WO2013023488A1 - Led光源 - Google Patents

Led光源 Download PDF

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Publication number
WO2013023488A1
WO2013023488A1 PCT/CN2012/077283 CN2012077283W WO2013023488A1 WO 2013023488 A1 WO2013023488 A1 WO 2013023488A1 CN 2012077283 W CN2012077283 W CN 2012077283W WO 2013023488 A1 WO2013023488 A1 WO 2013023488A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat dissipation
led
dissipation base
transparent cover
base
Prior art date
Application number
PCT/CN2012/077283
Other languages
English (en)
French (fr)
Inventor
黎昌兴
Original Assignee
Li Changxing
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN2011203054664U external-priority patent/CN202229131U/zh
Priority claimed from CN2011204475764U external-priority patent/CN202382134U/zh
Priority claimed from CN2011205600831U external-priority patent/CN202647225U/zh
Application filed by Li Changxing filed Critical Li Changxing
Priority to JP2014525288A priority Critical patent/JP5802887B2/ja
Priority to EP12824226.0A priority patent/EP2743566A4/en
Priority to CN201280003353.6A priority patent/CN103988015B/zh
Priority to US14/238,710 priority patent/US8936378B2/en
Publication of WO2013023488A1 publication Critical patent/WO2013023488A1/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F21S45/48—Passive cooling, e.g. using fins, thermal conductive elements or openings with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
    • F21S41/148—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device the main emission direction of the LED being perpendicular to the optical axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/20—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by refractors, transparent cover plates, light guides or filters
    • F21S41/28—Cover glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/42—Forced cooling
    • F21S45/43—Forced cooling using gas
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/42—Forced cooling
    • F21S45/46—Forced cooling using liquid
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes

Definitions

  • the present invention relates to the field of LED illumination, and in particular, to an LED light source.
  • a first object of an embodiment of the present invention is to provide an LED light source, which has a good heat dissipation effect, and is particularly suitable for high power LED illumination.
  • a second object of the present invention is to provide another LED light source which has a good heat dissipation effect and is particularly suitable for high power LED illumination.
  • the first LED light source provided by the embodiment of the present invention includes a heat dissipation base.
  • a circuit base is fixed on a surface of the heat dissipation base, and an LED capable of emitting light is fixed on the circuit base, and a light distribution mirror is sealed and sealed outside the heat dissipation base, and is fixed outside the light distribution mirror a front end of the outer casing and a front end of the light distribution mirror are respectively fixedly connected to the transparent cover,
  • the transparent cover is also sealedly connected to the heat dissipation base, and the circuit base and the LED are located in the sealed first cavity formed by the light distribution mirror, the heat dissipation base and the transparent cover.
  • At least one channel is further disposed on the heat dissipation base, each of the channels is not in communication with the first cavity, and the opposite openings of each of the channels are in communication with the outside.
  • Each of the channels is a pipe passage formed in the heat dissipation base
  • Each of the channels is a slot-like channel between any two adjacent fins.
  • each of the channels is a pipe channel formed in the heat dissipation base
  • Each of the channels is a slot-like channel between any two adjacent fins.
  • the rear end portion of the heat dissipation base is out of the rear end of the outer casing
  • An opening of each of the passages is located outside the rear end of the outer casing.
  • the heat dissipation base is all located on one side of the transparent cover.
  • At least one through hole is further disposed at an outer peripheral portion of the transparent cover on a portion connected to the heat dissipation base, and each of the through holes is opposite to an opening of each of the channels on the heat dissipation base.
  • a second LED light source provided by an embodiment of the present invention
  • the heat dissipation base portion is out of the transparent cover
  • An outer peripheral portion of the portion of the translucent cover that is connected to the heat dissipation base is further provided with at least a through hole.
  • a portion of the heat dissipation base passes through the transparent cover through hole and is out of the transparent cover.
  • a port of each of the channels on the heat dissipation base is located outside the light transmissive cover.
  • a portion of the transparent cover that is connected to the heat dissipation base is further provided with two opposite convex edges, and the transparent cover is also sealingly connected with the heat dissipation base, specifically :
  • the portion of the heat dissipation base that is connected to the light transmissive cover is sealed and fixed between the two convex edges of the light transmissive cover.
  • a first convex edge is disposed on the transparent cover and the outer casing and the light distribution mirror, and the front end of the outer casing and the front end of the light distribution mirror respectively are transparent to the light transmission
  • the cover is fixedly connected, specifically, the outer casing is sealingly fixed to the outer side of the first convex side of the transparent cover,
  • the lens is sealed to the inner side of the first flange by face-to-face sealing.
  • the heat dissipation base comprises: a metal substrate, an insulating layer, and a copper foil;
  • the LED is an LED chip, and each of the LED chips is fixed on a surface of the metal substrate.
  • An insulating layer of each of the LED wafer bottoms W is in surface contact with the metal substrate
  • One electrode pin of each of the LED chips is soldered to the metal substrate, and the other electrode pin is electrically connected to the copper copper IS;
  • the PCB insulating substrate is laid on a top surface of the metal substrate except for a fixed position of the LED chip, and the trace copper foil is laid in the: PCB insulating substrate;
  • the metal substrate and the copper foil are electrically connected to the positive electrode and the negative electrode of the external power supply circuit, respectively.
  • a recess is further disposed on a top surface of the metal substrate,
  • each of the LED chips is fixed on a surface of the metal substrate, and specifically: each of the LED chips is fixed on a surface of the pit.
  • the PCB insulating substrate is disposed on a top surface of the metal substrate except the fixed position of the LED chip, and specifically: the insulating S is specifically laid on the metal substrate except the pit Top area
  • the other electrode pins of each of the LED chips are respectively electrically connected to the copper foil, specifically: the other electrode pins of each of the LED chips are respectively passed through the respective conductive leads and the copper Connection
  • the pit is also filled with a silicone filling portion.
  • the silicone fill portion is filled in the recess, and all of the LED wafer and the conductive lead are co-wrapped in the silicone fill portion.
  • An LED light source provided by an embodiment of the present invention includes: a heat dissipation base,
  • a circuit base is fixed on a top surface and a bottom surface of the heat dissipation base, and LEDs capable of emitting light are respectively fixed on each of the circuit bases;
  • a light distribution mirror is sleeved on the outside of the heat dissipation base, and a housing is sleeved outside the light distribution mirror, and a front end of the outer casing and a front end of the light distribution mirror are respectively fixedly connected with the light transmissive cover;
  • the circuit base and the LED located on the top surface of the heat dissipation base are located in the first sealed cavity formed by the light distribution mirror, the heat dissipation base and the transparent cover.
  • the circuit base and the LED located on the bottom surface of the heat dissipation base are located in the second sealed cavity formed by the light distribution mirror, the heat dissipation base and the transparent cover.
  • At least one pipe passage is further disposed inside the heat dissipation base, and the opposite openings of each of the channels are communicated with the outside.
  • the rear end portion of the heat dissipation base is out of the rear end of the outer casing
  • a port of each of the channels is located outside the rear end of the housing.
  • the heat dissipation base is all located on one side of the transparent cover.
  • At least one through hole is further disposed on the transparent cover, and each of the through holes is opposite to a port of each of the channels on the heat dissipation base.
  • the heat dissipation base portion is out of the transparent cover
  • a through hole is further disposed at an outer peripheral portion of the transparent cover and the heat dissipation base.
  • the heat dissipation base portion passes through the transparent cover through hole and is out of the transparent cover.
  • An opening of each of the channels on the heat dissipation base is located outside the light transmissive cover.
  • a portion of the transparent cover that is connected to the heat dissipation base is further provided with two opposite convex edges, and the transparent cover is also sealingly connected with the heat dissipation base, specifically - a portion of the heat dissipation base that is connected to the light transmissive cover is sealed and fixed between the two convex edges of the light transmissive cover.
  • a first convex edge is disposed on the transparent cover and the housing and the light beam connecting portion,
  • the front end of the outer casing and the front end of the light distribution mirror are respectively fixedly connected to the transparent cover.
  • the outer casing is sealed and fixed to the outer side of the first convex side of the transparent cover.
  • the lens is sealed and fixed to the inner side of the first flange.
  • the heat dissipation base comprises: a metal substrate, an insulating layer, and a copper foil;
  • the LED is an LED chip fixed on a surface of the metal substrate, and an insulation of a bottom surface of each of the LED chips is in surface contact with the target substrate.
  • One electrode pin of each of the LED chips is soldered to the metal substrate, and the other electrode pin is electrically connected to the copper copper II;
  • the PCB insulating substrate is laid on a top surface of the metal substrate except for a fixed position of the LED chip, and the trace copper foil is laid in the PCB absolute substrate;
  • the metal substrate and the copper foil are electrically connected to the positive electrode and the negative electrode of the external power supply circuit, respectively.
  • a recess is further disposed on a top surface of the metal substrate.
  • Each of the LED chips is fixed on a surface of the metal substrate, and specifically: each of the LED chips is fixed on a surface of the pit.
  • the PCB recording substrate is disposed on a top surface of the metal substrate except for the fixed position of the LED chip, specifically, the insulation is specifically laid on the metal substrate except the pit Top area
  • the other electrode pins of each of the LED chips are electrically connected to the copper foil, respectively. Specifically, the other electrode pins of each of the LED chips are respectively passed through the conductive leads and the copper foil. Electrical connection
  • the pit is also filled with a silicone filling portion.
  • the silicone fill portion is filled in the recess, and all of the LED wafer and the conductive lead are co-wrapped in the silicone fill portion.
  • the external power supply when the external power supply is turned on, the external power supply supplies power to each LED on the circuit base through the circuit base, and the LED is illuminated under the electric drive. Glowing.
  • the heat generated during the operation of the LED is quickly transferred to the connected heat sink base through the circuit base, and at least one external communication channel is provided in the heat dissipation base, and an air or liquid entering the inlet of the channel
  • the fluid flows through the heat dissipation base, and is in full contact with the heat dissipation base, and the heat on the heat dissipation base is quickly taken out from the other outlet of the channel to realize fluid circulation heat dissipation, thereby improving the heat dissipation efficiency of the LED strong light source.
  • the technical solution of the present embodiment can realize a super-power LED strong light source, and the power of the LED light source can reach several thousand watts.
  • each channel in the embodiment, the two ports of each channel are respectively opposed, so that the fluid flowing through the channel enters from one end and quickly flows out from the other end, and the heat on the heat dissipation base is quickly taken out to achieve heat dissipation. .
  • each channel in the heat dissipation base is not in communication with the circuit base and the first cavity in which the LED is located, the fluid flowing through the channel does not enter the electrical properties of the main electrical and electronic device.
  • FIG. 1 is a schematic view showing a gaze structure of an LED light source with a heat dissipating device according to Embodiment 1 of the present invention
  • FIG. 2 is a schematic structural view of the A-A cross-sectional view of FIG. 1 according to Embodiment 1 of the present invention
  • FIG. 3 is a cross-sectional structural view of an LED light source with a rear end portion of the heat dissipation base and a rear end of the outer casing of the present invention provided in Embodiment 1 of the present invention;
  • ⁇ 4 is a cross-sectional structural diagram of an LED light source with a front end portion of the heat dissipation base and a light source outside the light transmission cover provided in Embodiment 1 of the present invention;
  • the circle 5 is a schematic diagram of the connection structure of the circuit base for fixing the LED and the LED thereon provided in the embodiment 1 of the present invention
  • FIG. 6 is a schematic structural view showing another connection structure of a circuit base for fixing an LED and an LED thereon provided in Embodiment 1 of the present invention
  • FIG. 7 is a schematic cross-sectional structural view of an LED light source with a heat sink base according to Embodiment 2 of the present invention
  • FIG. 8 is a cross-sectional structural diagram of an LED light source with a heat sink base according to Embodiment 3 of the present invention.
  • An LED light source provided by this embodiment mainly includes a casing K)6, a heat dissipation base 101, a light distribution mirror 102, a light transmission cover 103, a circuit base 104, and an LED 105.
  • the heat dissipation base 101 is a material with good heat dissipation performance, such as, but not limited to, a copper base, an aluminum base, or a copper-aluminum base.
  • the circuit base 104 is tightly fixed on the surface of the heat dissipation base 101, and a power supply circuit structure for supplying power to the LEDs 105 is fixed on the circuit base 104, and the LED 105 is fixed on the circuit base 104, wherein the LED 105 It can be either a pin LED or an LED chip.
  • the LED 105 can be a single high-power LED or an LED cluster composed of a plurality of LEDs. The shape of the LED cluster can be arranged according to specific needs, and the skin can be arranged into a certain trademark. Patterns, in order to achieve advertising projection publicity and so on.
  • a light distribution mirror 102 is fixed on the heat dissipation base 101.
  • the type and shape of the light distribution mirror 102 can be selected according to the application of the current high power LED light source, for example, the light distribution mirror 102 having a collecting effect. To achieve high-power remote high-intensity lighting.
  • the rear end of the light distribution mirror 102 is tightly connected to the heat dissipation base 101, and the front end of the light distribution mirror 102 is closely connected to the light transmission cover 103.
  • the circuit base 104 and the LEDs on the circuit base 104 are all located in the sealed cavity formed by the heat dissipation base 101, the light distribution mirror 102, and the light transmission cover 103, as shown in FIG.
  • a housing 106 for protection is further fixed on the outside of the lens 102.
  • the front open end of the housing 106 is fixedly connected to the transparent cover 103.
  • the rear end of the housing 106 can be used for connecting and fixing the external connection portion. installation.
  • At least one channel 1011 not communicating with the first cavity 107 is further disposed on the heat dissipation base 101.
  • the channels 1011 may be disposed inside the heat dissipation base 101 or may be disposed on the heat dissipation base 101. The periphery of a portion within a cavity 107.
  • the working principle of the LED light source of this embodiment is as follows - the external power supply is turned on, and the external power supply supplies power to each LED 105 on the circuit base * 104 through the circuit base 104, and the LED 105 is illuminated and externally illuminated under the electric drive. .
  • the heat generated during the operation of the LED 105 is quickly transferred to the connected heat sink base 101 through the circuit base 104, and the externally connected passage 101 is provided in the heat sink base 101, and a fluid or liquid such as air or liquid is provided.
  • An inlet 1012 of 1011 enters, flows through the heat dissipation base * 101, and is in full contact with the heat dissipation base 101.
  • the heat on the heat dissipation base 101 is quickly taken out from the other outlet 1013 of the passage 10U, thereby achieving fluid through heat dissipation and improving the LED.
  • the heat dissipation efficiency of a strong light source is used to generate a strong light source.
  • the technical solution of the present embodiment can realize a super-power LED strong light source, and the power of the LED light source can reach several thousand watts.
  • each channel 1011 the two ports 1012 and 1013 of each channel 1011 are respectively opposed to each other, so that the fluid flowing through the channel 1011 enters from one end and quickly flows out from the other end, and the heat on the heat dissipation base 101 is quickly taken out. Efficient heat dissipation.
  • all of the heat dissipation bases 101 may be located in the outer casing 106.
  • the outer periphery of the connection position of the light transmission cover 103 and the heat dissipation base 101 on the transparent cover 103 is shown.
  • the portion is also provided with at least one or a plurality of through holes 201 that are opposite to one end of the passage 1011 on the heat dissipation base 101.
  • Its fluid cooling principle Lower-water or air or the like enters from the through hole 201 in the translucent cover 103, enters the passage 1011 from an opening of the passage 1011 on the heat dissipation base 101, and then flows out from the other opening 1013 of the passage 1011 from the outer casing 106.
  • the rear end portion 1061 flows out.
  • the rear end portion of the heat dissipation base 301 can also be made to exit the rear end 1061 of the outer casing 106.
  • fluid such as water or air can enter from the through hole 201 in the transparent cover 103, enter the channel 3011 from a port 3012 of the passage 3011 on the heat dissipation base 301, and then from the The other port 3013 of the passage 3011 flows directly to the outside.
  • the use of the design is advantageous for increasing the volume of the heat dissipation base 301, so that the volume of the heat dissipation base 301 is not restricted by the outer casing, thereby further improving the heat dissipation effect.
  • the front end portion of the heat dissipation base 401 can be further removed from the light transmission cover 403, as shown in FIG.
  • a through hole 4031 is provided in the outer periphery of the connection position of the light transmissive cover 403 and the heat dissipation base 401 on the transparent cover 403, so that the front end portion 4012 of the heat dissipation base 401 is interrupted.
  • the principle of fluid heat dissipation is as follows - fluid such as water or air can enter from the opening 40i2 of the heat dissipation base 401 which is discharged from the outside of the light transmission cover 403, and then flows out from the passage 4011 to the other opening 4013 outside the rear port of the housing.
  • the application of the technical solution is advantageous for improving the heat dissipation volume of the heat dissipation base 401 and improving the heat dissipation efficiency.
  • the outlets 4012 and 4013 of the passage 4011 are disposed outside the outer casing and the transparent cover 403, if all the passages 4011 are used When it is arranged as a tubular structure instead of a groove-like structure, it can be ensured that the fluid for straight-through flow through the heat dissipation base 401 does not need to flow through any of the inside of the outer casing, but flows directly from the outside and directly flows out to the outside, further ensuring various electronic components in the outer casing. Security.
  • two opposite flanges may be disposed on the inner side of the connection portion between the light transmission cover and the heat dissipation base. 1031, 1032.
  • the portion where the heat sink base is connected to the diffuser is limited to the two flanges 1031 and 1032, and is sealed to the space formed by the flanges 1031 and 1032.
  • the structure can further improve the tight fit of the heat-dissipating base and the light-transmitting cover, and the face-to-face interference fit connection can further ensure the sealing of the first cavity and ensure the stability of the electronic components therein.
  • each of the channels ll, 3011, and 4011 on the heat dissipation bases 10i, 301, and 401 may be a duct passage disposed in the heat dissipation base, or may have a plurality of wings on the back of the heat dissipation base.
  • the slot between any two fins acts as a slotted passage through which the fluid can flow in the heat sink base.
  • the circuit base mainly comprises: a metal substrate 501, an insulating substrate 502, a copper wire Foil 503.
  • the metal substrate 501 can be, but not limited to, a copper plate, an aluminum plate, or other metal plate.
  • the insulating substrate 502 can be a PCB insulating substrate used in current circuit fabrication, and the LED mounted on the circuit base is an LED chip.
  • connection relationship of the components is as follows:
  • the bottom surface of the metal substrate 501 is mounted on the surface of the heat dissipation base in contact with the surface of the heat dissipation base, and the LED chips 504 are respectively fixed on the top surface of the metal substrate 501, and the insulating layer 504 on the bottom surface of each LED wafer 504.
  • one electrode pin of each LED chip 504 is soldered to the metal substrate 501 on the bottom surface of the LED chip 504, and the other electrode pins are respectively laid through the respective conductive leads.
  • the wiring copper foil 503 in the edge substrate 502 is electrically connected, and the insulating substrate 502 is laid on a top surface of the metal substrate 501 except for a fixed position of the LED wafer 504.
  • the metal substrate 501 and the wiring copper foil 503 can be electrically connected to the positive electrode and the negative electrode of the external power supply circuit, respectively.
  • the working principle is that the external power supply circuit respectively introduces a DC power supply to the metal substrate 501 and the copper foil 503, and the LED chip 504 electrically connected between the metal substrate 501 and the copper _ 503 is in the current. Drive to work outside the light.
  • the LED chip 504 is directly fixed to the metal substrate 501 in face-to-face contact, and the insulating layer 5041 of the bottom surface of the LED chip 504 is directly in surface contact with the metal substrate 501, and one of the LED chips 504 is directly
  • the electrode leads are directly soldered to the metal substrate 501, and the other electrode lead of each of the LED chips 504 is electrically connected to the wiring copper foil 503 laid in the insulating substrate 502 by a wire lead.
  • the metal substrate 501 and the trace copper foil 503 introduce a DC working power supply for each LED chip 504, and the heat generated during the operation of the LED wafer 504 can be quickly transferred to the metal substrate 501 with good heat dissipation performance by contact heat conduction.
  • the heat on the LED chip 504 is quickly transferred to the heat dissipation base, and further radiated from the heat dissipation base, and the LED chip is soldered on the positive and negative trace copper foil 503 of the conventional PCT substrate relative to the prior art.
  • the solid crystal technology solution of 504 is further beneficial to improve the heat dissipation effect by applying the technical solution.
  • the heat dissipation base is used as an electrode conductor of the same polarity as the metal substrate 501 in addition to heat dissipation. Because the heat sink base has a large volume, the technical solution of the embodiment is further improved to reduce the internal resistance of the LED light, reduce the heat, and avoid the heat of the conductor being excessively burned due to long-term use, that is, further extending. Service life and stability.
  • the LED chip 607 can also be mounted on the metal substrate 601 using the technical solution shown in FIG.
  • the circuit base provided in this embodiment includes: a metal substrate 601, an insulating substrate 602, a copper foil 603, a silicone filling portion 604, and a plurality of conductive leads 605.
  • a recess 6011 is disposed on the top surface of the metal substrate 601.
  • the insulating substrate 602 is laid and fixed on the top surface area of the metal substrate 601 except the pit 6011.
  • a plurality of traces are laid on the insulating substrate 602. Copper foil 603.
  • a plurality of LED chips 607 are fixed in the recess 6011 of the metal substrate 601.
  • the insulating layer 6071 of the bottom surface of the LED chips 607 is in face-to-face contact with the metal substrate 601 under the LED chip 601, and an electrode lead of each LED chip 607 is directly soldered ( 608 is shown in the figure.
  • the other electrode lead of each LED chip 607 is placed on the insulating substrate 602 through the spliced conductive leads 605 and outside the recess 6011.
  • the wiring copper foil 603 is electrically connected.
  • each LED chip 607 is coated with a phosphor powder, which is coated on the top surface of the LED wafer 607 to form a phosphor layer after being coated, and the specific phosphor modulation and coating process can be However, it is not limited to refer to existing processes.
  • Phosphor S can dim the light emitted by the LED chip 607 to emit a predetermined color of light, such as yellow light, white light, etc. Generally, white light is generally used in applications.
  • the silica gel filling portion 604 is filled in the dimple 6011, and covers the top surface of the dimple 6011 as an exposed light transmissive protective layer.
  • the silicone filling portion 604 fills the filling pit 6011, and the inside of the dimple 6011
  • Each of the LED chips 607, the conductive leads 605, and the phosphor layer are collectively wrapped in the silica gel filling portion 604.
  • the negative electrode of the external DC power source is electrically connected to the metal substrate 601, and the positive electrode of the external DC power source is electrically connected to the wiring copper foil 603.
  • the copper foil 603 becomes the positive electrode of the power source, and the large-area metal substrate 601 located at the bottom serves as the negative electrode of the power supply, and collectively supplies the working power to the LED chip 607 soldered on the surface of the metal substrate 601, and the working current is quoted for each LED chip 607.
  • the LED chip 607 emits light under electric driving, and the light is emitted through the phosphor S and the silicone filling portion 604, and is externally emitted to realize illumination.
  • the insulating j3 ⁇ 4 of the bottom surface of the LED chip is directly in surface contact with the metal substrate, and an electrode lead of each LED chip is directly soldered.
  • the other electrode lead of each LED chip is electrically connected to the trace copper foil laid in the insulating substrate through a wire lead.
  • the metal substrate and the trace copper foil are used to introduce DC work for each LED chip. power supply.
  • the heat generated in the working process of the LED chip of the present embodiment can be quickly transferred to the metal substrate with good heat dissipation performance by contact heat conduction, and the metal substrate dissipates heat outside the LED chip, so that the conventional PCT substrate is compared with the prior art.
  • the solid crystal technology scheme for soldering LED chips on the copper foil is applied, and the application of the technical scheme is beneficial to improve the heat dissipation effect.
  • the positive electrodes of the LED chips may be soldered on the metal substrate, and the negative electrodes of the LED chips are electrically connected to the trace copper foil outside the pits through the leads.
  • the negative input terminal of the external DC power supply is electrically connected to the copper foil, and the positive input terminal is electrically connected to the metal substrate.
  • the negative electrode of each LED chip may be soldered on the metal substrate, and the lE pole of each LED chip is electrically connected to the copper outside the pit through the lead wire ( It can be, but is not limited to, electrically conductively connected by soldering).
  • the positive input terminal of the external DC power supply is electrically connected to the copper foil, and the negative input terminal is electrically connected to the metal substrate.
  • the volume of the negative bulk metal substrate is relatively large, so that the solid crystal technology scheme for soldering the LED wafer on the conventional copper foil of the conventional PCT substrate is improved compared with the prior art.
  • the stability of the current improves the illumination stability and lifetime of the LED chip.
  • the LED chip is fixed on the positive and negative wire copper foil laid on the insulating substrate, and the embodiment of the present invention directly solders the LED chip on the surface of the solid metal substrate.
  • the technical solution breaks through the inertia of current technicians and overcomes technical bias.
  • the cross section of the outer casing in this embodiment may be square, circular, elliptical, trapezoidal, triangular or a combination of one or more of the foregoing; in this embodiment, the cross section of the heat dissipation base It may be a square, a circle, an ellipse, a scorpion, a triangle or a combination of one or more of the foregoing.
  • the LED light source with the structure of the heat dissipation base 701 provided in this embodiment differs from that shown in Embodiment 1 mainly includes:
  • circuit bases 7041 and 7042 are fixed on at least two opposite surfaces of the heat dissipation base 701, and LEDs are fixed to the circuit bases 7041 and 7042.
  • a light distribution mirror 702 is sleeved on the outer surface of the heat dissipation base 701, and a casing is sleeved outside the light distribution mirror 702.
  • the light shielding mirror 702 and the front end portion of the outer casing are commonly connected and fixed with a light transmission cover 703 for heat dissipation.
  • All the LEDs on the circuit bases 7041, 7042 and the circuit bases 704, 7042 of the respective surfaces of the base 701 are commonly located in a sealed cavity 707 formed by the light distribution mirror 702, the heat dissipation base 701 and the light transmission cover 703.
  • the sealed cavity 707 surrounds the outer circumference of the heat dissipation base 701
  • the heat dissipation principle and the corresponding beneficial effects are the same as those of the first embodiment. Since the layout of the LED of the embodiment is distributed on the plurality of faces on the heat dissipation base 701, the illumination range is wider and the illumination intensity is stronger.
  • At least one pipe passage 70U is disposed in the heat dissipation base 701, and both opposite outlets of the pipe passage 7011 are externally connected, and the pipe passage in Embodiment 1
  • the duct passage 7011 on the heat dissipation base 701 may be located in the light-transmitting cover 703 and the outer casing, or the front end portion may be outside the light-transmitting cover 703, or the rear end portion may be the outer casing.
  • the front end can also be out of the outer casing and the outer cover 703.
  • the circuit bases 7041 and 7042 for fixing LEDs can be widely used at present.
  • the technical solutions of FIGS. 6 and 7 in Embodiment 1 can also be used. The beneficial effects are shown in the description in Example 1.
  • At least one circuit base 8041 and 8042 may be respectively fixed on the top surface and the bottom surface of the heat dissipation base 801 of a large area, and LEDs 8051 and 8052 are respectively fixed on the circuit bases 8041 and 8042.
  • the connection of the specific circuit substrate and the LEDs 8051, 8052 can be, but is not limited to, the description in Examples 1 and 2.
  • a light distribution mirror 8021, 8022 is sleeved outside the heat dissipation base 801, and a housing 806 is sleeved outside the light distribution mirrors 8021 and 8022.
  • the circuit base 8041 and the LEDs on the top surface of the heat dissipation base 801 are located in the first sealed cavity 8071 formed by the light distribution mirror 8021, the heat dissipation base 801 and the transparent cover 803, and are located in the heat dissipation.
  • the circuit base 8042 and the LEDs on the bottom surface of the pedestal 801 are both located in the second sealing cavity 8072 formed by the light distribution mirror 8022, the heat dissipation base 801, and the light transmission cover 803.
  • At least one pipe passage 8011 is further disposed inside the heat dissipation base 801, and the two ports 8013. 8013 of the respective channels 8011 are all communicated with the outside.
  • the pipe passage 8011 on the heat dissipation base 801 can be located in both the light transmission cover 803 and the outer casing 806.
  • the front end portion may be outside the light transmissive cover 803, or the rear end portion may be out of the outer casing 806, and the front end portion may be out of the outer casing 806 and the outer cover 803.
  • the specific working principle and effect refer to the description in Embodiment 1.
  • the LEDs of the structures shown in FIGS. The light source is used as a unit, and a plurality of units are combined to form a large matrix of glare LED light sources with good heat dissipation capability, and the LED glare-oriented energy-saving illumination with good heat dissipation is realized.
  • the present invention performs the following test tests on the high power LED lamp produced by the present embodiment.
  • Test environment room temperature, and air is blown into the second cavity 111 from the first through hole 112 below the lens 103 at a wind speed of 2 m per second to simulate the air flow during the traveling of the car.
  • Test object 1 LED lamp with a power of 100W.
  • test environment room temperature, and air is blown into the second cavity 111 at a wind speed of 2 m per second from the first through hole 112 located below the lens 103 to simulate the air flow during the traveling of the car.
  • an infrared temperature detector is used, which is outside the LED chip.
  • the infrared temperature detector was used to test the temperature on the surface of the main heat sink base 0.3 mm from the outer circumference of the LED chip, and the measured temperature value was 52.2 ° C, which was on the surface of the high beam LED chip. Temperature is 58.6 °
  • Test object 2 A matrix of LED lamps with a power of 1000 W, which is adapted to increase the physical mass of the heat dissipation base, so that it is discharged from the front end of the light transmission cover 403 as shown in FIG. 4, and the rear end is rearward from the outer casing 106.
  • the terminal is in the middle, and the channels are all pipeline channels;
  • Test environment room temperature, room temperature, from pipe channel 3011 to simulate airflow during vehicle travel. Water is bubbled into the second cavity 111 at 2 m per second to simulate the flow of water during the ship's travel.
  • the infrared temperature detector was used to test the temperature on the surface of the main heat sink base at 0.3 nm from the periphery of the LED chip, and the measured temperature value was 52.2 ° C, which was on the surface of the high beam LED chip.
  • the temperature is 55.6 ° C.
  • the present embodiment can be applied not only to high-power lighting in various conventional occasions, but also to LED headlamps such as motorcycles, automobiles, ships, etc.
  • This embodiment is particularly suitable for high-power lighting equipment placed outdoors.
  • the heat can be dissipated by using natural wind, rain, etc.; the embodiment is also particularly suitable for illumination on a movable device, and the reverse flow or water flow generated during the movement of the device can be utilized to achieve fluid penetration and efficient heat dissipation.

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Abstract

LED光源包括散热基座，在所述散热基座的表面固定有电路基座，在所述电路基座上固定有可发光的LED，在所述散热基座外密封连接有配光镜，在所述配光镜外固定有外壳，所述外壳的前端以及所述配光镜的前端分别与所述透光罩固定连接，所述透光罩还与所述散热基座密封连接，所述电路基座以及LED均位于所述配光镜、散热基座以及透光罩构成的密封的第一空腔内，在所述散热基座上还设置有至少一个通道，各所述通道与所述第一空腔不连通，各所述通道相对的两开口均与外部相通。其具有良好的散热效果，特别适用于大功率的LED照明。

Description

LED光源 技术领域
[0001] 本实用新型涉及 LED照明领域， 尤其涉及一种 LED光源。
背景技术
[0002] 隨着电气技术的发展， 散热问题已经成为制约设备的功率提升以及产品寿命的重要 因素。
[00031 特别地， 在 LED照明领域， 虽然 LED作为新型绿色环保用光源的优势已经越来越明 显， 但是 LED功能照明强光源散热至今是尚未妥善解决的世界性技术难题， 以至于妨碍了 LED功能照明作为强光源的应用。 比如动力汽车车灯、 轮船的大型 LED照明光源、 LED路 灯、 以及探照灯等大功率 LED光源的推广越来越受到散热问题的制约。
实用新型内容
[00041 本实用新型实施例第一目的在于提供一种 LED光源， 其具有良好的散热效果， 特别 适用于大功率的 LED照明。
[000S1 本实用新型实施例第二目的在于提供另一种 LED光源， 其具有良好的散热效果， 特 别适用于大功率的 LED照明。
[0006] 本实用新型实施例提供的第一种 LED光源， 包括散热基座，
在所述散热基座的表面固定有电路基座， 在所述电路基座上固定有可发光的 LED, 在所述散热基座外密封连接有配光镜， 在所述配光镜外固定有外壳， 所述外壳的前端以及所 述配光镜的前端分别与所述透光罩固定连接，
所述透光罩还与所述散热基 ϋ密封连接， 所述电路基座以及 LED均位于所述配光镜、 散热 基座以及透光罩构成的密封的第一空腔内，
在所述散热基座上还设置有至少一个通道， 各所述通道与所述第一空腔不连通， 各所述通道 相对的两开口均与外部相通。
[0007】 2、 根据权利要求 1所述的 LED光源， 其特征是，
各所述通道为形成在所述散热基座内的管道通道； 或者，
在所述散热基座表面形成有复数个翅片，
各所述通道为任意相邻的两所述翅片之间的槽状通道。
[00081 可选地， 各所述通道为形成在所述散热基座内的管道通道； 或者，
在所述散热基座表面形成有复数个翅片， 各所述通道为任意相邻的两所述翅片之间的槽状通道。
[00091 可选地， 所述散热基座的后端部分仲出在所述外壳的后端外，
各所述通道的一开口位于所述外壳的后端外。
[0010] 可选地， 所述散热基座全部位于所述透光罩的一侧，
在所述透光罩上与所述散热基座相连接的部位的外周部位还设置有至少一个通孔， 各所述通孔与所述散热基座上各所述通道的一开口相对。
[0011] 可选地，
本实用新型实施例提供的第二种 LED光源，
可选地， 所述散热基座部分仲出在所述透光罩外，
在所述透光罩上与所述散热基座相连接的部位的外周部位还设置有至少通孔，
所述散热基座的部分贯穿所述透光罩通孔仲出所述透光罩外，
所述散热基座上各所述通道的一幵口位于所述透光罩外。
[0012] 可选地， 在所述透光罩上与所述散热基座相互连接的部位还设置有两相对的凸边， 所述透光罩还与所述散热基座密封连接， 具体是：
所述散热基座与所述透光罩连接的部位限位密封固定在所述透光罩两所述凸边之间。
[0013] 可选地， 所述透光罩上与所述外壳以及配光镜连接部位上设置有第一凸边， 所述外壳的前端以及所述配光镜的前端分别与所述透光罩固定连接， 具体是- 所述外壳面对面地密封固定在所述透光罩的第一凸边的外侧，
所述配光镜面对面密封固定在所述第一凸边的内侧。
[0014] 可选地， 所述散热基座包括： 金属基板、 绝缘层、 走线铜箔；
所述 LED为 LED晶片， 各所述 LED晶片固定在所述金属基板的表面，
各所述 LED晶片底 W的绝缘层与所述金属基板面接触，
各所述 LED晶片的一电极引脚分别焊接于所述金属基板上， 另一电极引脚分别与所述走线 铜 IS电连接；
其中， 所述 PCB绝缘基材铺设在所述金属基板的顶面上除所述 LED晶片固定位置外的区 域， 所述走线铜箔铺设在所述： PCB绝緣基材内；
所述金属基板、 走线铜箔可分别与所述外供电电路的正极、 负极分别电连接。
[0015] 可选地， 在所述金属基板的顶面还设置有一凹坑，
各所述 LED晶片固定在所述金属基板的表面， 具体是： 各所述 LED晶片均固定在所述凹坑 的表面， 所述 PCB绝緣基材铺设在所述金属基板的顶面上除所述 LED晶片固定位置外的区域， 具体 是： 所述绝缘 S具体铺设在所述金属基板上除所述凹坑外的顶面区域；
各所述 LED晶片的另一电极引脚分别与所述走线铜箔电连接， 具体是： 各所述 LED晶片的 另一电极引脚具体分别通过各导电引线与所述走线铜 «电连接；
在所述凹坑内还填充有硅胶填充部，
所述硅胶填充部填充在所述凹坑内， 所有所述 LED晶片以及导电引线被共同包裹在所述硅 胶填充部内。
[00161 本实用新型实施例提供的一种 LED光源， 包括： 包括散热基座，
在所述散热基座的顶面以及底面分别固定有电路基座 , 在各所述电路基座上分别固定有可发 光的 LED;
在所述散热基座外还密封套接有配光镜， 在所述配光镜外还套接有外壳， 所述外壳的前端以 及配光镜的前端分别与透光罩固定连接；
位于所述散热基座顶面的所述电路基座以及 LED均位于所述配光镜、 散热基座以及透光罩 构成的第一密封空腔内，
位于所述散热基座底面的所述电路基座以及 LED均位于所述配光镜、 散热基座以及透光罩 构成的第二密封空腔内，
在所述散热基座内部还设置有至少一管道通道， 各所述通道相对的两开口均与外相通。
10017] 可选地， 所述散热基座的后端部分仲出在所述外壳的后端外，
各所述通道的一幵口位于所述外壳的后端外。
[0018] 可选地， 所述散热基座全部位于所述透光罩的一侧，
在所述透光罩上还设置有至少一个通孔， 各所述通孔与所述散热基座上各所述通道的一幵口 相对。
[0019] 可选地， 所述散热基座部分仲出在所述透光罩外，
在所述透光罩与所述散热基座连接处的外周部位还设置有通孔，
所述散热基座部分贯穿所述透光罩通孔仲出所述透光罩外，
所述散热基座上的各所述通道的一开口位于所述透光罩外。
[0020] 可选地， 在所述透光罩上与所述散热基座相互连接的部位还设置有两相对的凸边， 所述透光罩还与所述散热基座密封连接， 具体是- 所述散热基座与所述透光罩连接的部位限位密封固定在所述透光罩两所述凸边之间。
[0021] 可选地， 所述透光罩上与所述外壳以及配光镜连接部位上设置有第一凸边， 所述外壳的前端以及所述配光镜的前端分别与所述透光罩固定连接， 具体是- 所述外壳面对面地密封固定在所述透光罩的第一凸边的外侧，
所述配光镜面对面地密封固定在所述第一凸边的内侧。
[0022] 可选地， 所述散热基座包括： 金属基板、 绝缘层、 走线铜箔；
所述 LED为 LED晶片， 固定在所述金属基板的表面， 各所述 LED晶片底面的绝缘 与所 述企属基板面接触，
各所述 LED晶片的一电极引脚分别焊接于所述金属基板上， 另一电极引脚分别与所述走线 铜 II电连接；
其中, 所述 PCB绝缘基材铺设在所述金属基板的顶面上除所述 LED晶片固定位置外的区 域， 所述走线铜箔铺设在所述 PCB绝錄基材内；
所述金属基板、 走线铜箔可分别与所述外供电电路的正极、 负极分别电连接。
[0023] 可选地， 在所述金属基板的顶面还设置有一凹坑，
各所述 LED晶片固定在所述金属基板的表面， 具体是： 各所述 LED晶片均固定在所述凹坑 的表面，
所述 PCB绝錄基材铺设在所述金属基板的顶面上除所述 LED晶片固定位置外的区域， 具体 是- 所述绝緣 具体铺设在所述金属基板上除所述凹坑外的顶面区域；
各所述 LED晶片的另一电极引脚分别与所述走线铜箔电连接， 具体是： 各所述 LED晶片的 另一电极引脚具律分别通过各导电引线与所述走线铜箔电连接；
在所述凹坑内还填充有硅胶填充部，
所述硅胶填充部填充在所述凹坑内， 所有所述 LED晶片以及导电引线被共同包裹在所述硅 胶填充部内。
[00241 由上可见， 应用本实用新型实施例的技术方案， 在接通外接供电电源时， 外接电源 通过电路基座向电路基座上的各 LED供电， 在电驱动下 LED被点亮而对外发光。 在 LED 工作过程中发生的热量通过电路基座被快速传递至其连接的散热基座上， 而在散热基座中设 置有至少一个与外连通的通道， 与通道的一进口进入的空气或者液体等流体从散热基座中流 过, 与散热基座充分接触热快速将散热基座上的热量从通道的另一出口带出， 实现流体流通 散热， 提高 LED强光源的散热效率。 经过本发明人的试验， 利用本实施例技术方案能够实 现超大功率的 LED强光源， 其 LED光源的功率可达数千瓦特。
[0025] 另外， 在本实施例中各通道的两幵口分别相对， 故流经通道的流体从一端进入后快 速从另一端流出， 快速将散热基座上的热量带出， 实现髙效散热。 [0026] 另外， 由于散热基座内的各通道与电路基座以及 LED所在的第一腔体不连通， 故流 经通道的流体均不会进入主要电气电子器件的电性能。
[0027] 附图说明
此处所说明的附图用来提供对本实用新型的进一步理解， 构成本申请的一部分， 并不构成对 本实用新型的不当限定， 在險图中:
图 1为本实用新型实施例 1提供的一种带散热装置的 LED光源的注视结构示意图； 图 2为本实用新型实施例 1中图 1所示的 A-A剖面结构示意图；
图 3为本实用新型实施例 1中提供的一种带散热基座的后端部分仲出外壳后端的 LED光源 的剖面结构示意图；
圏 4为本实用新型实施例 1中提供的一种带散热基座的前端部分仲出透光罩外的 LED光源 的剖面结构示意图；
圈 5为本实用新型实施例 1中提供的一种用于固定 LED的电路基座与其上的 LED的连接结 构示意图；
图 6为本实用新型实施例 1中提供的另一种用于固定 LED的电路基座与其上的 LED的连接 结构示意图；
图 7为本实用新型实施例 2提供的一种带散热基座的 LED光源的剖面结构示意圈； 图 8为本实用新型实施例 3提供的一种带散热基座的 LED光源的剖面结构示意图。
[0028] 具体实施方式
下面将结合附图以及具体实施例来详细说明本实用新型， 在此本实用新型的示意性实施例以 及说明用来解释本实用新型， 但并不作为对本实用新型的限定。
[0029J 实施例 1 :
请参考图 1、 2。
[0030] 本实施例提供的一种 LED光源主要包括外壳 K)6、 散热基座 101、 配光镜 102、 透光 罩 103、 电路基座 104、 LED 105。
[0031] 该散热基座 101为散热性能良好的材料， 比如其可以但不限为铜基座、 铝基座、 或 者铜铝合金基座。
[0032J 电路基座 104紧密固定在散热基座 101的表面， 在该电路基座 104上固定有用于给 LED 105供电的供电电路结构， LED 105固定在该电路基座 104上， 其中该 LED 105可以为 插脚 LED也可以为 LED晶片。 该 LED 105可以为单个大功率 LED也可以为有复数个 LED 组成的 LED集群， 该 LED集群的形状可以根据具体需要排布， 皮如可以排布成确定的商标 图案， 以便实现广告投影宣传作用等。
[0033] 在散热基座 101夕卜固定有配光镜 102， 配光镜 102的种类以及形状可以根据当前大功 率 LED光源的应用场合选用， 譬如可以为具有聚光作用的配光镜 102, 以实现大功率远程 高强度照明。
[0034] 配光镜 102的后端与散热基座 101密封紧密连接， 该配光镜 102的前端与透光罩 103 紧密连接。
[00351 电路基座 104以及该电路基座 104上的 LED均位于散热基座 101、 配光镜 102以及 透光罩 103组成的密封腔体内， 见图 1中的所示的第一腔体亂
【00M| 在配光镜 102外还固定有一用于保护的外壳 106 , 该外壳 106的前开口端与透光罩 103固定连接， 该外壳 106的后端可用于连接固定外连接部， 以实现安装。
[0037] 在散热基座 101上还设置有至少一个与第一腔体 107不相连通的通道 1011， 这些通 道 1011可以设置在散热基座 101的内部也可以设置在散热基座 101上不在第一腔体 107内 的部位外周。
[0038] 各通道 1011相对的两端部 100、 1013分别对外连通。
[0039] 本实施例 LED光源的工作原理如下- 接通外接供电电源， 外接电源通过电路基座 104向电路基 * 104上的各 LED 105供电， 在 电驱动下 LED 105被点亮而对外发光。 在 LED 105工作过程中发生的热量通过电路基座 104 被快速传递至其连接的散热基座 101上， 而在散热基座 101中设置有外连通的通道 101 1， 空气或者液体等流体从通道 1011的一进口 1012进入， 流经散热基 * 101， 与散热基座 101 充分接触热快速将散热基座 101上的热量从通道 10U的另一出口 1013带出出， 实现流体贯 通散热， 提高 LED强光源的散热效率。
[00401 经过本发明人的试验， 利用本实施例技术方案能够实现超大功率的 LED强光源， 其 LED光源的功率可达数千瓦特。
[00411 在本实施例中， 各通道 1011的两幵口 1012、 1013分别相对， 故流经通道 1011的流 体从一端进入后快速从另一端流出， 快速将散热基座 101上的热量带出， 高效散热。
[00421 另外， 由于散热基座 01 内的各通道 101 1与电路基座 104以及 LED所在的第一腔体
107不连通， 故流经通道 101 1的流体均不会进入主要电气电子器件的电性能。
[0043] 在本实施例中， 可以使散热基座 101的全部均位于外壳 106内， 参见图 2所示， 在 透光罩 103上本透光罩 103与散热基座 101的连接位置的外周部位还设置有至少一个或多个 通孔 201， 这些通孔 201与散热基座 101上的通道 1011的一端相对。 其流体散热原理如 下- 水或者空气等流体从透光罩 103上的通孔 201进入， 从散热基座 101上的通道 1011的一开 口进入通道 1011 , 然后从该通道 1011的另一开口 1013流出， 从外壳 106的后端部 1061流 出。
[0044] 在本实施例中， 还可以使散热基座 301的后端部分仲出外壳 106的后端 1061。 参见 图 3所示， 釆用该设计， 水或者空气等流体可以从透光罩 103上的通孔 201进入， 从散热基 座 301上的通道 3011的一幵口 3012进入通道 3011， 然后从该通道 3011的另一幵口 3013直 接流到外部。 采用该设计有利于增大散热基座 301的体积， 使散热基座 301的体积不受外壳 的约束， 进一步提高散热效果。
[00451 在本实施例中， 还可进一歩使散热基座 401的前端部分仲出透光罩 403外， 具体参 见图 4所示。 在透光罩 403上本透光罩 403与散热基座 401的连接位置的外周还设置可供散 热基座 401的前端部分仲出的通孔 4031， 使散热基座 401的前端部分 4012仲出在透光罩 403外。 其流体散热原理如下- 水或者空气等流体可以从透光罩 403外仲出的散热基座 401的开口 40i2进入， 然后从该通 道 4011仲出在外壳后端口外的另一开口 4013流出。 应用本技术方案一方面有利于提高散热 基座 401的散热体积， 提高散热效率， 另一方面由于通道 4011的迸出口 4012、 4013均设置 在外壳以及透光罩 403外， 如果将所有的通道 4011设置为管状结构而非槽状结构时， 可以 保证用于直通流过散热基座 401的流体无需流过外壳内的任何， 而直接从外部流进而直接流 出外部， 进一步保证外壳内各电子元器件的安全性。
[0046] 参见图 2、 3、 4所示， 为了提髙透光罩与散热基座之间的连接紧密型， 可在透光罩 与散热基座连接部位的内侧设置两个相对的凸边 1031、 1032。 在装配时， 使散热基座与透 光罩连接的部位限位在两凸边 1031、 1032内， 与该凸边 1031、 1032构成的空间密封连接。 釆用该结构能进一步提高散热基座与透光罩连接配合的紧密型， 并且采用该面对面的过盈配 合连接能进一步保障第一腔体的密封性， 保证其内电子元器件的稳定性。
[0047] 在本实施例中， 在散热基座 10i、 301、 401上的各通道 l l、 3011, 4011可以为设 置在散热基座内的管道通道， 也可以在散热基座背面有多个翅片， 任意两翅片之间的幵槽作 为散热基座中可供流体流过的槽状通道。
10048] 另外， 本发明人经过长期的试验发现， 上述的电路基座可以为目前广 S使用的 PCB 电路板或者其他， 也可以采用以下的技术方案- 参见图 5所示， 参见本实施例的电路基座主要包括： 金属基板 501、 绝缘基材 502、 走线铜 箔 503。 该金属基板 501可以但不限于为铜板、 铝板或者其他的金属板， 该绝缘基材 502可 以为目前电路制备中使用的 PCB绝緣基材， 安装在电路基座上的 LED为 LED晶片。 各部 件的连接关系如下： 金属基板 501的底面与散热基座面接触地安装在散热基座表面， 各 LED晶片 504分别固定在金属基板 501的顶面， 各 LED晶片 504底面的绝緣层 504 与本 LED晶片 504底面的金属基板 501面接触， 各 LED晶片 504的一电极引脚分别焊接于本 LED晶片 504底面的金属基板 501上， 另一电极引脚分别通过各导电引线与铺设在绝緣基 材 502内的走线铜箔 503电连接， 所述绝缘基材 502铺设在所述金属基板 501的顶面、 除 LED晶片 504固定位置外的区域。 金属基板 501、 走线铜箔 503可分别与外供电电路的正 极、 负极分别电连接。
[004¾ 其工作原理是， 外供电电路分别向金属基板 501、 走线铜箔 503引入直流电源， 而电 连接在金属基板 501以及走线铜 _« 503之间的 LED晶片 504在该引入电流的驱动下工作对 外发光。
[00501 由上可见， 在上述的技术方案中， LED晶片 504直接面对面接触地固定在金属基板 501上， LED晶片 504底面的绝緣层 5041直接与金属基板 501面对面接触， 各 LED晶片 504的一电极引脚直接焊接在金属基板 501上， 各 LED晶片 504的另一电极引脚通过导线 引线与铺设在绝緣基材 502内的走线铜箔 503电连接。
[0051] 在应用时， 金属基板 501以及走线铜箔 503为各 LED晶片 504引入直流工作电源， LED晶片 504工作过程中产生的热量可通过接触热传导而快速传递到散热性能良好的金属 基板 501上， 金属基板 501将 LED晶片 504上的热量快速传递到散热基座上， 由散热基座 进一步散发， 相对于现有技术在常规的 PCT基板的正负极走线铜箔 503上焊接 LED晶片 504的固晶技术方案， 应用本技术方案进一步有利于提高散热效果。
【0052】 另外， 由于本实施例的金属基板 501与散热基座紧密接触连接， 在 LED晶片 504工 作过程中， 散热基座除了散热之外， 还作为与金属基板 501极性相同的电极导体应用， 而由 于散热基座的体积较大， 故应用本实施例技术方案还进一歩有利于降低 LED照明灯的内 阻， 降低热量， 避免导体由于长期使用而发热过大而烧坏， 即进一步延长使用寿命以及稳定 性。
[00531 为了进一步提髙电路基座上 LED晶片 607的稳固性， 还可以釆用图 6所示技术方案 在金属基板 601上固定 LED晶片 607。
10054] 本实施例提供的电路基座包括： 金属基板 601、 绝缘基材 602、 走线铜箔 603、 硅胶 填充部 604、 复数条导电引线 605。 [0055] 在金属基板 601的顶面设置有一凹坑 6011 , 绝缘基材 602铺设固定在金属基板 601 上除凹坑 601 1外的顶面区域， 在绝缘基材 602上铺设有多个走线铜箔 603。
[00561 在金属基板 601的凹坑 6011内固定有多个 LED晶片 607 , 这些 LED晶片 607底面 的绝缘层 6071与其下方的金属基板 601面对面接触， 各 LED晶片 607的一电极引脚被直接 焊接 （见图中的 608示意） 在本晶片 607下方的金属基板 601上， 各 LED晶片 607的另一 电极引脚通过悍接的导电引线 605而与铺设在凹坑 6011外， 绝缘基材 602上的走线铜箔 603电连接。
[00571 在各 LED晶片 607的顶面涂覆有荧光粉， 该荧光粉在涂覆后固化成型地包裹在 LED 晶片 607的顶面形成荧光粉层， 具体的荧光粉的调制以及涂覆工艺可以但不限于参考现有的 工艺进行。 荧光粉 S可以对 LED晶片 607发出的光线进行调光， 对外发出预定颜色的光 线， 譬如黄光、 白光等， 一般在应用中白光居多。
[0058] 硅胶填充部 604填充在凹坑 6011内， 作为外露的可透光的保护层而覆盖在凹坑 6011 的顶面， 该硅胶填充部 604充盈填充凹坑 6011， 而凹坑 6011内的各 LED晶片 607、 导电引 线 605以及荧光粉层均被严严实实地共同包裹在硅胶填充部 604内。
[0059] 在应用时， 将外部直流电源的负极与金属基板 601电连接， 外部直流电源的正极与 走线铜箔 603电连接。 在通电时， 走线铜箔 603成为电源正极， 位于底部的大面积金属基板 601成为电源负极， 共同为焊接在金属基板 601表面上的 LED晶片 607提供工作电源， 为 各 LED晶片 607引用工作电流， LED晶片 607在电驱动下发出光线， 光线经荧光粉 S、 硅 胶填充部 604后对外射出， 实现照明。
[0060] 由上可见， 由于本实施例在 LED晶片的固定直接在金属基板上焊接 LED晶片， 使 LED晶片底面的绝缘 j¾直接与金属基板面对面接触， 各 LED晶片的一电极引脚直接焊接在 金属基板上， 各 LED晶片的另一电极引脚通过导线引线与铺设在绝緣基材内的走线铜箔电 连接， 在应用时， 金属基板以及走线铜箔为各 LED晶片引入直流工作电源。 本实施例 LED 晶片工作过程中产生的热量可通过接触热传导而快速传递到散热性能良好的金属基板上， 金 属基板将 LED晶片上的热量外散发， 故相对于现有技术在常规的 PCT基板的走线铜箔上焊 接 LED晶片的固晶技术方案， 应用本技术方案有利于提高散热效果。
[0061] 作为本实施例的一种可选应用实施方案， 可以将各 LED晶片的正极焊接在金属基板 上， 将各 LED晶片的负极通过引线与凹坑外的走线铜箔电连接。 在应用时， 将外部直流电 源的负极输入端子与走线铜箔电连接， 正极输入端子与金属基板电连接。 该可选方案的选用 根据实际应用场景选择。 [0062] 作为本实施例的一种较优应用实施方案， 可以将各 LED晶片的负极焊接在金属基板 上， 将各 LED晶片的 lE极通过引线与凹坑外的走线铜猜电连接 （可以但不限于通过焊接方 式导电连接）。 在应用时， 将外部直流电源的正极输入端子与走线铜箔电连接， 负极输入端 子与金属基板电连接。 此时在电性能上， 负极块状金属基板的体积较粗， 故相对于现有技术 在常规的 PCT基板的走线铜箔上焊接 LED晶片的固晶技术方案， 应用本技术方案有利于增 强电流的稳定性， 提高 LED晶片的光照稳定性以及使用寿命。
[00631 另外， 相对于现有技术传统的 LED固定方式： 在绝缘基材上铺设的正负极走线铜箔 上固定焊接 LED晶片， 本实用新型实施例直接在实心金属基板表面焊接 LED晶片的技术方 案突破了目前技术人员的惯性思维， 克服了技术偏见。
100641 需要说明的是， 在本实施例外壳的橫截面可以为方形、 圆形、 椭圆形、 梯形、 三角 形或前述其中 1种至几种的结合； 在本实施例中该散热基座的横截面可以为方形、 圆形、 椭 圓形、 綈形、 三角形或前述其中 1种至几种的结合。
[0065] 实施例 2:
请参见图 7。
[0066J 本实施例提供的一种带散热基座 701结构的 LED光源与实施例 1中所示所不同之处 主要包括：
本实施例的 LED光源中散热基座 701的至少两个相对面上固定有电路基座 7041、 7042 , 在 各电路基座 7041、 7042上均固定有 LED。
[00671 在散热基座 701外密封套接有配光镜 702， 在配光镜 702外还套接有外壳， 配光镜 702以及外壳的前端部共同连接固定有透光罩 703 , 位亍散热基座 701各表面的电路基座 7041、 7042以及各电路基座 704】、 7042上的所有 LED共同位于配光镜 702、 散热基座 701 以及透光罩 703构成的一密封空腔 707内， 该密封空腔 707围绕散热基座 701的外周
[0068] 其散热原理以及对应的有益效果与实施例 1相同， 由于本实施例的 LED的布局分布 在散热基座 701上的多个面， 故其光照范围更广， 光照强度更强。
[0069] 与实施例 i中图 1-4同理， 在该散热基座 701内设置有至少一个管道通道 70U, 该 管道通道 7011的两相对出口均对外连通， 与实施例 1中关于管道通道 7011的记载同理， 该 散热基座 701上的管道通道 7011既可以均位于透光罩 703与外壳内， 也可以前端部分仲出 于透光罩 703外， 也可以后端部分仲出于外壳外， 还可以前后端均仲出外壳外以及透光罩 703外。
[0070] 与实施例 1同理， 用于固定 LED的电路基座 7041、 7042可以为目前广泛使用的 PCB电路板或者其他， 也可以釆用实施例 1中图 6、 7技术方案。 其有益效果见实施例 1中 的记载。
[0071] 实施例 3 :
请参见图 8。
10072] 在本实施例中还可以在一大面积的散热基座 801的顶面以及底面分别固定至少一电 路基座 8041、 8042, 各电路基座 8041、 8042上分别固定有 LED 8051、 8052, 具体电路基 板以及 LED 8051、 8052的连接可以但不限于参见实施例 1、 2中的描述。
[0073] 在散热基座 801外还密封套接有配光镜 8021、 8022, 在配光镜 8021、 8022外还套接 有外壳 806， 外壳 806的前端以及配光镜 8021、 8022的前端分别与透光罩 803固定连接； 位于散热基座 801顶面的电路基座 8041以及 LED均位于配光镜 8021、 散热基座 801以及 透光罩 803构成的第一密封空腔 8071内， 位于散热基座 801底面的所述电路基座 8042以 及 LED均位于配光镜 8022、 散热基座 801 以及透光罩 803构成的第二密封空腔 8072内。
[0074] 在散热基座 801内部还设置有至少一管道通道 8011， 各所述通道 8011相对的两幵口 8013. 8013均与外相通。
[0075] 与实施例 1中图 1-4同理， 与实施例 1中关于管道通道 8011的记载同理， 该散热基 座 801上的管道通道 8011既可以均位于透光罩 803与外壳 806内， 也可以前端部分仲出于 透光罩 803外， 也可以后端部分仲出亍外壳 806外， 还可以前后端均仲出外壳 806外以及透 光罩 803外。 具体工作原理以及效果具体参见实施例 1中的描述。
[00761 需要说明的是， 应用上述实施例技术方案， 在应用过程中除了可以应用实施例 1、 2 中的设计外， 可以将实施例 1、 2中图 1-4、 7所示结构的 LED光源作为单元， 而将多个单 元组合在一起组成大型的具在良好散热能力的强光 LED光源矩阵， 实现散热良好的 LED强 光定向节能照明。
[0077] 为了进一步说明本实用新型的效果， 本实用新型对釆用本实施例制成的大功率 LED 灯进行了以下的试验测试。
【00781 测试环境： 室温， 并且从位亍透镜 103下方的第一通孔 112处以风速每秒 2m向第二 腔体 111中鼓风， 以模拟在汽车行进过程中的气流。
[0079] 被测试对象 1 : 功率为 100W的 LED灯。
[0080] 测试环境： 室温， 并且从位于透镜 103下方的第一通孔 112处以风速每秒 2m向第二 腔体 111中鼓风， 以模拟在汽车行进过程中的气流。
[0081] 在上述测试环境中， 使连续工作 1小时后， 釆用红外温度检测仪， 在离 LED晶片外 周 0.3mm处的主散热基座表面测试温度， 测得温度值为 50.2° C , 在远光灯 LED晶片表面 的温度为 55.6° C;
在 LED灯连续工作 2小时后， 釆用红外温度检测仪， 在离 LED晶片外周 0.3mm处的主散 热基座表面测试温度， 测得温度值为 52.2 ° C , 在远光灯 LED晶片表面的温度为 58.6 °
[0082]被测试对象 2: 功率为 1000W的 LED灯矩阵， 相适应的， 增加散热基座的体质， 使 其如图 4所示从透光罩 403前端仲出， 后端从外壳 106的后端仲出， 其中的通道均为管道通 道；
测试环境： 室温， 室温， 从管道通道 3011中以， 以模拟在汽车行进过程中的气流。 每秒 2m 向第二腔体 111中鼓入水， 以模拟轮船行进过程中的水流。
[0083] 在上述测试环境中， 使连续工作 1小时后， 采用红外温度检测仪， 在离 LED晶片外 周 0.3mm处的主散热基座表面测试温度， 测得温度值为 45.2° C , 在远光灯 LED晶片表面 的温度为 50.6。 C;
在 LED灯连续工作 2小时后， 釆用红外温度检测仪， 在离 LED晶片外周 0.3nim处的主散 热基座表面测试温度， 测得温度值为 52.2 ° C , 在远光灯 LED晶片表面的温度为 55.6 ° C。
[0084] 由上可见， 应用本实施例技术方案， 可以实现大功率 LED照明， 且通过流体贯通实 现高效散热。 需要说明的是， 本实施例不仅可以应用于各种常规场合大功率照明， 还可以用 于摩托车、 汽车、 轮船等 LED前照灯， 本实施例特别适用于置于室外的大功率照明设备， 其可以利用自然风、 雨等而实现散热； 本实施例还特别适用于可移动的设备上的照明， 可利 用设备移动过程中产生的逆向气流或者水流而实现流体贯通高效散热。
[0085] 本实施例为了进一步优化其配光光照效果， 还进行了以下的优化设计- 以上对本实用新型实施例所提供的技术方案进行了详细介绍， 本文中应用了具体个例对本实 用新型实施例的原理以及实施方式进行了阐述， 以上实施例的说明只适用于帮助理解本实用 新型实施例的原理； 同时, 对于本领域的一般技术人员， 依据本实用新型实施例， 在具体实 施方式以及应用范围上均会有改变之处， 综上所述， 本说明书内容不应理解为对本实用新型 的限制。

Claims

1、 一种 LED光源， 其特征是， 包 ^：热基座，
在所述散热基座的表面固定有电路基座， 在所述电路基座上固定有可发 光的 LED, 在所述散热基座外密封连接有配光镜， 在所述配光镜外固定有外壳， 所 述外壳的前端以及所述配光镜的前端分別与所述透光罩固定连接，
所述透光罩还与所迷散热基座密封连接， 所迷电路基座以及 LED均位于 所述配光镜、 散热基座以及透光罩构成的密封的第一空腔内，
在所述散热基座上还设置有至少一个通道， 各所述通道与所述第一空腔 不连通， 各所述通道相对的两开口均与外部相通。
2、 根据权利要求 1所迷的 LED光源， 其特征是，
各所述通道为形成在所述散热基座内的管道通道； 或者，
在所述散热基座表面形成有复数个翅片，
各所述通道为任意相邻的两所述翅片之间的槽状通道。
3、 根据权利要求 1或 2所述的 LED光源， 其特征是，
所述散热基座的后端部分伸出在所述外壳的后端外，
各所述通道的一开口位于所述外壳的后端外。
4、 根据权利要求 1或 2所述的 LED光源， 其特征是，
所述散热基座全部位于所述透光罩的一侧，
Figure imgf000015_0001
-个通孔，
各所述通孔与所述散热基座上各所述通道的一开口相对。
5、 根据权利要求 1或 2所述的 LED光源 , 其特征是， 所述散热基座部分伸出在所述透光罩外， 通孔, 所述散热基座的部分贯穿所述透光罩通孔伸出所述透光罩外， 所述散热基座上各所述通道的一开口位于所述透光罩外。
6、 根据权利要求 1或 2所述的 LED光源， 其特征是，
边， 所述透光罩还与所述散热基座密封连接， 具体是： 所述散热基座与所述透光罩连接的部位限位密封固定在所述透光罩两所 述凸边之间。
7、 根据权利要求 1或 2所述的 LED光源， 其特征是， 所述透光罩上与所述外壳以及配光镜连接部位上设置有第一凸边， 所述外壳的前端以及所述配光镜的前端分別与所述透光罩固定连接， 具 体是：
所述外壳面对面地密封固定在所述透光罩的第一凸边的外側， 所述配光镜面对面密封固定在所迷第一凸边的内侧。
8、 根据权利要求 1或 2所述的 LED光源， 其特征是， 所述散热基座包括： 金属綠、 绝缘层、 走线铜箔； 所述 LED为 LED晶片， 各所述 LED晶片固定在所述金属基板的表面， 各所述 LED晶片底面的绝缘层与所述金属 J £面接触， 各所述 LED晶片的一电极引脚分別焊接于所迷金属 反上， 另一电极引 脚分別与所述走线铜箔电连接； 其中，所迷 PCB绝缘基材铺设在所述金属基板的顶面上除所述 LED晶片 固定位置外的区域， 所述走线铜箔铺设在所述 PCB绝缘基材内； 所述金属基板、 走线铜箔可分别与所述外供电电路的正极、 负极分別电 连接。
9、 根据权利要求 8所述的 LED光源， 其特征是， 在所述金属基板的顶面还设置有一凹坑， 各所述 LED晶片固定在所述金属 反的表面，具体是：各所述 LED晶片 均固定在所述凹坑的表面， 所述 PCB绝缘基材铺设在所述金属基板的顶面上除所述 LED晶片固定位 置外的区域， 具体是： 所述绝缘层具体铺设在所述金属基板上除所述凹坑外 的顶面区域； 各所述 LED晶片的另一电极引脚分別与所述走线铜箔电连接， 具体是： 各所述 LED晶片的另一电极引脚具体分別通过各导电引线与所述走线铜箔电 连接； 在所述凹坑内还填充有硅胶填充部， 所述硅胶填充部填充在所述凹坑内， 所有所述 LED晶片以及导电引线被 共同包裏在所述硅胶填充部内。
10、 一种 LED光源， 其特征是， 包括： 包括散热基座， 在所述散热基座的顶面以及底面分別固定有电路基座， 在各所述电路基 座上分別固定有可发光的 LED; 在所述散热基座外还密封套接有配光镜， 在所述配光镜外还套接有外壳， 所述外壳的前端以及配光镜的前端分別与透光罩固定连接； 位于所述散热基座顶面的所述电路基座以及 LED均位于所述配光镜、 散 热基座以及透光罩构成的第一密封空腔内， 热基座以及透光罩构成的第二密封空腔内，
在所述散热基座内部还设置有至少一管道通道， 各所述通道相对的两开 口均与外相通。
11、 根据权利要求 10所述的一种 LED光源， 其特征是，
所述散热基座的后端部分伸出在所述外壳的后端外，
各所述通道的一开口位于所述外壳的后端外。
12、 根据权利要求 10所述的一种 LED光源， 其特征是，
所述散热基座全部位于所述透光罩的一侧，
在所述透光罩上还设置有至少一个通孔， 各所述通孔与所述散热基座上 各所述通道的一开口相对。
13、 根据权利要求 10所述的一种 LED光源， 其特征是，
所述散热基座部分伸出在所述透光罩外，
在所述透光罩与所迷散热基座连接处的外周部位还设置有通孔， 所述散热基座部分贯穿所述透光罩通孔伸出所述透光罩外，
所述散热基座上的各所述通道的一开口位于所述透光罩外。
14、 根据权利要求 10所述的一种 LED光源， 其特征是，
所述透光罩还与所迷散热基座密封连接， 具体是: 迷凸边之间。
15、 根据权利要求 10所述的 LED光源， 其特征是, 所述透光罩上与所述外壳以及配光镜连接部位上设置有第一凸边， 所述外壳的前端以及所述配光镜的前端分别与所迷透光罩固定连接， 具 体是：
所述外壳面对面地密封固定在所述透光罩的第一凸边的外侧， 所述配光镜面对面地密封固定在所述第一凸边的内側。
16、 根据权利要求 10所述的 LED光源， 其特征是， 所述散热基座包括： 金属 «反、 绝缘层、 走线铜箔；
所述 LED为 LED晶片， 固定在所述金属基板的表面， 各所述 LED晶片 底面的绝缘层与所迷金属基板面接触， 各所述 LED晶片的一电极引脚分別焊接于所述金属 1 上， 另一电极引 脚分别与所述走线铜箔电连接；
其中，所述 PCB绝缘基材铺设在所述金属基板的顶面上除所述 LED晶片 固定位置外的区域， 所述走线铜箔铺设在所述 PCB绝缘基材内； 所述金属基板、 走线铜箔可分別与所述外供电电路的正极、 负极分別电 连接。
17、 根椐权利要求 16所述的 LED光源， 其特征是， 在所述金属基板的顶面还设置有一凹坑，
各所述 LED晶片固定在所述金属 的表面，具体是：各所迷 LED晶片 均固定在所述凹坑的表面， 所述 PCB绝彖基材铺设在所述金属 的顶面上除所述 LED晶片固定位 置外的区域， 具体是： 所述绝缘层具体铺设在所述金属基板上除所述凹坑外 的頂面区域； 各所述 LED晶片的另一电极引脚分別与所述走线铜箔电连接， 具体是： 各所述 LED晶片的另一电极引脚具体分別通过各导电引线与所述走线铜箔电 连接；
在所述凹坑内还填充有硅胶填充部， 所述圭胶填充部填充在所述凹坑内， 所有所述 LED晶片以及导电引线被 共同包裏在所述硅胶填充部内。
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US20140211468A1 (en) 2014-07-31
WO2013023487A1 (zh) 2013-02-21
US8936378B2 (en) 2015-01-20
JP2014522092A (ja) 2014-08-28
JP5802887B2 (ja) 2015-11-04
EP2743566A1 (en) 2014-06-18

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