WO2016008213A1 - Led汽车灯及其制造方法、汽车大灯总成 - Google Patents

Led汽车灯及其制造方法、汽车大灯总成 Download PDF

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Publication number
WO2016008213A1
WO2016008213A1 PCT/CN2014/086946 CN2014086946W WO2016008213A1 WO 2016008213 A1 WO2016008213 A1 WO 2016008213A1 CN 2014086946 W CN2014086946 W CN 2014086946W WO 2016008213 A1 WO2016008213 A1 WO 2016008213A1
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Prior art keywords
lamp body
led
column
lamp
circuit board
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PCT/CN2014/086946
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English (en)
French (fr)
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杨道达
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杨道达
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Publication of WO2016008213A1 publication Critical patent/WO2016008213A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/151—Light emitting diodes [LED] arranged in one or more lines
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/151—Light emitting diodes [LED] arranged in one or more lines
    • F21S41/153—Light emitting diodes [LED] arranged in one or more lines arranged in a matrix
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems

Definitions

  • the invention relates to an automobile lamp, in particular to an LED automobile lamp, a manufacturing method thereof and an automobile headlight assembly.
  • LED As a new type of light source, LED has the characteristics of energy saving, environmental protection, long life and high reliability. It has been widely used in various fields. For example, in the automotive field, more and more manufacturers use LED as the light source of automobile lamps. When the LED chip is applied to an automobile lamp, since the power of the single LED chip is small, the illumination requirement of the automobile lamp cannot be achieved.
  • the usual practice is to integrate a plurality of LED chips into the COB light source bracket to form a COB light source, and then The COB light source is mounted on the lamp post of the LED car light.
  • the power of a headlight of an LED car is about 30 watts. When it works normally, it will generate a lot of heat. The heat dissipation becomes a very sharp problem.
  • the heat dissipation path of the traditional LED car lamp is: LED chip heat conduction.
  • the COB light source bracket is then conducted to the lamp post by the COB light source bracket, and then transmitted to the heat sink by the lamp post, which results in a long heat dissipation path and poor heat dissipation effect.
  • the traditional LED car light has poor heat dissipation effect, which will have many adverse consequences: poor heat dissipation and high temperature accumulation, resulting in damage to the LED light source; in order to prevent the LED light source from being burned by high temperature, the integrated LED chip of the COB light source is relatively dispersed, which makes the COB light source difficult.
  • the light type affects the use effect; and the size of the lamp post and COB light source is large, resulting in the large size of the LED car lamp, which is not well matched with the headlight assembly of many models, which greatly limits the LED car.
  • the universal application of lights is not well matched with the headlight assembly of many models, which greatly limits the LED car.
  • An LED automobile lamp comprises: a lamp body column, a heat sink, an LED chip, and a strip-shaped circuit board, wherein the heat sink is provided with a mounting hole, and the lower part of the column of the lamp body is fixed in the mounting hole a circuit board is mounted on a sidewall thereof along a direction in which the pillar of the lamp body extends, the circuit board including a body portion and a solder portion connected to the body portion, the LED chip is directly packaged on a sidewall of the upper portion of the pillar in the lamp body, and Electrically connected to the soldering portion.
  • the pillars of the lamp body are in the shape of a quadrangular prism, and the circuit board is four. Two pillars are disposed on opposite sides of the pillar of the lamp body, and the welded portion of the circuit board is bent to form a chamfer. The first wire bonding zone and the second bonding wire zone are connected to each other on two adjacent sides.
  • the LED chips are multiple, and the plurality of LED chips are respectively packaged in The LED chip is electrically connected to the adjacent soldering portion on the four sides of the pillar in the lamp body and between the two soldering portions on each side.
  • the column of the lamp body has a quadrangular prism shape, the LED chip is plural, and a plurality of LED chips are disposed on one side of the column of the lamp body; or the plurality of LED chips are disposed on the column
  • the two sides of the column of the lamp body are disposed on the two sides of the column; or the plurality of LED chips are disposed on three sides of the column of the lamp body, wherein the circuit board is disposed on at least one side.
  • the LED automobile lamp further includes a four-core socket for connecting with the power plug, and the double-sided wiring board is disposed on the bottom plate of the heat sink, and the double-sided wiring board is electrically connected to the circuit board and the four-core socket respectively.
  • the LED automobile lamp further includes a heat dissipating fan, the radiator bottom plate is provided with a groove on one side, the groove wall is provided with a bayonet, the cooling fan is installed in the groove through the bayonet, and the cooling fan and the double-sided The terminal block is electrically connected.
  • the LED automobile lamp further includes a rear cover, the rear cover is disposed outside the heat sink bottom plate, the rear cover is provided with a heat dissipation hole, and the heat dissipation fan is provided with a protective shell, and the protective cover is connected with the back cover.
  • the unit is connected to the radiator.
  • the column of the lamp body is coated with an optical glue layer, and the optical glue layer is disposed around the side of the column in the lamp body.
  • a method for manufacturing an LED automobile lamp comprising the following steps:
  • the LED chip is directly packaged on the upper side wall of the column in the lamp body, and is electrically connected to the soldering portion of the circuit board.
  • the method for manufacturing the LED automobile lamp further comprises the steps of: arranging the column of the lamp body into a quadrangular prism shape, and placing the two circuit boards on the opposite sides of the column in the lamp body, the welding portion of the circuit board.
  • the first welding line area and the second welding line area are respectively formed in a folded shape, and the first welding line area and the second welding line area are respectively embedded on two adjacent sides of the column of the lamp body, on each side
  • a plurality of LED chips are disposed between the upper two soldering portions, and the LED chips are electrically connected to the adjacent soldering portions.
  • the utility model relates to an automobile headlight assembly, comprising the LED automobile lamp, the lamp body card seat, the card seat spring and the headlight body according to any one of the above items, wherein the lamp body card seat is provided with a card interface matched with the LED car lamp.
  • the lamp body is provided with a mounting hole, and the lamp body card seat is disposed in the mounting hole, and is clamped by the card seat spring, and the LED car lamp is installed in the card interface.
  • the above LED automobile lamp by directly encapsulating the LED chip on the column of the lamp body, the LED chip, the circuit board and the column in the lamp body are combined to form a wick structure, and the LED chip is equivalent to directly contacting the column in the lamp body, and the LED chip is issued.
  • the heat can be directly transmitted to the column of the lamp body, and then transmitted to the heat sink by the column of the lamp body. Compared with the conventional LED car lamp, the heat in the heat dissipation process only needs to pass the heat between the LED chip and the column of the lamp body.
  • the heat dissipation path of the LED automobile lamp described in the present application is shortened, thereby effectively improving the heat dissipation effect, and The heat dissipation performance is improved, so the installation of a plurality of LED chips can be more compact, the overall volume of the LED automobile lamp can be reduced, and the effect of forming a light-emitting point can be formed, thereby achieving the light-type requirement of the automobile lighting specification, and improving the popularization application of the LED automobile lamp.
  • the manufacturing method of the above LED automobile lamp is simple in operation, and the LED chip is directly packaged on the column of the lamp body, thereby effectively shortening the heat dissipation path of the LED automobile lamp and improving the heat dissipation performance of the LED automobile lamp, and is suitable for compact installation of a plurality of LED chips.
  • the utility model can reduce the overall volume of the LED automobile lamp, facilitate the formation of the luminous point effect, and improve the popular application of the LED automobile lamp.
  • the above-mentioned automobile headlight assembly can quickly clamp the LED car lamp on the headlight body through the card seat spring, and the installation is convenient, and the heat dissipation performance is good, which is beneficial to reducing the volume of the headlight body, and is advantageous for forming the effect of the light-emitting point and improving Popularization of LED car lights.
  • FIG. 1 is a schematic view 1 of a column in a lamp body according to an embodiment of the present invention
  • FIG. 2 is a schematic view 2 of a column in a lamp body according to an embodiment of the present invention
  • FIG. 3 is a schematic structural view of an LED automobile lamp according to an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of an LED automobile lamp mounted on an automobile headlight assembly according to an embodiment of the present invention.
  • FIG. 5 is a schematic diagram of a heat sink bottom plate according to an embodiment of the present invention.
  • Figure 6 is a schematic view of a back cover according to an embodiment of the present invention.
  • LED car light 2, lamp body card holder, 21, card interface, 3, card seat spring, 4, headlight body, 41, mounting hole, 10, lamp body column, 20, radiator, 210, heat dissipation Base plate, 212, bayonet, 30, LED chip, 40, circuit board, 410, body part, 420, soldering part, 422, first bonding line area, 423, second bonding line area, 50, four-core socket, 60, double-sided wiring board, 70, cooling fan, 80, back cover, 810, cooling holes, 90, protective case, 100, power plug.
  • an LED automobile lamp 1 includes: a lamp center pillar 10 , a heat sink 20 , an LED chip 30 , a strip-shaped circuit board 40 , and a mounting hole on the heat sink 20 .
  • the lower portion of the column 10 of the lamp body is fixed in the mounting hole, and the circuit board 40 is embedded on the side wall of the lamp body 10 in the extending direction of the column 10.
  • the circuit board 40 includes a body portion 410 and a soldering portion connected to the body portion. 420.
  • the LED chip 30 is directly packaged on the upper sidewall of the pillar 10 in the lamp body, and is electrically connected to the soldering portion 420.
  • the column 10 in the lamp body has a quadrangular prism shape, and its extending direction is its longitudinal direction; the column 10 in the lamp body has a cylindrical shape, and its extending direction is its axial direction.
  • the column 10 of the lamp body in the embodiment has a quadrangular prism shape, and the circuit board 40 has four blocks.
  • the lamp body center column 10 is provided with two circuit boards 40 on opposite sides of the lamp body.
  • the soldering portion 420 of the circuit board 40 is bent, and the soldering portion 420 of the embodiment is bent at a 90-degree angle to form a first bonding wire region 422 and a second bonding wire region 423 connected by a chamfer.
  • the wire bonding area 422 and the second bonding wire area 423 are respectively mounted on two adjacent side surfaces.
  • the LED chip 30 is a plurality of LED chips 30 respectively, and the plurality of LED chips 30 are respectively packaged on the four sides of the column 10 of the lamp body.
  • the chip 30 is electrically connected to its adjacent soldering portion 420.
  • the package includes basic processes such as die bonding, wire bonding, dispensing, baking, testing, and the like.
  • the soldering portion 420 is set in a bent shape to facilitate the laying of the wire.
  • the LED chip 30 of the four faces can be electrically conductive only by providing the circuit board 40 on two sides thereof, and four of the pillars 10 in the lamp body. A plurality of LED chips 30 are disposed on the side, and the LED car lights emit light from the four faces, thereby achieving annular light emission and increasing the illumination range.
  • the column 10 of the lamp body can be either cylindrical or prismatic.
  • the LED chip 30 is disposed on all sides of the column 10 of the lamp body;
  • a plurality of LED chips 30 are disposed around the outer circumference of the column 10 in the lamp body.
  • the LED chip 30 can be attached to the column 10 of the lamp body by means of thermal glue bonding, snapping or the like. Therefore, the heat generated by the operation of the LED chip 30 can be directly conducted to the column 10 in the lamp body and conducted to the heat sink 20 through the column 10 in the lamp body. Therefore, the heat dissipation path in the automobile lamp is short, and the heat dissipation effect is better.
  • the LED chip 30 is covered with a phosphor paste (not shown).
  • the column 10 of the lamp body has a quadrangular prism shape, and the LED chips 30 are plural, and a plurality of LED chips 30 can be disposed in the column 10 of the lamp body.
  • the plurality of LED chips 30 are disposed on two sides of the column 10 of the lamp body; or, the plurality of LED chips 30 are disposed in three of the columns 10 of the lamp body
  • the circuit board 40 is disposed on at least one of the side surfaces to realize the effect of the LED automobile lamp emitting light from one surface, two surfaces or three surfaces.
  • the heat sink 20 is made of a material that is highly thermally conductive.
  • the heat sink 20 is provided with a plurality of ribs and/or grooves (not labeled) spaced apart from each other to increase the surface area of the heat sink 20. The larger the surface area of the heat sink 20, the more favorable the heat dissipation.
  • the LED automobile lamp further includes a four-core socket 50 for connecting to the power plug 100.
  • the heat sink base plate 210 is provided with a double-sided wiring board 60, and the double-sided wiring board 60 and the line respectively The board 40 and the four-core socket 50 are electrically connected.
  • the power plug and the four-core socket 50 can be quickly inserted and removed, and the four-core socket 50 is connected to the double-sided wiring board 60 to facilitate the conduction of the circuit board 40 and the LED chip 30.
  • the LED car lamp further includes a heat dissipating fan 70.
  • the side surface of the heat sink bottom plate 210 is provided with a groove, and the groove wall is provided with a bayonet 212.
  • the heat dissipating fan 70 is installed in the recess through the bayonet 212.
  • the heat dissipation fan 70 is electrically connected to the double-sided wiring board 60 in the slot.
  • the LED car lamp further includes a rear cover 80.
  • the rear cover 80 is disposed outside the heat sink base plate 210.
  • the rear cover 80 is provided with a heat dissipation hole 810.
  • the heat dissipation fan 70 is provided with a protective cover 90.
  • the protective case 90 and the rear cover 80 are integrally connected to the heat sink 20.
  • the heat dissipation hole 810 accelerates the heat dissipation, and the protective case 90 and the rear cover 80 are disposed in an integrated structure to enhance the overall stability of the LED automobile lamp.
  • the column 10 of the lamp body is coated with an optical glue layer, and the optical glue layer is disposed around the side of the column 10 of the lamp body.
  • the optical glue can well act as a light guide.
  • the optical glue layer can conduct light to the side where the LED chip 30 is not disposed. Therefore, the LED car lamp can be made more uniform by setting the optical adhesive layer, and the omnidirectional light can be realized while using the minimum LED chip 30.
  • the LED chip 30 is directly packaged on the column 10 of the lamp body, and the LED chip 30, the circuit board 40, and the column 10 of the lamp body are combined to form a wick structure, and the LED chip 30 is equivalent to direct In contact with the column 10 of the lamp body, the heat generated by the LED chip 30 can be directly transmitted to the column 10 of the lamp body, and then transmitted to the heat sink 20 by the column 10 of the lamp body, compared with the conventional LED car lamp, during the heat dissipation process.
  • the heat only needs to pass through the thermal resistance between the LED chip 30 and the column 10 of the lamp body, without the need to pass the LED chip 30 to the COB source bracket, and then the thermal resistance of the COB source bracket to the column 10 of the lamp body, as described in the present application.
  • the heat dissipation path of the LED automobile lamp is shortened, so that the heat dissipation effect is effectively improved, and since the heat dissipation performance is improved, the installation of the plurality of LED chips 30 can be more compact, and the overall volume of the LED automobile lamp can be reduced, thereby facilitating the formation of the light-emitting point.
  • the effect is to achieve the light-type requirements of automotive lighting specifications and to improve the popularization of LED automotive lights.
  • an automobile headlight assembly includes the above LED automobile lamp 1, a lamp body holder 2, a card seat spring 3, and a headlight body 4, and the lamp body card holder 2 is provided with an LED car lamp 1 a matching card interface 21, the headlight body 4 is provided with a mounting hole 41, and the lamp body holder 2 is disposed in the mounting hole 41, and is clamped by the card seat spring 3, the LED car light 1 Installed in the card interface 21, it can be locked by rotating at a certain angle, which is convenient for the installation of the LED car lamp.
  • the LED car lamp 1 is quickly stuck on the headlight body 4 through the card seat spring 3, which is convenient to install and has good heat dissipation performance, and is beneficial to reducing the volume of the headlight body 4, Conducive to the formation of luminous points, improve the popular application of LED car lights.
  • a method of manufacturing an LED automobile lamp includes the following steps:
  • the LED chip 30 is directly packaged on the upper side wall of the column 10 in the lamp body, and is electrically connected to the solder portion of the circuit board 40.
  • the method for manufacturing the LED automobile lamp further comprises the steps of: arranging the column 10 of the lamp body into a quadrangular prism shape, and placing the two circuit boards 40 on the opposite sides of the column 10 of the lamp body, the circuit board
  • the welding portion 420 of the 40 is disposed in a bent shape, preferably at an angle of 90 degrees, forming a first bonding wire region 422 and a second bonding wire region 423 which are connected by a chamfer.
  • the first bonding wire region 422 and the second bonding wire region 423 are respectively inlaid.
  • a plurality of LED chips 30 are disposed between the two soldering portions 420 on each side, and the LED chips 30 are electrically connected to the adjacent soldering portions 420.
  • the manufacturing method of the LED automobile lamp is simple in operation, and the LED chip 30 is directly packaged on the column 10 of the lamp body, thereby effectively shortening the heat dissipation path of the LED automobile lamp and improving the heat dissipation performance of the LED automobile lamp, and is suitable for the plurality of LED chips 30.
  • the compact installation can reduce the overall volume of the LED car lamp, facilitate the formation of the luminous point effect, and improve the popular application of the LED car lamp.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

一种ＬＥＤ汽车灯及其制造方法、汽车大灯总成，ＬＥＤ汽车灯包括：灯体中柱（10）、散热器（20）、ＬＥＤ芯片（30）、呈长条状的线路板（40）。散热器（20）上设有安装孔，灯体中柱（10）的下段固定在安装孔内，线路板（40）沿灯体中柱（10）的延伸方向镶嵌在其侧壁上。线路板（40）包括本体部（410）以及与本体部（410）连接的焊接部（420），ＬＥＤ芯片（30）封装在灯体中柱（10）的上段侧壁上，并且与焊接部（420）电性连接。还提供了一种ＬＥＤ汽车灯的制造方法及汽车大灯总成。该LED汽车灯有效缩短散热路径，从而使得散热效果得到有效提升。

Description

LED汽车灯及其制造方法、汽车大灯总成 技术领域
本发明涉及汽车灯，特别是涉及一种LED汽车灯及其制造方法、汽车大灯总成。
背景技术
LED作为一种新型的光源，具有节能、环保、寿命长、可靠性高等特点，已被广泛应用于各种领域，例如，在汽车领域中，越来越多的厂家采用LED作为汽车灯的光源，将LED芯片应用于汽车灯时，由于单颗LED芯片功率较小，不能达到汽车灯的照明要求，通常的做法是：将多颗LED芯片集成封装在COB光源支架上做成COB光源，再将COB光源安装在LED汽车灯的灯柱上。一般一只LED汽车前大灯的功率在30瓦左右，当它正常工作的时会产生大量的热量，散热就成为一个非常尖锐的问题，传统的LED汽车灯的散热途径为：LED芯片热量传导到COB光源支架，再由COB光源支架传导到灯柱，再由灯柱传导到散热器上，这样导致散热途径较长，散热效果差。
传统LED汽车灯散热效果差，会产生诸多不良后果：散热不好而产生高温聚集，导致LED光源损坏；为了防止LED光源被高温烧毁，COB光源集成的LED芯片设置相对较分散，导致COB光源难以形成发光点的效果，而往往形成一个较大的发光面，当COB光源做成的LED汽车灯与各种汽车大灯总成里面的反光杯或者双光透镜配合的时候，无法达到符合行业规范的光型，影响使用效果；而且灯柱及COB光源尺寸较大，导致做成的LED汽车灯体积大，与很多车型的大灯总成无法很好地配合安装，极大的限制了LED汽车灯的普及应用。
发明内容
基于此，有必要提供一种可有效缩短散热路径，散热效果好的LED汽车灯及其制造方法、汽车大灯总成。
一种LED汽车灯，包括：灯体中柱、散热器、LED芯片、呈长条状的线路板，所述散热器上设有安装孔，所述灯体中柱的下段固定在安装孔内，线路板沿灯体中柱的延伸方向镶嵌在其侧壁上，该线路板包括本体部以及与本部连接的焊接部、所述LED芯片直接封装在灯体中柱的上段侧壁上，并且与所述焊接部电性连接。
其进一步技术方案如下：
所述灯体中柱呈四棱柱状，所述线路板为四块，灯体中柱其中相对的两侧面上均设置两块线路板，所述线路板的焊接部呈折弯状，形成折角相连的第一焊线区、第二焊线区，第一焊线区、第二焊线区分别镶嵌在两相邻的侧面上，所述LED芯片为多个，多个LED芯片分别封装于该灯体中柱的四个侧面上，且位于每侧面上的两焊接部之间，LED芯片与其相邻的焊接部电性连接。
所述灯体中柱呈四棱柱状，所述LED芯片为多个，且多个LED芯片设置于所述灯体中柱的其中一个侧面上；或者，所述多个LED芯片设置于所述灯体中柱的其中两个侧面上；或者，所述多个LED芯片设置于所述灯体中柱的其中三个侧面上，其中至少一个侧面上设有所述线路板。
所述LED汽车灯还包括用于与电源插头连接的四芯插座，散热器底板上设有双面接线板，所述双面接线板分别与线路板、四芯插座电性连接。
所述LED汽车灯还包括散热风扇，所述散热器底板一侧设有凹槽，凹槽壁上设有卡口，所述散热风扇通过卡口安装在凹槽内，并且散热风扇与双面接线板电性连接。
所述LED汽车灯还包括后盖，所述后盖罩在散热器底板外，所述后盖上开有散热孔，所述散热风扇外设有保护壳，所述保护壳与后盖连成一体与散热器连接。
所述灯体中柱上涂覆有光学胶层，所述光学胶层围绕所述灯体中柱的侧面设置。
一种LED汽车灯的制造方法，包括如下步骤：
将灯体中柱的下段固定在散热器的安装孔内；
将长条状的线路板沿灯体中柱的延伸方向镶嵌在其侧壁上；
将LED芯片直接封装在灯体中柱的上段侧壁上，并且与线路板的焊接部电性连接。
进一步，所述LED汽车灯的制造方法还包括如下步骤，将灯体中柱设置成四棱柱状，灯体中柱其中相对的两侧面上均设置两块所述线路板，线路板的焊接部设置成折弯状，形成折角相连的第一焊线区、第二焊线区，第一焊线区、第二焊线区分别镶嵌在灯体中柱两相邻的侧面上，在每侧面上的两焊接部之间设置多个LED芯片，所述LED芯片与其相邻的焊接部电性连接。
一种汽车大灯总成，包括上述任一项所述的LED汽车灯、灯体卡座、卡座弹簧、大灯本体，所述灯体卡座上设有与LED汽车灯匹配的卡接口，所述大灯本体上设有与安装孔，灯体卡座设置在所述安装孔内，并通过所述卡座弹簧卡紧，所述LED汽车灯安装在卡接口内。
上述LED汽车灯，通过将LED芯片直接封装在灯体中柱上，LED芯片、线路板、灯体中柱三者结合形成灯芯结构，LED芯片相当于直接和灯体中柱接触，LED芯片发出的热量，可直接传导至灯体中柱，再由灯体中柱传导至散热器上，相比传统的LED汽车灯，散热过程中热量只需经过LED芯片与灯体中柱之间的热阻，而无需要经过LED芯片到COB光源支架，再由COB光源支架到灯体中柱的热阻，本申请所述的LED汽车灯的散热路径缩短，从而使得散热效果得到有效提升，并且由于散热性能提高了，所以多个LED芯片的安装能更紧凑，能够减小LED汽车灯的整体体积，利于形成发光点的效果，从而达到汽车照明规范光型要求，提高LED汽车灯的普及应用。
上述LED汽车灯的制造方法，操作简单，将LED芯片直接封装在灯体中柱上，有效缩短LED汽车灯的散热路径，提高LED汽车灯的散热性能，适用于多个LED芯片的紧凑安装，能够减小LED汽车灯的整体体积，利于形成发光点的效果，提高LED汽车灯的普及应用。
上述汽车大灯总成，通过卡座弹簧快捷地将LED汽车灯卡在大灯本体上，安装方便，而且散热性能好，有利于减小大灯本体的体积，利于形成发光点的效果，提高LED汽车灯的普及应用。
附图说明
图1为本发明实施例所述的灯体中柱的示意图一；
图2为本发明实施例所述的灯体中柱的示意图二；
图3为本发明实施例所述的LED汽车灯的结构示意图；
图4为本发明实施例所述的LED汽车灯安装在汽车大灯总成上的示意图；
图5为本发明实施例所述的散热器底板的示意图；
图6为本发明实施例所述的后盖的示意图。
附图标记说明：
1、LED汽车灯，2、灯体卡座，21、卡接口，3、卡座弹簧，4、大灯本体，41、安装孔，10、灯体中柱，20、散热器，210、散热器底板，212、卡口，30、LED芯片，40、线路板，410、本体部，420、焊接部，422、第一焊线区，423、第二焊线区，50、四芯插座，60、双面接线板，70、散热风扇，80、后盖，810、散热孔，90、保护壳，100、电源插头。
具体实施方式
请参阅图1至图3，一种LED汽车灯1，包括：灯体中柱10、散热器20、LED芯片30、呈长条状的线路板40，所述散热器20上设有安装孔，所述灯体中柱10的下段固定在安装孔内，线路板40沿灯体中柱10的延伸方向镶嵌在其侧壁上，该线路板40包括本体部410以及与本部连接的焊接部420、所述LED芯片30直接封装在灯体中柱10的上段侧壁上，并且与所述焊接部420电性连接。灯体中柱10呈四棱柱状，其延伸方向即其长边方向；灯体中柱10呈圆柱形，其延伸方向即其轴向方向。
参照图2、图3，本实施例所述的灯体中柱10呈四棱柱状，所述线路板40为四块，灯体中柱10其中相对的两侧面上均设置两块线路板40，所述线路板40的焊接部420呈折弯状，本实施例所述的焊接部420呈90度角折弯，形成折角相连的第一焊线区422、第二焊线区423，第一焊线区422、第二焊线区423分别镶嵌在两相邻的侧面上，所述LED芯片30为多个，多个LED芯片30分别封装于该灯体中柱10的四个侧面上，且位于每侧面上的两焊接部420之间，LED 芯片30与其相邻的焊接部420电性连接。所述封装包括固晶、焊线、点胶、烘烤、测试等基本工艺。一方面，将焊接部420设置成折弯状，方便铺线，只需在其中两个面设置线路板40即可实现四个面的LED芯片30导电，而且在灯体中柱10的四个侧面上均设置多个LED芯片30，LED汽车灯从四个面出光，从而实现环形出光，增大光照范围。根据实际需求，灯体中柱10既可呈圆柱形，也可呈棱柱状，具体的，灯体中柱10呈棱柱状时，LED芯片30设置于灯体中柱10的所有侧面上；灯体中柱10为圆柱形或其他形状时，多个LED芯片30围绕灯体中柱10外圆周设置。LED芯片30可通过导热胶胶合、卡合等方式贴附于灯体中柱10上。因此，LED芯片30工作所产生的热量可直接传导至灯体中柱10，并经过灯体中柱10传导至散热器20。因此，汽车灯中的散热路径较短，散热效果较佳。在LED芯片30上覆盖有荧光粉胶(图未示)。
参照图2、图3，根据实际需求，所述灯体中柱10呈四棱柱状，所述LED芯片30为多个，且多个LED芯片30可设置于所述灯体中柱10的其中一个侧面上；或者，所述多个LED芯片30设置于所述灯体中柱10的其中两个侧面上；或者，所述多个LED芯片30设置于所述灯体中柱10的其中三个侧面上，其中至少一个侧面上设有所述线路板40，实现LED汽车灯从一个面、两个面或者三个面出光的效果。
所述散热器20由高导热的材料制成。在本实施例中，散热器20上设置有多条相互间隔设置的凸条和/或凹槽(图未标)，以增大散热器20的表面积。散热器20的表面积越大，越有利于热量散发。
参照图5、图6，所述LED汽车灯还包括用于与电源插头100连接的四芯插座50，散热器底板210上设有双面接线板60，所述双面接线板60分别与线路板40、四芯插座50电性连接。电源插头与四芯插座50能实现快速插拔，通过四芯插座50与双面接线板60连接，方便实现对线路板40及LED芯片30的导电。
参照图5，所述LED汽车灯还包括散热风扇70，所述散热器底板210一侧设有凹槽，凹槽壁上设有卡口212，所述散热风扇70通过卡口212安装在凹槽内，并且散热风扇70与双面接线板60电性连接。通过设置散热风扇70，可进 一步加快热量散发的速度，而且通过在散热器底板210上设卡口212，方便对散热风扇70的拆卸与安装。
所述LED汽车灯还包括后盖80，所述后盖80罩在散热器底板210外，所述后盖80上开有散热孔810，所述散热风扇70外设有保护壳90，所述保护壳90与后盖80连成一体与散热器20连接。通过散热孔810加速热量散发，将保护壳90与后盖80设置成一体结构，加强LED汽车灯的整体稳定性。
所述灯体中柱10上涂覆有光学胶层，所述光学胶层围绕所述灯体中柱10的侧面设置。光学胶能很好的起到导光作用，当灯体中柱10上只有两个或三个面发光时，通过光学胶层可将光线传导至未设置LED芯片30的一面。因此，通过设置光学胶层可使LED汽车灯出光更均匀，在使用最少LED芯片30的同时实现全方位出光。
本实施例所述LED汽车灯，通过将LED芯片30直接封装在灯体中柱10上，LED芯片30、线路板40、灯体中柱10三者结合形成灯芯结构，LED芯片30相当于直接和灯体中柱10接触，LED芯片30发出的热量，可直接传导至灯体中柱10，再由灯体中柱10传导至散热器20上，相比传统的LED汽车灯，散热过程中热量只需经过LED芯片30与灯体中柱10之间的热阻，而无需要经过LED芯片30到COB光源支架，再由COB光源支架到灯体中柱10的热阻，本申请所述的LED汽车灯的散热路径缩短，从而使得散热效果得到有效提升，并且由于散热性能提高了，所以多个LED芯片30的安装能更紧凑，能够减小LED汽车灯的整体体积，利于形成发光点的效果，从而达到汽车照明规范光型要求，提高LED汽车灯的普及应用。
参照图4，一种汽车大灯总成，包括上述LED汽车灯1、灯体卡座2、卡座弹簧3、大灯本体4，所述灯体卡座2上设有与LED汽车灯1匹配的卡接口21，所述大灯本体4上设有与安装孔41，灯体卡座2设置在所述安装孔41内，并通过所述卡座弹簧3卡紧，所述LED汽车灯1安装在卡接口21内，旋转一定角度即可卡紧，方便实现对LED汽车灯的安装。
本实施例所述汽车大灯总成，通过卡座弹簧3快捷地将LED汽车灯1卡在大灯本体4上，安装方便，而且散热性能好，有利于减小大灯本体4的体积， 利于形成发光点的效果，提高LED汽车灯的普及应用。
参照图1至图6，一种LED汽车灯的制造方法，包括如下步骤：
将灯体中柱10的下段固定在散热器20的安装孔内；
将长条状的线路板40沿灯体中柱10的延伸方向镶嵌在其侧壁上；
将LED芯片30直接封装在灯体中柱10的上段侧壁上，并且与线路板40的焊接部电性连接。
进一步，所述LED汽车灯的制造方法还包括如下步骤，将灯体中柱10设置成四棱柱状，灯体中柱10其中相对的两侧面上均设置两块所述线路板40，线路板40的焊接部420设置成折弯状，优选90度角折弯，形成折角相连的第一焊线区422、第二焊线区423，第一焊线区422、第二焊线区423分别镶嵌在灯体中柱10两相邻的侧面上，在每侧面上的两焊接部420之间设置多个LED芯片30，所述LED芯片30与其相邻的焊接部420电性连接。
所述LED汽车灯的制造方法，操作简单，将LED芯片30直接封装在灯体中柱10上，有效缩短LED汽车灯的散热路径，提高LED汽车灯的散热性能，适用于多个LED芯片30的紧凑安装，能够减小LED汽车灯的整体体积，利于形成发光点的效果，提高LED汽车灯的普及应用。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对本发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (10)

  1. 一种LED汽车灯，其特征在于，包括：灯体中柱、散热器、LED芯片、呈长条状的线路板，所述散热器上设有安装孔，所述灯体中柱的下段固定在安装孔内，线路板沿灯体中柱的延伸方向镶嵌在其侧壁上，该线路板包括本体部以及与本部连接的焊接部，所述LED芯片直接封装在灯体中柱的上段侧壁上，并且与所述焊接部电性连接。
  2. 根据权利要求1所述的LED汽车灯，其特征在于，所述灯体中柱呈四棱柱状，所述线路板为四块，灯体中柱其中相对的两侧面上均设置两块线路板，所述线路板的焊接部呈折弯状，形成折角相连的第一焊线区、第二焊线区，第一焊线区、第二焊线区分别镶嵌在两相邻的侧面上，所述LED芯片为多个，多个LED芯片分别封装于该灯体中柱的四个侧面上，且位于每侧面上的两焊接部之间，LED芯片与其相邻的焊接部电性连接。
  3. 根据权利要求1所述的LED汽车灯，其特征在于，所述灯体中柱呈四棱柱状，所述LED芯片为多个，且多个LED芯片设置于所述灯体中柱的其中一个侧面上；或者，所述多个LED芯片设置于所述灯体中柱的其中两个侧面上；或者，所述多个LED芯片设置于所述灯体中柱的其中三个侧面上，其中至少一个侧面上设有所述线路板。
  4. 根据权利要求2或3所述的LED汽车灯，其特征在于，其还包括用于与电源插头连接的四芯插座，散热器底板上设有双面接线板，所述双面接线板分别与线路板、四芯插座电性连接。
  5. 根据权利要求4所述的LED汽车灯，其特征在于，其还包括散热风扇，所述散热器底板一侧设有凹槽，凹槽壁上设有卡口，所述散热风扇通过卡口安装在凹槽内，并且散热风扇与双面接线板电性连接。
  6. 根据权利要求5所述的LED汽车灯，其特征在于，其还包括后盖，所述后盖罩在散热器底板外，所述后盖上开有散热孔，所述散热风扇外设有保护壳，所述保护壳与后盖连成一体与散热器连接。
  7. 根据权利要求2或3所述的LED汽车灯，其特征在于，所述灯体中柱上涂覆有光学胶层，所述光学胶层围绕所述灯体中柱的侧面设置。
  8. 一种LED汽车灯的制造方法，其特征在于，包括如下步骤：
    将灯体中柱的下段固定在散热器的安装孔内；
    将长条状的线路板沿灯体中柱的延伸方向镶嵌在其侧壁上；
    将LED芯片直接封装在灯体中柱的上段侧壁上，并且与线路板的焊接部电性连接。
  9. 根据权利要求8所述的LED汽车灯的制造方法，其特征在于，还包括如下步骤：将灯体中柱设置成四棱柱状，灯体中柱其中相对的两侧面上均设置两块所述线路板，线路板的焊接部设置成折弯状，形成折角相连的第一焊线区、第二焊线区，第一焊线区、第二焊线区分别镶嵌在灯体中柱两相邻的侧面上，在每侧面上的两焊接部之间设置多个LED芯片，所述LED芯片与其相邻的焊接部电性连接。
  10. 一种汽车大灯总成，其特征在于，包括权利要求1至7任一项所述的LED汽车灯、灯体卡座、卡座弹簧、大灯本体，所述灯体卡座上设有与LED汽车灯匹配的卡接口，所述大灯本体上设有与安装孔，灯体卡座设置在所述安装孔内，并通过所述卡座弹簧卡紧，所述LED汽车灯安装在卡接口内。
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