WO2011111784A1 - 接着材リール - Google Patents

接着材リール Download PDF

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Publication number
WO2011111784A1
WO2011111784A1 PCT/JP2011/055671 JP2011055671W WO2011111784A1 WO 2011111784 A1 WO2011111784 A1 WO 2011111784A1 JP 2011055671 W JP2011055671 W JP 2011055671W WO 2011111784 A1 WO2011111784 A1 WO 2011111784A1
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WO
WIPO (PCT)
Prior art keywords
adhesive
adhesive layer
mass
tape
reel
Prior art date
Application number
PCT/JP2011/055671
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
松田　和也
貴志 関
藤縄　貢
忠恭 藤枝
Original Assignee
日立化成工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立化成工業株式会社 filed Critical 日立化成工業株式会社
Priority to CN201180006535.4A priority Critical patent/CN102712834B/zh
Priority to KR1020147009593A priority patent/KR101763458B1/ko
Priority to JP2011513812A priority patent/JPWO2011111784A1/ja
Publication of WO2011111784A1 publication Critical patent/WO2011111784A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
    • B65H37/002—Web delivery apparatus, the web serving as support for articles, material or another web
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides

Definitions

  • the present invention relates to an adhesive reel, and more particularly, to an adhesive reel in which an adhesive tape having a tape-like base material and an adhesive layer provided on one surface thereof is wound around a winding core.
  • An anisotropic conductive film (ACF: Anisotropic Conductive Film) is used as a connection material for electrically connecting circuit members having a large number of electrodes to manufacture a circuit connection body.
  • Anisotropic conductive film keeps the conductive state between opposing electrodes when connecting a semiconductor element such as an IC or LSI or a member such as a package to a substrate such as a printed wiring board, LCD glass substrate or flexible printed circuit board. It is a connection material that performs electrical connection and mechanical fixation so as to maintain insulation between electrodes.
  • connection materials such as non-conductive films (NCF) are known.
  • the connecting material includes an adhesive component containing a thermosetting resin and conductive particles blended as necessary in the case of an anisotropic conductive film, and on a base material such as a polyethylene terephthalate film (PET film). Formed into a film.
  • PET film polyethylene terephthalate film
  • the raw film of the obtained film is cut into a tape shape so as to have a width suitable for the application, and this is wound around a core to produce an adhesive reel (see Patent Document 1).
  • Blocking is a phenomenon in which the adhesive layer is transferred to the back surface of the substrate when the wound adhesive tape is pulled out and used. Since the adhesive layer provided on one surface of the substrate is in an uncured state, it has a certain degree of fluidity. If the adhesive reel is left for a long time, the adhesive may ooze out from the end face of the adhesive tape, and this may stick to the side plate of the reel. When the adhesive tape is pulled out from the reel in this state, there is a problem that a part of the adhesive layer is transferred to the back surface of the base material, or a problem that the adhesive layer is peeled off from the base material and only the base material is pulled out. There is a case.
  • FIG. 9 is a cross-sectional view schematically showing an example of blocking that occurs when an adhesive tape is pulled out from a conventional adhesive reel.
  • the adhesive tape 25 shown in FIG. 9 is wound around the core 1 so that the adhesive layer 28 faces the core side (inside) (the base material 26 faces the outside).
  • Patent Documents 2 and 3 describe a technique for suppressing blocking from the viewpoint of the shape of the adhesive tape, and an adhesive having a width narrower than the width of the base material on the inner side in the width direction of the base material on the end surface on the tape side.
  • An adhesive tape provided with a layer is disclosed.
  • Patent Document 4 describes a technique for suppressing blocking from the viewpoint of the composition of the adhesive, and discloses an adhesive tape having a temporary fixing force with respect to a substrate within a predetermined range.
  • Patent Document 5 describes a technique for suppressing blocking from the viewpoint of use conditions, and discloses a sticking device having means for controlling the temperature of a reel.
  • Patent Document 6 describes a technique for suppressing blocking from the viewpoint of the structure of a reel part around which an adhesive tape is wound, and discloses an adhesive reel in which a rib structure provided on a side plate has conductivity.
  • Patent Document 7 describes a technique for suppressing blocking from the viewpoint of the configuration of a base material, and discloses a wound body using a material having a superior difference in surface tension between the front and back surfaces as a base material.
  • Patent Document 8 describes a technique for suppressing blocking from the viewpoint of compatibility between an end mark and an adhesive.
  • JP 2003-34468 A International Publication No. 08/053824 International Publication No. 07/015372 Japanese Patent Application Laid-Open No. 2003-064322 JP 2006-218867 A JP 2009-004354 A Japanese Patent Laid-Open No. 11-293206 JP 2001-284005 A
  • the present invention provides an adhesive reel capable of suppressing a problem that the adhesive layer is peeled off from the base material and only the base material is pulled out when the wound adhesive tape is pulled out at a very high level.
  • blocking indicates “a problem that when the wound adhesive tape is pulled out, the adhesive layer is peeled off from the base material and only the base material is pulled out”.
  • the adhesive reel according to the present invention has a winding core, a pair of side plates provided on both sides of the winding core so as to face each other, a tape-shaped substrate, and an adhesive layer provided on one surface thereof. And an adhesive tape wound around the core, and the adhesive tape is wound around the core such that the surface of the base material on which the adhesive layer is not formed faces the core.
  • the adhesive tape is directed to the core side (inside) and the adhesive tape is used as the core so that the base material faces outward. It was common sense to wind (see FIGS. 3 and 4 of Patent Document 2). For example, when the adhesive layer is directed outward, there is a disadvantage that dust adheres to the adhesive layer. In particular, since the adhesive tape used for electronic materials leads to product defects even with a small amount of dust, it has been protected from contamination sources by winding the adhesive layer toward the core side (inside).
  • the present inventors made a trial production of an adhesive reel by winding an adhesive tape around a winding core so that the substrate faces the core side (inside) and the adhesive layer faces the outside, contrary to conventional common sense. .
  • this adhesive reel was evaluated for the presence or absence of blocking, it was found that blocking could be prevented at an extremely high level.
  • the length of the adhesive tape that can be wound around the core has been limited, but by adopting the above configuration, the adhesive tape is longer than the conventional product (for example, 200 m or more) is possible.
  • the adhesive layer preferably has a shear viscosity at 30 ° C. of 100000 Pa ⁇ s or less.
  • the low-viscosity adhesive include a thermal radical curable adhesive and a low-temperature curable adhesive.
  • a low-temperature curable adhesive is required to have high fluidity at a low temperature (for example, 130 to 150 ° C.).
  • a thermal radical curable adhesive containing a radical polymerization initiator having a 1 minute half-life temperature of 160 ° C. or less can be mentioned.
  • the thermal radical curable adhesive contains a thermoplastic resin, a radical polymerizable material containing a radical polymerizable substance that is liquid at 30 ° C., and a radical polymerization initiator, blocking with a conventional adhesive reel is possible. It is likely to occur with high probability.
  • the content of the radical polymerizable substance in the thermal radical curable adhesive is 20 to 80 masses with respect to 100 mass parts of the total amount of the thermoplastic resin and the radical polymerizable material. Even if it is a part, blocking can fully be suppressed.
  • the adhesive layer may be an epoxy adhesive containing a thermoplastic resin, a thermosetting material containing an epoxy resin that is liquid at 30 ° C., and a curing agent.
  • the content of the epoxy resin in the epoxy adhesive is the total amount of the thermoplastic resin and the thermosetting material. Even if it is 20 to 80 parts by mass with respect to 100 parts by mass, blocking can be sufficiently suppressed.
  • the inorganic filler content of the adhesive layer may be 20% by volume or less based on the volume of the adhesive layer.
  • the inorganic filler content of the adhesive layer may be 50% by mass or less based on the mass of the adhesive layer. According to the present invention, blocking can be sufficiently suppressed even when an inorganic filler is not blended in the adhesive layer or even when the blending amount is 50% by mass or less.
  • silica is used as the inorganic filler
  • the content is preferably 35% by mass or less based on the mass of the adhesive layer.
  • alumina is used as the inorganic filler, the content is preferably 50% by mass or less based on the mass of the adhesive layer.
  • blocking can be sufficiently suppressed even when the width of the adhesive tape is 0.5 to 3.0 mm.
  • a narrow tape has a relatively large influence of the bleeding of the adhesive on the end face of the tape as compared with a thick tape, and is likely to be blocked.
  • the adhesive tape is suitable for use in circuit connection. As described above, since blocking can be suppressed at a high level, it is possible to manufacture a circuit connection body having excellent connection reliability.
  • FIG. 1 It is a perspective view which shows one Embodiment of the adhesive material reel which concerns on this invention. It is sectional drawing which shows typically the structure inside the adhesive material reel shown in FIG. It is a front view which shows the inner surface of the side plate of the adhesive material reel which concerns on this invention. It is sectional drawing which shows an example of an anisotropic conductive tape typically. It is sectional drawing which shows typically an example of the circuit connection body to which circuit electrodes were connected. It is sectional drawing which shows typically an example of the manufacturing method of a circuit connection body. It is a perspective view which shows other embodiment of the adhesive material reel which concerns on this invention. It is sectional drawing which shows the other example of an anisotropic conductive tape typically. It is sectional drawing which shows typically an example of the blocking produced when drawing out an adhesive tape from the conventional adhesive reel.
  • an anisotropic conductive tape (adhesive tape) 5 is wound on the outer surface F1 of the core 1 to form a wound body.
  • the anisotropic conductive tape 5 is wound around the core 1 such that the surface of the substrate 6 on which the adhesive layer is not formed faces the core 1 and the adhesive layer 8 faces the outside. In the state of the wound body, the surface of the substrate 6 on which the adhesive layer 8 is not formed is in direct contact with the adhesive layer 8 of the anisotropic conductive tape 5 on the inner side of the winding.
  • the side plates are preferably provided at both ends of the core in the axial direction because a plurality of adhesive reels can be easily arranged and stored, but a part of the core penetrates the side plate and protrudes from the outer surface of the side plate.
  • a side plate may be provided.
  • the side plate 2 includes a rib structure portion 2 b that protrudes from the surface F ⁇ b> 2 and extends radially from the edge of the through hole 2 a on the inner side surface F ⁇ b> 2 adjacent to the anisotropic conductive tape 5. Even if the adhesive oozes out from the end face of the anisotropic conductive tape 5 by providing the rib structure portion 2b, the area where the adhesive is adhered to the side plate 2 can be sufficiently reduced. Can be effectively suppressed.
  • the adhesive reel 10 has a shaft hole 10 a into which a rotating shaft of a crimping device (not shown) is inserted, and the shaft hole 10 a is provided on the rotating shaft.
  • a notch portion 10b that fits with the convex portion is provided.
  • a configuration other than the notch portion 10b may be adopted as long as it can prevent idling when the adhesive reel 10 is mounted on the rotating shaft of the crimping apparatus.
  • a plastic molded product or the like can be used as a reel component including the core 1 and the side plate 2.
  • the anisotropic conductive tape 5 includes a tape-like base material 6 and an adhesive layer 8 formed on one surface of the base material 6.
  • the length of the anisotropic conductive tape 5 is preferably 1 to 1000 m, more preferably 200 to 1000 m, still more preferably 200 to 500 m, still more preferably 250 to 500 m, and particularly preferably 300. ⁇ 500 m.
  • the length of the anisotropic conductive tape 5 that can be wound around the core 1 is limited.
  • the anisotropic conductive tape 5 is attached to the core 1 so that the substrate 6 faces inward. By winding, it is possible to wind the anisotropic conductive tape 5 longer than the conventional product around the core 1.
  • the width of the anisotropic conductive tape 5 is preferably 0.5 to 30 mm, more preferably 0.5 to 3.0 mm, still more preferably 0.5 to 2.0 mm, and particularly preferably 0. .5 to 1.0 mm.
  • the width of the anisotropic conductive tape 5 that can be wound around the core 1 is limited.
  • the anisotropic conductive tape 5 is wound around the core 1 so that the base 6 faces inward. As a result, the anisotropic conductive tape 5 having a narrower width than the conventional product can be wound around the core 1.
  • variety of the base material 6 is the same as the width
  • FIG. What is necessary is just to adjust the width
  • the thickness of the adhesive layer 8 may be appropriately selected according to the adhesive component to be used and the type of the adherend, but is preferably 5 to 100 ⁇ m, more preferably 10 to 40 ⁇ m. Conventionally, since blocking is likely to occur, the thickness of the adhesive layer 8 of the anisotropic conductive tape 5 that can be wound around the core 1 has been limited, but the anisotropic conductive tape 5 so that the substrate 6 faces inward. It is possible to wind the anisotropic conductive tape 5 having the adhesive layer 8 thicker than the conventional product having a thickness of, for example, about 30 to 100 ⁇ m.
  • the thickness of the substrate 6 is preferably about 4 to 200 ⁇ m, more preferably 20 to 100 ⁇ m.
  • the substrate 6 is, for example, polyethylene terephthalate, polyethylene naphthalate, polyethylene isophthalate, polybutylene terephthalate, polyolefin, polyacetate, polycarbonate, polyphenylene sulfide, polyamide, ethylene / vinyl acetate copolymer, polyvinyl chloride, polyvinylidene chloride, Various plastic tapes made of synthetic rubber or liquid crystal polymer can be used.
  • the material which comprises the base material 6 is not limited to these. Moreover, you may use as the base material 6 what the mold release process was performed to the contact surface etc. with the adhesive bond layer 8. FIG. Furthermore, what mixed 2 or more types chosen from said material, or the thing in which said film was multilayered may be used.
  • an epoxy adhesive or a radical curable adhesive can be used as the adhesive component 8a of the adhesive layer 8.
  • a thermoplastic adhesive such as polyurethane or polyvinyl ester can be used.
  • the use of a crosslinkable material is preferred because of excellent heat resistance and moisture resistance after connection.
  • an epoxy adhesive containing an epoxy resin as a main component as a thermosetting resin is preferable because it can be cured for a short time, has good connection workability, and has excellent molecular adhesion.
  • the radical curable adhesive has characteristics such as excellent curability at a low temperature and in a short time as compared with the epoxy adhesive, and can be appropriately selected depending on the application.
  • the epoxy adhesive contains, for example, a thermosetting material such as an epoxy resin and a curing agent. Moreover, it is common to mix
  • the epoxy resin examples include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol A novolak type epoxy resin, bisphenol F novolak type epoxy.
  • examples thereof include resins, alicyclic epoxy resins, glycidyl ester type epoxy resins, glycidyl amine type epoxy resins, hydantoin type epoxy resins, isocyanurate type epoxy resins, and aliphatic chain epoxy resins. These epoxy resins may be halogenated or hydrogenated. Further, an acryloyl group or a methacryloyl group may be added to the side chain of the epoxy resin. These are used individually by 1 type or in combination of 2 or more types.
  • the curing agent is not particularly limited as long as it can cure the epoxy resin.
  • anionic polymerizable catalyst-type curing agent cationic polymerizable catalyst-type curing agent, polyaddition-type curing agent, etc. Is mentioned.
  • anionic or cationic polymerizable catalyst-type curing agents are preferred because they are excellent in rapid curability and do not require chemical equivalent considerations.
  • anionic or cationic polymerizable catalyst-type curing agent examples include imidazole, hydrazide, boron trifluoride-amine complexes, onium salts (aromatic sulfonium salts, aromatic diazonium salts, aliphatic sulfonium salts, etc.), Examples include amine imides, diaminomaleonitrile, melamine and derivatives thereof, polyamine salts, dicyandiamide, and the like, and modifications thereof.
  • Examples of the polyaddition type curing agent include polyamines, polymercaptans, polyphenols, and acid anhydrides.
  • Latent curing agents that are microencapsulated by coating these epoxy resin curing agents with polyurethane, polyester or other polymer materials, nickel, copper or other metal thin films, inorganic materials such as calcium silicate, etc. are acceptable. It is preferable because the working time can be extended.
  • curing agent is used individually by 1 type or in combination of 2 or more types.
  • the compounding amount of the curing agent is generally about 0.05 to 20 parts by mass with respect to 100 parts by mass of the total amount of the thermosetting material and the thermoplastic resin blended as necessary.
  • the radical curable adhesive contains, for example, a radical polymerizable material and a radical polymerization initiator. Moreover, it is common to mix
  • radical polymerizable material for example, any substance having a functional group that is polymerized by radicals can be used without particular limitation.
  • radical polymerizable substances such as acrylate (including corresponding methacrylate, the same shall apply hereinafter) compound, acryloxy (including corresponding methacryloxy, and the same shall apply hereinafter) compound, maleimide compound, citraconic imide resin, nadiimide resin and the like may be mentioned. It is done.
  • radically polymerizable substances may be used in the state of a monomer or an oligomer, and a monomer and an oligomer can be used in combination.
  • acrylate compound examples include methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, 2-hydroxy-1,3-dia Acryloxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl] propane, 2,2-bis [4- (acryloxypolyethoxy) phenyl] propane, dicyclopentenyl acrylate, tricyclodecanyl acrylate, Examples include tris (acryloyloxyethyl) isocyanurate, urethane acrylate and the like.
  • the radical polymerizable substance such as an acrylate compound has at least one substituent such as a dicyclopentenyl group, a tricyclodecanyl group, or a triazine ring.
  • a compound described in International Publication No. 2009/063827 can be preferably used. These are used individually by 1 type or in combination of 2 or more types.
  • radical polymerization initiator for example, any compound that can be decomposed by heating or light irradiation to generate free radicals can be used without particular limitation. Specific examples include peroxide compounds and azo compounds. Such a curing agent is appropriately selected depending on the intended connection temperature, connection time, pot life, and the like.
  • examples of the radical polymerization initiator include diacyl peroxide, peroxydicarbonate, peroxyester, peroxyketal, dialkyl peroxide, hydroperoxide, silyl peroxide, and the like.
  • peroxyesters, dialkyl peroxides, hydroperoxides, silyl peroxides, and the like are preferable, and peroxyesters that provide high reactivity are more preferable.
  • compounds described in International Publication No. 2009/063827 can be preferably used. These are used individually by 1 type or in combination of 2 or more types.
  • the amount of the radical polymerization initiator is generally about 0.1 to 10 parts by mass with respect to 100 parts by mass of the total amount of the radical polymerizable material and the thermoplastic resin compounded as necessary.
  • thermoplastic resins blended as necessary with epoxy adhesives and radical curable adhesives facilitate imparting film properties to the adhesive.
  • thermoplastic resins include phenoxy resin, polyvinyl formal resin, polystyrene resin, polyvinyl butyral resin, polyester resin, polyamide resin, xylene resin, polyurethane resin, polyester urethane resin, phenol resin, terpene phenol resin, and the like.
  • the compounds described in International Publication No. 2009/063827 can be suitably used.
  • a phenoxy resin is preferable because of excellent adhesion, compatibility, heat resistance, mechanical strength, and the like. These are used individually by 1 type or in combination of 2 or more types.
  • the blending amount of this thermoplastic resin is generally about 5 to 80 parts by mass with respect to 100 parts by mass of the total amount of the thermoplastic resin and the thermosetting material when blended with the epoxy adhesive. Further, when a thermoplastic resin is blended in the radical curable adhesive, the blending amount of the thermoplastic resin is generally 5 to 80 mass with respect to 100 mass parts of the total amount of the thermoplastic resin and the radical polymerizable material. About a part.
  • the adhesive layer 8 may have a shear viscosity at 30 ° C. of 100000 Pa ⁇ s or less.
  • the viscosity is more preferably 1000 to 50000 Pa ⁇ s, and still more preferably 1000 to 30000 Pa ⁇ s.
  • a heat radical curable adhesive and a low temperature curable adhesive may be used as the low-viscosity adhesive component 8a.
  • thermo radical curable adhesive containing a radical polymerization initiator having a 1 minute half-life temperature of 160 ° C. or less.
  • the 1-minute half-life temperature is more preferably 60 to 140 ° C, still more preferably 60 to 120 ° C.
  • di-tert-butylperoxyhexahydroterephthalate (1 minute half-life temperature: 142 ° C., HTP-65W (trade name) manufactured by Kayaku Azo Co., Ltd.), substituted benzoyl peroxide (1 Minute half-life temperature: 131.1 ° C., manufactured by NOF Corporation, NIPPER BMT (trade name), dilauroyl peroxide (1 minute half-life temperature: 116.4 ° C., manufactured by NOF Corporation, Parroyl L (product) Name)).
  • a thermal radical curable adhesive containing a thermoplastic resin, a radical polymerizable material containing a radical polymerizable substance that is liquid at 30 ° C., and a radical polymerization initiator Is mentioned.
  • the content of the radical polymerizable substance in the thermal radical curable adhesive is preferably 20 to 80 parts by mass with respect to 100 parts by mass of the total amount of the thermoplastic resin and the radical polymerizable material.
  • the content is more preferably 30 to 80 parts by mass, still more preferably 40 to 80 parts by mass.
  • the adhesive component 8a may be an epoxy adhesive containing a thermoplastic resin, a thermosetting material containing an epoxy resin that is liquid at 30 ° C., and a curing agent.
  • the content of the epoxy resin in the epoxy adhesive is preferably 20 to 80 parts by mass with respect to 100 parts by mass of the total amount of the thermoplastic resin and the thermosetting material.
  • the content is more preferably 40 to 80 parts by mass, still more preferably 30 to 80 parts by mass.
  • a component that exerts a relaxing action on internal stress from the viewpoint of suppressing the warpage of the substrate caused by the difference in linear expansion coefficient between the IC chip and the substrate is preferably blended into the adhesive component. Specifically, it is preferable to blend an acrylic rubber or an elastomer component with the adhesive component.
  • a radical curable adhesive as described in International Publication No. 98/44067 can also be used.
  • the conductive particles 8b include metal particles such as Au, Ag, Ni, Cu, and solder, and carbon.
  • metal particles such as Au, Ag, Ni, Cu, and solder, and carbon.
  • non-conductive glass, ceramic, plastic, or the like may be used as a core, and the core may be coated with the above-described metal or carbon film or metal particles.
  • the conductive particles 8b are conductive particles having a plastic core or hot-melt metal particles, the conductive particles 8b have deformability when heated and pressurized. For this reason, it is possible to increase the contact area between the electrode and the conductive particles 8b at the time of connection, and the connection reliability can be improved.
  • insulating particles obtained by coating the surface of the conductive particles 8b with a polymer resin or the like may be added.
  • insulating particles when the total amount of particles is increased, it becomes possible to suppress short circuit due to contact between particles when used as anisotropic conductive tape, and insulation between adjacent circuit electrodes Can be improved.
  • the average particle diameter of the conductive particles and the insulating particles is preferably 1 to 18 ⁇ m, more preferably 2.5 to 10 ⁇ m, from the viewpoint of improving dispersibility and conductivity.
  • the blending amount of the conductive particles 8b is not particularly limited, and is preferably 0.1 to 30% by volume, more preferably 0.1 to 10% by volume, and still more preferably 0, based on the entire adhesive component. .5-5% by volume. If the blending amount of the conductive particles 8b is less than 0.1% by volume, excellent conductivity tends to be impaired, and if it exceeds 30% by volume, a short circuit occurs when used as an anisotropic conductive tape. It tends to be easier.
  • an inorganic filler may be added to the adhesive component 8a.
  • the inorganic filler is not particularly limited as long as it is, for example, a solid particulate inorganic compound.
  • Specific examples of the material of the inorganic filler include, for example, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, alumina, aluminum nitride, aluminum borate whisker, and nitride. Examples include boron, silica such as crystalline silica and amorphous silica, and antimony oxide.
  • An inorganic filler is used individually by 1 type or in combination of 2 or more types.
  • the anisotropic conductive tape 5 is wound around the core 1 so that the base material 6 faces the core side (inside), so that no inorganic filler is added to the adhesive layer 8 or Even if the blending amount is 20% by volume or less based on the volume of the adhesive layer 8, blocking can be sufficiently suppressed.
  • the inorganic filler content is more preferably 0 to 15% by volume, still more preferably 0 to 10% by volume.
  • the inorganic filler content is more preferably 0 to 40% by mass, and still more preferably 0 to 30% by mass. Since the specific gravity of an inorganic filler changes with kinds, it is preferable to set content based on mass to a suitable value according to the inorganic filler to be used. For example, when the inorganic filler is silica, blocking can be sufficiently suppressed even if the content based on the mass of the adhesive layer 8 is 35% by mass or less.
  • the silica content is more preferably 0 to 30% by mass, and still more preferably 0 to 20% by mass.
  • the inorganic filler is alumina
  • blocking can be sufficiently suppressed even if the content based on the mass of the adhesive layer 8 is 50% by mass or less.
  • the alumina content is more preferably 0 to 40% by mass, still more preferably 0 to 30% by mass.
  • the content of the inorganic filler can be easily calculated at the time of blending, but can be measured, for example, by the following method when measured from the state of the adhesive tape.
  • a crucible used for measurement is placed in an electric furnace (in an air environment) heated to 700 ° C. in advance and heated for 45 minutes.
  • the temperature of the electric furnace is returned to room temperature, and the mass of the crucible taken out from the electric furnace is quickly weighed in a desiccator.
  • the mass of the crucible or the like is measured to 3 decimal places (0.001 g) using a balance (Precision Electronic Balance UW series manufactured by Shimadzu Corporation).
  • This ash should contain an inorganic filler and conductive particles (metal). (7)
  • the type and content of conductive particles (metal content) contained in the ash are separately calculated by ICP emission spectroscopic analysis.
  • the ash is decomposed with a mixed acid of hydrofluoric acid and nitric acid to obtain a test solution.
  • the metal species contained in the test solution and the content thereof are quantitatively analyzed by an ICP emission spectroscopic analyzer (ICP-AES manufactured by Shimadzu Corporation).
  • the mixed acid is a mixture of hydrofluoric acid, nitric acid and water at a mass ratio of 1: 1: 1.
  • the mass of the conductive particles (metal component) calculated by this ICP emission spectroscopic analysis is subtracted from the mass of the ash obtained in (6) above to obtain the mass of the inorganic filler.
  • the content of the inorganic filler based on the volume is determined as follows. That is, the specific gravity of the ash extracted from the crucible and the specific gravity of the adhesive layer before heating were measured with a dry hydrometer (Shimadzu dry density meter Accupic II 1340 series) and detected by ICP emission spectroscopy. The theoretical specific gravity and content of the metal are subtracted from the ash, and the volume percentage of the inorganic filler relative to the original adhesive layer is calculated.
  • a coating liquid containing an adhesive component is used on a base film (the above-mentioned various materials can be used as a base, for example, a polyethylene terephthalate film).
  • the raw material of the anisotropic conductive film is produced by coating.
  • This raw fabric is cut into a tape shape so as to have a width suitable for the application.
  • a slit device described in JP-A-2003-285293 can be used.
  • the adhesive reel 10 is manufactured by winding the anisotropic conductive tape 5 having a predetermined width around the core of the reel component. At this time, in this embodiment, the anisotropic conductive tape 5 is wound around the core 1 so that the base material 6 faces the core 1 and the adhesive layer 8 faces the outside.
  • the first portion of the anisotropic conductive tape (winding start portion) to the core and wind it up.
  • this fixing method can use a well-known method, it can fix with an adhesive tape and an adhesive, for example.
  • a fastener and a notch part can also be provided and fixed to a winding core.
  • the adhesive layer 8 on the substrate 6 is previously removed from the last portion (the end portion of the winding) of the anisotropic conductive tape 5 to provide a blank portion, and the adhesive layer 8 is wound around the wound body. Exposure can be prevented.
  • another tape (similar to the base material can be exemplified) is prepared, and this is connected to the end of the base material 6 and wound around the wound body. May be. In addition to the above, contamination from the external environment can be suppressed by storing the adhesive reel 10 in a bag.
  • the circuit connector 100 shown in FIG. 5 includes a first circuit member 30 and a second circuit member 40 that face each other, and the first circuit member 30 and the second circuit member 40 are disposed between the first circuit member 30 and the second circuit member 40. A connecting portion 50a for connecting them is provided.
  • the first circuit member 30 includes a circuit board 31 and circuit electrodes 32 formed on the main surface 31 a of the circuit board 31.
  • the second circuit member 40 includes a circuit board 41 and circuit electrodes 42 formed on the main surface 41 a of the circuit board 41.
  • the circuit member include chip components such as a semiconductor chip (IC chip), a resistor chip, and a capacitor chip. These circuit members include circuit electrodes, and generally include a large number (at least two or more) of circuit electrodes. Specific examples of the other circuit member to which the circuit member is connected include a flexible substrate having metal wiring, a flexible printed wiring board, and a wiring substrate such as a glass substrate on which indium tin oxide (ITO) is deposited. It is done.
  • ITO indium tin oxide
  • the anisotropic conductive tape 5 drawn from the adhesive reel 10 the circuit members can be connected efficiently and with high connection reliability. Therefore, the anisotropic conductive tape 5 according to the present embodiment is suitable for COG mounting (Chip On Glass) or COF mounting (Chip On Flex) on a wiring board of a chip component having many fine connection terminals (circuit electrodes). It is.
  • each circuit electrode 32, 42 may be composed of one kind selected from gold, silver, tin, ruthenium, rhodium, palladium, osmium, iridium, platinum, and indium tin oxide (ITO), or two or more kinds. It may be comprised. Moreover, the material of the surface of the circuit electrodes 32 and 42 may be the same in all the circuit electrodes, or may be different.
  • connection portion 50a includes a cured product 8A of the adhesive component 8a included in the adhesive layer 8, and conductive particles 8b dispersed therein. And in the circuit connection body 100, the circuit electrode 32 and the circuit electrode 42 which oppose are electrically connected through the conductive particle 8b. That is, the conductive particles 8 b are in direct contact with both the circuit electrodes 32 and 42.
  • connection resistance between the circuit electrodes 32 and 42 is sufficiently reduced, and a good electrical connection between the circuit electrodes 32 and 42 becomes possible.
  • the cured product 8A has electrical insulation, and the insulation between adjacent circuit electrodes is ensured. Therefore, the flow of current between the circuit electrodes 32 and 42 can be made smooth, and the functions of the circuit can be fully exhibited.
  • FIG. 6 is a process diagram showing a schematic cross-sectional view of an embodiment of a method for manufacturing a circuit connector.
  • the adhesive layer 8 of the anisotropic conductive tape 5 is thermally cured, and finally the circuit connector 100 is manufactured.
  • the adhesive reel 10 is mounted on the rotating shaft of a connecting device (not shown).
  • the anisotropic conductive tape 5 is pulled out from the adhesive reel 10 so that the adhesive layer 8 faces downward.
  • the anisotropic conductive tape 5 is cut into a predetermined length and placed on the main surface 31a of the circuit member 30 (FIG. 6A).
  • pressure is applied in the directions of arrows A and B in FIG. 6A to temporarily fix the adhesive layer 8 to the first circuit member 30 (FIG. 6B).
  • the pressure at this time is not particularly limited as long as it does not damage the circuit member, but it is generally preferably 0.1 to 30.0 MPa.
  • you may pressurize, heating, and let heating temperature be the temperature which the adhesive bond layer 8 does not harden
  • the heating temperature is preferably 50 to 100 ° C. These heating and pressurization are preferably performed in the range of 0.1 to 2 seconds.
  • the adhesive layer 8 is arranged so that the second circuit member 40 faces the second circuit electrode 42 toward the first circuit member 30. Put it on top. And the whole is pressurized to the arrow A and B direction of FIG.6 (c), heating the adhesive bond layer 8.
  • FIG. The heating temperature at this time is set to a temperature at which the adhesive component 8a of the adhesive layer 8 can be cured.
  • the heating temperature is preferably 60 to 180 ° C, more preferably 70 to 170 ° C, and still more preferably 80 to 160 ° C. If the heating temperature is less than 60 ° C, the curing rate tends to be slow, and if it exceeds 180 ° C, unwanted side reactions tend to proceed.
  • the heating time is preferably 0.1 to 180 seconds, more preferably 0.5 to 180 seconds, and still more preferably 1 to 180 seconds.
  • connection part 50a is formed by hardening of the adhesive component 8a, and the circuit connection body 100 as shown in FIG. 5 is obtained.
  • the connection conditions are appropriately selected depending on the application to be used, the adhesive component, and the circuit member.
  • cured with light is used as an adhesive agent component of the adhesive bond layer 8, what is necessary is just to irradiate the adhesive bond layer 8 with an actinic ray or an energy ray suitably.
  • the active light include ultraviolet light, visible light, and infrared light.
  • energy rays include electron beams, X-rays, ⁇ rays, and microwaves.
  • the anisotropic conductive tape 5 when the anisotropic conductive tape 5 is wound around the core 1 so that the base material 6 faces the core side (inside), the anisotropic conductive tape 5 wound around the reel component is pulled out.
  • the peeling of the adhesive layer 8 from the substrate 6 can be suppressed at an extremely high level.
  • the anisotropic conductive tape 5 is illustrated as an adhesive tape for circuit connection.
  • the non-conductive tape in which the adhesive layer 8 is made of the adhesive component 8a and does not contain the conductive particles 8b is used as the core 1.
  • the adhesive reel may be produced by winding the conductive material 8 on the tape, or a conductive tape having no anisotropy in which the conductive particles 8b are blended more than the anisotropic conductive tape may be used.
  • an adhesive tape 15A shown in FIG. 8A includes an adhesive layer 18 having a multilayer structure.
  • the adhesive layer 18 includes a conductive particle non-containing layer 18a that does not contain conductive particles and a conductive particle-containing layer 18b that contains conductive particles.
  • an adhesive agent component of the conductive particle non-containing layer 18a and the conductive particle containing layer 18b the same adhesive component as that of the adhesive layer 8 described above can be used.
  • the adhesive layer 18 having the two-layer structure is used as a circuit connecting material, the decrease in the number of conductive particles on the circuit electrode due to the flow of the adhesive component can be sufficiently suppressed when the circuit members are joined to each other. .
  • the adhesive layer 18 is disposed so that the surface of the IC chip with the metal bumps and the conductive particle non-containing layer 18a are in contact with the substrate on which the IC chip is to be mounted and the conductive particle containing layer 18b, respectively. It is preferable to do.
  • the adhesive tape 15 ⁇ / b> B shown in FIG. 8B is provided with a pressure-sensitive adhesive layer 9 a between the substrate 6 and the adhesive layer 8 from the viewpoint of more reliably preventing the peeling of the adhesive layer 8. .
  • the adhesive tape 15 ⁇ / b> C shown in FIG. 8C is obtained by further laminating the pressure-sensitive adhesive layer 9 b on the adhesive layer 8 from the viewpoint of improving the sticking property to the circuit member.
  • Example 1 [Preparation of raw materials for adhesive components]
  • the following raw materials were prepared.
  • 50 g of thermoplastic phenoxy resin manufactured by Union Carbide Co., Ltd., trade name: PKHC, weight average molecular weight: 45000
  • 1 toluene (boiling point 110.6 ° C.)
  • ethyl acetate (boiling point 77.1 ° C.) It melt
  • urethane acrylate that is liquid at 30 ° C.
  • an adhesive film was prepared as follows. For 40 parts by mass of the phenoxy resin solution, 40 parts by mass of liquid urethane acrylate, 20 parts by mass of liquid dimethacrylate, and 4 parts by mass of radical generator were blended to obtain a mixed solution. To the liquid mixture, nickel powder (conductive particles) having an average particle diameter of 5 ⁇ m and silica powder (inorganic filler) having an average particle diameter of 0.5 ⁇ m are blended, and nickel powder and silica powder are dispersed in the liquid mixture. A coating solution was obtained.
  • the coating solution is applied to a PET film (carrier film) having a thickness of 80 ⁇ m, a width of 500 mm, and a silicone release treatment on both sides using a coating apparatus, and is applied to a length of 320 m, followed by drying at a furnace length of 15 m and a hot air temperature of 70 ° C. Drying was performed using a furnace at a speed of 3 m / min.
  • the nickel powder content of the adhesive layer after drying was 1.5% by volume, and the silica powder content was 15% by volume (26% by mass).
  • An adhesive layer having a thickness of about 0.6 mm was prepared by laminating 15 adhesive layers (thickness: 40 ⁇ m) of the adhesive film, and a sample cut into a size of 1 cm ⁇ 1 cm was used as a sample. The shear viscosity was measured. A shear viscoelasticity measuring device (manufactured by TA Instruments, trade name: ARES) was used for this measurement. As a result, the shear viscosity at 30 ° C. of the adhesive layer was 20000 Pa ⁇ s. The measurement conditions were as follows.
  • Measurement frequency 10 Hz Atmosphere: under nitrogen Temperature range: 0 ° C to 150 ° C, Temperature increase rate: 10 ° C / min, Probe diameter: 8mm Sample size: 10 mm x 10 mm, Sample thickness: about 0.6 mm, Measurement strain: 1.0%.
  • the adhesive film was cut into a width of 1.5 mm using a roll-to-roll slit facility, and an adhesive tape was wound up on a reel part (core outer diameter: 66 mm, plastic molded product) to a length of 300 m. At this time, it wound up so that the base material which consists of PET might face the core side (inner side), and the adhesive bond layer might face the outer side.
  • Reel side plates are provided on both sides of the winding core, and the gap distance between the reel side plate and the wound tape of the adhesive tape is in the range of about 0.1 mm to 0.5 mm on each side. It was in.
  • a reel component having a reel side plate provided with a rib structure portion 2b extending radially as shown in FIG. 1 is used.
  • the rib structure portion extending radially as shown in FIG. Even if a reel part having a reel side plate not provided is used, the effect of the present invention can be obtained.
  • Example 2 [Preparation of raw materials for adhesive components]
  • the following raw materials were prepared. 50 g of thermoplastic phenoxy resin (manufactured by Union Carbide Co., Ltd., trade name: PKHC, weight average molecular weight: 45000), 1: 1 toluene (boiling point 110.6 ° C.) and ethyl acetate (boiling point 77.1 ° C.) It melt
  • an epoxy resin an epoxy resin that is liquid at 30 ° C.
  • an adhesive film was prepared as follows. 60 parts by mass of epoxy resin YL-980 that is liquid at 30 ° C., 5 parts by mass of epoxy resin 1032H60 that is solid at 30 ° C., and 4 parts by mass of curing agent SI-60 with respect to 35 parts by mass of the phenoxy resin solution A liquid mixture was obtained by blending. A nickel powder having an average particle diameter of 5 ⁇ m and a silica powder having an average particle diameter of 0.5 ⁇ m were blended with the mixed liquid to obtain a coating liquid in which the nickel powder and the silica powder were dispersed in the mixed liquid.
  • the coating solution is applied to a PET film having a thickness of 80 ⁇ m, a width of 500 mm, and a silicone release treatment on both sides using a coating apparatus with a length of 320 m, and a drying furnace having a furnace length of 15 m and a hot air temperature of 70 ° C. Drying was performed at a speed of 3 m / min.
  • the nickel powder content of the adhesive layer after drying was 1.5% by volume, and the silica powder content was 15% by volume (26% by mass).
  • Example 3 an adhesive reel was produced in the same manner as in Example 1. In order to make it easier for the adhesive to ooze out from the side surface of the wound body, a constant temperature is applied in the same manner as in Example 1 except that a weight of 50 g is installed at the tip of the adhesive tape and tension of the winding is applied to the entire wound body. The sample was left standing in the tank for 24 hours. Then, when the state of the side surface was observed with a microscope, it was confirmed that the adhesive that exuded from the side surface of the wound body was adhered to the reel side plate. Next, this adhesive reel was subjected to an unwinding test with a total length of 300 m at a speed of 1 m per second. As a result, the adhesive layer peeled off from the substrate never occurred.
  • Example 4 In place of the adhesive reel manufactured in the same manner as in Example 1, an adhesive reel manufactured in the same manner as in Example 2 was used. A weight was installed and the adhesive reel was left in a thermostat. Then, when the state of the side surface was observed with a microscope, it was confirmed that the adhesive that exuded from the side surface of the wound body was adhered to the reel side plate. Next, this adhesive reel was subjected to an unwinding test with a total length of 300 m at a speed of 1 m per second. As a result, the adhesive layer peeled off from the substrate never occurred.
  • Example 5 The adhesive reel manufactured in the same manner as in Example 1 was set in the thermostatic chamber as in Example 1 except that the temperature of the thermostatic chamber was set to 40 ° C instead of 35 ° C. I left it alone. Then, when the state of the side surface was observed with a microscope, it was confirmed that the adhesive that exuded from the side surface of the wound body was adhered to the reel side plate. Next, this adhesive reel was subjected to an unwinding test with a total length of 300 m at a speed of 1 m per second. As a result, the adhesive layer peeled off from the substrate never occurred.
  • Example 1 An adhesive reel was prepared in the same manner as in Example 1 except that the adhesive tape was wound around the core so that the base material faced the outside and the adhesive layer faced the core side (inside). The sample was left standing for 24 hours in a constant temperature bath at 35 ° C. Then, when the state of the side surface was observed with a microscope, it was confirmed that the adhesive that exuded from the side surface of the wound body was adhered to the reel side plate. Next, when this unwinding reel was subjected to an unwinding test with a total length of 300 m at a speed of 1 m per second, 15 defects occurred in which the adhesive layer peeled off from the substrate.
  • Example 2 An adhesive reel was prepared in the same manner as in Example 2 except that the adhesive tape was wound around the core so that the base material faced the outside and the adhesive layer faced the core side (inside). The sample was left standing for 24 hours in a constant temperature bath at 35 ° C. Then, when the state of the side surface was observed with a microscope, it was confirmed that the adhesive that exuded from the side surface of the wound body was adhered to the reel side plate. Next, when this unwinding reel was subjected to an unwinding test with a total length of 300 m at a speed of 1 m per second, a defect in which the adhesive layer peeled off from the substrate occurred 17 times.

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  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)
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JP2016150982A (ja) * 2015-02-18 2016-08-22 株式会社ホンマ コーナー部用粘着テープ

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CN102712834A (zh) 2012-10-03
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KR20120113803A (ko) 2012-10-15
CN104403589B (zh) 2017-01-11
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TW201139259A (en) 2011-11-16
JP5928567B2 (ja) 2016-06-01
CN102712834B (zh) 2014-11-26
CN104403589A (zh) 2015-03-11
JPWO2011111784A1 (ja) 2013-06-27
JP2014037544A (ja) 2014-02-27

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