WO2011064919A1 - Appareil de polissage de matière étrangère et procédé pour polir une matière étrangère sur un ouvrage - Google Patents

Appareil de polissage de matière étrangère et procédé pour polir une matière étrangère sur un ouvrage Download PDF

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Publication number
WO2011064919A1
WO2011064919A1 PCT/JP2010/004868 JP2010004868W WO2011064919A1 WO 2011064919 A1 WO2011064919 A1 WO 2011064919A1 JP 2010004868 W JP2010004868 W JP 2010004868W WO 2011064919 A1 WO2011064919 A1 WO 2011064919A1
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WO
WIPO (PCT)
Prior art keywords
polishing
foreign matter
protrusion
tape
foreign material
Prior art date
Application number
PCT/JP2010/004868
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English (en)
Japanese (ja)
Inventor
佐藤仁
藤井茂喜
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Publication of WO2011064919A1 publication Critical patent/WO2011064919A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/004—Machines or devices using grinding or polishing belts; Accessories therefor using abrasive rolled strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
    • B24B13/0018—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor for plane optical surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/033—Other grinding machines or devices for grinding a surface for cleaning purposes, e.g. for descaling or for grinding off flaws in the surface

Definitions

  • the present invention relates to a foreign matter polishing apparatus and method for polishing and correcting foreign matter on a workpiece.
  • a color liquid crystal display device which has been widely used conventionally, liquid crystal is sealed between two glass substrates, a color filter substrate and an array substrate.
  • a transparent electrode film is formed on the color filter element of the color filter substrate, but when manufacturing the color filter substrate, various fibers generated from clothing etc. on the substrate surface, skin tissue of workers, metal pieces, When a foreign substance such as a glass piece adheres, a protruding defect is formed. When such a projecting defect occurs, the defect comes into contact with the counter electrode, resulting in a defect that an image is not formed at that portion. For this reason, for example, as in Patent Document 1, in the color filter manufacturing process, the shape and address of the protruding defect are detected by a defect inspection apparatus, and the protruding defect is corrected or removed in the correcting process. Yes.
  • the polishing tape 8 is fed out from the supply reel, and the polishing tape 8 between the supply reel and the take-up reel is pressed by the protrusion 112a of the polishing head 112 while being taken up by the take-up reel. Therefore, it is necessary to individually grind and correct the foreign matter A1 on the workpiece W.
  • the present invention has been made in view of such a point, and an object of the present invention is to enable efficient polishing correction even when a large foreign matter adheres to the workpiece surface.
  • the polishing head having a plurality of protrusions is polished with one of the protrusions according to the size of the foreign matter.
  • the present invention is intended for a foreign material polishing apparatus including a moving device that moves the polishing head to an arbitrary position on the workpiece.
  • the polishing head has a plurality of protrusions of different sizes and is rotatably supported, and a portion of the plurality of protrusions that comes into sliding contact with the polishing tape in sliding contact with any of the protrusions. It is comprised so that a foreign material may be grind
  • the polishing head is rotated in accordance with the size of the foreign matter, the corresponding size of protrusion is slidably contacted with the polishing tape, and the foreign matter is polished at that portion.
  • the plurality of protrusions are formed integrally with the polishing head.
  • the above-mentioned foreign material polishing method is: Defect capturing step for capturing defects on the workpiece surface and creating information for correction; A foreign matter selection step of selecting a foreign matter that needs to be corrected based on the above information; When the maximum length of the selected foreign matter is less than a predetermined reference, the polishing head is set to the normal foreign matter position and the first protrusion is the lower surface. A head switching step with two protrusions on the bottom surface; A foreign matter polishing step of polishing foreign matter with the polishing tape in contact with the first protrusion or the second protrusion, The contact area between the second protrusion and the polishing tape is larger than the contact area between the first protrusion and the polishing tape.
  • the projection size can be changed by rotating the polishing head in accordance with the size of the foreign matter, polishing can be efficiently performed even when a large amount of foreign matter adheres to the work surface. It can be carried out.
  • FIG. 2 shows a foreign substance polishing apparatus 1 according to an embodiment of the present invention.
  • the foreign substance polishing apparatus 1 includes a base portion 2 having a frame structure, for example, and a flat surface on which a workpiece W is placed on the upper surface of the base portion 2.
  • a work stage 3 is provided.
  • the workpiece W is an array substrate after a polyimide resin film is formed.
  • the work stage 3 is provided with a plurality of through holes (not shown), and the work W is fixed on the work stage 3 by sucking air.
  • a moving device 5 that supports the head body 4 so as to be movable in the X direction, the Y direction, and the Z direction.
  • the moving device 5 moves along the Y direction along a pair of rail portions 5a arranged along the Y direction on the opposite side surfaces of the base portion 2, and moves the head body 4 along the X direction and the Z direction.
  • a gantry portion 5b that is movably supported in a direction and a plurality of motors (not shown) are provided, and the head body 4 can be moved to an arbitrary position on the work stage 3.
  • the head body 4 includes a polishing cassette 7 shown in FIG.
  • the polishing cassette 7 has a shape similar to that of a normal audio tape, and includes a supply reel 9 around which the polishing tape 8 is wound, and a take-up reel 10 around which the polishing tape 8 is wound.
  • the supply reel 9 and the take-up reel 10 are driven by a motor (not shown) provided in the head body 4, and a pair of guide rollers 11 for guiding the polishing tape 8 is provided between the reels 9 and 10.
  • a polishing head 12 that is disposed between the pair of guide rollers 11 and presses the polishing tape 8 against the workpiece W.
  • the polishing tape 8 is prepared by putting polishing powder on a weakly sticky surface layer, and most of the polished material generated by polishing is taken into the polishing cassette 7 while adhering to the polishing tape 8. .
  • the polishing head 12 has first and second protrusions 12a and 12b having different sizes.
  • the polishing head 12 has a substantially rectangular shape in plan view, and the first or second protrusions 12a and 12b are respectively disposed at a pair of adjacent corners.
  • the polishing head 12 is rotatably supported by the head main body 4 around a rotation shaft 12c, and is driven to rotate by a motor (not shown).
  • the rotary shaft 12c is rotationally driven so that the first or second protrusions 12a and 12b are located on the lower surface, and the polishing tape 8 is slidably brought into contact with any of the protrusions 12a and 12b.
  • the contact area between the second protrusion 12 b and the polishing tape 8 is set larger than the contact area between the first protrusion 12 a and the polishing tape 8.
  • the portion where the polishing tape 8 is in sliding contact is pressed against a foreign substance and polished.
  • the polishing head 12 having a simple structure and being inexpensive can be obtained.
  • the first protrusion 12a is semicircular when viewed from the front, and the second protrusion 12b is elliptical when viewed from the front.
  • the maximum length of the second protrusion 12b may be set to 4 to 5 times the radius of the first protrusion 12a.
  • the shape of the first protrusion 12a and the second protrusion 12b is not particularly limited, and the ratio of the sizes is also not particularly limited. However, as shown in FIG. Since the polishing is often repeated up to 5 times, the size of the second protrusion 12b is optimally 4 to 5 times the size of the first protrusion 12a. Further, the number of protrusions is not limited to two and may be three or four. 7 and 8, the shapes of the first and second protrusions 12a and 12b are exaggerated, but actually, the first and second protrusions 12a and 12b are the size of the entire polishing head 12. On the other hand, it is formed smaller than that shown in the figure.
  • the foreign matter polishing apparatus 1 includes a control device 14 at an arbitrary position of the base portion 2, and the control device 14 is connected to the main server 15.
  • the main server 15 stores defect information for correcting defects such as the size and position of defects on the surface of the workpiece W captured by the defect capturing mechanism 16 provided in a device different from the foreign material polishing apparatus 1 in the previous process. ing.
  • the configuration of the defect capturing mechanism 16 is not particularly limited, but it is only necessary that the surface of the workpiece W can be scanned by a well-known imaging unit.
  • the height measuring mechanism 17 includes a known digital micromirror device.
  • This digital micromirror device is a kind of display element in which a number of micro mirror surfaces (micromirrors) (not shown) are arranged in a plane.
  • the so-called confocal method makes it possible to grasp the height distribution of foreign matter at each coordinate. It is configured.
  • the control device 14 moves the head body 4 to a foreign object that needs to be corrected based on the defect information stored in the main server 15, and measures the height of the foreign object with the height measuring mechanism 17. Has been.
  • an appropriate first protrusion 12a or second protrusion 12b is selected based on the defect information obtained by the defect capturing mechanism 16 by an automatic mode sequence in the control device 14.
  • the workpiece W is an array substrate after the polyimide resin film is formed.
  • step S01 defects are captured on the array substrate after the polyimide resin film is formed by the defect capturing mechanism 16.
  • the position and size of the foreign matter that needs to be corrected on the substrate are captured and stored in the main server 15. At this stage, the height is not captured accurately.
  • step S02 it is determined based on the defect information (foreign material position, size, etc.) whether foreign material polishing is necessary. If there is no defect or a defect that does not need to be polished, the process proceeds to step S03, and the process proceeds to an accepted cassette storage process. In step S04, a color filter substrate (not shown) is placed on a normal production line. Can be pasted together. On the other hand, if there is a defect that needs to be polished, in step S05, the process proceeds to the cassette housing process for correction. Therefore, the defective array substrate is stored in a cassette that goes to the correction process, and is put into the correction process in step S06.
  • the defect information foreign material position, size, etc.
  • the control device 14 controls the foreign material polishing device 1 according to the sequence of the automatic mode.
  • step S10 the foreign substance polishing apparatus 1 acquires defect information from the main server 15 (defect capturing step).
  • step S11 a foreign matter that needs to be corrected is selected based on the defect information (foreign matter selection step).
  • the selection criterion is arbitrarily set according to the workpiece W.
  • step S12 the selected foreign substance size is determined. If the maximum size of the foreign substance in plan view is less than 10 ⁇ m, it is the normal projection A1 and can be sufficiently polished by the first projection 12a.
  • the polishing head 12 is set so as to come to (normally foreign matter position). If it is 10 ⁇ m or more, since it is a large foreign matter A2, the process proceeds to step S14, and as shown in FIG. (Large foreign object position). It should be noted that the value of 10 ⁇ m serving as a judgment criterion may be increased or decreased in accordance with the processing capability of the polishing tape 8, the shape of the polishing head 12, and the like.
  • step S15 a foreign substance polishing step is performed.
  • the moving device 5 performs centering on the foreign matter.
  • step S16 the center height of the centered foreign matter is accurately measured by the digital micromirror device.
  • polishing correction is performed in step S17.
  • the polishing tape 8 is fed out from the supply reel 9 and while being wound up by the take-up reel 10, the polishing tape 8 between the supply reel 9 and the take-up reel 10 is pressed by the polishing head 12 to press the workpiece W. Polish and correct the foreign material on the surface.
  • the amount of pressing is based on the average surface of the array substrate, and the polishing tape 8 is run to a height of about 1 to 2 ⁇ m from the reference.
  • step S18 again, a height measurement process is performed, and the height after polishing correction is measured.
  • step S19 if the height is, for example, 3 ⁇ m or more, it is determined that polishing correction is still necessary, and the process returns to step S17 again to perform polishing correction. If the height is less than 3 ⁇ m, the process proceeds to step S20. Although not shown, even if step S17 is repeated a plurality of times at the same coordinates, if there is no change in height, it is determined that further polishing will not be effective, and polishing may be stopped.
  • step S20 it is determined whether there is an uncorrected defect based on the defect information. If there is an uncorrected defect, the process returns to step S11 to select another foreign object, and the subsequent steps are repeated. On the other hand, if there are no uncorrected defects, it is determined that polishing correction has been completed, and in step S21, the process is put into the bonding step in step S04.
  • the present invention may be configured as follows with respect to the above embodiment.
  • the workpiece W is the array substrate after the polyimide resin film is formed in the liquid crystal display device, but is not limited thereto, and may be an array substrate before the polyimide resin film is formed or a color filter substrate. Good. Furthermore, the present invention can also be applied to plasma display substrates other than liquid crystal display devices.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

L'invention porte sur un procédé pour polir une matière étrangère sur un ouvrage, où des défauts présents sur la surface de l'ouvrage sont capturés, une information de correction est produite et une matière étrangère qui nécessite une correction est sélectionnée sur la base de l'information. Dans le procédé, il se produit une commutation entre un mode dans lequel une première saillie est définie comme la surface inférieure par le fait qu'on a une tête de polissage dans une position de matière étrangère normale lorsque la longueur maximale de la matière étrangère sélectionnée est inférieure à une longueur de référence prédéterminée, et un mode dans lequel une seconde saillie, plus grande que la première saillie est définie comme la surface inférieure par le fait qu'on a la tête de polissage dans une position de matière étrangère de grande dimension lorsque la longueur maximale de la matière étrangère sélectionnée est la longueur de référence prédéterminée ou plus grande. Ensuite, la matière étrangère est polie au moyen d'une bande de polissage en contact avec la première saillie ou avec la seconde saillie. De cette façon, même dans le cas où une matière étrangère de grande dimension adhère sur la surface de l'ouvrage, le polissage est réalisé efficacement.
PCT/JP2010/004868 2009-11-24 2010-08-02 Appareil de polissage de matière étrangère et procédé pour polir une matière étrangère sur un ouvrage WO2011064919A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-266145 2009-11-24
JP2009266145 2009-11-24

Publications (1)

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WO2011064919A1 true WO2011064919A1 (fr) 2011-06-03

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013003289A (ja) * 2011-06-15 2013-01-07 Toppan Printing Co Ltd カラーフィルタ基板の欠陥修正装置及び欠陥修正方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5974049U (ja) * 1982-11-09 1984-05-19 竹川鉄工株式会社 ベルトサンダ−機の踏圧パツド装置
JPH04300158A (ja) * 1991-03-26 1992-10-23 Shinkusu Kk ベルトサンダー機の踏圧パッド装置
JP2002283206A (ja) * 2001-03-28 2002-10-03 Toray Ind Inc 突起物研磨方法および研磨装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5974049U (ja) * 1982-11-09 1984-05-19 竹川鉄工株式会社 ベルトサンダ−機の踏圧パツド装置
JPH04300158A (ja) * 1991-03-26 1992-10-23 Shinkusu Kk ベルトサンダー機の踏圧パッド装置
JP2002283206A (ja) * 2001-03-28 2002-10-03 Toray Ind Inc 突起物研磨方法および研磨装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013003289A (ja) * 2011-06-15 2013-01-07 Toppan Printing Co Ltd カラーフィルタ基板の欠陥修正装置及び欠陥修正方法

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