WO2012053165A1 - Procédé d'abrasion de matières étrangères - Google Patents

Procédé d'abrasion de matières étrangères Download PDF

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Publication number
WO2012053165A1
WO2012053165A1 PCT/JP2011/005702 JP2011005702W WO2012053165A1 WO 2012053165 A1 WO2012053165 A1 WO 2012053165A1 JP 2011005702 W JP2011005702 W JP 2011005702W WO 2012053165 A1 WO2012053165 A1 WO 2012053165A1
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WO
WIPO (PCT)
Prior art keywords
height
polishing
foreign matter
height measurement
measurement range
Prior art date
Application number
PCT/JP2011/005702
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English (en)
Japanese (ja)
Inventor
佐藤　仁
Original Assignee
シャープ株式会社
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Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Publication of WO2012053165A1 publication Critical patent/WO2012053165A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/004—Machines or devices using grinding or polishing belts; Accessories therefor using abrasive rolled strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B24B21/06—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving members with limited contact area pressing the belt against the work, e.g. shoes sweeping across the whole area to be ground
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/033—Other grinding machines or devices for grinding a surface for cleaning purposes, e.g. for descaling or for grinding off flaws in the surface

Definitions

  • the present invention relates to a foreign matter polishing method for polishing and correcting foreign matter on the surface of a workpiece, and more particularly, to measures for quickly and reliably correcting foreign matter defects.
  • a color liquid crystal display device that has been widely used conventionally has a liquid crystal layer sealed between two substrates, a color filter substrate and an array substrate.
  • various fibers generated from clothing, etc. and foreign objects such as operator's skin tissue, metal powder, glass pieces, etc., adhere to the surface of the substrate, resulting in protrusion-like defects. Display defects such as missing pixels where an image is not formed in a portion occur. For this reason, the correction process which detects the location with the defect of the workpiece
  • polishing apparatus is performed.
  • a feeding reel around which a polishing tape is wound a take-up reel that winds up the polishing tape fed out from the feeding reel, and a polishing unit having a pressing head disposed between both reels, And is configured such that the foreign matter is spot-polished and corrected in a spot manner by pressing it against the foreign matter using a pressing head while the polishing tape is running.
  • Such a foreign material polishing apparatus is provided with a height measurement mechanism (microscope device) that observes the foreign material and detects the height of the foreign material, and the foreign object is observed by the height measurement mechanism and is determined to be corrected.
  • the polishing unit is lowered based on the height information of the foreign matter, and the foreign matter is polished and corrected while the polishing tape is running (see, for example, Patent Document 1).
  • the height measuring mechanism of the foreign substance polishing apparatus as disclosed in Patent Document 1 requires that foreign substances can be observed at a high magnification in order to reliably capture small foreign substances and accurately measure the height of the foreign substances. Therefore, a wide-angle lens cannot be adopted, and the monitor field of view is narrowed. For this reason, in the conventional foreign matter polishing apparatus, for example, when a large foreign matter such as a fiber is present on the workpiece surface, the range in which the height can be measured by the height measuring mechanism only reaches a part of the large foreign matter, and the measurement range When the height in the measurement result at is less than or equal to the predetermined height, it is determined that the polishing correction has been completed, and the polishing process is terminated. As a result, only a part of the large foreign matter can be corrected for polishing, and a portion that has not been polished remains, and there is a possibility that a foreign matter defect may occur despite the polishing correction.
  • the present invention has been made in view of such a point, and an object of the present invention is to correct the polishing quickly and reliably even if there is a large foreign matter.
  • the height measurement in a predetermined range based on the polishing portion and the polishing of the maximum height portion in the height measurement are repeatedly performed.
  • the polishing tape is fed out from the supply reel, and while being wound up by the take-up reel, the polishing tape between the supply reel and the take-up reel is pressed against the work surface by the pressing head,
  • the present invention is intended for a foreign matter polishing method for a workpiece surface that polishes and corrects foreign matter on the workpiece surface, and has taken the following solution.
  • the first invention is based on the inspection step of inspecting the foreign matter on the surface of the workpiece and acquiring the position and size information of the detected foreign matter, and the position and size information of the foreign matter detected in the inspection step,
  • the polishing step for polishing the maximum height portion to be equal to or lower than the predetermined height
  • the height measurement is performed. Process, polishing process and resetting process And repeating in sequence.
  • the initial measurement is performed on the foreign matter even if the height measurement range in which the height can be measured reaches only a part of the foreign matter.
  • the predetermined range including the peripheral area of the polishing location is reset to the height measurement range
  • the height of the workpiece surface is measured in the height measurement range, and the maximum height location is higher than the predetermined height.
  • the maximum height portion is polished. Then, the height measurement range is reset as described above, and thereafter, the same height measurement as described above, polishing of the maximum height portion, and resetting of the height measurement range are repeated.
  • the height of the place where the polishing process has been performed is a predetermined height or less, in the second and subsequent height measurement, the other places in the peripheral area of the polishing place are the maximum height places within the height measurement range, As a result, it becomes a location to be polished, and the height measurement range sequentially moves to an area close to the location to be polished. As a result, the height measurement range can be automatically scanned over the entire large foreign matter. Further, since the height is measured every time after the foreign substance polishing process, even if the foreign substance is displaced or deformed by the previous polishing process, the foreign substance is accurately polished correspondingly.
  • the entire large foreign matter can be reliably polished so as to be equal to or less than a predetermined height in accordance with the above-described scanning of the height measurement range. Therefore, even if there is a large foreign matter, it can be corrected quickly and reliably.
  • the foreign matter can be uniformly corrected by performing the same polishing correction process regardless of whether the foreign matter is small or large, so that the foreign matter defect can be corrected with a simple algorithm. It is possible to perform well.
  • the second invention is characterized in that, in the foreign matter polishing method of the first invention, in the initial setting step, a predetermined range including an end of the foreign matter is set as the height measurement range.
  • the second aspect of the invention when the foreign matter on the workpiece surface is a large foreign matter, even if the height measurement range in which the height can be measured reaches only a part of the foreign matter, one end portion of the large foreign matter is first a portion to be polished. Then, the height measurement range moves along with the polishing target portion sequentially to the center side and further to the other end side of the foreign matter, and polishing correction is performed over the entire foreign matter. Thereby, even if it is a linear large foreign substance like a fiber, for example, the measurement range can be scanned over the whole from one end side to the other end side of the foreign substance, and the entire foreign substance is reliably polished and corrected. Is possible.
  • a maximum height within a height measurement range in which the height is measured in the height measurement step is equal to or less than a predetermined height. If there is a part where the height is not measured in the area where the foreign object is present, a complementary setting for resetting a predetermined range including at least a part of the unmeasured part as the height measurement range
  • the method further includes a step, and the height measuring step, the polishing step, and the resetting step are sequentially repeated after the complementary setting step.
  • the predetermined range including at least a part of the unmeasured portion is reset to the height measurement range, and thereafter, as in the first invention, the height measurement and the maximum Since the polishing of the height location and the resetting of the height measurement range are repeated, it is possible to polish and correct the entire foreign matter even more reliably without leaving a part that has not been polished and corrected. become.
  • a fourth invention is characterized in that in the foreign matter polishing method according to any one of the first to third inventions, the workpiece is a display panel substrate.
  • the quality in a display device in which the quality is likely to deteriorate due to foreign matter, the quality can be remarkably improved and the manufacturing efficiency can be increased.
  • the predetermined range including the peripheral region of the polishing portion is reset to the height measurement range, and the height measurement range is set to the height measurement range.
  • the maximum height location is higher than the predetermined height, the maximum height location is repeatedly polished, so that even if there is a large foreign matter, it can be corrected quickly and reliably. As a result, it is possible to increase the efficiency of correcting foreign matter defects on the workpiece surface without increasing personnel costs, and to improve the product quality.
  • FIG. 1 is a perspective view schematically showing a foreign object polishing apparatus according to an embodiment.
  • FIG. 2 is a configuration diagram schematically showing the polishing unit of the embodiment.
  • FIG. 3 is a flowchart showing an outline of the periphery of the correction process in the manufacturing process of the liquid crystal display device.
  • FIG. 4 is a flowchart showing a foreign matter polishing method for a workpiece surface according to the embodiment.
  • FIG. 5A is a plan view showing an initially set height measurement range
  • FIG. 5B is a side view showing a state in which a large foreign material is initially polished.
  • FIG. 6A is a plan view showing the height measurement range set for the second time
  • FIG. 6B is a side view showing a state in which the large foreign matter is subjected to the second polishing process.
  • FIG. 7A is a plan view showing the height measurement range set for the third time
  • FIG. 7B is a side view showing a state in which the third foreign object is subjected to the third polishing process.
  • FIG. 8A is a plan view showing the height measurement range set after the fourth time
  • FIG. 8B is a side view showing a state in which the large foreign matter has been polished and corrected.
  • FIG. 9 is a flowchart showing a foreign matter polishing method for a workpiece surface according to a modification of the embodiment.
  • FIG. 1 is a schematic perspective view of a foreign matter polishing apparatus S of the present embodiment.
  • the foreign material polishing apparatus S includes a base 1 serving as a base and a flat work stage 3 fixedly disposed on the base 1. On the work stage 3, a work W to be corrected is placed. Although not shown, a plurality of suction holes are formed on the upper surface of the work stage 3, and these suction holes are connected to a vacuum suction means such as a vacuum pump. The work stage 3 is configured to suck and hold the placed work W by driving the vacuum suction means.
  • a moving mechanism that supports the scanning head 8 so as to be movable in the left-right direction (X direction in FIG. 1), the front-rear direction (Y direction in FIG. 1), and the up-down direction (Z direction in FIG. 1). 4 is provided.
  • the moving mechanism 4 includes a pair of guide rails 5 that are disposed so as to sandwich the work stage 3 and extend in the front-rear direction, and a gantry structure that is supported on the pair of guide rails 5 so as to be movable in the front-rear direction.
  • the gantry part 7 is provided.
  • the gantry unit 7 is moved in the front-rear direction along the pair of guide rails 5 by a front-rear moving mechanism (not shown) such as a feed screw mechanism or a linear motor that is operated by rotation of a drive motor.
  • a front-rear moving mechanism such as a feed screw mechanism or a linear motor that is operated by rotation of a drive motor.
  • a pair of guide rails 7a extending in the left-right direction and a ball screw 7b extending between the pair of guide rails 7a are provided, and the scanning head 8 moves in the left-right direction on the guide rails 7a. Supported as possible.
  • This scanning head 8 has a slider 8a provided with a ball nut (not shown) screwed to the ball screw 7b on the back side, and the ball screw 7b is rotated by a drive motor 7c provided at one end of the ball screw 7b. By doing so, it moves in the left-right direction along the guide rail 7a.
  • the scanning head 8 includes a height measuring mechanism 9 for measuring the height of the workpiece surface, and a polishing unit 10 disposed in the vicinity of the side of the height measuring mechanism 9.
  • the height measuring mechanism 9 includes a known digital micromirror device.
  • This digital micromirror device is a kind of display element in which a large number of micromirror surfaces (micromirrors) are arranged in a plane.
  • the height of the workpiece surface at each coordinate at a magnification of about 50 times, for example, by a so-called confocal system.
  • the distribution and thus the height distribution of the foreign matter 100 can be specified.
  • the range that can be measured at once by the height measuring mechanism 9 is, for example, a rectangular range having a side of 210 ⁇ m to 250 ⁇ m.
  • FIG. 2 is a schematic configuration diagram of the polishing unit 10.
  • the polishing unit 10 includes a polishing cassette 11.
  • the polishing cassette 11 has a shape similar to that of a normal audio cassette, and a payout reel 12 around which the polishing tape T is wound, and a take-up reel 13 disposed at a side of the payout reel 12 with a space therebetween.
  • a pair of guide rollers 14 for guiding the polishing tape T disposed below the reels 12 and 13 are rotatably supported by the cassette body 11a.
  • the supply reel 12 and the take-up reel 13 are driven by a drive motor (not shown) provided in the polishing unit 10, so that the polishing tape T supplied from the supply reel 12 is taken up by the take-up reel 13.
  • the abrasive tape T is run.
  • the polishing tape T has an adhesive surface layer loaded with an abrasive made of fine particles, and most of the polishing debris generated by polishing is taken into the polishing cassette 11 while adhering to the polishing tape T. It has become.
  • the polishing cassette 11 is detachably attached to the polishing unit main body 10a. For this reason, when the polishing tape T is used up, it is possible to supply the new polishing tape T without delay and perform highly efficient polishing correction work of the foreign matter 100 by replacing the polishing tape T. ing.
  • the polishing unit 10 further includes a pair of guide rollers 16 for guiding the polishing tape T so as to be positioned between the pair of guide rollers 14 in the polishing cassette 11 so as to be rotatably supported by the polishing unit main body 10a.
  • a pressing head 17 is provided between the pair of guide rollers 16 to press the polishing tape T against the foreign material 100 on the workpiece surface.
  • the pressing head 17 is held below the polishing cassette 11 by a holding member 18 fixedly disposed on the polishing unit main body 10a, and the polishing tape T is fed out from the feeding reel 12 through the guide rollers 14 and 16 and the take-up reel 13.
  • the tip is brought into pressure contact with the polishing tape T while being wound around.
  • the region that can be cut at once by pressing the polishing tape T with the pressing head 17 is, for example, a circle having a diameter of about 100 ⁇ m to 200 ⁇ m.
  • the size and shape of the area that can be shaved by pressing the polishing tape are not limited to this, and vary greatly depending on the pressing amount of the pressing head 17 and the shape of the tip of the pressing head 17.
  • the foreign matter polishing apparatus S includes a control device 20 for controlling each mechanism at an arbitrary position of the base 1, and the control device 20 is connected to the main server 21.
  • the main server 21 stores defect information such as the position and size of the defect on the workpiece surface detected by the inspection by the defect inspection device 22 separate from the foreign material polishing device S.
  • the configuration of the defect inspection apparatus 22 is not particularly limited as long as the defect can be detected by scanning the workpiece surface.
  • the defect inspection apparatus 22 cannot accurately measure the height of the workpiece surface, and cannot accurately grasp the shape of the foreign matter 100 that forms the detected defect.
  • FIG. 3 is a flowchart showing an outline of the periphery of the correction process in the manufacturing process of the liquid crystal display device.
  • a workpiece W to be inspected is prepared.
  • the workpiece W in this embodiment is, for example, an array substrate after an alignment film is formed on the surface.
  • the defect inspection apparatus 22 inspects the defect by the foreign material 100 which exists on the surface of the workpiece
  • step St02 it is determined whether or not a defect is detected, and if a defect is detected, whether or not the defect needs to be corrected is determined from defect information (position and size, etc.). If there is only a defect that has no defect or that does not need to be corrected, the process proceeds to step St03 and the workpiece W is stored in the accepted product cassette, and is then put into the bonding process in step St04, and is put on a normal production line. And bonded to the color filter substrate. On the other hand, if there is a defect that needs to be corrected, the process proceeds to step St05 to be stored in the correction target product cassette, and in the subsequent step St06, it is put into the correction process.
  • FIG. 4 is a flowchart showing a method for polishing the foreign material 100 on the workpiece surface in the correction process.
  • 5 to 8 show a state of each polishing process when the large foreign material 100 is polished a plurality of times, (a) is a plan view showing a height measurement range A, and (b) is a polishing. It is a side view of the processed foreign material 100.
  • a black circle “c” indicates a contact portion of the center of the pressing head 17 when the pressing head 17 is lowered, and a broken-line circle “a” with an oblique line on the inner side indicates that when the pressing head 17 is lowered.
  • Each of the polishing ranges is shown.
  • the foreign matter portion subjected to the polishing process is dot-hatched.
  • the control device 20 controls the foreign material polishing device S according to the sequence of the automatic mode.
  • the foreign material polishing apparatus S acquires defect information from the main server 21.
  • step St11 a defect that needs to be corrected is selected based on the acquired defect information. Then, based on the selected defect information (position and size), a predetermined range including at least a part of the region where the foreign material 100 forming the defect exists is set as the height measurement range A (initial setting step).
  • a range including the end of the foreign object 100 is set as a height measurement range A.
  • An outer two-dot chain line in FIG. 5A indicates a range in which the foreign matter 100 is estimated from the defect information.
  • a range including the entire region where the foreign object 100 exists is set as the height measurement range A.
  • the defect can be corrected normally by one polishing process, a case where a large foreign object 100 larger than a predetermined size is corrected by polishing will be described below.
  • the large foreign matter 100 exemplified in this embodiment is a linear foreign matter such as a fiber.
  • step St12 the scanning head 8 is moved so that the height measurement mechanism 9 is positioned above the initially set height measurement range A, and the height of the workpiece surface is adjusted in the height measurement range A. Measure accurately (height measurement process).
  • Step St13 it is determined whether or not the maximum height of the workpiece surface within the height measurement range A, that is, the maximum height of the foreign material 100 is a predetermined height h1, for example, 3 ⁇ m or less. At this time, if the maximum height of the foreign material 100 is 3 ⁇ m or less, the polishing correction for the foreign material 100 is not necessary, and the process jumps to Step St20. On the other hand, when the maximum height of the foreign object 100 is higher than 3 ⁇ m, the foreign object 100 needs to be corrected for polishing. Therefore, the process proceeds to step St14, and the maximum height portion M in the height measurement range A is set as the polishing target location. To do.
  • the scanning head 8 is moved so that the pressing head 17 is positioned above the set polishing target location, that is, the maximum height location M within the previous height measurement range A.
  • the polishing tape T is caused to travel, and the distance from the pressing head 17 to the foreign object 100 and the workpiece surface is estimated based on the measurement result by the height measuring mechanism 9, and the polishing unit 10 is lowered based on the estimated distance.
  • the polishing tape T traveling at the tip of the pressing head 17 is slid while being pressed against the foreign material 100, whereby the maximum height portion M of the foreign material 100 is spotted as shown in FIG.
  • Polishing correction polishing process.
  • the surface of the workpiece W is polished to a height h2 equal to or less than a predetermined height h1, for example, 2.5 ⁇ m so as not to be damaged.
  • step St16 the range including the peripheral area of the polishing location with reference to the polishing location, specifically, the range centering on the polishing location as shown in FIG. Re-set (re-setting process).
  • the height measurement range A moves from the initially set range to a proximity region centered on the location where the foreign object 100 is located.
  • step St17 the scanning head 8 is moved so that the height measurement mechanism 9 is positioned above the reset height measurement range A, and the height measurement mechanism 9 in the reset height measurement range A is moved. Accurately measures the height of the workpiece surface (height measurement process).
  • step St18 it is determined whether or not the maximum height of the foreign material 100 within the height measurement range A is 3 ⁇ m or less. At this time, if the maximum height of the foreign object 100 is 3 ⁇ m or less, the polishing correction for the foreign object 100 is completed, and the process proceeds to step St20. On the other hand, when the maximum height of the foreign material 100 is higher than 3 ⁇ m, the foreign material 100 still needs to be corrected for polishing. Therefore, the process returns to step St14 and the maximum height portion M in the height measurement range A set again is polished. The target location is set, and Steps St15 to St18 are performed again.
  • step St15 the scanning head 8 is moved, the polishing tape T is run, and the polishing unit 10 is moved downward, so that the polishing target position (previous time) is set again as shown in FIG.
  • the maximum height portion M) in the height measurement is polished (polishing step).
  • step St16 the range centered on this polishing location is reset to the height measurement range A (resetting step).
  • step St17 the scanning head 8 is moved, and the height of the workpiece surface is accurately measured by the height measuring mechanism 9 in the height measurement range A that has been reset previously (height measurement step).
  • step St18 it is determined whether or not the maximum height of the foreign object 100 within the height measurement range A is 3 ⁇ m or less.
  • step St14 If the maximum height of the foreign object 100 is greater than 3 ⁇ m, the process returns to step St14. Then, the maximum height portion M in the reset height measurement range A is set as a polishing target portion (resetting step), and in step St15, as shown in FIG. 7B, the polishing target portion is polished. (Polishing step).
  • steps St14 to St18 are repeated until the maximum height in the height measurement range A when the height of the workpiece surface is measured becomes 3 ⁇ m or less.
  • the height measurement range A sequentially moves along the foreign object 100 to an area close to the polishing target portion, and the height measurement range A with respect to the entire large foreign object 100.
  • the polishing process is sequentially performed while automatically scanning.
  • the large foreign matter 100 is polished and corrected so as to be less than or equal to a predetermined height throughout.
  • step St20 it is determined whether there is an uncorrected defect based on the defect information. If there is an uncorrected defect, the process returns to step St11 to select another defect and the subsequent steps are repeated. On the other hand, if there are no uncorrected defects, it is determined that all the polishing correction for the workpiece W has been completed, the process proceeds to step St21, and is put into the bonding process of step St04.
  • the range including the end of the foreign matter 100 is included.
  • the range including the peripheral area of the polishing location is set as the height measurement range A. Since the maximum height portion M within the height measurement range A is repeatedly polished, one end portion of the large foreign material 100 becomes the polishing target portion first, and then sequentially the center side of the foreign material X, Furthermore, the height measurement range A moves to the other end side together with the polishing target portion.
  • the height measurement range A can be automatically scanned over the entire large foreign matter 100. Further, since the height is measured every time the foreign object 100 is polished, even if the foreign object 100 is displaced or deformed by the previous polishing process, the foreign object 100 can be accurately polished correspondingly. As a result, the entire large foreign object 100 can be polished and corrected so as to be equal to or less than a predetermined height in accordance with the scanning of the height measurement range A described above. Therefore, even if there is a large foreign object 100, it is possible to correct and correct quickly and reliably. As a result, it is possible to increase the efficiency of correcting foreign matter defects on the workpiece surface without increasing personnel costs, and to improve the product quality.
  • the quality can be remarkably improved and the manufacturing efficiency can be improved in the display device in which the quality deterioration due to the foreign matter 100 is likely to occur. it can.
  • the foreign object 100 can be uniformly corrected by performing the same polishing correction process regardless of whether the foreign object 100 is small or large. Corrections can be made.
  • FIG. 9 is a flowchart showing a method of polishing the foreign material 100 on the workpiece surface in the correction process according to this modification.
  • step St13 and step St18 when it is determined in step St13 and step St18 whether the maximum height of the foreign matter 100 within the height measurement range A (the maximum height of the workpiece surface) is 3 ⁇ m or less, the maximum height is If it is 3 ⁇ m or less, it is determined that polishing correction for the foreign material 100 is not necessary or completed, and even if a portion where the height is not measured remains in the region where the foreign material 100 exists, the process proceeds to the next step St20.
  • this modification when a portion where the height is not measured remains in the region where the foreign material 100 exists, if the foreign material 100 is higher than 3 ⁇ m in the unmeasured portion, a defect may occur. Focusing on a certain point, a method of measuring the height of the region where the foreign object 100 exists over the entire region is adopted.
  • Step St13 and Step St18 when it is determined that the maximum height of the foreign object 100 is 3 ⁇ m or less, the process proceeds to Step St19-1, and there is a portion where the height is not measured in the region where the foreign object 100 exists. It is determined whether it remains. Whether or not the unmeasured part remains is determined by whether or not the unmeasured part exists in a range in which it is estimated from the defect information that the foreign object 100 exists. At this time, if there is an unmeasured part, the process proceeds to step St19-2, and a range including at least a part of the unmeasured part is set as the height measurement range A (complement setting step), and the process returns to step St12. The subsequent steps St13 to St18 are repeated. On the other hand, if there is no unmeasured portion, it is determined that polishing correction for the foreign material 100 is not necessary or completed, and the process proceeds to the next step St20.
  • the large foreign matter 100 can be more reliably polished and corrected without leaving a portion that has not been polished and corrected. Therefore, it can be used suitably also for the workpiece
  • the workpiece W is the array substrate after forming the alignment film constituting the liquid crystal display device, but it may be an array substrate before forming the alignment film or a color filter substrate. Furthermore, a substrate constituting another display device such as an organic EL (Electro Luminescence) display device or a plasma display device other than the liquid crystal display device can be used as the work W.
  • a substrate constituting another display device such as an organic EL (Electro Luminescence) display device or a plasma display device other than the liquid crystal display device can be used as the work W.
  • the present invention is useful for a foreign matter polishing method, and is particularly suitable for a foreign matter polishing method in which it is desired to improve the quality of a product by quickly and reliably polishing and correcting even if there is a large foreign matter. ing.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

Le procédé de l'invention comprend les étapes consistant à: détecter une matière étrangère (100) sur la surface d'une pièce (W), et acquérir des informations relatives à la position et à la taille de la matière étrangère (100) détectée; effectuer un réglage initial consistant à établir une plage prédéterminée, qui contient au moins une partie de la région dans laquelle se situe la matière étrangère (100), selon une plage de mesure de la hauteur; mesurer la hauteur de la surface de la pièce (W) dans la plage de mesure de la hauteur; abraser l'emplacement présentant la hauteur maximum, de sorte que la hauteur ne dépasse pas une hauteur prédéterminée quand la hauteur maximum, comprise dans la plage de mesure de la hauteur dans laquelle ladite hauteur a été mesurée à l'étape de mesure de la hauteur, est supérieure à la hauteur prédéterminée; et réajuster la plage prédéterminée contenant la région périphérique du lieu abrasé par rapport à la plage de mesure de la hauteur, en utilisant come ligne de base l'emplacement abrasé obtenu à l'étape d'abrasion. Après l'étape de réajustement, l'étape de mesure de la hauteur, l'étape d'abrasion et l'étape de réajustement sont répétées dans cet ordre.
PCT/JP2011/005702 2010-10-19 2011-10-12 Procédé d'abrasion de matières étrangères WO2012053165A1 (fr)

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JP2010234417 2010-10-19
JP2010-234417 2010-10-19

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Citations (5)

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JPS6263059A (ja) * 1985-09-12 1987-03-19 Nippon Steel Corp 金属材の表面疵自動研削装置
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JPH10253818A (ja) * 1997-03-13 1998-09-25 Sharp Corp 微小突起の除去方法及び除去装置
JP2003266292A (ja) * 2002-03-13 2003-09-24 Act Brain:Kk 基板欠陥のリペア装置及び方法
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