WO2011070717A1 - Procédé d'abrasion de corps étrangers sur une surface de pièce à travailler et dispositif pour abraser des corps étrangers - Google Patents

Procédé d'abrasion de corps étrangers sur une surface de pièce à travailler et dispositif pour abraser des corps étrangers Download PDF

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Publication number
WO2011070717A1
WO2011070717A1 PCT/JP2010/006567 JP2010006567W WO2011070717A1 WO 2011070717 A1 WO2011070717 A1 WO 2011070717A1 JP 2010006567 W JP2010006567 W JP 2010006567W WO 2011070717 A1 WO2011070717 A1 WO 2011070717A1
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WO
WIPO (PCT)
Prior art keywords
polishing
foreign matter
reel
foreign
tape
Prior art date
Application number
PCT/JP2010/006567
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English (en)
Japanese (ja)
Inventor
佐藤仁
Original Assignee
シャープ株式会社
株式会社ブイ・テクノロジー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社, 株式会社ブイ・テクノロジー filed Critical シャープ株式会社
Priority to JP2011545053A priority Critical patent/JP5442030B2/ja
Priority to CN201080053452.6A priority patent/CN102639295B/zh
Publication of WO2011070717A1 publication Critical patent/WO2011070717A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/033—Other grinding machines or devices for grinding a surface for cleaning purposes, e.g. for descaling or for grinding off flaws in the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/004—Machines or devices using grinding or polishing belts; Accessories therefor using abrasive rolled strips

Definitions

  • the present invention relates to a foreign matter polishing method and foreign matter polishing apparatus for a workpiece surface that corrects the foreign matter on the workpiece surface by polishing.
  • a color liquid crystal display device which has been widely used conventionally, liquid crystal is sealed between two glass substrates, a color filter substrate and an array substrate.
  • a transparent electrode film is formed on the color filter element of the color filter substrate, but when manufacturing the color filter substrate, various fibers generated from clothing etc. on the substrate surface, skin tissue of workers, metal pieces, When a foreign substance such as a glass piece adheres, a protruding defect is formed. When such a projecting defect occurs, the defect comes into contact with the counter electrode, resulting in a defect that an image is not formed at that portion. For this reason, for example, as in Patent Document 1, in the color filter manufacturing process, the shape and address of the protruding defect are detected by a defect inspection apparatus, and the protruding defect is corrected or removed in the correcting process. Yes.
  • the polishing tape 8 is fed from the supply reel, and while being wound by the take-up reel, the polishing tape 8 between the supply reel and the take-up reel is pressed by the polishing head 12 to press the work W It is necessary to grind and correct the foreign matter A on the top.
  • polishing is performed while pressing the foreign matter A by the polishing head 12 at the center position Xa of the foreign matter A.
  • the pressure on the substrate W against the foreign material A is the strongest, and the hard foreign material A such as metal is dragged in the feeding direction of the polishing tape 8 and scratches the surface of the substrate W, causing the panel to light up.
  • a brittle foreign material A ′ such as a fragile and fragile resin is polished while being pressed at its center position Xa, it is crushed and scattered on the substrate W to remain. Therefore, there is a problem that the quality deteriorates.
  • the present invention has been made in view of such points, and the object of the present invention is to efficiently perform polishing correction without deteriorating the quality even when hard foreign matters or brittle foreign matters adhere to the workpiece surface. It is to be able to do it.
  • the center position of the polishing head is shifted with respect to the foreign substance center position.
  • the polishing tape between the supply reel and the take-up reel While removing the polishing tape from the supply reel and winding it with the take-up reel, press the polishing tape between the supply reel and the take-up reel with the polishing head to polish and correct the foreign matter on the work surface. For polishing method.
  • the above-mentioned foreign material polishing method is: Defect capturing step for capturing defects on the workpiece surface and creating information for correction; A foreign matter selection step of selecting a foreign matter that needs to be corrected based on the above information; A position shift step of specifying a foreign substance center position, which is the center of the selected foreign substance, and shifting the center of the polishing head from the foreign substance center position to the side opposite to the feeding direction of the polishing tape.
  • the center of the polishing head is shifted from the foreign substance center position to the side opposite to the feeding direction of the polishing tape. Without being damaged, the foreign matter is lifted in the direction of feeding the polishing tape, adheres to the polishing tape, and is wound as it is on the take-up reel.
  • the powder is scooped up in the direction of feeding the polishing tape, so that most of the powder adheres to the polishing tape without scattering, and the take-up reel Rolled up.
  • it is a normal foreign substance that is neither hard nor brittle the side opposite to the feeding direction of the foreign substance is polished, and even if the feeding direction side remains, the remaining part may be polished thereafter.
  • the polishing material generated by the polishing is configured to be wound around the winding reel while adhering to the polishing tape.
  • the present invention is intended for a foreign material polishing apparatus including a moving device that moves the polishing head to an arbitrary position on the workpiece.
  • polishing apparatus is A defect capturing mechanism for capturing defects on the workpiece surface and creating information for correction; Based on the information obtained by the defect capturing mechanism, a foreign matter that needs to be corrected is selected, a foreign matter center position that is the center of the selected foreign matter is specified, and the feeding direction of the polishing tape is determined from the foreign matter center position. And a control device for shifting the center of the polishing head to the opposite side by the moving device.
  • the control device shifts the center of the polishing head to the opposite side of the feeding direction of the polishing tape by the moving device with respect to the center position of the foreign matter that needs to be corrected by the defect capturing mechanism.
  • the foreign matter is lifted in the feeding direction of the polishing tape and adheres to the polishing tape without being damaged by excessive pressing, and is wound on the take-up reel as it is.
  • the powder is scooped up in the direction of feeding the polishing tape, so that most of the powder adheres to the polishing tape without scattering, and the take-up reel Rolled up.
  • it is a normal foreign material that is neither hard nor brittle, the side opposite to the feeding direction of the foreign material is polished, so that the remaining portion may be polished thereafter.
  • the polishing tape is composed of a surface having a weak adhesive surface and a polishing powder prepared therein, and a polished product generated by polishing is configured to be wound around the take-up reel while adhering to the polishing tape.
  • the foreign matter that needs to be corrected is selected based on the defect information on the workpiece surface, and polishing is performed from the foreign matter center position of the selected foreign matter to the side opposite to the feeding direction of the polishing tape.
  • FIG. 2 shows a foreign substance polishing apparatus 1 according to an embodiment of the present invention.
  • the foreign substance polishing apparatus 1 includes a base portion 2 having a frame structure, for example, and a flat surface on which a workpiece W is placed on the upper surface of the base portion 2.
  • a work stage 3 is provided.
  • the workpiece W is an array substrate after a polyimide resin film is formed.
  • the work stage 3 is provided with a plurality of through holes (not shown), and the work W is fixed on the work stage 3 by sucking air.
  • a moving device 5 that supports the head body 4 so as to be movable in the X direction, the Y direction, and the Z direction.
  • the moving device 5 moves along the Y direction along a pair of rail portions 5a arranged along the Y direction on the opposite side surfaces of the base portion 2, and moves the head body 4 along the X direction and the Z direction.
  • a gantry portion 5b that is movably supported in a direction and a plurality of motors (not shown) are provided, and the head body 4 can be moved to an arbitrary position on the work stage 3.
  • the head body 4 includes a polishing cassette 7 shown in FIG.
  • the polishing cassette 7 has a shape similar to that of a normal audio tape, and includes a supply reel 9 around which the polishing tape 8 is wound, and a take-up reel 10 around which the polishing tape 8 is wound.
  • the supply reel 9 and the take-up reel 10 are driven by a motor (not shown) provided in the head body 4, and a pair of guide rollers 11 for guiding the polishing tape 8 is provided between the reels 9 and 10.
  • a polishing head 12 that is disposed between the pair of guide rollers 11 and presses the polishing tape 8 against the workpiece W.
  • the polishing tape 8 is composed of a weakly sticky surface layer in which polishing powder made of fine particles is charged.
  • the foreign matter polishing apparatus 1 includes a control device 14 at an arbitrary position of the base portion 2, and the control device 14 is connected to the main server 15.
  • the main server 15 stores defect information for defect correction such as the size and position of defects on the surface of the workpiece W, which is supplemented by a defect capturing mechanism 16 provided in a device different from the foreign material polishing device 1 in the previous process. ing.
  • the configuration of the defect capturing mechanism 16 is not particularly limited, but it is only necessary that the surface of the workpiece W can be scanned by a well-known imaging unit.
  • the height measuring mechanism 17 includes a known digital micromirror device.
  • This digital micromirror device is a type of display element in which a number of micro mirror surfaces (micromirrors) (not shown) are arranged in a plane, and the so-called confocal method makes it possible to specify the height distribution of foreign matter at each coordinate. It is configured.
  • the control device 14 moves the head body 4 to a foreign object that needs to be corrected based on the defect information stored in the main server 15, and measures the height of the foreign object with the height measuring mechanism 17. Has been.
  • the foreign substance center position Xa of the foreign substances A and A ′ is specified from the detection result of the height measuring mechanism 17 and the like by the sequence of the automatic mode in the control device 14.
  • the polishing head 12 is configured to shift.
  • the work W is an array substrate after the polyimide resin film is formed.
  • step S01 defects are captured on the array substrate after the polyimide resin film is formed by the defect capturing mechanism 16.
  • the position and size of the foreign matter that needs to be corrected on the board are supplemented and stored in the main server 15.
  • the height of the foreign material is not accurately captured.
  • step S02 it is determined based on the defect information (foreign material position, size, etc.) whether foreign material polishing is necessary. If there is no defect or a defect that does not need to be polished, the process proceeds to step S03 and proceeds to the accepted product cassette storage process. In step S04, a color filter substrate (not shown) is placed on a normal production line. Can be pasted together. On the other hand, if there is a defect that needs to be polished, in step S05, the process proceeds to the cassette housing process for correction. Therefore, the defective array substrate is stored in a cassette that goes to the correction process, and is put into the correction process in step S06.
  • the defect information foreign material position, size, etc.
  • the control device 14 controls the foreign material polishing device 1 according to the sequence of the automatic mode.
  • step S10 the foreign substance polishing apparatus 1 acquires defect information from the main server 15 (defect capturing step).
  • step S11 a foreign matter that needs to be corrected is selected based on the defect information (foreign matter selection step).
  • the selection criterion is arbitrarily set according to the workpiece W.
  • step S12 the height of the selected foreign object is accurately measured by the digital micromirror device. Data is obtained in a map.
  • step S13 the foreign substance center position Xa of the selected foreign substance is specified.
  • the foreign object center position Xa is recognized from the defect information image, or the highest position among the height data obtained by the height measurement mechanism 17 is recognized as the foreign object center position Xa.
  • step S14 it is determined whether or not the foreign substances A and A 'need to be shifted.
  • the determination is made by image processing to determine whether the foreign matter is a hard foreign matter A such as a metal exceeding the processing capability of the polishing tape 8 or a brittle foreign matter A ′ such as a very brittle brittle resin.
  • a shape pattern or the like of the foreign matter A or A ' may be input in advance and the image may be recognized and automatically determined.
  • the defect information may be recognized as hard foreign matter A if it is highly reflective (appears white) or has a defect profile that tends to cause scratches C.
  • a brittle foreign matter A ′ may be recognized as a brittle foreign matter A ′ having a defect profile that tends to be crushed. Further, since the shift is not necessary when the hard foreign matter A or the brittle foreign matter A ′ is not used, the target center X of the polishing head 12 is set to the foreign matter center position Xa in step S15. On the other hand, when the foreign matter is a hard foreign matter A or a brittle foreign matter A ′, in step S16, the target center X of the polishing head 12 is moved in the direction opposite to the feeding direction of the polishing tape 8 from the foreign matter center position Xa (right in FIGS. 5 and 6). Shift (direction) by Y. The size of Y is arbitrary, and may be set individually depending on the shape, characteristics, etc. of the foreign matter A, A ', but may be constant, for example, 100 ⁇ m for simplification of the process.
  • step S17 the center of the polishing head 12 is centered on the target center X.
  • polishing correction is performed in step S18.
  • the polishing tape 8 is fed out from the supply reel 9 and while being wound up by the take-up reel 10, the polishing tape 8 between the supply reel 9 and the take-up reel 10 is pressed by the polishing head 12 to press the workpiece W. Polish and correct the foreign material on the surface.
  • the amount of pressing is based on the average surface of the array substrate, and the polishing tape 8 is run to a height of about 1 to 2 ⁇ m from the reference.
  • the target center X of the polishing head 12 is shifted from the foreign matter center position Xa by 100 ⁇ m to the side opposite to the feeding direction of the polishing tape 8.
  • the surface of the workpiece W is not damaged by pressing A too much, and the hard foreign matter A is lifted in the feeding direction of the polishing tape 8, adheres to the polishing tape 8, and is wound on the take-up reel 10 as it is.
  • the target center X of the polishing head 12 is shifted from the foreign matter center position Xa by 100 ⁇ m to the side opposite to the feeding direction of the polishing tape 8. Even when pulverized when pressed, most of the generated powder is scooped up in the feeding direction of the polishing tape 8, so that it adheres to the polishing tape 8 without being scattered and is wound around the take-up reel 10 as it is.
  • step S14 if the foreign matter recognized as the hard foreign matter A or the brittle foreign matter A ′ in step S14 is a normal foreign matter that is not actually hard or brittle, the side opposite to the feeding direction is left with the foreign matter remaining on the workpiece W. Can be polished. Also in this case, the polished material (scraps) adheres to the polishing tape 8 and is wound on the take-up reel 10 as it is.
  • step S19 again the height measurement process is performed again, and the height after polishing correction is measured.
  • step S20 if the polishing is insufficient and the height is, for example, 3 ⁇ m or more, it is determined that the polishing correction is still necessary, and the process returns to step S18 again and the polishing correction is performed. Polishing correction may be performed after centering the foreign matter remaining before polishing. If the height is less than 3 ⁇ m, the process proceeds to step S21. Although not shown, even if step S18 is repeated a plurality of times at the same coordinates, if there is no change in height, it is determined that further polishing will not be effective, and polishing may be stopped.
  • step S21 it is determined whether there is an uncorrected defect based on the defect information. If there is an uncorrected defect, the process returns to step S11 to select another foreign object, and the subsequent steps are repeated. On the other hand, if there are no uncorrected defects, it is determined that all polishing corrections have been made, and the process proceeds to step S04 in step S04.
  • the quality is significantly improved compared to the conventional case, and the production line is not stopped more than necessary, so that the production efficiency is improved.
  • the polishing correction is performed without deteriorating the quality. Can be performed efficiently.
  • the present invention may be configured as follows with respect to the above embodiment.
  • the workpiece W is the array substrate after the polyimide resin film is formed in the liquid crystal display device, but is not limited thereto, and may be an array substrate before the polyimide resin film is formed or a color filter substrate. Good. Furthermore, the present invention can also be applied to plasma display substrates other than liquid crystal display devices.
  • the present invention is useful for a foreign matter polishing method and a foreign matter polishing apparatus that polish and correct foreign matter on the workpiece surface.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

Selon l'invention, un défaut sur la surface d'une pièce à travailler est capturé, une information sur la correction est créée, un corps étranger nécessitant une correction est sélectionné, le centre du corps étranger sélectionné, autrement dit le centre de corps étranger (Xa), est identifié, et le centre d'une tête d'abrasion est décalé de ce centre de corps étranger (Xa) vers une direction opposée à la direction dans laquelle une bande abrasive avance. Ensuite, tandis que l'on fait avancer la bande abrasive à partir d'un rouleau d'alimentation et que l'on enroule la bande abrasive sur un rouleau d'enroulement, la partie de la bande abrasive entre le rouleau d'alimentation et le rouleau d'enroulement est pressée contre la tête d'abrasion, et le corps étranger sur la surface de la pièce à travailler est abrasé et corrigé. Du fait de ce qui précède, même si un corps étranger dur ou un corps étranger cassant colle à la surface de la pièce à travailler, une correction par abrasion peut être effectuée efficacement sans détériorer la qualité.
PCT/JP2010/006567 2009-12-08 2010-11-09 Procédé d'abrasion de corps étrangers sur une surface de pièce à travailler et dispositif pour abraser des corps étrangers WO2011070717A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011545053A JP5442030B2 (ja) 2009-12-08 2010-11-09 ワーク表面の異物研磨方法及び異物研磨装置
CN201080053452.6A CN102639295B (zh) 2009-12-08 2010-11-09 工件表面的异物研磨方法和异物研磨装置

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Application Number Priority Date Filing Date Title
JP2009-278360 2009-12-08
JP2009278360 2009-12-08

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WO2011070717A1 true WO2011070717A1 (fr) 2011-06-16

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JP (1) JP5442030B2 (fr)
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Publication number Priority date Publication date Assignee Title
CN110170922B (zh) * 2019-06-03 2020-12-04 北京石油化工学院 自动化打磨方法、装置和设备
CN115741412A (zh) * 2023-01-09 2023-03-07 中国建筑一局(集团)有限公司 一种建筑钢管的除锈装置

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