WO2011129132A1 - 放射線検出器モジュール - Google Patents
放射線検出器モジュール Download PDFInfo
- Publication number
- WO2011129132A1 WO2011129132A1 PCT/JP2011/051605 JP2011051605W WO2011129132A1 WO 2011129132 A1 WO2011129132 A1 WO 2011129132A1 JP 2011051605 W JP2011051605 W JP 2011051605W WO 2011129132 A1 WO2011129132 A1 WO 2011129132A1
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- Prior art keywords
- regions
- photoelectric conversion
- radiation
- radiation shielding
- dielectric layers
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Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
- G01T1/2018—Scintillation-photodiode combinations
- G01T1/20183—Arrangements for preventing or correcting crosstalk, e.g. optical or electrical arrangements for correcting crosstalk
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
- G01T1/2018—Scintillation-photodiode combinations
- G01T1/20188—Auxiliary details, e.g. casings or cooling
- G01T1/2019—Shielding against direct hits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14658—X-ray, gamma-ray or corpuscular radiation imagers
- H01L27/14661—X-ray, gamma-ray or corpuscular radiation imagers of the hybrid type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14658—X-ray, gamma-ray or corpuscular radiation imagers
- H01L27/14663—Indirect radiation imagers, e.g. using luminescent members
Definitions
- This invention relates to a radiation detector module.
- Patent Document 1 describes an X-ray CT apparatus having a configuration for protecting a signal processing circuit provided in an X-ray detector from exposure by X-rays.
- a circuit board on which a signal processing circuit is mounted is disposed on the back side of a wiring board on which a detection element is mounted on the front surface.
- An X-ray shielding part is installed on the wiring board so as to cover the upper part of the signal processing circuit.
- the wiring board and the circuit board are electrically connected to each other by a connection member provided around the X-ray shielding part.
- Patent Document 2 describes a medical diagnostic imaging apparatus and an X-ray radiation detector using X-rays.
- This X-ray radiation detector comprises a carrier substrate.
- the carrier substrate supports the photosensitive element on the front surface side and provides an electrical path to the back surface side.
- An X-ray radiation shield is disposed between the carrier substrate and the signal processing circuit. The area of the X-ray radiation shielding portion viewed from the X-ray incident direction is larger than the signal processing circuit included in the ASIC readout chip.
- a photoelectric conversion device such as a photodiode array having a plurality of photoelectric conversion regions arranged two-dimensionally, and a scintillator disposed on the photoelectric conversion device;
- Such radiation detectors are more convenient than those using conventional X-ray photosensitive films, and are highly convenient, such as being able to check images in real time, and are easy to store and handle data. Also excellent in ease.
- the photoelectric conversion device is mounted on a substrate. Then, since it is necessary to amplify a minute signal output from the photoelectric conversion device, an integrated circuit device including a plurality of readout circuits such as a plurality of integration circuits corresponding to a plurality of photoelectric conversion regions is used. Note that the plurality of readout circuits are configured by, for example, an integration circuit.
- This integrated circuit device is preferably mounted on the back side of the substrate in order to reduce the size of the apparatus.
- the following problem occurs. That is, when a part of the radiation incident on the scintillator is transmitted without being absorbed by the scintillator, the radiation may pass through the substrate and reach the integrated circuit device.
- the readout circuit of an integrated circuit device includes circuit elements that are susceptible to radiation, such as an operational amplifier, a capacitor, or a MOS transistor for switching. Therefore, radiation that reaches the integrated circuit device may cause abnormalities in these circuit elements. Therefore, it is desirable to protect the readout circuit from radiation by some measure.
- a radiation shielding material having a size that covers the entire integrated circuit device is provided in the substrate.
- a wiring for connecting the photoelectric conversion device and the integrated circuit device must be arranged so as to bypass the radiation shielding material. Therefore, for example, when a photoelectric conversion device or an integrated circuit device is flip-chip mounted on a substrate, wiring of the substrate becomes complicated.
- An object of the present invention is to provide a radiation detector module capable of protecting a readout circuit of an integrated circuit device from radiation with a simple configuration.
- the radiation detector module includes (a1) a scintillator that converts radiation incident from a predetermined direction into light, and (b) a plurality of photoelectric conversion regions arranged in a two-dimensional manner.
- a photoelectric conversion device that receives light from the scintillator in a photoelectric conversion region; (c) a connection substrate that is formed by laminating a plurality of dielectric layers; and a photoelectric conversion device mounted on one plate surface; and (d) a connection substrate.
- an integrated circuit device that individually reads electrical signals output from each of the plurality of photoelectric conversion regions of the photoelectric conversion device.
- the integrated circuit device has a plurality of unit circuit regions.
- the plurality of unit circuit regions are two-dimensionally arranged and are separated from each other.
- the plurality of unit circuit regions include a plurality of readout circuits corresponding to the plurality of photoelectric conversion regions, respectively.
- the connection board has a plurality of metal through conductors.
- the plurality of through conductors are provided through at least three dielectric layers adjacent to each other among the plurality of dielectric layers.
- the plurality of through conductors become part of the path of the electrical signal.
- a plurality of metal radiation shielding films are provided in two or more interlayer portions in at least three dielectric layers.
- the plurality of radiation shielding films are integrally formed with each of the plurality of through conductors and are separated from each other.
- Each of the plurality of first regions obtained by projecting the plurality of radiation shielding films onto a virtual plane perpendicular to the predetermined direction includes each of a plurality of second regions obtained by projecting the plurality of unit circuit regions onto the virtual plane.
- a radiation detector module includes (a2) a scintillator that converts radiation into light, and (b) a plurality of photoelectric conversion regions arranged in a two-dimensional manner.
- a photoelectric conversion device that receives the light in the photoelectric conversion region, (c) a connection substrate on which a plurality of dielectric layers are stacked, and the photoelectric conversion device is mounted on one plate surface, and (d) the other of the connection substrates
- an integrated circuit device that individually reads out electrical signals output from each of the plurality of photoelectric conversion regions of the photoelectric conversion device.
- the integrated circuit device has a plurality of unit circuit regions. The plurality of unit circuit regions are two-dimensionally arranged and are separated from each other.
- the plurality of unit circuit regions include a plurality of readout circuits corresponding to the plurality of photoelectric conversion regions, respectively.
- the connection board has a plurality of metal through conductors.
- the plurality of through conductors are provided through at least three dielectric layers adjacent to each other among the plurality of dielectric layers.
- the plurality of through conductors become part of the path of the electrical signal.
- a plurality of metal radiation shielding films are provided in two or more interlayer portions in at least three dielectric layers.
- the plurality of radiation shielding films are integrally formed with each of the plurality of through conductors and are separated from each other.
- Each of the plurality of first regions obtained by projecting the plurality of radiation shielding films onto a virtual plane parallel to one plate surface includes each of a plurality of second regions obtained by projecting the plurality of unit circuit regions onto the virtual plane.
- the integrated circuit device mounted on the other plate surface of the connection substrate has a plurality of unit circuit regions each including a plurality of readout circuits.
- the plurality of unit circuit areas are two-dimensionally arranged and separated from each other. Therefore, regarding the gaps in these unit circuit areas, the influence of radiation is minimal because there is no readout circuit.
- connection substrate is provided with a plurality of through conductors penetrating at least three dielectric layers and a plurality of metal radiation shielding films formed integrally with each of the plurality of through conductors.
- the radiation shielding film formed integrally with the through conductor does not hinder the arrangement of the through conductor, for example, a complicated wiring that bypasses the radiation shielding material as in the device described in Patent Document 1 is provided. There is no need to form. Therefore, the current path between the photoelectric conversion device and the integrated circuit device, that is, the wiring length can be shortened, and noise superimposed on the photocurrent can be further reduced.
- each of the plurality of radiation shielding films are separated from each other and are provided in two or more interlayer portions of at least three dielectric layers. Further, each of the plurality of first regions obtained by projecting the plurality of radiation shielding films on the virtual plane includes each of a plurality of second regions obtained by projecting the plurality of unit circuit regions on the virtual plane.
- the virtual plane is a plane perpendicular to a predetermined direction, that is, a radiation incident direction. Alternatively, when the radiation incident direction is perpendicular to the plate surface of the connection substrate, the virtual plane is a surface parallel to one plate surface of the connection substrate. With such a configuration, each of the plurality of radiation shielding films formed inside the connection substrate protects each corresponding unit circuit region from radiation. Further, although radiation that has passed through the gaps between the plurality of radiation shielding films can reach the integrated circuit device, there is no problem because the reaching location is a gap between the plurality of unit circuit regions.
- the readout circuit of the integrated circuit device can be protected from radiation with a simple configuration.
- each of the plurality of third regions obtained by projecting the plurality of through conductors onto the virtual plane is included in each of the plurality of second regions, and each radiation shielding film corresponds to the corresponding through-hole. It may extend around the conductor.
- the readout circuit may include an operational amplifier, a capacitor, and a MOS transistor.
- the readout circuit of the integrated circuit device can be protected from radiation with a simple configuration.
- FIG. 1 is a cross-sectional view showing an embodiment of a radiation detector module.
- FIG. 2 is a cross-sectional view showing the internal configuration of the connection substrate and the integrated circuit device.
- FIG. 3 shows the arrangement of each component of the integrated circuit as seen from the incident direction of radiation.
- FIG. 4 is an equivalent circuit diagram illustrating a configuration example of the readout circuit.
- FIG. 5 is a diagram illustrating a state in which the radiation shielding film and the unit circuit region are projected on a virtual plane.
- FIG. 6 is a cross-sectional view showing a modification of the radiation detector module.
- FIG. 7 is a diagram illustrating a state in which the radiation shielding film and the unit circuit area in one modified example are projected onto a virtual plane.
- FIG. 1 is a cross-sectional view showing a configuration of an embodiment of a radiation detector module.
- the radiation detector module 10 ⁇ / b> A shown in FIG. 1 includes a scintillator 11, a photodiode array 12, a connection substrate 13, and an integrated circuit device 14.
- the scintillator 11 is a plate-like member for converting the radiation R incident from a predetermined direction into light.
- the radiation R is, for example, X-rays.
- the scintillator 11 is divided into a plurality of pixels arranged in M rows and N columns, and is disposed on the light incident surface of the two-dimensional photodiode array 12. N and M are both integers of 2 or more.
- the scintillator 11 generates scintillation light according to the incident radiation R, converts the radiation image into an optical image, and outputs the optical image to the two-dimensional photodiode array 12.
- the scintillator 11 is made of CsI, for example.
- the scintillator 11 can be installed so as to cover the two-dimensional photodiode array 12, or can be provided on the two-dimensional photodiode array 12 by vapor deposition.
- the two-dimensional photodiode array 12 is a photoelectric conversion device in the present embodiment.
- the two-dimensional photodiode array 12 has a plurality of photodiodes as a plurality of photoelectric conversion regions arranged two-dimensionally such as M rows and N columns, and receives light from the scintillator 11 by the plurality of photodiodes.
- the two-dimensional photodiode array 12 has a plurality of bump electrodes 12a, which are conductive bonding materials for so-called flip-chip mounting, on the back surface opposite to the light incident surface.
- the two-dimensional photodiode array 12 is arranged in a two-dimensional shape such as M rows and N columns on the back surface.
- the planar dimension of the two-dimensional photodiode array 12 is, for example, 20 mm ⁇ 35 mm.
- the connection substrate 13 has the two-dimensional photodiode array 12 mounted on one plate surface 13a, and an integrated circuit device 14 described later is mounted on the other plate surface 13b.
- the connection substrate 13 is formed by laminating a plurality of dielectric layers, and has internal wiring for electrically connecting the two-dimensional photodiode array 12 and the integrated circuit device 14.
- a plurality of land-like wirings for mounting the two-dimensional photodiode array 12 are arranged in a two-dimensional form such as M rows and N columns on one plate surface 13a of the connection substrate 13, and the other plate surface 13b.
- a plurality of land-like wirings for mounting the integrated circuit device 14 are two-dimensionally arranged.
- the integrated circuit device 14 reads out these electrical signals by individually detecting electrical signals such as photocurrents output from the plurality of photodiodes of the two-dimensional photodiode array 12.
- the integrated circuit device 14 has a structure in which a plurality of readout circuits corresponding to a plurality of photodiodes of the two-dimensional photodiode array 12 are collectively enclosed in one chip.
- a plurality of bump electrodes 14 a as conductive bonding materials serving as input terminals to the plurality of readout circuits are two-dimensionally arranged on the surface of the integrated circuit device 14 facing the connection substrate 13.
- the radiation detector module 10A further includes a flexible printed circuit board 15 for outputting the electrical signal output from the integrated circuit device 14 to the outside.
- One end of the flexible printed circuit board 15 is electrically connected to the other plate surface 13 b of the connection board 13.
- the radiation detector module 10 ⁇ / b> A further includes a heat sink 16 for cooling the integrated circuit device 14.
- the heat sink 16 is in contact with the surface opposite to the surface facing the connection substrate 13 of the integrated circuit device 14, and has a shape in which a large number of fins protrude outward.
- FIG. 2 is a cross-sectional view showing the internal configuration of the connection substrate 13 and the integrated circuit device 14. Although the two-dimensional photodiode array 12 is shown in the figure, the scintillator 11 and the heat sink 16 are not shown.
- the integrated circuit device 14 has a plurality of unit circuit regions 14b and a plurality of circuit regions 14c.
- the plurality of unit circuit regions 14b include a plurality of pre-stage amplifiers as a plurality of readout circuits, respectively.
- the plurality of readout circuits respectively correspond to the plurality of photodiodes of the two-dimensional photodiode array 12 and receive electrical signals such as photocurrents from the corresponding photodiodes.
- a post-stage amplifier is provided as an amplifier circuit for further amplifying the signal output from the readout circuit of the unit circuit region 14b.
- FIG. 3A is a diagram illustrating a configuration example of the integrated circuit device 14.
- FIG. 3A shows the arrangement of each component of the integrated circuit device 14 as viewed from the incident direction of the radiation R.
- FIG. 3B is an enlarged view of one unit circuit region 14b included in the integrated circuit device 14.
- the integrated circuit device 14 has a size of 9 mm ⁇ 11 mm, for example.
- the unit circuit regions 14b are arranged two-dimensionally in J rows and K columns inside the integrated circuit device 14. J and K are integers of 2 or more.
- Each unit circuit region 14b is provided with an input pad 14e as shown in FIG.
- a bump electrode 14a shown in FIG. 1 is provided on the input pad 14e.
- These unit circuit regions 14b are spaced apart from each other, and a region in which no circuit element such as a transistor or a capacitor exists between the one unit circuit region 14b and the other unit circuit region 14b. Extending in the direction. However, metal wiring for connecting circuit elements to each other may exist in this region.
- the size of one unit circuit region 14b is, for example, 0.5 mm in the row direction and 0.5 mm in the column direction, and the gap between adjacent unit circuit regions 14b is, for example, 0.16 mm.
- the K circuit areas 14c are arranged corresponding to the respective columns of the unit circuit area 14b. These circuit regions 14c are arranged side by side in the row direction, and each input end is electrically connected to the unit circuit region 14b of the corresponding column.
- Switches are individually provided in the pre-stage amplifier as the readout circuit included in the unit circuit area 14b and the post-stage amplifier as the amplifier circuit included in the circuit area 14c.
- a row to be read can be specified by using the switch of the reading circuit in the unit circuit region 14b, and a column to be read can be specified by using the switch of the amplifier circuit in the circuit region 14c.
- the output ends of the K circuit areas 14c are electrically connected to the A / D converter 14d.
- the A / D converter 14d converts the analog signal output from each circuit area 14c into a digital signal.
- the digital signal output from the A / D converter 14 d is output to the outside of the integrated circuit device 14 through one of a plurality of input / output pads 14 f arranged along the edge of the integrated circuit device 14.
- the other input / output pad 14f is used for power supply voltage input, reference potential input such as ground potential, clock input, and the like.
- FIG. 4 is an equivalent circuit showing a configuration example of the readout circuit included in each unit circuit region 14b.
- the readout circuit 140 is configured by an integration circuit, and includes an operational amplifier 141, a capacitor 142 as a feedback capacitor, and a reset switch 143.
- the non-inverting input terminal of the operational amplifier 141 is connected to the reference voltage Vref, and the inverting input terminal of the operational amplifier 141 is connected to the anode of one photodiode 12b included in the two-dimensional photodiode array 12 shown in FIG. Yes.
- the cathode of the photodiode 12b is connected to the reference voltage Vref, and a reverse bias is applied to the photodiode 12b.
- the capacitor 142 is connected between the inverting input terminal and the output terminal of the operational amplifier 141.
- the capacitor 142 accumulates charges due to the photocurrent output from the photodiode 12b.
- the reset switch 143 is connected in parallel to the capacitor 142 and resets the electric charge accumulated in the capacitor 142.
- the reset switch 143 is preferably realized by a MOS transistor, for example.
- connection substrate 13 of this embodiment includes a base material 130 formed by laminating a plurality of dielectric layers 130a to 130f.
- FIG. 2 shows six dielectric layers 130a to 130f.
- the dielectric layers 130a to 130f of the base material 130 are made of a ceramic substrate whose main material is a ceramic material such as alumina, for example.
- the thickness of each dielectric layer 130a to 130f is, for example, not less than 100 ⁇ m and not more than 200 ⁇ m.
- connection board 13 has a plurality of through conductors 20.
- the through conductor 20 is provided so as to penetrate through at least three dielectric layers 130c to 130f adjacent to each other among the dielectric layers 130a to 130f.
- the through conductor 20 is provided through the four dielectric layers 130c to 130f.
- Each of the plurality of through conductors 20 has a one-to-one correspondence with each of the plurality of photodiodes of the two-dimensional photodiode array 12, and becomes a part of the path of the photocurrent output from the photodiode.
- the through conductor 20 is made of a metal material such as tungsten, for example, and is formed by embedding a metal material in the through holes formed in the dielectric layers 130c to 130f.
- the pitch between adjacent through conductors 20 is equal to the pitch between the unit circuit regions 14b of the integrated circuit device 14, and each through conductor 20 is positioned immediately above the corresponding unit circuit region 14b. is doing.
- the pitch between adjacent through conductors 20 is, for example, 500 ⁇ m.
- the diameter of the through conductor 20 is 100 ⁇ m, for example.
- connection substrate 13 includes a plurality of radiation shielding film groups 21 to 23 provided in two or more interlayer portions in at least three dielectric layers 130c to 130f.
- the plurality of radiation shielding film groups 21 to 23 are provided in three interlayer portions of the four dielectric layers 130c to 130f.
- the radiation shielding film group 21 is provided in an interlayer portion between the dielectric layers 130c and 130d
- the radiation shielding film group 22 is provided in an interlayer portion between the dielectric layers 130d and 130e.
- the group 23 is provided between the dielectric layers 130e and 130f.
- Each of the radiation shielding film groups 21 to 23 includes a plurality of metal radiation shielding films corresponding to the number of the through conductors 20. That is, the radiation shielding film group 21 includes the same number of radiation shielding films 21 a as the through conductors 20, the radiation shielding film group 22 includes the same number of radiation shielding films 22 a as the through conductors 20, and the radiation shielding film group 23 includes the through conductors 20. The same number of radiation shielding films 23a is included. These radiation shielding films 21 a to 23 a are formed integrally with the corresponding through conductor 20, and extend around the through conductor 20.
- the radiation shielding films are separated from each other.
- the plurality of radiation shielding films 21a are provided at intervals in one interlayer portion
- the plurality of radiation shielding films 22a are provided at intervals in another interlayer portion, so that the plurality of radiation shielding films are provided.
- the film 23a is provided at a distance from the other interlayer portion. Thereby, electrical isolation between the through conductors 20 is achieved.
- the planar shape of the radiation shielding film 21a is, for example, a 400 ⁇ m square. Moreover, the space
- the radiation shielding films 21a to 23a can be easily formed by a method similar to the method of forming so-called via lands in the interlayer portions of the dielectric layers 130c to 130f.
- the connection substrate 13 further includes a plurality of interlayer wirings 24.
- the interlayer wiring 24 is a wiring resulting from the difference between the electrode pitch of the two-dimensional photodiode array 12 and the pitch of the plurality of through conductors 20.
- the interlayer wiring 24 is one or two of the interlayer portions of the plurality of dielectric layers 130a to 130f located on the one plate surface 13a side with respect to the dielectric layers 130c to 130f provided with the radiation shielding films 21a to 23a. It is provided in the above interlayer part. In FIG. 2, the interlayer wiring 24 is provided in an interlayer portion between the dielectric layer 130a and the dielectric layer 130b and an interlayer portion between the dielectric layer 130b and the dielectric layer 130c.
- the virtual plane is defined as a plane perpendicular to a predetermined direction that is the incident direction of the radiation R shown in FIG.
- the virtual plane may be defined as a surface parallel to the plate surface 13a or 13b.
- FIG. 5 is a diagram illustrating a state in which the plurality of radiation shielding films 21a to 23a of the connection substrate 13 and the plurality of unit circuit regions 14b of the integrated circuit device 14 are projected onto the virtual plane VP.
- PR1 indicates a first region obtained by projecting a plurality of radiation shielding films 21a, 22a and 23a onto the virtual plane VP.
- PR2 represents a second region obtained by projecting the plurality of unit circuit regions 14b onto the virtual plane VP.
- PR3 indicates a third region obtained by projecting the plurality of through conductors 20 onto the virtual plane VP.
- each of the plurality of first regions PR1 obtained by projecting the plurality of radiation shielding films 21a to 23a onto the virtual plane VP projects the plurality of unit circuit regions 14b onto the virtual plane VP.
- Each of the obtained second regions PR2 is included.
- the plurality of unit circuit regions 14b are completely covered by the plurality of radiation shielding films 21a.
- each of the plurality of radiation shielding films 21a to 23a formed inside the connection substrate 13 protects the corresponding unit circuit region 14b from radiation.
- the radiation R that has passed through the gaps between the plurality of radiation shielding films 21a to 23a can reach the integrated circuit device 14.
- the unit circuit region 14b does not exist at the reaching position, and the influence of the radiation R is slight. Become.
- each of the plurality of radiation shielding films 21 a is formed integrally with the corresponding through conductor 20.
- the radiation shielding films 21a to 23a formed integrally with the through conductor 20 do not hinder the arrangement of the through conductor 20, for example, as in the apparatus described in Patent Document 1, the radiation shielding material is bypassed. There is no need to form complicated wiring. Therefore, the current path and the wiring length between the two-dimensional photodiode array 12 and the integrated circuit device 14 can be shortened, and noise superimposed on an electric signal such as a photocurrent can be further reduced.
- the readout circuit of the integrated circuit device 14 can be protected from radiation with a simple configuration.
- the radiation detector module 10A since the plurality of unit circuit regions 14b of the integrated circuit device 14 are separated from each other, noise caused by electrical crosstalk between the plurality of unit circuit regions 14b can be reduced.
- the radiation shielding film 21b, 21c or 21a formed integrally with the conductor 20 may not overlap the first region PR1.
- the plurality of first regions PR1 do not overlap each other, and the projection regions related to the radiation shielding films 21a to 23a are all the first region PR1 and coincide with each other. 21a, 22a and 23a do not overlap each other as long as the corresponding through conductors 20 are different.
- the radiation shielding films 21a to 23a formed integrally with one through conductor 20 and the radiation shielding films 21a to 23a formed integrally with the other through conductor 20 do not face each other.
- the parasitic capacitance generated during the period 20 can be reduced. Therefore, noise superimposed on an electrical signal such as photocurrent output from a plurality of photodiodes of the two-dimensional photodiode array 12 can be reduced.
- each of the plurality of third regions PR3 obtained by projecting the plurality of through conductors 20 onto the virtual plane VP is included in each of the plurality of second regions PR2.
- each of the radiation shielding films 21a to 23a since the radiation shielding films 21a to 23a extend around the corresponding through conductors 20, each of the radiation shielding films 21a to 23a preferably uses the corresponding unit circuit region 14b from radiation. Can be protected.
- FIG. 6 is a diagram showing a configuration of a radiation detector module 10B as a modification of the above-described embodiment.
- the two-dimensional photodiode array 12, the connection substrate 13, and the integrated circuit device 14 are shown as in FIG. Among these, the configurations of the two-dimensional photodiode array 12 and the integrated circuit device 14 are the same as those in the above-described embodiment.
- the internal configuration of the connection board 13 is different from that in the above embodiment. That is, the radiation shielding film groups 21 and 22 of the connection substrate 13 include radiation shielding films 21b and 22b instead of the radiation shielding films 21a and 22a of the above embodiment. The positions and sizes of these radiation shielding films 21b and 22b are different from the positions and sizes of the radiation shielding films 21a and 22a of the above embodiment.
- FIG. 7 is a diagram showing a state in which the plurality of radiation shielding films 21b and 22b and the plurality of unit circuit regions 14b of the integrated circuit device 14 in the present modification are projected onto the virtual plane VP.
- PR4 indicates a region obtained by projecting the radiation shielding film 21b onto the virtual plane VP.
- PR5 indicates a region obtained by projecting the radiation shielding film 22b onto the virtual plane VP. Note that PR2 and PR3 are the same as in the above embodiment.
- the region PR5 for the radiation shielding film 22b formed integrally with each other overlaps.
- the radiation shielding film 21b formed integrally with one through conductor 20 and the radiation shielding film 22b formed integrally with another through conductor 20 face each other. It will be.
- each of the plurality of radiation shielding films 21b, 22b, and 23a protects the corresponding unit circuit region 14b from radiation.
- the radiation shielding films 21b, 22b and 23a formed integrally with the through conductor 20 do not disturb the arrangement of the through conductor 20, it is not necessary to form a complicated wiring that bypasses the radiation shielding material. Therefore, also in the radiation detector module 10B of this modification, the readout circuit of the integrated circuit device 14 can be protected from radiation with a simple configuration.
- the radiation detector module according to the present invention is not limited to the embodiment described above, and various other modifications are possible.
- the radiation shielding films 21a to 23a are provided in the three interlayer portions of the four dielectric layers 130c to 130f, but the radiation shielding film is formed of two or more interlayers in the at least three dielectric layers.
- the same effect as the above embodiment can be obtained.
- an integration circuit including an operational amplifier, a capacitor, and a MOS transistor is illustrated as an example of the readout circuit.
- the same effect as in the above embodiment is obtained. It can be suitably obtained.
- the present invention can be used as a radiation detector module capable of protecting a readout circuit of an integrated circuit device from radiation with a simple configuration.
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Abstract
Description
Claims (5)
- 所定方向から入射する放射線を光に変換するシンチレータと、
二次元状に配列された複数の光電変換領域を有し、前記シンチレータからの光を前記光電変換領域に受ける光電変換デバイスと、
複数の誘電体層が積層されて成り、前記光電変換デバイスを一方の板面上に搭載する接続基板と、
前記接続基板の他方の板面上に搭載され、前記光電変換デバイスの前記複数の光電変換領域それぞれから出力される電気信号を個別に読み出す集積回路デバイスと
を備え、
前記集積回路デバイスは、二次元状に配列され且つ互いに離間された複数の単位回路領域を有し、該複数の単位回路領域は、前記複数の光電変換領域に対応する複数の読出回路をそれぞれ含み、
前記接続基板は、前記複数の誘電体層のうち、互いに隣接する少なくとも三つの前記誘電体層を貫通して設けられ、前記電気信号の経路の一部となる金属製の複数の貫通導体を有し、
前記複数の貫通導体それぞれと一体に形成されると共に互いに離間された金属製の複数の放射線遮蔽膜が、前記少なくとも三つの誘電体層における二以上の層間部分に設けられており、
前記複数の放射線遮蔽膜を前記所定方向に垂直な仮想平面に投影した複数の第一領域それぞれは、前記複数の単位回路領域を前記仮想平面に投影した複数の第二領域それぞれを含む、放射線検出器モジュール。 - 放射線を光に変換するシンチレータと、
二次元状に配列された複数の光電変換領域を有し、前記シンチレータからの光を前記光電変換領域に受ける光電変換デバイスと、
複数の誘電体層が積層されて成り、前記光電変換デバイスを一方の板面上に搭載する接続基板と、
前記接続基板の他方の板面上に搭載され、前記光電変換デバイスの前記複数の光電変換領域それぞれから出力される電気信号を個別に読み出す集積回路デバイスと
を備え、
前記集積回路デバイスは、二次元状に配列され且つ互いに離間された複数の単位回路領域を有し、該複数の単位回路領域は、前記複数の光電変換領域に対応する複数の読出回路をそれぞれ含み、
前記接続基板は、前記複数の誘電体層のうち、互いに隣接する少なくとも三つの前記誘電体層を貫通して設けられ、前記電気信号の経路の一部となる金属製の複数の貫通導体を有し、
前記複数の貫通導体それぞれと一体に形成されると共に互いに離間された金属製の複数の放射線遮蔽膜が、前記少なくとも三つの誘電体層における二以上の層間部分に設けられており、
前記複数の放射線遮蔽膜を前記一方の板面に平行な仮想平面に投影した複数の第一領域それぞれは、前記複数の単位回路領域を前記仮想平面に投影した複数の第二領域それぞれを含む、放射線検出器モジュール。 - 一の前記層間部分において一の前記貫通導体と一体に形成された前記放射線遮蔽膜についての前記第一領域と、他の前記層間部分において他の前記貫通導体と一体に形成された前記放射線遮蔽膜についての前記第一領域とが互いに重ならない、請求項1または2に記載の放射線検出器モジュール。
- 前記複数の貫通導体を前記仮想平面に投影した複数の第三領域それぞれが、前記複数の第二領域それぞれに含まれており、
各放射線遮蔽膜が、対応する各貫通導体の周囲に延在している、請求項1または2に記載の放射線検出器モジュール。 - 前記読出回路が、オペアンプ、コンデンサ、及びMOSトランジスタを含む、請求項1または2に記載の放射線検出器モジュール。
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