WO2012053165A1 - Foreign material abrading method - Google Patents

Foreign material abrading method Download PDF

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Publication number
WO2012053165A1
WO2012053165A1 PCT/JP2011/005702 JP2011005702W WO2012053165A1 WO 2012053165 A1 WO2012053165 A1 WO 2012053165A1 JP 2011005702 W JP2011005702 W JP 2011005702W WO 2012053165 A1 WO2012053165 A1 WO 2012053165A1
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WO
WIPO (PCT)
Prior art keywords
height
polishing
foreign matter
height measurement
measurement range
Prior art date
Application number
PCT/JP2011/005702
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French (fr)
Japanese (ja)
Inventor
佐藤　仁
Original Assignee
シャープ株式会社
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Publication date
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Publication of WO2012053165A1 publication Critical patent/WO2012053165A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/004—Machines or devices using grinding or polishing belts; Accessories therefor using abrasive rolled strips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B24B21/06—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving members with limited contact area pressing the belt against the work, e.g. shoes sweeping across the whole area to be ground
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/033—Other grinding machines or devices for grinding a surface for cleaning purposes, e.g. for descaling or for grinding off flaws in the surface

Definitions

  • the present invention relates to a foreign matter polishing method for polishing and correcting foreign matter on the surface of a workpiece, and more particularly, to measures for quickly and reliably correcting foreign matter defects.
  • a color liquid crystal display device that has been widely used conventionally has a liquid crystal layer sealed between two substrates, a color filter substrate and an array substrate.
  • various fibers generated from clothing, etc. and foreign objects such as operator's skin tissue, metal powder, glass pieces, etc., adhere to the surface of the substrate, resulting in protrusion-like defects. Display defects such as missing pixels where an image is not formed in a portion occur. For this reason, the correction process which detects the location with the defect of the workpiece
  • polishing apparatus is performed.
  • a feeding reel around which a polishing tape is wound a take-up reel that winds up the polishing tape fed out from the feeding reel, and a polishing unit having a pressing head disposed between both reels, And is configured such that the foreign matter is spot-polished and corrected in a spot manner by pressing it against the foreign matter using a pressing head while the polishing tape is running.
  • Such a foreign material polishing apparatus is provided with a height measurement mechanism (microscope device) that observes the foreign material and detects the height of the foreign material, and the foreign object is observed by the height measurement mechanism and is determined to be corrected.
  • the polishing unit is lowered based on the height information of the foreign matter, and the foreign matter is polished and corrected while the polishing tape is running (see, for example, Patent Document 1).
  • the height measuring mechanism of the foreign substance polishing apparatus as disclosed in Patent Document 1 requires that foreign substances can be observed at a high magnification in order to reliably capture small foreign substances and accurately measure the height of the foreign substances. Therefore, a wide-angle lens cannot be adopted, and the monitor field of view is narrowed. For this reason, in the conventional foreign matter polishing apparatus, for example, when a large foreign matter such as a fiber is present on the workpiece surface, the range in which the height can be measured by the height measuring mechanism only reaches a part of the large foreign matter, and the measurement range When the height in the measurement result at is less than or equal to the predetermined height, it is determined that the polishing correction has been completed, and the polishing process is terminated. As a result, only a part of the large foreign matter can be corrected for polishing, and a portion that has not been polished remains, and there is a possibility that a foreign matter defect may occur despite the polishing correction.
  • the present invention has been made in view of such a point, and an object of the present invention is to correct the polishing quickly and reliably even if there is a large foreign matter.
  • the height measurement in a predetermined range based on the polishing portion and the polishing of the maximum height portion in the height measurement are repeatedly performed.
  • the polishing tape is fed out from the supply reel, and while being wound up by the take-up reel, the polishing tape between the supply reel and the take-up reel is pressed against the work surface by the pressing head,
  • the present invention is intended for a foreign matter polishing method for a workpiece surface that polishes and corrects foreign matter on the workpiece surface, and has taken the following solution.
  • the first invention is based on the inspection step of inspecting the foreign matter on the surface of the workpiece and acquiring the position and size information of the detected foreign matter, and the position and size information of the foreign matter detected in the inspection step,
  • the polishing step for polishing the maximum height portion to be equal to or lower than the predetermined height
  • the height measurement is performed. Process, polishing process and resetting process And repeating in sequence.
  • the initial measurement is performed on the foreign matter even if the height measurement range in which the height can be measured reaches only a part of the foreign matter.
  • the predetermined range including the peripheral area of the polishing location is reset to the height measurement range
  • the height of the workpiece surface is measured in the height measurement range, and the maximum height location is higher than the predetermined height.
  • the maximum height portion is polished. Then, the height measurement range is reset as described above, and thereafter, the same height measurement as described above, polishing of the maximum height portion, and resetting of the height measurement range are repeated.
  • the height of the place where the polishing process has been performed is a predetermined height or less, in the second and subsequent height measurement, the other places in the peripheral area of the polishing place are the maximum height places within the height measurement range, As a result, it becomes a location to be polished, and the height measurement range sequentially moves to an area close to the location to be polished. As a result, the height measurement range can be automatically scanned over the entire large foreign matter. Further, since the height is measured every time after the foreign substance polishing process, even if the foreign substance is displaced or deformed by the previous polishing process, the foreign substance is accurately polished correspondingly.
  • the entire large foreign matter can be reliably polished so as to be equal to or less than a predetermined height in accordance with the above-described scanning of the height measurement range. Therefore, even if there is a large foreign matter, it can be corrected quickly and reliably.
  • the foreign matter can be uniformly corrected by performing the same polishing correction process regardless of whether the foreign matter is small or large, so that the foreign matter defect can be corrected with a simple algorithm. It is possible to perform well.
  • the second invention is characterized in that, in the foreign matter polishing method of the first invention, in the initial setting step, a predetermined range including an end of the foreign matter is set as the height measurement range.
  • the second aspect of the invention when the foreign matter on the workpiece surface is a large foreign matter, even if the height measurement range in which the height can be measured reaches only a part of the foreign matter, one end portion of the large foreign matter is first a portion to be polished. Then, the height measurement range moves along with the polishing target portion sequentially to the center side and further to the other end side of the foreign matter, and polishing correction is performed over the entire foreign matter. Thereby, even if it is a linear large foreign substance like a fiber, for example, the measurement range can be scanned over the whole from one end side to the other end side of the foreign substance, and the entire foreign substance is reliably polished and corrected. Is possible.
  • a maximum height within a height measurement range in which the height is measured in the height measurement step is equal to or less than a predetermined height. If there is a part where the height is not measured in the area where the foreign object is present, a complementary setting for resetting a predetermined range including at least a part of the unmeasured part as the height measurement range
  • the method further includes a step, and the height measuring step, the polishing step, and the resetting step are sequentially repeated after the complementary setting step.
  • the predetermined range including at least a part of the unmeasured portion is reset to the height measurement range, and thereafter, as in the first invention, the height measurement and the maximum Since the polishing of the height location and the resetting of the height measurement range are repeated, it is possible to polish and correct the entire foreign matter even more reliably without leaving a part that has not been polished and corrected. become.
  • a fourth invention is characterized in that in the foreign matter polishing method according to any one of the first to third inventions, the workpiece is a display panel substrate.
  • the quality in a display device in which the quality is likely to deteriorate due to foreign matter, the quality can be remarkably improved and the manufacturing efficiency can be increased.
  • the predetermined range including the peripheral region of the polishing portion is reset to the height measurement range, and the height measurement range is set to the height measurement range.
  • the maximum height location is higher than the predetermined height, the maximum height location is repeatedly polished, so that even if there is a large foreign matter, it can be corrected quickly and reliably. As a result, it is possible to increase the efficiency of correcting foreign matter defects on the workpiece surface without increasing personnel costs, and to improve the product quality.
  • FIG. 1 is a perspective view schematically showing a foreign object polishing apparatus according to an embodiment.
  • FIG. 2 is a configuration diagram schematically showing the polishing unit of the embodiment.
  • FIG. 3 is a flowchart showing an outline of the periphery of the correction process in the manufacturing process of the liquid crystal display device.
  • FIG. 4 is a flowchart showing a foreign matter polishing method for a workpiece surface according to the embodiment.
  • FIG. 5A is a plan view showing an initially set height measurement range
  • FIG. 5B is a side view showing a state in which a large foreign material is initially polished.
  • FIG. 6A is a plan view showing the height measurement range set for the second time
  • FIG. 6B is a side view showing a state in which the large foreign matter is subjected to the second polishing process.
  • FIG. 7A is a plan view showing the height measurement range set for the third time
  • FIG. 7B is a side view showing a state in which the third foreign object is subjected to the third polishing process.
  • FIG. 8A is a plan view showing the height measurement range set after the fourth time
  • FIG. 8B is a side view showing a state in which the large foreign matter has been polished and corrected.
  • FIG. 9 is a flowchart showing a foreign matter polishing method for a workpiece surface according to a modification of the embodiment.
  • FIG. 1 is a schematic perspective view of a foreign matter polishing apparatus S of the present embodiment.
  • the foreign material polishing apparatus S includes a base 1 serving as a base and a flat work stage 3 fixedly disposed on the base 1. On the work stage 3, a work W to be corrected is placed. Although not shown, a plurality of suction holes are formed on the upper surface of the work stage 3, and these suction holes are connected to a vacuum suction means such as a vacuum pump. The work stage 3 is configured to suck and hold the placed work W by driving the vacuum suction means.
  • a moving mechanism that supports the scanning head 8 so as to be movable in the left-right direction (X direction in FIG. 1), the front-rear direction (Y direction in FIG. 1), and the up-down direction (Z direction in FIG. 1). 4 is provided.
  • the moving mechanism 4 includes a pair of guide rails 5 that are disposed so as to sandwich the work stage 3 and extend in the front-rear direction, and a gantry structure that is supported on the pair of guide rails 5 so as to be movable in the front-rear direction.
  • the gantry part 7 is provided.
  • the gantry unit 7 is moved in the front-rear direction along the pair of guide rails 5 by a front-rear moving mechanism (not shown) such as a feed screw mechanism or a linear motor that is operated by rotation of a drive motor.
  • a front-rear moving mechanism such as a feed screw mechanism or a linear motor that is operated by rotation of a drive motor.
  • a pair of guide rails 7a extending in the left-right direction and a ball screw 7b extending between the pair of guide rails 7a are provided, and the scanning head 8 moves in the left-right direction on the guide rails 7a. Supported as possible.
  • This scanning head 8 has a slider 8a provided with a ball nut (not shown) screwed to the ball screw 7b on the back side, and the ball screw 7b is rotated by a drive motor 7c provided at one end of the ball screw 7b. By doing so, it moves in the left-right direction along the guide rail 7a.
  • the scanning head 8 includes a height measuring mechanism 9 for measuring the height of the workpiece surface, and a polishing unit 10 disposed in the vicinity of the side of the height measuring mechanism 9.
  • the height measuring mechanism 9 includes a known digital micromirror device.
  • This digital micromirror device is a kind of display element in which a large number of micromirror surfaces (micromirrors) are arranged in a plane.
  • the height of the workpiece surface at each coordinate at a magnification of about 50 times, for example, by a so-called confocal system.
  • the distribution and thus the height distribution of the foreign matter 100 can be specified.
  • the range that can be measured at once by the height measuring mechanism 9 is, for example, a rectangular range having a side of 210 ⁇ m to 250 ⁇ m.
  • FIG. 2 is a schematic configuration diagram of the polishing unit 10.
  • the polishing unit 10 includes a polishing cassette 11.
  • the polishing cassette 11 has a shape similar to that of a normal audio cassette, and a payout reel 12 around which the polishing tape T is wound, and a take-up reel 13 disposed at a side of the payout reel 12 with a space therebetween.
  • a pair of guide rollers 14 for guiding the polishing tape T disposed below the reels 12 and 13 are rotatably supported by the cassette body 11a.
  • the supply reel 12 and the take-up reel 13 are driven by a drive motor (not shown) provided in the polishing unit 10, so that the polishing tape T supplied from the supply reel 12 is taken up by the take-up reel 13.
  • the abrasive tape T is run.
  • the polishing tape T has an adhesive surface layer loaded with an abrasive made of fine particles, and most of the polishing debris generated by polishing is taken into the polishing cassette 11 while adhering to the polishing tape T. It has become.
  • the polishing cassette 11 is detachably attached to the polishing unit main body 10a. For this reason, when the polishing tape T is used up, it is possible to supply the new polishing tape T without delay and perform highly efficient polishing correction work of the foreign matter 100 by replacing the polishing tape T. ing.
  • the polishing unit 10 further includes a pair of guide rollers 16 for guiding the polishing tape T so as to be positioned between the pair of guide rollers 14 in the polishing cassette 11 so as to be rotatably supported by the polishing unit main body 10a.
  • a pressing head 17 is provided between the pair of guide rollers 16 to press the polishing tape T against the foreign material 100 on the workpiece surface.
  • the pressing head 17 is held below the polishing cassette 11 by a holding member 18 fixedly disposed on the polishing unit main body 10a, and the polishing tape T is fed out from the feeding reel 12 through the guide rollers 14 and 16 and the take-up reel 13.
  • the tip is brought into pressure contact with the polishing tape T while being wound around.
  • the region that can be cut at once by pressing the polishing tape T with the pressing head 17 is, for example, a circle having a diameter of about 100 ⁇ m to 200 ⁇ m.
  • the size and shape of the area that can be shaved by pressing the polishing tape are not limited to this, and vary greatly depending on the pressing amount of the pressing head 17 and the shape of the tip of the pressing head 17.
  • the foreign matter polishing apparatus S includes a control device 20 for controlling each mechanism at an arbitrary position of the base 1, and the control device 20 is connected to the main server 21.
  • the main server 21 stores defect information such as the position and size of the defect on the workpiece surface detected by the inspection by the defect inspection device 22 separate from the foreign material polishing device S.
  • the configuration of the defect inspection apparatus 22 is not particularly limited as long as the defect can be detected by scanning the workpiece surface.
  • the defect inspection apparatus 22 cannot accurately measure the height of the workpiece surface, and cannot accurately grasp the shape of the foreign matter 100 that forms the detected defect.
  • FIG. 3 is a flowchart showing an outline of the periphery of the correction process in the manufacturing process of the liquid crystal display device.
  • a workpiece W to be inspected is prepared.
  • the workpiece W in this embodiment is, for example, an array substrate after an alignment film is formed on the surface.
  • the defect inspection apparatus 22 inspects the defect by the foreign material 100 which exists on the surface of the workpiece
  • step St02 it is determined whether or not a defect is detected, and if a defect is detected, whether or not the defect needs to be corrected is determined from defect information (position and size, etc.). If there is only a defect that has no defect or that does not need to be corrected, the process proceeds to step St03 and the workpiece W is stored in the accepted product cassette, and is then put into the bonding process in step St04, and is put on a normal production line. And bonded to the color filter substrate. On the other hand, if there is a defect that needs to be corrected, the process proceeds to step St05 to be stored in the correction target product cassette, and in the subsequent step St06, it is put into the correction process.
  • FIG. 4 is a flowchart showing a method for polishing the foreign material 100 on the workpiece surface in the correction process.
  • 5 to 8 show a state of each polishing process when the large foreign material 100 is polished a plurality of times, (a) is a plan view showing a height measurement range A, and (b) is a polishing. It is a side view of the processed foreign material 100.
  • a black circle “c” indicates a contact portion of the center of the pressing head 17 when the pressing head 17 is lowered, and a broken-line circle “a” with an oblique line on the inner side indicates that when the pressing head 17 is lowered.
  • Each of the polishing ranges is shown.
  • the foreign matter portion subjected to the polishing process is dot-hatched.
  • the control device 20 controls the foreign material polishing device S according to the sequence of the automatic mode.
  • the foreign material polishing apparatus S acquires defect information from the main server 21.
  • step St11 a defect that needs to be corrected is selected based on the acquired defect information. Then, based on the selected defect information (position and size), a predetermined range including at least a part of the region where the foreign material 100 forming the defect exists is set as the height measurement range A (initial setting step).
  • a range including the end of the foreign object 100 is set as a height measurement range A.
  • An outer two-dot chain line in FIG. 5A indicates a range in which the foreign matter 100 is estimated from the defect information.
  • a range including the entire region where the foreign object 100 exists is set as the height measurement range A.
  • the defect can be corrected normally by one polishing process, a case where a large foreign object 100 larger than a predetermined size is corrected by polishing will be described below.
  • the large foreign matter 100 exemplified in this embodiment is a linear foreign matter such as a fiber.
  • step St12 the scanning head 8 is moved so that the height measurement mechanism 9 is positioned above the initially set height measurement range A, and the height of the workpiece surface is adjusted in the height measurement range A. Measure accurately (height measurement process).
  • Step St13 it is determined whether or not the maximum height of the workpiece surface within the height measurement range A, that is, the maximum height of the foreign material 100 is a predetermined height h1, for example, 3 ⁇ m or less. At this time, if the maximum height of the foreign material 100 is 3 ⁇ m or less, the polishing correction for the foreign material 100 is not necessary, and the process jumps to Step St20. On the other hand, when the maximum height of the foreign object 100 is higher than 3 ⁇ m, the foreign object 100 needs to be corrected for polishing. Therefore, the process proceeds to step St14, and the maximum height portion M in the height measurement range A is set as the polishing target location. To do.
  • the scanning head 8 is moved so that the pressing head 17 is positioned above the set polishing target location, that is, the maximum height location M within the previous height measurement range A.
  • the polishing tape T is caused to travel, and the distance from the pressing head 17 to the foreign object 100 and the workpiece surface is estimated based on the measurement result by the height measuring mechanism 9, and the polishing unit 10 is lowered based on the estimated distance.
  • the polishing tape T traveling at the tip of the pressing head 17 is slid while being pressed against the foreign material 100, whereby the maximum height portion M of the foreign material 100 is spotted as shown in FIG.
  • Polishing correction polishing process.
  • the surface of the workpiece W is polished to a height h2 equal to or less than a predetermined height h1, for example, 2.5 ⁇ m so as not to be damaged.
  • step St16 the range including the peripheral area of the polishing location with reference to the polishing location, specifically, the range centering on the polishing location as shown in FIG. Re-set (re-setting process).
  • the height measurement range A moves from the initially set range to a proximity region centered on the location where the foreign object 100 is located.
  • step St17 the scanning head 8 is moved so that the height measurement mechanism 9 is positioned above the reset height measurement range A, and the height measurement mechanism 9 in the reset height measurement range A is moved. Accurately measures the height of the workpiece surface (height measurement process).
  • step St18 it is determined whether or not the maximum height of the foreign material 100 within the height measurement range A is 3 ⁇ m or less. At this time, if the maximum height of the foreign object 100 is 3 ⁇ m or less, the polishing correction for the foreign object 100 is completed, and the process proceeds to step St20. On the other hand, when the maximum height of the foreign material 100 is higher than 3 ⁇ m, the foreign material 100 still needs to be corrected for polishing. Therefore, the process returns to step St14 and the maximum height portion M in the height measurement range A set again is polished. The target location is set, and Steps St15 to St18 are performed again.
  • step St15 the scanning head 8 is moved, the polishing tape T is run, and the polishing unit 10 is moved downward, so that the polishing target position (previous time) is set again as shown in FIG.
  • the maximum height portion M) in the height measurement is polished (polishing step).
  • step St16 the range centered on this polishing location is reset to the height measurement range A (resetting step).
  • step St17 the scanning head 8 is moved, and the height of the workpiece surface is accurately measured by the height measuring mechanism 9 in the height measurement range A that has been reset previously (height measurement step).
  • step St18 it is determined whether or not the maximum height of the foreign object 100 within the height measurement range A is 3 ⁇ m or less.
  • step St14 If the maximum height of the foreign object 100 is greater than 3 ⁇ m, the process returns to step St14. Then, the maximum height portion M in the reset height measurement range A is set as a polishing target portion (resetting step), and in step St15, as shown in FIG. 7B, the polishing target portion is polished. (Polishing step).
  • steps St14 to St18 are repeated until the maximum height in the height measurement range A when the height of the workpiece surface is measured becomes 3 ⁇ m or less.
  • the height measurement range A sequentially moves along the foreign object 100 to an area close to the polishing target portion, and the height measurement range A with respect to the entire large foreign object 100.
  • the polishing process is sequentially performed while automatically scanning.
  • the large foreign matter 100 is polished and corrected so as to be less than or equal to a predetermined height throughout.
  • step St20 it is determined whether there is an uncorrected defect based on the defect information. If there is an uncorrected defect, the process returns to step St11 to select another defect and the subsequent steps are repeated. On the other hand, if there are no uncorrected defects, it is determined that all the polishing correction for the workpiece W has been completed, the process proceeds to step St21, and is put into the bonding process of step St04.
  • the range including the end of the foreign matter 100 is included.
  • the range including the peripheral area of the polishing location is set as the height measurement range A. Since the maximum height portion M within the height measurement range A is repeatedly polished, one end portion of the large foreign material 100 becomes the polishing target portion first, and then sequentially the center side of the foreign material X, Furthermore, the height measurement range A moves to the other end side together with the polishing target portion.
  • the height measurement range A can be automatically scanned over the entire large foreign matter 100. Further, since the height is measured every time the foreign object 100 is polished, even if the foreign object 100 is displaced or deformed by the previous polishing process, the foreign object 100 can be accurately polished correspondingly. As a result, the entire large foreign object 100 can be polished and corrected so as to be equal to or less than a predetermined height in accordance with the scanning of the height measurement range A described above. Therefore, even if there is a large foreign object 100, it is possible to correct and correct quickly and reliably. As a result, it is possible to increase the efficiency of correcting foreign matter defects on the workpiece surface without increasing personnel costs, and to improve the product quality.
  • the quality can be remarkably improved and the manufacturing efficiency can be improved in the display device in which the quality deterioration due to the foreign matter 100 is likely to occur. it can.
  • the foreign object 100 can be uniformly corrected by performing the same polishing correction process regardless of whether the foreign object 100 is small or large. Corrections can be made.
  • FIG. 9 is a flowchart showing a method of polishing the foreign material 100 on the workpiece surface in the correction process according to this modification.
  • step St13 and step St18 when it is determined in step St13 and step St18 whether the maximum height of the foreign matter 100 within the height measurement range A (the maximum height of the workpiece surface) is 3 ⁇ m or less, the maximum height is If it is 3 ⁇ m or less, it is determined that polishing correction for the foreign material 100 is not necessary or completed, and even if a portion where the height is not measured remains in the region where the foreign material 100 exists, the process proceeds to the next step St20.
  • this modification when a portion where the height is not measured remains in the region where the foreign material 100 exists, if the foreign material 100 is higher than 3 ⁇ m in the unmeasured portion, a defect may occur. Focusing on a certain point, a method of measuring the height of the region where the foreign object 100 exists over the entire region is adopted.
  • Step St13 and Step St18 when it is determined that the maximum height of the foreign object 100 is 3 ⁇ m or less, the process proceeds to Step St19-1, and there is a portion where the height is not measured in the region where the foreign object 100 exists. It is determined whether it remains. Whether or not the unmeasured part remains is determined by whether or not the unmeasured part exists in a range in which it is estimated from the defect information that the foreign object 100 exists. At this time, if there is an unmeasured part, the process proceeds to step St19-2, and a range including at least a part of the unmeasured part is set as the height measurement range A (complement setting step), and the process returns to step St12. The subsequent steps St13 to St18 are repeated. On the other hand, if there is no unmeasured portion, it is determined that polishing correction for the foreign material 100 is not necessary or completed, and the process proceeds to the next step St20.
  • the large foreign matter 100 can be more reliably polished and corrected without leaving a portion that has not been polished and corrected. Therefore, it can be used suitably also for the workpiece
  • the workpiece W is the array substrate after forming the alignment film constituting the liquid crystal display device, but it may be an array substrate before forming the alignment film or a color filter substrate. Furthermore, a substrate constituting another display device such as an organic EL (Electro Luminescence) display device or a plasma display device other than the liquid crystal display device can be used as the work W.
  • a substrate constituting another display device such as an organic EL (Electro Luminescence) display device or a plasma display device other than the liquid crystal display device can be used as the work W.
  • the present invention is useful for a foreign matter polishing method, and is particularly suitable for a foreign matter polishing method in which it is desired to improve the quality of a product by quickly and reliably polishing and correcting even if there is a large foreign matter. ing.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

The present invention includes: a detection step for detecting foreign material (100) on the surface of a work (W) and acquiring information regarding the position and size of the detected foreign material (100); an initial setting step for setting a predetermined range containing at least a portion of the region at which the foreign material (100) is present to a height measurement range; a height measurement step for measuring the height of the surface of the work (W) in the height measurement range; an abrading step for abrading the locus of maximum height in a manner so that the height becomes no greater than a predetermined height when the maximum height within the height measurement range of which the height was measured in the height measurement step is higher than the predetermined height; and a resetting step for resetting the predetermined range containing the peripheral region of the abraded locus to the height measurement range using the abraded locus abraded in the abrading step as a baseline. After the resetting step: the height measurement step, the abrading step, and the resetting step are repeated in order.

Description

異物研磨方法Foreign matter polishing method
　本発明は、ワーク表面の異物を研磨して修正する異物研磨方法に関し、特に異物欠陥の修正を迅速且つ確実に行うための対策に関するものである。 The present invention relates to a foreign matter polishing method for polishing and correcting foreign matter on the surface of a workpiece, and more particularly, to measures for quickly and reliably correcting foreign matter defects.
　従来から広く利用されているカラー液晶表示装置は、カラーフィルタ基板とアレイ基板との２枚の基板の間に液晶層が封入されてなる。カラーフィルタ基板又はアレイ基板の製造過程において、衣類などから発生する各種繊維や、オペレータの皮膚組織、金属粉、ガラス片などの異物が基板表面上に付着すると、突起状の欠陥となって、その部分で画像が形成されない画素欠けなどの表示不良が生じる。このため、欠陥検査装置によりワーク表面の欠陥がある箇所を検出し、検出した欠陥をなす異物を異物研磨装置によって研磨修正する修正工程が行われている。 A color liquid crystal display device that has been widely used conventionally has a liquid crystal layer sealed between two substrates, a color filter substrate and an array substrate. In the process of manufacturing a color filter substrate or array substrate, various fibers generated from clothing, etc. and foreign objects such as operator's skin tissue, metal powder, glass pieces, etc., adhere to the surface of the substrate, resulting in protrusion-like defects. Display defects such as missing pixels where an image is not formed in a portion occur. For this reason, the correction process which detects the location with the defect of the workpiece | work surface with a defect inspection apparatus, and grind | polishes and corrects the foreign material which makes the detected defect with a foreign material grinding | polishing apparatus is performed.
　異物研磨装置としては、研磨テープが巻回された繰出しリールと、該繰出しリールから繰り出された研磨テープを巻き取る巻取りリールと、これら両リールの間に配置された押付ヘッドを有する研磨ユニットとを備え、研磨テープを走行させつつ押付ヘッドを用いて異物に押し付けることにより、その異物をスポット的に研磨修正するように構成されたものが知られている。 As a foreign matter polishing apparatus, a feeding reel around which a polishing tape is wound, a take-up reel that winds up the polishing tape fed out from the feeding reel, and a polishing unit having a pressing head disposed between both reels, And is configured such that the foreign matter is spot-polished and corrected in a spot manner by pressing it against the foreign matter using a pressing head while the polishing tape is running.
　このような異物研磨装置は、異物を観察すると共に該異物の高さを検出する高さ計測機構（顕微鏡装置）を備え、該高さ計測機構により異物を観察し、修正が必要と判断された場合に、異物の高さ情報に基づき研磨ユニットを下降させ、研磨テープを走行させながら当該異物を研磨修正するようになっている（例えば、特許文献１参照）。 Such a foreign material polishing apparatus is provided with a height measurement mechanism (microscope device) that observes the foreign material and detects the height of the foreign material, and the foreign object is observed by the height measurement mechanism and is determined to be corrected. In this case, the polishing unit is lowered based on the height information of the foreign matter, and the foreign matter is polished and corrected while the polishing tape is running (see, for example, Patent Document 1).
特開２００８－２９０１６６号公報JP 2008-290166 A
　しかしながら、特許文献１に開示のような異物研磨装置の高さ計測機構には、小さな異物も確実に捉えると共に異物の高さを正確に計測するために高倍率で異物を観察可能なことが要求されるので、広角なレンズを採用し得ず、モニター視野が狭くなっている。このため、従来の異物研磨装置では、例えば、繊維のような大型異物がワーク表面にある場合、高さ計測機構で高さを計測できる範囲が大型異物の一部にしか及ばず、その計測範囲での計測結果において高さが所定の高さ以下になると、研磨修正が完了したと判断して研磨処理を終了している。その結果、大型異物については部分的な研磨修正しかできず研磨できていない部分が残ってしまい、研磨修正を行ったにもかかわらず、異物欠陥が発生するおそれがある。 However, the height measuring mechanism of the foreign substance polishing apparatus as disclosed in Patent Document 1 requires that foreign substances can be observed at a high magnification in order to reliably capture small foreign substances and accurately measure the height of the foreign substances. Therefore, a wide-angle lens cannot be adopted, and the monitor field of view is narrowed. For this reason, in the conventional foreign matter polishing apparatus, for example, when a large foreign matter such as a fiber is present on the workpiece surface, the range in which the height can be measured by the height measuring mechanism only reaches a part of the large foreign matter, and the measurement range When the height in the measurement result at is less than or equal to the predetermined height, it is determined that the polishing correction has been completed, and the polishing process is terminated. As a result, only a part of the large foreign matter can be corrected for polishing, and a portion that has not been polished remains, and there is a possibility that a foreign matter defect may occur despite the polishing correction.
　そこで、大型異物が存在する領域全体の高さを計測し、その計測結果を確認した上で研磨を行う範囲を手動で指定することにより、大型異物について全体を確実に研磨することも考えられるが、大型異物毎にいちいちオペレータの指定が必要なため、人員コストがかかる上に、処理効率が悪く、オペレータ個人の能力にも依存するという問題がある。 Therefore, it may be possible to reliably polish the entire large foreign object by measuring the height of the entire area where the large foreign object is present and confirming the measurement result and manually specifying the range to be polished. In addition, since it is necessary to designate an operator for each large foreign matter, there is a problem in that the cost of personnel is high, the processing efficiency is low, and it depends on the individual ability of the operator.
　本発明は、斯かる点に鑑みてなされたものであり、その目的とするところは、大型異物があっても迅速且つ確実に研磨修正することにある。 The present invention has been made in view of such a point, and an object of the present invention is to correct the polishing quickly and reliably even if there is a large foreign matter.
　上記の目的を達成するために、この発明では、研磨箇所を基準とした所定の範囲での高さ計測と該高さ計測での最大高さ箇所の研磨とを繰り返し行うようにした。 In order to achieve the above object, in the present invention, the height measurement in a predetermined range based on the polishing portion and the polishing of the maximum height portion in the height measurement are repeatedly performed.
　具体的には、本発明は、繰出しリールから研磨テープを繰り出すと共に、巻取りリールで巻き取りながら、これら繰出しリールと巻取りリールとの間の研磨テープを押付ヘッドでワーク表面に押し付けて、該ワーク表面の異物を研磨して修正するワーク表面の異物研磨方法を対象とし、以下の解決手段を講じたものである。 Specifically, in the present invention, the polishing tape is fed out from the supply reel, and while being wound up by the take-up reel, the polishing tape between the supply reel and the take-up reel is pressed against the work surface by the pressing head, The present invention is intended for a foreign matter polishing method for a workpiece surface that polishes and corrects foreign matter on the workpiece surface, and has taken the following solution.
　すなわち、第１の発明は、上記ワーク表面の異物を検査して、検出した異物の位置及び大きさ情報を取得する検査工程と、上記検査工程で検出した異物の位置及び大きさ情報に基づき、該異物が存在する領域を少なくとも一部含む所定の範囲を高さ計測範囲に設定する初期設定工程と、上記高さ計測範囲においてワーク表面の高さを計測する高さ計測工程と、上記高さ計測工程で高さを計測した高さ計測範囲内での最大高さが所定の高さよりも高い場合に、該最大高さ箇所を所定の高さ以下になるように研磨する研磨工程と、上記研磨工程で研磨した研磨箇所を基準として、該研磨箇所の周辺領域を含む所定の範囲を上記高さ計測範囲に設定し直す再設定工程とを含み、上記再設定工程の後に、上記高さ計測工程、研磨工程及び再設定工程を順に繰り返すことを特徴とする。 That is, the first invention is based on the inspection step of inspecting the foreign matter on the surface of the workpiece and acquiring the position and size information of the detected foreign matter, and the position and size information of the foreign matter detected in the inspection step, An initial setting step for setting a predetermined range including at least a part of the area where the foreign substance exists as a height measurement range, a height measurement step for measuring the height of the workpiece surface in the height measurement range, and the height When the maximum height within the height measurement range in which the height is measured in the measurement step is higher than the predetermined height, the polishing step for polishing the maximum height portion to be equal to or lower than the predetermined height, and the above And a resetting step of resetting a predetermined range including a peripheral region of the polishing spot to the height measurement range with the polishing spot polished in the polishing step as a reference. After the resetting step, the height measurement is performed. Process, polishing process and resetting process And repeating in sequence.
　この第１の発明によると、ワーク表面の異物が大型異物の場合に、高さを計測できる高さ計測範囲が異物の一部にしか及ばなくても、異物に対して初期研磨を行った後において、研磨箇所の周辺領域を含む所定の範囲を高さ計測範囲に設定し直し、該高さ計測範囲でワーク表面の高さを計測して最大高さ箇所が所定の高さよりも高い場合に当該最大高さ箇所を研磨する。そして、また上述したように高さ計測範囲を設定し直し、その後、上記と同様な高さ計測と最大高さ箇所の研磨と高さ計測範囲の再設定とを繰り返し行う。研磨処理が施された箇所の高さは所定の高さ以下となるので、２回目以降の高さ計測では、研磨箇所の周囲領域における他箇所が高さ計測範囲内での最大高さ箇所、ひいては研磨対象箇所となって、高さ計測範囲が研磨対象箇所と共に近接する領域に順次移っていく。これにより、大型異物の全体に亘って高さ計測範囲を自動で走査させることが可能になる。また、異物の研磨処理後に毎回高さを計測するので、先の研磨処理によって異物がずれたり変形しても、それに対応して異物が正確に研磨される。これにより、上述した高さ計測範囲の走査に伴って大型異物の全体を所定の高さ以下となるように確実に研磨することが可能となる。したがって、大型異物があっても迅速且つ確実に研磨修正することができる。 According to the first aspect of the invention, when the foreign matter on the workpiece surface is a large foreign matter, the initial measurement is performed on the foreign matter even if the height measurement range in which the height can be measured reaches only a part of the foreign matter. In the case where the predetermined range including the peripheral area of the polishing location is reset to the height measurement range, the height of the workpiece surface is measured in the height measurement range, and the maximum height location is higher than the predetermined height. The maximum height portion is polished. Then, the height measurement range is reset as described above, and thereafter, the same height measurement as described above, polishing of the maximum height portion, and resetting of the height measurement range are repeated. Since the height of the place where the polishing process has been performed is a predetermined height or less, in the second and subsequent height measurement, the other places in the peripheral area of the polishing place are the maximum height places within the height measurement range, As a result, it becomes a location to be polished, and the height measurement range sequentially moves to an area close to the location to be polished. As a result, the height measurement range can be automatically scanned over the entire large foreign matter. Further, since the height is measured every time after the foreign substance polishing process, even if the foreign substance is displaced or deformed by the previous polishing process, the foreign substance is accurately polished correspondingly. As a result, the entire large foreign matter can be reliably polished so as to be equal to or less than a predetermined height in accordance with the above-described scanning of the height measurement range. Therefore, even if there is a large foreign matter, it can be corrected quickly and reliably.
　また、第１の発明によると、異物が小型であるか大型であるかを問わず同様の研磨修正処理を行うことにより一律に異物の研磨修正を行えるので、単純なアルゴリズムで異物欠陥の修正を良好に行うことが可能である。 In addition, according to the first invention, the foreign matter can be uniformly corrected by performing the same polishing correction process regardless of whether the foreign matter is small or large, so that the foreign matter defect can be corrected with a simple algorithm. It is possible to perform well.
　第２の発明は、第１の発明の異物研磨方法において、上記初期設定工程では、上記異物の端部を含む所定の範囲を上記高さ計測範囲に設定することを特徴とする。 The second invention is characterized in that, in the foreign matter polishing method of the first invention, in the initial setting step, a predetermined range including an end of the foreign matter is set as the height measurement range.
　この第２の発明によると、ワーク表面の異物が大型異物の場合に、高さを計測できる高さ計測範囲が異物の一部にしか及ばなくても、大型異物の一端部が先ず研磨対象箇所となって、その後に順次、異物の中央側、さらには他端側へと高さ計測範囲が研磨対象箇所と共に移り、異物全体に亘って研磨修正が行われることになる。これにより、例えば繊維のような線状の大型異物であっても、当該異物の一端側から他端側まで全体に亘って計測範囲を走査させることができ、当該異物の全体を確実に研磨修正することが可能である。 According to the second aspect of the invention, when the foreign matter on the workpiece surface is a large foreign matter, even if the height measurement range in which the height can be measured reaches only a part of the foreign matter, one end portion of the large foreign matter is first a portion to be polished. Then, the height measurement range moves along with the polishing target portion sequentially to the center side and further to the other end side of the foreign matter, and polishing correction is performed over the entire foreign matter. Thereby, even if it is a linear large foreign substance like a fiber, for example, the measurement range can be scanned over the whole from one end side to the other end side of the foreign substance, and the entire foreign substance is reliably polished and corrected. Is possible.
　第３の発明は、第１及び第２の発明のいずれか１つの異物研磨方法において、上記高さ計測工程で高さを計測した高さ計測範囲内での最大高さが所定の高さ以下である場合に、上記異物が存在する領域において高さを計測していない部分が残っているときには、その未計測部分を少なくとも一部含む所定の範囲を上記高さ計測範囲に設定し直す補完設定工程をさらに含み、上記補完設定工程の後に、上記高さ計測工程、研磨工程及び再設定工程を順に繰り返すことを特徴とする。 According to a third invention, in the foreign matter polishing method according to any one of the first and second inventions, a maximum height within a height measurement range in which the height is measured in the height measurement step is equal to or less than a predetermined height. If there is a part where the height is not measured in the area where the foreign object is present, a complementary setting for resetting a predetermined range including at least a part of the unmeasured part as the height measurement range The method further includes a step, and the height measuring step, the polishing step, and the resetting step are sequentially repeated after the complementary setting step.
　異物が存在する領域において高さを計測していない部分が残っている場合には、当該未計測部分で異物が所定の高さよりも高いと、欠陥が発生するおそれがある。これに対して、第３の発明によると、その未計測部分を少なくとも一部含む所定の範囲を高さ計測範囲に設定し直して、その後、第１の発明と同様に、高さ計測と最大高さ箇所の研磨と高さ計測範囲の再設定とを繰り返し行うので、大型異物について、研磨修正できていない部分を残すことがなく、当該異物の全体をよりいっそう確実に研磨修正することが可能になる。 If there is a portion where the height is not measured in the region where the foreign matter exists, a defect may occur if the foreign matter is higher than a predetermined height in the unmeasured portion. On the other hand, according to the third invention, the predetermined range including at least a part of the unmeasured portion is reset to the height measurement range, and thereafter, as in the first invention, the height measurement and the maximum Since the polishing of the height location and the resetting of the height measurement range are repeated, it is possible to polish and correct the entire foreign matter even more reliably without leaving a part that has not been polished and corrected. become.
　第４の発明は、第１～第３の発明のいずれか１つの異物研磨方法において、上記ワークが表示パネル用基板であることを特徴とする。 A fourth invention is characterized in that in the foreign matter polishing method according to any one of the first to third inventions, the workpiece is a display panel substrate.
　この第４の発明によると、異物による品質の低下が現れやすい表示装置において、品質が格段に向上すると共に、製造効率を高めることが可能となる。 According to the fourth aspect of the present invention, in a display device in which the quality is likely to deteriorate due to foreign matter, the quality can be remarkably improved and the manufacturing efficiency can be increased.
　以上説明したように、本発明によれば、異物に初期研磨を行った後において、研磨箇所の周辺領域を含む所定の範囲を高さ計測範囲に設定し直し、該高さ計測範囲で高さを計測して最大高さ箇所が所定高さよりも高い場合に当該最大高さ箇所を研磨することを繰り返し行うので、大型異物があっても迅速且つ確実に研磨修正することができる。その結果、人員コストをかけずに、ワーク表面の異物欠陥の修正効率を高めることができ、且つ製品の品質を向上させることができる。 As described above, according to the present invention, after the initial polishing is performed on the foreign matter, the predetermined range including the peripheral region of the polishing portion is reset to the height measurement range, and the height measurement range is set to the height measurement range. When the maximum height location is higher than the predetermined height, the maximum height location is repeatedly polished, so that even if there is a large foreign matter, it can be corrected quickly and reliably. As a result, it is possible to increase the efficiency of correcting foreign matter defects on the workpiece surface without increasing personnel costs, and to improve the product quality.
図１は、実施形態に係る異物研磨装置を概略的に示す斜視図である。FIG. 1 is a perspective view schematically showing a foreign object polishing apparatus according to an embodiment. 図２は、実施形態の研磨ユニットを概略的に示す構成図である。FIG. 2 is a configuration diagram schematically showing the polishing unit of the embodiment. 図３は、液晶表示装置の製造工程における修正工程周辺の概略を示すフローチャート図である。FIG. 3 is a flowchart showing an outline of the periphery of the correction process in the manufacturing process of the liquid crystal display device. 図４は、実施形態に係るワーク表面の異物研磨方法を示すフローチャート図である。FIG. 4 is a flowchart showing a foreign matter polishing method for a workpiece surface according to the embodiment. 図５（ａ）は初期設定した高さ計測範囲を示す平面図であり、図５（ｂ）は大型異物を初期研磨した状態を示す側面図である。FIG. 5A is a plan view showing an initially set height measurement range, and FIG. 5B is a side view showing a state in which a large foreign material is initially polished. 図６（ａ）は２回目に設定された高さ計測範囲を示す平面図であり、図６（ｂ）は大型異物に２回目の研磨処理を施した状態を示す側面図である。FIG. 6A is a plan view showing the height measurement range set for the second time, and FIG. 6B is a side view showing a state in which the large foreign matter is subjected to the second polishing process. 図７（ａ）は３回目に設定された高さ計測範囲を示す平面図であり、図７（ｂ）は大型異物に３回目の研磨処理を施した状態を示す側面図である。FIG. 7A is a plan view showing the height measurement range set for the third time, and FIG. 7B is a side view showing a state in which the third foreign object is subjected to the third polishing process. 図８（ａ）は４回目以降に設定された高さ計測範囲を示す平面図であり、図８（ｂ）は大型異物の研磨修正が完了した状態を示す側面図である。FIG. 8A is a plan view showing the height measurement range set after the fourth time, and FIG. 8B is a side view showing a state in which the large foreign matter has been polished and corrected. 図９は、実施形態の変形例に係るワーク表面の異物研磨方法を示すフローチャート図である。FIG. 9 is a flowchart showing a foreign matter polishing method for a workpiece surface according to a modification of the embodiment.
　以下、本発明の実施形態を図面に基づいて詳細に説明する。なお、本発明は、以下の実施形態に限定されるものではない。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, this invention is not limited to the following embodiment.
　《発明の実施形態》
　図１は、本実施形態の異物研磨装置Ｓの概略斜視図である。 << Embodiment of the Invention >>
FIG. 1 is a schematic perspective view of a foreign matter polishing apparatus S of the present embodiment.
　この異物研磨装置Ｓは、ベースとなる基台１と、該基台１上に固定配置された平坦なワークステージ３とを備えている。ワークステージ３上には、修正対象であるワークＷが載置される。このワークステージ３の上面には、図示しないが、複数の吸着孔が形成され、これら各吸着孔が真空ポンプなどの真空吸着手段と接続されている。そして、ワークステージ３は、真空吸着手段の駆動により、載置したワークＷを吸着保持するように構成されている。 The foreign material polishing apparatus S includes a base 1 serving as a base and a flat work stage 3 fixedly disposed on the base 1. On the work stage 3, a work W to be corrected is placed. Although not shown, a plurality of suction holes are formed on the upper surface of the work stage 3, and these suction holes are connected to a vacuum suction means such as a vacuum pump. The work stage 3 is configured to suck and hold the placed work W by driving the vacuum suction means.
　基台１上にはさらに、走査ヘッド８を左右方向（図１でＸ方向）、前後方向（図１でＹ方向）、及び上下方向（図１でＺ方向）に移動可能に支持する移動機構４が設けられている。この移動機構４は、ワークステージ３を挟むように配設された前後方向に延びる一対の案内レール５と、これら一対の案内レール５上で前後方向に移動可能に支持されたガントリー（構台）構造のガントリー部７とを備えている。 Further, on the base 1, a moving mechanism that supports the scanning head 8 so as to be movable in the left-right direction (X direction in FIG. 1), the front-rear direction (Y direction in FIG. 1), and the up-down direction (Z direction in FIG. 1). 4 is provided. The moving mechanism 4 includes a pair of guide rails 5 that are disposed so as to sandwich the work stage 3 and extend in the front-rear direction, and a gantry structure that is supported on the pair of guide rails 5 so as to be movable in the front-rear direction. The gantry part 7 is provided.
　ガントリー部７は、駆動モータの回転で作動される送りネジ機構やリニアモータなどの前後移動機構（不図示）により、一対の案内レール５に沿って前後方向に移動されるようになっている。このガントリー部７の前面側には、左右方向に延びる一対の案内レール７ａ及びこれら一対の案内レール７ａ間に延びるボールネジ７ｂが設けられており、案内レール７ａ上に走査ヘッド８が左右方向に移動可能に支持されている。この走査ヘッド８は、ボールネジ７ｂに螺合するボールナット（不図示）が背面側に設けられたスライダ８ａを有しており、ボールネジ７ｂの一端部に設けられた駆動モータ７ｃによってボールネジ７ｂが回転することにより、案内レール７ａに沿って左右方向に移動するようになっている。 The gantry unit 7 is moved in the front-rear direction along the pair of guide rails 5 by a front-rear moving mechanism (not shown) such as a feed screw mechanism or a linear motor that is operated by rotation of a drive motor. On the front side of the gantry section 7, a pair of guide rails 7a extending in the left-right direction and a ball screw 7b extending between the pair of guide rails 7a are provided, and the scanning head 8 moves in the left-right direction on the guide rails 7a. Supported as possible. This scanning head 8 has a slider 8a provided with a ball nut (not shown) screwed to the ball screw 7b on the back side, and the ball screw 7b is rotated by a drive motor 7c provided at one end of the ball screw 7b. By doing so, it moves in the left-right direction along the guide rail 7a.
　走査ヘッド８は、ワーク表面の高さを計測する高さ計測機構９と、該高さ計測機構９の側方近傍に配置された研磨ユニット１０とを備えている。 The scanning head 8 includes a height measuring mechanism 9 for measuring the height of the workpiece surface, and a polishing unit 10 disposed in the vicinity of the side of the height measuring mechanism 9.
　高さ計測機構９は、公知のデジタル・マイクロミラー・デバイス（Digital Micromirror Device）を備えている。このデジタル・マイクロミラー・デバイスは、多数の微小鏡面（マイクロミラー）を平面に配列した表示素子の一種であり、いわゆる共焦点方式により、例えば約５０倍の倍率で各座標におけるワーク表面の高さ分布、ひいては異物１００の高さ分布を特定可能に構成されている。本実施形態では、この高さ計測機構９により、一度に計測できる範囲は、例えば一辺が２１０μｍ～２５０μｍの矩形範囲となっている。 The height measuring mechanism 9 includes a known digital micromirror device. This digital micromirror device is a kind of display element in which a large number of micromirror surfaces (micromirrors) are arranged in a plane. The height of the workpiece surface at each coordinate at a magnification of about 50 times, for example, by a so-called confocal system. The distribution and thus the height distribution of the foreign matter 100 can be specified. In the present embodiment, the range that can be measured at once by the height measuring mechanism 9 is, for example, a rectangular range having a side of 210 μm to 250 μm.
　図２は、研磨ユニット１０の概略構成図である。 FIG. 2 is a schematic configuration diagram of the polishing unit 10.
　研磨ユニット１０は、研磨カセット１１を備えている。この研磨カセット１１は、通常のオーディオカセットと同様な形状を有し、研磨テープＴが巻回された繰出しリール１２と、該繰出しリール１２の側方に間隔をあけて配置された巻取りリール１３と、これら両リール１２，１３の下方に配置された研磨テープＴを案内する一対の案内ローラ１４とが、カセット本体部１１ａに対してそれぞれ回転自在に軸支されている。 The polishing unit 10 includes a polishing cassette 11. The polishing cassette 11 has a shape similar to that of a normal audio cassette, and a payout reel 12 around which the polishing tape T is wound, and a take-up reel 13 disposed at a side of the payout reel 12 with a space therebetween. A pair of guide rollers 14 for guiding the polishing tape T disposed below the reels 12 and 13 are rotatably supported by the cassette body 11a.
　繰出しリール１２及び巻取りリール１３は、研磨ユニット１０に設けられた駆動モータ（不図示）により駆動されることで、繰出しリール１２から繰り出された研磨テープＴが巻取りリール１３に巻き取られて、研磨テープＴを走行させる。研磨テープＴは、粘着性の表層に微小粒子からなる研磨材が仕込まれたものであり、研磨により発生した研磨屑の大部分は、研磨テープＴに付着したまま研磨カセット１１に取り込まれるようになっている。 The supply reel 12 and the take-up reel 13 are driven by a drive motor (not shown) provided in the polishing unit 10, so that the polishing tape T supplied from the supply reel 12 is taken up by the take-up reel 13. The abrasive tape T is run. The polishing tape T has an adhesive surface layer loaded with an abrasive made of fine particles, and most of the polishing debris generated by polishing is taken into the polishing cassette 11 while adhering to the polishing tape T. It has become.
　この研磨カセット１１は、研磨ユニット本体１０ａに着脱自在に装着されている。このため、上記研磨テープＴを使い切った場合には、研磨テープＴを交換することにより、新たな研磨テープＴを遅滞なく供給して異物１００の高効率な研磨修正作業を行うことが可能になっている。 The polishing cassette 11 is detachably attached to the polishing unit main body 10a. For this reason, when the polishing tape T is used up, it is possible to supply the new polishing tape T without delay and perform highly efficient polishing correction work of the foreign matter 100 by replacing the polishing tape T. ing.
　研磨ユニット１０にはさらに、研磨カセット１１における一対の案内ローラ１４の間に位置するように研磨テープＴを案内する一対の案内ローラ１６が研磨ユニット本体１０ａに対してそれぞれ回転自在に軸支されており、これら一対の案内ローラ１６の間に研磨テープＴをワーク表面の異物１００に押し付けるための押付ヘッド１７が設けられている。 The polishing unit 10 further includes a pair of guide rollers 16 for guiding the polishing tape T so as to be positioned between the pair of guide rollers 14 in the polishing cassette 11 so as to be rotatably supported by the polishing unit main body 10a. A pressing head 17 is provided between the pair of guide rollers 16 to press the polishing tape T against the foreign material 100 on the workpiece surface.
　この押付ヘッド１７は、研磨カセット１１の下方で研磨ユニット本体１０ａに固定配置された保持部材１８によって保持され、研磨テープＴが繰出しリール１２から繰り出されて案内ローラ１４，１６を経て巻取りリール１３に巻き取られる間に当該研磨テープＴに先端が圧接するようになっている。本実施形態では、この押付ヘッド１７で研磨テープＴを押し付けて一度に削ることができる領域は、例えば直径約１００μｍ～２００μｍの円形となっている。この研磨テープの押付けによって削ることができる領域の大きさや形状は、これに限定されず、押付ヘッド１７の押し込み量や該押付ヘッド１７の先端部形状によって大きく変わる。 The pressing head 17 is held below the polishing cassette 11 by a holding member 18 fixedly disposed on the polishing unit main body 10a, and the polishing tape T is fed out from the feeding reel 12 through the guide rollers 14 and 16 and the take-up reel 13. The tip is brought into pressure contact with the polishing tape T while being wound around. In the present embodiment, the region that can be cut at once by pressing the polishing tape T with the pressing head 17 is, for example, a circle having a diameter of about 100 μm to 200 μm. The size and shape of the area that can be shaved by pressing the polishing tape are not limited to this, and vary greatly depending on the pressing amount of the pressing head 17 and the shape of the tip of the pressing head 17.
　また、異物研磨装置Ｓは、図１に示すように、基台１の任意の位置に各機構を制御するための制御装置２０を備え、該制御装置２０がメインサーバ２１に繋がれている。メインサーバ２１には、異物研磨装置Ｓとは別個の欠陥検査装置２２による検査で検出されたワーク表面の欠陥の位置及び大きさなどの欠陥情報が保存されている。欠陥検査装置２２の構成は、特に限定されず、ワーク表面の走査により欠陥を検出可能であればよい。なお、この欠陥検査装置２２では、ワーク表面の高さは精密に測定できず、検出した欠陥をなす異物１００の形状も正確に把握できない。 Further, as shown in FIG. 1, the foreign matter polishing apparatus S includes a control device 20 for controlling each mechanism at an arbitrary position of the base 1, and the control device 20 is connected to the main server 21. The main server 21 stores defect information such as the position and size of the defect on the workpiece surface detected by the inspection by the defect inspection device 22 separate from the foreign material polishing device S. The configuration of the defect inspection apparatus 22 is not particularly limited as long as the defect can be detected by scanning the workpiece surface. The defect inspection apparatus 22 cannot accurately measure the height of the workpiece surface, and cannot accurately grasp the shape of the foreign matter 100 that forms the detected defect.
　　－ワーク表面の異物研磨方法－
　次に、上記異物研磨装置Ｓを使用してワーク表面に存在する異物１００による欠陥を修正する方法について、一例を挙げて説明する。 -Foreign matter polishing method on workpiece surface-
Next, a method for correcting defects caused by the foreign matter 100 existing on the workpiece surface using the foreign matter polishing apparatus S will be described with an example.
　図３は、液晶表示装置の製造工程における修正工程周辺の概略を示すフローチャート図である。 FIG. 3 is a flowchart showing an outline of the periphery of the correction process in the manufacturing process of the liquid crystal display device.
　まず、ステップＳｔ０１において、検査対象となるワークＷを準備する。本実施形態でのワークＷは、例えば、配向膜を表面に形成した後のアレイ基板とする。そして、ワークＷの表面に存在する異物１００による欠陥を欠陥検査装置２２により検査する（検査工程）。これによって、ワーク表面に欠陥が存在する場合には、検出された欠陥の位置及び大きさなどの欠陥情報が取得されてメインサーバ２１に保存される。なお、この段階では、ワーク表面の高さは正確に測定できていない。 First, in step St01, a workpiece W to be inspected is prepared. The workpiece W in this embodiment is, for example, an array substrate after an alignment film is formed on the surface. And the defect inspection apparatus 22 inspects the defect by the foreign material 100 which exists on the surface of the workpiece | work W (inspection process). As a result, if there is a defect on the workpiece surface, defect information such as the position and size of the detected defect is acquired and stored in the main server 21. At this stage, the height of the workpiece surface cannot be measured accurately.
　続いて、ステップＳｔ０２において、欠陥が検出されたか否か、欠陥が検出された場合には欠陥情報（位置及び大きさなど）からその欠陥の修正が必要か否かを判定する。欠陥がない又は修正の必要がない欠陥のみがある場合には、ステップＳｔ０３に進んでワークＷを合格品カセットに収納し、続くステップＳｔ０４において貼合工程に投入され、通常の製造ラインにのってカラーフィルタ基板と貼り合わせられる。一方、修正が必要な欠陥が存在する場合には、ステップＳｔ０５に進んで修正対象品カセットに収納し、続くステップＳｔ０６において、修正工程に投入される。 Subsequently, in step St02, it is determined whether or not a defect is detected, and if a defect is detected, whether or not the defect needs to be corrected is determined from defect information (position and size, etc.). If there is only a defect that has no defect or that does not need to be corrected, the process proceeds to step St03 and the workpiece W is stored in the accepted product cassette, and is then put into the bonding process in step St04, and is put on a normal production line. And bonded to the color filter substrate. On the other hand, if there is a defect that needs to be corrected, the process proceeds to step St05 to be stored in the correction target product cassette, and in the subsequent step St06, it is put into the correction process.
　図４は、修正工程におけるワーク表面の異物１００の研磨方法を示すフローチャート図である。図５～図８は、大型異物１００が複数回に亘って研磨される場合の研磨処理毎の様子を示し、（ａ）は高さ計測範囲Ａを示す平面図であり、（ｂ）は研磨処理された異物１００の側面図である。なお、図６～図８において、黒円ｃは押付ヘッド１７を下降させた際のそのヘッド中心の当接部分を、斜線を内側に付した破線円ａは押付ヘッド１７を下降させた際の研磨範囲をそれぞれ示し、（ａ）では研磨処理が施された異物部分にドットハッチングを付している。 FIG. 4 is a flowchart showing a method for polishing the foreign material 100 on the workpiece surface in the correction process. 5 to 8 show a state of each polishing process when the large foreign material 100 is polished a plurality of times, (a) is a plan view showing a height measurement range A, and (b) is a polishing. It is a side view of the processed foreign material 100. FIG. In FIGS. 6 to 8, a black circle “c” indicates a contact portion of the center of the pressing head 17 when the pressing head 17 is lowered, and a broken-line circle “a” with an oblique line on the inner side indicates that when the pressing head 17 is lowered. Each of the polishing ranges is shown. In (a), the foreign matter portion subjected to the polishing process is dot-hatched.
　修正工程では、ワークステージ３上にワークＷを載置し、次いで、制御装置２０が自動モードのシーケンスに従って異物研磨装置Ｓを制御する。まず最初にステップＳｔ１０において、異物研磨装置Ｓがメインサーバ２１から欠陥情報を取得する。 In the correction process, the workpiece W is placed on the workpiece stage 3, and then the control device 20 controls the foreign material polishing device S according to the sequence of the automatic mode. First, in step St <b> 10, the foreign material polishing apparatus S acquires defect information from the main server 21.
　次に、ステップＳｔ１１において、取得した欠陥情報を基に修正が必要な欠陥を選択する。そして、選択した欠陥情報（位置及び大きさ）に基づき、その欠陥をなす異物１００が存在する領域を少なくとも一部含む所定の範囲を高さ計測範囲Ａに設定する（初期設定工程）。 Next, in step St11, a defect that needs to be corrected is selected based on the acquired defect information. Then, based on the selected defect information (position and size), a predetermined range including at least a part of the region where the foreign material 100 forming the defect exists is set as the height measurement range A (initial setting step).
　具体的には、異物１００が、所定の大きさ、例えば高さ計測機構９の計測範囲（縦横２１０μｍ～２５０μｍの矩形範囲）に比べて若干小さい判定基準である縦横２００μｍよりも大きい場合には、図５（ａ）に示すように、その異物１００の端部を含む範囲を高さ計測範囲Ａに設定する。図５（ａ）中で外側の二点鎖線は、欠陥情報から異物１００が存在すると推定される範囲を示している。一方、当該異物１００が所定の大きさ以下である場合には、その異物１００が存在する領域全体を含む範囲を高さ計測範囲Ａに設定する。この場合は通常１回の研磨処理で欠陥の修正が可能であるので、以下では、所定の大きさよりも大きな大型異物１００を研磨修正する場合について説明する。なお、本実施形態で例に挙げる大型異物１００は、繊維のような線状の異物である。 Specifically, when the foreign object 100 is larger than a predetermined size, for example, 200 μm in length and width which is a slightly smaller criterion than the measurement range of the height measuring mechanism 9 (rectangular range of 210 μm to 250 μm in length and width), As shown in FIG. 5A, a range including the end of the foreign object 100 is set as a height measurement range A. An outer two-dot chain line in FIG. 5A indicates a range in which the foreign matter 100 is estimated from the defect information. On the other hand, when the foreign object 100 is not larger than a predetermined size, a range including the entire region where the foreign object 100 exists is set as the height measurement range A. In this case, since the defect can be corrected normally by one polishing process, a case where a large foreign object 100 larger than a predetermined size is corrected by polishing will be described below. Note that the large foreign matter 100 exemplified in this embodiment is a linear foreign matter such as a fiber.
　上記ステップＳｔ１１に続くステップＳｔ１２では、初期設定した高さ計測範囲Ａの上方に高さ計測機構９が位置するように走査ヘッド８を移動させ、同高さ計測範囲Ａにおいてワーク表面の高さを正確に計測する（高さ計測工程）。 In step St12 following step St11, the scanning head 8 is moved so that the height measurement mechanism 9 is positioned above the initially set height measurement range A, and the height of the workpiece surface is adjusted in the height measurement range A. Measure accurately (height measurement process).
　次いで、ステップＳｔ１３において、高さ計測範囲Ａ内でのワーク表面の最大高さ、つまり異物１００の最大高さが所定の高さｈ１、例えば３μｍ以下であるか否かを判定する。このとき、異物１００の最大高さが３μｍ以下であれば、この異物１００に対する研磨修正は必要ないので、ステップＳｔ２０に飛ぶ。一方、異物１００の最大高さが３μｍよりも高いときは、この異物１００には研磨修正が必要なので、ステップＳｔ１４に進んで上記高さ計測範囲Ａにおける最大高さ箇所Ｍを研磨対象箇所に設定する。 Next, in Step St13, it is determined whether or not the maximum height of the workpiece surface within the height measurement range A, that is, the maximum height of the foreign material 100 is a predetermined height h1, for example, 3 μm or less. At this time, if the maximum height of the foreign material 100 is 3 μm or less, the polishing correction for the foreign material 100 is not necessary, and the process jumps to Step St20. On the other hand, when the maximum height of the foreign object 100 is higher than 3 μm, the foreign object 100 needs to be corrected for polishing. Therefore, the process proceeds to step St14, and the maximum height portion M in the height measurement range A is set as the polishing target location. To do.
　続くステップＳｔ１５では、設定した研磨対象箇所、つまり先の高さ計測範囲Ａ内での最大高さ箇所Ｍの上方に押付ヘッド１７が位置するように走査ヘッド８を移動させる。次いで、研磨テープＴを走行させると共に、高さ計測機構９による計測結果に基づき、押付ヘッド１７から異物１００及びワーク表面までの距離を推定し、その推定距離に基づいて研磨ユニット１０を下降させる。そして、押付ヘッド１７先端で走行する研磨テープＴを異物１００に押し付けながら摺動させることにより、異物１００の最大高さ箇所Ｍをテープ走行に伴って図５（ｂ）に示すようにスポット的に研磨修正する（研磨工程）。研磨修正する際には、ワークＷの表面を傷つけないように、所定の高さｈ１以下の高さｈ２、例えば２．５μｍのところまで研磨する。 In the subsequent step St15, the scanning head 8 is moved so that the pressing head 17 is positioned above the set polishing target location, that is, the maximum height location M within the previous height measurement range A. Next, the polishing tape T is caused to travel, and the distance from the pressing head 17 to the foreign object 100 and the workpiece surface is estimated based on the measurement result by the height measuring mechanism 9, and the polishing unit 10 is lowered based on the estimated distance. Then, the polishing tape T traveling at the tip of the pressing head 17 is slid while being pressed against the foreign material 100, whereby the maximum height portion M of the foreign material 100 is spotted as shown in FIG. Polishing correction (polishing process). When correcting the polishing, the surface of the workpiece W is polished to a height h2 equal to or less than a predetermined height h1, for example, 2.5 μm so as not to be damaged.
　次に、ステップＳｔ１６において、研磨箇所を基準として該研磨箇所の周辺領域を含む範囲、具体的には、図６（ａ）に示すように研磨箇所を中心とした範囲を高さ計測範囲Ａに設定し直す（再設定工程）。これにより、高さ計測範囲Ａが初期設定した範囲から異物１００のある箇所を中心とした近接領域に移る。 Next, in step St16, the range including the peripheral area of the polishing location with reference to the polishing location, specifically, the range centering on the polishing location as shown in FIG. Re-set (re-setting process). As a result, the height measurement range A moves from the initially set range to a proximity region centered on the location where the foreign object 100 is located.
　続いて、ステップＳｔ１７において、再設定した高さ計測範囲Ａの上方に高さ計測機構９が位置するように走査ヘッド８を移動させ、再設定した高さ計測範囲Ａにおいて高さ計測機構９によりワーク表面の高さを正確に計測する（高さ計測工程）。 Subsequently, in step St17, the scanning head 8 is moved so that the height measurement mechanism 9 is positioned above the reset height measurement range A, and the height measurement mechanism 9 in the reset height measurement range A is moved. Accurately measures the height of the workpiece surface (height measurement process).
　そして、続くステップＳｔ１８では、高さ計測範囲Ａ内での異物１００の最大高さが３μｍ以下であるか否かを判定する。このとき、異物１００の最大高さが３μｍ以下であれば、この異物１００に対する研磨修正は完了したとして、ステップＳｔ２０に進む。一方、異物１００の最大高さが３μｍよりも高いときは、この異物１００には未だ研磨修正が必要なので、ステップＳｔ１４に戻って、再々設定した高さ計測範囲Ａにおける最大高さ箇所Ｍが研磨対象箇所に設定され、再度ステップＳｔ１５～ステップＳｔ１８が行われる。 Then, in the following step St18, it is determined whether or not the maximum height of the foreign material 100 within the height measurement range A is 3 μm or less. At this time, if the maximum height of the foreign object 100 is 3 μm or less, the polishing correction for the foreign object 100 is completed, and the process proceeds to step St20. On the other hand, when the maximum height of the foreign material 100 is higher than 3 μm, the foreign material 100 still needs to be corrected for polishing. Therefore, the process returns to step St14 and the maximum height portion M in the height measurement range A set again is polished. The target location is set, and Steps St15 to St18 are performed again.
　すなわち、ステップＳｔ１５において、走査ヘッド８を移動させ、研磨テープＴを走行させると共に、研磨ユニット１０を下降させることにより、図６（ｂ）に示すように、再々設定された研磨対象箇所（前回の高さ計測での最大高さ箇所Ｍ）が研磨される（研磨工程）。続くステップＳｔ１６において、図７（ａ）に示すように、この研磨箇所を中心とした範囲が高さ計測範囲Ａに設定し直される（再設定工程）。そして、ステップＳｔ１７において、走査ヘッド８を移動させ、先ほど設定し直した高さ計測範囲Ａにおいて高さ計測機構９によりワーク表面の高さが正確に計測される（高さ計測工程）。次いで、ステップＳｔ１８において、高さ計測範囲Ａ内での異物１００の最大高さが３μｍ以下であるか否かが判定され、異物１００の最大高さが３μｍよりも大きいときは、ステップＳｔ１４に戻って、設定し直した高さ計測範囲Ａにおける最大高さ箇所Ｍが研磨対象箇所に設定され（再設定工程）、ステップＳｔ１５において、図７（ｂ）に示すように、その研磨対象箇所が研磨される（研磨工程）。 That is, in step St15, the scanning head 8 is moved, the polishing tape T is run, and the polishing unit 10 is moved downward, so that the polishing target position (previous time) is set again as shown in FIG. The maximum height portion M) in the height measurement is polished (polishing step). In the subsequent step St16, as shown in FIG. 7A, the range centered on this polishing location is reset to the height measurement range A (resetting step). Then, in step St17, the scanning head 8 is moved, and the height of the workpiece surface is accurately measured by the height measuring mechanism 9 in the height measurement range A that has been reset previously (height measurement step). Next, in step St18, it is determined whether or not the maximum height of the foreign object 100 within the height measurement range A is 3 μm or less. If the maximum height of the foreign object 100 is greater than 3 μm, the process returns to step St14. Then, the maximum height portion M in the reset height measurement range A is set as a polishing target portion (resetting step), and in step St15, as shown in FIG. 7B, the polishing target portion is polished. (Polishing step).
　以降、ワーク表面の高さを計測した際の高さ計測範囲Ａ内での最大高さが３μｍ以下になるまで、ステップＳｔ１４～ステップＳｔ１８が繰り返される。これによって、図８（ａ）に示すように、高さ計測範囲Ａが研磨対象箇所と共に近接する領域に異物１００に沿って順次移っていき、大型異物１００の全体に対して高さ計測範囲Ａを自動で走査させながら研磨処理が逐次実行される。その結果、図８（ｂ）に示すように、大型異物１００が全体に亘って所定の高さ以下となるように研磨修正される。 Thereafter, steps St14 to St18 are repeated until the maximum height in the height measurement range A when the height of the workpiece surface is measured becomes 3 μm or less. As a result, as shown in FIG. 8A, the height measurement range A sequentially moves along the foreign object 100 to an area close to the polishing target portion, and the height measurement range A with respect to the entire large foreign object 100. The polishing process is sequentially performed while automatically scanning. As a result, as shown in FIG. 8 (b), the large foreign matter 100 is polished and corrected so as to be less than or equal to a predetermined height throughout.
　ステップＳｔ２０では、欠陥情報を基に未修正の欠陥がないか判定され、未修正の欠陥がある場合には、ステップＳｔ１１に戻って別の欠陥が選択されて、それ以降の工程が繰り返される。一方、未修正の欠陥がなくなれば、ワークＷに対する研磨修正を全て終えたと判定してステップＳｔ２１に進んで、ステップＳｔ０４の貼り合わせ工程に投入される。 In step St20, it is determined whether there is an uncorrected defect based on the defect information. If there is an uncorrected defect, the process returns to step St11 to select another defect and the subsequent steps are repeated. On the other hand, if there are no uncorrected defects, it is determined that all the polishing correction for the workpiece W has been completed, the process proceeds to step St21, and is put into the bonding process of step St04.
　　－実施形態の効果－
　この実施形態によると、ワーク表面の異物１００が大型異物の場合に、高さを計測できる高さ計測範囲Ａが異物１００の一部にしか及ばなくても、異物１００の端部を含む範囲を初期の高さ計測範囲Ａに設定し、該高さ計測範囲Ａ内での最大高さ箇所Ｍに初期研磨を行った後において、研磨箇所の周辺領域を含む範囲を高さ計測範囲Ａに設定し直し、該高さ計測範囲Ａ内での最大高さ箇所Ｍを研磨することを繰り返し行うので、大型異物１００の一端部が先ず研磨対象箇所となって、その後順次、異物Ｘの中央側、さらには他端側へと高さ計測範囲Ａが研磨対象箇所と共に移っていく。これにより、大型異物１００の全体に亘って高さ計測範囲Ａを自動で走査させることができる。また、異物１００の研磨処理毎に毎回高さを計測するので、先の研磨処理によって異物１００がずれたり変形しても、それに対応して異物１００を正確に研磨できる。これにより、上述した高さ計測範囲Ａの走査に伴って大型異物１００の全体を所定の高さ以下となるように確実に研磨修正することができる。したがって、大型異物１００があっても迅速且つ確実に研磨修正することができる。その結果、人員コストをかけずに、ワーク表面の異物欠陥の修正効率を高めることができ、且つ製品の品質を向上させることができる。 -Effects of the embodiment-
According to this embodiment, when the foreign matter 100 on the workpiece surface is a large foreign matter, even if the height measurement range A in which the height can be measured reaches only a part of the foreign matter 100, the range including the end of the foreign matter 100 is included. After setting the initial height measurement range A and performing initial polishing on the maximum height M within the height measurement range A, the range including the peripheral area of the polishing location is set as the height measurement range A. Since the maximum height portion M within the height measurement range A is repeatedly polished, one end portion of the large foreign material 100 becomes the polishing target portion first, and then sequentially the center side of the foreign material X, Furthermore, the height measurement range A moves to the other end side together with the polishing target portion. Thereby, the height measurement range A can be automatically scanned over the entire large foreign matter 100. Further, since the height is measured every time the foreign object 100 is polished, even if the foreign object 100 is displaced or deformed by the previous polishing process, the foreign object 100 can be accurately polished correspondingly. As a result, the entire large foreign object 100 can be polished and corrected so as to be equal to or less than a predetermined height in accordance with the scanning of the height measurement range A described above. Therefore, even if there is a large foreign object 100, it is possible to correct and correct quickly and reliably. As a result, it is possible to increase the efficiency of correcting foreign matter defects on the workpiece surface without increasing personnel costs, and to improve the product quality.
　そして、本実施形態で研磨修正したワークＷであるアレイ基板を表示装置に適用すれば、異物１００による品質の低下が現れやすい表示装置において、品質を格段に向上させると共に、製造効率を高めることができる。 If the array substrate, which is the workpiece W polished and corrected in the present embodiment, is applied to the display device, the quality can be remarkably improved and the manufacturing efficiency can be improved in the display device in which the quality deterioration due to the foreign matter 100 is likely to occur. it can.
　また、本実施形態によれば、異物１００が小型であるか大型であるかを問わず同様の研磨修正処理を行うことにより一律に異物１００の研磨修正を行えるので、単純なアルゴリズムで異物欠陥の修正を行うことができる。 Further, according to the present embodiment, the foreign object 100 can be uniformly corrected by performing the same polishing correction process regardless of whether the foreign object 100 is small or large. Corrections can be made.
　〈実施形態の変形例〉
　図９は、この変形例に係る修正工程でのワーク表面の異物１００の研磨方法を示すフローチャート図である。 <Modification of Embodiment>
FIG. 9 is a flowchart showing a method of polishing the foreign material 100 on the workpiece surface in the correction process according to this modification.
　上記実施形態では、ステップＳｔ１３及びステップＳｔ１８において、高さ計測範囲Ａ内での異物１００の最大高さ（ワーク表面の最大高さ）が３μｍ以下であるか判定した際に、当該最大高さが３μｍ以下であれば、その異物１００に対する研磨修正は必要ないか若しくは完了したとして、異物１００が存在する領域において高さを計測していない部分が残っていても、次のステップＳｔ２０に進むようにしたが、本変形例では、異物１００が存在する領域において高さを計測していない部分が残っている場合に、当該未計測部分で異物１００が３μｍよりも高いと、欠陥が発生するおそれがあることに着目し、異物１００が存在する領域は全域に亘って高さ計測する方法を採用している。 In the above embodiment, when it is determined in step St13 and step St18 whether the maximum height of the foreign matter 100 within the height measurement range A (the maximum height of the workpiece surface) is 3 μm or less, the maximum height is If it is 3 μm or less, it is determined that polishing correction for the foreign material 100 is not necessary or completed, and even if a portion where the height is not measured remains in the region where the foreign material 100 exists, the process proceeds to the next step St20. However, in this modification, when a portion where the height is not measured remains in the region where the foreign material 100 exists, if the foreign material 100 is higher than 3 μm in the unmeasured portion, a defect may occur. Focusing on a certain point, a method of measuring the height of the region where the foreign object 100 exists over the entire region is adopted.
　すなわち、ステップＳｔ１３及びステップＳｔ１８において、異物１００の最大高さが３μｍ以下であると判定した場合には、ステップＳｔ１９－１に進み、異物１００が存在する領域において高さを計測していない部分が残っているか否かを判定する。当該未計測部分が残っているか否かは、欠陥情報から異物１００が存在すると推定される範囲において、未計測部分が存在するか否かによって判定される。このとき、当該未計測部分があれば、ステップＳｔ１９－２に進んで、その未計測部分を少なくとも一部含む範囲を高さ計測範囲Ａに設定し直し（補完設定工程）、ステップＳｔ１２に戻って上述した以降のステップＳｔ１３～ステップＳｔ１８を再度行う。一方、未計測部分がない場合には、その異物１００に対する研磨修正は必要ないか若しくは完了したとして、次のステップＳｔ２０に進む。 That is, in Step St13 and Step St18, when it is determined that the maximum height of the foreign object 100 is 3 μm or less, the process proceeds to Step St19-1, and there is a portion where the height is not measured in the region where the foreign object 100 exists. It is determined whether it remains. Whether or not the unmeasured part remains is determined by whether or not the unmeasured part exists in a range in which it is estimated from the defect information that the foreign object 100 exists. At this time, if there is an unmeasured part, the process proceeds to step St19-2, and a range including at least a part of the unmeasured part is set as the height measurement range A (complement setting step), and the process returns to step St12. The subsequent steps St13 to St18 are repeated. On the other hand, if there is no unmeasured portion, it is determined that polishing correction for the foreign material 100 is not necessary or completed, and the process proceeds to the next step St20.
　このような異物研磨方法によれば、大型異物１００について、研磨修正できていない部分を残すことがなく、当該異物１００の全体をよりいっそう確実に研磨修正することができる。したがって、極めて高精度な異物１００の研磨修正が求められるワークＷにも好適に用いることができる。 According to such a foreign matter polishing method, the large foreign matter 100 can be more reliably polished and corrected without leaving a portion that has not been polished and corrected. Therefore, it can be used suitably also for the workpiece | work W in which the grinding | polishing correction | amendment of the very high precision foreign material 100 is calculated | required.
　なお、上記実施形態では、ワークＷを、液晶表示装置を構成する配向膜を形成した後のアレイ基板としたが、配向膜を形成する前のアレイ基板でもよく、カラーフィルタ基板でも構わない。さらには、液晶表示装置以外の有機ＥＬ（Electro Luminescence）表示装置やプラズマ表示装置などの他の表示装置を構成する基板などもワークＷとすることが可能である。 In the above embodiment, the workpiece W is the array substrate after forming the alignment film constituting the liquid crystal display device, but it may be an array substrate before forming the alignment film or a color filter substrate. Furthermore, a substrate constituting another display device such as an organic EL (Electro Luminescence) display device or a plasma display device other than the liquid crystal display device can be used as the work W.
　以上、本発明の好ましい実施形態及び変形例について説明したが、本発明の技術的範囲は上記実施形態及び変形例に記載の範囲に限定されない。上記実施形態及び変形例が例示であり、それらの各構成要素や各処理プロセスの組み合わせに、さらにいろいろな変形例が可能なこと、またそうした変形例も本発明の範囲にあることは当業者に理解されるところである。 As mentioned above, although preferable embodiment and the modification of this invention were described, the technical scope of this invention is not limited to the range as described in the said embodiment and modification. Those skilled in the art will appreciate that the above-described embodiments and modifications are exemplifications, and that various modifications can be made to combinations of the respective constituent elements and processing processes, and that such modifications are also within the scope of the present invention. It is understood.
　以上説明したように、本発明は、異物研磨方法について有用であり、特に、大型異物があっても迅速且つ確実に研磨修正して製品の品質を向上させることが要望される異物研磨方法に適している。 As described above, the present invention is useful for a foreign matter polishing method, and is particularly suitable for a foreign matter polishing method in which it is desired to improve the quality of a product by quickly and reliably polishing and correcting even if there is a large foreign matter. ing.
　Ａ　　　高さ計測範囲
　Ｔ　　　研磨テープ
　Ｗ　　　ワーク
　ｈ１　　所定の高さ
　１２　　繰出しリール
　１３　　巻取りリール
　１７　　押付ヘッド
　１００　異物 A Height measurement range T Polishing tape W Work piece h1 Predetermined height 12 Feed reel 13 Take-up reel 17 Pressing head 100 Foreign matter

Claims (4)

  1. 　繰出しリールから研磨テープを繰り出すと共に、巻取りリールで巻き取りながら、これら繰出しリールと巻取りリールとの間の研磨テープを押付ヘッドでワーク表面に押し付けて、該ワーク表面の異物を研磨して修正するワーク表面の異物研磨方法であって、
    　上記ワーク表面の異物を検査して、検出した異物の位置及び大きさ情報を取得する検査工程と、
    　上記検査工程で検出した異物の位置及び大きさ情報に基づき、該異物が存在する領域を少なくとも一部含む所定の範囲を高さ計測範囲に設定する初期設定工程と、
    　上記高さ計測範囲においてワーク表面の高さを計測する高さ計測工程と、
    　上記高さ計測工程で高さを計測した高さ計測範囲内での最大高さが所定の高さよりも高い場合に、該最大高さ箇所を所定の高さ以下になるように研磨する研磨工程と、
    　上記研磨工程で研磨した研磨箇所を基準として、該研磨箇所の周辺領域を含む所定の範囲を上記高さ計測範囲に設定し直す再設定工程とを含み、
    　上記再設定工程の後に、上記高さ計測工程、研磨工程及び再設定工程を順に繰り返す
    ことを特徴とする異物研磨方法。     While feeding the polishing tape from the supply reel and winding it with the take-up reel, the polishing tape between the supply reel and the take-up reel is pressed against the work surface with the pressing head, and the foreign matter on the work surface is polished and corrected. A foreign matter polishing method for a workpiece surface,
    Inspecting the foreign matter on the workpiece surface, and obtaining the position and size information of the detected foreign matter,
    Based on the position and size information of the foreign matter detected in the inspection step, an initial setting step for setting a predetermined range including at least a part of the region where the foreign matter exists as a height measurement range;
    A height measurement step for measuring the height of the workpiece surface in the height measurement range;
    A polishing step for polishing the maximum height portion to be equal to or lower than a predetermined height when the maximum height within the height measurement range measured in the height measuring step is higher than the predetermined height. When,
    Including, as a reference, a polishing portion polished in the polishing step, a resetting step for resetting a predetermined range including a peripheral region of the polishing portion to the height measurement range,
    The foreign material polishing method, wherein the height measuring step, the polishing step, and the resetting step are sequentially repeated after the resetting step.
  2. 　請求項１に記載の異物研磨方法において、
    　上記初期設定工程では、上記異物の端部を含む所定の範囲を上記高さ計測範囲に設定する
    ことを特徴とする異物研磨方法。     The foreign matter polishing method according to claim 1,
    In the initial setting step, a foreign matter polishing method characterized in that a predetermined range including an end of the foreign matter is set as the height measurement range.
  3. 　請求項１及び２のいずれか１項に記載の異物研磨方法において、
    　上記高さ計測工程で高さを計測した高さ計測範囲内での最大高さが所定の高さ以下である場合に、上記異物が存在する領域において高さを計測していない部分が残っているときには、その未計測部分を少なくとも一部含む所定の範囲を上記高さ計測範囲に設定し直す補完設定工程をさらに含み、
    　上記補完設定工程の後に、上記高さ計測工程、研磨工程及び再設定工程を順に繰り返すことを特徴とする異物研磨方法。     In the foreign material grinding | polishing method of any one of Claim 1 and 2,
    When the maximum height within the height measurement range where the height is measured in the height measurement step is less than or equal to a predetermined height, there is a portion where the height is not measured in the region where the foreign matter exists. A supplementary setting step for resetting the predetermined range including at least a part of the unmeasured portion to the height measurement range,
    The foreign material polishing method, wherein the height measuring step, the polishing step, and the resetting step are sequentially repeated after the complementary setting step.
  4. 　請求項１～３のいずれか１項に記載の異物研磨方法において、
    　上記ワークは、表示パネル用基板である
    ことを特徴とする異物研磨方法。     In the foreign matter polishing method according to any one of claims 1 to 3,
    The foreign material polishing method, wherein the workpiece is a display panel substrate.
PCT/JP2011/005702 2010-10-19 2011-10-12 Foreign material abrading method WO2012053165A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6263059A (en) * 1985-09-12 1987-03-19 Nippon Steel Corp Automatic surface flaw grinder
JPH07205012A (en) * 1994-01-20 1995-08-08 Sanshin:Kk Foreign matter removing device for filter base plate
JPH10253818A (en) * 1997-03-13 1998-09-25 Sharp Corp Removal method and device for micro projection
JP2003266292A (en) * 2002-03-13 2003-09-24 Act Brain:Kk Repair device for defect of basic plate and method therefor
JP2008290166A (en) * 2007-05-23 2008-12-04 Lasertec Corp Tape grinding device and guide tool

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6263059A (en) * 1985-09-12 1987-03-19 Nippon Steel Corp Automatic surface flaw grinder
JPH07205012A (en) * 1994-01-20 1995-08-08 Sanshin:Kk Foreign matter removing device for filter base plate
JPH10253818A (en) * 1997-03-13 1998-09-25 Sharp Corp Removal method and device for micro projection
JP2003266292A (en) * 2002-03-13 2003-09-24 Act Brain:Kk Repair device for defect of basic plate and method therefor
JP2008290166A (en) * 2007-05-23 2008-12-04 Lasertec Corp Tape grinding device and guide tool

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