WO2013044636A1 - 一种led灯 - Google Patents

一种led灯 Download PDF

Info

Publication number
WO2013044636A1
WO2013044636A1 PCT/CN2012/075421 CN2012075421W WO2013044636A1 WO 2013044636 A1 WO2013044636 A1 WO 2013044636A1 CN 2012075421 W CN2012075421 W CN 2012075421W WO 2013044636 A1 WO2013044636 A1 WO 2013044636A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat dissipation
heat
led
hole
dissipating
Prior art date
Application number
PCT/CN2012/075421
Other languages
English (en)
French (fr)
Inventor
杨东佐
Original Assignee
Yang Dongzuo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yang Dongzuo filed Critical Yang Dongzuo
Publication of WO2013044636A1 publication Critical patent/WO2013044636A1/zh

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/27Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S6/00Lighting devices intended to be free-standing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00Lighting devices intended for fixed installation
    • F21S8/02Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/02Wall, ceiling, or floor bases; Fixing pendants or arms to the bases
    • F21V21/04Recessed bases
    • F21V21/041Mounting arrangements specially adapted for false ceiling panels or partition walls made of plates
    • F21V21/042Mounting arrangements specially adapted for false ceiling panels or partition walls made of plates using clamping means, e.g. for clamping with panel or wall
    • F21V21/044Mounting arrangements specially adapted for false ceiling panels or partition walls made of plates using clamping means, e.g. for clamping with panel or wall with elastically deformable elements, e.g. spring tongues
    • F21V21/046Mounting arrangements specially adapted for false ceiling panels or partition walls made of plates using clamping means, e.g. for clamping with panel or wall with elastically deformable elements, e.g. spring tongues being tensioned by rotation of parts
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00Planar light sources
    • F21Y2105/10Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • the invention relates to an LED lamp for illumination, in particular to an LED spotlight, an LED ceiling lamp, an LED ceiling lamp, an LED lamp tube, an LED bulb, an LED street lamp, an LED table lamp, an LED tunnel lamp and the like.
  • LED light-emitting diodes Compared with traditional light sources, LED light-emitting diodes have no lead, mercury, no stroboscopic, energy saving, long service life, fast response, vibration resistance, easy maintenance, high brightness, low energy consumption, no ultraviolet radiation and environmental pollution. It has been widely used in electronic devices or lighting fixtures due to its high safety and many other advantages.
  • the light decay of the LED source and its lifetime are directly related to its junction temperature.
  • LED lights especially high-power LED light sources, concentrate heat when emitting light. If the heat generated by the LED chips does not dissipate in time, the junction temperature is very high and the lifetime is short. According to the Ares rule, for every 10 ° C decrease in temperature, the life expectancy is doubled. According to research, if the junction temperature can be controlled at 65 ° C, the lifetime of the LED light source can be as high as 100,000 hours. Since LEDs are electroluminescent devices, their heat cannot be dissipated by radiation. In the photoelectric conversion process, only 15-25% of the electrical energy is converted into light energy, and the remaining electrical energy is almost converted into thermal energy, which causes the temperature of the LED lamp to rise.
  • the heat source area is high in heat, which is likely to cause the temperature of the device such as the LED chip to be too high. If a large amount of heat is not released in time, it will cause a series of problems: for example, it will accelerate the aging of LED chips and other devices, shorten the service life, and even lead to the burning of LED chips; red-shift the wavelength of blue LEDs, and the color of white LEDs. Degree and color temperature have an important influence. If the wavelength shifts too much, it will deviate from the absorption peak of the phosphor, which will cause the quantum efficiency of the phosphor to decrease and affect the light extraction efficiency.
  • the temperature also has a great influence on the radiation characteristics of the phosphor, with the temperature rising.
  • the quantum efficiency of the phosphor is reduced, and the wavelength of the radiation is also changed.
  • the change of the wavelength of the phosphor radiation also causes the color temperature and chromaticity of the white LED to change, and the higher temperature accelerates the aging of the phosphor.
  • the greater the power of the LED chip integrated packaged light source the farther the illumination distance is, and the better the illumination effect; but at the same time, the heat dissipation problem is more difficult to solve.
  • the heat dissipation problem finally restricts the improvement of the power of the LED chip integrated packaged light source.
  • the maximum power of the integrated single-chip LED chip in the United States is only 25W, and the LED heat dissipation technology has become the development of high-power LED technology. bottleneck.
  • the heat dissipation of the existing LED light source generally adopts the following methods: First, the LED light source is combined with a metal heat dissipating component (such as a metal heat sink substrate, a metal heat sink), a heat sink, and a heat dissipation hole, and the heat conduction and heat of the metal heat dissipating component are utilized. Radiation, through the external low temperature air heat exchange to reduce the temperature effect of the metal heat sink parts, to ensure the life of the LED light source.
  • a metal heat dissipating component such as a metal heat sink substrate, a metal heat sink
  • a heat sink such as a heat sink substrate, a metal heat sink
  • a heat sink such as a heat sink, a heat sink, and a heat dissipation hole
  • the fan uses forced convection to dissipate heat, and the fan extracts the lower temperature air outside the lamp housing to exchange heat with the higher temperature air in the lamp housing, and reduces the air temperature inside the lamp housing through the outer surface of the lamp housing, thereby Component temperature to ensure the life of the LED light source.
  • the heat dissipation method of the fan is complicated in structure, high in cost, energy consumption in itself, and more importantly, the life of the fan is shorter than that of the chip, the reliability is low, and frequent maintenance and repair are required.
  • the third is heat pipe and loop heat pipe heat dissipation, etc.
  • the heat pipe heat dissipation structure is complicated and the cost is high; the heat sink heat dissipation, the surface area is limited, and the effect is also not good.
  • a heat dissipating device for an integrated packaged light source of an LED chip which comprises a solid base, and a plurality of vertical through holes for air convection are arranged in the base. .
  • the centerlines of the plurality of vertical through holes are parallel to the centerline of the pedestal.
  • a plurality of vertical through holes are arranged on the plurality of concentric cylinders, and the vertical through holes on the adjacent two concentric cylinders are arranged offset from each other.
  • An LED chip integrated packaged light source 1 is mounted on a region of the bead 7 of the lower end surface 21 of the susceptor 2 of the heat sink for the LED chip integrated packaged light source of the present invention, and is mounted on the copper substrate 5 to cover
  • the LED chip integrates the luminaire lens 9 of the packaged light source 1 to form a luminaire module.
  • Three such luminaire modules are mounted in the luminaire housing 6 to form an LED luminaire.
  • a plurality of heat dissipation fins 61 integrally formed therewith may be disposed on the upper casing 63.
  • Upper housing 63 A plurality of vent holes 62 are provided which are adapted to the vertical through holes in the susceptor 2.
  • the vertical through hole is only distributed outside the LED chip integrated package type light source, each LED chip
  • the LED chips on the base of the integrated packaged light source module are also densely arranged without the heat dissipation holes.
  • the heat generated by the densely arranged LED chips cannot be quickly discharged through the vertical through holes on the base and the base.
  • the heat is very concentrated, the junction temperature is high, and the phosphor is more susceptible to aging.
  • Second, the heat generated by the LED chip is first transmitted to the pedestal and then conducted to the casing, which increases the intermediate link due to heat conduction and the thick metal heat transfer.
  • the body corresponds to a very long heat transfer path.
  • the heat first heats the solid of the heat transfer path first, and then forms a very stubborn heat accumulation. Although the heat is close to the outermost end of the air, the temperature is lower, but the middle The heat transfer body is not easy to fall due to heat accumulation, the heat is not easily dissipated, and the heat dissipation effect is poor.
  • the die passes through the heat dissipation base as the first heat sink. Since the columnar heat sink base does not directly contact the air to dissipate heat, and has a certain solid metal length, heat can be dissipated to the air due to the long metal conduction heat dissipation distance. Moreover, the contact area of the heat dissipation base and the air is small, so the heat generated when the crystal grains emit light may have a heat accumulation effect.
  • an LED lamp which has a lamp body, the lamp body comprises a lamp cover and a lamp cup, the lamp cover is connected with the lamp cup, and the lamp cover is connected with the external socket; the lamp cover is equipped with
  • the power supply circuit has an LED electrically connected to the power supply circuit; the lamp body is provided with an air inlet for the outside cold air to enter the lamp body and a heat dissipation hole for discharging heat generated inside the LED lamp; wherein the lamp cup is thermally conductive
  • the body is provided with an accommodating space, and a heat dissipating fan electrically connected to the power supply circuit is disposed in the accommodating space.
  • the above LED lamp is provided with a cooling fan in the lamp body.
  • the heat generated by the LED can be discharged into the interior of the LED lamp through the heat dissipation hole on the lamp body.
  • the air inlet is provided with an air inlet for the outside cold air to enter the lamp body and a heat dissipation hole for discharging heat generated inside the LED lamp is arranged along the side wall of the lamp body, the heat dissipation channel formed by the air inlet and the air outlet is horizontal.
  • the direction is not conducive to air convection heat dissipation, so the utility model adds a fan to accelerate the convection heat dissipation of the air.
  • Increasing fan heat dissipation can improve heat dissipation.
  • the fan heat dissipation method has a complicated structure, high cost, and energy consumption. More importantly, the life of the fan is shorter than that of the chip, and the reliability is low, requiring frequent maintenance and repair.
  • a closed outdoor lighting fixture with an LED light source module comprising a sealed hollow shell composed of a lamp shell and a transparent lampshade, and a sealed hollow shell.
  • the reflector and the LED light source module in the body form a relatively independent inner and outer chamber between the reflector and the transparent lamp cover, and between the lamp housing and the reflector, the reflector is provided with a mounting hole and a plurality of air holes, and the air holes are connected to each other.
  • the air flow passage of the inner and outer chambers; the invention improves the thermal resistance of the power supply and the LED light source module in order to avoid the uncleanness of introducing external air, and the forced convection of the fan is adopted to make the air in the inner and outer chambers of the lamp housing Flowing and moving through the mesh of the metal heat sink substrate to form forced internal circulation heat dissipation.
  • the invention uses internal air circulation to dissipate heat, and on the one hand, the structure is complicated. On the other hand, no matter how fast the internal air circulates, the hot air is always exchanged, and the heat dissipation effect is extremely unsatisfactory.
  • an LED lamp isolation heat conduction device which is composed of a resin upper cover and an aluminum alloy heat sink; the resin upper cover is assembled between the lamp cap and the aluminum alloy heat sink, and the resin is The cover is provided with a heat dissipation hole for communicating with the outside of the lamp body; the aluminum alloy heat sink is assembled between the resin upper cover and the glass cover. There are several heat dissipation ribs on the surface of the aluminum alloy heat sink.
  • the heat generated during operation of the circuit board can be dissipated through the heat dissipation hole and the aluminum alloy heat sink, but since the heat dissipation hole on the aluminum alloy heat sink is only horizontal, it is not conducive to air convection heat dissipation.
  • a self-heating safety LED lamp which comprises an external power connector, a lamp cup, an internal power converter, a heat sink, an LED light source, a lampshade, and an external power connector. , lamp cup, heat sink, internal power converter, LED light source and lamp
  • the cover is connected by a connecting member to form a lamp
  • the heat sink is disposed in the inner cavity of the lamp cover and the lamp cup joint portion and is separated from the space of the LED light source disposed in the lower cover body
  • the micro fan is disposed under the internal power converter of the upper portion of the heat sink.
  • a vent hole communicating with the outside is provided on the cup body of the lamp cup, thereby constituting the heat dissipation of the LED lamp and the air-cooled cup-to-cup air-flow exchange structure.
  • the device must use a fan to achieve better heat dissipation.
  • an LED downlight which comprises a heat sink, a reflector, an LED light source and an electrical box.
  • the reflector is mounted on the front end of the heat sink, and the LED light source is fixed at the bottom of the reflector.
  • the electrical box is mounted on one side of the heat sink, and the LED light source and the electrical box are electrically charged. Road connection. A venting hole is provided in the electrical box.
  • the LED downlight provided by the utility model completely separates the heat dissipation of the light source part and the power supply part, and the light source part uses the heat sink which is in direct contact with the outside to dissipate heat, and the power supply part naturally convects heat through the vent hole, which is beneficial to the entire heat dissipation of the lamp.
  • the LED light source only relies on the heat dissipation fins of the downlight to dissipate heat, the heat dissipation effect is still poor.
  • an LED street lamp which comprises a lamp housing, a light emitting module, a metal seat, two or more heat pipes and a plurality of heat dissipation fins
  • the lamp housing comprises a mutual cover and is formed by a lower cover and an upper cover of the receiving space, the lower cover is provided with an opening, and a first heat dissipation hole is disposed on a side far away from the hole, and a second heat dissipation hole is disposed on the upper cover corresponding to the first heat dissipation hole
  • the light emitting module is provided
  • the light-emitting module includes a circuit board and two or more LED lights disposed on one side of the circuit board
  • the metal seat includes the first board and the second board that are overlapped with each other, and is disposed in the accommodating space.
  • each heat pipe comprises a heat absorption section and a heat release section
  • the heat absorption section is horizontally disposed between the first plate body and the second plate body
  • the heat release section extends horizontally Aside from one side of the metal seat, the heat dissipating fins are sleeved in parallel on the heat release section of the heat pipe.
  • the problem of high natural convection speed is that the light-emitting module and the heat-dissipating fins are respectively disposed on both sides of the lamp housing, and the accommodating space of the light-emitting module is separated from the area provided with the vertical heat-dissipating through-hole and the heat-dissipating fin, and the light is emitted through the heat pipe.
  • the heat generated by the module is taken away, and the heat pipe is dissipated through the heat dissipation through hole and the heat dissipation fin.
  • the structure of the street lamp is particularly complicated, the manufacturing cost is increased, and the street lamp volume is greatly increased.
  • the technical problem to be solved by the present invention is to provide a short heat dissipation path, and the paths of each LED light-emitting unit to the heat dissipation holes are equal or substantially equal.
  • the air inside the vent hole can pass through the convection LED lamp at both ends of the louver.
  • An LED lamp comprising a transparent lamp cover, a heat dissipation base, two or more LED illumination units, a conductive layer of a layout circuit electrically connected to the LED illumination unit, and a fixing mechanism for fixing the lamp at the set position;
  • LED illumination unit Fixed on the heat dissipation base, the conductive layer of the layout circuit and the LED illumination unit are disposed on the same side of the heat dissipation base; the transparent light cover and the heat dissipation base are mounted together to form a receiving cavity for accommodating the LED illumination unit, and the fixing mechanism is directly It is fixed on the heat dissipation base, or integrally formed with the heat dissipation base, or directly fixed on the light-transmitting lamp cover, or integrally formed with the light-transmitting lamp cover; and the arrangement of the LED light-emitting units is also arranged between the LED light-emitting units.
  • the matching heat-dissipating through-holes are respectively adjacent to the heat-dissipating through-holes, and the heat-dissipating through-holes extend through the transparent lamp cover and the heat-dissipating base; both ends of the heat-dissipating through-holes communicate with the outside air to form a convective gas heat-dissipating channel.
  • the LED lighting unit is an LED lamp bead fixed on the heat dissipation base;
  • the heat dissipation base includes a flat heat dissipation substrate fixed to the LED lamp bead, and the surface of the heat dissipation substrate facing away from the LED lamp bead is fixedly fixed.
  • the conductive layer of the layout circuit is disposed on the heat dissipation substrate, and the lamp bead is directly fixed on the heat dissipation substrate; the heat dissipation substrate is disposed in the accommodating cavity.
  • the plastic component of the positioning lens or the molding lens is further included.
  • the LED lighting unit comprises an LED chip, a lens, a wire electrically connecting the LED chip and the conductive layer of the layout circuit, and is disposed on the plastic part of the positioning lens or the molding lens.
  • the plastic piece of the positioning lens or the forming lens is fixed to the heat dissipating base through the fixing post and the resisting portion;
  • the LED chip is fixed on the heat dissipating base by a die bonding process, and juxtaposed In the corresponding first through hole;
  • the conductive layer of the layout circuit extends between the sidewall of the first through hole and the LED chip, the wire is placed in the first through hole, and one end of the wire is electrically connected to the electrode of the LED chip, the wire The other end is electrically connected to the conductive layer of the layout circuit between the first via and the LED chip.
  • one or more bosses integrally formed with the heat dissipation base are disposed on the heat dissipation base, and the LED chip is fixed on the end surface of the boss by a die bonding process; the boss is placed corresponding to the first Inside the through hole.
  • the heat dissipation through hole is one, and the plastic part of the positioning lens or the molding lens is one, and the plastic part of the positioning lens or the molding lens is provided with a hollow hole matched with the shape of the heat dissipation through hole, first The through holes are all arranged on the plastic part.
  • each of the LED lighting units is provided with a heat dissipation boss on the sidewall of the heat dissipation through hole.
  • strip-shaped or mesh-shaped heat dissipating fins are disposed on the sidewall of the heat dissipation through hole provided on the heat dissipation base.
  • the sidewalls of the heat dissipation through-holes are equal to the center distance of each of the LED light-emitting units.
  • the LED lighting units are arranged in a circular or square shape or a pentagon or a mesh shape or a field shape.
  • the LED lighting unit is arranged in two rows or more, and a heat dissipation through hole is arranged between the adjacent two rows of LED lighting units.
  • heat dissipation fins are provided on the outer side of the heat dissipation base and/or the surface facing away from the light-transmitting lamp cover and/or the heat dissipation through-hole provided on the heat dissipation base.
  • the method further includes: a flow channel housing disposed on a side of the heat dissipation base facing away from the LED light emitting unit, the heat dissipation through hole penetrating through the flow path housing; and a flow between the flow path housing and the heat dissipation base
  • the outer periphery of the heat dissipation through hole is provided with an inner side wall of the flow channel, and the flow path housing is fixed with the heat dissipation substrate, and the heat dissipation base, the outer side wall of the flow path, the inner side wall of the flow path, and the flow path housing form a completely sealed cooling flow path. .
  • a connecting wall is provided between the inner side walls of the set flow passage, or a connecting wall is provided between the inner side walls of the set flow passage, the outer side wall of the set flow passage and the inner side wall of the flow passage, and cooling
  • the flow channel is a circulation flow channel; a liquid inlet port and a liquid outlet port are also provided on the flow channel housing.
  • the fixing mechanism is disposed on a side of the LED light-emitting unit facing away from the transparent lamp cover; the heat-dissipating through-hole is directly connected to the outside air at one end of the transparent lamp cover, and the heat-dissipating through hole is away from the end of the transparent lamp cover
  • the lateral gap of the fixing mechanism communicates with the outside air.
  • the fixing mechanism is disposed on a side of the LED lighting unit facing away from the transparent lamp cover; and is disposed on the outer side of the heat dissipation base and/or the heat dissipation through hole and/or the side facing away from the LED lighting unit.
  • the fins and the heat-dissipating through-holes penetrate through the heat-dissipating fins on the side facing away from the LED light-emitting unit, and the sides of the adjacent heat-dissipating fins on the side facing away from the LED light-emitting unit are not connected, and the heat-dissipating through-holes are located at one end of the light-transmitting lamp cover directly to the outside The air is connected, and the end of the heat dissipation through hole facing away from the transparent lamp cover is directly communicated with the outside air through the gap of the heat dissipation fin facing away from the LED light emitting unit.
  • the fixing mechanism is disposed on one side of the heat dissipation base; and the heat dissipation fins are disposed on the outer side of the heat dissipation base and/or the side facing away from the LED light emitting unit, and the heat dissipation through hole penetrates away from the LED light emitting unit.
  • the side of the heat-dissipating fin is not connected to the side of the adjacent heat-dissipating fin on the side of the LED light-emitting unit.
  • the heat-dissipating straight-through hole is directly connected to the outside air at one end of the light-transmitting lamp cover, and the heat-dissipating straight-through hole is away from the end of the light-transmitting lamp cover. Directly communicate with the outside air, or directly communicate with the outside air through the gap of the heat dissipating fins on the side of the LED lighting unit.
  • the fixing mechanism is disposed on one side of the heat dissipation base; a dust cover is disposed on a side of the heat dissipation base facing away from the LED light emitting unit; and outside the heat dissipation base and/or the heat dissipation through hole and / or the side of the LED light-emitting unit is provided with a heat-dissipating fin, the heat-dissipating through-hole runs through the heat-dissipating fin on the side of the LED light-emitting unit, and the side of the adjacent heat-dissipating fin on the side of the LED light-emitting unit is not connected, and the heat-dissipating through The hole is located at one end of the transparent lamp cover and directly communicates with the outside air.
  • the end of the heat dissipation through hole facing away from the transparent lamp cover is directly communicated with the outside air through the gap of the heat dissipation fin on the side of the LED illumination unit and/or passes through the dust cover.
  • the lateral gap is in communication with the outside air.
  • the fixing mechanism is disposed on one side of the heat dissipation base; the side of the heat dissipation base facing away from the LED light emitting unit is curved; in the outer side of the heat dissipation base and/or in the heat dissipation through hole and/or away from One side of the LED light-emitting unit is provided with heat-dissipating fins, and the heat-dissipating through-holes penetrate through the heat-dissipating fins on the side of the LED light-emitting unit, and the sides of the adjacent heat-dissipating fins on the side of the LED light-emitting unit are not connected, and the heat-dissipating through-holes are transparent.
  • One end of the light cover is directly connected to the outside air, and the end of the heat dissipation through hole facing away from the transparent lamp cover is directly communicated with the outside air and/or directly communicated with the outside air through a gap of the heat dissipation fin facing away from the LED light emitting unit.
  • the fixing mechanism includes two or more connecting bosses extending from a side of the heat radiating base facing away from the LED lighting unit, and an elastic buckle mounted on the connecting boss.
  • the fixing mechanism includes two or more fixing convex portions extending from a side of the heat dissipation base facing away from the LED light emitting unit, and a fixing plate mounted on the fixing convex portion is disposed on the fixing plate. a connecting boss on one side of the light cover and an elastic buckle mounted on the connecting boss.
  • the fixing mechanism includes two or more connecting bosses extending from a side of the flow path plate facing away from the LED lighting unit, and an elastic buckle mounted on the connecting boss.
  • a connecting wall connecting the one side of the inner side wall of the flow channel, a partition wall separating the inner side walls of the adjacent flow path, not connected with the connecting wall, and connected to the outer wall of the flow channel;
  • Flow path shell, outer side wall of flow channel, inside flow channel The side wall, the connecting wall, the retaining wall and the heat dissipating base form a cooling circulation flow path which completely surrounds the inner side wall of the flow channel without a dead angle.
  • the fixing mechanism comprises a lamp holder, and the lamp holder comprises an upper fixing ring and a lower fixing ring, connecting connecting ribs of the upper fixing ring and the lower fixing ring; the outer diameter of the upper fixing ring is larger than the outer diameter of the lower fixing ring And protruding the connecting rib to form a fixing boss for fixing the LED lamp at the set position, the inner diameter of the lower fixing ring is smaller than the inner diameter of the upper fixing ring and the connecting rib is protruded inward to form a fixing boss; the heat dissipation base is accommodated in The lamp holder is fixed to the fixing boss; the light-transmitting lamp cover is disposed at the bottom of the lamp holder.
  • the common improvement of the schemes 1 to 5 and the scheme 7 is that the LED lamp is a lamp tube, the translucent lamp cover is a pipe body, and the socket member respectively disposed at the two ends of the light transmission pipe body is installed in the socket member and is electrically conductive with the layout circuit.
  • Layered electrical connection lamp legs; LED light-emitting unit array distribution, heat dissipation through-holes are arranged between adjacent two rows of LED lighting units and distributed in the same direction; both ends of the transparent lamp cover and the heat dissipation base are installed Inside the socket.
  • Each LED lighting unit comprises a single primary color or two double primary colors or three three primary colors or four three primary color LED chips, or the LED lighting unit is an LED lamp bead fixed on the heat dissipation base. Since the LED light-emitting units are provided with heat-dissipating through-holes matched with the arrangement of the LED light-emitting units, each of the LED light-emitting units is adjacent to the heat-dissipating through-holes, thereby reducing the dense arrangement of the LED light-emitting units to produce a high junction temperature.
  • each LED light-emitting unit can be directly radiated through the adjacent heat-dissipating through-holes, so that the heat-dissipating path of each LED light-emitting unit is as short as possible, and the heat-dissipating paths of each LED light-emitting unit are equal or substantially equal. , to ensure that the heat dissipation effect of each LED lighting unit is very good, further reducing the high junction temperature of the LED lighting unit.
  • the heat through hole penetrates through the transparent lamp cover and the heat dissipation base, and both ends of the heat dissipation through hole communicate with the outside air to form a convective gas heat dissipation channel, so the air convection is very favorable.
  • the heat generated by the LED light source during operation is conducted to the susceptor, which becomes a hot conductor and carrier.
  • the susceptor with a large amount of heat exchanges heat with the air in the heat-dissipating through-hole to heat the air in the through-hole. Since the heat-dissipating through-holes are generally vertical, the air density in the heat-dissipating through-holes becomes smaller and rises.
  • the upper end of the heat dissipation through hole is discharged.
  • the cold air located under the base continuously enters the heat dissipation through hole from the lower end of the heat dissipation through hole, and absorbs heat from the hole wall of the heat dissipation through hole, so that the base cools and absorbs
  • the hot air of heat is continuously discharged from the upper end portion of the vertical through hole, thereby quickly taking away the heat in the susceptor, so that a large amount of heat is not accumulated in the susceptor, which affects the service life of the LED light source and has high heat dissipation efficiency.
  • the processing of the heat dissipation through hole is very convenient and fast, saves manpower, material resources and financial resources, and can greatly reduce the cost of the heat sink device and even the LED lamp having the heat sink device.
  • the LED light-emitting unit is housed in the accommodating cavity to avoid contamination of the conductive layer of the LED light-emitting unit, the wire and the layout circuit, the thermal resistance of the LED light-emitting unit, the wire and the layout circuit, and the phosphor, the silica gel, on the one hand, avoiding the unclean air with moisture and harmful chemicals on the outside.
  • the material is deteriorated to improve the life of the LED lighting unit; on the other hand, the LED lamp can be used outdoors to prevent water from entering the accommodating cavity.
  • Each LED light-emitting unit contains only one LED chip, ensuring that each LED chip is adjacent to the heat-dissipating through-hole, so that the heat generated by each LED chip can be directly radiated through the heat-dissipating through-hole adjacent thereto, so as to make each
  • the heat dissipation path of the LED chip is the shortest, and the heat dissipation paths of each LED chip are equal or substantially equal, which ensures that the heat dissipation effect of each LED chip is good, further reducing the high junction temperature of the LED chip.
  • the LED lamp bead structure is convenient for standardization and sub-process production, and the organization and production are convenient.
  • the conductive layer of the layout circuit can be inserted into the plastic parts of the positioning lens or the molding lens, and on the one hand, the wires can be directly electrically connected with the conductive layer of the layout circuit, no longer
  • the conductive metal bracket needs to be connected to the conductive layer of the layout circuit through the conductive metal bracket or through the heat sink base facing away from the LED chip through the wiring pin to connect with the conductive layer of the layout circuit, thereby simplifying the structure and minimizing the thermal resistance of the intermediate link.
  • the heat dissipation effect is good; on the other hand, it is no longer necessary to solder the metal bracket or the wiring pin to electrically connect with the conductive layer of the layout circuit, and no reflow or wave soldering is required, so the encapsulant can be made of resin or silica gel; The electrical connecting wires and their two soldering ends are not exposed to the air, which is beneficial to the long life of the use.
  • reflow or wave soldering since the temperature of reflow soldering or wave soldering is generally 250C or 280C, the encapsulant cannot be used.
  • the present invention can further save costs and improve the optical performance of the LED chip.
  • the advantage of this COB package design is that the electrodes of each LED chip directly form an ohmic contact with the conductive layer of the layout circuit through the bonding wires, and the formation of the multi-channel LED chip array is an electrical connection device between the heat dissipation base and the LED chip. By realizing electrical interconnection, the series and parallel connection of LED chips can be realized, and the reliability and production yield of the products can be improved.
  • a plurality of chip fixing bosses integrally formed with the heat dissipation base are arranged on the heat dissipation base, and the area of the heat dissipation base is large
  • the LED chip is fixed on the chip fixing boss by a die bonding method, which is larger than the area of the top of the chip fixing boss.
  • the heat generated by the LED chip is greatly reduced in the intermediate path distance of the heat-dissipating gas, that is, the air, and the contact area with the heat-dissipating gas is greatly increased, the heat accumulation effect is greatly reduced, the heat dissipation efficiency is greatly improved, and the chip is kept at a suitable level.
  • the operating temperature thus maintaining the long life of the chip and effective luminous efficiency.
  • the chip fixing boss and the heat sink base are integrally formed, so that the heat generated by the chip is directly emitted into the air through the heat sink base, so the heat resistance is small, the heat dissipation speed is fast, and the heat dissipation is not required by the other heat sink, and the heat dissipation effect is Quite good. Due to the chip fixing boss, the electrical connection wire minimizes the shadow of the light emitted by the LED chip, which is advantageous for optical secondary optimization!
  • the existing LED bracket is omitted, that is, the heat dissipation in the LED bracket is omitted.
  • the multi-layer intermediate part of the metal piece and the electrode metal foot thereof particularly reduces the high thermal resistance generated between the heat dissipating metal piece and the two parts of the heat dissipating base, so the thermal resistance is small, the heat conduction is fast, the heat dissipation effect is good, and the structure is simple and reliable.
  • the integral formation of the chip fixing boss and the heat dissipation base is more advantageous for the design and assembly process of the light source, and the cost is saved. Therefore, the invention has simple and reliable structure, few parts, thin thickness and easy assembly, and is particularly suitable for occasions requiring high power for the light source.
  • the plastic part of the positioning lens or the molding lens is provided with a hole avoiding hole, so that both ends of the heat dissipation through hole are connected with the outside air to form a gas convection channel, which can obtain the shortest heat dissipation path of the LED light emitting unit and the heat dissipation through hole. , to achieve the best heat dissipation.
  • One of the plastic parts of the positioning lens or the forming lens can reduce the number of fixing columns and increase the number of LED lighting units in the unit area.
  • the heat dissipation boss on the side wall of the heat dissipation through hole further increases the heat dissipation area and improves the heat dissipation effect.
  • Strip or mesh fins can improve the strength of the heat sink base, make the heat sink base less deformable, make the LED look more beautiful, and more importantly increase the heat contact area with the air to improve heat dissipation. effect.
  • the sidewalls of the heat-dissipating through-holes are equal to the center distance of each of the LED lighting units, and the heat dissipation is uniform, and the heat dissipation effect is good.
  • the LED light-emitting unit is arranged in a line of two or more rows with the luminous effect of the fluorescent tube, and the illumination effect is good.
  • Heat-dissipating fins can increase the heat-dissipating contact area with air and improve heat dissipation.
  • the heat-dissipating fins on the inner side of the heat-dissipating through-holes can improve the heat-dissipating effect on the one hand, and the heat-dissipating through-holes on the other hand, so that the LED lights look more beautiful.
  • Cooling channels and cooling media are provided to further enhance heat dissipation. The cooling water is filled in the cooling flow channel.
  • the heat of the LED light source can be quickly dissipated into the water, and the temperature of the heated water is higher than the temperature of the heat-dissipating terminal contacting the air.
  • the low water forms convection, and the heat is exchanged to the lower temperature contact air.
  • the heat dissipation terminal is quickly dissipated into the air through the heat dissipation terminal, which dissipates heat quickly and can effectively reduce the junction temperature.
  • the maximum temperature of water is 100 ° C
  • the junction temperature at the LED light source can be prevented from exceeding 100 ° C. For street lamps with relatively large temperature difference, the sudden cooling and heating of the LED lamp can be reduced, and the working environment of the LED lamp can be improved.
  • the fixing mechanism is arranged on the side of the LED lighting unit facing away from the transparent lamp cover to form a bulb, a spotlight, a ceiling lamp, a ceiling lamp, and the like. In the case where the top of the LED lamp needs to be fixed, both ends of the heat dissipation through hole are still in communication with the outside air to form a convective gas heat dissipation channel.
  • the fixing mechanism is disposed on one side of the heat dissipation base to form a street lamp, a desk lamp, and the like.
  • the dust cover can reduce the accumulation of dust on the top surface of the heat dissipation base and improve the heat dissipation effect of the heat dissipation base.
  • a dust cover is provided at the top of the LED lamp, both ends of the heat dissipation through hole are still in communication with the outside air to form a convective gas heat dissipation path.
  • the side of the heat dissipation base facing away from the LED light-emitting unit is curved, which reduces dust accumulation on the top surface of the heat dissipation base and improves the heat dissipation effect of the heat dissipation base.
  • Elastic snaps are easy to install and easy to install.
  • the structure of the lamp holder is simple, the installation is convenient, the fixing is reliable, and the appearance is beautiful.
  • FIG. 1 is a perspective view of Embodiment 1 of the present invention.
  • Figure 2 is a perspective exploded view of Embodiment 1 of the present invention.
  • Fig. 3 is a perspective exploded view showing the projection of the embodiment 1 of the present invention from another direction.
  • Figure 4 is a perspective exploded view of Embodiment 2 of the present invention.
  • Figure 5 is a perspective exploded view of Embodiment 3 of the present invention.
  • Figure 6 is a perspective exploded view of Embodiment 4 of the present invention.
  • Figure 7 is a perspective exploded view of Embodiment 5 of the present invention.
  • Figure 8 is a perspective exploded view of Embodiment 6 of the present invention.
  • Figure 9 is a perspective exploded view of Embodiment 7 of the present invention.
  • Figure 10 is a perspective exploded view of Embodiment 8 of the present invention.
  • Figure 11 is a perspective exploded view of Embodiment 9 of the present invention.
  • Figure 12 is a perspective exploded view of Embodiment 10 of the present invention.
  • Figure 13 is a perspective view of Embodiment 11 of the present invention.
  • Figure 14 is a perspective exploded view of Embodiment 11 of the present invention.
  • Figure 15 is a perspective exploded view of Embodiment 12 of the present invention.
  • Figure 16 is a perspective view showing the light transmissive lamp cover of the embodiment 12 of the present invention from another direction.
  • Figure 17 is a perspective exploded view of Embodiment 13 of the present invention.
  • Figure 18 is a perspective exploded view of Embodiment 14 of the present invention.
  • Figure 19 is a perspective exploded view of Embodiment 15 of the present invention.
  • Figure 20 is a perspective exploded view of Embodiment 16 of the present invention.
  • Figure 21 is a perspective exploded view of Embodiment 17 of the present invention.
  • Figure 22 is a perspective exploded view of Embodiment 17 of the present invention.
  • Figure 23 is a perspective exploded view of Embodiment 18 of the present invention.
  • Figure 24 is a perspective exploded view of Embodiment 19 of the present invention.
  • Figure 25 is a perspective exploded view of Embodiment 20 of the present invention.
  • Figure 26 is a perspective exploded view of Embodiment 21 of the present invention.
  • Figure 27 is a perspective view showing the projection of the embodiment 21 of the present invention from another direction.
  • Figure 28 is a perspective exploded view of Embodiment 22 of the present invention.
  • Figure 29 is a perspective view of Embodiment 23 of the present invention.
  • Figure 30 is a perspective exploded perspective view of the embodiment 23 of the present invention projected from another direction.
  • Figure 31 is a perspective exploded view of Embodiment 23 of the present invention.
  • Figure 32 is a perspective exploded view of Embodiment 24 of the present invention.
  • an LED lamp comprises a transparent lamp cover 1, a heat dissipation PCB board 2, a heat sink 10, a plurality of LED lamp beads 3 containing only one LED chip, a lamp holder 4, and an electric lamp.
  • a patterned circuit conductive layer (not shown) for connecting the positive and negative pins of the LED lamp bead 3, and an electronic control device 5 electrically connected to the external power source and the LED lighting unit.
  • the electric control device 5 is fixed to the lamp cap 4.
  • the LED lamp bead 3 is arranged like a pentagon, and is fixed on the heat dissipation PCB 2.
  • the conductive layer of the layout circuit is directly disposed on the heat dissipation PCB 2.
  • the LED lamp bead 3 and the conductive layer of the layout circuit are disposed on the same layer of the heat dissipation PCB 2. On the surface.
  • the outer circumference shape of the heat sink 10, the heat dissipation PCB board 2, and the light transmissive lamp cover 1 is a pentagon having a circular arc transition.
  • the heat sink 10 and the surface of the heat dissipation PCB 2 facing away from the LED lamp bead 3 are attached and fixed.
  • the light-transmitting lamp cover 1 is provided with a pentagon-shaped annular cavity 6 , and a fixing post 21 of the through-hole 22 is extended on the bottom surface of the annular cavity 6 , and the transparent lamp cover 1 is fixed by the screw 20 through the through-hole 22 for heat dissipation.
  • a sealed receiving cavity for accommodating the LED lighting unit is formed on the seat 10, and the heat dissipation PCB board 2 is placed in the accommodating cavity.
  • the heat dissipating PCB board 2 is a flat plate, and the heat dissipating block 10 is a flat plate.
  • the heat dissipating fins 7 are integrally formed with the heat dissipating fins 7 on the surface of the heat dissipating block 10 facing away from the LED lamp bead 3.
  • the outer circumference of the heat dissipating fins 7 is a circular arc shape, which is flush with the outer periphery of the lamp cap 4. level.
  • the LED lamp bead 3 is further provided with a pentagon heat dissipation line having a circular arc transition matching the arrangement of the LED lamp beads 3.
  • each of the LED lamp beads 3 are adjacent to the heat dissipation through hole 8, and the center distance of the side wall of the heat dissipation through hole 8 to each of the LED lamp beads 3 is equal.
  • the heat sink 10 is provided with a heat dissipation through hole 11 having the same size as the heat dissipation through hole 8 , and the heat dissipation through hole 11 penetrates the heat dissipation fin 7 .
  • a heat dissipation through hole 9 having a size equivalent to that of the heat dissipation through hole 8 is provided in the transmission lamp cover 1. The sides of the adjacent heat dissipating fins 7 are not connected, and the end of the heat dissipating through hole 9 is separated from the outside air directly.
  • the end of the heat dissipating through hole 11 is separated from the end of the hot PCB board 2 through the heat dissipating fins 7 and directly communicates with the outside air.
  • the heat dissipation through hole 9, the heat dissipation through hole 8, the heat dissipation through hole 11, and the lateral gap between the heat dissipation fins 7 form a convective gas heat dissipation channel.
  • Each of the LED light-emitting units is provided with a heat dissipation boss 14 , a heat dissipation boss 15 , a heat dissipation boss 16 , a heat dissipation boss 17 , a heat dissipation boss 18 , and a heat dissipation boss 19 on the sidewall of the heat dissipation through hole 11 .
  • the heat dissipation boss 15, the heat dissipation boss 16, the heat dissipation boss 17, the heat dissipation boss 18, and the heat dissipation boss 19 are connected together.
  • a card slot 12 is formed in the heat dissipating fin 7, and a boss 13 that cooperates with the card slot is provided on the inner side of the lamp cap 4.
  • the base 4 and the heat radiating fins 7 are fixed by the bosses 14 on the inner side of the base 4 being inserted into the slots 12 of the heat radiating fins 7.
  • an LED lamp includes a transparent lamp cover 30, a plastic plate 37 for molding a lens, a PCB board 31, a heat dissipation base 32, an LED illumination unit, and a layout circuit conductive layer electrically connected to the LED illumination unit. (not shown), an electronic control unit 34 and a base 35 electrically connected to the external power source and the conductive layer of the layout circuit.
  • the LED lighting unit includes an LED chip 36, a lens 45, a gold wire 33 electrically connected to the LED chip 36, and a conductive layer of the layout circuit.
  • the heat sink base 32 includes an annular flat plate bottom plate, and a plurality of chip fixing bosses 40, which are integrally formed with the heat sink base 32, and the fixing bosses 40 are distributed on the same circumference.
  • a fixing post 39 extends from the end face of the plastic plate 61 of the molded lens.
  • a second through hole 41 is engaged with the fixing post 39 on the heat sink base 32.
  • the chip fixing boss 40 has a circular cross section, and the cross-sectional area of the bottom plate is much larger than the cross-sectional area of the chip fixing boss 40, at least three or three times the area of the cross section of the chip fixing boss 40. the above.
  • the LED chip 36 is fixed to the fixing boss 40.
  • a first through hole 38 corresponding to the number and position of the fixing bosses 40 is provided on the plastic plate 61 of the molded lens.
  • the conductive layer of the layout circuit is directly disposed on the PCB board 31, and the conductive layers of the layout circuit are distributed on the same plane.
  • Each of the chip fixing bosses 40 on the PCB board 31 is provided with a fourth through hole 42 that cooperates with the chip fixing boss 40 and a third through hole 43 that cooperates with the fixing post 39.
  • the PCB board 31 is placed on the heat sink base 32.
  • One side of the chip fixing boss 40 is provided and is in direct contact with the heat dissipation base 32.
  • the PCB board 31 is provided with a contact surface on which the conductive layer of the layout circuit faces away from the contact heat dissipation base 32.
  • the chip fixing boss 40 of the heat dissipation base 32 passes through the fourth through hole 42 of the PCB board 31, and the fixing post 39 of the plastic plate 37 of the molded lens passes through the third through hole 43 of the PCB board 31 and the heat dissipation base 32.
  • the second through hole 41 is fixed to the PCB board 31 and the heat dissipation base 32 by the abutting portion 44 of the end portion of the fixing post 39, thereby sequentially fixing the heat dissipation base 32, the PCB board 31, and the plastic plate 37 of the molded lens.
  • the chip fixing boss 40 is disposed in the first through hole 38 of the corresponding plastic lens plate 37 of the molded lens, and the conductive layer of the layout circuit extends between the inner side wall of the first through hole 38 and the outer side wall of the chip fixing boss 40.
  • the chip 36 is fixed on the end surface of the chip fixing boss 40 by a die bonding process, the gold wire 33 is placed in the plastic plate 37 of the molded lens, the gold wire 33-end is electrically connected to the electrode of the LED chip 36, and the gold wire 33 is further connected.
  • One end is electrically connected to the patterned circuit conductive layer extending into the plastic plate 37 of the molding lens; the lens 45 is directly molded into the first through hole 38 through the mold and encapsulates the LED chip 36 and the gold wire 33.
  • the electric control unit 34 is fixed to the base 35.
  • a cavity (not shown) is disposed on the light-transmitting lamp cover 30, and the light-transmitting lamp cover 30 is fixed to the heat-dissipating base 32 by screws 53 to form a sealed accommodating cavity for accommodating the LED light-emitting unit.
  • the PCB board 31 and the plastic plate 37 of the molded lens are placed in the accommodating chamber.
  • the heat sink base 32, the light transmissive lamp cover 30, the PCB board 31, and the plastic plate 37 of the molded lens have a cylindrical outer shape.
  • a heat dissipation circular through hole 47 matching the arrangement of the LED chips 36 is further disposed, and each of the LED chips 36 is adjacent to the heat dissipation circular through hole 47, and the heat dissipation is straight through.
  • the center distance of the side walls of the holes 47 to each of the LED chips 36 is equal.
  • Parallel strip-shaped heat dissipation fins 46 are integrally formed on the surface of the heat dissipation base 32 facing away from the LED chip 36.
  • the outer circumference of the heat dissipation fins 46 has a circular arc shape and is flush with the outer circumference of the lamp cap 35.
  • a strip-shaped heat dissipation fin 54 integrally connected to the heat dissipation fin 46 is integrally formed, and the strip-shaped heat dissipation fin 54 in the heat dissipation circular through hole 47 protrudes toward the side of the light-transmitting lamp cover 30 to protrude from the heat dissipation base. 32.
  • the outer circumference thereof is flush with the heat dissipation straight through hole 47.
  • the heat dissipation fins 46 and the heat dissipation fins 54 are arranged in parallel.
  • the two ends of the heat dissipation fins 54 are connected to the heat dissipation fins 46.
  • the surface of the heat dissipation fins 54 facing away from the transparent light cover 30 is flush with the heat dissipation fins 46.
  • the hot round through hole 47 penetrates the heat radiating round through hole 48 of the same size.
  • a heat-dissipating circular through-hole 49 having a size equivalent to that of the heat-dissipating straight through-hole 48 is provided in the plastic plate 37 of the molded lens.
  • the through-light cover 30 is provided with a heat-dissipating circular through-hole 50 of the same size as the heat-dissipating straight through-hole 49.
  • the heat sink base 32 is provided with a fixing boss (not shown) having a threaded hole, and a fixing post 51 having a through hole in cooperation with the fixing boss is provided in the base 35.
  • the base 35 is passed through the fixing post 51 through the fixing post 51 to engage the threaded hole of the loose fixing boss to fix the base 35 to the heat sink base 32.
  • the side surfaces of the adjacent heat dissipation fins 46 are not connected, and the heat dissipation circular through hole 50 is directly connected to the outside air at one end of the transparent lamp cover 30, and the end of the heat dissipation circular through hole 47 facing away from the transparent lamp cover 30 passes through the heat dissipation fins 46 and
  • the lateral gap of the fixed boss 51 is directly in communication with the outside air.
  • an LED lamp includes a transparent light cover 60, a plastic plate 61 for forming a lens, a PCB board 62, a heat dissipation base 63, a flow path cover 64, and LED illumination.
  • the unit is electrically connected to the patterned circuit conductive layer (not shown) of the LED lighting unit, the electronic control device 65 electrically connected to the external power source and the conductive layer of the layout circuit, and the lamp cap 66.
  • the LED lighting units are arranged in a pentagon shape.
  • the outer circumference of the flow path cover 64, the heat dissipation base 63, the light transmissive cover 60, the PCB board 62, and the plastic plate 61 of the molded lens has a circular arc-transitional pentagon shape.
  • An integrally formed cooling passage 76 is provided on the side of the heat sink base 63 facing away from the LED lighting unit.
  • the maximum outer diameter of the heat sink base 63 is flush with the base 66.
  • a circular arc-shaped heat dissipation through-hole 67 matching the arrangement of the LED light-emitting units is further provided.
  • a pentahedral heat-dissipating through-hole 68 is formed in the PCB board 62 so as to extend through a circular arc of the same size as the heat-dissipating through-hole 67.
  • a pentagonal heat-dissipating through-hole 69 is formed in the plastic plate 61 of the molded lens with a circular arc transition of the same size as the heat-dissipating through-hole 68.
  • a pentagonal heat-dissipating through-hole 70 is formed in the through-light cover 60 to extend through a circular arc of the same size as the heat-dissipating through-hole 69.
  • the flow path cover 64 is provided with a pentagonal heat dissipation through hole 71 which is formed by a circular arc of the same size as the heat dissipation through hole 67.
  • a fixing boss 72 with a threaded inner hole and a heat dissipating fin 73 are disposed on a side of the flow path cover 64 facing away from the transparent lamp cover 60.
  • the lamp cap 66 is provided with a fixing of the through hole with the fixing boss 72. column.
  • the base 66 is secured to the runner cover 64 by a screw 74 extending through the mounting post in cooperation with the threaded bore of the retaining boss 72.
  • the flow path cover 64 and the heat dissipation base 63 are fixedly and liquid-tightly sealed by welding to the cooling flow path 76.
  • the back side of the LED lighting unit is completely covered by the cooling flow path 76.
  • the fixing post 75 of the plastic plate 61 of the molded lens is sealed with the heat sink base 63.
  • the sides of the adjacent heat dissipation fins 73 are not connected, and the arc-shaped pentagon heat dissipation through hole 70 is directly connected to the outside air at one end of the light-transmitting lamp cover 60, and the arc-transition pentagonal heat dissipation through hole 71 faces away from the transparent lamp cover 60.
  • One end is directly in communication with the outside air through the lateral gaps of the heat dissipation fins 73 and the fixed bosses 72.
  • each of the LED lighting units is provided with a heat dissipation boss 82 on the inner wall of the heat dissipation through hole 81 provided in the heat dissipation base 80.
  • Heat dissipation fins 83 are integrally formed on the concave surface of the outer surface of the heat dissipation base 80.
  • the outer circumference of the heat dissipation fins 83 has a circular arc shape and is flush with the outer circumference of the base 84.
  • the LED lamp bead 100 is arranged in two rows of symmetrical reverse W in the X direction, and is arranged in two rows in the Y direction.
  • the outer circumference of the heat sink 101, the heat dissipation PCB board 102, and the light transmissive lamp cover 103 has a circular arc transition W shape symmetrically in the X direction, and a linear arc transition in the X direction and the Y direction and the Y direction.
  • the maximum outer diameter of the seat 101, the heat dissipation PCB board 102, and the light transmissive lamp cover 103 are flush with the lamp head 104.
  • the shape of the heat dissipation through hole 105, the heat dissipation through hole 106, and the heat dissipation through hole 107 which penetrate the heat sink 101, the heat dissipation PCB board 102, and the light transmission lamp cover 103, respectively, are similar in shape to the outer circumference thereof.
  • the shape of the annular cavity 108 provided in the light-transmitting lamp cover 103 is similar to its outer peripheral shape.
  • the heat radiating fins 109 soldered on the heat sink 101 are distributed only on the surface of the heat sink 101 facing away from the light-transmitting lamp cover 103.
  • the heat dissipation PCB board 102 is provided with a fixing boss 111 having a threaded hole 110, and a fixing post (not shown) having a through hole 112 fitted to the fixing boss 111 is provided in the base 104.
  • the base 104 is secured to the heat sink PCB 102 by a screw 113 passing through the through hole 112 in cooperation with the threaded hole 110.
  • the LED lamp is a ceiling lamp, including a transparent lamp cover 120 and a molding lens.
  • the plastic plate 121, the PCB board 122, the heat dissipation base 123, the LED illumination unit, the layout circuit conductive layer (not shown) electrically connected to the LED illumination unit, and the electrical connection electrically connected to the external power supply and the conductive layer of the layout circuit The device 125 and the fixed circular plate 126.
  • the electronic control unit 125 is fixed to the fixed circular plate 126.
  • the fixed circular plate 126 and the heat dissipation fins 127 are fixed together by welding.
  • a connecting boss 124 and a connecting boss 128 extending from a side of the fixed circular plate 126 opposite to the discrete heat base 123 are disposed, and an elastic buckle 129 is disposed on the connecting boss 124, and an elastic card is disposed on the connecting boss 128.
  • the LED lamp is a ceiling lamp, and includes a transparent lamp cover 144, a plastic plate 145 for molding the lens, a PCB board 146, a heat dissipation base 140, an LED illumination unit, and an electrical connection.
  • the electronic control unit is fixed to the heat dissipation base 140.
  • Parallel strip-shaped heat dissipation fins 142 are integrally formed on a surface of the heat dissipation base 140 facing away from the LED chip 141.
  • the outer circumference of the heat dissipation fins 142 has a circular arc shape and is flush with the outer circumference of the heat dissipation base 140;
  • a heat dissipation fin 143 is integrally formed in the 148.
  • the mesh heat dissipation fin 143 in the heat dissipation circular through hole 148 protrudes from the side of the transparent lamp cover 144 to the heat dissipation base 140, and the outer circumference and the heat dissipation circular through hole 148.
  • Elastic snaps 147 are provided on the outermost two of the fins 142.
  • the LED lamp is a ceiling lamp, and includes a transparent lamp cover 150 , a plastic plate 151 of the molded lens, a PCB board 152 , a heat dissipation base 153 , an LED illumination unit, and an electrical connection.
  • the outer circumference of the flow path cover 155 is a cylindrical shape flush with the outer circumference of the heat dissipation base 153.
  • the shape of the heat sink base 153 is different from that of the second embodiment.
  • a plurality of parallel heat dissipation strips integrally formed in the heat dissipation circular through hole of the heat dissipation base 153 are provided.
  • a plurality of parallel heat dissipation holes formed along the outer circumference of the heat dissipation base 153 and the heat dissipation strips and the heat dissipation base 153 extend in a direction away from the LED chip, and are provided with a flow channel wall 160, and are further formed by connecting the flow channel walls 160.
  • the heat sink base 153, the flow path wall 160, and the connecting wall 161 form a first circulating cooling flow path 162.
  • a weather strip 163 is integrally formed on the flow path cover 155 in one-to-one correspondence with the heat dissipation strip.
  • the flow path cover 155 is fixed to the heat dissipation base 153, and the weather strip 163 liquid seals the cooling flow path 162.
  • the back side of the LED chip 164 is completely covered by the cooling flow path 162.
  • the fixing post 165 of the plastic plate 151 of the molded lens is liquid-sealed with the heat dissipation base 153.
  • the weather strip 163 and the flow path cover 155 form a plurality of heat dissipation holes 159 which penetrate the heat dissipation holes on the heat dissipation base 153.
  • the electronic control unit 154 is attached to the fixed circular plate 156.
  • a fixing boss 167 having a threaded blind hole 166 is formed on a side of the flow path cover 155 facing away from the light-transmitting lamp cover 150, and a through hole 168 is provided in the fixed circular plate 156 in cooperation with the threaded blind hole 166.
  • the screw 169 is passed through the through hole 168 to engage the threaded blind hole 166 on the fixed boss 167 to secure the fixed circular plate 156 to the flow passage cover 155.
  • a connecting boss 170 and a connecting boss 171 are disposed from a side of the fixed circular plate 156 opposite to the discrete heat base 153.
  • An elastic buckle 172 is disposed on the connecting boss 170, and an elastic buckle is disposed on the connecting boss 171. 173.
  • the LED lamp is a ceiling lamp, and includes a translucent lamp cover 180, a plastic plate 181 for molding the lens, a PCB board 182, a heat dissipation base 183, an LED illumination unit, and an electrical connection.
  • the electronic control unit 184 is attached to the flow path cover 185.
  • a connecting boss 186 and a connecting boss 187 are disposed from a side of the flow channel cover 185 behind the discrete heat base 183.
  • An elastic buckle 188 is disposed on the connecting boss 186, and an elastic card is disposed on the connecting boss 187.
  • a liquid inlet 190 communicating with the first circulating cooling flow path 191 is provided on the flow path cover 185.
  • the outer periphery of the heat dissipation base 183 protrudes from the outer flow path wall 192 of the first circulation cooling flow path 191, and the outer circumference of the flow path plate 185 is flush with the outer flow path wall 192.
  • an LED lamp includes a transparent lamp cover 200, a plastic plate 201 for molding a lens, a PCB board 202, a heat dissipation base 203, an LED illumination unit, and an electric A patterned circuit conductive layer (not shown) for electrically connecting the LED lighting unit, an electronic control device electrically connected to the external power source and the conductive layer of the layout circuit, and a lamp holder 205.
  • the lamp holder 205 includes an upper fixing ring 206 and a lower fixing ring 207, and four upper fixing ring 206 and lower fixing ring 207 Connecting ribs 208.
  • the outer diameter of the upper fixing ring 206 is larger than the outer diameter of the lower fixing ring 207 and protrudes outwardly from the connecting rib 208 to form a fixing boss for fixing the LED lamp at the set position.
  • the inner diameter of the lower fixing ring 207 is smaller than the inner diameter of the upper fixing ring 206.
  • the connecting ribs 208 are protruded inward to form a fixing boss 209 for fixing the heat dissipation base 203.
  • a fixing post 211 having an end with a resisting portion 210 is disposed on a surface of the transparent lamp cover 200 facing the heat dissipation base 203.
  • the fixing post 211 and the resisting portion 210 are disposed on a surface of the socket 205 facing away from the transparent lamp cover 200.
  • the mating elastic buckle 212 is disposed on the socket 205 at a center position of the elastic buckle 212 and larger than the outer diameter of the resisting portion 210.
  • the light-transmitting lamp cover 200 passes through the through-hole 213 through the fixing post 211 and the resisting portion 210 thereon, and the resisting portion 210 abuts against the elastic buckle 212 to fix the transparent lamp cover 200 and the socket 205.
  • the heat dissipation base 203 is fixed to the lower fixing ring 207.
  • the socket includes a fixing ring 221, and a connecting rib 223 extending from the fixing ring 221 toward the surface of the light-transmitting lamp cover 222 is connected to the rib 223.
  • the end is provided with an elastic buckle 224.
  • An abutment hole 225 that cooperates with the elastic buckle 224 is provided on the light-transmitting lamp cover 222.
  • the light-transmitting lamp cover 222 extends through the elastic buckle 224 into the resisting hole 225 and against the light-transmitting lamp cover 222 to fix the light-transmitting lamp cover 222 and the lamp holder.
  • the heat sink base 226 is attached to the light transmissive cover 222.
  • An electronic control unit (not shown) is attached to the base.
  • the LED lighting unit includes an LED chip 230, a lens 231, a light transmitting encapsulant 232, an electrical connection LED chip 230, and a gold wire 233 of the conductive layer of the layout circuit.
  • the lens 231 is fixed to the first through hole 234.
  • the light transmitting encapsulant 232 is filled between the lens 231 and the LED chip 230.
  • Lamp holder 235 light-transmitting lamp cover 236-body forming.
  • the heat sink base 237 is attached to the light transmissive cover 236.
  • an LED lamp includes a transparent lamp cover 240, a plurality of LED lamp beads 241 including only one LED chip, a heat dissipation PCB board 242, a heat sink 243, and an electrical connection of the LED lamp beads 241.
  • a patterned circuit of the pins (not shown).
  • the LED lamp bead 241 is arranged in a row shape on the heat dissipation PCB board 242, and the conductive layer of the layout circuit is directly disposed on the heat dissipation PCB board 242.
  • the LED lamp bead 241 and the conductive layer of the layout circuit are disposed on the same side of the heat dissipation PCB board 242. on.
  • the outer shape of the heat sink 243, the heat dissipation PCB 242, and the light transmissive cover 240 are square.
  • the surface of the heat-dissipating PCB 242 away from the LED lamp bead 241 is fixed to the heat sink 243.
  • a light-receiving lamp cover 240 is disposed on the heat-dissipating cover 240 to form a sealed receiving cavity for accommodating the LED lamp bead 241, and the heat-dissipating PCB 242 is disposed in the accommodating cavity.
  • the heat dissipation PCB 242 is a flat plate, and the heat sink 243 is a flat plate.
  • Stripe parallel fins 245 are integrally formed on the surface of the heat sink 243 facing away from the LED lamp bead 241.
  • Four square heat dissipation through holes 246 are formed on the heat dissipation PCB 242 and between the LED lamp beads 241 to match the arrangement of the LED lamp beads 241.
  • Each of the LED lamp beads 241 is adjacent to the corresponding heat dissipation through hole 246.
  • the center distance of the sidewall of the corresponding heat dissipation through hole 246 to each of the LED lamp beads 241 is equal.
  • four heat dissipation through holes (not shown) having the same size as the heat dissipation through holes 246 are also provided.
  • the light-transmitting lamp cover 260, the plurality of LED light-emitting units including only one LED chip, the plastic plate 261 of the molded lens, the PCB board 262, the heat dissipation base 263, and the flow path The outer circumference of the cover 264 is square.
  • the heat dissipation bosses 265 on the heat dissipation base 263 are arranged in a shape of a line.
  • the light transmissive lamp cover 260, the plastic plate 261 of the molded lens, the PCB board 262, the heat dissipation base 263, and the flow path cover 264 are respectively provided with three heat dissipation through holes 266, a heat dissipation through hole 267, and a heat dissipation through hole.
  • a hollow-shaped cavity 271 is provided in the light-transmitting lamp cover 260.
  • a square flow path outer side wall 273 extends along an outer circumference of the lens 272 arranged on the surface of the heat dissipation base 263 facing away from the LED light emitting unit, and a square flow path inner side wall 274 extends along the outer circumference of the heat dissipation through hole 269. Further, the same side of the square flow path inner side wall 274 disposed on both sides is connected to the flow path outer side wall 273, and the opposite side of the square flow path inner side wall 274 disposed in the middle is connected with the flow path outer side wall 273.
  • the outer flow side wall 273, the inner flow side wall 274, and the connecting wall 275 form a first circulating cooling flow path.
  • the flow path cover 264 is fixed to the heat dissipation base 263 and liquid-tightens the cooling flow path.
  • a square flow path outer side wall 283 is extended along the outer circumference of the lens 282 arranged in the shape of the eye on the surface of the flow path housing 280 facing the heat dissipation base 281.
  • the outer circumference of the through hole 284 is extended with a square flow channel inner side wall 285, and a connecting wall 286 for connecting one side of the square flow channel inner side wall 285 together, separating adjacent flow channel inner side walls 285, A retaining wall 288 that is not connected to the connecting wall 286 and is connected to the outer side wall 283 of the flow path.
  • the heat sink base 281 is fixed to the flow path housing 280.
  • the heat sink base 281, the runner housing 280, the runner outer sidewall 283, the runner inner sidewall 285, the connecting wall 286, and the retaining wall 288 form a sealed first circulating cooling runner that completely surrounds the runner inner wall 285 without dead angles.
  • an LED lamp includes a transparent lamp cover 301, a heat dissipation base 302, a plurality of LED lamp beads 303 including only one LED chip, and positive and negative leads of electrically connecting the LED lamp beads 303.
  • the electric control device is fixed on the heat dissipation base 302.
  • the LED lamp bead 303 is arranged in a 4*5 dot matrix, and is fixed on the heat dissipation base 302.
  • the conductive layer of the layout circuit is directly disposed on the heat dissipation base 302, and the LED lamp bead 303 and the layout circuit conductive layer are disposed on the heat dissipation base 302. On the same face.
  • the outer circumference of the heat dissipation base 302 and the light-transmitting lamp cover 301 has a square shape.
  • Four arrays of square recesses 304 matching the lamp beads are disposed on the light-transmitting lamp cover 301.
  • the light-transmitting lamp cover 301 is fixed on the heat-dissipating base 302 to form a sealed accommodating cavity for accommodating the LED lamp beads 303.
  • Heat dissipation fins 305 are integrally formed on the surface of the heat dissipation base 302 facing away from the LED lamp beads 303, and heat dissipation fins 306 are integrally formed on the opposite sides of the heat dissipation base 302, adjacent to the four diagonal positions.
  • a fixing portion 307 is connected between the heat dissipation fins 306, and a fixing hole 308 is provided in the fixing portion 307.
  • Three square heat dissipation through holes 309 matching the arrangement of the LED lamp beads 303 are disposed on the heat dissipation base 302 and between the four rows of LED lamp beads 303, and parallel heat dissipation fins are disposed between the heat dissipation through holes 309. 311.
  • Each of the LED lamp beads 303 is adjacent to the corresponding heat dissipation through hole 309, and the center distance of the corresponding side wall of the heat dissipation through hole 309 to the corresponding LED lamp bead 303 is equal.
  • the light-transmitting lamp cover 301 is provided with a heat-dissipating through-hole 312 having a size equivalent to that of the heat-dissipating through-hole 309, and a heat-dissipating fin 313 corresponding to the heat-dissipating fin 311 is disposed in the heat-dissipating through-hole 312.
  • an LED lamp includes a transparent lamp cover 320, a plastic plate 321 for molding a lens, a PCB board 322, a heat dissipation base 323, an LED illumination unit, and an LED for electrical connection.
  • the outer periphery of the flow path cover 326 is flush with the outer periphery of the heat dissipation base 323.
  • a heat dissipation through hole 328 having the same shape and shape as that of the heat dissipation through hole 327 on the heat dissipation base 323 is provided on the flow path cover 326.
  • a cavity 329 similar in shape to the heat sink base 323 is provided on the face of the heat sink base 323 facing away from the light transmissive lamp cover 320.
  • a cavity 330 is further disposed on the transparent lamp cover 320.
  • the heat dissipation base 323 is provided with a through hole 331 having the same cross-sectional shape as the cavity 330.
  • the flow channel cover 326 is provided with a sealing through hole 331.
  • a sealing portion 332 on one side of the light cover 320.
  • the flow channel cover 326 is fixed to the heat dissipation base 323 to form a sealed receiving cavity for accommodating the LED light emitting unit.
  • the runner cover 326 is then fixed to the heat sink base 323 to form a sealed receiving cavity for receiving the electronic control unit 325.
  • a connection handle 333 is also provided on the side of the heat dissipation base 323 back discrete thermal through hole 327.
  • the fixing post 334 on the plastic plate 321 of the molded lens is sealed with the heat sink base 323.
  • an LED lamp includes a transparent light cover 340, a heat dissipation PCB 341, a heat sink 342, a plurality of LED lamp beads 343 including only one LED chip, and positive and negative connection of the LED lamp beads 343.
  • the LED lamp bead 343 is arranged in a 5*8 dot matrix, and is fixed on the heat dissipation PCB board 341.
  • the conductive layer of the layout circuit is directly disposed on the heat dissipation PCB board 341, and the LED lamp bead 343 and the layout circuit conductive layer are disposed on the heat dissipation PCB board 341. On the same face.
  • the outer shape of the heat sink 342, the heat dissipation PCB board 341, the light transmissive lamp cover 340, and the top cover 345 is square.
  • the surface of the heat dissipation PCB 341 facing away from the LED lamp bead 343 is fixed to the heat dissipation seat 342.
  • the heat dissipation through holes 348 are adjacent to the corresponding heat dissipation through holes, and the center distances of the corresponding heat dissipation through holes are equal to the center distance of the corresponding LED lamp beads 343.
  • a cavity outer wall 349 is extended, and a cavity inner wall 350 is extended along the periphery of the heat dissipation through hole 348.
  • a partition wall 353 that partitions the outer wall 349 into a cavity 351 and a cavity 352 is also provided.
  • a cavity (not shown) that cooperates with the cavity 352 is also provided on the heat dissipation PCB 341.
  • the heat-dissipating lamp cover 340 is fixed on the heat-dissipating base 342, and the heat-dissipating base 342 and the cavity form a sealed accommodating cavity for accommodating the LED lamp bead 343, and the heat-dissipating PCB board 341 is placed in the sealed accommodating cavity.
  • the electric control device 344 is fixed in the cavity 352 of the heat dissipation PCB 341, and the cavity 352 and the cavity on the heat sink 342 form a receiving cavity for receiving the electronic control device 344.
  • Strip-shaped parallel fins 354 are integrally formed on the surface of the heat sink 342 facing away from the LED lamp beads 343.
  • a fixing post 355 is provided on the surface of the top cover 345 facing the heat sink 342, and the heat sink 342 is fixed to the fixing post 355 of the top cover 345.
  • a connecting handle 356 is also provided on one side of the heat sink 342.
  • One end of the heat dissipation through hole 348 is directly connected to the outside air, and one end of the heat dissipation through hole 346 facing away from the transparent lamp cover 340 is directly communicated with the outside air through the gap of the heat dissipation fin 354.
  • the flow path cover 360 is further included.
  • a flow channel outer sidewall 363 is extended, and a heat dissipation through hole 364 is extended along the periphery of the heat sink 361 to provide a flow channel inner sidewall 365.
  • the flow channel outer wall 363, the flow channel inner side wall 365, and the recess in which the electric control device is mounted face the side wall of the heat dissipation through hole 364 to form a cooling flow path 366.
  • the flow path cover 360 is provided with a heat dissipation through hole 367 which penetrates the heat dissipation through hole 364 on the heat sink 361 and has the same size and shape.
  • the runner cover 360 is fixed to the heat sink 361 and fluidly sealed to the heat sink 361 cooling runner.
  • the runner cover 360 is fixed to the fixed post 368 of the top cover 370.
  • One end of the heat dissipation through hole 371 on the transparent lamp cover 369 is directly connected to the outside air, and the end of the heat dissipation through hole 367 facing away from the transparent lamp cover 369 is directly connected to the outside air through the lateral gap between the fixing posts 368. .
  • an LED lamp includes a transparent lamp cover 381, a heat sink 382, a plurality of LED lamp beads 383 including only one LED chip, and positive and negative pins electrically connected to the LED lamp bead 383.
  • a patterned circuit conductive layer (not shown), an electrical control device 392 electrically coupled to the external power source and the LED lighting unit.
  • the electronic control unit 392 is fixed to the heat sink 382.
  • the LED lamp bead 383 is arranged in a 4*5 dot matrix, and is fixed on the heat sink 382.
  • the conductive layer of the layout circuit is directly disposed on the heat sink 382, and the LED lamp bead 383 and the conductive layer of the layout circuit are disposed on the same side of the heat sink 382. On the surface.
  • the outer shape of the heat sink 382 and the light-transmitting lamp cover 381 is square.
  • Four arrays of square cavities 384 mated with the bead 383 are disposed on the translucent lamp cover 381.
  • the translucent lamp cover 381 is fixed on the heat sink 382 to form a sealed receiving cavity for accommodating the LED bead 383.
  • Arc-shaped parallel fins 385 are integrally formed on the face of the heat sink 382 facing away from the LED lamp bead 383 and on the opposite sides.
  • On the heat sink 382 there are five square heat dissipation through holes 386 separated by four rows of LED lamp beads 383 and matched with the arrangement of the LED lamp beads 383, and parallel heat dissipation fins are arranged between the heat dissipation through holes 386.
  • Each LED lamp bead 383 is adjacent to the corresponding heat dissipation through hole 386, and the center distance of the corresponding side wall of the heat dissipation through hole 386 to the corresponding LED lamp bead 383 is equal.
  • the light-transmitting lamp cover 381 is provided with a heat-dissipating through-hole 388 having the same size as the heat-dissipating through-hole 386.
  • the heat-dissipating through-hole 388 is provided with a heat-dissipating fin 389 corresponding to the heat-dissipating fin 387.
  • a cavity 390 is further provided on the surface of the light-transmitting lamp cover 381 facing the heat sink 382, and a cavity having the same cross-sectional shape as the cavity 390 is provided on the heat sink 382.
  • the electronic control unit 392 is fixed in the cavity of the heat sink 382.
  • the transparent lamp cover 381 is fixed on the heat sink 382.
  • the sealing cavity 384 forms a sealed receiving cavity for accommodating the LED lamp bead 383.
  • the cavity 390 and the cavity on the heat sink 382 form a receiving cavity for receiving the electronic control device 392.
  • a connecting handle 393 is also provided on the side of the heat sink 382 on the back of the discrete thermal through hole 386.
  • the heat dissipation through hole 380 on the transparent lamp cover 381 and the heat dissipation through hole 386 of the heat dissipation seat 382 and the heat dissipation through hole 382 of the heat dissipation seat 382 are directly connected to the outside of the transparent lamp cover 381.
  • Example 22 As shown in Fig. 28, unlike the twenty-first embodiment, the LED lamp is a desk lamp, the connecting rod 401 is fixed to the connecting handle 400, and the socket 402 is fixed to the connecting rod 401.
  • an LED lamp includes a light-transmitting tube body 410, a socket member 411 respectively disposed at two ends of the light-transmitting tube body 410, a heat-dissipating PCB board 414, a heat sink 415, and a plurality of only one.
  • LED lamp bead 416 of the LED chip a patterned circuit conductive layer (not shown) electrically connected to the positive and negative pins of the LED lamp bead 416, and an electronic control device (not shown) electrically connected to the conductive layer of the layout circuit
  • the lamp leg 413 is electrically connected to the electric control device in the socket 411.
  • the LED lamp bead 416 is arranged in a row of 3 rows and 13 columns, and is fixed on the heat dissipation PCB board 414.
  • the conductive layer of the layout circuit is directly disposed on the heat dissipation PCB board 414, and the LED lamp bead 416 and the conductive layer of the layout circuit are disposed on the heat dissipation PCB board. The same face of 414.
  • the heat dissipation through holes 420 are respectively adjacent to the corresponding heat dissipation through holes, and the center distances of the side walls of the corresponding heat dissipation through holes to the corresponding LED lamp beads 416 are equal.
  • a fixing portion 421 for mounting a heat dissipating substrate is provided on a surface of the light transmitting tube body 410 facing the heat dissipating PCB 414 along the periphery of the two heat dissipating through holes 420.
  • the light transmitting tube body 410 is a partial cylinder which is not connected to the semicircular columnar surface.
  • the outer shape of the heat sink 415 and the heat dissipation PCB 414 is square.
  • the heat dissipation PCB 414 is fixed on the fixing portion 421 of the transparent tube body 410, and the surface of the heat dissipation seat 415 facing the LED lamp bead 416 is fixed to the heat dissipation PCB board 414.
  • Both ends of the light-transmitting pipe body 410 are respectively mounted on the socket member 411.
  • the light-transmissive tube body 410, the heat-dissipating PCB board 414, and the socket member 411 form a sealed accommodating cavity for accommodating the LED lamp bead 416.
  • the electronic control unit is mounted in the socket 411.
  • Strip-shaped parallel fins 417 are integrally formed on the face of the heat sink 415 away from the LED bead 416.
  • One end of the heat dissipation through hole 420 is directly connected to the outside air, and one end of the heat dissipation through hole 418 facing away from the transparent tube 410 is directly communicated with the outside air through the gap of the heat dissipation fin 417.
  • a curved runner cover 430 is further included.
  • a flow channel outer sidewall 433 extends along the periphery of the heat sink 431, and a flow channel inner sidewall 435 extends along the periphery of the heat dissipation through hole 434 on the heat sink 431.
  • the outer flow side wall 433 and the inner flow side wall 435 form a cooling flow path 436.
  • the flow path cover 430 is provided with a heat dissipation through hole 437 which penetrates the heat dissipation through hole 434 on the heat sink 431 and has the same size and shape.
  • the top surface of the inner side wall 435 of the flow path is curved in cooperation with the bottom surface of the flow path cover 430.
  • an arcuate projection 440 that fits the bottom surface of the flow path cover 430 is provided.
  • the flow path cover 430 is fixed to the heat sink 431 and sealed to the heat sink 431 cooling flow path 436.
  • the heat-dissipating through-hole 438 on the light-transmissive lamp cover 439 is directly connected to the outside air, and one end of the heat-dissipating straight-through hole 437 is directly connected to the outside air.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

一种LED灯,包括透光灯盖(60)、散热基座(63)、LED发光单元、电性连接LED发光单元的布图电路导电层和将灯固定在设定位置的固定机构。LED发光单元固定在散热基座(63)上,透光灯盖(60)与散热基座(63)安装在一起形成容置LED发光单元的容置腔,固定机构直接固定在散热基座(63)上、或与散热基座(63)—体成型、或直接固定在透光灯盖(60)上、或与透光灯盖(60)—体成型。在LED发光单元间还设有与LED发光单元的排列方式相匹配的散热直通孔(67),每个LED发光单元均与散热直通孔(67)相邻,散热直通孔(67)贯穿透光灯盖(60)、散热基座(63),散热直通孔(67)的两端均与外界空气连通形成对流的气体散热通道。该LED灯的结构简单,散热效果好,LED发光单元的寿命长。

Description

一种 LED灯 技术领域
本发明涉及一种用于照明的 LED灯, 特别是涉及一种 LED射灯、 LED吸顶灯、 LED吊 顶灯、 LED灯管、 LED灯泡、 LED路灯、 LED台灯、 LED隧道灯等。
背景技术
LED发光二极管较之传统光源具有不含铅、 汞, 无频闪, 节能环保、 使用寿命长、 响 应速度快、 耐震动、 易维护、 亮度高、 能耗低、 没有紫外辐射和环境污染、 使用安全性高 等诸多优点而被广泛地应用在电子装置或照明灯具上。
LED光源的光衰和其寿命直接与其结温有关。 LED灯, 特别是大功率的 LED光源, 发 光时热量集中, 如果 LED芯片产生的热量不及时散发出去, 结温就非常高, 寿命就短。 依 照阿雷斯法则, 温度每降低 10° C, 寿命就会延长两倍。 据研究表明, 结温假如能控制在 65 ° C, LED光源光衰至 70%的寿命就可高达 10万小时。 由于 LED属于电发光器件, 其热 量不能通过辐射方式散发出去。 其光电转换过程中只有 15— 25 %的电能转换成光能, 其 余的电能几乎都转换成热能, 使 LED灯具的温度升高。 而对于 LED晶片集成封装式光源来 说, 由于晶片比较集中, 发光源区热量高, 这样就很容易导致 LED芯片等器件温度过高。 大量的热量如果不能及时散发出去会引发一系列问题:例如,会加速 LED芯片等器件老化, 縮短使用寿命, 甚至会导致 LED芯片烧毁; 使蓝光 LED的波长发生红移, 并对白光 LED的 色度、 色温产生重要影响, 如果波长偏移过多, 偏离了荧光粉的吸收峰, 将导致荧光粉量 子效率降低, 影响出光效率; 温度对荧光粉的辐射特性也有很大影响, 随着温度上升, 荧 光粉量子效率降低, 辐射波长也会发生变化, 荧光粉辐射波长的改变也会引起白光 LED色 温、 色度的变化, 较高的温度还会加速荧光粉的老化。 通常, LED晶片集成封装式光源的 功率越大, 照射的距离也越远, 照射效果越好; 但与此同时, 散热问题越难解决。 散热问 题最终制约了 LED晶片集成封装式光源功率的提高, 目前在技术比较发达的美国单颗 LED 晶片集成封装式光源功率最大功率也只能达到 25W, LED散热技术已成为大功率 LED技术 发展的瓶颈。
现有的 LED光源的散热通常采用以下几种方式:其一,将 LED光源与金属散热部件(如 金属散热基板、 金属热沉) 、 散热片、 散热孔结合, 利用金属散热部件的热传导与热辐射 作用, 通过外界较低温度空气热交换达到降低金属散热部件温度效果, 确保 LED光源的寿 命。 这种散热方式, 由于现有的散热孔一般设置在散热基板的侧面, 并没用将 LED光源隔 开, LED光源产生的热量需先上升再通过散热孔散发出去, 外界的冷空气也需通过设置在 散热基板侧面的散热孔达到 LED光源。 这种散热方式, 由于散热基板朝向灯盖的一侧被密 封, 因此不能形成对流的气体散热通道, 散热孔仅水平方向布置, 不利于空气对流散热, 散热效果不好。 其二, 采用风扇强制对流方式散热, 利用风扇抽取灯壳外较低温度的空气 与灯壳内较高温度的空气进行热交换, 并经过灯壳外表面散热降低灯壳内空气温度, 从而 LED元件温度, 确保 LED光源的寿命。 风扇散热方式结构复杂, 成本高, 本身耗能, 更重 要的是风扇的寿命比芯片还短, 可靠性低, 需要经常性的维护和维修。 其三是热管和回路 热管散热等, 热管散热结构复杂, 成本高; 散热片散热, 因表面积有限, 效果同样不好。
申请号为 201020001106. 0的实用新型专利中, 公开了一种用于 LED晶片集成封装式 光源的散热装置, 包括实体的基座, 在基座内设有若干个用于空气对流的垂直贯通孔。 若 干个垂直贯通孔的中心线与基座的中心线平行。 若干个垂直贯通孔布置在多个同心圆筒 上, 并且位于相邻两个同心圆筒上的垂直贯通孔相互错开布置。 在该实用新型的用于 LED 晶片集成封装式光源的散热装置的基座 2下端面 21的凸圈 7内的区域安装上 LED晶片集 成封装式光源 1, 并在铜基板 5上安装能罩住 LED晶片集成封装式光源 1的灯具透镜 9, 就形成了一个灯具模块。将 3个这样的灯具模块安装到灯具壳体 6内,就组成了 LED灯具。 为了增加散热面积, 在上壳体 63上可以设置与其一体的若干散热鳍片 61。 上壳体 63上 设有若干个与基座 2内的垂直贯通孔相适应的通气孔 62。 该实用新型专利中, 虽然公开 了用与外界连通垂直贯通孔散热, 对散热有一定效果, 但还是存在以下缺点: 一是垂直贯 通孔只分布在 LED晶片集成封装式光源外, 每个 LED晶片集成封装式光源模块基座上的 LED芯片还是无散热孔隔开的密集排列, 密集排列的多个 LED芯片产生的热量还是无法通 过基座和基座上的垂直贯通孔迅速排出去, LED光源热量非常集中, 节点温度高, 荧光粉 更容易老化; 二是 LED芯片产生的热量需先传导到基座上, 再传导到壳体上, 由于热传导 增加了中间环节, 以及很厚的金属传热体对应的很长的传热路径, 热量会先把该传热路径 的固体先加热透, 就会先形成很顽固的热量聚集, 虽然接近空气的最外端散热处会温度低 些, 但中间的传热体因热量聚集而温度始终不易下降, 热量不易散去, 散热效果很差。 晶 粒通过散热基座作第一散热体, 由于柱状的散热基座不直接接触空气来散热, 而且其具有 一定的金属实心长度, 由于需要较长的金属传导散热距离才能将热散发于空气, 且散热基 座与空气的接触面积小, 因此晶粒发光时产生的热量会起到热聚集效应。
申请号为 200720121299. 1的实用新型专利中, 公开了一种 LED灯, 具有一灯体, 灯 体包括灯罩及灯杯,灯罩与灯杯相连接,且灯罩与外接插座相连接;灯罩内装有供电电路, 灯杯上设有与供电电路电性连接的 LED; 灯体上设有供外界冷风进入灯体内的入风口及供 LED灯内部产生的热量排出的散热孔; 其中, 灯杯为导热体, 其上设有一容置空间, 容置 空间内设有一与供电电路电性连接的散热风扇。 上述 LED灯在灯体内安装有散热风扇, 散 热风扇工作时, 可将 LED产生的热量通过灯体上的散热孔排出 LED灯内部。 该专利中, 由 于灯体上设有供外界冷风进入灯体内的入风口及供 LED灯内部产生的热量排出的散热孔 沿灯体的侧壁排列,入风口和出风口形成的散热通道是水平方向的,不利于空气对流散热, 所以该实用新型中增加了风扇来加速空气的对流散热。增加风扇散热, 虽然可提高散热效 果, 但风扇散热方式结构复杂, 成本高, 本身耗能, 更重要的是风扇的寿命比芯片还短, 可靠性低, 需要经常性的维护和维修。
申请号为 200910111308. 2的发明专利中, 公开了一种具有 LED光源模块的封闭式户 外照明灯具, 包括由灯壳和透光灯罩组合成的密封中空壳体、 以及设置在密封中空壳体内 的反光罩和 LED光源模块, 在反光罩与透光灯罩之间、灯壳与反光罩之间构成相对独立的 内、 外腔室, 反光罩上开设有安装孔和若干气孔, 气孔构成连通内、 外腔室的气流通道; 该发明为了避免引入外部空气的不洁造成热阻提高,延长电源供应器和 LED光源模块的寿 命,采用风扇强制对流,使空气在灯具壳体内、外腔室流动并穿梭于金属散热基板的网孔, 形成强制内循环散热。 该发明采用内部空气循环流动散热, 一方面结构复杂, 另一方面不 管内部空气循环有多快, 始终都是热空气在进行交换, 散热效果极不理想。
申请号为 200920138725. 1的实用新型专利中, 公开了一种 LED灯隔离导热装置, 由 树脂上盖和铝合金散热体组成; 树脂上盖组装在灯头与铝合金散热体之间, 且树脂上盖上 开有供灯体内部与外界相通的散热孔; 铝合金散热体组装树脂上盖与玻璃罩壳之间。在铝 合金散热体的表面具有若干散热筋条。该实用新型中电路板工作时产生的热量可以经过散 热孔和铝合金散热体散放出去, 但由于铝合金散热体上散热孔仅是水平方向的, 不利于空 气对流散热。
申请号为 201020103865. 8的发明专利中, 公开了一种自散热安全型 LED灯具, 包括 外部电源连接头、 灯杯、 内部电源变换器、 散热器、 LED光源、 灯罩, 其中的外部电源连 接头、 灯杯、 散热器、 内部电源变换器、 LED光源和灯
罩通过连接件连接构成灯具, 散热器设置在灯罩与灯杯结合部、 并与下部罩体内安置 LED 光源空间相隔绝的内部空腔中, 微型风扇设置在散热器上部的内部电源变换器下方, 并且 在灯杯杯体上设有与外界相通的通气孔, 由此组成 LED灯具的热量散发与空气冷却的杯 内、 杯外气流交换结构。 该装置必须借助风扇才能达到较好的散热效果,
申请号为 201020196371. 9的实用新型专利中, 公开了一种 LED筒灯, 包括散热器、 反射罩, LED光源和电气盒, 反射罩安装在散热器的前端, LED光源固定在反射罩的底部, 电气盒安装在散热器的一侧, LED光源与电气盒电 路连接。 在电气盒上设有透气孔。 该实用新型所提供的 LED筒灯, 其光源部分和电源部分 的散热完全分离, 光源部分采用与外界直接接触的散热器散热, 而电源部分通过透气孔自 然对流散热,一虽然有利于整个灯具散热, 但由于 LED光源仅依靠筒灯的散热鳍片散热, 散 热效果还是较差。
申请号为 201020250587. 9的发明专利中,公开了一种 LED路灯,包括灯壳、发光模块、 金属座、 两个或两个以上热管及多个散热鳍片, 灯壳包含相互罩合并形成有容置空间的下 盖及上盖, 下盖设有开孔, 并在远离开孔的一侧设有第一散热孔, 上盖对应第一散热孔处 设有第二散热孔, 发光模块容置在容置空间中, 并对应开孔配置, 发光模块包含电路板及 设置在电路板一侧面的两个或两个以上 LED灯,金属座包含相互叠接的第一板体及第二板 体, 且第一板体是热接触发光模块, 每一个热管包含吸热段及放热段, 吸热段水平穿设在 第一板体及第二板体之间, 放热段水平延伸在远离金属座的一侧边, 散热鳍片平行排列地 套接在热管的放热段上。 该实用新型为解决气体是自下盖的散热孔进入灯壳内部, 从而带 走散热鳍片上大量的热后,继续直线地向上流动,再从上盖散热孔流出,气体呈直线流动, 时其自然对流速度快的问题, 发光模块与散热鳍片分别设置在灯壳内的两侧边, 将发光模 块的容置空间与设有上下散热直通孔和散热鳍片的区域分开,通过热管将发光模块产生的 热量带走, 再通过散热直通孔和散热鳍片对热管散热, 一方面使路灯的结构特别复杂, 增 加制造成本, 另一方面大大增加路灯体积。
发明内容
为了解决现有的 LED灯的散热不畅, 寿命短,发光效率低下的问题, 本发明要解决的 技术问题在于提供一种散热路径短、 每个 LED发光单元到散热孔的路径相等或大致相等、 散热孔内的空气能通过散热孔的两端自然对流的 LED灯。
一种 LED灯, 包括透光灯盖、 散热基座、 两个以上的 LED发光单元、 电性连接 LED 发光单元的布图电路导电层、 将灯固定在设定位置的固定机构; LED 发光单元固定在散 热基座上, 布图电路导电层和 LED发光单元设置在散热基座的同侧; 透光灯盖与散热基 座安装在一起形成容置 LED发光单元的容置腔, 固定机构直接固定在散热基座上、 或与散 热基座一体成型、 或直接固定在透光灯盖上、 或与透光灯盖一体成型; 在 LED发光单元间 还设有与 LED发光单元的排列方式相匹配的散热直通孔,每个 LED发光单元均与散热直通 孔相邻, 散热直通孔贯穿透光灯盖、 散热基座; 散热直通孔的两端均与外界空气连通形成 对流的气体散热通道。
作为方案一的改进, LED发光单元为固定在散热基座上的 LED灯珠; 散热基座包括固 定 LED灯珠的平板状的散热基板, 与散热基板背离 LED灯珠的面贴合固定的散热座; 布图 电路导电层设置在散热基板上, 灯珠直接固定在散热基板上; 散热基板置于容置腔内。
作为方案一的改进, 还包括定位透镜或成型透镜的塑胶件, LED发光单元包括 LED 芯片、 透镜、 电性连接 LED芯片和布图电路导电层的导线; 在定位透镜或成型透镜的塑 胶件上设有第一通孔, 在定位透镜或成型透镜的塑胶件的端面上延伸设有固定柱, 在散热 基座上设有与固定柱配合的第二通孔, 固定柱穿过散热基座的第二通孔, 在固定柱的端部 设有抵挡部; 定位透镜或成型透镜的塑胶件通过固定柱和抵挡部与散热基座固定; LED芯 片通过固晶工艺固定在散热基座上, 并置于对应的第一通孔内; 布图电路导电层伸入第一 通孔的侧壁与 LED芯片之间, 导线置于第一通孔内, 导线一端与 LED芯片的电极电性连 接, 导线的另一端与第一通孔与 LED芯片之间的布图电路导电层电性连接。
作为上述方案的改进,在散热基座上设有与散热基座一体成型的一个或一个以上的凸 台, LED芯片通过固晶工艺固定在凸台的端面上; 凸台置于对应的第一通孔内。
作为上述方案的又一改进,散热直通孔为一个,定位透镜或成型透镜的塑胶件为一个, 在定位透镜或成型透镜的塑胶件上设有与散热直通孔形状配合的避空孔,第一通孔均设置 在塑胶件上。
作为方案一的改进, 在散热直通孔的侧壁上对应每个 LED发光单元均设有散热凸台。 作为方案一的改进,在设置在散热基座上的散热直通孔侧壁上设有条状或网状的散热 鳍片。 作为方案一的改进, 散热直通孔的侧壁到每个 LED发光单元的中心距离均相等。 作为方案一的改进, LED发光单元成圆形或方形或五角形或目字形或田字形排列。 作为方案一的改进, LED发光单元成两排以上的直线排列, 在相邻两排 LED发光单元 间均设有散热直通孔。
作为方案一的改进,在散热基座的外侧和 /或背离透光灯盖的面和 /或设置在散热基座 上的散热直通孔的内侧设有散热鳍片。
作为方案一至七的共同改进,还包括设置在散热基座背离 LED发光单元一侧的流道壳 体, 散热直通孔贯穿流道壳体; 在流道壳体和散热基座间设有与流道壳体和散热基座液密 封的流道外侧壁, 在流道壳体和散热基座间、 沿设置在流道壳体上散热直通孔的外周、 和 /或沿设置在散热基座上的散热直通孔的外周、 设有流道内侧壁, 流道壳体与散热基板固 定在一起, 散热基座、 流道外侧壁、 流道内侧壁、 流道壳体形成完全密封的冷却流道。
作为上述方案的改进,在设定的流道内侧壁间设有连接壁,或在设定的流道内侧壁间、 设定的流道外侧壁和流道内侧壁间设有连接壁, 冷却流道为循环流道; 在流道壳体上还设 有进液口和出液口。
作为方案一至七的共同改进, 固定机构设置在 LED发光单元背离透光灯盖的一侧; 散 热直通孔位于透光灯盖的一端直接与外界空气连通,散热直通孔背离透光灯盖的一端通过 固定机构的侧向间隙与外界空气连通。
作为方案一至七的共同改进, 固定机构设置在 LED发光单元背离透光灯盖的一侧; 在 散热基座的外侧和 /或散热直通孔内和 /或背离 LED发光单元的一侧设有散热鳍片,散热直 通孔贯穿背离 LED发光单元一侧的散热鳍片,背离 LED发光单元的一侧的相邻散热鳍片的 侧面均不连接, 散热直通孔位于透光灯盖的一端直接与外界空气连通, 散热直通孔背离透 光灯盖的一端通过背离 LED发光单元一侧的散热鳍片的间隙直接与外界空气连通。
作为方案一至七的共同改进, 固定机构设置在散热基座的一侧; 在散热基座的外侧和 /或背离 LED发光单元的一侧设有散热鳍片, 散热直通孔贯穿背离 LED发光单元一侧的散 热鳍片, 背离 LED发光单元一侧的相邻散热鳍片的侧面均不连接, 散热直通孔位于透光灯 盖的一端直接与外界空气连通, 散热直通孔背离透光灯盖的一端直接与外界空气连通、 或 通过背离 LED发光单元一侧的散热鳍片的间隙直接与外界空气连通。
作为方案一至七的共同改进, 固定机构设置在散热基座的一侧; 在散热基座背离 LED 发光单元的一侧设有防尘盖;在散热基座的外侧和 /或散热直通孔内和 /或背离 LED发光单 元的一侧设有散热鳍片, 散热直通孔贯穿背离 LED发光单元一侧的散热鳍片, 背离 LED发 光单元一侧的相邻散热鳍片的侧面均不连接,散热直通孔位于透光灯盖的一端直接与外界 空气连通,散热直通孔背离透光灯盖的一端通过背离 LED发光单元一侧的散热鳍片的间隙 直接与外界空气连通和 /或通过防尘盖的侧向间隙与外界空气连通。
作为方案一至七的共同改进, 固定机构设置在散热基座的一侧; 散热基座背离 LED发 光单元的一侧为弧形;在散热基座的外侧和 /或散热直通孔内和 /或背离 LED发光单元的一 侧设有散热鳍片, 散热直通孔贯穿背离 LED发光单元一侧的散热鳍片, 背离 LED发光单元 一侧的相邻散热鳍片的侧面均不连接,散热直通孔位于透光灯盖的一端直接与外界空气连 通,散热直通孔背离透光灯盖的一端通过背离 LED发光单元一侧的散热鳍片的间隙直接与 外界空气连通和 /或直接与外界空气连通。
作为方案一至七的共同改进, 固定机构包括从散热基座背离 LED发光单元的一侧延伸 设有的两个以上的连接凸台, 安装在连接凸台上的弹性卡扣。
作为方案一至七的共同改进, 固定机构包括从散热基座背离 LED发光单元的一侧延伸 设有的两个以上的固定凸部, 安装在固定凸部上的固定板, 设置在固定板背离透光灯盖一 侧的连接凸台和安装在连接凸台上的弹性卡扣。
作为方案九的改进, 固定机构包括从流道板背离 LED发光单元的一侧延伸设有的两个 以上的连接凸台, 安装在连接凸台上的弹性卡扣。
作为方案九的改进, 还设有将流道内侧壁的一侧连接在一起的连接壁, 将相邻的流道 内侧壁隔开、 与连接壁不连接、 与流道外壁连接的挡壁; 流道壳体、 流道外侧壁、 流道内 侧壁、 连接壁、 挡壁、 散热基座形成完全环绕流道内侧壁无死角的冷却循环流道。
作为方案一至六的共同改进, 固定机构包括灯座, 灯座包括上固定环和下固定环, 连 接上固定环和下固定环的连接筋;上固定环的外径大于下固定环的外径并向外凸出连接筋 形成将 LED灯固定在设定位置的固定凸台,下固定环的内径小于上固定环的内径并向内凸 出连接筋形成固定凸台; 散热基座容置在灯座内并与固定凸台固定; 透光灯盖设置在灯座 的底部。
方案一至五、 方案七的共同改进, LED灯为灯管, 透光灯盖为管体, 还包括分别 设于透光管体两端的套接件, 安装在套接件内与布图电路导电层电性连接的灯脚; LED发 光单元阵列分布, 散热直通孔设置在相邻的两排 LED发光单元间、 并沿同一个方向分布; 透光灯盖、 散热基座的两端均安装在套接件内。
本发明的有益效果是:
1 ) 每个 LED发光单元包括一个单基色或两个双基色或三个三基色或四个三基色的 LED芯 片, 或 LED发光单元为固定在散热基座上的 LED灯珠。 由于在 LED发光单元间设有与 LED 发光单元的排列方式相匹配的散热直通孔, 每个 LED发光单元均与散热直通孔相邻, 一方 面减少了 LED发光单元密集排列在一起产生很高的结温,另一方面每个 LED发光单元产生 的热量可直接通过与其相邻的散热直通孔散发出去,尽可能使每个 LED发光单元的散热路 径最短, 每个 LED发光单元的散热路径相等或大致相等, 保证每个 LED发光单元的散热效 果都很好, 进一步减少了 LED发光单元产生很高的结温。 散热直通孔贯穿透光灯盖、 散热 基座, 散热直通孔的两端均与外界空气连通形成对流的气体散热通道, 所以非常有利于空 气对流。 LED光源在工作过程中产生的热量传导至基座上, 基座成为热的传导体和载体。 带有大量热量的基座会与散热直通孔内的空气进行热交换而加热散热直通孔内的空气, 由 于散热直通孔一般均是竖直方向,散热直通孔内的空气密度变小而上升并由散热直通孔的 上端部排出,这时位于基座下方的冷空气会不断地从散热直通孔的下端部进入散热直通孔 内, 从散热直通孔的孔壁吸收热量, 使基座冷却, 吸收了热量的热空气再不断地从垂直贯 通孔的上端部排出, 从而快速带走基座内的热量, 因此在基座内不会囤积大量热量而影响 LED光源的使用寿命、 散热效率高。 散热直通孔的加工非常方便、 快捷, 节约人力、 物力、 财力, 可大幅度降低散热装置乃至具有该散热装置的 LED灯具的成本。 LED发光单元容置 在容置腔内, 一方面避免外部带有湿气和有害化学物质等不洁空气造成 LED发光单元、 导 线和布图电路导电层受到污染、 热阻提高、 造成荧光粉、 硅胶材质劣化, 提高 LED发光单 元的寿命; 另一方面可以将 LED灯户外使用, 防止水等进入容置腔内。
2 ) 每个 LED发光单元只包含一个 LED芯片, 确保每个 LED芯片均与散热直通孔相邻, 使 每个 LED芯片产生的热量可直接通过与其相邻的散热直通孔散发出去, 尽可能使每个 LED 芯片的散热路径最短, 每个 LED芯片的散热路径相等或大致相等, 保证每个 LED芯片的散 热效果都很好, 进一步减少了 LED芯片产生高的结温。 采用 LED灯珠结构, 便于标准化分 工序生产, 组织生产方便。
3 ) 由于均设有定位透镜或成型透镜的塑胶件, 布图电路导电层可伸入定位透镜或成型透 镜的塑胶件内, 一方面导线可直接与布图电路导电层电性连接, 不再需要通过导电金属支 架将导线与布图电路导电层连接或通过接线脚从背离 LED 芯片的散热基座穿出与布图电 路导电层连接, 简化了结构和最大限度的减少中间环节的热阻, 散热效果好; 另一方面不 再需要焊接金属支架或接线脚与布图电路导电层电性连接, 不需要回流焊或波峰焊, 因此 封装胶体可以用树脂或硅胶等; 而且还可保证 LED芯片、 电性连接导线及其两个焊接端不 会暴露于空气中, 有利于使用的长寿命。 而需要回流焊或波峰焊时, 由于回流焊或波峰焊 的温度一般在 250C°或 280C°, 封装胶体就不可以使用树脂。 由于硅胶的价格远远高于树 脂, 透光性比树脂差, 因此本发明可以进一步节省成本, 提高 LED芯片的光学性能。 这种 COB 封装设计的优点在于每个 LED 芯片的电极都通过键合导线直接与布图电路导电层形 成欧姆接触,多路 LED芯片阵列的形成是通过散热基座与 LED芯片的电性连接装置实现电 气互联, 即可实现 LED芯片的串并联, 又可提高产品的可靠性和生产合格率。
4 ) 在散热基座上设有与散热基座一体成型的多个芯片固定凸台, 散热基座的面积大大的 大于芯片固定凸台顶部的面积, LED芯片通过固晶方式固定在芯片固定凸台上。 这样一方 面大大减少 LED 芯片产生的热量散发于散热气体即空气中的中间路径距离和大大增加了 与散热气体的接触面积, 大大减少了热积聚效应,可大大提高散热效率和使芯片保持于合 适的工作温度,从而保持芯片的长寿命及有效发光效率。 芯片固定凸台与散热基座一体成 型, 因此芯片产生的热量只透过散热基座就直接散发于空气中,故热阻小, 散热速度快, 不须借助其它散热件来散热, 散热效果便相当好。 由于有芯片固定凸台,使得电性连接导 线对 LED芯片发出的光线的抵挡阴影降到最低 ,利于光学二次优化!省去了现有的 LED支 架,也就是省去了 LED支架中的散热金属件, 及其电极金属脚等多层中间环节, 尤其减少 了散热金属件与散热基座的两个零件之间产生的高热阻,因此热阻小,导热快散热效果好, 结构简单可靠, 尤其芯片固定凸台与散热基座一体成型更有利于光源的设计与装配工艺, 又节省成本。 因此本发明结构简单可靠,零件少,厚度薄, 易于装配, 特别适用于对光源要 求大功率的场合。
5 ) 在定位透镜或成型透镜的塑胶件上设有避空孔, 使散热直通孔的两端均与外界空气连 通形成气体对流通道, 可以让 LED发光单元与散热直通孔获得最短的散热路径, 取得最佳 的散热效果。 定位透镜或成型透镜的塑胶件为一个, 可以减少固定柱的个数和增加单位面 积内 LED发光单元的个数。 散热直通孔侧壁上的散热凸台进一步增加散热面积, 提高散 热效果。
6 ) 条状或网状的散热鳍片, 一方面可以提高散热基座的强度, 使散热基座不易变形, 使 LED看起来更美观, 更重要的是增加与空气的散热接触面积, 提高散热效果。 散热直通孔 的侧壁到每个 LED发光单元的中心距离均相等, 散热均匀, 散热效果好。
7 ) LED发光单元成两排以上的直线排列具有日光灯管的发光效果, 照射效果好。
8 ) 散热鳍片, 可增加与空气的散热接触面积, 提高散热效果。 散热直通孔内侧的散热鳍 片, 一方面可提高散热效果, 另一方面可以装饰散热直通孔, 使 LED灯看起来更美观。 设 置冷却流道和冷却介质, 可进一步提高散热效果。 在冷却流道内充填冷却水, 由于水的比 热高, 又可通过对流散热, 可使 LED光源的热量迅速散发到水中, 被加热起来温度较高的 水会与接触空气的散热终端的温度较低的水形成对流,热量被交换到温度较低的接触空气 的散热终端通过散热终端迅速散发到空气中, 散热快, 可有效减少结温。 还有由于水的最 高温度为 100° C, 可避免 LED光源处的结温远远超过 100° C, 对于温差比较大的路灯等, 可减少 LED灯的骤冷骤热, 改善 LED灯的工作环境。
9) 通过在有些流道内侧壁间设有连接壁, 有些流道内侧壁间没有设连接壁, 使冷却流道 形成循环流道, 通过进液口将外面的冷却液体输进冷却流道内, 通过出液口将冷却流道内 的液体输出去,便于冷却介质的快速对流运动,散热效果更好。通过在设定流道内侧壁间、 设定的流道外侧壁和流道内侧壁间设有连接壁,使第一循环冷却流道完全环绕流道内侧壁 无死角, 不存在没有被冷却流道覆盖的散热单元, 散热效果更好, 更均匀。
10) 固定机构设置在 LED发光单元背离透光灯盖的一侧形成灯泡、 射灯、 吸顶灯、 吊顶灯 等。在 LED灯的顶部需要固定的情况下, 散热直通孔的两端仍然与外界空气连通形成对流 的气体散热通道。 固定机构设置在散热基座的一侧形成路灯、 台灯等。
11 ) 防尘盖可减少灰尘积聚在散热基座的顶面, 提高散热基座的散热效果。 在 LED灯的顶 部设有防尘盖的情况下, 散热直通孔的两端仍然与外界空气连通形成对流的气体散热通 道。 散热基座背离 LED发光单元的一侧为弧形, 可减少灰尘积聚在散热基座的顶面, 提高 散热基座的散热效果。
弹性卡扣 安装方式, 结构简单, 安装方便。采用灯座的结构, 结构简单, 安装方便、 固定可靠, 外观美观。
14)通过在有些流道内侧壁间设有连接壁, 有些流道内侧壁间没有设连接壁, 使冷却流道 形成循环流道, 通过进液口将外面的冷却液体输进冷却流道内, 通过出液口将冷却流道内 的液体输出去,便于冷却介质的快速对流运动,散热效果更好。通过连接壁和挡壁的结合, 使第一循环冷却流道完全环绕流道内侧壁无死角,不存在没有被冷冷却流道覆盖的散热单 元, 散热效果更好, 更均匀。 附图说明
图 1是本实用新型实施例 1的立体示意图。
图 2是本实用新型实施例 1的立体分解示意图。
图 3是本实用新型实施例 1从另一个方向投影的立体分解示意图。
图 4是本实用新型实施例 2的立体分解示意图。
图 5是本实用新型实施例 3的立体分解示意图。
图 6是本实用新型实施例 4的立体分解示意图。
图 7是本实用新型实施例 5的立体分解示意图。
图 8是本实用新型实施例 6的立体分解示意图。
图 9是本实用新型实施例 7的立体分解示意图。
图 10是本实用新型实施例 8的立体分解示意图。
图 11是本实用新型实施例 9的立体分解示意图。
图 12是本实用新型实施例 10的立体分解示意图。
图 13是本实用新型实施例 11的立体示意图。
图 14是本实用新型实施例 11的立体分解示意图。
图 15是本实用新型实施例 12的立体分解示意图。
图 16是本实用新型实施例 12的透光灯盖从另一个方向的立体示意图。
图 17是本实用新型实施例 13的立体分解示意图。
图 18是本实用新型实施例 14的立体分解示意图。
图 19是本实用新型实施例 15的立体分解示意图。
图 20是本实用新型实施例 16的立体分解示意图。
图 21是本实用新型实施例 17的立体分解示意图。
图 22是本实用新型实施例 17的立体分解示意图。
图 23是本实用新型实施例 18的立体分解示意图。
图 24是本实用新型实施例 19的立体分解示意图。
图 25是本实用新型实施例 20的立体分解示意图。
图 26是本实用新型实施例 21的立体分解示意图。
图 27是本实用新型实施例 21从另一个方向投影的立体示意图。
图 28是本实用新型实施例 22的立体分解示意图。
图 29是本实用新型实施例 23的立体示意图。
图 30是本实用新型实施例 23从另一个方向投影的立体分解示意图。
图 31是本实用新型实施例 23的立体分解示意图。
图 32是本实用新型实施例 24的立体分解示意图。
具体实施方式
实施例 1
如图 1、 图 2、 图 3所示, 一种 LED灯, 包括透光灯盖 1、 散热 PCB板 2、 散热座 10、 多个只包含一个 LED芯片的 LED灯珠 3、 灯头 4、 电性连接 LED灯珠 3的正负引脚的布图 电路导电层 (未示出)、 与外部电源和 LED发光单元电性连接的电控装置 5。 电控装置 5 固定在灯头 4上。 LED灯珠 3成类似五角形排布, 固定在散热 PCB板 2上, 布图电路导电 层直接设置在散热 PCB板 2上, LED灯珠 3和布图电路导电层设置在散热 PCB板 2的同一 个面上。
散热座 10、 散热 PCB板 2、 透光灯盖 1的外周形状为具有圆弧过渡的五角形。 散热座 10与散热 PCB板 2背离 LED灯珠 3的面贴合固定。 在透光灯盖 1上设有五角形的环形凹 腔 6, 在环形凹腔 6的底面延伸设有通孔 22的固定柱 21, 透光灯盖 1通过螺钉 20穿过通 孔 22固定在散热座 10上形成容置 LED发光单元的密闭容置腔,散热 PCB板 2置于容置腔 内。 散热 PCB板 2为平板, 散热座 10为平板, 在散热座 10背离 LED灯珠 3的面上一体成 型有散热鳍片 7, 散热鳍片 7的外周为圆弧形, 与灯头 4的外周齐平。在散热 PCB板 2上、 LED灯珠 3间还设有与 LED灯珠 3的排列方式相匹配的具有圆弧过渡的一个五角形散热直 通孔 8, 每个 LED灯珠 3均与散热直通孔 8相邻, 散热直通孔 8的侧壁到每个 LED灯珠 3 的中心距离均相等。 在散热座 10上设有与散热直通孔 8贯通大小等同的散热直通孔 11, 散热直通孔 11贯穿散热鳍片 7。 在透过灯盖 1上设有与散热直通孔 8贯通大小等同的散 热直通孔 9。 相邻散热鳍片 7的侧面均不连接, 散热直通孔 9背离散热 PCB板 2的一端直 接与外界空气连通, 散热直通孔 11背离散热 PCB板 2的一端通过散热鳍片 7直接与外界 空气连通, 散热直通孔 9、 散热直通孔 8、 散热直通孔 11、 散热鳍片 7之间的侧向间隙形 成对流的气体散热通道。 在散热直通孔 11的侧壁上对应每个 LED发光单元均设有散热凸 台 14、 散热凸台 15、 散热凸台 16、 散热凸台 17、 散热凸台 18、 散热凸台 19。 散热凸台 15、 散热凸台 16、 散热凸台 17、 散热凸台 18、 散热凸台 19连接在一起。
在散热鳍片 7上设有卡槽 12, 在灯头 4内侧面上设有与卡槽配合的凸台 13。 通过灯 头 4内侧面上的凸台 14卡入散热鳍片 7的卡槽 12内将灯头 4与散热鳍片 7固定在一起。 实施例 2
如图 4所示, 一种 LED灯, 包括透光灯盖 30、 成型透镜的塑胶板 37、 PCB板 31、 散 热基座 32、 LED发光单元、 电性连接 LED发光单元的布图电路导电层 (未示出)、 与外部 电源和布图电路导电层电性连接的电控装置 34、灯头 35。 LED发光单元包括 LED芯片 36、 透镜 45、 电性连接 LED芯片 36和布图电路导电层的金线 33。
散热基座 32包括一环形的平板状的底板,与散热基座 32—体成型的凸出底板的复数 个芯片固定凸台 40, 固定凸台 40均与分布在同一圆周上。 在成型透镜的塑胶板 61的端 面上延伸设有固定柱 39。 在散热基座 32上与固定柱 39配合的第二通孔 41。 芯片固定凸 台 40的横截面为圆形,底板的横截面的面积大大的大于芯片固定凸台 40的横截面的面积, 至少是芯片固定凸台 40的横截面的面积的三倍或三倍以上。 LED芯片 36固定在固定凸台 40上。在成型透镜的塑胶板 61上设有与固定凸台 40个数和位置一一对应的第一通孔 38。
布图电路导电层直接设置在 PCB板 31上, 布图电路导电层分布在同一个平面上。 在 PCB板 31上对应每个芯片固定凸台 40设有与芯片固定凸台 40配合的第四通孔 42和与固 定柱 39配合的第三通孔 43, PCB板 31置于散热基座 32设有芯片固定凸台 40的一侧并与 散热基座 32直接接触, PCB板 31设有布图电路导电层的一侧背离接触散热基座 32的接 触面。
散热基座 32的芯片固定凸台 40穿过 PCB板 31的第四通孔 42,成型透镜的塑胶板 37 的固定柱 39穿过 PCB板 31上的第三通孔 43、 散热基座 32的第二通孔 41, 通过固定柱 39的端部的抵挡部 44与 PCB板 31、 散热基座 32固定, 从而将散热基座 32、 PCB板 31、 成型透镜的塑胶板 37依次固定在一起。 芯片固定凸台 40置于对应的成型透镜的塑胶板 37的第一通孔 38内, 布图电路导电层伸入第一通孔 38的内侧壁与芯片固定凸台 40外侧 壁之间, LED芯片 36通过固晶工艺固定在芯片固定凸台 40的端面上, 金线 33置于成型 透镜的塑胶板 37内, 金线 33—端与 LED芯片 36的电极电性连接, 金线 33的另一端与伸 入成型透镜的塑胶板 37内的布图电路导电层电性连接;透镜 45通过模具直接成型在第一 通孔 38内并封装 LED芯片 36和金线 33。
电控装置 34固定在灯头 35上。 在透光灯盖 30上设有凹腔 (未示出), 透光灯盖 30 通过螺钉 53固定在散热基座 32上形成容置 LED发光单元的密闭容置腔。 PCB板 31、成型 透镜的塑胶板 37置于容置腔内。
散热基座 32、 透光灯盖 30、 PCB板 31、 成型透镜的塑胶板 37的外周形状为圆柱形。 在散 热基座 32的底板上、 LED芯片 36间还设有与 LED芯片 36的排列方式相匹配的散热圆直 通孔 47,每个 LED芯片 36均与散热圆直通孔 47相邻,散热圆直通孔 47的侧壁到每个 LED 芯片 36的中心距离均相等。 在散热基座 32背离 LED芯片 36的面上一体成型有平行的条 状散热鳍片 46, 散热鳍片 46的外周为圆弧形, 与灯头 35的外周齐平; 在散热圆直通孔 47内一体成型有与散热鳍片 46—一对应、连接为一体的条状散热鳍片 54, 散热圆直通孔 47内的条状散热鳍片 54朝向透光灯盖 30的一侧凸出散热基座 32、 其外周与散热圆直通 孔 47齐平。 散热鳍片 46和散热鳍片 54均平行排列, 散热鳍片 54的两端均与散热鳍片 46连接, 散热鳍片 54背离透光灯盖 30的面与散热鳍片齐平 46。在 PCB板 31上设有与散 热圆直通孔 47贯通大小等同的散热圆直通孔 48。 在成型透镜的塑胶板 37上设有与散热 圆直通孔 48贯通大小等同的散热圆直通孔 49。 在透过灯盖 30上设有与散热圆直通孔 49 贯通大小等同的散热圆直通孔 50。
在散热基座 32设有带螺纹孔的固定凸台 (未示出), 在灯头 35内设有与固定凸台配 合的带通孔的固定柱 51。 灯头 35通过螺钉 52穿过固定柱 51与散固定凸台的螺纹孔配合 将灯头 35与散热基座 32固定在一起。 相邻散热鳍片 46的侧面均不连接, 散热圆直通孔 50位于透光灯盖 30的一端直接与外界空气连通, 散热圆直通孔 47背离透光灯盖 30的一 端通过散热鳍片 46和固定凸台 51的侧向间隙直接与外界空气连通。
实施例 3
如图 5所示, 与实施例 2不同的是, 一种 LED灯, 包括透光灯盖 60、 成型透镜的塑 胶板 61、 PCB板 62、 散热基座 63、 流道盖板 64、 LED发光单元、 电性连接 LED发光单元 的布图电路导电层 (未示出)、 与外部电源和布图电路导电层电性连接的电控装置 65、 灯 头 66。 LED发光单元成五角形排列。
流道盖板 64、 散热基座 63、 透光灯盖 60、 PCB板 62、 成型透镜的塑胶板 61的外周 形状为圆弧过渡的五角形。 在散热基座 63背离 LED发光单元的一侧设有一体成型的冷却 流道 76。 散热基座 63的最大外径与灯头 66齐平。 在散热基座 63上、 LED发光单元间还 设有与 LED发光单元的排列方式相匹配的圆弧过渡的五角形散热直通孔 67。 在 PCB板 62 上设有与散热直通孔 67贯通大小等同的圆弧过渡的五角形散热直通孔 68。 在成型透镜的 塑胶板 61上设有与散热直通孔 68贯通大小等同的圆弧过渡的五角形散热直通孔 69。 在 透过灯盖 60上设有与散热直通孔 69贯通大小等同的圆弧过渡的五角形散热直通孔 70。 在流道盖板 64上设有与散热直通孔 67贯通大小等同的圆弧过渡的五角形散热直通孔 71。
在流道盖板 64背离透光灯盖 60的一侧设有带螺纹内孔的固定凸台 72和散热鳍片 73, 在灯头 66内设有与固定凸台 72配合的带通孔的固定柱。灯头 66通过螺钉 74穿过固定柱 与固定凸台 72的螺纹孔配合将灯头 66与流道盖板 64固定在一起。流道盖板 64与散热基 座 63通过焊接固定和液密封冷却流道 76。 LED发光单元的背面完全被冷却流道 76覆盖。 成型透镜的塑胶板 61的固定柱 75与散热基座 63液密封。相邻散热鳍片 73的侧面均不连 接, 圆弧过渡的五角形散热直通孔 70位于透光灯盖 60的一端直接与外界空气连通, 圆弧 过渡的五角形散热直通孔 71背离透光灯盖 60的一端通过散热鳍片 73和固定凸台 72的侧 向间隙直接与外界空气连通。
实施例 4
如图 6所示, 与实施例 3不同的是, 在设置在散热基座 80上的散热直通孔 81的内侧 壁上对应每个 LED发光单元均设有散热凸台 82。 在散热基座 80的外侧面的凹陷面上一体 成型有散热鳍片 83, 散热鳍片 83的外周为圆弧形, 与灯头 84的外周齐平。
实施例 5
如图 7所示,与实施例 4不同的是,在散热凸台 86内设有与冷却流道连通的凹槽 87。 实施例 6
如图 8所示, 与实施例 1不同的是, LED灯珠 100在 X向成两排对称的反向 W排列, 在 Y向成两排直线排列。 散热座 101、 散热 PCB板 102、 透光灯盖 103的外周形状为在 X 向成对称的具有圆弧过渡 W形, 在 Y为直线形, X向和 Y向的接合处圆弧过渡, 散热座 101、散热 PCB板 102、透光灯盖 103的最大外径处与灯头 104齐平。分别贯穿散热座 101、 散热 PCB板 102、 透光灯盖 103的散热直通孔 105、 散热直通孔 106、 散热直通孔 107的 形状与其外周形状相似。设置在透光灯盖 103内的环形凹腔 108的形状与其外周形状相似。 焊接在散热座 101上的散热鳍片 109仅分布在散热座 101背离透光灯盖 103—侧的面上。
在散热 PCB板 102设有带螺纹孔 110的固定凸台 111, 在灯头 104内设有与固定凸台 111配合的带通孔 112的固定柱 (未示出)。 灯头 104通过螺钉 113穿过通孔 112与螺纹 孔 110配合将灯头 104与散热 PCB板 102固定在一起。
实施例 7
如图 9所示, 与实施例 2不同的是, LED灯为吸顶灯, 包括透光灯盖 120、 成型透镜 的塑胶板 121、 PCB板 122、 散热基座 123、 LED发光单元、 电性连接 LED发光单元的布图 电路导电层 (未示出)、 与外部电源和布图电路导电层电性连接的电控装置 125、 固定圆 板 126。 电控装置 125固定在固定圆板 126上。 固定圆板 126与散热鳍片 127通过焊接固 定在一起。 从固定圆板 126背离散热基座 123的一侧延伸设有的连接凸台 124、 连接凸台 128, 在连接凸台 124上设有弹性卡扣 129, 在连接凸台 128上设有弹性卡扣 130。
实施例 8
如图 10所示, 与实施例 2不同的是, LED灯为吸顶灯, 包括透光灯盖 144、 成型透镜 的塑胶板 145、 PCB板 146、 散热基座 140、 LED发光单元、 电性连接 LED发光单元的布图 电路导电层 (未示出)、 与外部电源和布图电路导电层电性连接的电控装置 (未示出)。 电 控装置固定在散热基座 140上。
在散热基座 140背离 LED芯片 141的面上一体成型有平行的条状散热鳍片 142, 散热 鳍片 142的外周为圆弧形, 与散热基座 140的外周齐平; 在散热圆直通孔 148内一体成型 有网状的散热鳍片 143, 散热圆直通孔 148内的网状散热鳍片 143朝向透光灯盖 144的一 侧凸出散热基座 140、 其外周与散热圆直通孔 148齐平。 在散热鳍片 142最外的两条上均 设有弹性卡扣 147。
实施例 9
如图 11所示, 与实施例 2不同的是, LED灯为吸顶灯, 包括透光灯盖 150、 成型透 镜的塑胶板 151、 PCB板 152、 散热基座 153、 LED发光单元、 电性连接 LED发光单元的布 图电路导电层 (未示出)、 与外部电源和布图电路导电层电性连接的电控装置 154、 流道 盖板 155、 固定圆板 156。 流道盖板 155的外周为与散热基座 153外周齐平的圆柱形。
散热基座 153的形状与实施例 2不同。在散热基座 153的散热圆直通孔内设有一体成 型的多条平行的散热条。沿散热基座 153的外圆周、 散热条与散热基座 153形成的多个平 行的散热孔的外周向背离 LED芯片的方向延伸设有流道壁 160, 还设有将流道壁 160连接 形成循环流道的连接壁 161。 散热基座 153、 流道壁 160、 连接壁 161形成第一循环冷却 流道 162。 在流道盖板 155上一体成型有与散热条一一对应的密封条 163。 流道盖板 155 与散热基座 153固定在一起, 密封条 163液密封冷却流道 162。 LED芯片 164的背面完全 被冷却流道 162覆盖。成型透镜的塑胶板 151的固定柱 165与散热基座 153液密封。密封 条 163与流道盖板 155形成多个与散热基座 153上的散热孔贯通的散热孔 159。
电控装置 154固定在固定圆板 156上。在流道盖板 155背离透光灯盖 150的一侧延伸 设有带螺纹盲孔 166的固定凸台 167, 在固定圆板 156内设有与螺纹盲孔 166配合的通孔 168。 螺钉 169穿过通孔 168与固定凸台 167上的螺纹盲孔 166配合将固定圆板 156与流 道盖板 155固定在一起。
从固定圆板 156背离散热基座 153的一侧延伸设有连接凸台 170、连接凸台 171, 在连 接凸台 170上设有弹性卡扣 172, 在连接凸台 171上设有弹性卡扣 173。
实施例 10
如图 12所示, 与实施例 9不同的是, LED灯为吸顶灯, 包括透光灯盖 180、 成型透 镜的塑胶板 181、 PCB板 182、 散热基座 183、 LED发光单元、 电性连接 LED发光单元的布 图电路导电层 (未示出)、 与外部电源和布图电路导电层电性连接的电控装置 184、 流道 盖板 185。 电控装置 184固定在流道盖板 185上。 从流道盖板 185背离散热基座 183的一 侧延伸设有连接凸台 186、 连接凸台 187, 在连接凸台 186上设有弹性卡扣 188, 在连接 凸台 187上设有弹性卡扣 189。 在流道盖板 185上设有与第一循环冷却流道 191连通的注 液口 190。 散热基座 183周边凸出第一循环冷却流道 191的外流道壁 192, 流道板 185的 外周与外流道壁 192齐平。
实施例 11
如图 13、 图 14所示, 与实施例 2不同的是, 一种 LED灯, 包括透光灯盖 200、 成型 透镜的塑胶板 201、 PCB板 202、 散热基座 203、 LED发光单元、 电性连接 LED发光单元的 布图电路导电层(未示出)、与外部电源和布图电路导电层电性连接的电控装置、灯座 205。
灯座 205包括上固定环 206和下固定环 207, 四个连接上固定环 206和下固定环 207 的连接筋 208。 上固定环 206的外径大于下固定环 207的外径并向外凸出连接筋 208形成 将 LED灯固定在设定位置的固定凸台,下固定环 207的内径小于上固定环 206的内径并向 内凸出连接筋 208形成固定散热基座 203的固定凸台 209。 在透光灯盖 200朝向散热基座 203的面上设有端部带抵挡部 210的固定柱 211, 在灯座 205背离透光灯盖 200的面上设 有与固定柱 211和抵挡部 210配合的弹性扣 212, 设置在灯座 205上位于弹性扣 212中心 位置、大于抵挡部 210外径的通孔 213。透光灯盖 200通过固定柱 211和其上的抵挡部 210 穿过通孔 213、 抵挡部 210抵挡在弹性扣 212上将透光灯盖 200和灯座 205固定。 散热基 座 203固定在下固定环 207上。
实施例 12
如图 15、 图 16所示, 与实施例 11不同的是, 灯座包括固定环 221, 从固定环 221朝 向透光灯盖 222的面上延伸设有的连接筋 223, 在连接筋 223的端部设有弹性卡扣 224。 在透光灯盖 222上设有与弹性卡扣 224配合的抵挡孔 225。透光灯盖 222通过弹性卡扣 224 伸入抵挡孔 225并抵挡在透光灯盖 222上将透光灯盖 222和灯座固定。散热基座 226固定 在透光灯盖 222上。 电控装置 (未示出) 固定在灯座上。
实施例 13
如图 17所示, 与实施例 12不同的是, LED发光单元包括 LED芯片 230、 透镜 231、 透光封装胶体 232、 电性连接 LED芯片 230和布图电路导电层的金线 233。 透镜 231固定 在第一通孔 234上。 透光封装胶体 232填充在透镜 231和 LED芯片 230间。
灯座 235、 透光灯盖 236—体成形。 散热基座 237固定在透光灯盖 236上。
实施例 14
如图 18所示, 一种 LED灯, 包括透光灯盖 240、 多个只包含一个 LED芯片的 LED灯 珠 241、 散热 PCB板 242、 散热座 243、 电性连接 LED灯珠 241的正负引脚的布图电路导 电层 (未示出)。 LED灯珠 241成田字形排布, 固定在散热 PCB板 242上, 布图电路导电 层直接设置在散热 PCB板 242上, LED灯珠 241和布图电路导电层设置在散热 PCB板 242 的同一个面上。
散热座 243、 散热 PCB板 242、 透光灯盖 240的外周形状为方形。 散热 PCB板 242背 离 LED灯珠 241的面与散热座 243贴合固定。 在透光灯盖 240上设有田字形凹腔 244, 透 光灯盖 240固定在散热座 243上形成容置 LED灯珠 241的密闭容置腔,散热 PCB板 242置 于容置腔内。 散热 PCB板 242为平板, 散热座 243为平板, 在散热座 243背离 LED灯珠 241的面上一体成型有条状的相互平行的散热鳍片 245。 在散热 PCB板 242上、 LED灯珠 241间还设有与 LED灯珠 241的排列方式相匹配的四个方形的散热直通孔 246, 每个 LED 灯珠 241均与对应散热直通孔 246相邻, 对应的散热直通孔 246的侧壁到每个 LED灯珠 241的中心距离均相等。 在散热座 243上同样设有四个与散热直通孔 246贯通大小等同的 散热直通孔 (未示出)。 在透过灯盖 240上设有四个与散热直通孔 246贯通大小等同的散 热直通孔 247。 散热直通孔 247位于透光灯盖 240的一端直接与外界空气连通, 散热直通 孔 247背离透光灯盖 240的一端通过散热鳍片 245直接与外界空气连通。在最外侧的两条 散热鳍片 245上均设有弹性卡扣 248。
实施例 15
如图 19所示,与实施例 10不同的是,透光灯盖 260、多个只包含一个 LED芯片的 LED 发光单元、 成型透镜的塑胶板 261、 PCB板 262、 散热基座 263、 流道盖板 264的外周为方 形。 在散热基座 263上的散热凸台 265成目字形排列。 在透光灯盖 260、 成型透镜的塑胶 板 261、 PCB板 262、 散热基座 263、 流道盖板 264分别设有三个置于目字形内的散热直通 孔 266、 散热直通孔 267、 散热直通孔 268、 散热直通孔 269、 散热直通孔 270。 在透光灯 盖 260上设有目字形的凹腔 271。
在散热基座 263背离 LED发光单元的面上沿目字形排列的透镜 272的外周延伸设有方 形的流道外侧壁 273、 沿散热直通孔 269的外周延伸设有方形的流道内侧壁 274, 还设有 将置于两侧的方形的流道内侧壁 274的同一侧与流道外侧壁 273连接、将置于中间的方形 的流道内侧壁 274 的异侧与流道外侧壁 273连接形成循环流道的连接壁 275。 散热基座 263、 流道外侧壁 273、 流道内侧壁 274、 连接壁 275形成第一循环冷却流道。 流道盖板 264与散热基座 263固定在一起并液密封冷却流道。
实施例 16
如图 20所示, 与实施例 15不同的是, 在流道壳体 280朝向散热基座 281的面上沿目 字形排列的透镜 282的外周延伸设有方形的流道外侧壁 283、 沿散热直通孔 284的外周延 伸设有方形的流道内侧壁 285, 还设有将方形的流道内侧壁 285的一侧连接在一起的连接 壁 286, 将相邻的流道内侧壁 285隔开、 与连接壁 286不连接、 与流道外侧壁 283连接的 挡壁 288。 散热基座 281与流道壳体 280固定在一起。 散热基座 281、 流道壳体 280、 流 道外侧壁 283、 流道内侧壁 285、 连接壁 286、 挡壁 288形成完全环绕流道内壁 285无死 角的密封的第一循环冷却流道。
实施例 17
如图 21、 图 22所示, 一种 LED灯, 包括透光灯盖 301、 散热基座 302、 多个只包含 一个 LED芯片的 LED灯珠 303、 电性连接 LED灯珠 303的正负引脚的布图电路导电层 (未 示出)、 与外部电源和 LED发光单元电性连接的电控装置。 电控装置固定在散热基座 302 上。 LED灯珠 303成 4*5点阵排布, 固定在散热基座 302上, 布图电路导电层直接设置在 散热基座 302上, LED灯珠 303和布图电路导电层设置在散热基座 302的同一个面上。 散热基座 302、 透光灯盖 301的外周形状为方形。 在透光灯盖 301上设四个阵列的与灯珠 配合的方形凹腔 304, 透光灯盖 301固定在散热基座 302上形成容置 LED灯珠 303的密闭 容置腔。 在散热基座 302背离 LED灯珠 303的面上一体成型有散热鳍片 305, 在散热基座 302相背的两个侧面上一体成型有散热鳍片 306, 在四个对角位置相邻的散热鳍片 306间 连接有固定部 307, 在固定部 307上设有固定孔 308。 在散热基座 302上、 四排 LED灯珠 303间还设有与 LED灯珠 303的排列方式相匹配的三个方形散热直通孔 309, 在散热直通 孔 309间均设有平行的散热鳍片 311。每个 LED灯珠 303均与对应的散热直通孔 309相邻, 对应的散热直通孔 309的侧壁到对应的 LED灯珠 303的中心距离均相等。 在透光灯盖 301 上设有与散热直通孔 309贯通大小等同的散热直通孔 312, 在散热直通孔 312内设有与散 热鳍片 311—一对应的散热鳍片 313。
实施例 18
如图 23所示, 与实施例不同的是, 一种 LED灯, 包括透光灯盖 320、 成型透镜的塑 胶板 321、 PCB板 322、 散热基座 323、 LED发光单元、 电性连接 LED发光单元的导线 324 和电性连接导线的布图电路导电层 (未示出)、 与外部电源和 LED发光单元电性连接的电 控装置 325、 流道盖板 326。
流道盖板 326的外周边与散热基座 323的外周边齐平。在流道盖板 326上设有与散热基座 323上的散热直通孔 327大小形状完全相同的散热直通孔 328。
在散热基座 323背离透光灯盖 320的面上设有与散热基座 323外形相似的凹腔 329。 在透 光灯盖 320上还设有凹腔 330, 在散热基座 323上设有与凹腔 330截面形状完全相同的通 孔 331, 在流道盖板 326上设有密封通孔 331背离透光灯盖 320的一侧的密封部 332。 流 道盖板 326固定在散热基座 323上形成容置 LED发光单元的密闭容置腔。流道盖板 326再 固定在散热基座 323上形成容置电控装置 325的密闭容置腔。在散热基座 323背离散热直 通孔 327的侧面上还设有连接柄 333。
成型透镜的塑胶板 321上的固定柱 334与散热基座 323液密封。
实施例 19
如图 24所示, 一种 LED灯, 包括透光灯盖 340、 散热 PCB板 341、 散热座 342、 多个 只包含一个 LED芯片的 LED灯珠 343、 电性连接 LED灯珠 343的正负引脚的布图电路导电 层 (未示出)、 与外部电源和 LED发光单元电性连接的电控装置 344、 顶盖 345。 LED灯珠 343成 5*8点阵排布, 固定在散热 PCB板 341上, 布图电路导电层直接设置在散热 PCB板 341上, LED灯珠 343和布图电路导电层设置在散热 PCB板 341的同一个面上。
散热座 342、 散热 PCB板 341、 透光灯盖 340、 顶盖 345的外周形状为方形。 散热 PCB板 341背离 LED灯珠 343的面与散热座 342贴合固定。 在散热座 342、 散热 PCB板 341、 透光灯盖 340上、 LED灯珠 343间依次设有与 LED灯珠 343的排列方式相匹配的四个阵列的散热直通孔 346、 散热直通孔 347、 散热直通孔 348, 每个 LED灯珠 343均与对应的散热直通孔相邻,相应的散热直通孔的侧壁到相应的 LED灯 珠 343的中心距离均相等。
在透光灯盖 340朝向散热 PCB板 341的面上、 沿透光灯盖 340的周边、 散热直通孔 348的周边延伸设有腔外壁 349、 沿散热直通孔 348的周边延伸设有腔内壁 350, 还设有 将腔外壁 349分隔成凹腔 351、 凹腔 352的隔墙 353。 在散热 PCB板 341上还设有与凹腔 352配合的凹腔 (未示出)。 透光灯盖 340固定在散热座 342上, 散热座 342与凹腔形成 容置 LED灯珠 343的密闭容置腔, 散热 PCB板 341置于密闭容置腔内。 电控装置 344固定 在散热 PCB板 341的凹腔 352内, 凹腔 352与散热座 342上的凹腔形成容置电控装置 344 的容置腔。在散热座 342背离 LED灯珠 343的面上一体成型有条状的平行的散热鳍片 354。 在顶盖 345朝向散热座 342的面上设有固定柱 355, 散热座 342固定在顶盖 345的固定柱 355上。 在散热座 342的一个侧面上还设有连接柄 356。
散热直通孔 348背离散热座 342的一端直接与外界空气连通,散热直通孔 346背离透 光灯盖 340的一端通过散热鳍片 354的间隙直接与外界空气连通。
实施例 20
如图 25所示, 与实施例 20不同的是, 还包括流道盖板 360。
在散热座 361背离散热 PCB板 362的面上、沿散热座 361的三个周边延伸设有流道外 侧壁 363、 沿散热座 361上的散热直通孔 364的周边延伸设有流道内侧壁 365。 流道外侧 壁 363、 流道内侧壁 365、 安装电控装置的凹腔朝向散热直通孔 364的一侧的侧壁形成冷 却流道 366。 在流道盖板 360上设有与散热座 361上的散热直通孔 364贯通、 大小形状相 同的散热直通孔 367。 流道盖板 360与散热座 361固定并与散热座 361冷却流道液密封。 流道盖板 360与顶盖 370的固定柱 368固定。透光灯盖 369上的散热直通孔 371背离散热 座 361的一端直接与外界空气连通,散热直通孔 367背离透光灯盖 369的一端通过固定柱 368之间的侧向间隙直接与外界空气连通。
实施例 21
如图 26、 图 27所示, 一种 LED灯, 包括透光灯盖 381、 散热座 382、 多个只包含一 个 LED芯片的 LED灯珠 383、 电性连接 LED灯珠 383的正负引脚的布图电路导电层 (未示 出)、 与外部电源和 LED发光单元电性连接的电控装置 392。 电控装置 392固定在散热座 382上。 LED灯珠 383成 4*5点阵排布, 固定在散热座 382上, 布图电路导电层直接设置 在散热座 382上, LED灯珠 383和布图电路导电层设置在散热座 382的同一个面上。
散热座 382、 透光灯盖 381的外周形状为方形。 在透光灯盖 381上设四个阵列的与灯 珠 383配合的方形凹腔 384, 透光灯盖 381固定在散热座 382上形成容置 LED灯珠 383的 密闭容置腔。在散热座 382背离 LED灯珠 383的面上和相背的两个侧面上一体成型有弧形 的平行的散热鳍片 385。 在散热座 382上阵列有被四排 LED灯珠 383分隔开、 与 LED灯珠 383的排列方式相匹配的五个方形散热直通孔 386, 在散热直通孔 386间均设有平行的散 热鳍片 387。 每个 LED灯珠 383均与对应的散热直通孔 386相邻, 对应的散热直通孔 386 的侧壁到对应的 LED灯珠 383的中心距离均相等。 在透光灯盖 381上设有与散热直通孔 386贯通大小等同的散热直通孔 388, 在散热直通孔 388内设有与散热鳍片 387—一对应 的散热鳍片 389。
在透光灯盖 381朝向散热座 382的面上还设有凹腔 390, 在散热座 382上设有与凹腔 390截面形状完全相同的凹腔。 电控装置 392固定在散热座 382的凹腔内。 透光灯盖 381 固定在散热座 382上密封凹腔 384形成容置 LED灯珠 383的密闭容置腔,凹腔 390和散热 座 382上的凹腔形成容置电控装置 392的容置腔。在散热座 382背离散热直通孔 386的侧 面上还设有连接柄 393。
透光灯盖 381上的散热直通孔 388背离散热座 382的一端和散热座 382的散热直通孔 386背离透光灯盖 381的一端均与外界直接连通。
实施例 22 如图 28所示, 与实施例 21不同的是, LED灯为台灯, 在连接柄 400上固定有连接杆 401, 在连接杆 401上固定有灯座 402。
实施例 23
如图 29至图 31所示, 一种 LED灯, 包括透光管体 410、 分别设于透光管体 410两 端的套接件 411、散热 PCB板 414、散热座 415、多个只包含一个 LED芯片的 LED灯珠 416、 电性连接 LED灯珠 416的正负引脚的布图电路导电层 (未示出)、 与布图电路导电层电性 连接的电控装置(未示出), 安装在套接件 411内与电控装置电性连接的灯脚 413。 LED灯 珠 416成 3行 13列点阵排布, 固定在散热 PCB板 414上, 布图电路导电层直接设置在散 热 PCB板 414上, LED灯珠 416和布图电路导电层设置在散热 PCB板 414的同一个面上。 在散热座 415、 散热 PCB板 414、 透光管体 410上、 LED灯珠 416间依次设有与 LED灯珠 416的排列方式相匹配的二个阵列的散热直通孔 418、 散热直通孔 419、 散热直通孔 420, 每个 LED灯珠 416均与对应的散热直通孔相邻,相应的散热直通孔的侧壁到相应的 LED灯 珠 416的中心距离均相等。
在透光管体 410朝向散热 PCB板 414的面上、沿两个散热直通孔 420的周边延伸设有用来 安装散热基板的固定部 421。 透光管体 410为大于半圆的柱状面不连接的部分圆柱体。 散 热座 415、 散热 PCB板 414的外周形状为方形。 散热 PCB板 414固定在透光管体 410的固 定部 421上, 散热座 415朝向 LED灯珠 416的面与散热 PCB板 414贴合固定。 透光管体 410的两端分别安装在套接件 411上。 透光管体 410、 散热 PCB板 414、 套接件 411形成 容置 LED灯珠 416的密闭容置腔。 电控装置安装在套接件 411内。 在散热座 415背离 LED 灯珠 416的面上一体成型有条状的平行的散热鳍片 417。
散热直通孔 420背离散热座 415的一端直接与外界空气连通,散热直通孔 418背离透光管 体 410的一端通过散热鳍片 417的间隙直接与外界空气连通。
实施例 24
如图 32所示, 与实施例 23不同的是, 还包括弧形的流道盖板 430。
在散热座 431背离散热 PCB板 432的面上、沿散热座 431的周边延伸设有流道外侧壁 433、 沿散热座 431上的散热直通孔 434的周边延伸设有流道内侧壁 435。 流道外侧壁 433、 流 道内侧壁 435形成冷却流道 436。在流道盖板 430上设有与散热座 431上的散热直通孔 434 贯通、 大小形状相同的散热直通孔 437。 流道内侧壁 435的顶面为与流道盖板 430的底面 配合的弧形。在流道盖板 430的两端、沿流道外侧壁 433向上延伸设有与流道盖板 430底 面配合的弧形凸出部 440。 流道盖板 430与散热座 431固定并与散热座 431冷却流道 436 液密封。 透光灯盖 439上的散热直通孔 438背离散热座 431的一端直接与外界空气连通, 散热直通孔 437背离透光灯盖 439的一端直接与外界空气连通。

Claims

1、 一种 LED灯, 包括透光灯盖、 散热基座、 两个以上的 LED发光单元、 电性连接 LED 发光单元的布图电路导电层、 将灯固定在设定位置的固定机构; LED发光单元固定在散 热基座上, 布图电路导电层和 LED发光单元设置在散热基座的同侧; 透光灯盖与散热基 座安装在一起形成容置 LED发光单元的容置腔, 固定机构直接固定在散热基座上、 或与 散热基座一体成型、 或直接固定在透光灯盖上、 或与透光灯盖一体成型; 其特征在于: 在 LED发光单元间还设有与 LED发光单元的排列方式相匹配的散热直通孔, 每个 LED发 光单元均与散热直通孔相邻, 散热直通孔贯穿透光灯盖、 散热基座; 散热直通孔的两端 均与外界空气连通形成对流的气体散热通道。
2、 如权利要求 1所述的一种 LED灯, 其特征在于: 所述的 LED发光单元为固定在散热基 座上的 LED灯珠;散热基座包括固定 LED灯珠的平板状的散热基板,与散热基板背离 LED 灯珠的面贴合固定的散热座; 布图电路导电层设置在散热基板上, 灯珠直接固定在散热 基板上; 散热基板置于容置腔内。
3、 如权利要求 1所述的一种 LED灯, 其特征在于: 在散热直通孔的侧壁上对应每个所述 的 LED发光单元均设有散热凸台。
4、 如权利要求 1所述的一种 LED灯: 其特征在于: 在设置在散热基座上的散热直通孔侧 壁上设有条状或网状的散热鳍片。
5、 如权利要求 1所述的一种 LED灯 其特征在于: 所述的散热直通孔的侧壁到每个 LED 发光单元的中心距离均相等。
6、 如权利要求 1所述的一种 LED灯: 其特征在于: 所述的 LED发光单元成圆形或方形或 五角形或目字形或田字形排列。
7、 如权利要求 1所述的一种 LED灯, 其特征在于: 所述的 LED发光单元成两排以上的直 线排列, 在相邻两排 LED发光单元间均设有所述的散热直通孔。
8、 如权利要求 1所述的一种 LED灯, 其特征在于: 在散热基座的外侧和 /或背离透光灯 盖的面和 /或设置在散热基座上的所述散热直通孔的内侧设有散热鳍片。
9、 如权利要求 1至 7任意一项所述的一种 LED灯, 其特征在于: 还包括设置在散热基座 背离 LED发光单元一侧的流道壳体, 散热直通孔贯穿流道壳体; 在流道壳体和散热基座 间设有与流道壳体和散热基座液密封的流道外侧壁, 在流道壳体和散热基座间、 沿设置 在流道壳体上散热直通孔的外周、和 /或沿设置在散热基座上的散热直通孔的外周、 设有 流道内侧壁, 流道壳体与散热基板固定在一起, 散热基座、 流道外侧壁、 流道内侧壁、 流道壳体形成完全密封的冷却流道。
10、 如权利要求 9所述的一种 LED灯, 其特征在于: 在设定的流道内侧壁间设有连接壁, 或在设定的流道内侧壁间、 设定的流道外侧壁和流道内侧壁间设有连接壁, 冷却流道为 循环流道; 在流道壳体上还设有进液口和出液口。
11、 如权利要求 1至 7任意一项所述的一种 LED灯, 其特征在于: 固定机构设置在 LED 发光单元背离透光灯盖的一侧; 散热直通孔位于透光灯盖的一端直接与外界空气连通, 散热直通孔背离透光灯盖的一端通过固定机构的侧向间隙与外界空气连通。
12、 如权利要求 1至 7任意一项所述的一种 LED灯, 其特征在于: 固定机构设置在 LED 发光单元背离透光灯盖的一侧; 在散热基座的外侧和 /或散热直通孔内和 /或背离 LED发 光单元的一侧设有散热鳍片, 散热直通孔贯穿背离 LED发光单元一侧的散热鳍片, 背离 LED发光单元的一侧的相邻散热鳍片的侧面均不连接,散热直通孔位于透光灯盖的一端直 接与外界空气连通, 散热直通孔背离透光灯盖的一端通过背离 LED发光单元一侧的散热 鳍片的间隙直接与外界空气连通。
13、 如权利要求 1至 7任意一项所述的一种 LED灯, 其特征在于: 固定机构设置在散热 基座的一侧; 在散热基座的外侧和 /或背离 LED发光单元的一侧设有散热鳍片, 散热直通 孔贯穿背离 LED发光单元一侧的散热鳍片, 背离 LED发光单元一侧的相邻散热鳍片的侧 面均不连接, 散热直通孔位于透光灯盖的一端直接与外界空气连通, 散热直通孔背离透 光灯盖的一端直接与外界空气连通、 或通过背离 LED发光单元一侧的散热鳍片的间隙直 接与外界空气连通。
14、 如权利要求 1至 7任意一项所述的一种 LED灯, 其特征在于: 固定机构设置在散热 基座的一侧; 在散热基座背离 LED发光单元的一侧设有防尘盖; 在散热基座的外侧和 /或 散热直通孔内和 /或背离 LED发光单元的一侧设有散热鳍片,散热直通孔贯穿背离 LED发 光单元一侧的散热鳍片, 背离 LED发光单元一侧的相邻散热鳍片的侧面均不连接, 散热 直通孔位于透光灯盖的一端直接与外界空气连通, 散热直通孔背离透光灯盖的一端通过 背离 LED发光单元一侧的散热鳍片的间隙直接与外界空气连通和 /或通过防尘盖的侧向间 隙与外界空气连通。
15、 如权利要求 1至 7任意一项所述的一种 LED灯, 其特征在于: 固定机构设置在散热 基座的一侧; 散热基座背离 LED发光单元的一侧为弧形; 在散热基座的外侧和 /或散热直 通孔内和 /或背离 LED发光单元的一侧设有散热鳍片,散热直通孔贯穿背离 LED发光单元 一侧的散热鳍片, 背离 LED发光单元一侧的相邻散热鳍片的侧面均不连接, 散热直通孔 位于透光灯盖的一端直接与外界空气连通,散热直通孔背离透光灯盖的一端通过背离 LED 发光单元一侧的散热鳍片的间隙直接与外界空气连通和 /或直接与外界空气连通。
16、 如权利要求 1至 6任意一项所述的一种 LED灯, 其特征在于: 所述的固定机构包括 从散热基座背离 LED发光单元的一侧延伸设有的两个以上的连接凸台, 安装在连接凸台 上的弹性卡扣。
17、 如权利要求 1至 6任意一项所述的一种 LED灯, 其特征在于: 所述的固定机构包括 从散热基座背离 LED发光单元的一侧延伸设有的两个以上的固定凸部, 安装在固定凸部 上的固定板, 设置在固定板背离透光灯盖一侧的连接凸台和安装在连接凸台上的弹性卡 扣。
18、 如权利要求 9所述的一种 LED灯, 其特征在于: 所述的固定机构包括从流道板背离 LED发光单元的一侧延伸设有的两个以上的连接凸台, 安装在连接凸台上的弹性卡扣。
19、 如权利要求 9所述的一种 LED灯, 其特征在于: 还设有将流道内侧壁的一侧连接在 一起的连接壁, 将相邻的流道内侧壁隔开、 与连接壁不连接、 与流道外壁连接的挡壁; 流道壳体、 流道外侧壁、 流道内侧壁、 连接壁、 挡壁、 散热基座形成完全环绕流道内侧 壁无死角的冷却循环流道。
20、 如权利要求 1至 6任意一项所述的一种 LED灯, 其特征在于: 所述的固定机构包括 灯座, 灯座包括上固定环和下固定环, 连接上固定环和下固定环的连接筋; 上固定环的 外径大于下固定环的外径并向外凸出连接筋形成将 LED灯固定在设定位置的固定凸台, 下固定环的内径小于上固定环的内径并向内凸出连接筋形成固定凸台; 散热基座容置在 灯座内并与固定凸台固定; 透光灯盖设置在灯座的底部。
21、 如权利要求 1至 5、 7任意一项所述的一种 LED灯, 其特征在于: 所述的 LED灯为灯 管, 透光灯盖为管体, 还包括分别设于透光管体两端的套接件, 安装在套接件内与布图 电路导电层电性连接的灯脚; 所述的 LED发光单元阵列分布, 所述的散热直通孔设置在 相邻的两排 LED发光单元间、 并沿同一个方向分布; 透光灯盖、 散热基座的两端均安装 在所述的套接件内。
PCT/CN2012/075421 2011-09-30 2012-05-14 一种led灯 WO2013044636A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201110310551 2011-09-30
CN201110310551.4 2011-09-30

Publications (1)

Publication Number Publication Date
WO2013044636A1 true WO2013044636A1 (zh) 2013-04-04

Family

ID=46857542

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2012/075421 WO2013044636A1 (zh) 2011-09-30 2012-05-14 一种led灯

Country Status (2)

Country Link
CN (1) CN102691906B (zh)
WO (1) WO2013044636A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2851615A1 (en) * 2013-09-19 2015-03-25 Kabushiki Kaisha Toshiba Lighting apparatus
CN105202426A (zh) * 2015-10-23 2015-12-30 苏州汉克山姆照明科技有限公司 一种卧室或客厅用吸顶灯
US20220357021A1 (en) * 2021-05-06 2022-11-10 Magna Exteriors Gmbh Cover element for sensors and method for producing the cover element

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103047563A (zh) * 2012-11-30 2013-04-17 黄超 一种在光源之间分布有空气对流通道的led灯具
JP6025054B2 (ja) * 2013-03-04 2016-11-16 パナソニックIpマネジメント株式会社 照明装置
WO2017000766A1 (zh) * 2015-06-30 2017-01-05 欧普照明股份有限公司 一种led光源模组
CN105043150A (zh) * 2015-08-28 2015-11-11 中山市绿涛电子科技有限公司 一种可展开式散热器
CN105526502A (zh) * 2016-01-15 2016-04-27 成都格瑞思文化传播有限公司 防尘led灯结构
CN108019627A (zh) * 2016-11-04 2018-05-11 马文波 一种高散热性能的大功率led灯
CN106902474A (zh) * 2017-04-24 2017-06-30 深圳市和普利科技有限公司 一种量子光波疗仪
WO2024099282A1 (zh) * 2022-11-09 2024-05-16 嘉兴山蒲照明电器有限公司 一种led灯具

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090237932A1 (en) * 2008-03-18 2009-09-24 Pan-Jit International Inc. Led lighting device having heat convection and heat conduction effects and heat dissipating assembly therefor
CN101785117A (zh) * 2007-03-29 2010-07-21 香港应用科技研究院有限公司 照明装置
WO2010088303A1 (en) * 2009-01-28 2010-08-05 Guy Vaccaro Heat sink for passive cooling of a lamp
CN201820758U (zh) * 2010-09-15 2011-05-04 杨东佐 一种带有冷却装置的led集成结构
CN102177399A (zh) * 2008-09-08 2011-09-07 英特曼帝克司公司 发光二极管(led)照明装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070211470A1 (en) * 2006-03-03 2007-09-13 Hsien-Jung Huang Lamp house with heat sink
CN101598268A (zh) * 2008-06-05 2009-12-09 先进开发光电股份有限公司 光触媒灯具
TWI398601B (zh) * 2008-07-11 2013-06-11 Foxconn Tech Co Ltd 發光二極體燈具
CN101769523A (zh) * 2009-01-05 2010-07-07 富准精密工业(深圳)有限公司 发光二极管灯具
CN201582607U (zh) * 2009-12-24 2010-09-15 陈鸿蛟 Led灯泡
CN201772362U (zh) * 2010-08-12 2011-03-23 全昊 嵌入式灯具
CN202834815U (zh) * 2011-09-30 2013-03-27 杨东佐 一种led灯

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101785117A (zh) * 2007-03-29 2010-07-21 香港应用科技研究院有限公司 照明装置
US20090237932A1 (en) * 2008-03-18 2009-09-24 Pan-Jit International Inc. Led lighting device having heat convection and heat conduction effects and heat dissipating assembly therefor
CN102177399A (zh) * 2008-09-08 2011-09-07 英特曼帝克司公司 发光二极管(led)照明装置
WO2010088303A1 (en) * 2009-01-28 2010-08-05 Guy Vaccaro Heat sink for passive cooling of a lamp
CN201820758U (zh) * 2010-09-15 2011-05-04 杨东佐 一种带有冷却装置的led集成结构

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2851615A1 (en) * 2013-09-19 2015-03-25 Kabushiki Kaisha Toshiba Lighting apparatus
CN105202426A (zh) * 2015-10-23 2015-12-30 苏州汉克山姆照明科技有限公司 一种卧室或客厅用吸顶灯
US20220357021A1 (en) * 2021-05-06 2022-11-10 Magna Exteriors Gmbh Cover element for sensors and method for producing the cover element
US11608965B2 (en) * 2021-05-06 2023-03-21 Magna Exteriors Gmbh Cover element for sensors and method for producing the cover element

Also Published As

Publication number Publication date
CN102691906A (zh) 2012-09-26
CN102691906B (zh) 2014-05-14

Similar Documents

Publication Publication Date Title
WO2013044636A1 (zh) 一种led灯
US9435492B2 (en) LED luminaire with improved thermal management and novel LED interconnecting architecture
JP5101578B2 (ja) 発光ダイオード照明装置
TWI515387B (zh) 路燈及其發光設備
JP5968911B2 (ja) 照明装置
US9068701B2 (en) Lamp structure with remote LED light source
WO2011112005A2 (ko) 에어 파이프를 갖는 조명 커버 및 이를 이용한 엘이디 조명장치
WO2013044601A1 (zh) 一种led点阵显示屏及组合式点阵显示屏
KR20120055596A (ko) 개선된 히트 싱크를 가지는 고체 조명 장치
TW201348646A (zh) 發光二極體燈具
MX2011005992A (es) Aparato disipador de calor de forma radial y aparato de iluminación led en forma de foco que usa el mismo.
WO2010022630A1 (zh) Led光源的散热装置及led光源
KR101072584B1 (ko) 엘이디 조명 장치
CN201281266Y (zh) 大功率led道路照明灯
CN103335254A (zh) Led光源模块及其led路灯
CN102691908A (zh) Led灯
CN202834815U (zh) 一种led灯
CN102691907A (zh) Led灯
KR20110003221U (ko) 전방 발열이 가능한 엘이디 조명기구
CN201555069U (zh) 高效散热型led灯具
JP2012069396A (ja) 照明ユニットおよび照明装置
KR20120007668A (ko) 발광다이오드 모듈
EP3447374B1 (en) Lighting device
KR100982682B1 (ko) 엘이디 고효율 램프용 조명등의 구조
CN109708032B (zh) 一种高散热型灯珠排列led灯具

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12834786

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 12834786

Country of ref document: EP

Kind code of ref document: A1