WO2012005096A1 - Matrice de type à emboîtement - Google Patents

Matrice de type à emboîtement Download PDF

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Publication number
WO2012005096A1
WO2012005096A1 PCT/JP2011/063784 JP2011063784W WO2012005096A1 WO 2012005096 A1 WO2012005096 A1 WO 2012005096A1 JP 2011063784 W JP2011063784 W JP 2011063784W WO 2012005096 A1 WO2012005096 A1 WO 2012005096A1
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WO
WIPO (PCT)
Prior art keywords
mold
child
parent
die
recess
Prior art date
Application number
PCT/JP2011/063784
Other languages
English (en)
Japanese (ja)
Inventor
敏 岩渕
Original Assignee
Hoya株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya株式会社 filed Critical Hoya株式会社
Publication of WO2012005096A1 publication Critical patent/WO2012005096A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2673—Moulds with exchangeable mould parts, e.g. cassette moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2602—Mould construction elements
    • B29C45/2606—Guiding or centering means

Definitions

  • the present invention relates to a telescopic mold for molding a small molded product such as a lens used in a pickup device for an optical disk.
  • a small molded product such as a lens for a pickup device
  • a plurality of molded products are manufactured at a time using a single mold.
  • a mold for molding a plurality of molded products at a time there is a nested mold such as that described in Japanese Patent Application Publication JP06-335943A.
  • the nested mold is formed by incorporating a plurality of child molds for molding a molded product body into a parent mold provided with a path (runner) for supplying a resin material to each of the child molds.
  • the parent mold is provided with a recess capable of accommodating each of the child molds.
  • the child mold is accommodated in the recess, and the child mold is fixed to the parent mold with a bolt or the like. .
  • the nested mold is superior in cost. However, it is difficult for the nesting mold to ensure the positioning accuracy between the parent mold and the child mold.
  • the accuracy of the molded product depends on the positioning accuracy between the pair of molds.
  • a certain amount of play (clearance) is required between the parent mold and the child mold in order to assemble the parent mold into the child mold, the positioning of the child mold with respect to the parent mold is highly accurate. Can not do. For this reason, it has been difficult to manufacture a highly accurate molded product with the conventional nested mold.
  • an object of the present invention is to provide a telescopic mold capable of producing a highly accurate molded product.
  • the nested mold according to the present invention includes a master mold having a recess, a slave mold accommodated in the recess, and its own heat when the master mold and the slave mold are preheated.
  • the positioning means when the mold is preheated prior to the injection of the resin material into the mold, the positioning means is thermally expanded, and as a result, the child mold is in close contact with the parent mold. Positioning is performed. Therefore, in the present embodiment, the child mold can be positioned with high accuracy with respect to the parent mold, and a highly accurate molded product can be manufactured.
  • the positioning means is a member inserted into the recess of the parent mold together with the child mold, and when preheated, the positioning means comes into contact with the inner peripheral surface of the recess of the parent mold and the child mold. It is good also as a structure which urges
  • the linear expansion coefficient of the positioning means is m 1
  • the linear expansion coefficient of the parent mold is m 2
  • the positioning means is a child mold, and when the telescopic mold is preheated, the child mold expands and comes into contact with the inner peripheral surface of the recess of the parent mold, so that the child mold is in the recess. It is good also as a structure urged
  • the linear expansion coefficient of the child mold is m 11
  • the linear expansion coefficient of the parent mold is m 12
  • the size of the clearance is s
  • the dimension of the child mold in the direction in which the child mold presses the parent mold is x
  • the difference between the preheating temperature and the normal temperature of the nested mold is ⁇ T
  • the positioning means is formed from carbon tool steel, and the parent mold is formed from stainless steel.
  • a nested mold capable of manufacturing a highly accurate molded product is realized.
  • FIG. 1 is a top view of a lens molding die according to the first embodiment of the present invention.
  • FIG. 2 is a cross-sectional view taken along the line AA in FIG.
  • FIG. 3 is a top view of the vicinity of the child mold in the mold according to the second embodiment of the present invention.
  • FIG. 1 is a top view of a lens molding die according to the first embodiment of the present invention.
  • the mold 1 shown in FIG. 1 is for molding the first lens surface of the lens (surface located on the light source side in the pickup device).
  • Another mold for molding the second lens surface of the lens is combined with the mold 1.
  • the mold 1 of the present embodiment is a combination of a parent mold 10 and eight child molds 20.
  • the parent mold 10 is formed with runner grooves 11 extending radially in four directions from the central portion thereof.
  • eight concave portions 12 adjacent to the vicinity of the tip end portion of the runner groove 11 are formed in the parent die 10.
  • a mold recess 21 and a runner groove 23 that is connected to the runner groove 11 when the child mold 20 is accommodated in the recess 12 are formed on the surface of the child mold 20, a mold recess 21 and a runner groove 23 that is connected to the runner groove 11 when the child mold 20 is accommodated in the recess 12 are formed.
  • the runner groove 23 and the mold recess 21 are connected via a gate groove 22 that is narrower than the runner groove 23.
  • the child mold 20 has a shape in which both ends of the disc are cut by two surfaces parallel to the axis of the disc.
  • pin accommodating portions 12 a and 12 b for biasing the child mold 20 and positioning the child mold 20 with respect to the parent mold 10 are provided for each recess 12. ing.
  • FIG. 2 is a cross-sectional view taken along the line AA in FIG.
  • the child mold 20 is held by the parent mold 10 by screwing.
  • the child mold 20 is provided with two through holes 24, and female screws 13 are formed at positions corresponding to the through holes 24 of the parent mold 10.
  • the child mold 20 is held by the parent mold 10 by passing bolts 41 through the respective through holes 24 and then screwing each of the bolts 41 into the female screw 13.
  • the diameter of the through hole 24 is slightly larger than the diameter of the bolt 41, and the child mold 20 is substantially perpendicular to the axis of the bolt 41 even when the child mold 20 is held by the parent mold 10. It can move to some extent in the direction.
  • a cylindrical lens receiving mold 50 is disposed below the child mold 20.
  • the lens receiving mold 50 protrudes outward in the radial direction of the main body 50a from the main body 50a, a protruding portion 50b that protrudes upward (on the side of the child mold 20) from the upper end of the main body 50a, and the lower end of the main body 50a.
  • a flange portion 50c The lens receiving mold 50 is positioned by engaging the main body 50 a with the parent mold 10.
  • the tip of the protrusion 50b is a molding surface of the first lens surface, and the mold recess 21 is formed by engaging the protrusion 50b and the child mold 20.
  • the lens receiving mold 50 is positioned in the vertical direction by the flange portion 50c coming into contact with the parent mold 10, and at this time, the mold concave portion 21 is configured to have a predetermined depth.
  • the pins 31 and 32 are accommodated in the pin accommodating portions 12a and 12b, respectively.
  • the temperature of the mold 1 is preheated to a temperature equal to or higher than the softening temperature of the resin in order to ensure the fluidity of the resin. For this reason, the pin accommodating parts 12a and 12b are expanded by thermal expansion, and the diameters of the pins 31 and 32 are increased.
  • the child mold 20 and the pin 31 Under normal temperature when the child mold 20 is assembled to the parent mold 10, the child mold 20 and the pin 31 have play with respect to the recess 12.
  • the degree of play of the child mold 20 and the pin 31 at room temperature that is, the clearance between the child mold 20 and the pin 31 and the clearance between the child mold 20 and the parent mold 10
  • the directional component from the pin 31 to the child mold 20 is the total of the clearance between the parent mold 10 and the pin 31 is s 1 (FIG. 1).
  • the child mold 20 and the pin 32 have a play with respect to the recess 12 at room temperature.
  • the degree of play between the child mold 20 and the pin 32 at room temperature that is, the clearance between the child mold 20 and the pin 32 and the clearance between the child mold 20 and the parent mold 10
  • the directional component from the pin 32 to the child die 20 in the cumulative clearance between the parent die 10 and the pin 32 is s 2 (FIG. 1).
  • a clearance s 3 between the upper end face and lower end face of the Kokin die 20 of the main body portion 50a of the lens receiving mold 50 Is provided.
  • the tip portion of the protruding portion 50b as the lens receiving mold 50 is expanded in the vertical direction (molding surface of the first lens surface) High
  • the thickness (depth of the mold recess 21) is maintained constant.
  • the diameters d 1 and d 2 of the pins 31 and 32 and the clearance need to satisfy the following formula 3.
  • the coefficient m 1 is the linear expansion coefficient of the material forming the pins 31 and 32
  • the coefficient m 2 is the linear expansion coefficient of the material forming the parent mold 10.
  • ⁇ T in Equation 3 is the difference between the preheating temperature of the mold 1 and the normal temperature.
  • the linear expansion coefficient m 1 of the material forming the pins 31 and 32 is larger than the linear expansion coefficient m 2 of the material forming the parent mold 10.
  • the material forming the parent mold 10 and the child mold 20 is stainless steel
  • the material forming the pins 31 and 32 is carbon tool steel.
  • the linear expansion coefficient m 1 of the carbon tool steel used for the pins 31 and 32 is about 1.4 ⁇ 10 ⁇ 5 [1 / K]
  • the linear expansion of the stainless steel used for the parent mold 10 is It is larger than the coefficient m 2 (about 1.1 ⁇ 10 ⁇ 5 [1 / K]).
  • the diameters d 1 and d 2 and the clearance sizes s 1 and s 2 of the pins 31 and 32 are set so as to satisfy the above formula 3. Therefore, when the mold 1 is preheated, the pins 31 and 32 expand more than the pin accommodating portions 12 a and 12 b and come into contact with the child mold 20. As a result, the child mold 20 comes into contact with the inner peripheral surface of the recess 12 located on the side opposite to the pins 31 and 32, and the child mold 20 is positioned with respect to the parent mold 10.
  • the pin accommodating part 12b is provided in the position which the pin 32 can contact
  • the pins 31 and 32 are cylindrical pins.
  • the present invention is not limited to the above configuration, and a pin having another shape may be used instead of the cylindrical pin.
  • the cylindrical pin has an advantage that manufacturing by processing is easy.
  • the cylindrical pin expands evenly in the radial direction when thermally expanding, it is only necessary to attach the pin to the pin accommodating portions 12a and 12b without considering the mounting direction of the pin. This is preferable in that positioning with respect to the parent mold 10 is possible.
  • the pins 31 and 32 are configured such that a material having a larger linear expansion coefficient than that of the parent die 10 is used so that the child die 20 is positioned. It has become.
  • this embodiment is not limited to the above configuration.
  • the child mold 20 is positioned without using the pins 31 and 32.
  • FIG. 3 is a top view of the periphery of one child mold 120 of the mold 101 according to the second embodiment of the present invention. Similar to the first embodiment, the mold 101 of the present embodiment is also a combination of the parent mold 110 and eight child molds 120. In addition, a runner groove 111 extending radially in four directions from the center of the master mold 110 is formed, and eight recesses 112 are provided in the master mold 110 adjacent to the vicinity of the tip of the runner groove 111. This is also the same as in the first embodiment.
  • a runner groove 123 connected to the runner groove 111 when the child mold 120 is accommodated in the recess 112, and a mold recess 121, A gate groove 122 is formed.
  • the point that the child mold 120 is held on the parent mold 110 via the bolt 141 is also the same as in the first embodiment.
  • the child mold 120 has a shape in which both ends of the disk are cut by two surfaces parallel to the axis of the disk and parallel to each other.
  • the degree of play between the child mold 120 and the parent mold 110 that is, the clearance between the child mold 120 and the parent mold 110 is as follows. It has become a longitudinal direction s 11 in (in Figure 3 the vertical direction), s 12 in the lateral direction (in FIG. 3 the left-right direction) of the Kokin type 120.
  • the material forming the parent mold 110 is stainless steel, which is a material having a small linear expansion coefficient
  • the material forming the child mold is a carbon tool, which is a material having a large linear expansion coefficient. It is steel.
  • the linear expansion coefficient m 1 (about 1.4 ⁇ 10 ⁇ 5 [1 / K]) of the carbon tool steel used for the child mold 120 is the same as that of the stainless steel used for the parent mold 110. It is larger than the linear expansion coefficient m 2 (about 1.1 ⁇ 10 ⁇ 5 [1 / K]). Therefore, when the mold 101 is preheated, the child mold 120 expands more than the recess 112 of the parent mold 110 and comes into contact with the parent mold 110. Thereby, the positioning of the child mold 120 with respect to the parent mold 110 is performed.
  • the longitudinal dimension x and the transverse dimension y of the child mold 120 and the clearances s 11 and s 12 are set so as to satisfy the following formula 4, and the mold 101 is preheated. Sometimes, the child mold 120 is surely positioned with respect to the parent mold 110. Note that ⁇ T in Equation 4 is the difference between the preheating temperature of the mold 101 and the normal temperature.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

L'invention concerne une matrice de type à emboîtement comprenant une matrice externe ayant une portion concave, une matrice interne hébergée dans la portion concave, et un système de positionnement pour positionner la matrice interne par rapport à la matrice externe de manière à ce que la matrice interne presse la surface périphérique interne de la portion concave de la matrice externe quand la matrice externe et la matrice interne sont préchauffées par expansion thermique des matrices elles-mêmes. Le système de positionnement peut être un membre inséré dans la portion concave de la matrice externe avec la matrice interne de sorte à buter contre la surface périphérique interne de la portion concave de la matrice externe et la matrice interne au moment du préchauffage, et à incliner la matrice interne vers la surface périphérique interne de la portion concave de la matrice externe située sur le côté opposé au système de positionnement. En variante, le système de positionnement peut être la matrice interne, et quand la matrice de type à emboîtement est préchauffée, la matrice interne est expansée pour buter contre la surface périphérique interne de la portion concave de la matrice externe, et de telle sorte que la matrice interne soit inclinée vers la surface périphérique interne de la portion concave.
PCT/JP2011/063784 2010-07-07 2011-06-16 Matrice de type à emboîtement WO2012005096A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010154703A JP2013188863A (ja) 2010-07-07 2010-07-07 入れ子式金型
JP2010-154703 2010-07-07

Publications (1)

Publication Number Publication Date
WO2012005096A1 true WO2012005096A1 (fr) 2012-01-12

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PCT/JP2011/063784 WO2012005096A1 (fr) 2010-07-07 2011-06-16 Matrice de type à emboîtement

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JP (1) JP2013188863A (fr)
WO (1) WO2012005096A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111633880A (zh) * 2019-03-01 2020-09-08 波音公司 模具组件

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009248542A (ja) * 2008-04-10 2009-10-29 Ricoh Opt Ind Co Ltd 射出成形金型・鏡面駒および射出成形方法。
JP2010042653A (ja) * 2008-08-11 2010-02-25 Samsung Electro-Mechanics Co Ltd コア金型
JP2010126378A (ja) * 2008-11-26 2010-06-10 Panasonic Corp 光学素子成形用金型
JP2010234637A (ja) * 2009-03-31 2010-10-21 Konica Minolta Opto Inc 成形装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009248542A (ja) * 2008-04-10 2009-10-29 Ricoh Opt Ind Co Ltd 射出成形金型・鏡面駒および射出成形方法。
JP2010042653A (ja) * 2008-08-11 2010-02-25 Samsung Electro-Mechanics Co Ltd コア金型
JP2010126378A (ja) * 2008-11-26 2010-06-10 Panasonic Corp 光学素子成形用金型
JP2010234637A (ja) * 2009-03-31 2010-10-21 Konica Minolta Opto Inc 成形装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111633880A (zh) * 2019-03-01 2020-09-08 波音公司 模具组件

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JP2013188863A (ja) 2013-09-26

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