WO2012063764A1 - 封止フィルムの製造方法および封止フィルム - Google Patents
封止フィルムの製造方法および封止フィルム Download PDFInfo
- Publication number
- WO2012063764A1 WO2012063764A1 PCT/JP2011/075560 JP2011075560W WO2012063764A1 WO 2012063764 A1 WO2012063764 A1 WO 2012063764A1 JP 2011075560 W JP2011075560 W JP 2011075560W WO 2012063764 A1 WO2012063764 A1 WO 2012063764A1
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- WIPO (PCT)
- Prior art keywords
- resin
- sealing film
- heat
- electrode
- layer
- Prior art date
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- 238000007789 sealing Methods 0.000 title claims abstract description 149
- 238000000034 method Methods 0.000 title claims abstract description 43
- 229920005989 resin Polymers 0.000 claims abstract description 219
- 239000011347 resin Substances 0.000 claims abstract description 219
- 239000010410 layer Substances 0.000 claims abstract description 109
- 239000012790 adhesive layer Substances 0.000 claims abstract description 48
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 26
- 229920005672 polyolefin resin Polymers 0.000 claims abstract description 26
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims abstract description 19
- 125000000524 functional group Chemical group 0.000 claims abstract description 19
- 238000004898 kneading Methods 0.000 claims abstract description 17
- 238000010030 laminating Methods 0.000 claims abstract description 15
- 239000000565 sealant Substances 0.000 claims description 46
- 238000002844 melting Methods 0.000 claims description 34
- 230000008018 melting Effects 0.000 claims description 34
- 239000004743 Polypropylene Substances 0.000 claims description 27
- 229920001155 polypropylene Polymers 0.000 claims description 27
- 238000004519 manufacturing process Methods 0.000 claims description 21
- -1 polypropylene Polymers 0.000 claims description 20
- 238000003475 lamination Methods 0.000 claims description 13
- 125000003277 amino group Chemical group 0.000 claims description 11
- 125000003700 epoxy group Chemical group 0.000 claims description 9
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 7
- 238000010559 graft polymerization reaction Methods 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- 238000010248 power generation Methods 0.000 claims description 6
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 abstract description 4
- 239000000155 melt Substances 0.000 abstract description 4
- 239000005001 laminate film Substances 0.000 description 26
- 229920000098 polyolefin Polymers 0.000 description 21
- 239000011888 foil Substances 0.000 description 18
- 238000003466 welding Methods 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 15
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- 238000001125 extrusion Methods 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
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- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 10
- 239000005977 Ethylene Substances 0.000 description 10
- 239000004952 Polyamide Substances 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 9
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- 238000010894 electron beam technology Methods 0.000 description 7
- 238000009413 insulation Methods 0.000 description 7
- 229920013716 polyethylene resin Polymers 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
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- 239000002313 adhesive film Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 229920000573 polyethylene Polymers 0.000 description 5
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 5
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 5
- 229920005604 random copolymer Polymers 0.000 description 5
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229920001400 block copolymer Polymers 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- 239000008151 electrolyte solution Substances 0.000 description 4
- 229920001519 homopolymer Polymers 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 239000004745 nonwoven fabric Substances 0.000 description 4
- 239000002759 woven fabric Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 239000004699 Ultra-high molecular weight polyethylene Substances 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- 150000001735 carboxylic acids Chemical class 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 239000004715 ethylene vinyl alcohol Substances 0.000 description 3
- 229920005674 ethylene-propylene random copolymer Polymers 0.000 description 3
- 229920000578 graft copolymer Polymers 0.000 description 3
- 229920001684 low density polyethylene Polymers 0.000 description 3
- 239000004702 low-density polyethylene Substances 0.000 description 3
- 150000001451 organic peroxides Chemical class 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- 229920000785 ultra high molecular weight polyethylene Polymers 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
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- 238000004040 coloring Methods 0.000 description 2
- 238000009820 dry lamination Methods 0.000 description 2
- 229920005676 ethylene-propylene block copolymer Polymers 0.000 description 2
- 229920000554 ionomer Polymers 0.000 description 2
- 229920000092 linear low density polyethylene Polymers 0.000 description 2
- 239000004707 linear low-density polyethylene Substances 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004711 α-olefin Substances 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- 239000004594 Masterbatch (MB) Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
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- 238000003490 calendering Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
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- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
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- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 125000002485 formyl group Chemical group [H]C(*)=O 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- CUPFNGOKRMWUOO-UHFFFAOYSA-N hydron;difluoride Chemical compound F.F CUPFNGOKRMWUOO-UHFFFAOYSA-N 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
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- 229910052742 iron Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
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- 239000007870 radical polymerization initiator Substances 0.000 description 1
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- 239000010935 stainless steel Substances 0.000 description 1
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- 238000004381 surface treatment Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
- H01G11/78—Cases; Housings; Encapsulations; Mountings
- H01G11/80—Gaskets; Sealings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/183—Sealing members
- H01M50/186—Sealing members characterised by the disposition of the sealing members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
- H01G11/74—Terminals, e.g. extensions of current collectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/183—Sealing members
- H01M50/19—Sealing members characterised by the material
- H01M50/193—Organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/183—Sealing members
- H01M50/19—Sealing members characterised by the material
- H01M50/197—Sealing members characterised by the material having a layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2323/00—Polyalkenes
- B32B2323/04—Polyethylene
- B32B2323/043—HDPE, i.e. high density polyethylene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/16—Capacitors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/70—Energy storage systems for electromobility, e.g. batteries
Definitions
- the present invention relates to a method for producing a sealing film for sealing an electrode of a power generation element such as a secondary battery or a capacitor housed in a bag, and a sealing film.
- втори ⁇ ел ⁇ ество ⁇ олки ⁇ о ⁇ оловки ⁇ оло ⁇ оловки ⁇ о ⁇ ол ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ е ⁇ еловани ⁇ ⁇ ески ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇
- the resin should wrap around the electrode in the thickness direction without sealing. Is difficult, and a gap may occur around the electrode in the thickness direction. If there is a gap around the electrode, the sealing part may deteriorate or the adhesive strength between the bag body and the electrode in the sealing part may deteriorate under long-term use, severe environments such as high temperature and high humidity, etc. Thus, there is a possibility that the electrolyte solution leaks from the sealing portion. In recent years, for these problems, a method of heat-sealing with a film substrate of a bag body with a sealing film sandwiched between both front and back surfaces of an electrode has been used.
- Patent Document 1 discloses a laminated structure in which a heat seal portion of a terminal material is sandwiched between a heat-resistant film made of woven fabric, non-woven fabric, or ultrahigh molecular weight polyethylene with a heat-adhesive film.
- Patent Document 2 describes an adhesive film in which an electron beam cross-linked polyolefin layer and an acid-modified polyolefin layer are laminated.
- Patent Document 1 Since the coating material described in Patent Document 1 ensures heat resistance with a woven or non-woven fabric, it is necessary to select a material that is difficult to melt as a woven or non-woven fabric. However, since woven fabrics and nonwoven fabrics do not melt, it is difficult to laminate them with a heat-adhesive film with high adhesion. Therefore, pinholes are easily formed, and sealing performance may not be improved. In some cases, the sealability is rather reduced. Ultra high molecular weight polyethylene is difficult to obtain and is disadvantageous in terms of cost. Ultra high molecular weight polyethylene cannot be laminated with a heat-adhesive film made of polypropylene resin. Therefore, polypropylene resin cannot be used for the sealant of the bag body, and it is difficult to increase the heat resistance of the bag body.
- the adhesive film described in Patent Document 2 is excellent in heat resistance.
- the polyolefin film is cross-linked in advance with an electron beam and the acid-modified polyolefin layer is extrusion laminated, or the polyolefin layer and the acid-modified polyolefin layer are laminated by coextrusion and then cross-linked with the electron beam. Therefore, any method requires an electron beam crosslinking step.
- Paragraph 0013 of Patent Document 2 describes that a specific resin needs to be used because normal polypropylene is decomposed by electron beam irradiation.
- the acid-modified polyolefin is also crosslinked and the flexibility is lowered, so that the resin is wrapped around the electrode in the thickness direction without any gaps. It becomes difficult.
- the heat-resistant layer and the electrode adhesive layer can be easily wound around the electrode in the thickness direction by using an easily available material and in a simple process.
- a method for producing a sealing film that can be directly laminated with high adhesive strength and excellent in heat resistance and sealing properties, and a sealing film produced by this manufacturing method is provided.
- the inventor of the present invention reacted with a hydroxyl group, an amino group, an epoxy group, etc., in the carboxyl group of an acid-modified polyolefin resin grafted with carboxylic acid during research on a sealing film excellent in heat resistance and sealing properties.
- denatured easily was acquired.
- the present invention has been made based on this finding.
- the manufacturing method of the following sealing films is provided.
- a heat-resistant layer film forming step for forming a heat-resistant layer by molding the resin C into a layer, and an adhesive layer film-forming step for forming an electrode adhesive layer for forming the carboxylic acid-modified polyolefin resin D into a layer and adhering to the electrode.
- a lamination step of directly laminating the heat-resistant layer and the electrode adhesive layer when either one or both of the resin C and the resin D are in a molten state.
- the following sealing films are provided.
- the resin B having a functional group capable of reacting with the resin B is melted and kneaded, whereby a heat-resistant layer made of the resin C modified by chemically bonding the carboxyl group of the resin A and the functional group of the resin B is A sealing film having a laminated structure directly laminated on an electrode adhesive layer made of acid-modified polyolefin resin D.
- the sealing film according to (8), wherein the resin B is one or more selected from resins having a hydroxyl group, an amino group, or an epoxy group.
- the resin A is an acid-modified polyolefin resin obtained by graft-polymerizing maleic anhydride to polypropylene.
- the carboxyl group of the resin A and the functional group of the resin B are chemically bonded to denature the resin C, so that a crosslinking step such as electron beam crosslinking is unnecessary. Therefore, heat resistance can be imparted to the heat-resistant layer by a simple process. Since both resin A and resin B are only melted and kneaded, they can be modified to resin C in a normal extruder used in the film forming process. In the present invention, the heat-resistant layer and the electrode adhesive layer are directly laminated when one or both of the resin C and the resin D are in a molten state.
- the lamination method one layer is formed by combining an extruder and a film forming die, and then the other layer is extrusion laminated.
- the heat-resistant layer and the electrode adhesive layer are coextruded.
- the heat-resistant layer and the electrode adhesive layer can be directly laminated with high adhesive strength by a simple process. Sealing films obtained by these methods are unlikely to melt or deform due to contact with a high-temperature seal bar or radiant heat during heat sealing. Thereby, a short circuit with an electrode and the metal foil of a bag body does not occur easily.
- the co-extrusion of the heat-resistant layer and the electrode adhesive layer can be directly laminated with higher adhesive strength by a simpler process.
- the sealing film of the present invention has a resin C having a low melt fluidity, in which the heat-resistant layer is modified by chemically bonding the carboxyl group of the resin A and the functional group of the resin B.
- the resin B is one or more selected from resins having a hydroxyl group, an amino group or an epoxy group, the carboxyl group of the resin A and the functional group of the resin B are easily chemically bonded, and the modification to the resin C is smooth. It is. Since resin A and resin B are melted and kneaded to be modified into resin C, the carboxyl group of resin A and the functional group of resin B are likely to be chemically bonded uniformly.
- the resin A is an acid-modified polyolefin resin obtained by graft polymerization of maleic anhydride on polypropylene
- the carboxyl group of the resin A and the functional group of the resin B are easily chemically bonded, and the modification to the resin C becomes smoother.
- the laminated structure of the sealing film is formed by co-extrusion of the resin C and the resin D
- the adhesive strength of the laminated structure is high, and the sealing film is not thermally deformed during heat sealing. Short circuit with metal foil hardly occurs.
- the sealant that is thermally welded to the innermost layer of the bag body is laminated on the heat resistant layer, the thermal welding strength of the innermost layer of the bag body and the sealing film can be increased. Further, when the sealant is directly laminated on the heat-resistant layer, it is possible to prevent the adhesion interface from being peeled off by the electrolytic solution.
- FIG. 1 It is sectional drawing which shows an example of the sealing film of this invention. It is sectional drawing which shows the state which joined the laminate film and electrode of the bag body using the sealing film shown in FIG. It is a perspective view which shows the electrode with the sealing film which adhere
- FIG. 1 is a cross-sectional view showing a schematic configuration of a sealing film 1 of the present invention.
- FIG. 2 is a cross-sectional view taken along the longitudinal direction of the electrode 11, showing a state in which the sealing film 1 shown in FIG. 1 is welded by being interposed between the laminate film 20 of the bag and the electrode 11.
- FIG. 3A is a perspective view showing an electrode 10 with a sealing film in which the sealing film 1 shown in FIG. 1 is bonded to an electrode 11.
- FIG. 3B is a cross-sectional view in a direction orthogonal to the longitudinal direction of the electrode 11 showing the electrode with sealing film 10.
- the sealing film 1 of this invention is inserted
- the basic layer structure of this film has a laminated structure comprising at least two layers in which an electrode adhesive layer 2 and a heat-resistant layer 3 are laminated.
- a heat-resistant layer 3 having a basic layer structure is directly laminated with a sealant 4 that is thermally welded to the innermost sealant 22 of the bag body.
- the thickness of the sealing film 1 of the present invention is preferably 50 ⁇ m to 300 ⁇ m. When the thickness of the sealing film 1 is smaller than this range, the insulating property may be lowered. In addition, the thickness of the sealing film 1 may be larger than this range. However, further improvement in insulation cannot be expected, and it becomes rather difficult to heat seal.
- the heat-resistant layer 3 is obtained by melting and kneading both the acid-modified polyolefin resin A in which carboxylic acid is graft-polymerized and the resin B having a functional group capable of reacting with the carboxyl group of the resin A, so that the carboxyl group of the resin A It consists of a resin C modified by chemically bonding with a functional group of the resin B.
- the blending ratio of the resin at this time is preferably 1 to 10% by weight of the resin B with respect to 99 to 90% by weight of the resin A. If the blending ratio of the resin B is lower than this range, the modification effect of the resin C is small, and the heat resistance of the sealing film 1 may be poor. If the blending ratio of the resin B is higher than this range, the heat resistant layer 3 tends to be brittle. For this reason, the heat-resistant layer 3 may be cracked by bending the electrode 11 when the battery pack is mounted.
- the heat-resistant layer 3 ensures insulation between the metal foil 21 of the laminate film 20 of the bag and the electrode 11.
- the heat-resistant layer 3 is preferably thin as long as it prevents thermal deformation of the sealing film 1 during heat welding and ensures insulation.
- the thickness of the heat-resistant layer 3 is preferably 30 ⁇ m to 150 ⁇ m. If the thickness of the heat-resistant layer 3 is less than 50 ⁇ m, the sealing film 1 may be thermally deformed or thinned during heat welding, resulting in poor insulation. In addition, the thickness of the heat-resistant layer 3 may exceed 150 ⁇ m. However, further improvement in insulation cannot be expected.
- the resin constituting the heat-resistant layer 3 is polymerized more than the resin A by the amount that the resin B is chemically bonded to the resin A, and is relatively hard and has low melt fluidity. Therefore, when the heat-resistant layer 3 becomes thicker than necessary, when the electrode 11 is sandwiched between the two sealing films 1 and 1, a gap created by a step due to the thickness of the electrode 11 is difficult to be filled at the time of heat welding. Thereby, a pinhole may generate
- the acid-modified polyolefin resin A is obtained by graft polymerization of an unsaturated carboxylic acid or a derivative thereof using, as a base resin, a polyolefin obtained by polymerizing one or more of alkylene monomers such as ethylene and propylene.
- a polyolefin obtained by polymerizing one or more of alkylene monomers such as ethylene and propylene.
- the polyolefin for example, homopolymers and copolymers of polypropylene and polyethylene are used.
- Copolymers include random copolymer (random PP) or block copolymer (block PP) of propylene and 1 to 5% by weight of ethylene, random or block copolymer of ethylene and 1 to 10% by weight of propylene.
- a copolymer, a copolymer of propylene or ethylene and an ⁇ -olefin having 1 to 10% by weight of 4 or more carbon atoms, a mixture thereof, or the like
- the melting point is about 130 to 140 ° C. It is preferable to use chain low density polyethylene or high density polyethylene.
- the base resin of the acid-modified polyolefin resin A has a melt flow rate (MFR) of 0.5 to 30 g / 10 minutes, particularly 5 to 15 g / 10 minutes of homopolypropylene and propylene-ethylene random copolymer, or MFR of 0. Polyethylene and ethylene- ⁇ olefin copolymers of 3 to 30 g / 10 min are preferably used.
- the MFR of the resin C forming the heat-resistant layer 3 is preferably in the range of 0.5 g / 10 min to 3 g / 10 min. If the MFR is smaller than this range, molding may be difficult. If the MFR is larger than this range, the heat resistance layer 3 may be deformed or thinned at the time of heat welding, and the insulation may be lowered.
- the heat-resistant layer 3 is required to be hardly melted or softened when the sealing film 1 of the present invention is thermally welded to the electrode 11. Accordingly, the melting point of the resin C forming this is preferably as high as possible.
- a resin having a melting point of 130 to 170 ° C. measured by JIS K6921-2 DSC method is preferable.
- an acid-modified polyolefin resin using a polypropylene (PP) homopolymer, a random copolymer or block copolymer of ethylene and propylene, or a polymer alloy thereof as a base resin Is preferably used.
- PP-based resins tend to be brittle under a low temperature environment.
- a block copolymer of ethylene and propylene is preferred because it has excellent flexibility even when the melting point is high and does not become brittle even in a low temperature environment (cold resistance).
- Examples of the unsaturated carboxylic acid graft-polymerized to the base resin of the acid-modified polyolefin resin A include acrylic acid, methacrylic acid, maleic acid, fumaric acid, itaconic acid, citraconic acid, their acid anhydrides, and esters thereof. , Amides, imides, metal salts and other derivatives. Of these unsaturated carboxylic acids, maleic acid is preferred, and maleic anhydride is most preferred.
- an organic peroxide such as benzoyl peroxide or lauroyl peroxide
- a radical polymerization initiator such as azobisisobutyronitrile
- the amount of the unsaturated carboxylic acid to be graft polymerized is usually 0.5 to 5% by weight based on the total weight of the monomers.
- the method of graft polymerization of unsaturated carboxylic acid to polyolefin includes, for example, a method of reacting polyolefin and unsaturated carboxylic acid in a molten state, a method of reacting in a solution state, a method of reacting in a slurry state, and a reaction in a gas phase state. There is a method to make it. Among these methods, the method of reacting in a molten state is preferable because the operation is easy.
- the polymerization initiators such as polyolefin, unsaturated carboxylic acid and organic peroxide shown above are sufficiently mixed with a tumbler, Henschel mixer or the like.
- the method for melt-kneading is not particularly limited, and can be performed using, for example, a screw extruder, a Banbury mixer, a mixing roll, or the like. Of these methods, a screw extruder is preferably used because of its simple operation.
- the screw extruder may be a single screw, twin screw or more multi-screw.
- the melt kneading temperature is preferably not lower than the melting point of the polyolefin used and not higher than the decomposition temperature of the organic peroxide used.
- the specific temperature and time are usually from 160 to 280 ° C. for 0.3 to 30 minutes, preferably from 170 to 250 ° C. for 1 to 10 minutes.
- the heat-resistant layer 3 that gives heat resistance to the sealing film is formed by forming a resin C obtained by melting and kneading the resin B in the acid-modified polyolefin resin A into a layer.
- the method for forming the heat-resistant layer 3 include a calendering method in which the resin C is rolled between a plurality of rolls, and an extrusion method in which the molten resin C is extruded with a T die or a ring die.
- the extrusion method is preferable because the melted and kneaded resin C can be extruded as it is with an extruder used in the modification step.
- the polyolefin and the unsaturated carboxylic acid are charged into an extruder and melt-kneaded to modify the acid-modified polyolefin resin A before the step of modifying the resin C.
- the resin B is preferably introduced into the extruder to denature the resin A to the resin C.
- the acid-modified polyolefin resin obtained by graft polymerization of unsaturated carboxylic acid is commercially available, a commercially available product can be used.
- the PP polymer graft-polymerized with an unsaturated carboxylic acid contains an ionomer having a carboxyl group neutralized with a metal hydroxide, an alkoxide, a lower fatty acid salt or the like.
- Examples of the functional group capable of reacting with the carboxyl group of the resin A included in the resin B include a hydroxyl group, an amino group, a carboxyl group, a formyl group, and an epoxy group.
- the general purpose resin with easy acquisition is preferable.
- Such general-purpose resins include ethylene-vinyl alcohol copolymer (EVOH), polyvinyl alcohol (PVA), polyamide (PA) such as nylon 6 and nylon 6,6, and ethylene-glycidyl methacrylate copolymer (E-GMA).
- preferred functional groups capable of reacting with the carboxyl group of the resin A include a hydroxyl group, an amino group, and an epoxy group.
- EVOH When EVOH is used as the resin B, one having an MFR of 1 to 30 g / 10 minutes (230 ° C.) is preferable from the viewpoint of compatibility with the resin A and processability.
- the MFR is more preferably 1 to 20 g / 10 minutes, and particularly preferably 3 to 16 g / 10 minutes.
- ethylene As the ethylene content in EVOH, ethylene is preferably 20 to 60 mol%, and more preferably 25 to 50 mol%.
- a polyamide When a polyamide is used as the resin B, a polyamide having the same terminal amino group amount and terminal carboxyl group amount or a terminal amino group is used rather than a polyamide in which the terminal amino group amount is blocked to stabilize the terminal amino group.
- a polyamide having a terminal carboxyl group molar ratio of 2 or more and a terminal amino group amount of 8.0 ⁇ 10 ⁇ 5 mol / g or more can increase the shear rate dependence of the melt viscosity of the resin C. Since polyamide has a relatively high melting point among general-purpose resins, the resistance to thermal deformation of the obtained resin C is improved.
- an epoxy group-containing resin is used as the resin B, it is preferable that an ethylene monomer is copolymerized from the viewpoint of compatibility with the resin A and workability.
- the carboxyl group of the resin A opens the epoxy group of the epoxy group-containing resin, and esterifies the hydroxyl group generated by the ring opening. This esterification is repeated. As a result, the molecular structure of the resin C becomes a cross-linked structure, and resistance to thermal deformation is improved.
- the electrode adhesive layer 2 is a layer in which the sealing film 1 is heat-pressed and heat-welded to the electrode 11.
- the electrode adhesive layer 2 is made of a carboxylic acid-modified polyolefin resin D that is excellent in adhesion to metal.
- the resin D is a resin obtained by copolymerizing one or more alkylene monomers such as ethylene and propylene and one or more unsaturated carboxylic acids or derivatives thereof. Examples of the copolymer include a block copolymer, a graft copolymer, and a random copolymer.
- a carboxylic acid-modified polyolefin resin D can be obtained by graft polymerization of a polyolefin similar to the resin A and an unsaturated carboxylic acid similar to the resin A.
- the electrode adhesive layer 2 is preferably thin as long as thermal welding with the electrode 11 is ensured.
- the electrode adhesive layer 2 has a thickness of 20 ⁇ m to 60 ⁇ m. If the thickness of the electrode adhesive layer 2 is smaller than this range, the adhesive strength between the electrode adhesive layer 2 and the electrode 11 may be lowered. If the thickness of the electrode adhesive layer 2 is larger than this range, the heat resistance of the sealing film 1 may be poor.
- the melting point of the resin D forming the electrode adhesive layer 2 is preferably lower than the melting point of the resin C forming the heat-resistant layer 3. In the case of the sealing film 1 made of a polypropylene resin, the melting point of the resin D is preferably 130 ° C. to 150 ° C.
- the melting point of the resin D is lower than this range, the heat resistance of the sealing film 1 may be poor. If the melting point of the resin D is higher than this range, it is difficult to increase the difference in melting point with the resin C forming the heat-resistant layer 3. It is preferable that the difference between the melting points of the resin D and the resin C is 10 ° C. or more because temperature management during heat welding is easy.
- the melting point of the resin D is preferably the same as or lower than the melting point of the resin A.
- the resin A is modified to the resin C, the molecule of the resin B is bonded to the molecule of the resin A, the molecular weight of the resin C is increased, and the melting point of the resin C is higher than that of the resin A. Thereby, it becomes easy to make the melting point difference between the resin D and the resin C 10 ° C. or more.
- the management of the resin becomes easy.
- Examples of the method for forming the electrode adhesive layer 2 include an extrusion method in which the molten resin D is extruded from a T die or a ring die using an extruder.
- a graft copolymer is used as the resin D
- the polyolefin and the unsaturated carboxylic acid can be graft-polymerized when being extruded with an extruder as in the case of the resin A.
- acid-modified polyethylene is used for the electrode adhesive layer 2 in order to obtain a sealing film made of a polyethylene resin
- maleic anhydride graft copolymerized polyethylene having a melting point of about 90 to 120 ° C. is preferable.
- the acid-modified polyethylene contains an ionomer that has neutralized carboxyl groups.
- the MFR of the acid-modified polyolefin resin D forming the electrode adhesive layer 2 is preferably in the range of 3 g / 10 min to 30 g / 10 min. More preferably, the MFR is in the range of 5 g / 10 min to 10 g / 10 min. If the MFR is smaller than these ranges, the acid-modified polyolefin may not be sufficiently circulated around the electrode 11 during heat welding. If the MFR is larger than these ranges, the electrode adhesive layer 2 may become thin and the adhesive strength may be poor. In the present invention, MFR is measured at 230 ° C. for all polypropylene resins and 190 ° C. for all polyethylene resins according to JIS K7210. In addition, since carboxylic acid modified polyolefin resin is marketed, a commercial item can also be used.
- the electrode adhesive layer 2 and the heat-resistant layer 3 are directly laminated without interposing an adhesive layer or an anchor agent layer. Thereby, peeling by the penetration
- the sealing film 1 not only the electrode adhesive layer 2 but also the wraparound of the heat-resistant layer 3 around the electrode 11 is important. If there is no influence of flexibility and interaction with the electrolyte, dry lamination may be performed using an adhesive. Moreover, you may use an anchor agent when carrying out extrusion lamination.
- a heat laminate in which the molded electrode adhesive layer 2 and the heat-resistant layer 3 are stacked and heat-welded, or either one of the electrode adhesive layer 2 and the heat-resistant layer 3 is molded in advance and the other is in a molten state examples thereof include an extrusion laminating method of laminating while extruding from a T die, and a coextrusion laminating method of laminating while extruding from a coextrusion die when both the electrode adhesive layer 2 and the heat-resistant layer 3 are in a molten state.
- the co-extrusion laminating method is a method in which a co-extrusion die is connected to an extruder that extrudes resin C while being melt-kneaded and modified to resin C, and another extruder that extrudes resin D. Lamination can be done directly in the extrusion die. Thereby, modification to the resin C, formation of the heat-resistant layer 3, formation of the electrode adhesive layer 2, and lamination of the electrode adhesive layer 2 and the heat-resistant layer 3 can be performed in one step, which is preferable.
- the sealant 4 is laminated on the surface of the heat-resistant layer 3 opposite to the electrode adhesive layer 2.
- the sealant 4 is a layer that is heat-pressed and welded to the sealant 22 of the laminate film 20 of the bag.
- the same method is employed for the same reason as the lamination of the electrode adhesive layer 2 and the heat-resistant layer 3.
- the sealant 4 is preferably thin as long as welding with the sealant 22 of the bag is ensured.
- the thickness of the sealant 4 is 20 ⁇ m to 40 ⁇ m. If the thickness of the sealant 4 is smaller than these ranges, the welding strength between the sealant 4 and the sealant 22 of the bag body may be lowered. If the thickness of the sealant 4 is larger than these ranges, the heat resistance of the sealing film 1 may be poor.
- the resin forming the sealant 4 (hereinafter referred to as “resin E”) is preferably the same or the same resin as the resin constituting the sealant 22 because it easily welds to the sealant 22 of the laminate film 20 of the bag.
- the sealing film 1 is excellent in heat resistance, it is comprised with PP resin.
- the resin E may be a PP homopolymer, a random copolymer of ethylene and propylene, a block copolymer, or a mixture thereof, or a polymer alloy thereof. It is done. Among these, a random copolymer of ethylene and propylene is preferable because of excellent flexibility.
- the melting point of the resin E forming the sealant 4 is preferably 130 ° C. to 170 ° C.
- the heat resistance of the sealing film 1 may be poor.
- the melting point of the resin E forming the sealant 4 is higher than this range, it is difficult to increase the melting point difference from the resin C forming the heat-resistant layer 3. It is preferable that the difference between the melting point of the resin E and the melting point of the resin C is 10 ° C. or more because temperature management during welding of the bag body to the laminate film 20 is facilitated.
- a polyethylene resin is used for the sealant 4 in order to make the sealing film 1 a polyethylene resin, it is preferable to use a low density polyethylene or a linear low density polyethylene having a melting point of about 100 to 120 ° C.
- the MFR of the resin E forming the sealant 4 is preferably in the range of 3 g / 10 min to 30 g / 10 min, and in the range of 5 g / 10 min to 10 g / 10 min. Is more preferable.
- the MFR of the resin E is smaller than these ranges, it may be difficult to laminate by extrusion lamination or coextrusion lamination. If the MFR of the resin E is larger than these ranges, it may be difficult to mold with a coextrusion ring die.
- the sealant 4 is an arbitrary layer, and may not be provided when the heat-resistant layer 3 and the sealant 22 of the bag body are secured.
- the sealing film 1 of the present invention is welded between the sealant 22 of the bag body and the electrode 11.
- the sealing film 1 is welded, as shown in FIG. 2, the predetermined width sealing film 1 is exposed from the end portion of the laminate film 20 and welded.
- a coloring method at least one of the layers constituting the sealing film 1 can be printed, dyed, or kneaded with a colorant such as a dye or a pigment. Of these methods, the kneading of the colorant is simple and preferable.
- the layer to be colored can also be used for confirming whether or not the bag sealant 22 is welded. Accordingly, the heat resistant layer 3 that is not deformed or melted during welding is preferable as the coloring layer.
- the sealing film 1 of the present embodiment has a sealing film 1 according to the present invention as shown in FIG. 1 is preferably heat-welded on at least one surface of the electrode 11, preferably on both surfaces, using the electrode adhesive layer 2 of the sealing film 1. Thereby, it can weld to the sealant 22 of a bag body easily and reliably using the sealant 4 and the heat-resistant layer 3 of the sealing film 1.
- the sealing film 1 when the sealing film 1 is colored, at the time of heat welding of the innermost layer of the bag and the electrode tab on which the sealing film is welded, the electrode tab can be The sealing film 1 can be positioned accurately.
- heat sealing can be performed by using a heat sealer, an impulse sealer, or the like with a seal bar. Further, when the sealing film 1 is heated, if the electrode 11 is directly heated using electromagnetic induction heating or current heating, the flow due to melting of the outer part of the sealant 4 or the heat-resistant layer 3 is suppressed, and the inner part of the heat-resistant layer 3 is suppressed. And the electrode adhesive layer 2 is preferably softened and melted.
- Examples of the shape of the electrode 11 include a tape and a round bar.
- the size of the electrode 11 is not particularly limited.
- the thickness is about 50 ⁇ m to 500 ⁇ m
- the width is 5 mm to 100 mm
- the length is about 40 mm to 100 mm.
- the ridgeline may be rounded.
- the surface may be the processed surface as it is rolled, but is preferably roughened by a surface treatment such as sand blasting or etching. By roughening, the adhesive strength of the sealing film 1 is improved.
- base treatment such as chemical conversion treatment may be performed.
- metals such as aluminum, copper, nickel, iron, gold, platinum, and various alloys can be used.
- aluminum and copper are preferably used because they are excellent in conductivity and advantageous in terms of cost.
- aluminum and copper may not have sufficient resistance to hydrogen fluoride (hydrofluoric acid), which is feared to be generated in the electrolyte solution in the battery pack.
- hydrogen fluoride hydrogen fluoride
- PP resin contacts copper deterioration of resin may be accelerated
- the laminate film 20 of the bag body to which the sealing film 1 of the present invention is welded is formed by laminating a sealant 22 on one surface of a metal foil 21 and a film base material 23 on the other surface.
- a laminated film etc. are mentioned.
- the laminate film 20 may be laminated with other layers.
- the bag laminate film 20 is formed into a drawn bag, a flat bag, or the like.
- the metal foil 21 include aluminum foil, stainless steel foil, copper foil, and iron foil.
- the metal foil 21 may be subjected to a base treatment such as a chemical conversion treatment.
- a resin that can be welded to the sealant 4 of the sealing film 1 is selected.
- a resin for example, when the sealant 4 of the sealing film 1 is a PP resin, a PP homopolymer or a copolymer of PP and ethylene can be used.
- a polyethylene resin low density polyethylene, linear low density polyethylene, or the like can be used.
- the resin constituting the film base material 23 is not particularly limited, but high strength polyamide, polyethylene terephthalate (PET), PP, or the like is preferably used. When these resins are stretched films, high physical strength can be obtained. A plurality of these films may be laminated.
- the sealing film 1 may include other layers such as a further resin layer in order to improve adhesion between the resin layers, physical strength, insulation, and the like.
- the other layer is preferably a layer that is difficult to melt at the time of heat welding and has high flexibility.
- the function of a safety valve may be imparted to the sealing film 1 in case the temperature or pressure in the bag rises abnormally by controlling the laminate strength between the layers to an appropriate range.
- Resin A Maleic anhydride-modified PP obtained by graft polymerization of maleic anhydride on random PP (MFR 2.4 g / 10 min (230 ° C.), melting point 143 ° C.)
- Resin B Resin B-1: EVOH with an ethylene ratio of 48 mol% (MFR 15 g / 10 min (230 ° C.), melting point 160 ° C.)
- Resin B-2 EVOH having an ethylene ratio of 32 mol% (MFR 3.6 g / 10 min (230 ° C.), melting point 183 ° C.)
- Resin B-3 Nylon 6 (relative viscosity 3.37, melting point 220 ° C.)
- Resin B-4 Nylon 6 (relative viscosity 4.08, melting point 220 ° C.)
- Resin B-5 E-GMA copolymer having a glycidyl methacrylate
- Examples 1 to 15 Resin A and resin B are put into the hopper of the extruder at the compounding ratio shown in Table 1, extruded while being modified to resin C at the extrusion temperature shown in Table 1, and extruded from another extruder and coextruded T-die Then, Examples 1 to 15 of the sealing film 1 were cast.
- the resin E was extruded from another extruder and coextruded and laminated at the time of coextrusion cast molding. Further, in the example in which the column of the colorant in Table 1 is 3 parts, 3 parts by weight of a PP-based pigment master batch was added when the resin A and the resin B were blended.
- the extrusion temperatures of Resin D and Resin E were both 240 ° C.
- a laminated film having a three-layer structure in which a laminated film having a two-layer structure composed of a 40 ⁇ m electrode adhesive layer 2 and a heat-resistant layer 3 having a thickness shown in the column of the heat-resistant layer in Table 1 and a 20 ⁇ m sealant 4 are laminated. Molded.
- This laminated film was slit to a width of 25 mm, and Examples 1 to 15 of the sealing film 1 were produced.
- Electrode adhesion strength As the electrode 11, a square aluminum foil having a thickness of 50 ⁇ m, a width of 50 mm, and a length of 50 mm was used. Examples 1 to 15 and Comparative Example 1 of the sealing film 1 were each cut to a length of 60 mm. The electrode 11 was placed on the electrode 11 with the electrode adhesive layer 2 of the sealing film 1 inside. Heating was performed from the aluminum foil side using a heat sealer at 200 ° C., 0.2 MPa for 3 seconds, and the other end was thermally welded, leaving an unwelded portion at one end. The peel strength between the electrode adhesive layer 2 and the electrode 11 of each sealing film 1 was measured using an Instron type tensile tester.
- the end of the sealing film 1 and the end of the electrode 11 not welded to the electrode 11 are fixed to two chucks of a tensile tester, pulled at a speed of 300 mm / min, and peeled 180 degrees. The strength was measured.
- the electrode adhesive layer 2 and the electrode 11 of each sealing film 1 were heat-sealed with a sealing strength of 27.5 to 32.8 N / 25 mm.
- a biaxially stretched PET film having a thickness of 12 ⁇ m as the film substrate 23, an aluminum foil having a thickness of 40 ⁇ m as the metal foil 21, and a random copolymer film of ethylene and propylene having a thickness of 40 ⁇ m as the sealant 22 were laminated by dry lamination.
- the obtained laminated film was cut into a square having a side of 100 mm to produce a laminate film 20 of two bags.
- Examples 1 to 15 and Comparative Example 1 of the sealing film 1 were each cut to a length of 60 mm.
- the sealant 22 of the laminate film 20 of two bags was faced each other, and the sealing film 1 was sandwiched therebetween.
- the sealing film 1 When sandwiching the sealing film 1, the sealing film 1 was exposed 5 mm from the end of the laminate film 20. One end of the side where the sealing film 1 is exposed was welded by heating from both sides of the laminate film 20 of the two bags under the same conditions as the measurement of the electrode adhesive strength. The other end was left as an unwelded part.
- the seal bar touched about 2 mm at the base of the exposed portion of the sealing film 1.
- the end of the non-welded portion of the sealing film 1 and the end of the laminate film 20 are fixed to the two chucks of the tensile tester, and under the same conditions as the measurement of the electrode adhesive strength, The heat seal strength of the sealant 4 or the heat-resistant layer 3 and the laminate film 20 of each sealing film 1 was measured.
- Each sealing film 1 and the laminate film 20 were heat-sealed with a sealing strength of 124.2 to 143.3 N / 25 mm.
- the heat-deformed or melted trace was not seen in the part exposed from the laminate film 20 of the sealing film 1 in any Example.
- the root of the portion exposed from the laminate film 20 was slightly shrunk.
- ⁇ MFR of kneaded product> A melt-kneaded product (resin C-1) of 95 parts by weight of resin A and 5 parts by weight of resin B-1 and a melt-kneaded product of 95 parts by weight of resin A and 5 parts by weight of resin B-3 (resin C) -3) were extruded individually, and MFR at 230 ° C. was measured.
- the MFR of the original resin A was 2.4.
- Resin C-1 had an MFR of 1.9, which was lower than that of Resin A.
- Resin C-3 had an MFR of 2.5, which was higher than that of Resin A.
- the reason why the heat resistance of the sealing film 1 is improved in the present invention is not only because the molecular weight increases due to the chemical bond between the carboxyl group of the resin A and the functional group of the resin B, but also the partial crosslinking. Presumed to be affected.
- the present invention can be widely applied to a method for manufacturing a sealing film for sealing electrodes of power generation elements such as secondary batteries and capacitors housed in a bag body, and a sealing film.
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Abstract
Description
本願は、2010年11月11日に日本に出願された特願2010-252940号に基づき優先権を主張し、その内容をここに援用する。
従来、これらの二次電池やキャパシタは、アルミ箔などの金属箔にポリオレフィンのシーラントを積層したラミネートフィルムからなる平袋や絞り成形された袋体に扁平な発電要素が密封されて構成される。袋体のフィルム基材には、充放電のための電極が一端を外部に突出させて封止される。封止に際しては、袋体のフィルム基材にテープ状の電極(電極タブ)が挟まれヒートシールされる。
これらの問題に対して、近年、電極の表裏両面に封止フィルムを挟んで袋体のフィルム基材とヒートシールする方法が用いられている。しかし、袋体と電極との密着性を上げるために、封止時の加熱や加圧の条件を厳しくすると、袋体の金属箔と電極との間の樹脂が薄くなったり、封止フィルムが変形したりして短絡が起こる可能性がある。
また、特許文献2には、電子線架橋されたポリオレフィン層と酸変性ポリオレフィン層とを積層した接着性フィルムが記載されている。
(1)袋体に収納される発電要素の電極と袋体の端縁との間に挟み込まれる封止フィルムの製造方法であって、カルボン酸がグラフト重合された酸変性ポリオレフィン樹脂Aと樹脂Aのカルボキシル基と反応しうる官能基を有する樹脂Bとの両者を溶融して混練することで、樹脂Aのカルボキシル基と樹脂Bの官能基とを化学結合させて樹脂Cに変性させる溶融混練工程と、樹脂Cを層状に成形して耐熱層を形成する耐熱層製膜工程と、カルボン酸変性ポリオレフィン樹脂Dを層状に成形して電極に接着する電極接着層を形成する接着層製膜工程と、樹脂Cと樹脂Dのいずれか一方または両方が溶融状態にあるときに前記耐熱層と前記電極接着層を直接積層する積層工程と、を有する封止フィルムの製造方法。
(2)前記溶融混練工程が押出機内で行われる(1)に記載の封止フィルムの製造方法。
(3)前記溶融混練工程と前記耐熱層製膜工程が連続して行われる(1)または(2)に記載の封止フィルムの製造方法。
(4)前記耐熱層製膜工程と前記接着層製膜工程のいずれか一方または両方に連続して前記積層工程が行われる(1)から(3)のいずれか一項に記載の封止フィルムの製造方法。
(5)前記積層工程が共押出ダイ内で行われる(1)から(4)のいずれか一項に記載の封止フィルムの製造方法。
(6)前記溶融混練工程は、樹脂Aが99~90に対して樹脂Bが1~10となる重量百分比で配合して行われる(1)から(5)のいずれか一項に記載の封止フィルムの製造方法。
(7)樹脂Aの融点と同じかまたはそれより低い融点を有する樹脂を樹脂Dとして用いる(1)から(6)のいずれか一項に記載の封止フィルムの製造方法。
(8)袋体に収納される発電要素の電極と袋体の端縁との間に挟み込まれる封止フィルムであって、カルボン酸がグラフト重合された酸変性ポリオレフィン樹脂Aと樹脂Aのカルボキシル基と反応しうる官能基を有する樹脂Bの両者を溶融して混練することで、樹脂Aのカルボキシル基と樹脂Bの官能基とを化学結合させて変性させた樹脂Cからなる耐熱層が、カルボン酸変性ポリオレフィン樹脂Dからなる電極接着層に直接積層された積層構造を有する封止フィルム。
(9)樹脂Bが水酸基、アミノ基またはエポキシ基を有する樹脂より選ばれる一種または二種以上である(8)に記載の封止フィルム。
(10)樹脂Aがポリプロピレンに無水マレイン酸がグラフト重合された酸変性ポリオレフィン樹脂である(8)または(9)に記載の封止フィルム。
(11)前記積層構造が樹脂Cと樹脂Dとの共押出により形成されている(8)から(10)のいずれか一項に記載の封止フィルム。
(12)前記耐熱層に袋体の最内層と熱溶着されるシーラントが積層された(8)から(11)のいずれか一項に記載の封止フィルム。
樹脂Aと樹脂Bの両者を溶融して混練するだけなので、製膜工程で用いる通常の押出機内で樹脂Cに変性させることができる。
本発明においては、樹脂Cと樹脂Dのいずれか一方または両方が溶融状態にあるときに耐熱層と電極接着層を直接積層する。積層方法は、押出機と製膜ダイを組み合わせて一方の層を製膜してから、他方の層を押出ラミネートする。他の積層方法は、耐熱層と電極接着層を共押出する。これらの方法により、本発明では、簡素な工程で耐熱層と電極接着層を高い接着強度で直接積層することができる。これらの方法による封止フィルムは、ヒートシール時に高温のシールバーの接触や輻射熱で封止フィルムが溶けたり、変形したりしにくい。これにより、電極と袋体の金属箔との短絡が起こりにくい。
特に、耐熱層と電極接着層の共押出は、より簡素な工程で、耐熱層と電極接着層を、より高い接着強度で直接積層することができる。
樹脂Bが水酸基、アミノ基またはエポキシ基を有する樹脂より選ばれる一種または二種以上であると、樹脂Aのカルボキシル基と樹脂Bの官能基とが化学結合しやすく、樹脂Cへの変性が円滑である。樹脂Aと樹脂Bを溶融して混練することで樹脂Cへ変性するので、樹脂Aのカルボキシル基と樹脂Bの官能基とが均一に化学結合しやすい。
封止フィルムの積層構造が樹脂Cと樹脂Dとの共押出により形成されていると、積層構造の接着強度が高く、ヒートシール時に封止フィルムが熱変形したりせず、電極と袋体の金属箔との短絡が起こりにくい。
耐熱層に袋体の最内層と熱溶着されるシーラントが積層されていると、袋体の最内層と封止フィルムの熱溶着強度を高くすることができる。また、耐熱層にシーラントが直接積層されていると、電解液による接着界面の剥離を防止できる。
図1は、本発明の封止フィルム1の概略構成を示す断面図である。
図2は、図1に示す封止フィルム1を、袋体のラミネートフィルム20と電極11との間に介在させて溶着した状態を示し、電極11の長手方向に沿う断面図である。
図3Aは、図1に示す封止フィルム1を、電極11に接着した封止フィルム付電極10を示す斜視図である。図3Bは、同封止フィルム付電極10を示す電極11の長手方向に直交する方向での断面図である。
本発明の封止フィルム1の厚さは、50μm~300μmであることが好ましい。封止フィルム1の厚さがこの範囲より小さいと、絶縁性が低くなることがある。なお、封止フィルム1の厚さがこの範囲より大きくてもよい。しかし、絶縁性のさらなる向上は期待できず、むしろヒートシールしにくくなる。
この時の樹脂の配合比率は、樹脂A99~90重量%に対して樹脂B1~10重量%が好ましい。樹脂Bの配合比率がこの範囲より低いと樹脂Cの変性効果が小さく、封止フィルム1の耐熱性が乏しくなることがある。樹脂Bの配合比率がこの範囲より高いと、耐熱層3が脆くなりやすい。このため、パック電池の装着時に電極11の折り曲げによって、耐熱層3にクラックが発生することがある。
ポリオレフィンとしては、たとえばポリプロピレンやポリエチレンのホモポリマーおよびコポリマーが用いられる。コポリマーとしては、プロピレンと1~5重量%のエチレンとのランダム共重合体(ランダムPP)またはブロック共重合体(ブロックPP)、エチレンと、1~10重量%のプロピレンとのランダムまたはブロック共重合体、プロピレンまたはエチレンと1~10重量%の炭素数が4以上のα-オレフィンとの共重合体、およびこれらの混合物等が用いられる。
酸変性ポリオレフィン樹脂Aのベースレジンは、メルトフローレート(MFR)が0.5~30g/10分、特に、5~15g/10分のホモポリプロピレンおよびプロピレン-エチレンランダム共重合体又は、MFRが0.3~30g/10分のポリエチレン及びエチレン-αオレフィン共重合体が好ましく用いられる。
耐熱層3を形成する樹脂CのMFRは、0.5g/10分~3g/10分の範囲であることが好ましい。MFRがこの範囲より小さいと成形しにくい場合がある。MFRがこの範囲より大きいと熱溶着時に耐熱層3が変形したり、薄くなったりして絶縁性が低下することがある。
その様な樹脂Cを得るには、樹脂Aとして、ポリプロピレン(PP)の単独重合体、エチレンとプロピレンのランダム共重合体またはブロック共重合体やそれらのポリマーアロイをベースレジンとする酸変性ポリオレフィン樹脂を用いることが好ましい。PP系樹脂は、一般的に、低温環境下で脆くなりやすい。融点が高くても柔軟性に優れ、低温環境下でも脆くならない(耐寒性)ので、エチレンとプロピレンのブロック共重合体が好ましい。
グラフト重合される不飽和カルボン酸の量としては、通常モノマーの全重量に対して0.5~5重量%である。
溶融混練する方法は特に制限されず、例えばスクリュー押出機、バンバリーミキサー、ミキシングロールなどを用いて行うことができる。これらの方法の内、操作が簡便なのでスクリュー押出機が好ましく使用される。スクリュー押出機は、単軸、二軸、あるいはそれ以上の多軸スクリューであってよい。溶融混練の温度は、用いるポリオレフィンの融点以上で、用いる有機過酸化物の分解温度以下が好ましい。具体的な温度および時間は、通常160~280℃で0.3~30分間、好ましくは170~250℃で1~10分間である。
樹脂Cへの変性工程の前段に、ポリオレフィンと不飽和カルボン酸類とを押出機に投入して溶融混練して酸変性ポリオレフィン樹脂Aに変性させる工程を加えることが好ましい。しかる後、さらに、その押出機に樹脂Bを投入して樹脂Aを樹脂Cに変性させることが好ましい。
なお、不飽和カルボン酸をグラフト重合した酸変性ポリオレフィン樹脂は、市販されているので、市販品を用いることもできる。
不飽和カルボン酸とグラフト重合させたPP系ポリマーは、金属水酸化物、アルコキシド、低級脂肪酸塩などでカルボキシル基を中和したアイオノマーを含む。
樹脂Bとして、ポリアミドを用いる場合は、安定化のために末端アミノ基を封鎖して末端アミノ基量を少なくしたポリアミドより、末端アミノ基量と末端カルボキシル基量が同じポリアミド、または末端アミノ基に対する末端カルボキシル基のモル比が2以上であり、かつ末端アミノ基量が8.0×10-5モル/g以上のポリアミドを用いることが好ましい。この様なポリアミドは、樹脂Cの溶融粘度の剪断速度依存性を高めることができる。ポリアミドは、汎用樹脂の中では比較的融点が高いので、得られる樹脂Cの熱変形に対する耐性が向上する。
樹脂Bとして、エポキシ基含有樹脂を用いる場合は、樹脂Aとの相溶性や加工性の観点から、エチレンモノマーが共重合されているものが好ましい。樹脂Aのカルボキシル基は、エポキシ基含有樹脂のエポキシ基を開環し、開環によって生成された水酸基をエステル化する。このエステル化は、繰り返し行われる。その結果、樹脂Cの分子構造が架橋構造のようになり、熱変形に対する耐性が向上する。
樹脂Dは、アルキレンモノマーたとえばエチレン、プロピレンなどの1種または2種以上と、不飽和カルボン酸またはその誘導体の1種または2種以上を共重合した樹脂である。共重合体としては、ブロック共重合体、グラフト共重合体またはランダム共重合体が挙げられる。グラフト共重合体を用いる場合は、樹脂Aと同様なポリオレフィンと樹脂Aと同様な不飽和カルボン酸をグラフト重合してカルボン酸変性ポリオレフィン樹脂Dとすることができる。
電極接着層2を形成する樹脂Dの融点は、耐熱層3を形成する樹脂Cの融点より低いことが好ましい。ポリプロピレン系樹脂からなる封止フィルム1の場合、樹脂Dの融点は、130℃~150℃であることが好ましい。樹脂Dの融点がこの範囲より低いと封止フィルム1の耐熱性が乏しくなることがある。樹脂Dの融点がこの範囲より高いと耐熱層3を形成する樹脂Cとの融点差を大きくしにくい。樹脂Dと樹脂Cの融点差が10℃以上あると熱溶着時の温度管理が容易となり好ましい。
樹脂Dの融点は、樹脂Aの融点と同じかまたはそれより低いことが好ましい。樹脂Aを樹脂Cに変性させると、樹脂Bの分子が樹脂Aの分子に結合して樹脂Cの分子量が大きくなり、樹脂Cの融点が樹脂Aより高くなる。これにより、樹脂Dと樹脂Cの融点差を10℃以上とすることが容易となる。樹脂Dと樹脂Aを同一の樹脂とすると、樹脂の管理が容易となる。
ポリエチレン系樹脂からなる封止フィルムとするために、電極接着層2に酸変性ポリエチレンを採用する場合は、融点が90~120℃程度の無水マレイン酸グラフト共重合ポリエチレンが好ましい。酸変性ポリエチレンは、カルボキシル基を中和したアイオノマーを含む。
本発明においては、MFRは、JIS K7210においてポリプロピレン系樹脂の場合は全て230℃、ポリエチレン系樹脂の場合は全て190℃で測定される。
なお、カルボン酸変性ポリオレフィン樹脂は、市販されているので、市販品を用いることもできる。
直接積層する方法としては、成形された電極接着層2と耐熱層3を重ねて加熱溶着する熱ラミネート、電極接着層2と耐熱層3のいずれか一方を予め成形しておいて他方を溶融状態のままTダイから押し出しつつ積層する押出ラミネート法、電極接着層2と耐熱層3の両方が溶融状態にあるときに共押出ダイから押し出しつつ積層する共押出ラミネート法を挙げることができる。これらの方法の内、共押出ラミネート法は、溶融混練して樹脂Cへ変性しつつ樹脂Cを押し出す押出機と、樹脂Dを押し出す別の押出機とを共押出ダイに接続することで、共押出ダイ内で直接積層することができる。これにより、樹脂Cへの変性、耐熱層3の形成、電極接着層2の形成、電極接着層2と耐熱層3の積層を一工程で行えるので好ましい。
積層方法としては、電極接着層2と耐熱層3の積層と同様な理由により、同様な方法が採用される。これらの方法の内、電極接着層2と耐熱層3とシーラント4を一度に積層できるので、共押出ラミネート法で積層することが好ましい。
シーラント4を形成する樹脂(以下、樹脂Eという。)は、袋体のラミネートフィルム20のシーラント22と溶着しやすいことから、シーラント22を構成する樹脂と同種または同一の樹脂が好ましい。通常、封止フィルム1は、耐熱性に優れることから、PP系樹脂で構成される。
封止フィルム1がPP系樹脂で構成される場合、樹脂Eは、PPの単独重合体、エチレンとプロピレンのランダム共重合体やブロック共重合体またはそれらの混合物、あるいはこれらのポリマーアロイなどが挙げられる。これらのうち、柔軟性に優れることから、エチレンとプロピレンのランダム共重合体が好ましい。
封止フィルム1をポリエチレン系樹脂とするために、シーラント4にポリエチレン系樹脂を採用する場合は、融点が100~120℃程度の低密度ポリエチレンや直鎖状低密度ポリエチレンを用いることが好ましい。
なお、シーラント4は、任意の層であり、耐熱層3と袋体のシーラント22との溶着が確保される場合は、設けなくてもよい。
封止フィルム1と電極11の熱溶着には、ヒートシーラーやインパルスシーラー等を用いてシールバーで加熱して圧着することができる。また、封止フィルム1の加熱に際しては、電磁誘導加熱や通電加熱を用いて電極11を直接加熱すると、シーラント4や耐熱層3の外側部分の溶融による流動を抑えて、耐熱層3の内側部分や電極接着層2の軟化や溶融を促すので好ましい。
電極11の材質としては、例えば、アルミニウム、銅、ニッケル、鉄、金、白金や各種合金などの金属を用いることができる。これらのうち、導電性に優れ、コスト的にも有利なことから、アルミニウムや銅が好ましく用いられる。ただし、アルミニウムや銅は、パック電池において電解液中に発生が懸念されるフッ化水素(フッ酸)に対する耐性が十分でない場合がある。また、PP系樹脂は、銅と接触すると、樹脂の劣化が促進される可能性がある。従って、アルミニウムや銅の下地金属に、導電性が高くフッ酸の耐性に優れるニッケルをメッキすることが好ましい。
袋体のラミネートフィルム20は、絞り成形した袋や平袋などに成形される。金属箔21としては、アルミ箔、ステンレス箔、銅箔、鉄箔などを挙げることができる。金属箔21は、化成処理等の下地処理が施されていてもよい。
例えば、封止フィルム1は、各樹脂層間の接着性、物理的強度や絶縁性の向上等のために、さらなる樹脂層等の他の層を含んでもよい。この場合、他の層は、熱溶着時に溶融しにくい層で、柔軟性も高いことが好ましい。また、各層間のラミネート強度を適度な範囲に制御して封止フィルム1に袋体内の温度や圧力が異常に上昇した場合に備えて安全弁の機能を付与してもよい。
樹脂A:ランダムPPに無水マレイン酸をグラフト重合した無水マレイン酸変性PP(MFR2.4g/10分(230℃)、融点143℃)
樹脂B
樹脂B-1:エチレン比率48mol%のEVOH(MFR15g/10分(230℃)、融点160℃)
樹脂B-2:エチレン比率32mol%のEVOH(MFR3.6g/10分(230℃)、融点183℃)
樹脂B-3:ナイロン6 (相対粘度3.37、融点220℃)
樹脂B-4:ナイロン6 (相対粘度4.08、融点220℃)
樹脂B-5:グリシジルメタクリレート含有率6wt%のE-GMA共重合体(MFR3g/10分(190℃)、融点105℃)
樹脂D
樹脂D-1:ランダムPPに無水マレイン酸をグラフト重合した無水マレイン酸変性PP(MFR7.5g/10分(230℃)、融点135℃)
樹脂D-2:ランダムPPに無水マレイン酸をグラフト重合した無水マレイン酸変性PP(MFR7.0g/10分(230℃)、融点140℃)
樹脂E:ブロックPP(MFR2.3g(230℃)/10分、融点163℃)
樹脂Aと樹脂Bとを表1に示す配合比で押出機のホッパーに入れ、表1に示す押出温度で樹脂Cに変性させつつ押し出し、別の押出機から押し出した樹脂Dと共押出Tダイ内で積層して封止フィルム1の実施例1~15をキャスト成形した。
表1の層構成の欄が3層の実施例においては、共押出キャスト成形に際し、さらに別の押出機から樹脂Eを押し出して共押出積層した。また、表1の着色剤の欄が3部の実施例においては、樹脂Aと樹脂Bを配合するに際し、PPベースの顔料マスターバッチ3重量部を加えた。
樹脂Dと樹脂Eの押出温度は、いずれも240℃とした。
樹脂D-1と樹脂Eをそれぞれ240℃で押し出し、共押出Tダイ内で積層して、20μmの電極接着層2と80μmのシーラント4からなる2層構造の積層フィルムをキャスト成形した。この積層フィルムを幅25mmにスリットし、比較例1の封止フィルム1を作製した。
電極11として厚さ50μm、幅50mm、長さ50mmの正方形のアルミ箔を用いた。封止フィルム1の実施例1~15および比較例1をそれぞれ長さ60mmに切断した。封止フィルム1の電極接着層2を内側にして電極11に重ねた。ヒートシーラーを用いて200℃、0.2MPa、3秒間の条件でアルミ箔側から加熱し、一端に未溶着部を残して、他端を熱溶着した。
インストロン型引張試験機を用いて各封止フィルム1の電極接着層2と電極11の剥離強度を測定した。剥離強度の測定に際し、電極11に溶着されていない封止フィルム1の端部と電極11の端部を引張試験機の二つのチャックに固定して300mm/分の速さで引張り、180度剥離強度を測定した。各封止フィルム1の電極接着層2と電極11とは、27.5~32.8N/25mmのシール強度でヒートシールされていた。
フィルム基材23として厚さ12μmの二軸延伸PETフィルム、金属箔21として厚さ40μmのアルミ箔およびシーラント22として厚さ40μmのエチレンとプロピレンのランダム共重合体フィルムをドライラミネートで積層した。得られた積層フィルムを、一辺が100mmの正方形に切断して2枚の袋体のラミネートフィルム20を作製した。
封止フィルム1の実施例1~15および比較例1をそれぞれ長さ60mmに切断した。2枚の袋体のラミネートフィルム20のシーラント22同士を向かい合わせ、その間に封止フィルム1を挟んだ。封止フィルム1を挟むに際し、ラミネートフィルム20の端部から封止フィルム1を5mm露出させた。
電極接着強度の測定と同じ条件で2枚の袋体のラミネートフィルム20の両側から加熱して封止フィルム1が露出している側の一端を溶着した。他端は、未溶着部として残した。封止フィルム1の溶着に際し、封止フィルム1の露出部分の根元約2mmにシールバーが触れるようにした。
また、いずれの実施例における封止フィルム1のラミネートフィルム20から露出した部分には熱変形や溶融した形跡が見られなかった。一方、比較例においてはラミネートフィルム20から露出した部分の根元がわずかに縮んでいた。
95重量部の樹脂Aと5重量部の樹脂B-1との溶融混練品(樹脂C-1)と、95重量部の樹脂Aと5重量部の樹脂B-3の溶融混練品(樹脂C-3)とを、それぞれ単独で押し出し、230℃でのMFRを測定してみた。オリジナルの樹脂AのMFRは2.4であった。樹脂C-1のMFRは1.9で、樹脂Aに比べてMFRが下がっていた。なお、樹脂C-3のMFRは2.5で、樹脂Aに比べてMFRが上がっていた。これにより、本発明において封止フィルム1の耐熱性が向上する理由は、樹脂Aのカルボキシル基と樹脂Bの官能基との化学結合により、分子量が大きくなるためだけではなく、部分的な架橋も影響していると推定される。
2…電極接着層
3…耐熱層
4…シーラント
10…封止フィルム付電極
11…電極
20…袋体のラミネートフィルム
21…ラミネートフィルムの金属箔
22…ラミネートフィルムのシーラント
23…ラミネートフィルムのフィルム基材
Claims (12)
- 袋体に収納される発電要素の電極と袋体の端縁との間に挟み込まれる封止フィルムの製造方法であって、
カルボン酸がグラフト重合された酸変性ポリオレフィン樹脂Aと樹脂Aのカルボキシル基と反応しうる官能基を有する樹脂Bとの両者を溶融して混練することで、樹脂Aのカルボキシル基と樹脂Bの官能基とを化学結合させて樹脂Cに変性させる溶融混練工程と、
樹脂Cを層状に成形して耐熱層を形成する耐熱層製膜工程と、
カルボン酸変性ポリオレフィン樹脂Dを層状に成形して電極に接着する電極接着層を形成する接着層製膜工程と、
樹脂Cと樹脂Dのいずれか一方または両方が溶融状態にあるときに前記耐熱層と前記電極接着層を直接積層する積層工程と、を有する封止フィルムの製造方法。 - 前記溶融混練工程が押出機内で行われる請求項1に記載の封止フィルムの製造方法。
- 前記溶融混練工程と前記耐熱層製膜工程が連続して行われる請求項1または2に記載の封止フィルムの製造方法。
- 前記耐熱層製膜工程と前記接着層製膜工程のいずれか一方または両方に連続して前記積層工程が行われる請求項1から3のいずれか一項に記載の封止フィルムの製造方法。
- 前記積層工程が共押出ダイ内で行われる請求項1から4のいずれか一項に記載の封止フィルムの製造方法。
- 前記溶融混練工程は、樹脂Aが99~90に対して樹脂Bが1~10となる重量百分比で配合して行われる請求項1から5のいずれか一項に記載の封止フィルムの製造方法。
- 樹脂Aの融点と同じかまたはそれより低い融点を有する樹脂を樹脂Dとして用いる請求項1から6のいずれか一項に記載の封止フィルムの製造方法。
- 袋体に収納される発電要素の電極と袋体の端縁との間に挟み込まれる封止フィルムであって、
カルボン酸がグラフト重合された酸変性ポリオレフィン樹脂Aと樹脂Aのカルボキシル基と反応しうる官能基を有する樹脂Bの両者を溶融して混練することで、樹脂Aのカルボキシル基と樹脂Bの官能基とを化学結合させて変性させた樹脂Cからなる耐熱層が、カルボン酸変性ポリオレフィン樹脂Dからなる電極接着層に直接積層された積層構造を有する封止フィルム。 - 樹脂Bが水酸基、アミノ基またはエポキシ基を有する樹脂より選ばれる一種または二種以上である請求項8に記載の封止フィルム。
- 樹脂Aがポリプロピレンに無水マレイン酸がグラフト重合された酸変性ポリオレフィン樹脂である請求項8または9に記載の封止フィルム。
- 前記積層構造が樹脂Cと樹脂Dとの共押出により形成されている請求項8から10のいずれか一項に記載の封止フィルム。
- 前記耐熱層に袋体の最内層と熱溶着されるシーラントが積層された請求項8から11のいずれか一項に記載の封止フィルム。
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Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014091544A1 (ja) * | 2012-12-10 | 2014-06-19 | 藤森工業株式会社 | 非水系電池用の電極リード線部材 |
WO2014091542A1 (ja) * | 2012-12-10 | 2014-06-19 | 藤森工業株式会社 | 電池外装用積層体 |
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WO2016052293A1 (ja) * | 2014-09-30 | 2016-04-07 | 大日本印刷株式会社 | 金属端子用接着性フィルム |
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US20180230343A1 (en) * | 2017-02-16 | 2018-08-16 | Fujimori Kogyo Co., Ltd. | Adhesive resin laminate, laminate, and method of producing same |
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EP3886197A4 (en) * | 2018-11-21 | 2022-08-03 | LG Electronics Inc. | EXIT TAB FOR RECHARGEABLE BATTERY, CORRESPONDING MANUFACTURING DEVICE AND RECHARGEABLE BATTERY INCLUDING THE SAME |
EP3998649A4 (en) * | 2019-07-10 | 2023-07-19 | Dai Nippon Printing Co., Ltd. | ADHESIVE FILM FOR A METAL TERMINAL, METAL TERMINAL PROVIDED WITH THE ADHESIVE FILM INTENDED FOR A METAL TERMINAL, ENERGY STORAGE DEVICE IMPLEMENTING SUCH ADHESIVE FILM FOR A METAL TERMINAL, AND METHOD FOR PRODUCING ENERGY STORAGE DEVICE |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018133030A1 (en) * | 2017-01-20 | 2018-07-26 | Avery Dennison Corporation | Tab sealant |
JP6636121B1 (ja) * | 2018-11-23 | 2020-01-29 | 株式会社大北製作所 | 端子付きケース部材及びその製造方法 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002151024A (ja) * | 2000-11-15 | 2002-05-24 | Asahi Kasei Corp | 扁平型電池 |
JP2008235259A (ja) * | 2007-02-19 | 2008-10-02 | Railway Technical Res Inst | 低熱膨張線状体の製作方法 |
JP2009224218A (ja) * | 2008-03-17 | 2009-10-01 | Fujimori Kogyo Co Ltd | 封止フィルムおよび封止フィルム付電極 |
JP2010097853A (ja) * | 2008-10-17 | 2010-04-30 | Dainippon Printing Co Ltd | 金属端子フィルム及びそれが接着された金属端子 |
JP2010245000A (ja) * | 2009-04-10 | 2010-10-28 | Showa Denko Kk | 電気化学デバイス |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1102336B1 (en) * | 1999-04-08 | 2007-09-12 | Dai Nippon Printing Co., Ltd. | Lithium battery packaging laminated multilayer structure |
JP3596420B2 (ja) * | 2000-04-17 | 2004-12-02 | 松下電器産業株式会社 | 非水電解質二次電池 |
KR100901214B1 (ko) * | 2001-01-18 | 2009-06-05 | 다이니폰 인사츠 가부시키가이샤 | 전지장치 및 리드선용 필름 |
US7261935B2 (en) * | 2002-12-19 | 2007-08-28 | E. I. Du Pont De Nemours And Company | Co-extrudable multi-layer polymer |
US6844071B1 (en) * | 2003-10-06 | 2005-01-18 | General Electric Company | Multilayer articles comprising polycarbonate and polypropylene and method for their preparation |
-
2011
- 2011-11-07 JP JP2012542907A patent/JP5659241B2/ja active Active
- 2011-11-07 WO PCT/JP2011/075560 patent/WO2012063764A1/ja active Application Filing
- 2011-11-07 CN CN201180054069.7A patent/CN103222084B/zh active Active
- 2011-11-07 KR KR1020137011824A patent/KR101494811B1/ko active IP Right Grant
- 2011-11-09 TW TW104106424A patent/TWI601640B/zh active
- 2011-11-09 TW TW100140963A patent/TWI480160B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002151024A (ja) * | 2000-11-15 | 2002-05-24 | Asahi Kasei Corp | 扁平型電池 |
JP2008235259A (ja) * | 2007-02-19 | 2008-10-02 | Railway Technical Res Inst | 低熱膨張線状体の製作方法 |
JP2009224218A (ja) * | 2008-03-17 | 2009-10-01 | Fujimori Kogyo Co Ltd | 封止フィルムおよび封止フィルム付電極 |
JP2010097853A (ja) * | 2008-10-17 | 2010-04-30 | Dainippon Printing Co Ltd | 金属端子フィルム及びそれが接着された金属端子 |
JP2010245000A (ja) * | 2009-04-10 | 2010-10-28 | Showa Denko Kk | 電気化学デバイス |
Cited By (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014091542A1 (ja) * | 2012-12-10 | 2014-06-19 | 藤森工業株式会社 | 電池外装用積層体 |
WO2014091544A1 (ja) * | 2012-12-10 | 2014-06-19 | 藤森工業株式会社 | 非水系電池用の電極リード線部材 |
KR102200781B1 (ko) * | 2013-01-07 | 2021-01-12 | 도판 인사츠 가부시키가이샤 | 2차 전지용 금속 단자 피복 수지 필름 및 그 제조 방법, 및 전지 팩 |
WO2014106887A1 (ja) * | 2013-01-07 | 2014-07-10 | 凸版印刷株式会社 | 二次電池用金属端子被覆樹脂フィルム及びその製造方法並びに電池パック |
JP2014132538A (ja) * | 2013-01-07 | 2014-07-17 | Toppan Printing Co Ltd | 二次電池用金属端子被覆樹脂フィルムおよびその製造方法ならびに電池パック |
US10644273B2 (en) | 2013-01-07 | 2020-05-05 | Toppan Printing Co., Ltd. | Secondary battery metal terminal coating resin film, method for manufacturing same and battery pack |
CN104885256A (zh) * | 2013-01-07 | 2015-09-02 | 凸版印刷株式会社 | 二次电池用金属端子被覆树脂薄膜及其制造方法以及电池组 |
KR20150104097A (ko) * | 2013-01-07 | 2015-09-14 | 도판 인사츠 가부시키가이샤 | 2차 전지용 금속 단자 피복 수지 필름 및 그 제조 방법, 및 전지 팩 |
CN111509152A (zh) * | 2013-01-07 | 2020-08-07 | 凸版印刷株式会社 | 二次电池用金属端子被覆树脂薄膜以及电池组 |
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WO2015008826A1 (ja) * | 2013-07-17 | 2015-01-22 | 凸版印刷株式会社 | 二次電池用端子被覆樹脂フィルム、二次電池用タブ部材、および二次電池 |
JPWO2015008826A1 (ja) * | 2013-07-17 | 2017-03-02 | 凸版印刷株式会社 | 二次電池用端子被覆樹脂フィルム、二次電池用タブ部材、および二次電池 |
KR102507154B1 (ko) * | 2013-07-17 | 2023-03-08 | 도판 인사츠 가부시키가이샤 | 이차 전지용 단자 피복 수지 필름, 이차 전지용 탭 부재, 및 이차 전지 |
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WO2016052293A1 (ja) * | 2014-09-30 | 2016-04-07 | 大日本印刷株式会社 | 金属端子用接着性フィルム |
JPWO2016052293A1 (ja) * | 2014-09-30 | 2017-07-13 | 大日本印刷株式会社 | 金属端子用接着性フィルム |
JP2017069151A (ja) * | 2015-10-02 | 2017-04-06 | 大日本印刷株式会社 | 金属端子用接着性フィルム |
US20180230343A1 (en) * | 2017-02-16 | 2018-08-16 | Fujimori Kogyo Co., Ltd. | Adhesive resin laminate, laminate, and method of producing same |
JPWO2018186463A1 (ja) * | 2017-04-05 | 2020-02-20 | 大日本印刷株式会社 | 接着性保護フィルム、電池及びその製造方法 |
WO2018186463A1 (ja) * | 2017-04-05 | 2018-10-11 | 大日本印刷株式会社 | 接着性保護フィルム、電池及びその製造方法 |
JPWO2019078155A1 (ja) * | 2017-10-17 | 2020-12-03 | 大倉工業株式会社 | タブリード用フィルム、及びこれを用いたタブリード |
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JP2021532005A (ja) * | 2018-07-31 | 2021-11-25 | ダウ グローバル テクノロジーズ エルエルシー | 溶融フィラメント造形製造方法とそこで使用されるポリマーブレンド |
EP3886197A4 (en) * | 2018-11-21 | 2022-08-03 | LG Electronics Inc. | EXIT TAB FOR RECHARGEABLE BATTERY, CORRESPONDING MANUFACTURING DEVICE AND RECHARGEABLE BATTERY INCLUDING THE SAME |
JP2020095910A (ja) * | 2018-12-14 | 2020-06-18 | 積水化学工業株式会社 | 積層型電池 |
JP2019173033A (ja) * | 2019-07-08 | 2019-10-10 | 藤森工業株式会社 | 接着性樹脂フィルム、及び接着性樹脂積層体 |
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JP7311076B1 (ja) * | 2022-01-19 | 2023-07-19 | 大日本印刷株式会社 | 金属端子用接着性フィルム及びその製造方法、金属端子用接着性フィルム付き金属端子、当該金属端子用接着性フィルムを用いた蓄電デバイス、金属端子用接着性フィルムと蓄電デバイス用外装材を含むキット、並びに蓄電デバイスの製造方法 |
WO2023140338A1 (ja) * | 2022-01-19 | 2023-07-27 | 大日本印刷株式会社 | 金属端子用接着性フィルム及びその製造方法、金属端子用接着性フィルム付き金属端子、当該金属端子用接着性フィルムを用いた蓄電デバイス、金属端子用接着性フィルムと蓄電デバイス用外装材を含むキット、並びに蓄電デバイスの製造方法 |
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CN103222084A (zh) | 2013-07-24 |
KR20140003420A (ko) | 2014-01-09 |
TWI480160B (zh) | 2015-04-11 |
JPWO2012063764A1 (ja) | 2014-05-12 |
TW201522056A (zh) | 2015-06-16 |
CN103222084B (zh) | 2015-07-08 |
TWI601640B (zh) | 2017-10-11 |
KR101494811B1 (ko) | 2015-02-23 |
JP5659241B2 (ja) | 2015-01-28 |
TW201240817A (en) | 2012-10-16 |
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