WO2012028728A3 - Verfahren zum nasschemischen rückätzen eines emitters einer solarzelle - Google Patents
Verfahren zum nasschemischen rückätzen eines emitters einer solarzelle Download PDFInfo
- Publication number
- WO2012028728A3 WO2012028728A3 PCT/EP2011/065231 EP2011065231W WO2012028728A3 WO 2012028728 A3 WO2012028728 A3 WO 2012028728A3 EP 2011065231 W EP2011065231 W EP 2011065231W WO 2012028728 A3 WO2012028728 A3 WO 2012028728A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wet
- chemical etching
- solar cell
- etching back
- cell emitter
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 2
- 238000003631 wet chemical etching Methods 0.000 title abstract 2
- 238000005530 etching Methods 0.000 abstract 4
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 239000007800 oxidant agent Substances 0.000 abstract 1
- 125000005385 peroxodisulfate group Chemical group 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02363—Special surface textures of the semiconductor body itself, e.g. textured active layers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Weting (AREA)
- Photovoltaic Devices (AREA)
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201180053238.5A CN103403875B (zh) | 2010-09-03 | 2011-09-02 | 用于太阳能电池发射体的湿化学反向蚀刻的方法 |
JP2013526493A JP2013536992A (ja) | 2010-09-03 | 2011-09-02 | 太陽電池エミッタの湿式化学エッチングバックのための方法 |
KR1020137008454A KR20140014065A (ko) | 2010-09-03 | 2011-09-02 | 태양전지 에미터의 습식―화학 에칭 백을 위한 방법 |
US13/820,540 US9583652B2 (en) | 2010-09-03 | 2011-09-02 | Method for the wet-chemical etching back of a solar cell emitter |
EP11760429.8A EP2612365A2 (de) | 2010-09-03 | 2011-09-02 | Verfahren zum nasschemischen rückätzen eines emitters einer solarzelle |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010037311.7 | 2010-09-03 | ||
DE102010037311 | 2010-09-03 | ||
DE102011050136A DE102011050136A1 (de) | 2010-09-03 | 2011-05-05 | Verfahren zum nasschemischen Ätzen einer Siliziumschicht |
DE102011050136.3 | 2011-05-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2012028728A2 WO2012028728A2 (de) | 2012-03-08 |
WO2012028728A3 true WO2012028728A3 (de) | 2012-10-11 |
Family
ID=44583021
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2011/065231 WO2012028728A2 (de) | 2010-09-03 | 2011-09-02 | Verfahren zum nasschemischen rückätzen eines emitters einer solarzelle |
PCT/EP2011/065222 WO2012028723A2 (de) | 2010-09-03 | 2011-09-02 | Verfahren zum nasschemischen ätzen einer hochdotierten halbleiterschicht |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2011/065222 WO2012028723A2 (de) | 2010-09-03 | 2011-09-02 | Verfahren zum nasschemischen ätzen einer hochdotierten halbleiterschicht |
Country Status (7)
Country | Link |
---|---|
US (2) | US9583652B2 (de) |
EP (2) | EP2612365A2 (de) |
JP (1) | JP2013536992A (de) |
KR (1) | KR20140014065A (de) |
CN (2) | CN103403875B (de) |
DE (2) | DE102011050136A1 (de) |
WO (2) | WO2012028728A2 (de) |
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US20150118785A1 (en) * | 2012-05-04 | 2015-04-30 | Akrion Systems, Llc | Method for consistently texturizing silicon wafers during solar cell wet chemical processing |
KR20150022017A (ko) * | 2012-06-25 | 2015-03-03 | 메르크 파텐트 게엠베하 | 국부 후면 필드 (lbsf) 를 갖는 태양전지들의 제조 방법 |
DE102012107372B4 (de) | 2012-08-10 | 2017-03-09 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Alkalischer Ätzprozess und Vorrichtung zur Durchführung des Verfahrens |
KR101431730B1 (ko) * | 2012-11-29 | 2014-08-26 | 한화케미칼 주식회사 | 태양전지용 기판의 표면처리 방법 |
DE102014001363B3 (de) | 2014-01-31 | 2015-04-09 | Technische Universität Bergakademie Freiberg | Verfahren zur Erzeugung von Texturen oder von Polituren auf der Oberfläche von monokristallinen Siliciumwafern |
DE102014103303A1 (de) | 2014-03-12 | 2015-10-01 | Universität Konstanz | Verfahren zum Herstellen von Solarzellen mit simultan rückgeätzten dotierten Bereichen |
DE102014110222B4 (de) * | 2014-07-21 | 2016-06-23 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zur Strukturierung von Ober- und Unterseite eines Halbleitersubstrats |
CN104900758B (zh) * | 2015-05-25 | 2017-03-15 | 连云港市产品质量监督检验中心 | 一种准单晶硅片微缺陷的检测方法 |
KR20170019597A (ko) * | 2015-08-12 | 2017-02-22 | 엘지전자 주식회사 | 태양 전지 및 그 제조 방법 |
US10538846B2 (en) * | 2015-12-11 | 2020-01-21 | Dongwoo Fine-Chem Co., Ltd. | Etching solution composition for tungsten layer, method for preparing electronic device using the same and electronic device |
JP6968194B2 (ja) * | 2017-04-04 | 2021-11-17 | テスカン ブルノ エスアールオーTESCAN BRNO s.r.o. | 半導体デバイスの金属と誘電体が混在した1つ以上の層をエッチングする方法 |
US20190103282A1 (en) * | 2017-09-29 | 2019-04-04 | Versum Materials Us, Llc | Etching Solution for Simultaneously Removing Silicon and Silicon-Germanium Alloy From a Silicon-Germanium/Silicon Stack During Manufacture of a Semiconductor Device |
CN107863418A (zh) * | 2017-11-02 | 2018-03-30 | 国家电投集团西安太阳能电力有限公司 | 一种n型太阳能电池硼扩散方法 |
CN108384548A (zh) * | 2018-02-24 | 2018-08-10 | 苏州晶瑞化学股份有限公司 | 一种非金属氧化物膜用缓冲蚀刻液 |
KR102584087B1 (ko) * | 2018-03-19 | 2023-10-04 | 상라오 징코 솔라 테크놀러지 디벨롭먼트 컴퍼니, 리미티드 | 텐덤 태양전지의 제조 방법 |
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CN110707163A (zh) * | 2019-09-20 | 2020-01-17 | 浙江师范大学 | 利用四甲基胍有机碱在单晶硅表面制绒的方法 |
CN110922970A (zh) * | 2019-11-29 | 2020-03-27 | 南京纳鑫新材料有限公司 | 一种perc电池背抛光添加剂及工艺 |
CN111019659B (zh) * | 2019-12-06 | 2021-06-08 | 湖北兴福电子材料有限公司 | 一种选择性硅蚀刻液 |
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CN112689886B (zh) * | 2020-06-16 | 2022-11-18 | 福建晶安光电有限公司 | 一种衬底加工方法及半导体器件制造方法 |
KR20220145638A (ko) * | 2021-04-22 | 2022-10-31 | 주식회사 이엔에프테크놀로지 | 반도체 기판용 식각액 조성물 |
CN114891509B (zh) * | 2021-12-14 | 2023-05-05 | 湖北兴福电子材料股份有限公司 | 一种高选择性的缓冲氧化物蚀刻液 |
CN116103047B (zh) * | 2022-09-20 | 2024-03-12 | 湖北兴福电子材料股份有限公司 | 一种高选择性蚀刻掺杂氧化硅/碳氮化硅的蚀刻液 |
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DE102009022477A1 (de) | 2009-05-25 | 2010-12-16 | Universität Konstanz | Verfahren zum Texturieren einer Oberfläche eines Halbleitersubstrates sowie Vorrichtung zum Durchführen des Verfahrens |
US7955989B2 (en) * | 2009-09-24 | 2011-06-07 | Rohm And Haas Electronic Materials Llc | Texturing semiconductor substrates |
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2011
- 2011-05-05 DE DE102011050136A patent/DE102011050136A1/de not_active Withdrawn
- 2011-06-07 DE DE102011050903A patent/DE102011050903A1/de not_active Withdrawn
- 2011-09-02 KR KR1020137008454A patent/KR20140014065A/ko active Search and Examination
- 2011-09-02 CN CN201180053238.5A patent/CN103403875B/zh not_active Expired - Fee Related
- 2011-09-02 US US13/820,540 patent/US9583652B2/en active Active
- 2011-09-02 US US13/820,537 patent/US20130228220A1/en not_active Abandoned
- 2011-09-02 WO PCT/EP2011/065231 patent/WO2012028728A2/de active Application Filing
- 2011-09-02 EP EP11760429.8A patent/EP2612365A2/de not_active Withdrawn
- 2011-09-02 EP EP11754360.3A patent/EP2612362A2/de not_active Withdrawn
- 2011-09-02 WO PCT/EP2011/065222 patent/WO2012028723A2/de active Application Filing
- 2011-09-02 JP JP2013526493A patent/JP2013536992A/ja active Pending
- 2011-09-02 CN CN2011800531611A patent/CN103314448A/zh active Pending
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WO2009084933A2 (en) * | 2008-01-03 | 2009-07-09 | Lg Electronics Inc. | Solar cell, mehtod of manufacturing the same, and method of texturing solar cell |
US20090199898A1 (en) * | 2008-02-13 | 2009-08-13 | Younggu Do | Solar cell and method of texturing solar cell |
DE102009005168A1 (de) * | 2009-01-14 | 2010-07-22 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Solarzelle und Verfahren zur Herstellung einer Solarzelle aus einem Siliziumsubstrat |
CN101814547A (zh) * | 2009-02-19 | 2010-08-25 | 上海交大泰阳绿色能源有限公司 | 一种选择性发射极晶体硅太阳能电池的制备方法 |
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HOFMANN M ET AL: "Industrial Type CZ Silicon Solar Cells with Screen-Printed Fine Line Front Contacts and Passivated Rear Contacted by Laser Firing", THE COMPILED STATE-OF-THE-ART OF PV SOLAR TECHNOLOGY AND DEPLOYMENT : 23RD EUROPEAN PHOTOVOLTAIC SOLAR ENERGY CONFERENCE, EU PVSEC ; PROCEEDINGS OF THE INTERNATIONAL CONFERENCE, HELD IN VALENCIA, SPAIN, 1 - 5 SEPTEMBER 2008, WIP-RENEWABLE ENERGIES, D, 1 September 2008 (2008-09-01), pages 1704 - 1707, XP009157630, ISBN: 978-3-936338-24-9 * |
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Also Published As
Publication number | Publication date |
---|---|
US20130255772A1 (en) | 2013-10-03 |
US20130228220A1 (en) | 2013-09-05 |
DE102011050903A1 (de) | 2012-03-08 |
WO2012028723A2 (de) | 2012-03-08 |
EP2612362A2 (de) | 2013-07-10 |
CN103403875B (zh) | 2017-07-25 |
KR20140014065A (ko) | 2014-02-05 |
DE102011050903A8 (de) | 2012-05-16 |
CN103403875A (zh) | 2013-11-20 |
US9583652B2 (en) | 2017-02-28 |
CN103314448A (zh) | 2013-09-18 |
DE102011050136A1 (de) | 2012-03-08 |
WO2012028723A3 (de) | 2012-10-18 |
EP2612365A2 (de) | 2013-07-10 |
JP2013536992A (ja) | 2013-09-26 |
WO2012028728A2 (de) | 2012-03-08 |
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