WO2011114885A1 - 電子材料の洗浄方法および洗浄システム - Google Patents
電子材料の洗浄方法および洗浄システム Download PDFInfo
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- WO2011114885A1 WO2011114885A1 PCT/JP2011/054739 JP2011054739W WO2011114885A1 WO 2011114885 A1 WO2011114885 A1 WO 2011114885A1 JP 2011054739 W JP2011054739 W JP 2011054739W WO 2011114885 A1 WO2011114885 A1 WO 2011114885A1
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- Prior art keywords
- cleaning
- electronic material
- functional chemical
- sulfuric acid
- chemical solution
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- 238000004140 cleaning Methods 0.000 title claims abstract description 170
- 239000012776 electronic material Substances 0.000 title claims abstract description 60
- 238000000034 method Methods 0.000 title claims description 63
- 239000000126 substance Substances 0.000 claims abstract description 115
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 97
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 30
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 23
- 238000006243 chemical reaction Methods 0.000 claims abstract description 12
- 239000012530 fluid Substances 0.000 claims abstract description 12
- 239000007788 liquid Substances 0.000 claims description 41
- 239000007789 gas Substances 0.000 claims description 27
- 150000004968 peroxymonosulfuric acids Chemical class 0.000 claims description 23
- 229910003460 diamond Inorganic materials 0.000 claims description 17
- 239000010432 diamond Substances 0.000 claims description 17
- 238000005868 electrolysis reaction Methods 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000011084 recovery Methods 0.000 claims description 7
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 4
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 2
- 239000001569 carbon dioxide Substances 0.000 claims description 2
- 238000007254 oxidation reaction Methods 0.000 claims description 2
- 239000011261 inert gas Substances 0.000 claims 1
- 229910001873 dinitrogen Inorganic materials 0.000 abstract description 17
- 238000003860 storage Methods 0.000 abstract description 16
- 239000008213 purified water Substances 0.000 abstract 3
- 239000000243 solution Substances 0.000 description 70
- 235000012431 wafers Nutrition 0.000 description 44
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 21
- 229910052710 silicon Inorganic materials 0.000 description 21
- 239000010703 silicon Substances 0.000 description 21
- 238000004380 ashing Methods 0.000 description 13
- 230000000694 effects Effects 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000001035 drying Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 230000001590 oxidative effect Effects 0.000 description 7
- 238000005406 washing Methods 0.000 description 7
- 229910021642 ultra pure water Inorganic materials 0.000 description 6
- 239000012498 ultrapure water Substances 0.000 description 6
- 239000002699 waste material Substances 0.000 description 6
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 5
- 238000011086 high cleaning Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- DAFQZPUISLXFBF-UHFFFAOYSA-N tetraoxathiolane 5,5-dioxide Chemical compound O=S1(=O)OOOO1 DAFQZPUISLXFBF-UHFFFAOYSA-N 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- JRKICGRDRMAZLK-UHFFFAOYSA-N peroxydisulfuric acid Chemical compound OS(=O)(=O)OOS(O)(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-N 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-M hydrogensulfate Chemical compound OS([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-M 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000008155 medical solution Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- -1 peroxodisulfate ions Chemical class 0.000 description 1
- 239000003186 pharmaceutical solution Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000008237 rinsing water Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
Definitions
- the present invention relates to a cleaning method and a cleaning system for peeling and removing.
- the semiconductor manufacturing process includes a step of locally injecting metal ions as impurities into the surface of the semiconductor wafer.
- a resist composed of a photosensitive resin material or the like is patterned as a mask material to prevent implantation into an undesired portion, and ions of the same concentration are also implanted into the resist surface. Since the ion-implanted resist is an unnecessary product in manufacturing, a resist removal process for peeling and removing from the wafer surface is performed.
- Patent Document 1 an SPM supply nozzle and a two-fluid nozzle for jetting droplets are installed in a single wafer cleaning device, and after supplying the droplet jet, high temperature SPM is supplied. A processing method has been proposed in which the resist is peeled off from the wafer.
- the present inventors have used an electrolytic sulfuric acid solution containing an oxidizing substance such as peroxomonosulfuric acid obtained by electrolyzing sulfuric acid as a cleaning solution as a substitute for the SPM cleaning solution, and a cleaning method in which sulfuric acid is circulated.
- a cleaning system are proposed (for example, Patent Documents 2 and 3). With this method, it is expected that the oxidizing power can be easily maintained at a certain level or more, and since there is almost no additional injection of chemical liquid or replacement of chemical liquid, the amount of chemical liquid can be greatly reduced.
- a cleaning solution having a high oxidizing power can be continuously produced, it is expected that peeling cleaning without ashing (washing without ashing) can be realized.
- Patent Document 2 and Patent Document 3 By this cleaning method, it is possible to reduce the amount of chemical solution used and the amount of waste liquid and at the same time obtain a high cleaning effect.
- the cleaning method described in Patent Document 3 can also be applied to single wafer cleaning. However, in the cleaning methods described in these patent documents, there is room for further improvement in terms of time until the resist that is no longer needed is completely removed from the silicon wafer.
- the present invention has been made in view of the above problems, and shortens the time required for the resist stripping process of the electronic material, and further can remove the resist residue reliably in a short time by wet cleaning after resist stripping.
- An object of the present invention is to provide a cleaning method and a cleaning system.
- the present invention includes a chemical cleaning step for bringing a functional chemical obtained by electrolyzing sulfuric acid into contact with an electronic material, and a jet of droplets generated from the gas and the liquid.
- a method for cleaning an electronic material comprising a wet cleaning step of contacting the electronic material (Invention 1).
- the wet cleaning process for contacting the jet of droplets generated from the gas and the liquid has high cleaning power, so that the subsequent rinse cleaning time is shortened or the rinse cleaning is unnecessary. can do.
- the time required for cleaning can be greatly reduced as compared with the conventional method.
- invention 2 by repeatedly using a functional chemical solution, the amount of chemical solution used and the amount of waste liquid are greatly reduced, the processing time of the material to be cleaned is shortened, and the throughput is improved. Can do.
- the functional chemical solution is brought into contact with an electronic material while being heated to 100 to 200 ° C. (Invention 3).
- the persulfuric acid contained in the functional chemical solution is effectively acted to obtain a sufficient cleaning effect, the boiling of the functional chemical solution is prevented, and the heat-resistant regular use of members constituting the apparatus It is possible to prevent the temperature from being exceeded.
- the functional chemical solution preferably has a sulfuric acid concentration of 80 to 96% by mass (Invention 4).
- At least the anode of the electrode used for electrolysis of sulfuric acid is a conductive diamond electrode, and the functional chemical solution contains persulfuric acid generated by an oxidation reaction at the anode. (Invention 5)
- the jet of droplets generated from the gas and the liquid is one gas selected from nitrogen, oxygen, rare gas, clean air, carbon dioxide, and ozone, or two kinds It is preferably produced from the above mixed gas and pure water (Invention 6).
- the wet cleaning can be performed efficiently in a short time without adversely affecting the electronic material.
- the present invention provides a chemical cleaning means for bringing a functional chemical obtained by electrolyzing sulfuric acid into contact with an electronic material, and a wet for bringing a jet of droplets generated from a gas and a liquid into contact with the electronic material.
- An electronic material cleaning system comprising a cleaning means is provided (Invention 8).
- the wet cleaning means for contacting the jet of droplets generated from the gas and the liquid has a high cleaning power, so that the subsequent rinse cleaning time is shortened or the rinse cleaning is unnecessary. can do.
- the time required for cleaning can be greatly reduced as compared with the conventional method.
- the functional chemical solution is recovered by the recovery means, electrolyzed again by the electrolyzer, and repeatedly used.
- the functional chemical solution is recovered by the recovery means, electrolyzed again by the electrolyzer, and repeatedly used.
- the persulfuric acid contained in the functional chemical solution is effectively acted to obtain a sufficient cleaning effect, the boiling of the functional chemical solution is prevented, and the heat-resistant regular use of the members constituting the apparatus Heating to a temperature that can prevent the temperature from being exceeded allows efficient cleaning.
- the chemical solution cleaning means has an electrolytic reaction apparatus for electrolyzing a sulfuric acid solution to produce a sulfuric acid solution containing persulfuric acid (Invention 11).
- sulfuric acid can be electrolyzed with an electrolytic reaction apparatus to produce a persulfuric acid-containing sulfuric acid solution suitable for washing, and a sufficient washing effect can be exhibited.
- At least the anode of the electrode of the electrolytic reaction apparatus is a conductive diamond electrode (Invention 12).
- invention 12 by using a conductive diamond electrode for the anode, it is possible to effectively produce persulfuric acid having a high cleaning ability and to enhance the durability of the electrode.
- the wet cleaning means includes a two-fluid nozzle having a pure water supply line and a gas supply line (Invention 13).
- the droplets generated from the gas and the liquid can be efficiently ejected, and the wet cleaning can be efficiently performed in a short time without adversely affecting the electronic material.
- spin cleaning can be efficiently performed for each single wafer in which a jet of a functional chemical solution or droplet is directed toward the surface of the electronic material while rotating the electronic material.
- the wet cleaning process for contacting a jet of droplets generated from a gas and a liquid is higher than conventional APM and HPM used for wet cleaning. Therefore, the subsequent rinse cleaning time can be shortened or the rinse cleaning can be made unnecessary.
- the time required for cleaning can be greatly reduced as compared with the conventional method.
- FIG. 1 is a flowchart showing an electronic material cleaning system according to an embodiment of the present invention.
- the electronic material cleaning system includes a chemical solution cleaning means 1, a wet cleaning means 2, and a single wafer cleaning device 3.
- the chemical cleaning means 1 includes a functional chemical storage tank 6 in which a concentrated sulfuric acid supply line 4 connected to a concentrated sulfuric acid tank (not shown) and a pure water supply line 5 connected to an ultrapure water production apparatus (not shown) communicated with each other.
- An electrolytic reaction device 8 connected to the chemical solution storage tank 6 through a concentrated sulfuric acid electrolysis line 7, and this electrolytic reaction device 8 circulates by communicating with the functional chemical solution storage tank 6 through a persulfuric acid supply line 9. A line is formed.
- the functional chemical solution storage tank 6 can supply the functional chemical solution W ⁇ b> 1 to the single wafer cleaning device 3 via the functional chemical solution supply line 10.
- the concentrated sulfuric acid electrolysis line 7 includes a liquid feed pump 11 and a cooler 12, the persulfuric acid supply line 9 includes a gas-liquid separator 13, and the functional chemical liquid supply line 10 includes a chemical liquid supply pump 14, a filter 15, and Heaters 16 serving as heating means are provided.
- the heater 16 can control the functional chemical W1 to a predetermined temperature described later by a control mechanism (not shown).
- the wet cleaning means 2 includes a pure water supply line 21 as a liquid connected to an ultrapure water production apparatus (not shown), a nitrogen gas supply line 22 connected to a nitrogen gas source (not shown) as a gas,
- the pure water supply line 21 and the nitrogen gas supply line 22 are connected to each other, and an internal mixing type two-fluid nozzle 23 is connected to each other, and a droplet W2 generated from nitrogen gas and ultrapure water is generated from the tip of the two-fluid nozzle 23. Injection is possible.
- the single wafer cleaning apparatus 3 includes a cleaning case 31 and a rotating device 32 provided in the cleaning case 31, and a silicon wafer 33 as an electronic material to be cleaned can be fixed to the rotating device 32. Yes.
- the single wafer cleaning device 3 is provided with a collection means 41.
- the recovery means 41 includes a sulfuric acid drain tank 42 and a sulfuric acid drain supply line 43.
- the sulfuric acid drain supply line 43 is provided with a liquid feed pump 44, a filter 45, and a cooler 46, respectively.
- the single wafer cleaning apparatus 3 is provided with a pure water waste liquid tank 47.
- the electrolytic reaction device 8 performs electrolysis with the anode and the cathode paired.
- the material of this electrode is not particularly limited. However, when platinum, which is widely used as an electrode, is used as an anode, persulfuric acid cannot be efficiently produced and platinum is eluted. . Therefore, in this embodiment, a conductive diamond electrode is used as at least the anode of the electrode. It is known that peroxodisulfate ions can be generated from sulfate ions or hydrogen sulfate ions using a conductive diamond electrode under conditions of a current density of about 0.2 A / cm 2 (Ch. Comninellis et al., Electrochemical and Solid-State Letters, Vol.3, No.2, pp.77-79, 2000).
- a semiconductor material such as a silicon wafer is used as a substrate, and a conductive diamond thin film is synthesized on the surface of the substrate to a film thickness of 20 ⁇ m or more.
- Type conductive polycrystalline diamond is one obtained by doping boron or nitrogen during synthesis of the diamond thin film to impart conductivity, and usually boron doped. If the doping amount is too small, technical significance does not occur. If the doping amount is too large, the doping effect is saturated. Therefore, a doping amount in the range of 50 to 20000 ppm with respect to the carbon amount of the diamond thin film is suitable.
- the conductive diamond electrode is usually a plate-like one, but a network structure having a plate-like shape can also be used.
- the current density on the surface of the conductive diamond electrode is 10 to 100,000 A / m 2
- concentrated sulfuric acid is parallel to the diamond electrode surface
- the liquid flow rate is 10 to 10,000 m / h. It is desirable to perform contact treatment.
- an electronic material on which a resist pattern is formed can be used in the manufacturing process of a semiconductor substrate, a liquid crystal display, an organic EL display, and a photomask thereof.
- the thickness of the resist film on the electronic material is about 0.1 to 2.0 ⁇ m, but the thickness is not limited to this.
- the concentration of sulfuric acid is adjusted by supplying concentrated sulfuric acid from the concentrated sulfuric acid supply line 4 to the functional chemical solution storage tank 6 and supplying pure water from the pure water supply line 5.
- the concentration of sulfuric acid in the functional chemical solution storage tank 6 is preferably 80 to 96 mass%.
- the liquid feeding pump 11 is activated to supply concentrated sulfuric acid to the electrolytic reaction device 8.
- the electrolysis temperature is excessively high, the electrolysis efficiency is lowered and the wear of the electrode is also increased.
- the heating energy for use in the chemical solution cleaning step described later increases, so that the concentrated sulfuric acid is cooled to 10 to 90 ° C., particularly 40 to 80 ° C. by the cooler 12. preferable.
- persulfuric acid is produced
- the persulfuric acid generated in this embodiment indicates peroxomonosulfuric acid (H 2 SO 5 ) and peroxodisulfuric acid (H 2 S 2 O 8 ). Both peroxomonosulfuric acid and peroxodisulfuric acid have high oxidizing power.
- the persulfuric acid generated in this way returns to the functional chemical liquid storage tank 6 from the persulfuric acid supply line 9.
- the functional chemical solution W1 composed of persulfuric acid and sulfuric acid is stored in the functional chemical solution storage tank 6, and the sulfuric acid concentration is 80 to 96% by mass (persulfuric acid concentration 2 to 20 [g / L (asS 2 O 8 )])
- the chemical solution supply pump 14 is activated to supply the functional chemical solution W 1 from the functional chemical solution supply line 10 to the single wafer cleaning device 3.
- the temperature of the functional chemical solution W1 is too low, a sufficient cleaning effect cannot be obtained.
- the temperature is too high, the sulfuric acid solution will boil depending on the sulfuric acid concentration and the like. It is preferable to heat to 200 ° C., particularly 100 to 180 ° C.
- the functional chemical solution W1 is supplied from the functional chemical solution supply line 10 to the silicon wafer 33 fixed to the rotating device 32 of the single wafer cleaning device 3, and the silicon wafer 33 is rotated to convert the functional chemical solution W1 into silicon.
- the resist on the silicon wafer 33 is peeled off (chemical solution cleaning step).
- the cleaning time in the chemical solution cleaning step as described above is not particularly limited, the resist adhesion state to the silicon wafer 33 as the material to be cleaned, the presence or absence of the ashing process prior to the peeling cleaning, the persulfuric acid in the functional chemical solution W1. Although it varies depending on the concentration, the solution temperature, the conditions of the subsequent wet cleaning step, etc., it is usually preferably 10 to 300 seconds, particularly preferably about 15 to 120 seconds.
- the functional chemical solution W1 cleaned in this way is stored in the sulfuric acid drainage tank 42 of the recovery means 41, and then returned from the sulfuric acid drainage supply line 43 to the functional chemical liquid storage tank 6 by the liquid feed pump 44.
- the sulfuric acid temperature is excessively high, the electrolysis efficiency decreases and the wear of the electrode also increases, so that the sulfuric acid is discharged to 10 to 90 ° C., particularly 40 to 80 ° C. by the cooler 46.
- the liquid is preferably returned to the functional chemical liquid storage tank 6.
- Rinse cleaning with rinsing water may be performed between the resist peeling cleaning process and the wet cleaning process. However, rinse cleaning is not essential, and wet cleaning may be performed without performing this.
- an ultrapure water is normally used as rinse water.
- the ultrapure water is, for example, fine particles having an electrical resistivity of 18 M ⁇ ⁇ cm or more, a metal ion concentration of 5 ng / L or less, a residual ion concentration of 10 ng / L or less, and 0.1 ⁇ m or more in 1 mL. Water having a quality of 5 or less and TOC of 0.1 to 10 ⁇ g / L.
- pure water is supplied from the pure water supply line 21, and nitrogen gas is supplied from the nitrogen gas supply line 22 to be merged by the internal mixing type two-fluid nozzle 23.
- nitrogen gas and pure water are mixed inside the nozzle, and the nitrogen gas and the superfluid are transferred from the two-fluid nozzle 23 to the silicon wafer 33 fixed to the rotating device 32 of the single wafer cleaning device 3.
- the silicon wafer 33 is cleaned by bringing the droplets W2 generated from the pure water into contact with the silicon wafer 33 (wet cleaning process).
- the cleaning time of the wet cleaning process as described above is not particularly limited, and varies depending on the conditions of the chemical cleaning process and the conditions of the wet cleaning process, but is usually 10 to 300 seconds, particularly about 15 to 120 seconds. It is preferable to do.
- nitrogen gas (gas) and pure water may be supplied from 10 to 10,000 nitrogen gas (gas) with respect to volume 1 of pure water.
- a series of resist removal cleaning removal processing is completed by spin drying and IPA drying according to a conventional method, and the electronic material from which the resist is removed is sent to the next step.
- the droplet W2 after being washed as described above is stored in the pure water-based waste liquid tank 47, and after passing through a predetermined process, is released or reused in the external environment.
- the silicon wafers 33 can be sequentially processed by repeating such operations continuously or intermittently. Note that the above operation may be repeated a plurality of times for a single silicon wafer 33.
- the droplet generated from the gas and the liquid one made of nitrogen gas and pure water is used.
- this gas various gases such as ozone gas, hydrogen gas, oxygen gas and the like are used. Gas can be used.
- the ashing process may be performed prior to the functional chemical cleaning.
- the ashing process is performed by ashing the resist on the electronic material with oxygen plasma or the like according to a conventional method.
- the persulfuric acid-containing sulfuric acid solution produced by electrolysis of the sulfuric acid solution can be used to reliably remove the resist without causing a problem of resist residue even if the ashing process is omitted. By omitting the ashing process, the time and cost required for a series of resist stripping processes can be greatly reduced.
- Example 1 Using the test apparatus shown in FIG. 1, a test was conducted to remove and remove the resist of a 12-inch wafer for which a resist was formed for a KrF excimer laser with a pattern and an As ion implantation concentration of 1E + 15 [atoms / cm 2 ].
- the test conditions were sulfuric acid (functional chemical solution W1) electrolyzed in the electrolytic reactor 8 while adjusting the sulfuric acid concentration to 92 mass% and the persulfuric acid concentration to about 10 g / L (asS 2 O 8 ).
- About 30 L was held in the chemical solution storage tank 6, and this functional chemical solution W ⁇ b> 1 was supplied to the single wafer cleaning device 3 while being heated by the heater 16 by the chemical solution supply pump 14.
- the functional chemical solution W 1 was heated to 180 ° C. and supplied to the silicon wafer 33 fixed in the single wafer cleaning apparatus 3 at 160 to 170 ° C. to perform a chemical cleaning process.
- This chemical cleaning step was performed by supplying the functional chemical W1 to the silicon wafer 33 at about 1 L / min and supplying the functional chemical W1 continuously for 2 minutes. Subsequently, cleaning was performed for 60 seconds by a jet of droplets W2 supplied to the two-fluid nozzle 23 at a flow rate of 100 mL / min of pure water and 50 L / min of N 2 gas, and a wet cleaning process was performed. Thereafter, spin drying was performed to complete the resist stripping process. As a result, from the start of the supply of the functional chemical solution W1 to the completion of the resist stripping process, it could be completed in 4 minutes including spin drying.
- Example 2 In Example 1, the time of the chemical cleaning process was set to 30 seconds and the time of the wet cleaning process was set to 30 seconds. After repeating this twice, the resist stripping process was performed in the same manner except that spin drying was performed. . As a result, from the start of supply of the functional chemical solution W1 to the completion of the resist stripping process, it could be completed in 4 minutes including spin drying.
- Example 1 the resist cleaning process was performed in the same manner except that the wet cleaning process was performed at 2 L / min of pure water for 1 minute and then spin drying was performed. As a result, a large number of resist residues remained on the silicon wafer 33, and the resist stripping process was not completed. Therefore, the silicon wafer 33 with resist residue that has not been processed was further washed with the functional chemical solution W1 for 2 minutes and treated with 2 L / min of pure water for 1 minute, but the resist residue was completely removed visually. Not confirmed. From these facts, it was found that the resist removal was difficult even if the amount of the functional pharmaceutical solution W1 in the chemical solution cleaning step or the cleaning time was doubled only by performing the wet cleaning step with pure water.
- Example 2 In Example 1, the time of the chemical solution cleaning step was set to 10 minutes, the wet cleaning step was set to 2 minutes with 2 L / min of pure water, and then the resist stripping process was performed in the same manner except that spin drying was performed. As a result, a large number of resist residues remained on the silicon wafer 33, and the resist stripping process was not completed. Therefore, when the time of the chemical cleaning process was sequentially extended until the resist remained, it was confirmed that the chemical cleaning process required 15 minutes. From these facts, it was found that when the wet cleaning process was performed only with pure water, it was necessary to take a very long cleaning time in the chemical cleaning process, and the cleaning efficiency was not good.
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- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
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Abstract
Description
図1は本発明の一実施形態に係る電子材料洗浄システムを示すフロー図である。
図1に示す試験装置を使用して、KrFエキシマレーザ用でパターン有、Asイオンの注入濃度1E+15[atoms/cm2]でレジストを形成した12インチウエハのレジストを剥離除去する試験を行った。
実施例1において、薬液洗浄工程の時間を30秒間とするとともにウエット洗浄工程の時間を30秒間とし、これを2度繰り返した後、スピン乾燥を行った以外は同様にしてレジスト剥離処理を行った。その結果、機能性薬液W1の供給開始から、レジスト剥離処理の完了まで、スピン乾燥を含めて4分で完了することができた。
実施例1において、ウエット洗浄工程を純水2L/分で1分間とした後、スピン乾燥を行った以外は同様にしてレジスト剥離処理を行った。その結果、シリコンウエハ33上にレジスト残渣が多数付着したままで、レジスト剥離処理は完了していなかった。そこで、処理の完了しなかったレジスト残渣付きのシリコンウエハ33に対し、さらに機能性薬液W1による洗浄を2分間行い、純水2L/分で1分間処理したが、レジスト残渣は目視でも完全に取れないことが確認された。これらのことから、ウエット洗浄工程を純水で行っただけでは、薬液洗浄工程における機能製薬液W1の量又は洗浄時間を2倍としてもレジストの剥離が困難であることがわかった。
実施例1において、薬液洗浄工程の時間を10分間とするとともにウエット洗浄工程を純水2L/分で1分間とした後、スピン乾燥を行った以外は同様にしてレジスト剥離処理を行った。その結果、シリコンウエハ33上にレジスト残渣が多数付着したままで、レジスト剥離処理は完了していなかった。そこで、薬液洗浄工程の時間をレジストの残留がなくなるまで順次延長したところ、薬液洗浄工程が15分は必要であることが確認された。これらのことからウエット洗浄工程を純水のみで行った場合には、薬液洗浄工程における洗浄時間を非常に長くとる必要があり、洗浄効率が良好でないことがわかった。
2…ウエット洗浄手段
3…枚葉式洗浄装置
6…機能性薬液貯留槽(薬液洗浄手段)
8…電解反応装置(薬液洗浄手段)
10…機能性薬液供給ライン(薬液洗浄手段)
14…薬液供給ポンプ(薬液洗浄手段)
16…加熱器(加熱手段:薬液洗浄手段)
21…純水供給ライン(ウエット洗浄手段)
22…窒素ガス供給ライン(ウエット洗浄手段)
23…二流体ノズル(ウエット洗浄手段)
33…シリコンウエハ(電子材料)
41…回収手段
42…硫酸排液槽(回収手段)
43…硫酸排液供給ライン(回収手段)
W1…機能性薬液
W2…窒素ガスと超純水とから生成される液滴(気体と液体とから生成される液滴)
Claims (14)
- 硫酸を電気分解して得られる機能性薬液を電子材料に接触させる薬液洗浄工程と、
気体と液体とから生成される液滴の噴流を前記電子材料に接触させるウエット洗浄工程と
を有することを特徴とする電子材料の洗浄方法。 - 前記電子材料に接触させた機能性薬液を回収し、当該機能性薬液を再度電気分解して再利用することを特徴とする請求項1に記載の電子材料の洗浄方法。
- 前記機能性薬液を100~200℃に加熱された状態で電子材料に接触させることを特徴とする請求項1又は2に記載の電子材料の洗浄方法。
- 前記機能性薬液が、硫酸濃度80~96質量%であることを特徴とする請求項1~3のいずれかに記載の電子材料の洗浄方法。
- 前記硫酸の電気分解に用いる電極の少なくとも陽極が導電性ダイヤモンド電極であり、
前記機能性薬液が、前記陽極での酸化反応によって生成する過硫酸を含有することを特徴とする請求項1~4のいずれかに記載の電子材料の洗浄方法。 - 前記気体と液体とから生成される液滴の噴流が、窒素、酸素、希ガス、清浄空気、二酸化炭素、オゾンから選ばれる1種のガスまたは2種以上の混合ガスと、純水とから生成されることを特徴とする請求項1~5のいずれかに記載の電子材料の洗浄方法。
- 前記電子材料が、回転装置に固定されて枚葉洗浄されることを特徴とする請求項1~6のいずれかに記載の電子材料の洗浄方法。
- 硫酸を電気分解して得られる機能性薬液を電子材料に接触させる薬液洗浄手段と、
気体と液体とから生成される液滴の噴流を前記電子材料に接触させるウエット洗浄手段と
を備えたことを特徴とする電子材料洗浄システム。 - 前記電子材料に接触させた機能性薬液を回収する回収手段を備えることを特徴とする請求項8に記載の電子材料洗浄システム。
- 前記機能性薬液を加熱する加熱手段を備えることを特徴とする請求項8又は9に記載の電子材料洗浄システム。
- 前記薬液洗浄手段が、硫酸溶液を電気分解して過硫酸含有硫酸溶液を製造する電解反応装置を有することを特徴とする請求項8~10のいずれかに記載の電子材料洗浄システム。
- 前記電解反応装置の電極の少なくとも陽極が導電性ダイヤモンド電極であることを特徴とする請求項8~11のいずれかに記載の電子材料洗浄システム。
- 前記ウエット洗浄手段が、純水供給ラインと不活性ガス供給ラインとを有する二流体ノズルを備えることを特徴とする請求項8~12のいずれかに記載の電子材料洗浄システム。
- 前記電子材料を固定可能な回転装置を備えることを特徴とする請求項8~13のいずれかに記載の電子材料洗浄システム。
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US20150262811A1 (en) * | 2012-08-22 | 2015-09-17 | Kurita Water Industries Ltd. | Method and system for cleaning semiconductor substrate |
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