WO2008028625A3 - Verfahren zur simultanen dotierung und oxidation von halbleitersubstraten und dessen verwendung - Google Patents
Verfahren zur simultanen dotierung und oxidation von halbleitersubstraten und dessen verwendung Download PDFInfo
- Publication number
- WO2008028625A3 WO2008028625A3 PCT/EP2007/007703 EP2007007703W WO2008028625A3 WO 2008028625 A3 WO2008028625 A3 WO 2008028625A3 EP 2007007703 W EP2007007703 W EP 2007007703W WO 2008028625 A3 WO2008028625 A3 WO 2008028625A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor substrates
- simultaneously doping
- oxidizing semiconductor
- oxidizing
- doping
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 2
- 230000001590 oxidative effect Effects 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
- H01L31/1864—Annealing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Photovoltaic Devices (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07802115A EP2064750A2 (de) | 2006-09-04 | 2007-09-04 | Verfahren zur simultanen dotierung und oxidation von halbleitersubstraten und dessen verwendung |
US12/439,964 US20100136768A1 (en) | 2006-09-04 | 2007-09-04 | Method for simultaneous doping and oxidizing semiconductor substrates and the use thereof |
JP2009525991A JP2010503190A (ja) | 2006-09-04 | 2007-09-04 | 半導体基板に対して同時にドーピングおよび酸化を実行する方法および当該方法の利用 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006041424.1 | 2006-09-04 | ||
DE102006041424A DE102006041424A1 (de) | 2006-09-04 | 2006-09-04 | Verfahren zur simultanen Dotierung und Oxidation von Halbleitersubstraten und dessen Verwendung |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2008028625A2 WO2008028625A2 (de) | 2008-03-13 |
WO2008028625A3 true WO2008028625A3 (de) | 2008-05-08 |
Family
ID=39078879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2007/007703 WO2008028625A2 (de) | 2006-09-04 | 2007-09-04 | Verfahren zur simultanen dotierung und oxidation von halbleitersubstraten und dessen verwendung |
Country Status (5)
Country | Link |
---|---|
US (1) | US20100136768A1 (de) |
EP (1) | EP2064750A2 (de) |
JP (1) | JP2010503190A (de) |
DE (1) | DE102006041424A1 (de) |
WO (1) | WO2008028625A2 (de) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008033169A1 (de) * | 2008-05-07 | 2009-11-12 | Ersol Solar Energy Ag | Verfahren zur Herstellung einer monokristallinen Solarzelle |
EP2302690A4 (de) * | 2008-06-26 | 2015-01-07 | Mitsubishi Electric Corp | Solarbatteriezelle und prozess zu ihrer herstellung |
DE102008030725B4 (de) * | 2008-07-01 | 2013-10-17 | Deutsche Cell Gmbh | Verfahren zur Herstellung einer Kontakt-Struktur mittels einer Galvanikmaske |
DE102008049281A1 (de) * | 2008-09-26 | 2010-04-08 | Centrotherm Photovoltaics Technology Gmbh | Diffusionseinrichtung für die Solarzellenfertigung und Verfahren zur Herstellung von Solarzellen |
EP2180531A1 (de) * | 2008-10-23 | 2010-04-28 | Applied Materials, Inc. | Halbleitervorrichtungsherstellungsverfahren, Halbleitervorrichtung und Halbleitervorrichtungsherstellungsanlage |
KR20110086833A (ko) * | 2008-10-23 | 2011-08-01 | 어플라이드 머티어리얼스, 인코포레이티드 | 반도체 소자 제조 방법, 반도체 소자 및 반도체 소자 제조 설비 |
US8124502B2 (en) * | 2008-10-23 | 2012-02-28 | Applied Materials, Inc. | Semiconductor device manufacturing method, semiconductor device and semiconductor device manufacturing installation |
DE102009005168A1 (de) * | 2009-01-14 | 2010-07-22 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Solarzelle und Verfahren zur Herstellung einer Solarzelle aus einem Siliziumsubstrat |
DE102009003393A1 (de) * | 2009-01-27 | 2010-07-29 | Schott Solar Ag | Verfahren zur Temperaturbehandlung von Halbleiterbauelementen |
EP2422373B1 (de) * | 2009-04-21 | 2024-06-05 | Tetrasun, Inc. | Herstellungsverfahren von hochleistungssolarzellenstrukturen |
CN104882513A (zh) * | 2009-04-22 | 2015-09-02 | 泰特拉桑有限公司 | 通过局部激光辅助转变太阳能电池中的功能膜得到的局部金属接触 |
US8450141B2 (en) * | 2009-06-17 | 2013-05-28 | University Of Delaware | Processes for fabricating all-back-contact heterojunction photovoltaic cells |
DE102010004498A1 (de) * | 2010-01-12 | 2011-07-14 | centrotherm photovoltaics AG, 89143 | Verfahren zur Ausbildung einer zweistufigen Dotierung in einem Halbleitersubstrat |
JP5778247B2 (ja) | 2010-03-26 | 2015-09-16 | テトラサン インコーポレイテッド | 高効率結晶太陽電池における遮蔽された電気接点およびパッシベーション化誘電体層を通じたドーピング、ならびにその構造および製造方法 |
CN102939662B (zh) * | 2010-05-20 | 2016-03-23 | 京瓷株式会社 | 太阳能电池元件及其制造方法、以及太阳能电池模块 |
KR101150686B1 (ko) | 2010-12-17 | 2012-05-25 | 현대중공업 주식회사 | 태양전지 및 그 제조방법 |
DE102011103538A1 (de) * | 2011-06-07 | 2012-12-13 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Dotierung von Halbleitersubstraten sowie dotiertes Halbleitersubstrat und Verwendung |
CN102751379A (zh) * | 2012-06-20 | 2012-10-24 | 常州天合光能有限公司 | 一种在n型硅衬底上快速形成p-n结的方法 |
US10014425B2 (en) | 2012-09-28 | 2018-07-03 | Sunpower Corporation | Spacer formation in a solar cell using oxygen ion implantation |
US9093598B2 (en) * | 2013-04-12 | 2015-07-28 | Btu International, Inc. | Method of in-line diffusion for solar cells |
US20140361407A1 (en) * | 2013-06-05 | 2014-12-11 | SCHMID Group | Silicon material substrate doping method, structure and applications |
JP6456279B2 (ja) * | 2015-01-29 | 2019-01-23 | 三菱電機株式会社 | 太陽電池の製造方法 |
FR3035741B1 (fr) * | 2015-04-28 | 2018-03-02 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de fabrication d'une cellule photovoltaique. |
US9673341B2 (en) | 2015-05-08 | 2017-06-06 | Tetrasun, Inc. | Photovoltaic devices with fine-line metallization and methods for manufacture |
CN107293604A (zh) * | 2017-07-27 | 2017-10-24 | 浙江晶科能源有限公司 | 一种p型面低反射率晶硅电池的制备方法 |
CN114566568A (zh) * | 2022-02-28 | 2022-05-31 | 安徽华晟新能源科技有限公司 | 半导体衬底层的处理方法和太阳能电池的制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4210472A (en) * | 1977-12-10 | 1980-07-01 | Itt Industries, Incorporated | Manufacturing process of semiconductor devices |
US5665175A (en) * | 1990-05-30 | 1997-09-09 | Safir; Yakov | Bifacial solar cell |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3690969A (en) * | 1971-05-03 | 1972-09-12 | Motorola Inc | Method of doping semiconductor substrates |
GB1536545A (en) * | 1975-03-26 | 1978-12-20 | Mullard Ltd | Semiconductor device manufacture |
US4295266A (en) * | 1980-06-30 | 1981-10-20 | Rca Corporation | Method of manufacturing bulk CMOS integrated circuits |
JP2989373B2 (ja) * | 1992-05-08 | 1999-12-13 | シャープ株式会社 | 光電変換装置の製造方法 |
US5591681A (en) * | 1994-06-03 | 1997-01-07 | Advanced Micro Devices, Inc. | Method for achieving a highly reliable oxide film |
US6180869B1 (en) * | 1997-05-06 | 2001-01-30 | Ebara Solar, Inc. | Method and apparatus for self-doping negative and positive electrodes for silicon solar cells and other devices |
US6274429B1 (en) * | 1997-10-29 | 2001-08-14 | Texas Instruments Incorporated | Use of Si-rich oxide film as a chemical potential barrier for controlled oxidation |
JPH11354516A (ja) * | 1998-06-08 | 1999-12-24 | Sony Corp | シリコン酸化膜形成装置及びシリコン酸化膜形成方法 |
US6221789B1 (en) * | 1998-07-29 | 2001-04-24 | Intel Corporation | Thin oxides of silicon |
US6784121B1 (en) * | 1998-10-23 | 2004-08-31 | Texas Instruments Incorporated | Integrated circuit dielectric and method |
US6204198B1 (en) * | 1998-11-24 | 2001-03-20 | Texas Instruments Incorporated | Rapid thermal annealing of doped polycrystalline silicon structures formed in a single-wafer cluster tool |
JP2002076400A (ja) * | 2000-08-30 | 2002-03-15 | Shin Etsu Handotai Co Ltd | 太陽電池セルおよび太陽電池セルの製造方法 |
CN100401532C (zh) * | 2001-11-26 | 2008-07-09 | 壳牌阳光有限公司 | 太阳能电池及其制造方法 |
JP2004221149A (ja) * | 2003-01-10 | 2004-08-05 | Hitachi Ltd | 太陽電池の製造方法 |
JP2005056875A (ja) * | 2003-08-01 | 2005-03-03 | Sharp Corp | 太陽電池およびその製造方法 |
JP4761706B2 (ja) * | 2003-12-25 | 2011-08-31 | 京セラ株式会社 | 光電変換装置の製造方法 |
JP4632672B2 (ja) * | 2004-02-04 | 2011-02-16 | シャープ株式会社 | 太陽電池の製造方法 |
-
2006
- 2006-09-04 DE DE102006041424A patent/DE102006041424A1/de not_active Withdrawn
-
2007
- 2007-09-04 WO PCT/EP2007/007703 patent/WO2008028625A2/de active Application Filing
- 2007-09-04 EP EP07802115A patent/EP2064750A2/de not_active Withdrawn
- 2007-09-04 JP JP2009525991A patent/JP2010503190A/ja active Pending
- 2007-09-04 US US12/439,964 patent/US20100136768A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4210472A (en) * | 1977-12-10 | 1980-07-01 | Itt Industries, Incorporated | Manufacturing process of semiconductor devices |
US5665175A (en) * | 1990-05-30 | 1997-09-09 | Safir; Yakov | Bifacial solar cell |
Non-Patent Citations (1)
Title |
---|
See also references of EP2064750A2 * |
Also Published As
Publication number | Publication date |
---|---|
EP2064750A2 (de) | 2009-06-03 |
WO2008028625A2 (de) | 2008-03-13 |
DE102006041424A1 (de) | 2008-03-20 |
JP2010503190A (ja) | 2010-01-28 |
US20100136768A1 (en) | 2010-06-03 |
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