WO2013008590A1 - 基板製造方法及び基板製造装置 - Google Patents
基板製造方法及び基板製造装置 Download PDFInfo
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- WO2013008590A1 WO2013008590A1 PCT/JP2012/065696 JP2012065696W WO2013008590A1 WO 2013008590 A1 WO2013008590 A1 WO 2013008590A1 JP 2012065696 W JP2012065696 W JP 2012065696W WO 2013008590 A1 WO2013008590 A1 WO 2013008590A1
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- film material
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- landing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/12—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J11/00—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
- B41J11/0015—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form for treating before, during or after printing or for uniform coating or laminating the copy material before or after printing
- B41J11/002—Curing or drying the ink on the copy materials, e.g. by heating or irradiating
- B41J11/0021—Curing or drying the ink on the copy materials, e.g. by heating or irradiating using irradiation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J11/00—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
- B41J11/0015—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form for treating before, during or after printing or for uniform coating or laminating the copy material before or after printing
- B41J11/002—Curing or drying the ink on the copy materials, e.g. by heating or irradiating
- B41J11/0021—Curing or drying the ink on the copy materials, e.g. by heating or irradiating using irradiation
- B41J11/00214—Curing or drying the ink on the copy materials, e.g. by heating or irradiating using irradiation using UV radiation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
Definitions
- the present invention relates to a substrate manufacturing method and a substrate manufacturing apparatus for forming a thin film pattern by discharging droplets of a thin film material from nozzle holes.
- a conventional method for forming a solder resist pattern on a printed circuit board will be described.
- a photosensitive solder resist is applied to the entire surface of a printed circuit board on which a circuit pattern is formed.
- the solder resist film is exposed using a predetermined mask pattern, and then developed to form a solder resist pattern.
- the image data of the thin film pattern to be formed is usually given in the Gerber format. Prior to forming the thin film pattern, the Gerber format image data is converted to raster format image data.
- 11A and 11B show a part of raster format image data.
- 11A and 11B show image data in the vicinity of an elliptical and square pattern. The range shown is a range of ⁇ ⁇ m in the column direction and ⁇ ⁇ m in the row direction.
- FIG. 11A and FIG. 11B show part of raster format image data in which the pixel pitch is 80 ⁇ m and 40 ⁇ m, respectively.
- the diagonal line is attached
- the elliptic pattern and the square pattern are not separated, whereas in the image data shown in FIG. 11B, both patterns are separated. This is due to the difference in resolution (resolution) of the thin film pattern.
- the resolution depends on the pixel pitch, and the smaller the pixel pitch, the higher the resolution.
- a thin film pattern is formed at a resolution of 300 dpi, for example, and in the example shown in FIG. 11B, a thin film pattern is formed at a resolution of 600 dpi, for example.
- ⁇ A solder resist is actually applied with a predetermined resolution to the printed circuit board on which the circuit pattern is formed. If it is determined that the resolution is insufficient based on the coating result, the pixel pitch is changed and the raster format image data is recreated.
- a thin film pattern can be formed with a resolution of 2400 dpi by reciprocally scanning a nozzle unit composed of four nozzle heads while shifting by a minute distance, for example, a pitch corresponding to 2400 dpi, on the forward path and the return path.
- the number of droplets that land per unit area is four times that of the case where a thin film pattern is formed with a resolution of 1200 dpi.
- the thickness of the thin film pattern is also quadrupled. Even when a high resolution of 2400 dpi is not required, the film thickness is quadrupled.
- the amount of thin film material used increases. Further, since the droplet discharge frequency is increased more than necessary, the life of the nozzle unit is shortened.
- the planar shape of the thin film pattern is defined by image data composed of a plurality of pixels distributed two-dimensionally, and the landing target pixel should be filled with the thin film material on the surface of the base substrate.
- a portion of pixels extracted from the plurality of pixels in a solid region The thin film material that has landed at a position corresponding to the landing target pixel spreads in the in-plane direction to a region corresponding to the pixel that has not been extracted as the landing target pixel, and then the thin film material is cured to thereby cure the solid material.
- a substrate manufacturing method for covering the entire region and forming the thin film pattern having a thickness.
- the landing target pixels are arranged such that the thin film material that has landed at the landing position extends in the in-plane direction to a position corresponding to the pixel that has not been extracted as the landing target pixel and covers the entire solid region.
- a substrate manufacturing apparatus for extraction is provided.
- FIG. 1 is a schematic diagram of a substrate manufacturing apparatus according to the first embodiment.
- FIG. 2A is a perspective view of the nozzle unit, and FIG. 2B is a bottom view of the nozzle unit.
- FIG. 3 is a diagram illustrating a positional relationship between the nozzle holes and the image of the nozzle holes.
- FIG. 4A is a front view of the nozzle unit and the printed board, and FIG. 4B is a front view of the ultraviolet light source.
- FIG. 5 is a plan view showing an example of a thin film pattern to be formed.
- FIG. 6 is a diagram illustrating a two-dimensional distribution of pixels of raster format image data in the vicinity of a circular pattern.
- FIGS. 7A to 7C are diagrams showing two-dimensional distributions of some pixels of image data obtained by extracting pixels on which droplets of a thin film material are landed.
- 8A and 8B are diagrams showing another example of the two-dimensional distribution of some pixels of image data obtained by extracting pixels on which droplets of a thin film material are landed.
- 9A to 9E are diagrams showing a two-dimensional distribution of a part of pixels of image data, and show an example in which a resolution is defined using an area.
- FIG. 10 is a diagram illustrating the distribution of the landing pixels illustrated in FIG. 8A when the pixel pitch is 10 ⁇ m and 5 ⁇ m.
- FIG. 11A and FIG. 11B are diagrams showing the distribution of some pixels of raster format image data.
- FIG. 16A is a diagram showing the relationship between the Y coordinate of the landing point of a droplet discharged from a nozzle hole and the discharge time by the substrate manufacturing method according to Example 5, and FIG. 16B shows the position of the landing point on the substrate.
- FIG. 17A to FIG. 17D are diagrams showing temporal changes in the shape of the ejected droplets.
- 18A is a plan view of a straight line drawn by droplets that have landed on the substrate
- FIG. 18B is a cross-sectional view taken along one-dot chain line 18B-18B in FIG. 18A.
- FIG. 19A is a bottom view of a nozzle unit according to a comparative example, and FIG.
- FIG. 19B is a cross-sectional view of a straight line drawn using the nozzle unit according to the comparative example.
- FIG. 20 is a bottom view of the nozzle unit of the substrate manufacturing apparatus according to the sixth embodiment.
- FIG. 21 is a bottom view of the nozzle unit of the substrate manufacturing apparatus according to the seventh embodiment.
- FIG. 22A is a plan view showing a part of a thin film pattern to be formed on a substrate by the thin film forming method according to Example 8, and
- FIG. 22B is a diagram showing an example of raster format image data.
- FIG. 23A to FIG. 23D are diagrams showing a part of pixel data obtained by extracting pixels on which droplets are landed.
- FIG. 29A is a plan view of a nozzle unit, a pixel row on which a droplet has landed, and a cross-sectional view of the droplet during the first scan of the substrate manufacturing method according to the tenth embodiment.
- FIG. 29B is a diagram during the second scan.
- FIG. 2 is a plan view of a nozzle unit, a pixel row on which a droplet has landed, and a cross-sectional view of the droplet.
- Control device 33 controls X moving mechanism 22, Y moving mechanism 23, ⁇ rotation mechanism 24, stage 25, and nozzle unit 40. For example, a desired resolution is input from an input device 35 including a keyboard and a reader. The input data is transmitted to the control device 33, and processing according to the input content is performed.
- the storage device 34 stores Gerber format image data input via the input device 35 and raster format image data generated from the Gerber format image data.
- a light source 43 is disposed between the nozzle heads 42A and 42B, between the nozzle heads 42B and 42C, and between the nozzle heads 42C and 42D. Further, the light source 43 is arranged in a region on the positive side of the X axis from the nozzle head 42A and a region on the negative side of the X axis from the nozzle head 42D.
- the light source 43 irradiates the substrate 50 (FIG. 1) with light containing a component in a wavelength region that cures the liquid thin film material, for example, ultraviolet rays.
- FIG. 2B shows a bottom view of the nozzle heads 42A to 42D and the light source 43.
- Two rows of nozzle rows 46a and 46b are formed on the bottom surface (the surface facing the substrate 50) of the nozzle head 42A.
- Each of the nozzle row 46a and the nozzle row 46b is composed of a plurality of nozzle holes 45 arranged at a pitch (period) 8P in the Y direction.
- the nozzle row 46b is shifted in the negative direction of the X axis with respect to the nozzle row 46a, and is further shifted by the pitch 4P in the negative direction of the Y axis.
- the nozzle holes 45 of the nozzle head 42A are distributed at equal intervals with a pitch 4P in the Y direction as a whole.
- the pitch 4P is a pitch P 300 (about 80 ⁇ m) corresponding to a resolution of 300 dpi, for example.
- the serial numbers are assigned to the nozzle heads 42A to 42D, and the serial numbers of the corresponding nozzle heads 42A to 42D are assigned to the images 55A to 55D of the nozzle holes 45.
- Each nozzle hole 45 includes a piezo element.
- a voltage to the piezo element from the control device 33 (FIG. 1), a droplet is ejected from the nozzle hole 45.
- the droplet discharge interval depends on the frequency of the applied voltage, and the discharge interval can be shortened by applying a high-frequency voltage. For this reason, for example, the resolution in the X direction of the thin film pattern to be formed can be adjusted by increasing the frequency of the applied voltage.
- the light source 43 attached to the outside of the nozzle head 42A (the positive side of the X axis) irradiates light to the region on the positive side of the X axis relative to the region 48A.
- the light source 43 attached to the outside of the nozzle head 42D (the negative side of the X axis) irradiates light to the region on the negative side of the X axis from the region 48D.
- a case where a thin film pattern is formed by discharging droplets from the nozzle heads 42A to 42D while moving the substrate 50 in the negative direction of the X axis will be described.
- the liquid droplets ejected from the nozzle heads 42A to 42D and attached to the substrate 50 are cured by being irradiated with light from a light source ahead (in the negative direction of the X axis) from the position of the liquid droplets at the time of landing.
- the cylindrical lens 43B reduces the incident angle to the substrate 50 so that the reflected light does not enter the nozzle hole 45 in the vicinity.
- ultraviolet rays are incident substantially perpendicularly in the ZX plane.
- FIG. 5 shows an example of a thin film pattern to be formed on the surface of the substrate 50.
- a region (a hatched region in FIG. 5) to which a thin film material such as a solder resist is attached and a region (opening) not to be attached (a white region in FIG. 5) are defined.
- the region to which the thin film material is not attached has a planar shape such as a quadrangle, a circle, or a straight line having a certain width.
- a thin film material is applied to the area 58 outside these openings.
- image data of a thin film pattern to be formed is given in a Gerber format.
- the control device 33 converts the image data in the Gerber format into the image data in the raster format and stores it in the storage device 34.
- a planar shape of a thin film pattern to be formed by a plurality of pixels arranged in a matrix is defined.
- the pitch of the pixels 60 in the row direction and the column direction is defined in advance and stored in the storage device 34. This pitch is defined for each type of substrate on which the thin film pattern is formed. Raster format image data is created based on the defined pitch.
- the minimum value of the pitch in the row direction and the column direction of the pixels 60 is limited by the positioning accuracy of the substrate 50 by the Y moving mechanism 23, for example. Further, the upper limit value of the pitch is limited by the resolution required for the thin film pattern to be formed. It is desirable to reduce the pitch of the pixels 60 in the row direction and the column direction, and to set the realizable resolution of the thin film pattern to be formed higher.
- the control device 33 (FIG. 1) is a landing target pixel that causes a droplet to land from a pixel in a region to which the thin film material is to be applied in accordance with a desired resolution (target resolution) input from the input device 35 (FIG. 1).
- a desired resolution target resolution
- the operation of the nozzle unit 40 and the moving mechanism 21 (FIG. 1) is controlled so that the droplet of the thin film material is landed on the position on the substrate 50 corresponding to the extracted landing target pixel.
- the position on the substrate corresponding to the pixel of the image data may be simply referred to as “pixel”.
- 7A to 7C show an example of the distribution of the extracted landing target pixels.
- the range shown in FIGS. 7A to 7C is, for example, a part of the range where the pixel 60 is blacked out in FIG. 6 (that is, the solid region where the thin film material is applied to the entire surface).
- the landing target pixels are circled.
- the landing target pixels are regularly (periodically) arranged in the row direction and the column direction, for example.
- FIG. 7A shows an example in which the pitch of the landing target pixels is 20 ⁇ m in both the row direction and the column direction.
- one pixel is disposed between the landing target pixels adjacent to each other in both the row direction and the column direction.
- the resolution of the thin film pattern is 1200 dpi in the row direction and the column direction.
- FIG. 7B shows an example in which the pitch of the landing target pixels is 40 ⁇ m in both the row direction and the column direction.
- the pitch of the landing target pixels is 40 ⁇ m in both the row direction and the column direction.
- three pixels are arranged between the landing target pixels adjacent to each other in both the row direction and the column direction.
- the resolution of the thin film pattern is 600 dpi in the row direction and the column direction.
- the resolution of the thin film pattern is 2400 dpi in the row direction and the column direction.
- the resolution of the thin film pattern is defined for the row direction and the column direction. May be.
- FIG. 8A shows an example in which landing target pixels are extracted in a checkered pattern.
- the resolution of the thin film pattern is 1200 dpi, but when viewed in the oblique 45 ° direction, the resolution is about 1700 dpi.
- the landing target pixels when attention is paid to the row direction, three pixels are arranged between the landing target pixels adjacent to each other. In addition, every other line including the landing target pixel is arranged. That is, one row of pixels is arranged between adjacent rows among the rows including the landing target pixels. Further, when attention is paid to adjacent rows among the rows including the landing target pixels, the landing target pixels are shifted in the row direction by a distance corresponding to a distance (20 ⁇ m) twice the pixel pitch. In the example shown in FIG. 8B, the resolution in the row direction and the column direction is 600 dpi, but when viewed in the oblique 45 ° direction, the resolution is about 850 dpi.
- the resolution of the thin film pattern can be defined using, for example, an area instead of defining a predetermined direction.
- the distribution of the landing target pixels shown in FIG. 9A is equal to the distribution shown in FIG. 7C.
- the area of the triangle in FIG. 9A corresponds to a resolution of 2400 dpi.
- the distribution of the landing target pixels shown in FIG. 9B is equal to the distribution shown in FIG. 7A, and the area of the triangle corresponds to a resolution of 1200 dpi.
- the distribution of the landing target pixels shown in FIG. 9C is equal to the distribution shown in FIG. 8A, and the area of the triangle corresponds to a resolution of 1700 dpi.
- 9D and 9E correspond to a resolution of 1200 dpi and a resolution of 800 dpi, respectively.
- the control device 33 may extract the landing target pixels so as to have the distribution of FIG. 9B, or the landing target so as to have the distribution of FIG. 9E. Pixels may be extracted.
- the resolution may be defined corresponding to the area of the polygon formed by connecting the center position of the landing target pixel with the line segment, or the polygon position formed by connecting the center position of the landing target pixel with the line segment may be defined.
- the resolution may be defined corresponding to the average of the lengths of the sides.
- the thin film material exceeds the range of the landed pixel and corresponds to the pixel that is not extracted as the landing target pixel. It spreads in the in-plane direction. Thereby, the thin film material covers the whole area of the solid region.
- the control device 33 (FIG. 1) extracts the landing target pixels according to the input target resolution so as to have the distributions shown in FIGS. 7A to 9E, and applies the droplet of the thin film material to the extracted landing target pixels. Let it land.
- the storage device 34 may store in advance the distribution (landing pattern) of the landing target pixels associated with the resolution.
- the control device 33 selects a landing pattern corresponding to the input resolution from the stored landing patterns according to the input target resolution. Further, the control device 33 extracts the landing target pixels based on the selected landing pattern, and controls the nozzle unit 40 (FIG. 1) and the moving mechanism 21 (FIG. 1).
- the landing pattern stored in the storage device 34 may be raster format image data as shown in FIGS. 7A to 9E, or numerical data corresponding to them.
- a method for defining a landing pattern with numerical data will be described.
- raster format image data that defines a thin film pattern is generated based on the Gerber format image data (selecting pixels in a region to which a thin film material is applied).
- the reference for extracting the landing target pixel from the raster format image data defining the thin film pattern is defined as follows.
- a non-landing pixels are arranged between adjacent landing target pixels.
- B rows composed of only non-landing pixels between the rows including the landing target pixels.
- the landing target pixels in rows adjacent to each other are arranged so as to be shifted from each other by a distance corresponding to X pixels in the row direction.
- the values of the variables A, B, and X are stored corresponding to the resolution.
- the control device 33 controls the nozzle unit 40 based on the contents stored in the storage device 34 so that the droplets of the thin film material land on the landing target pixels.
- the control device 33 may select a landing pattern having the closest resolution as the landing pattern corresponding to the input resolution. For example, when the input resolution is 1650 dpi, the landing pattern shown in FIG. 9C corresponding to 1700 dpi is selected, and when the input resolution is 780 dpi, the landing pattern shown in FIG. 9E corresponding to 800 dpi is selected. .
- the storage device 34 (FIG. 1) of the substrate manufacturing apparatus stores at least the pitches in the row direction and the column direction of the pixels 60 defined in advance.
- the control device 33 (FIG. 1) extracts the landing target pixels from the pixels 60 having a prescribed pitch based on the stored contents. The ejection of droplets is controlled so that the droplets of the thin film material land on the extracted landing target pixels.
- the degree of freedom in setting the resolution of the thin film pattern can be increased. This makes it possible to form a thin film pattern corresponding to the required resolution. Re-creation of image data and an increase in tact time due to overspec can be prevented. In addition, the thin film material is not used more than necessary, and the cost can be reduced. Furthermore, it is possible to suppress deterioration of the substrate manufacturing apparatus.
- Securing the pitch of the pixels 60 to a small value increases the resolution and enables formation of a high-definition thin film pattern.
- FIG. 10 shows the distribution of the landing target pixels when the pixel pitch is 10 ⁇ m and the distribution of the landing target pixels when the pitch is 5 ⁇ m.
- the pixels are arranged at equal intervals in the row direction and the column direction orthogonal to each other.
- a predetermined pitch is set along each of the first direction and the second direction intersecting with the first direction.
- a plurality of pixels may be arranged.
- the intersection angle between the first direction and the second direction is not limited to a right angle. You may arrange
- the resolution is numerically input.
- a degree of resolution such as “high resolution”, “medium resolution”, and “low resolution” may be input.
- the landing target pixel is extracted at 2400 dpi for “high resolution”, 1200 dpi for “medium resolution”, and 600 dpi for “low resolution”.
- the landing may be extracted with a resolution fixed at 1200 dpi.
- raster format image data is generated from the Gerber format image data.
- the landing target pixels are extracted from the pixels in the application region (solid region) of the thin film material based on the landing pattern shown in FIG. 7A. A droplet of a thin film material is discharged so as to land on the extracted landing target pixel.
- the pixels on which the droplets of the thin film material are landed are regularly arranged in the row direction and the column direction.
- Example 1 the solder resist thin film pattern was formed on the printed circuit board by the substrate manufacturing apparatus.
- the substrate manufacturing apparatus according to Example 1 is an application for forming an insulating film on a glass substrate in manufacturing a touch panel, for example. Can also be used. Further, it can be used for forming an insulating film of a build-up substrate.
- Example 2 Next, a substrate manufacturing apparatus and a substrate manufacturing method according to Example 2 will be described. Hereinafter, differences from the first embodiment will be described, and description of the same configuration will be omitted.
- Example 2 an example in which a thin film pattern including a circular opening shown in FIG. 6 is formed will be described.
- FIG. 12A shows a pixel (landing target pixel) 60a for landing a droplet of a thin film material in black.
- the pixels 60a at the positions where the even-numbered columns Ce intersect with the even-numbered rows Re are the targets of droplet landing.
- the column direction (vertical direction in FIG. 12A) corresponds to the X direction
- the row direction (horizontal direction in FIG. 12A) corresponds to the Y direction.
- the nozzle unit 40 While moving the substrate 50 (FIG. 1) in the X direction, the nozzle unit 40 (FIG. 1) is controlled to cause droplets to land on the landing target pixel 60a shown in FIG. 12A. This process is referred to as a “first scanning process”.
- rows and columns not selected in the first scanning step specifically, odd-numbered columns and odd-numbered rows are selected. From the pixel at the position where the selected column and row intersect, the pixel that causes the droplet to land is extracted.
- FIG. 12B shows a pixel (landing target pixel) 60b on which a droplet is landed in black.
- the pixels 60b at the positions where the odd-numbered columns Co and the odd-numbered rows Ro intersect are the target of droplet landing.
- the substrate 50 is moved in the Y direction by a distance corresponding to the pitch of the pixels 60, that is, a distance equal to P 300/8 .
- the nozzle unit 40 is controlled while moving the substrate 50 in the X direction, and droplets are landed on the landing target pixels 60b shown in FIG. 12B. This process is referred to as a “second scanning process”.
- FIG. 13A shows the pixels on which the liquid droplets have landed in black when the first and second scanning steps are completed.
- the pixel 60c at the position where the even-numbered column Ce and the odd-numbered row Ro intersect, and the pixel 60d at the position where the odd-numbered column Co and the even-numbered row Re intersect, are the first and second scanning steps. In either case, it is not selected as a landing target. For this reason, in the area where the thin film formation is to be applied, that is, the area outside the circular opening, the pixels on which the thin film material droplets have landed are distributed in a checkered pattern. However, after landing on the substrate 50, the size of the droplets spread in the in-plane direction is greater than the pitch P 300/8 pixels. For this reason, in FIG. 13A, the whole area of the solid region indicated by the checkered pattern is covered with a thin film material made of a solder resist. That is, an insulating thin film pattern made of a solder resist is formed.
- pixels may be selected in the first and second scan step is the X and Y directions, two times the pitch P 300/8, which corresponds to 2400 dpi, i.e. arranged at a pitch P 300/4 To do.
- pixels that can be selected in the first and second scanning steps are arranged at a pitch of (P 300/8 ) ⁇ 2 1/2 . This pitch corresponds to a resolution of about 1700 dpi.
- First scanning step, and the second scanning step in each step, onto which the droplets are to be discharged pixels are arranged at a pitch P 300/4 which corresponds to 1200dpi resolution in the Y direction.
- the pitch P of the nozzle images 55A to 55D shown in FIG. 3 may be set to a pitch corresponding to 1200 dpi.
- a thin film pattern can be formed with a resolution of about 1700 dpi using the nozzle unit 40 for 1200 dpi.
- the period at which droplets are ejected for each nozzle hole 45 may also be a period equivalent to 1200 dpi. This period is longer than the period corresponding to the resolution of 1700 dpi of the actually formed thin film pattern.
- the discharge cycle is shortened, the supply of the liquid thin film material to the nozzle holes 45 tends to become unstable.
- the period for discharging droplets can be set to a period equivalent to 1200 dpi, so that a stable thin film pattern can be formed.
- the film thickness of the insulating film made of a thin film material can be doubled as compared with the case where a thin film pattern is formed with a resolution of 1200 dpi.
- the film thickness of the thin film pattern is halved as compared with the case where the nozzle unit for 1200 dpi is reciprocated and drawn at 2400 dpi.
- an increase in the film thickness of the thin film pattern can be suppressed.
- FIG. 14A shows the distribution of pixels on which droplets of the thin film material land when drawing is performed with the direction parallel to the direction in which the linear edge extends as the column and row direction.
- FIG. When a thin film pattern is formed by the method according to, the distribution of pixels on which droplets of the thin film material land is shown.
- the pitch of the pixels arranged in the direction parallel to the linear edge is equivalent to 1200 dpi.
- the pitch of the pixels arranged in the direction parallel to the linear edge is equivalent to about 1700 dpi.
- FIG. 15 is a bottom view of the nozzle unit 40 used in the substrate manufacturing method according to the fourth embodiment.
- differences from the second embodiment will be described, and description of the same configuration will be omitted.
- nozzle rows 46a and 46b are formed in each of the nozzle heads 42A to 42D, but in the third embodiment, one nozzle row 46 is formed.
- the nozzle row 46 includes a plurality of nozzle holes 45 arranged in the Y direction at a pitch of 4P.
- the liquid droplets are landed on one straight line by shifting the discharge time from the two nozzle rows 46a and 46b.
- the nozzle holes in one nozzle head are used. From 45, the liquid droplets may be discharged simultaneously.
- the nozzle holes 45 of one nozzle head 42A, 42B, 42C or 42D are arranged at a pitch corresponding to 300 dpi, the resolution of about 1700 dpi is also obtained using the four nozzle heads 42A to 42D in the fourth embodiment.
- a thin film pattern can be formed.
- a resolution equivalent to about 1700 dpi is realized by using the nozzle unit 40 having a nozzle hole arrangement equivalent to 1200 dpi, but more generally, 2 1/2 of the resolution defined by the nozzle hole arrangement. It is possible to realize a double resolution.
- Example 5 Next, Example 5 will be described with reference to FIGS. 16A to 19B. Hereinafter, differences from the first embodiment will be described, and description of the same configuration will be omitted.
- FIG. 16A shows the relationship between the Y coordinate of the landing point of the droplet discharged from each nozzle hole 45 (FIG. 2A) and the discharge time.
- the horizontal axis in FIG. 16A represents elapsed time, and the vertical axis represents the position in the Y direction. While moving the stage 25 (FIG. 1) in the negative direction of the X axis, droplets are ejected from the nozzle holes 45.
- droplets are ejected from the nozzle rows 46a and 46b (FIG. 2B) of the nozzle head 42A, respectively. As a result, the droplets land on the landing points 47Aa and 47Ab.
- droplets are ejected from the nozzle rows 46a and 46b of the nozzle head 42B, respectively, and at time tCa and tCb, droplets are ejected from the nozzle rows 46a and 46b of the nozzle head 42C, respectively, at time tDa.
- TDb droplets are ejected from the nozzle rows 46a and 46b of the nozzle head 42D, respectively.
- the droplets land on the landing points 47Ba, 47Bb, 47Ca, 47Cb, 47Da, and 47Db.
- FIG. 16B shows a state where the landing points 47Aa to 47Db are arranged on one virtual straight line.
- the landing points 47Aa and 47Ab of the droplets discharged from the nozzle holes 45 of the nozzle head 42A are arranged at a pitch P in the Y direction.
- the landing points of the droplets discharged from the nozzle holes 45 of the other nozzle heads 42B to 42D are also arranged at a pitch P in the Y direction.
- the following effects can be obtained by making the droplet landing density different for each sub-region on the substrate and making the thickness of the thin film pattern different.
- electronic components 70 and 71 having different heights are soldered to lands in regions 80 and 81 of the substrate 50, respectively.
- the dimension of the electronic component 70 in the height direction is smaller than the dimension of the electronic component 71 in the height direction.
- the thin film pattern 53 formed in the region 80 is made thicker than the thin film pattern 53 formed in the region 81 in accordance with the difference in the dimension in the height direction between the electronic components 70 and 71. Accordingly, the heights of the upper surfaces of the electronic components 70 and 71 can be made uniform in a state where the connection portions (conductors) 70a and 71a of the electronic components 70 and 71 are soldered to the substrate 50 with the solders 70b and 71b, respectively. . Thus, the thickness including the substrate and the electronic component after mounting the electronic component can be made uniform.
- a recess is formed at the center of the bottom surface of the electronic component 76.
- a connection portion 76a is formed at the bottom of the recess.
- a region where no depression is formed in the bottom surface of the electronic component 76 is disposed on the thin film pattern 53, and the connection portion 76a and the land of the substrate 50 are electrically connected by the solder 76b. Connected to. It is necessary to raise the solder 76b on the land and make an electrical connection with the connection portion 76a.
- FIG. 24E shows a case where the thickness of the thin film pattern 53 is uniform.
- the solder 76b may flow out on the thin film pattern 53, and the connection reliability between the substrate 50 and the connection portion 76a may be insufficient.
- the quality of the board on which the electronic component is mounted can be improved by changing the film thickness of the solder resist for each sub-region on the board in accordance with the outer shape and dimensions of the electronic component.
- the control device 33 creates a landing pattern as shown in FIGS. 23A to 23D according to the required film thickness of the thin film pattern, and selectively causes droplets to land on the extracted landing target pixels.
- a landing pattern associated with the film thickness may be stored in the storage device 34.
- the control device 33 selects one landing pattern corresponding to the required film thickness from the plurality of stored landing patterns. Further, the control device 33 extracts the landing target pixels based on the selected landing pattern and the image data of the thin film pattern.
- the landing pattern stored in the storage device 34 may be image data indicating the distribution of the landing target pixels as shown in FIGS. 23A to 23D, or numerical data corresponding to them.
- the reference for extracting the landing target pixel from the pixels in one sub-region where the thickness of the thin film pattern is uniform is defined as follows.
- the control device 33 controls the nozzle unit 40 (FIG. 1) so that the droplets land on the landing target pixels.
- the pixels constituting the image data used in Example 8 are arranged in a row direction and a column direction orthogonal to each other.
- the image data may be composed of a plurality of pixels arranged along a first direction and a second direction intersecting therewith.
- the pixel arrangement may be a square lattice or a triangular lattice.
- Example 9 With reference to FIGS. 25A to 28B, a substrate manufacturing method according to the ninth embodiment will be described. Hereinafter, differences from the first embodiment will be described, and description of the same configuration will be omitted.
- the surface density of the landing target pixels is set to the first surface density, and the solid region and the thin film material are not attached.
- the surface density of the landing target pixel is set to a second surface density higher than the first surface density.
- the pixels on which the liquid droplets have landed when the first and second scans are completed are shown in black.
- the pixel 60g at the position where the even-numbered column Ce and the odd-numbered row Ro intersect, and the pixel 60h at the position where the odd-numbered column Co and the even-numbered row Re intersect In either the first scan or the second scan, the target is not selected. For this reason, pixels on which the thin film material has landed in the solid region are distributed in a checkered pattern.
- the boundary region 63 the droplets land on all the pixels. The size of the area covering the substrate surface one droplet landed is spread in the in-plane direction is greater than the pitch P 300/8 pixels. For this reason, in FIG. 26, the entire region indicated by the checkerboard pattern and the boundary region 63 are covered with the thin film material.
- the nozzle hole for landing the droplet on the pixel in the boundary region 63 has a frequency twice as high as that of the nozzle hole for landing the droplet on the pixel in the solid region in both the first scan and the second scan.
- the resolution in the scanning direction (X direction) is set to 2400 dpi.
- the outline of the thin film pattern can be smoothed.
- the boundary region 63 is as smooth as in the case of forming the thin film pattern with a resolution of 2400 dpi in both directions in the X direction and the Y direction. You can get it.
- the average film thickness of the thin film pattern is about the same as the average film thickness when the entire thin film pattern is formed at a resolution of 1200 dpi, and the film thickness of the thin film pattern formed at 2400 dpi by reciprocating scanning a nozzle unit for 1200 dpi. It becomes about 1/2.
- the landing pattern of the solid area is a checkered pattern, but the droplet may be landed with an arbitrary landing pattern.
- FIG. 27A and 27B are cross-sectional views of a part (opening and the vicinity thereof) of the substrate 50 on which the thin film pattern 61 is formed.
- FIG. 27A shows the substrate 50 on which the droplets of the thin film material are landed with the droplet landing density in the region where the thin film material is to be applied constant regardless of the position on the substrate 50.
- FIG. 27B shows a substrate 50 on which droplets of a thin film material have been landed using the method according to Example 9.
- FIG. 28A shows the relationship between the planar shape of the thin film pattern defined by the image data and the solid area and boundary area for extracting the landing target pixel.
- An opening 64 is defined in the surface of the substrate 50.
- a thin film material is applied to the outside of the opening 64.
- An annular boundary region 63 is defined so as to surround the opening 64.
- An offset region 66 is defined between the inner peripheral edge of the boundary region 63 and the opening 64. In other words, the inner peripheral edge of the boundary region 63 recedes from the outer peripheral line of the opening 64 and does not coincide with the outer peripheral line of the opening 64.
- a solid area 65 is arranged outside the boundary area 63. As shown in FIG.
- FIG. 28B shows a cross-sectional view taken along one-dot chain line 28B-28B in FIG. 28A.
- the offset region 66 is covered with the thin film material by spreading in the in-plane direction.
- the thin film material can be prevented from entering the opening 64 by arranging the offset region 66. Thereby, a thin film pattern having an opening 64 having a target size can be formed.
- Example 10 A substrate manufacturing method according to the tenth embodiment will be described with reference to FIGS. 29A to 30. FIG. Hereinafter, differences from the first embodiment will be described, and description of the same configuration will be omitted.
- the control device 33 uses the moving mechanism 21 (FIG. 1) based on the raster format image data stored in the storage device 34 (FIG. 1). 1) and by controlling the nozzle unit 40.
- a scan in which droplets are landed on the substrate 50 while moving the nozzle unit 40 relative to the substrate 50 (FIG. 4A) in a direction parallel to the X axis is performed in the Y direction.
- a droplet is landed on the pixel row 60A corresponding to the nozzle hole 45.
- the pixel row 60A forms a straight line that is long in the X direction. Since the pixel pitch (distance between the centers of adjacent pixels) is P / 2 and the pitch of the nozzle holes 45 is P, the pixel row 60A on which the droplets land has an interval of one pixel in the Y direction. Spaced apart.
- the pixel column 60A corresponds to, for example, an odd-numbered column.
- a droplet lands on each pixel of the pixel row 60 ⁇ / b> A corresponding to the normal nozzle hole 45. A droplet does not land on the pixel row 60AF corresponding to the failed nozzle hole 45F.
- the second scan is performed with the nozzle unit 40 moved in the negative direction of the Y axis with respect to the substrate 50 by a distance corresponding to 3/2 times the pixel pitch, that is, (3/2) P. . Thereby, a droplet can be made to land on the pixel row 60B between the pixel rows 60A.
- the pixel column 60B corresponds to, for example, an even-numbered column.
- the droplets land on the pixel row 60B on both sides of the pixel row 60AF where the droplets did not land on the first scan in the second scan.
- This droplet spreads to the region of the pixel row 60AF, so that the region corresponding to the pixel row 60AF is covered with the thin film material 67BS.
- the region corresponding to the pixel row 60BF where the droplets have not landed in the second scan is covered with the thin film material 67AS that has landed on both adjacent pixel rows 60A by the first scan.
- the spread of the thin film material from the surrounding pixels becomes insufficient, and the surface of the substrate 50 in the region corresponding to the pixel rows 60AF and 60BF cannot be covered with the thin film material, or the thin film pattern in the region is not covered. getting thin. For this reason, the linear defect pattern with insufficient application
- a droplet in one scan, a droplet lands on a pixel row arranged at an interval of one pixel in the Y direction.
- Two pixel rows on which droplets ejected from the same nozzle hole land in the first scan and the second scan are arranged in the Y direction with an interval of two pixels. For this reason, even when the nozzle hole is out of order, it is possible to suppress the occurrence of application failure that is visually recognized by the naked eye.
- two pixel rows on which droplets discharged from the same nozzle hole land are arranged with an interval of three pixels or more. Also good.
- Example 11 With reference to FIG. 31, the thin film formation method by Example 11 is demonstrated.
- the upper part of FIG. 31 shows the relative positional relationship between the pixels 60 and the nozzle holes 45, and the lower part shows the positional relation between the nozzle unit 40 and the region where the droplets land in one scan of the substrate 50.
- the pixels 60 are arranged in the X direction and the Y direction.
- the pitch of the nozzle holes 45 is P
- the number of nozzle holes 45 is N.
- the distance between the centers of the pixels 60 in the Y direction is 1 ⁇ 2 of the pitch P of the nozzle holes 45.
- droplets can be landed on the odd-numbered pixel row 60A.
- the region 68 having the width N ⁇ P is referred to as a unit scanning region 68.
- the surface of the substrate 50 is divided into a plurality of unit scanning regions 68A.
- This unit scan area 68A is referred to as a unit scan area 68A of the scan area group A.
- the position of the boundary line is changed to divide the surface of the substrate 50 into a plurality of unit scanning regions 68B.
- This unit scan area 68B is referred to as a unit scan area 68B of the scan area group B.
- the width of the unit scan regions 68 at both ends of one scan region group may be narrower than N ⁇ P.
- the scanning of the two unit scanning areas 68A adjacent to each other in the scanning area group A is performed with the nozzle unit 40 shifted by N ⁇ P in the Y direction. Thereby, all the unit scan areas 68A of the scan area group A are scanned, and droplets can be landed on all odd-numbered pixel columns 60A.
- the scanning of the two unit scanning regions 68B adjacent to each other in the scanning region group B is performed in a state where the nozzle unit 40 is shifted by N ⁇ P in the Y direction. As a result, all the unit scan regions 68B of the scan region group B are scanned, and droplets can be landed on all odd-numbered pixel columns 60B.
- the order of scanning the unit scanning area 68 is arbitrary. For example, after all the unit scan areas 68A of the scan area group A are scanned, the unit scan areas 68B of the scan area group B may be scanned, or in order from one end in the Y direction to the other end. The unit scanning area 68 may be scanned. In this case, scanning of the unit scanning area 68A of the scanning area group A and scanning of the unit scanning area 68B of the scanning area group B are performed alternately.
- Example 11 a thin film forming method according to a modification of Example 11 will be described.
- the distance between the centers of the pixels in the Y direction is P / 3.
- the number of nozzle holes 45 is N, and the pitch of the nozzle holes is P.
- a droplet can be landed on the unit scan region 68 having a width of N ⁇ P in one scan.
- the two unit scan areas 68 of the scan area groups A and B are defined.
- the unit scan areas 68 of the three scan area groups of the scan area groups A, B, and C are defined. Define.
- the scan of the unit scan area 68A of the scan area group A and the scan of the unit scan area 68C of the scan area group C that partially overlaps the nozzle unit 40 are N1 ⁇ P ⁇ (1/3) P in the Y direction. It is done in a shifted state.
- N1 is a positive integer that satisfies N1 ⁇ P ⁇ (1/3) P ⁇ (4/3) P
- N2 is N2 ⁇ P ⁇ (1/3) P ⁇ (4/3) ) A positive integer satisfying P.
- the nozzle holes 45 are distributed with a pitch P in the Y direction, and the distance between the centers of the pixels 60 adjacent in the Y direction is (1 / M) of the pitch P.
- M is a positive integer.
- the pixel columns arranged in the X direction are extracted every M columns to define M pixel column groups as one pixel column group (for example, a plurality of pixel columns A).
- the pixel row group and the scanning region group are associated with each other one to one.
- a pixel column group composed of a plurality of pixel columns 60A is associated with the scanning region group A
- a pixel column group composed of a plurality of pixel columns 60B is associated with the scanning region group B.
- a droplet is landed on a pixel column group (for example, a pixel column group composed of a plurality of pixel columns 60A) associated with the unit scanning region.
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Abstract
Description
下地基板の表面の、着弾対象ピクセルに対応する位置に光硬化性の薄膜材料の液滴を着弾させる工程と、
前記下地基板に着弾した前記薄膜材料を、光照射によって硬化させる工程と
を繰り返すことにより、前記薄膜材料からなる薄膜パターンを形成する基板製造方法であって、
前記薄膜パターンの平面形状が、2次元的に分布する複数のピクセルで構成される画像データで定義されており、前記着弾対象ピクセルは、前記下地基板の表面のうち、前記薄膜材料で塗り潰すべきベタ領域内の前記複数のピクセルから抽出された一部のピクセルであり、
前記着弾対象ピクセルに対応する位置に着弾した前記薄膜材料が、前記着弾対象ピクセルとして抽出されなかったピクセルに対応する領域まで面内方向に広がった後に、前記薄膜材料を硬化させることにより、前記ベタ領域の全域を覆い、厚さを有する前記薄膜パターンを形成する基板製造方法が提供される。
下地基板を保持するステージと、
前記ステージに保持された下地基板に対向し、光硬化性の薄膜材料の液滴を前記下地基板に向けて吐出する複数のノズル孔が設けられたノズルユニットと、
前記ステージ及びに前記ノズルユニットの一方を他方に対して、前記下地基板の表面に平行な方向に移動させる移動機構と、
前記ステージに保持された下地基板の表面に、前記薄膜材料を硬化させる光を照射する光源と、
前記ノズルユニット及び前記移動機構を制御する制御装置と
を有し、
前記制御装置は、
前記下地基板に形成すべき薄膜パターンの平面形状を、2次元的に分布する複数のピクセルで構成される画像データとして記憶しており、
前記薄膜パターンを形成する薄膜材料で塗り潰されるベタ領域内の前記複数のピクセルから、薄膜材料の液滴を着弾させるべき一部のピクセルである着弾対象ピクセルを抽出し、
前記下地基板の表面のうち、前記着弾対象ピクセルに対応する着弾位置に薄膜材料の液滴が着弾し、着弾した液滴が前記光源から照射される光によって硬化するように、前記ノズルユニット及び前記移動機構を制御し、
前記着弾対象ピクセルは、前記着弾位置に着弾した薄膜材料が、着弾対象ピクセルとして抽出されなかったピクセルに対応する位置まで面内方向に広がって前記ベタ領域の全域を覆うように前記着弾対象ピクセルを抽出する基板製造装置が提供される。
図1に、実施例1による基板製造装置の概略図を示す。定盤20の上に、移動機構21によりステージ25が支持されている。移動機構21は、X移動機構22、Y移動機構23、及びθ回転機構24を含む。水平面をXY面とし、鉛直方向をZ軸とするXYZ直交座標系を定義する。X移動機構22は、Y移動機構23をX方向に移動させる。Y移動機構23は、θ回転機構24をY方向に移動させる。θ回転機構24は、Z軸に平行な軸を回転中心として、ステージ25の回転方向の姿勢を変化させる。ステージ25は、薄膜形成対象である下地基板50を保持する。ステージ25には、例えば真空チャックが用いられる。下地基板50は、例えばプリント基板である。以下、ソルダーレジスト等の薄膜パターンを形成する前の下地基板50を、単に「基板」という。
次に、実施例2による基板製造装置及び基板製造方法について説明する。以下、実施例1との相違点について説明し、同一の構成については説明を省略する。実施例2では、図6に示した円形の開口部を含む薄膜パターンを形成する例について説明する。
図14A及び図14Bを参照して、実施例3による基板製造方法について説明する。以下、実施例2との相違点について説明し、同一の構成については説明を省略する。
図15に、実施例4による基板製造方法で用いられるノズルユニット40の底面図を示す。以下、実施例2との相違点について説明し、同一の構成については説明を省略する。
次に、図16A~図19Bを参照して、実施例5について説明する。以下、実施例1との相違点について説明し、同一の構成については説明を省略する。
図20に、実施例6による基板製造装置のノズルヘッドの配置を示す。以下、実施例5との相違点について説明し、同一の構成については説明を省略する。
図21に、実施例7による基板製造装置のノズルヘッドの配置を示す。以下、実施例5との相違点について説明し、同一の構成については説明を省略する。
図22A~図24Eを参照して、実施例8による基板製造方法について説明する。以下、実施例1との相違点について説明し、同一の構成については説明を省略する。
図25A~図28Bを参照して、実施例9による基板製造方法について説明する。以下、実施例1との相違点について説明し、同一の構成については説明を省略する。
図28Aに、画像データで定義された薄膜パターンの平面形状と、着弾対象ピクセルを抽出するためのベタ領域及び境界領域との関係を示す。基板50の表面に開口部64が画定されている。開口部64の外側に、薄膜材料が塗布される。開口部64を取り囲むように、環状の境界領域63が画定されている。境界領域63の内周側の縁と、開口部64との間に、オフセット領域66が画定される。すなわち、境界領域63の内周側の縁は、開口部64の外周線から後退しており、開口部64の外周線とは一致しない。境界領域63よりも外側にベタ領域65が配置される。図26に示したように、境界領域63内の着弾対象ピクセルの面密度は、ベタ領域65内の着弾対象ピクセルの面密度よりも高い。オフセット領域66内のピクセルからは、着弾対象ピクセルが抽出されない。すなわち、オフセット領域66内のピクセルには、液滴が着弾しない。
図29A~図30を参照して、実施例10による基板製造方法について説明する。以下、実施例1との相違点について説明し、同一の構成については説明を省略する。
図31を参照して、実施例11による薄膜形成方法について説明する。図31の上段に、ピクセル60とノズル孔45との相対位置関係を示し、下段に、基板50の1回の走査で液滴が着弾する領域と、ノズルユニット40との位置関係を示す。
21 移動機構
22 X移動機構
23 Y移動機構
24 θ回転機構
25 ステージ
30 支柱
31 梁
32 撮像装置
33 制御装置
35 入力装置
40 ノズルユニット
41 支持部材(ノズルホルダ)
42A~42D ノズルヘッド
43 光源
43A 発光ダイオード
43B シリンドリカルレンズ
45 ノズル孔
46、46a、46b ノズル列
48A~48D ノズルヘッドに対向する領域
50 基板
51 液滴
52 滲み
53 薄膜パターン
55A~55D ノズル孔の像
56 X軸に垂直な仮想平面
58 薄膜材料を付着させる領域
60 ピクセル
60a、60b 着弾対象ピクセル
60c、60d 着弾対象として選択されないピクセル
60A、60B ピクセル列
61 薄膜パターン
62 開口部を取り囲む円周
63 境界領域
64 開口部
65 ベタ領域
66 オフセット領域
67A、67B 薄膜材料
68 単位走査領域
70、71、72、73、74、76 電子部品
70a、71a、72a1、72a2、73a、74a、76a 接続部分
70b、71b、72b1、72b2、73b、74b、76b はんだ
72A1、72A2 電子部品の下面
75 導線
80、81 基板の面内の領域
Claims (19)
- 下地基板の表面の、着弾対象ピクセルに対応する位置に光硬化性の薄膜材料の液滴を着弾させる工程と、
前記下地基板に着弾した前記薄膜材料を、光照射によって硬化させる工程と
を繰り返すことにより、前記薄膜材料からなる薄膜パターンを形成する基板製造方法であって、
前記薄膜パターンの平面形状が、2次元的に分布する複数のピクセルで構成される画像データで定義されており、前記着弾対象ピクセルは、前記下地基板の表面のうち、前記薄膜材料で塗り潰すべきベタ領域内の前記複数のピクセルから抽出された一部のピクセルであり、
前記着弾対象ピクセルに対応する位置に着弾した前記薄膜材料が、前記着弾対象ピクセルとして抽出されなかったピクセルに対応する領域まで面内方向に広がった後に、前記薄膜材料を硬化させることにより、前記ベタ領域の全域を覆い、ある厚さを有する前記薄膜パターンを形成する基板製造方法。 - 前記薄膜材料の液滴を着弾させる工程の前に、形成すべき前記薄膜パターンの厚さに応じて、前記ベタ領域内における前記着弾対象ピクセルの面密度を選定して前記着弾対象ピクセルを抽出する工程を、さらに有する請求項1に記載の基板製造方法。
- 前記ベタ領域内に、複数のサブ領域が画定されており、前記サブ領域ごとに、前記着弾対象ピクセルの面密度が選定されている請求項1または2に記載の基板製造方法。
- 前記複数のピクセルが行列状に配置されており、形成すべき前記薄膜パターンの目標解像度に応じて、前記着弾対象ピクセルを抽出する請求項1乃至3のいずれか1項に記載の基板製造方法。
- 前記複数のピクセルが行列状に配置されており、前記着弾対象ピクセルは、市松模様を構成するように、前記複数のピクセルから抽出されており、
前記着弾対象ピクセルに対応する位置に薄膜材料の液滴を着弾させる工程において、
前記下地基板を、複数のノズル孔を有するノズルユニットに対向させ、前記ノズルユニットに対して前記下地基板を列方向に移動させながら、1つおきに選択された列に含まれる前記着弾対象ピクセルに対応する位置に薄膜材料の液滴を着弾させる第1の走査を行う工程と、
前記第1の走査を行った後、前記ノズルユニットに対して前記下地基板を列方向に移動させながら、前記第1の走査で選択されなかった列に含まれる前記着弾対象ピクセルに対応する位置に、薄膜材料の液滴を着弾させる第2の走査を行う工程と
を有する請求項1乃至4のいずれか1項に記載の基板製造方法。 - 前記薄膜パターンを形成する工程が、
前記ベタ領域内の仮想直線に沿って、第1の群の着弾対象ピクセル、第2の群の着弾対象ピクセル、第3の群の着弾対象ピクセル、第4の群の着弾対象ピクセルがこの順番に繰返し現れるように、仮想直線に沿う複数の着弾対象ピクセルを前記第1~第4の群に分類したとき、第1の群の前記着弾対象ピクセルに薄膜材料の液滴を着弾させ、着弾した薄膜材料に光を照射して硬化させる工程と、
前記第1の群の着弾対象ピクセルに着弾した薄膜材料が硬化した後、前記第3の群の前記着弾対象ピクセルに薄膜材料の液滴を着弾させ、着弾した薄膜材料に光を照射して硬化させる工程と、
前記第3の群の着弾対象ピクセルに着弾した薄膜材料が硬化した後、前記第2の群の前記着弾対象ピクセルに薄膜材料の液滴を着弾させ、着弾した薄膜材料に光を照射して硬化させる工程と、
前記第2の群の着弾対象ピクセルに着弾した薄膜材料が硬化した後、前記第4の群の前記着弾対象ピクセルに薄膜材料の液滴を着弾させ、着弾した薄膜材料に光を照射して硬化させる工程と
を含む請求項1乃至5のいずれか1項に記載の基板製造方法。 - 前記ベタ領域と、前記薄膜材料を付着させない領域との境界線に対応する境界領域内の着弾対象ピクセルの面密度が、前記ベタ領域内の着弾対象ピクセルの面密度よりも高くなるように、前記着弾対象ピクセルが抽出されている請求項1乃至6のいずれか1項に記載の基板製造方法。
- 前記境界領域は、前記画像データで定義された境界線よりも前記ベタ領域側に後退した位置に画定され、前記境界領域と前記境界線との間のオフセット領域内のピクセルには薄膜材料の液滴を着弾させず、前記着弾対象ピクセルに着弾した薄膜材料が面内方向に広がることによって前記オフセット領域が薄膜材料で覆われる請求項7に記載の基板製造方法。
- 前記複数のピクセルは行列状に配置されており、
前記薄膜パターンを形成する工程において、行方向に配列した複数のノズル孔を有するノズルユニットを、前記下地基板に対して相対的に列方向に移動させながら、前記ノズル孔から薄膜材料の液滴を吐出することにより、前記着弾対象ピクセルに対応する位置に薄膜材料を着弾させる走査を複数回繰り返し、
ある走査による複数のノズル孔の軌跡と、他の走査による前記複数のノズル孔の軌跡とが、交互に嵌合するように前記下地基板に対して前記ノズルユニットを行方向にずらして前記複数回の走査を行い、
行方向へのずらし量は、前記ノズル孔の行方向のピッチの3/2倍以上である請求項1乃至8のいずれか1項に記載の基板製造方法。 - 前記下地基板に着弾した薄膜材料の液滴の高さの目標値に応じて、前記薄膜材料の液滴が前記下地基板に着弾してから、前記下地基板に着弾した前記薄膜材料を、光照射によって硬化させるまでの時間が選択されている請求項1乃至9のいずれか1項に記載の基板製造方法。
- 下地基板を保持するステージと、
前記ステージに保持された下地基板に対向し、光硬化性の薄膜材料の液滴を前記下地基板に向けて吐出する複数のノズル孔が設けられたノズルユニットと、
前記ステージ及びに前記ノズルユニットの一方を他方に対して、前記下地基板の表面に平行な方向に移動させる移動機構と、
前記ステージに保持された下地基板の表面に、前記薄膜材料を硬化させる光を照射する光源と、
前記ノズルユニット及び前記移動機構を制御する制御装置と
を有し、
前記制御装置は、
前記下地基板に形成すべき薄膜パターンの平面形状を、2次元的に分布する複数のピクセルで構成される画像データとして記憶しており、
前記薄膜パターンを形成する薄膜材料で塗り潰されるベタ領域内の前記複数のピクセルから、薄膜材料の液滴を着弾させるべき一部のピクセルである着弾対象ピクセルを抽出し、
前記下地基板の表面のうち、前記着弾対象ピクセルに対応する着弾位置に薄膜材料の液滴が着弾し、着弾した液滴が前記光源から照射される光によって硬化するように、前記ノズルユニット及び前記移動機構を制御し、
前記着弾対象ピクセルは、前記着弾位置に着弾した薄膜材料が、着弾対象ピクセルとして抽出されなかったピクセルに対応する位置まで面内方向に広がって前記ベタ領域の全域を覆うように前記着弾対象ピクセルを抽出する基板製造装置。 - 前記制御装置は、前記下地基板に形成すべき薄膜パターンの厚さを記憶しており、形成すべき薄膜パターンの厚さに応じて、前記ベタ領域内における前記着弾対象ピクセルの面密度を選定する請求項11に記載の基板製造装置。
- 前記ベタ領域内に、複数のサブ領域が画定されており、前記制御装置は、前記サブ領域ごとに、前記着弾対象ピクセルの面密度を選定する請求項11または12に記載の基板製造装置。
- 前記複数のピクセルが行列状に配置されており、前記制御装置は、形成すべき前記薄膜パターンの目標解像度に応じて、前記着弾対象ピクセルを抽出する請求項11乃至13のいずれか1項に記載の基板製造装置。
- 前記複数のピクセルが行列状に配置されており、
前記制御装置は、前記着弾対象ピクセルを抽出する際に、前記着弾対象ピクセルが市松模様を構成するように、前記複数のピクセルから前記着弾対象ピクセルを抽出し、
前記ノズルユニット及び前記下地基板の一方を他方に対して列方向に移動させながら、1つおきに選択された列に含まれる前記着弾対象ピクセルに対応する位置に薄膜材料の液滴を着弾させる第1の走査を行い、
前記第1の走査を行った後、前記ノズルユニット及び前記下地基板の一方を他方に対して列方向に移動させながら、前記第1の走査で選択されなかった列に含まれる前記着弾対象ピクセルに対応する位置に、薄膜材料の液滴を着弾させる第2の走査を行う請求項11乃至14のいずれか1項に記載の基板製造装置。 - 前記薄膜パターンを形成するときに、
前記ベタ領域内の仮想直線に沿って、第1の群の着弾対象ピクセル、第2の群の着弾対象ピクセル、第3の群の着弾対象ピクセル、第4の群の着弾対象ピクセルがこの順番に繰返し現れるように、仮想直線に沿う複数の着弾対象ピクセルを前記第1~第4の群に分類したとき、第1の群の前記着弾対象ピクセルに薄膜材料の液滴が着弾し、着弾した薄膜材料に光が照射されて硬化し、
前記第1の群の着弾対象ピクセルに着弾した薄膜材料が硬化した後、前記第3の群の前記着弾対象ピクセルに薄膜材料の液滴が着弾し、着弾した薄膜材料に光が照射されて硬化し、
前記第3の群の着弾対象ピクセルに着弾した薄膜材料が硬化した後、前記第2の群の前記着弾対象ピクセルに薄膜材料の液滴が着弾し、着弾した薄膜材料に光が照射されて硬化し、
前記第2の群の着弾対象ピクセルに着弾した薄膜材料が硬化した後、前記第4の群の前記着弾対象ピクセルに薄膜材料の液滴が着弾し、着弾した薄膜材料に光が照射されて硬化するように、前記制御装置が前記移動機構及び前記ノズルユニットを制御する請求項11乃至15のいずれか1項に記載の基板製造装置。 - 前記着弾対象ピクセルを抽出する際に、前記制御装置は、前記ベタ領域と、前記薄膜材料を付着させない領域との境界線に対応する境界領域内の着弾対象ピクセルの面密度が、前記ベタ領域内の着弾対象ピクセルの面密度よりも高くなるように、前記着弾対象ピクセルを抽出する請求項11乃至16のいずれか1項に記載の基板製造装置。
- 前記制御装置は、前記画像データで定義された境界線よりも前記ベタ領域側に後退した位置に前記境界領域を画定し、前記境界領域と前記境界線との間のピクセルに対応する領域は、前記着弾対象ピクセルに着弾した薄膜材料が面内方向に広がることによって薄膜材料で覆われるように、前記制御装置に後退量が記憶されている請求項17に記載の基板製造装置。
- 前記複数のピクセルは行列状に配置されており、
前記ノズルユニットは、行方向に配列した複数のノズル孔を有し、
前記制御装置は、
前記ノズルユニットを前記下地基板に対して相対的に列方向に移動させながら、前記ノズル孔から薄膜材料の液滴を吐出させることにより、前記着弾対象ピクセルに対応する位置に薄膜材料を着弾させる走査が複数回繰り返され、
ある走査による複数のノズル孔の軌跡の一部と、他の走査による前記複数のノズル孔の軌跡の一部とが、交互に配置されるように前記下地基板に対して前記ノズルユニットが行方向にずらされて前記複数回の走査が行われ、
行方向へのずらし量は、前記ノズル孔の行方向のピッチの3/2倍以上になるように前記ノズルユニット及び前記移動機構を制御する請求項11乃至18のいずれか1項に記載の基板製造装置。
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Also Published As
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JPWO2013008590A1 (ja) | 2015-02-23 |
CN103688602B (zh) | 2016-10-26 |
JP5638137B2 (ja) | 2014-12-10 |
KR101497563B1 (ko) | 2015-03-02 |
CN103688602A (zh) | 2014-03-26 |
KR20140024934A (ko) | 2014-03-03 |
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