WO2011049133A1 - 基板支持装置、基板支持部材、基板搬送装置、露光装置、及びデバイス製造方法 - Google Patents

基板支持装置、基板支持部材、基板搬送装置、露光装置、及びデバイス製造方法 Download PDF

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Publication number
WO2011049133A1
WO2011049133A1 PCT/JP2010/068499 JP2010068499W WO2011049133A1 WO 2011049133 A1 WO2011049133 A1 WO 2011049133A1 JP 2010068499 W JP2010068499 W JP 2010068499W WO 2011049133 A1 WO2011049133 A1 WO 2011049133A1
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WIPO (PCT)
Prior art keywords
substrate
support
placement
tray
board
Prior art date
Application number
PCT/JP2010/068499
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English (en)
French (fr)
Japanese (ja)
Inventor
國博 河江
忠 関
宗泰 横田
清 小暮
Original Assignee
株式会社ニコン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ニコン filed Critical 株式会社ニコン
Priority to KR1020127010331A priority Critical patent/KR101925151B1/ko
Priority to JP2011537283A priority patent/JPWO2011049133A1/ja
Priority to CN201080046237.3A priority patent/CN102648518B/zh
Publication of WO2011049133A1 publication Critical patent/WO2011049133A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

Definitions

  • the present invention relates to a substrate support apparatus, a substrate support member, a substrate transport apparatus, an exposure apparatus, and a device manufacturing method.
  • the present application claims priority based on US Provisional Application No. 61 / 272,677 filed on October 20, 2009, and Japanese Patent Application No. 2010-002005 filed on January 7, 2010. Is hereby incorporated by reference.
  • processing apparatuses for large substrates such as exposure apparatuses and inspection apparatuses are used.
  • a transport apparatus as disclosed in the following patent document that transports a large substrate (for example, a glass substrate) to the processing apparatus is used.
  • the substrate and the substrate support member are separately supported when the substrate held in the carry-in / out section is transferred to the substrate support member (substrate support device). Therefore, depending on the substrate support method, the substrate may be bent downward by its own weight. When the substrate bent by its own weight is transferred to the substrate support member, the portion bent below the substrate contacts the substrate support member, and the substrate is bent on the substrate support member due to the friction of the contacted portion. The state is maintained.
  • An object of the present invention is to provide a substrate support member, a substrate transport apparatus, an exposure apparatus, and a device manufacturing method that can eliminate the bending of the substrate that occurs during the delivery of the substrate.
  • a substrate support device for supporting a substrate, wherein the substrate is placed on the placement portion, and protrudes from the placement portion and placed on the placement portion. At least one support part for supporting a part of the substrate, wherein the support part is fixed to the mounting part, and is provided movably with respect to the base part. There is provided a substrate support device having an abutting portion that abuts on the substrate placed on the placing portion.
  • a substrate transfer device for transferring a substrate, the substrate support device supporting the substrate, and a transfer unit that holds and moves the substrate support device.
  • a substrate transfer apparatus is provided.
  • an exposure apparatus that exposes the substrate by irradiating the substrate held by the substrate holder with exposure light, wherein the substrate transport apparatus transports the substrate to the substrate holder.
  • An exposure apparatus is provided.
  • a device manufacturing method comprising: exposing the substrate using the exposure apparatus described above; and processing the exposed substrate based on an exposure result. Is done.
  • a substrate support member for supporting a substrate, the mounting portion being supported on both sides in a state where the substrate is mounted, and protruding from the mounting portion.
  • a plurality of support parts for supporting a part of the substrate placed on the placement part, and the installation density of the support parts on the outer edge side of the placement part is a center side of the placement part
  • a substrate support member having a density higher than the installation density of the support portions is provided.
  • a substrate transfer apparatus for transferring a substrate, comprising: the substrate support member that supports the substrate; and a transfer unit that holds and moves the substrate support member.
  • a substrate transfer apparatus is provided.
  • an exposure apparatus that exposes the substrate by irradiating exposure light onto a substrate held by the substrate holder, wherein the substrate transport apparatus transports the substrate to the substrate holder.
  • An exposure apparatus is provided.
  • a device manufacturing method comprising: exposing the substrate using the exposure apparatus described above; and processing the exposed substrate based on an exposure result. Is done.
  • FIG. 17B is a cross-sectional view taken along the line B-B ′ of FIG. 17A.
  • FIG. 17B is a cross-sectional view taken along the line C-C ′ of FIG. 17A.
  • FIG. 5 is an enlarged side view of an outer edge support portion. It is the top view seen from the B direction of FIG. 18A.
  • FIG. 18B is a cross-sectional view taken along the line C-C ′ of FIG. 18A.
  • Embodiments of the present invention will be described with reference to the drawings. Note that the present invention is not limited to this.
  • an exposure apparatus that includes the substrate transport apparatus according to the present invention and performs an exposure process for exposing a liquid crystal display device pattern to a substrate coated with a photosensitive agent will be described, and a substrate support apparatus according to the present invention ( A substrate support member) and an embodiment of a device manufacturing method will also be described.
  • FIG. 1 is a cross-sectional plan view showing a schematic configuration of the exposure apparatus of the present embodiment.
  • the exposure apparatus 1 includes an exposure apparatus main body 3 that exposes a liquid crystal display device pattern on a substrate, a transport robot (transport section) 4, a carry-in / out section (transport section) 5, and a tray (substrate support apparatus, substrate support member). And a substrate transfer device 7, which are housed in a chamber 2 that is highly cleaned and adjusted to a predetermined temperature.
  • the substrate is a large glass plate, and the size of one side thereof is, for example, 500 mm or more.
  • FIG. 2 is an external perspective view of the exposure apparatus main body 3 and the transfer robot 4 that transfers the substrate P to the exposure apparatus main body 3.
  • the exposure apparatus main body 3 is disposed below the mask stage, an illumination system (not shown) that illuminates the mask M with the exposure light IL, a mask stage (not shown) that holds the mask M on which the liquid crystal display device pattern is formed.
  • the two-dimensional movement of the substrate holder 9 with respect to the base 8 is performed in a horizontal plane, and the X axis and the Y axis are set in directions orthogonal to each other in the horizontal plane.
  • the holding surface of the substrate holder 9 with respect to the substrate P is parallel to the horizontal plane in a reference state (for example, a state when the substrate P is transferred).
  • the Z axis is set in a direction orthogonal to the X axis and the Y axis, and the optical axis of the projection optical system PL is parallel to the Z axis.
  • the directions around the X, Y, and Z axes are referred to as the ⁇ X direction, the ⁇ Y direction, and the ⁇ Z direction, respectively.
  • the moving mechanism 33 includes a moving mechanism main body 35 and a plate table 34 that is disposed on the moving mechanism main body 35 and holds the substrate holder 9.
  • the moving mechanism body 35 is supported by the gas bearing in a non-contact manner on the guide surface 8a (the upper surface of the base 8), and can move on the guide surface 8a in the XY directions.
  • the exposure apparatus main body 3 can move within a predetermined region of the guide surface 8a on the light emission side (image surface side of the projection optical system PL) while holding the substrate P.
  • the moving mechanism main body 35 can move in the XY plane on the guide surface 8a by the operation of a coarse movement system (moving mechanism) including an actuator such as a linear motor.
  • the plate table 34 is movable in the Z-axis, ⁇ X, and ⁇ Y directions with respect to the moving mechanism body 35 by the operation of a fine movement system including an actuator such as a voice coil motor.
  • the plate table 34 is moved in six directions including the X axis, the Y axis, the Z axis, the ⁇ X, the ⁇ Y, and the ⁇ Z directions while holding the substrate P by the operation of the substrate stage driving system including the coarse movement system and the fine movement system. It is movable.
  • the transfer robot 4 is for transferring the substrate P to the exposure apparatus main body 3 and the loading / unloading unit 5.
  • the transfer robot 4 holds both side portions 18 and 18 of the tray (substrate support device) T, and transfers the substrate P by moving the substrate P placed on the tray T together with the tray T.
  • the substrate P is delivered to the carry-in / out unit 5.
  • the exposure apparatus 1 performs step-and-scan exposure with the rectangular substrate P placed on the substrate holder 9 and forms the mask M shown in FIG.
  • the formed pattern is sequentially transferred to a plurality of, for example, four exposure areas (pattern transfer areas) on the substrate P. That is, in the exposure apparatus 1, the slit M on the mask M is illuminated by the exposure light IL from the illumination system, and the mask M is moved by a controller (not shown) via a drive system (not shown).
  • the pattern of the mask M in one exposure region on the substrate P is obtained by moving the holding mask stage and the substrate holder 9 holding the substrate P in synchronization in a predetermined scanning direction (here, the Y-axis direction). Is transferred, that is, scanning exposure is performed.
  • the exposure apparatus 1 is a so-called multi-lens scan in which the projection optical system PL includes a plurality of projection optical modules, and the illumination system includes a plurality of illumination modules corresponding to the plurality of projection optical modules. It constitutes an exposure apparatus.
  • a stepping operation is performed in which the substrate holder 9 is moved in the X direction by a predetermined amount to the scanning start position of the next exposure area.
  • the pattern of the mask M is sequentially transferred to the four exposure regions by repeatedly performing such scanning exposure and stepping operation.
  • the transfer robot 4 has, for example, a horizontal joint type structure, and is connected to the arm portion 10 composed of a plurality of portions connected via a vertical joint axis, and the tip of the arm portion 10.
  • the conveyance hand 12 and the drive device 13 are provided.
  • the arm unit 10 can be moved, for example, in the vertical direction (Z-axis direction) by the driving device 13.
  • the driving of the driving device 13 is controlled by a control device (not shown).
  • the transport hand 12 is provided in a substantially U-shaped shape with an open front end portion, and both side portions (held portions) 18 in the longitudinal direction (long side direction of the substrate P) of the tray T on which the substrate P is placed, By supporting 18 in a support direction parallel to the long side of the tray T, the substrate P can be held via the tray T.
  • FIG. 3 is a perspective view for explaining the operation of the transfer robot 4.
  • the transfer robot 4 changes the direction of the transfer hand 12 so that the longitudinal direction of the transfer hand 12 (long side direction of the substrate P) faces the substrate holder 9 side of the exposure apparatus main body 3. Be able to.
  • the transfer robot 4 delivers the substrate P to the substrate holder 9.
  • the transfer robot 4 is provided below the transfer hand 12, has the same mechanism as the transfer hand 12, and can be independently driven. It has a double arm structure with Further, the transfer robot 4 is not limited to a horizontal joint type robot, and can be realized by appropriately adopting or combining known robots (generally, a transfer mechanism).
  • FIG. 4 is a side view showing a schematic configuration of the carry-in / out section 5.
  • the carry-in / out section 5 is configured to receive the substrate P which has been coated with a photosensitive agent and conveyed by a coater / developer (not shown) disposed adjacent to the exposure apparatus 1.
  • the carry-in / out unit 5 includes a substrate support unit 51 that supports the substrate P and a tray support unit 52 that supports the tray T.
  • the substrate support portion 51 includes a flat plate-like first support portion 51a and a plurality of substrate support pins (support pins) 51b that are provided on the first support portion 51a and support different portions of the lower surface of the substrate P. It has.
  • the state substantially along the horizontal plane means that, for example, the substrate P is bent when supported by the substrate support pins 51b, the positioning error of the substrate support pins 51b, the allowable tolerance of the substrate P, etc. are ignored. This means that the substrate surface is substantially parallel to the horizontal plane.
  • Each of the substrate support pins 51b has a lower end portion fixed to the first support portion 51a and an upper end portion (upper end surface) provided so as to support the substrate P.
  • a suction hole connected to a vacuum pump (not shown) is provided on the upper end surface of the substrate support pin 51b so that the substrate P can be sucked and held.
  • a substrate detection unit (not shown) that detects whether or not the substrate P is placed on the substrate support pin 51b is provided at the upper end of the substrate support pin 51b.
  • the substrate support unit 51 is connected to the drive unit 54 via a connecting member 53.
  • the drive unit 54 is movable in the XY plane and the ⁇ Z direction on the base unit 55 by operation of a drive system including a coarse motion system and a fine motion system, for example.
  • a drive system including a coarse motion system and a fine motion system, for example.
  • the tray support portion 52 is a frame-shaped second support portion 52a and a plurality of tray support pins (second support pins) that are provided on the second support portion 52a and support different portions of the lower surface of the tray T. 52b.
  • Each of the tray support pins 52b has a lower end portion fixed to the second support portion 52a and an upper end portion (upper end surface) provided so as to support the tray T.
  • the tray support pins 52b are disposed outside the first support portion 51a of the substrate support portion 51.
  • a tray detection unit (not shown) that detects whether or not the tray T is placed on the tray support pin 52b is provided at the upper end of the tray support pin 52b.
  • the tray support portion 52 is provided so as to be movable in the Z-axis direction along the guide portion 56 by the operation of a drive unit (not shown).
  • the guide unit 56 is provided outside the drive unit 54 and the base unit 55 of the substrate support unit 51.
  • the first support part 51a, the connecting member 53, and the drive part 54 of the substrate support part 51 are disposed inside the frame-shaped second support part 52a.
  • a support mechanism that supports the tray T and moves the tray T relative to the substrate P is configured by the tray support portion 52, the guide portion 56, and a drive unit (not shown).
  • the tray support portion 52 can move in the Z-axis direction without interfering with the first support portion 51 a, the connecting member 53, and the drive portion 54 of the substrate support portion 51.
  • the tray support portion 52 moves up in the positive direction of the Z axis to raise the tray T supported by the tray support pins 52b in the positive direction of the Z axis and is supported on the substrate support pins 51b of the substrate support portion 51.
  • the substrate P is placed on the tray T.
  • the tray support unit 52 is configured to deliver the tray T supported by the tray support pins 52 b to the transport hand 12 of the transport robot 4.
  • FIG. 5 is a plan view showing a planar structure of the tray T.
  • the tray T includes a mounting portion 20 formed in a lattice shape by a plurality of linear members 19 stretched at predetermined intervals in the vertical and horizontal directions. That is, the portion of the placement unit 20 where the linear member 19 is not disposed is a rectangular opening 21.
  • the placement unit 20 is configured to place the substrate P at a predetermined position between both side portions 18 and 18.
  • the shape of the tray T is not limited to the shape shown in FIG. 5.
  • the tray T is a frame-shaped single frame that supports only the peripheral edge of the substrate P and has only one opening 21. Also good.
  • the substrate P is arranged so that the long side is parallel to the both side portions 18 of the placement portion 20.
  • the placement unit 20 is configured such that both sides 18 and 18 are supported from below by the transport hand 12 of the transport robot 4 while the substrate P is placed (see FIGS. 2 and 3). That is, the transfer robot 4 in the present embodiment supports the substrate P via the tray T and transfers the substrate P to a predetermined position.
  • the tray T is configured such that the lower surface of the mounting portion 20 is supported by a plurality of tray support pins 52b of the tray support portion 52 of the carry-in / out portion 5 shown in FIG. Further, the tray T has a plurality of substrate support pins 51b of the substrate support portion 51 in a plurality of openings shown in FIG. 5 in a state where the lower surface of the placement portion 20 is supported by the tray support pins 52b as shown in FIG. It is made to pass through the portion 21.
  • the material for forming the tray T it is preferable to use a material capable of suppressing the bending due to the weight of the substrate P when the tray T supports the substrate P.
  • various synthetic resins or metals are used. Can do. Specific examples include nylon, polypropylene, AS resin, ABS resin, polycarbonate, fiber reinforced plastic, and stainless steel. Examples of the fiber reinforced plastic include GFRP (Glass Fiber Reinforced Plastic) and CFRP (Carbon Fiber Reinforced Plastic).
  • the linear member 19 stretched around in a lattice shape may be formed using a member having excellent flexibility such as a wire.
  • a groove 30 for holding the tray T is formed on the upper surface of the substrate holder 9.
  • the groove portions 30 are provided in a lattice shape corresponding to the frame structure of the tray T.
  • a plurality of holding portions (holder portions) 31 for the substrate P are provided in an island shape by forming the groove portion 30 on the upper surface of the substrate holder 9.
  • the holding unit 31 has a size corresponding to the opening 21 of the tray T.
  • the upper surface of the holding part 31 is finished so that the substantial holding surface of the substrate holder 9 with respect to the substrate P has good flatness.
  • a plurality of suction holes K are provided on the upper surface of the holding portion 31 for bringing the substrate P into close contact with the surface (see FIG. 2).
  • Each suction hole K is connected to a vacuum pump (not shown).
  • FIG. 6 is a partial side sectional view showing a state where the tray T is accommodated in the groove portion of the substrate holder 9. As shown in FIG. 6, the thickness of the tray T is smaller than the depth of the groove 30. As a result, the tray T is inserted into the groove 30 and sinks, so that the holding portion 31 is protruded from the opening 21, and only the substrate P placed on the tray T is received by the holding portion 31. It is supposed to be passed.
  • Conical concave portions 41 are formed at the four corners on the lower surface side of the placement portion 20 of the tray T, and spherical convex portions 42 that engage with the concave portions 41 are provided at positions corresponding to the concave portions 41 in the groove portion 30. It has been.
  • the tray T is misaligned with respect to the tray T accommodated in the groove portion 30 by engaging the convex portion 42 of the substrate holder 9 in the concave portion 41 of the placement portion 20 when the placement portion 20 is inserted into the groove portion 30. Is to prevent.
  • FIG. 7 is an enlarged side sectional view of the support movable part (support part) TM provided in the tray T.
  • a support movable portion supporting portion, protruding portion, auxiliary portion
  • the support movable part TM is mainly configured by a base part 22, an abutting part 23 disposed to face the base part 22, and a connecting part 24 disposed between the base part 22 and the abutting part 23. .
  • the base portion 22 and the contact portion 23 are made of the same material as that of the placement portion 20, for example.
  • the connecting portion 24 for example, sorbosein (registered trademark), ⁇ GEL (registered trademark), or the like, which has viscosity and elasticity, can be deformed by applying an external force and can be restored to an initial shape by removing the external force. Elastic materials can be used.
  • the base 22 has a lower surface fixed to the upper surface 20 a of the placement unit 20 and an upper surface fixed to the lower surface of the connection unit 24 by, for example, an adhesive.
  • the lower surface of the contact portion 23 is fixed to the upper surface of the connection portion 24 by, for example, an adhesive, and is connected to the base portion 22 through the connection portion 24. Further, the upper surface of the contact portion 23 is in contact with a part (supported surface) of the substrate P placed on the upper surface 20 a of the placement portion 20 to support the lower surface of the substrate P.
  • the height from the upper surface 20a of the mounting part 20 to the upper surface of the contact part 23 is, for example, about 1.0 mm to 1.5 mm.
  • the support movable part TM is configured such that when an external force is applied to the contact part 23, the connection part 24 is deformed in the direction of the external force, and the contact part 23 moves relative to the base part 22.
  • the contact portion 23 is provided so as to move along the direction when an external force is applied in a direction along the upper surface 20a of the placement portion 20.
  • the contact portion 23 is provided so as to move in the direction of the upper surface 20a when an external force is applied in a direction intersecting the upper surface 20a. That is, the connection part 24 connects the base part 22 and the contact part 23 so as to be able to move relative to each other.
  • the direction along the upper surface 20a includes a direction parallel to the upper surface 20a (direction in the XY plane) and a direction along the surface of the substrate P placed on the upper surface 20a of the placement unit 20.
  • the direction intersecting the upper surface 20a includes a direction perpendicular to the upper surface 20a (Z direction), a direction intersecting with the surface of the substrate P placed on the upper surface 20a of the placement unit 20, and a perpendicular direction.
  • connection part 24 of the support movable part TM may be configured to include a limiting part such as a stopper that restricts the movable range of the contact part 23 with respect to the base part 22 within a predetermined range.
  • FIG. 8 is a plan view of the tray T showing the arrangement of the support movable part TM.
  • a hatched portion that is displayed so as to overlap with the placement portion 20 indicates the position of the support movable portion TM.
  • the size of the hatched portion does not correspond to the size of the support movable portion TM.
  • a plurality of support movable parts TM are arranged in a region where the substrate P is placed on the upper surface 20 a of the placement part 20.
  • the contact part 23 can contact a part of the substrate P placed on the placement part 20, the support movable part TM can be a member outside the region where the substrate P is placed, It may be fixed to a member other than the placement unit 20.
  • the support movable portion TM is not disposed, and a contact area CA for bringing the upper surface 20a into direct contact with the substrate P is provided.
  • the contact area CA is formed as a substantially rectangular area extending in a direction parallel to the support direction (long side direction of the substrate P) of the both side portions 18 and 18 of the placement unit 20 by the transport hand 12 shown in FIG. Yes.
  • the contact area CA is an area for positively contacting the placed substrate P, and the upper surface 20a of the placement unit 20 is in contact with the substrate P in areas other than the contact area CA. Further, as shown in FIG.
  • the support movable unit TM is arranged so that the contact area CA side of the center of the placement unit 20 is sparse and the outer edge side of the placement unit 20 is dense. In other words, the interval between the support movable portions TM arranged on the center side of the placement portion 20 is wider than the interval between the support movable portions TM arranged on the outer edge side of the placement portion 20.
  • a plurality of support movable portions TM are arranged in a frame shape on the placement unit 20 so as to extend along the short side and the long side of the substrate P to be placed in the region where the substrate P is placed. . Further, inside the plurality of support movable parts TM arranged in a frame shape, a plurality of support movable parts arranged in a line along the support direction of the placement part 20 along the side parts 18, 18 of the placement part 20. A plurality of columns made of TM are provided. In the rows of these support movable portions TM, the interval between the rows arranged on the center side of the placement portion 20 is wider than the interval between the rows arranged on the outer edge side of the placement portion 20.
  • Such an arrangement of the support movable portion TM is determined according to, for example, the bending shape of the substrate P supported by the substrate support pins 51b of the carry-in / out portion 5 shown in FIG.
  • FIG. 9 is a plan view showing the deflection of the substrate P supported by the substrate support pins 51b shown in FIG.
  • the lighter the color the more the substrate P is bent downward (in the negative direction of the Z axis in FIG. 4).
  • the lower surface side of the substrate P is supported by a total of 30 substrate support pins 51b arranged in a 5 ⁇ 6 matrix. Therefore, the center part and outer edge part of the board
  • the portion along the long side of the substrate P is bent most downward, and then the portion along the short side and the central portion parallel to the short side are bent downward.
  • the support movable portion TM is intensively arranged at positions corresponding to a portion along the long side and a portion along the short side of the substrate P where the substrate P is largely bent according to the bending shape of the substrate.
  • the elastic coefficient of the connection part 24 shown in FIG. 7 is adjusted according to the position on the mounting part 20, and the substrate P in a bent state as shown in FIG. It is movably provided so as to release the stress of the substrate P when it comes into contact.
  • the elastic coefficient of the connecting portion 24 is such that when the substrate P in a bent state as shown in FIG. 9 comes into contact with the mounting portion 20 in a state where the support movable portion TM is not provided, the mounting portion 20.
  • the frictional force acting between the upper surface 20a and the substrate P can be set as a reference.
  • the elastic coefficient of the connecting portion 24 is set so that the elastic force in the direction along the upper surface 20a of the mounting portion 20 acting on the substrate P from the contact portion 23 is smaller than the above-described friction force. be able to.
  • the support movable parts TM arranged densely have a smaller elastic coefficient of the connection part 24 than the support movable parts TM arranged sparsely.
  • a plurality of support movable parts TM are used. However, depending on the size of the substrate P, the shape when bent, the size of the support movable part TM, etc., a configuration using one support movable part TM is used. It may be.
  • the operation of the exposure apparatus 1 will be described. Specifically, a method (substrate transport apparatus) for carrying in and carrying out the substrate P by transporting the substrate P placed on the tray T together with the tray T by the transport robot 4 will be described. Here, a procedure for placing the substrate P on the tray T and carrying the substrate P placed on the tray T into and out of the exposure apparatus main body 3 will be described.
  • the substrate P coated with the photosensitive agent is conveyed from the coater / developer to the carry-in / out unit 5 shown in FIG. 1, and is positioned and placed at a predetermined position on the substrate support pins 51b of the substrate support unit 51 shown in FIG. Then, it is sucked and held on the upper surface of the substrate support pin 51b. As described above, the substrate P supported by the plurality of substrate support pins 51b is in a state where the portion not supported by the substrate support pins 51b is bent downward as shown in FIG.
  • the substrate support portion 51 When the substrate P is sucked and held on the upper surface of the substrate support pin 51b, the substrate support portion 51 operates the driving unit 54 in a state where the substrate P is sucked and held on the upper surface of the substrate support pin 51b, and the tray T The substrate P is aligned.
  • the carry-in / out section 5 raises the tray support section 52 along the guide section 56 and raises the tray T on the tray support pins 52b. Thereby, the board
  • Parts (a), (b), and (c) of FIG. 10 are schematic diagrams for explaining a process of delivering the substrate P0 from the carry-in / out unit 500 of the conventional exposure apparatus to the conventional tray T0.
  • the substrate P0 supported by the plurality of substrate support pins 510b is in a state where a portion not supported by the substrate support pins 510b is bent downward. In this state, the tray support portion 520 is raised and the tray T0 supported by the tray support pins 520b is raised.
  • the substrate P0 is placed on the tray T0, and the substrate P0 is transferred from the substrate support pin 510b of the loading / unloading unit 500 to the tray T0.
  • the substrate P0 comes into contact with the tray T0 from the downwardly bent portion, and the substrate P cannot be spread on the tray T0 due to friction between the portion and the tray T0, and is bent so as to wave. Is maintained.
  • the transfer hand 1200 of the transfer robot 400 arranged below the tray T0 is raised.
  • both sides of the tray T0 are held by the transport hand 1200, and the tray T0 is lifted above the tray support pins 520b with the substrate P0 placed thereon. Since both sides of the tray T0 are supported, due to the weight of the substrate P0 and the tray T0, the middle part of both sides supported by the transport hand 1200 is bent downward. Then, the substrate P0 is warped so that the central portion protrudes downward, and stress that is compressed toward the central portion acts, and the planar area of the substrate P0 viewed from above is reduced. Thereafter, the transport hand 1200 is moved to transport the tray T0 on which the substrate P0 is placed toward the upper side of the substrate holder 900 shown in FIG.
  • FIG. 11 is a schematic diagram for explaining a process of transferring the substrate P0 from the conventional tray T0 to the substrate holder 900 of the conventional exposure apparatus.
  • the transport hand 1200 is lowered.
  • the tray T0 is accommodated in the groove 300 of the substrate holder 900, and the substrate P0 is placed on the substrate holder 900.
  • substrate P0 contacts the board
  • the substrate P0 is placed on the substrate holder 900, and the substrate P0 is transferred from the tray T0 to the substrate holder 900.
  • the tray T0 comes into contact with the bottom of the groove 300 of the substrate holder 900, and the tray T0 is transferred from the transport hand 1200 to the groove 300 of the substrate holder 900.
  • the bent shape of the substrate P0 is not completely restored, and the plane area of the substrate P0 is reduced as compared with the case where the substrate P0 is completely flat.
  • the substrate P0 is bent on the substrate holder 900, and there may be a problem of exposure failure such that predetermined exposure cannot be performed at an appropriate position on the substrate. is there.
  • Parts (a), (b), and (c) of FIG. 12 are schematic diagrams for explaining a process of transferring the substrate P from the carry-in / out part 5 of the exposure apparatus 1 of the present embodiment to the tray T.
  • the substrate P supported by the plurality of substrate support pins 51 b is in a state where a portion not supported by the substrate support pins 51 b is bent downward.
  • the tray support 52 is raised, and the tray T supported by the tray support pins 52b is raised.
  • the substrate P is placed on the tray T, and the substrate P is transferred from the substrate support pin 51b of the loading / unloading unit 5 to the tray T.
  • the central portion of the substrate P bent downward comes into contact with the tray T in the contact area CA where the support movable portion TM in the central portion of the tray T is not disposed.
  • the outer edge portion of the substrate P bent downward is in contact with the support movable portion TM provided on the tray T.
  • the contact portion 23 of the movable support portion TM is provided so as to be movable in a direction intersecting the upper surface 20a of the placement portion 20 of the tray T. It can move to the mounting part 20 side at the time of contact, and can reduce the impact at the time of contact with the substrate P.
  • the contact portion 23 of the support movable portion TM is provided so as to be movable in a direction along the upper surface 20a of the placement portion 20 of the tray T. Further, the central portion of the substrate P is in contact with the upper surface 20a of the placement portion 20 in the contact area CA. For this reason, as shown in FIG. 12B, the central portion of the substrate P is not displaced with respect to the tray T due to the friction between the upper surface 20a of the placement portion 20 and the substrate P, and the movable support portion TM. The outer edge portion of the substrate P that has come into contact with the base plate moves so as to spread outward from the central portion.
  • the elastic coefficient of the connection part 24 when the elastic coefficient of the connection part 24 is adjusted according to the position on the mounting part 20, and the board
  • the substrate P is adjusted to a temperature at which the exposure process is performed. Next, the transfer hand 12 of the transfer robot 4 arranged below the tray T is raised.
  • both side portions 18 and 18 (see FIGS. 2 and 5) of the tray T are held by the transport hand 12, and the tray support pins 52b are placed in a state where the substrate T is placed on the tray T. Is lifted upward. Since both sides 18 and 18 of the tray T are supported, the space between the sides 18 and 18 supported by the transport hand 12 is bent downward due to the weight of the substrate P and the tray T.
  • the transfer robot 4 changes the direction of the transfer hand 12 so that the longitudinal direction of the transfer hand 12 (long side direction of the substrate P) faces the substrate holder 9 side of the exposure apparatus body 3. . Thereafter, the transport hand 12 is moved, and the tray T0 on which the substrate P is placed is transported upward toward the substrate holder 9 shown in FIG.
  • the transport hand 12 transports the substrate P so that the surface of the substrate P and the holding portion 31 of the substrate holder 9 are substantially parallel.
  • substantially parallel means that the substrate P is in a parallel or nearly parallel state when the deflection of the substrate P due to its own weight is excluded.
  • the transport hand 12 transports the substrate P so that the held portion of the substrate P by the transport hand 12 and the substrate placement surface of the holding unit 31 are substantially parallel.
  • FIG. 13 is a schematic diagram for explaining a process of transferring the substrate P from the tray T of the present embodiment to the substrate holder 9 of the exposure apparatus 1.
  • the transfer robot 4 transfers the substrate P to the upper side of the substrate holder 9 by the transfer hand 12 and aligns the tray T with the groove part 30, and then, FIG. The drive device 13 shown is driven, and the conveyance hand 12 is lowered.
  • the tray T is accommodated in the groove 30 of the substrate holder 9, and the substrate P is placed on the substrate holder 9.
  • substrate P0 contacts the holding part 31 (refer FIG. 3) of the board
  • the contact portion 23 (see FIG. 7) of the support movable portion TM of the tray T releases the stress of the substrate P. Move to.
  • the substrate P0 is placed on the holding unit 31 of the substrate holder 9, and the substrate P is transferred from the tray T to the substrate holder 9.
  • the tray T comes into contact with the bottom of the groove 300 of the substrate holder 900, and the tray T0 is transferred from the transport hand 12 to the groove 30 of the substrate holder 9.
  • the contact portion 23 (see FIG. 7) of the support movable portion TM of the tray T moves in a direction to release the stress of the substrate P, so that the substrate P is placed on the holding portion of the substrate holder 9 while being bent. Is prevented from being placed.
  • the substrate P is in a flat state on the substrate holder 9, and predetermined exposure can be satisfactorily performed at an appropriate position on the substrate P.
  • the transfer robot 4 retracts the transfer hand 12 from the substrate holder 9.
  • the mask M shown in FIG. 2 is illuminated with the exposure light IL by the illumination system.
  • the pattern of the mask M illuminated with the exposure light IL is projected and exposed to the substrate P placed on the substrate holder 9 via the projection optical system PL. Since the exposure apparatus 1 can satisfactorily place the substrate P on the substrate holder 9 as described above, predetermined exposure can be performed at an appropriate position on the substrate P with high accuracy, and reliability can be improved. High exposure processing can be realized. In addition, since the exposure apparatus 1 can smoothly transfer the substrate P to the tray T and the substrate holder 9 as described above, the exposure processing for the substrate P can be performed without delay.
  • the transport hand 12 is described as carrying the substrate P out, but another transport hand in the double hand structure may be carried out.
  • the transport robot 4 drives the transport hand 12 and inserts the transport hand 12 from the ⁇ Y direction side on both sides in the X-axis direction of the substrate holder 9 below the tray T placed on the substrate holder 9. To do. At the same time, suction by the vacuum pump is released by a control device (not shown), and the adsorption of the substrate P by the substrate holder 9 is released.
  • the transport hand 12 comes into contact with the lower surfaces of the side portions 18, 18 of the tray 20.
  • the transport hand 12 is further driven upward, the substrate P placed on the holding unit 31 of the substrate holder 9 is transferred to the tray T.
  • the substrate P is flattened on the mounting portion 20 of the tray T as compared with the conventional case. It can be placed in a state.
  • the tray T supporting the substrate P is lifted above the substrate holder 9, and the placement unit 20 is separated from the substrate holder 9.
  • the tray T holding the substrate P is retracted from the substrate holder 9 by the transport hand 12. In this way, the carry-out operation of the substrate P with respect to the exposure apparatus main body 3 is completed.
  • the support movable part TM is not limited to what was demonstrated by the above-mentioned embodiment, It protrudes with respect to the mounting part 20, and supports a part of board
  • a modified example of the tray T will be described with reference to FIGS. 14A, 14B, 14C, 15A, 15B, 15C, and 15D.
  • the tray T1 in the first modified example shown in FIG. 14A is different in the arrangement of the tray T and the support movable portion TM described in the above embodiment.
  • the support movable unit TM is accommodated in a recess 20 b provided on the upper surface 20 a of the placement unit 20.
  • the concave portion 20b can be caused to function as a limiting portion that restricts the movable range of the contact portion 23.
  • the tray T2 in the second modified example shown in FIG. 14B is different from the tray T of the above-described embodiment in the configuration of the base 25 and the connecting portion 26 of the support movable portion TM2.
  • the connection part 26 of the support movable part TM2 in the second modification is configured by a plurality of springs that support the contact part 23 in a state of being separated from the upper surface 20a of the placement part 20.
  • the base portion 25 is disposed at a position shifted from the contact portion 23 in a direction parallel to the upper surface 20a of the placement portion 20.
  • the base 25 may be ring-shaped or divided into a plurality of parts. According to this modification, not only the same effects as in the above-described embodiment can be obtained, but also the elastic coefficient of the connection portion 26 can be adjusted more easily.
  • the tray T3 in the third modification shown in FIG. 14C is different from the tray T2 in the second modification described above in the configuration of the contact portion 23 of the support movable portion TM3.
  • a sliding portion 27 having a relatively small friction coefficient is fixed to the lower surface of the contact portion 23.
  • the abutting portion 23 is provided so as to be slidable with respect to the upper surface 20 a of the mounting portion 20 by sliding the sliding surface 27 a of the sliding portion 27 relative to the upper surface 20 a of the mounting portion 20.
  • a low friction material having a friction coefficient of the sliding surface 27a of about 0.1 to 0.2 can be used.
  • the tray T4 in the fourth modified example shown in FIGS. 15A to 15C is different from the tray T in the above-described embodiment in the configuration of the support movable portion TM4.
  • the support movable portion TM4 in the fourth modification includes a pair of magnetic members M1 and M2 in which the base portion 61 and the contact portion 63 exert a magnetic force with each other.
  • the magnetic members M1 and M2 for example, ferrite magnets or the like can be used, and the magnetic member M1 and the magnetic member M2 are disposed with the same poles facing each other so as to repel each other.
  • the magnetic members M1 and M2 may be formed in a ring shape as shown in FIG. 15B, or may be divided into a plurality of parts.
  • the center portion of the base portion 61 fixed to the upper surface of the placement portion 20 is below the locking portion 62 fixed to the contact portion 63.
  • a holding portion 61a for accommodating a part of the side is formed.
  • the inner wall of the holding portion 61a is formed in a tapered shape whose upper side is narrower than the lower side, and the outer wall 62a of the locking portion 62 is formed in a tapered shape corresponding to the inner wall of the holding portion 61a.
  • the locking part 62 is urged in a direction away from the mounting part 20 by a repulsive force between the magnetic members M1 and M2 in a state in which no external force is applied to the contact part 63, and is in a state of floating from the upper surface 20a. It has become.
  • the locking portion 62 is prevented from coming off from the base portion 61 by the outer wall 62a coming into contact with the inner wall of the holding portion 61a, and is arranged at a predetermined position.
  • the magnetic member set including the pair of magnetic members M1 and M2 that exert a magnetic force and the locking portion 62 can move the base portion 61 and the contact portion 63 relative to each other. It functions as a connection part to connect.
  • the magnetic force of the magnetic members M1 and M2 is such that the repulsive force acting between them is greater than the external force acting on the contact portion 63 that contacts the substrate P placed on the placement portion 20 of the tray T4. It is set to be smaller.
  • a conical projection 62b with a sharp tip is provided on the lower surface of the locking portion 62.
  • the protrusion 62b is separated from the upper surface 20a of the placement portion 20 in a state where no external force is applied to the contact portion 63. Further, when an external force larger than the repulsive force between the magnetic members M1 and M2 acts on the contact portion 63 in a direction perpendicular to the upper surface 20a of the placement portion 20 and toward the placement portion 20, the contact portion 63. And the locking part 62 moves in the direction of the external force, and the tip of the protrusion 62b comes into contact with the mounting part 20.
  • the contact portion 63 swings with the tip of the projection 62b as a fulcrum.
  • the range in which the abutting portion 63 can swing is limited by the holding portion 61 a of the base portion 61. That is, the holding portion 61 a of the base portion 61 functions as a limiting portion that limits the movement range of the contact portion 63.
  • the central portion of the upper surface of the contact portion 63 is processed into a spherical shape.
  • the abutment portion 63 and the locking portion 62 move to the mounting portion 20 side, whereby the outer wall 62a of the locking portion 62 and the inner wall of the holding portion 61a are separated from each other, and the protruding portion 62b is mounted on the mounting portion. 20 is in contact with the upper surface 20a of the substrate 20a.
  • the magnetic force of the magnetic members M1 and M2 is set so that the repulsive force between them becomes smaller than the external force acting on the contact portion 63 from the substrate P placed on the placement portion 20 of the tray T4. ing. Therefore, as described in the above-described embodiment, when the substrate P in a bent state tries to expand, the contact portion 63 swings with the tip end portion of the protrusion 62b as a fulcrum to release the stress of the substrate P. Further, the substrate P can move smoothly on the contact portion 63 by processing the central portion of the upper surface of the contact portion 63 into a spherical shape. Thereby, the effect similar to the above-mentioned embodiment can be acquired. Further, when the substrate P is transferred from the tray T4 to another member, the contact portion 63 returns to the original state shown in FIG. 15A due to the repulsive force between the magnetic members M1 and M2.
  • the tray T5 in the fifth modification example shown in FIG. 15D is the fourth modification described above in that the base portion 64 and the contact portion 65 of the support movable portion TM5 include a pair of magnetic members M3 and M4 that exert a magnetic force on each other.
  • the support movable portion TM5 in the fifth modified example includes magnetic members M3 and M4 similar to the magnetic members M1 and M2 in the modified example 4.
  • the magnetic member M3 and the magnetic member M4 are arranged with different polarities facing each other so as to attract each other.
  • the magnetic member M3 is disposed at the lower surface side central portion of the base portion 64 fixed to the upper surface 20a of the placement portion 20.
  • the lower surface 65b of the contact portion 65 is slidably in contact with the upper surface 64c of the base portion 64.
  • a side wall 64 a is projected from the peripheral edge of the upper surface 64 c of the base 64.
  • a hook-shaped restricting part 64b extending inward substantially parallel to the upper surface 20a of the mounting part 20 is provided.
  • the restricting portion 64b comes into contact with the abutting portion 65 that slides on the upper surface 64c of the base portion 64, thereby restricting the moving range of the abutting portion 65 to a predetermined range.
  • the contact portion 65 is provided with a concave portion 65a on the side surface corresponding to the restriction portion 64b of the base portion 64.
  • a magnetic member M4 is disposed at the center of the lower surface 65b of the contact portion 65.
  • the magnetic member M4 is disposed to face the magnetic member M3 provided on the base 64, and an attractive force acts between the magnetic member M3 and the magnetic member M3.
  • the contact portion 65 is formed of, for example, a low friction material, and the friction coefficient of the lower surface 65b is, for example, about 0.1 to 0.2.
  • the magnetic force of the magnetic members M3 and M4 is greater than the external force in which the attractive force acting between them acts on the contact portion 65 that contacts the substrate P placed on the placement portion 20 of the tray T5. It is set to be smaller.
  • the tray T5 of this modified example when the substrate P is placed on the placement portion 20 and an external force in a direction parallel to the upper surface 20a of the placement portion 20 acts on the contact portion 65 of the support movable portion TM5, The contact portion 65 moves in the direction of the external force. Therefore, the stress of the substrate P can be released when the substrate P in a bent state is about to expand.
  • the contact portion 65 returns to the original state shown in FIG. 15D by the attractive force between the magnetic members M3 and M4. Therefore, according to the tray T5 of this modification, it is possible to obtain the same effect as that of the above-described embodiment.
  • FIG. 16 is a plan view showing a planar structure of the tray T.
  • the tray T includes a placement unit 20 on which the substrate P is placed.
  • the placement unit 20 includes a plurality of first linear members (first members) 19A extending in a first direction along the long side of the substrate P to be placed, and short sides of the substrate P to be placed.
  • a plurality of second linear members (second members) extending in a second direction substantially perpendicular to the first direction are provided in a lattice shape.
  • a portion of the placement portion 20 where the first linear member 19A and the second linear member 19B are not arranged is a rectangular opening 21.
  • the shape of the tray T is not limited to the shape shown in FIG. 16, and is a frame-like single frame that supports only the peripheral edge of the substrate P, for example, having only one opening 21. Also good.
  • the tray T is a supported portion in which both side portions 18 and 18 of the placement portion 20 are supported by the transport hand 12.
  • the side portions 18 and 18 that are supported portions of the tray T are disposed at the end portions in the short direction of the tray T, and are provided by the first linear members 19A extending in the longitudinal direction of the tray T. Yes.
  • the tray T is transported in a state where the substrate P is placed at a predetermined position of the placement unit 20, the side portions 18 and 18 or the vicinity thereof are supported so that the substrate P is supported from below. It has become.
  • the placement surface 20a on which the substrate P of the placement portion 20 is placed has a plurality of lower surface support portions (support portions, the support portions, and the first linear members 19A and the second linear members 19B).
  • (Protrusion part, supplement part) TM11 and a plurality of outer edge support parts (support part, projection part, supplement part) TM12 arranged on the outer edge part of the placement part 20 are provided.
  • the lower surface support portion TM11 is in contact with the lower surface of the substrate P placed on the placement portion 20 so as to support a part of the substrate P.
  • the outer edge support portion TM12 is disposed along the outer edge of the placement portion 20, and contacts the lower surface of the substrate P placed on the placement portion 20 to support the outer edge portion of the substrate P.
  • the lower surface support portion TM11 and the outer edge support portion TM12 are formed of, for example, a low friction material having a lower friction coefficient than that of a normal material, or a surface treatment that lowers the friction coefficient is performed on the surface in contact with the substrate P.
  • substrate P of lower surface support part TM11 and outer edge support part TM12 is smaller than the friction coefficient of the mounting surface 20a of the mounting part 20 contact
  • the installation density of the lower surface support portion TM11 and the outer edge support portion TM12 on the outer edge side of the placement portion 20 is higher than the installation density of the lower surface support portion TM11 on the center side of the placement portion 20.
  • the installation density refers to the number of the lower surface support portions TM11 or the outer edge support portions TM12 per unit area on a plane including the placement surface 20a of the placement portion 20.
  • the number of the lower surface support portions TM11 or the outer edge support portions TM12 installed per unit area is larger on the outer edge side of the placement portion 20 than on the center side. . Therefore, the space
  • the mounting surface 20a of the mounting unit 20 is provided with a plurality of rows of support portions including a plurality of lower surface support portions TM11 arranged in a row along the side portions 18 and 18 and the first linear member 19A. Yes.
  • two rows of support portions made up of five lower surface support portions TM11 are arranged on the center side of the placement portion 20.
  • a support portion row including six lower surface support portions TM11 and a support portion row including seven lower surface support portions TM11 are arranged from the outer edge portion side to the central portion side of the placement portion 20.
  • these support portion rows intersect, for example, perpendicularly to the extending direction of the both side portions 18 and 18 of the mounting portion 20 of the tray T (the first direction, that is, the extending direction of the first linear member 19A).
  • the two side portions 18 and 18 are disposed symmetrically with respect to the intermediate portion. This arrangement corresponds to, for example, when the both side portions 18 and 18 of the placement portion 20 are supported, the placement portion 20 bends symmetrically with respect to the intermediate portion between the both side portions 18 and 18.
  • the distance between the support portion row composed of the five lower surface support portions TM11 disposed on the center side of the placement portion 20 and the support portion row composed of the seven lower surface support portions TM11 disposed on the outer edge side is as follows. , Wider than the interval between the support portion row composed of the six lower surface support portions TM11 disposed on the outer edge side of the placement portion 20 and the support portion row composed of the seven lower surface support portions TM11 disposed on the center side thereof. It has become. That is, the interval between the support portion rows arranged on the center side of the placement portion 20 is wider than the interval between the support portion rows arranged on the outer edge side of the placement portion 20.
  • FIG. 17A is an enlarged plan view of the lower surface support portion TM11.
  • FIG. 17B is a cross-sectional view taken along line B-B ′ of FIG. 17A.
  • FIG. 17C is a cross-sectional view taken along the line C-C ′ of FIG. 17A.
  • the lower surface support portion TM11 is provided in a substantially cross shape in a plan view by a base portion 222 at the center portion, a pair of first portions 223 and a pair of second portions 224 provided on the base portion 222. ing.
  • the lower surface support portion TM11 is provided so as to protrude from the placement surface 20a on which the substrate P of the placement portion 20 is placed.
  • the base 222 is disposed at a portion where the first linear member 19A and the second linear member 19B intersect.
  • the first portion 223 is formed to extend on both sides of the base portion 222 along the first linear member 19A.
  • the second portion 224 is formed to extend on both sides of the base 222 along the second linear member 19B.
  • the first portion 223 has a first movement restricting portion 223a protruding in the thickness direction of the placement portion 20, and is engaged with the placement surface 20a side of the first linear member 19A as shown in FIG. 17B. It has a substantially U-shape when viewed in cross section. As shown in FIG. 17C, the first movement restricting portion 223a is a plate-like portion formed along the side surface of the first linear member 19A.
  • the 1st movement control part 223a controls the movement of the direction along the 2nd linear member 19B of the lower surface support part TM11 by contact
  • a fixing ring 223b is disposed in the vicinity of the end of the first portion 223 opposite to the base 222.
  • the fixing ring 223b is made of a band plate-like member formed in a ring shape, and a flange-like portion provided at the end of the band plate-like member is fastened by a bolt / nut 223c.
  • the fixing ring 223b is disposed around the first linear member 19A and the first portion 223, and the flange portion is fastened by the bolt / nut 223c, thereby fastening the first portion 223 to the first linear member 19A. It is like that.
  • the lower surface support portion TM11 is fixed to the placement portion 20 by the first portion 223 being fastened to the first linear member 19A by the fixing ring 223b.
  • the second portion 224 has a second movement restricting portion 224a projecting in the thickness direction of the placement portion 20, and is engaged with the placement surface 20a side of the second linear member 19B, as shown in FIG. 17C. It has a substantially U-shape when viewed in cross section. As shown in FIG. 17B, the second movement restricting portion 224a is a plate-like portion formed along the side surface of the second linear member 19B. The second movement restricting portion 224a abuts the side surface of the second linear member 19B, thereby restricting movement of the lower surface support portion TM11 in the direction along the first linear member 19A.
  • FIG. 18A is an enlarged side view of the outer edge support portion TM12.
  • 18B is a plan view seen from the B direction of FIG. 18A.
  • 18C is a cross-sectional view taken along the line C-C ′ of FIG. 18A.
  • the outer edge support portion TM12 is provided so as to protrude from the placement surface 20a of the placement portion 20.
  • the surface in contact with the substrate P is inclined so that the height from the placement surface 20a on the center side of the placement portion 20 is lower than the height from the placement surface 20a on the outer edge side of the placement portion 20. Is provided.
  • the outer edge support portion TM12 is formed in a rectangular shape in a plan view extending in a direction intersecting with the outer edge of the placement portion 20. Accordingly, as shown in FIG. 18B, the longitudinal direction of the outer edge support portion TM12 intersects with the outer edge of the substrate P placed on the placement portion 20. As shown in FIG. 18A, the outer edge support portion TM12 is provided so as to support the outer edge of the substrate P placed on the placement portion 20 on an inclined surface.
  • the outer edge support portion TM12 has a movement restricting portion 225a that protrudes in the thickness direction (longitudinal direction of the cross section) of the first linear member 19A (second linear member 19B).
  • the first linear member 19 ⁇ / b> A (second linear member 19 ⁇ / b> B) has a substantially U-shaped shape in a cross-sectional view engaged with the placement surface 20 a side.
  • the movement restricting portion 225a is a plate-like portion formed along the side surface of the first linear member 19A (second linear member 19B).
  • the movement restricting portion 225a intersects the first linear member 19A (second linear member 19B) of the outer edge support portion TM12 by contacting the side surface of the first linear member 19A (second linear member 19B).
  • the movement of the direction is regulated.
  • the outer edge support portion TM12 is attached to the first linear member 19A (second linear member 19B) by a bolt 225b that is screwed into a screw hole provided in the first linear member 19A (second linear member 19B). It is concluded.
  • the material for forming the tray T shown in FIG. 16 it is preferable to use a material that can suppress bending due to the weight of the substrate P when the tray T supports the substrate P.
  • a material that can suppress bending due to the weight of the substrate P when the tray T supports the substrate P For example, various synthetic resins, Alternatively, a metal can be used. Specific examples include nylon, polypropylene, AS resin, ABS resin, polycarbonate, fiber reinforced plastic, and stainless steel. Examples of the fiber reinforced plastic include GFRP (Glass Fiber Reinforced Plastic) and CFRP (Carbon Fiber Reinforced Plastic).
  • the substrate P is arranged so that its long side is parallel to both side portions 18 and 18 of the tray T.
  • the tray T is transported by placing the substrate P on the placement unit 20 in a state where both side portions 18 and 18 are supported from below by the transport hand 12 of the transport robot 4 (see FIG. 2 and FIG. 2). (See FIG. 3). That is, the transport robot 4 in the present embodiment supports the side portions 18 and 18 of the placement unit 20 that is a supported portion of the tray T or the vicinity thereof by the transport hand 12. In addition, the transfer robot 4 moves the tray T while holding the side portions 18 and 18 of the mounting portion 20 of the tray T on which the substrate P is mounted by the transfer hand 12 or the vicinity thereof.
  • the tray T is configured such that the lower surface of the mounting portion 20 is supported by a plurality of tray support pins 52b of the tray support portion 52 of the carry-in / out portion 5 shown in FIG. Further, the tray T has a plurality of substrate support pins 51b of the substrate support portion 51 in a plurality of openings shown in FIG. 16 in a state where the lower surface of the placement portion 20 is supported by the tray support pins 52b as shown in FIG. It is made to pass through the portion 21.
  • a groove 30 for holding the tray T is formed on the upper surface of the substrate holder 9.
  • the groove portions 30 are provided in a lattice shape corresponding to the frame structure of the tray T.
  • a plurality of holding portions (holder portions) 31 for the substrate P are provided in an island shape by forming the groove portion 30 on the upper surface of the substrate holder 9. That is, the groove portion 30 is provided in a groove shape with respect to the holding portion 31 of the substrate holder 9, and the holding portion 31 has a size corresponding to the opening portion 21 of the tray T.
  • the upper surface of the holding part 31 is finished so that the substantial holding surface of the substrate holder 9 with respect to the substrate P has good flatness.
  • a plurality of suction holes K are provided on the upper surface of the holding portion 31 for bringing the substrate P into close contact with the surface (see FIG. 2).
  • Each suction hole K is connected to a vacuum pump (not shown).
  • FIG. 19 is a partial side sectional view showing a state where the tray T is accommodated in the groove 30 of the substrate holder 9. As shown in FIG. 19, the thickness of the tray T is smaller than the depth of the groove 30. As a result, the tray T is inserted into the groove 30 and sinks, so that the holding portion 31 is protruded from the opening 21, and only the substrate P placed on the tray T is received by the holding portion 31. It is supposed to be passed.
  • Conical concave portions 41 are formed at the four corners on the lower surface side of the placement portion 20 of the tray T, and spherical convex portions 42 that engage with the concave portions 41 are provided at positions corresponding to the concave portions 41 in the groove portion 30. It has been.
  • the tray T is displaced when the mounting portion 20 is inserted into the groove portion 30 and the convex portion 42 of the substrate holder 9 is engaged with the concave portion 41 of the mounting portion 20 so that the tray T is accommodated in the groove portion 30. Is to be prevented.
  • FIG. 20 is a schematic diagram illustrating a process of delivering the substrate P from the carry-in / out section 5 of the exposure apparatus 1 of the present embodiment to the tray T.
  • the substrate P supported by the plurality of substrate support pins 51 b is in a state where a portion not supported by the substrate support pins 51 b is bent downward.
  • the tray support 52 is raised, and the tray T supported by the tray support pins 52b is raised.
  • the substrate P is placed on the tray T, and the substrate P is transferred from the substrate support pin 51 b of the loading / unloading unit 5 to the tray T.
  • the central portion of the substrate P bent downward is in contact with the tray T in the portion where the lower surface support portion TM11 of the central portion of the tray T is not disposed.
  • the outer edge portion of the substrate P bent downward is in contact with the outer edge support portion TM12 provided in the tray T, and the central portion thereof is in contact with the lower surface support portion TM11 provided in the tray T.
  • the installation density of the outer edge support portion TM12 or the lower surface support portion TM11 on the outer edge side of the placement portion 20 is higher than the installation density of the lower surface support portion TM11 on the center side of the placement portion 20.
  • the interval between the lower surface support portions TM11 disposed on the center side of the placement portion 20 is greater than the interval between the lower surface support portions TM11 disposed on the outer edge side of the placement portion 20 or the interval between the outer edge support portions TM12. Is also getting wider. Therefore, the central portion of the substrate P and the vicinity thereof are in contact with the placement surface 20a of the placement portion 20 with a relatively large contact area.
  • the outer edge portion of the substrate P is supported by the lower surface support portion TM11 and the outer edge support portion TM12 and comes into contact with the placement surface 20a of the placement portion 20 with a smaller contact area than the center portion or the placement portion 20. It will be in the state spaced apart from the mounting surface 20a.
  • the surfaces of the lower surface support portion TM11 and the outer edge support portion TM12 that are in contact with the substrate P have a smaller friction coefficient than the placement surface 20a of the placement portion 20 of the tray T. Therefore, as shown in FIG. 20B, the central portion of the substrate P is not displaced with respect to the tray T due to friction between the mounting surface 20a of the mounting portion 20 and the substrate P. The portion of the P in contact with the lower surface support portion TM11 and the outer edge support portion TM12 slips on the lower surface support portion TM11 and the outer edge support portion TM12, and moves so as to spread outward from the central portion.
  • substrate P is eliminated and the board
  • the substrate P is adjusted to a temperature at which the exposure process is performed.
  • the transport hand 12 of the transport robot 4 disposed below the tray T is raised.
  • the placement part 20 of the tray T is held by the transport hand 12 of the transport robot 4 along both side parts 18 and 18 (see FIGS. 2 and 16).
  • the tray T is lifted above the tray support pins 52b with the substrate P placed thereon. Since both sides 18 and 18 of the tray T are supported, due to the weight of the substrate P and the tray T, the intermediate portion between the sides 18 and 18 supported by the transport hand 12 is bent downward.
  • a support portion row including five lower surface support portions TM ⁇ b> 11 is arranged on the center side of the placement portion 20.
  • a support portion row including six lower surface support portions TM11 and a support portion row including seven lower surface support portions TM11 are arranged from the outer edge portion side to the central portion side of the placement portion 20.
  • columns are symmetrically arrange
  • the interval between the support portion rows arranged on the center side of the placement portion 20 is wider than the interval between the support portion rows arranged on the outer edge side of the placement portion 20.
  • the substrate P a portion that is long in the long side direction of the intermediate portion in the short side direction is in contact with the mounting surface 20a in the intermediate portion between the side portions 18 and 18 of the mounting portion 20.
  • substrate P is supported by the some support part row
  • the outer edge side is easy to move to both side portions 18 and 18 along the direction of the short side of the substrate P.
  • both side portions 18 and 18 of the placement unit 20 of the tray T are held by the transport hand 12 of the transport robot 4, the portion along the long side direction of the central portion of the short side direction of the substrate P bends downward. Even when the substrate P is bent into a bowl-like shape, the outer edge (long side) side portion of the central portion in the short side direction of the substrate P is used as both side portions 18 of the placement portion 20 of the tray T. It can be slid to 18 side and moved. As a result, the stress acting to compress the substrate P toward the central portion in the short side direction is relaxed, and the substrate P is bent so as to wave in the short side direction (see the portion (c) in FIG. 10). Can be prevented.
  • the outer edge portion of the substrate P is supported by a plurality of outer edge support portions TM12.
  • the outer edge support portion TM12 is formed to extend in a direction intersecting with the outer edge of the placement portion 20. Therefore, when the outer edge (long side) orthogonal to the short side of the substrate P moves in the short side direction of the substrate P, the outer edge support portion TM12 extends over the entire range of movement of the outer edge of the substrate P. The lower surface is supported, and the outer edge of the substrate P can be smoothly slid without any delay.
  • the outer edge of the substrate P smoothly moves, so that the portion from the central portion in the short side direction to the outer edge portion in the short side direction of the substrate P is changed to the outer edge on the both side portions 18 and 18 side of the mounting portion 20. It can spread smoothly and smoothly in the direction that intersects.
  • the outer edge support portion TM12 has a height from the placement surface 20a on the center side of the placement portion 20 that is higher than the height from the placement surface 20a on the outer edge side of the placement portion 20.
  • the surface in contact with the substrate P is inclined so as to be lowered. Even if the substrate P is bent by making the angle of the inclined surface with respect to the mounting surface 20a correspond to the angle with respect to the mounting surface 20a of the outer edge portion of the substrate P when the substrate P is bent, The outer edge portion of the substrate P can be more reliably supported by the inclined surface.
  • the height of the end portion on the outer edge side of the placement portion 20 of the outer edge support portion TM12 is increased to increase the thickness, while the height of the end portion on the center side of the placement portion 20 of the outer edge support portion TM12 is decreased. And can be thinned. Thereby, not only can the step formed between the placement surface 20a of the placement part 20 and the outer edge support part TM12 be reduced to place the substrate P more stably, but also the outer edge support part TM12. It is possible to sufficiently secure the strength of the portion for fixing the to the mounting portion 20.
  • the lower surface support portion TM11 is formed on both sides of the base portion 222 along the first linear member 19A, and a base portion 222 disposed at a portion where the first linear member 19A and the second linear member 19B intersect.
  • the first portion 223 and the second portion 224 formed on both sides of the base 222 along the second linear member 19B are formed in a cross shape. Therefore, in the mounting portion 20 provided in a lattice shape by the first linear member 19A and the second linear member 19B, the lower surface support portion is provided only at the intersection of the first linear member 19A and the second linear member 19B.
  • TM11 Compared with the case where TM11 is installed, a wider range of the substrate P can be supported. Thereby, the surface pressure between the board
  • the first portion 223 has a first movement restricting portion 223a that abuts the side surface of the first linear member 19A and restricts the movement of the lower surface support portion TM11 in the direction intersecting the first linear member 19A.
  • the second portion 224 has a second movement restricting portion 224a that abuts the side surface of the second linear member 19B and restricts the movement of the lower surface support portion TM11 in the direction intersecting the second linear member 19B. ing.
  • the lower surface support portion TM11 fixes the lower surface support portion TM11 to the placement portion 20 by fastening the first portions 223 extending on both sides of the base portion 222 to the placement portion 20. Therefore, the lower surface support portion TM11 can be easily fixed to the placement portion 20, and the lower surface support portion TM11 can be easily detached from the placement portion 20.
  • the transfer robot 4 changes the direction of the transfer hand 12 so that the longitudinal direction of the transfer hand 12 (long side direction of the substrate P) faces the substrate holder 9 side of the exposure apparatus body 3. . Thereafter, the transport hand 12 is moved, and the tray T on which the substrate P is placed is transported upward of the substrate holder 9 shown in FIG.
  • the transport hand 12 transports the substrate P so that the surface of the substrate P and the holding portion 31 of the substrate holder 9 are substantially parallel.
  • substantially parallel means that the substrate P is in a parallel or nearly parallel state when the deflection of the substrate P due to its own weight is excluded.
  • the transport hand 12 transports the substrate P so that the held portion of the substrate P by the transport hand 12 and the substrate placement surface of the holding unit 31 are substantially parallel.
  • FIG. 21 is a schematic diagram for explaining a process of transferring the substrate P from the tray T of the present embodiment to the substrate holder 9 of the exposure apparatus 1.
  • the transfer robot 4 transfers the substrate P to the upper side of the substrate holder 9 by the transfer hand 12 and aligns the tray T with the groove part 30.
  • the drive device 13 shown is driven, and the conveyance hand 12 is lowered.
  • the tray T is accommodated in the groove 30 of the substrate holder 9, and the substrate P is placed on the substrate holder 9.
  • substrate P contacts the holding part 31 (refer FIG. 3) of the board
  • the transport hand 12 when the transport hand 12 is further lowered, the substrate P is placed on the holding portion 31 of the substrate holder 9, and the substrate P is transferred from the tray T to the substrate holder 9. Further, the tray T comes into contact with the bottom of the groove 30 of the substrate holder 9, and the tray T is transferred from the transport hand 12 to the groove 30 of the substrate holder 9. At this time, slip occurs between the lower surface support portion TM11 and the outer edge support portion TM12 of the tray T and the substrate P, and the portion from the center portion in the short side direction to the outer edge (long side) in the short side direction of the substrate P is It moves to both sides 18 and 18 side of the tray T supported by the transport hand 12.
  • the substrate P is in a flat state on the substrate holder 9, and predetermined exposure can be satisfactorily performed at an appropriate position on the substrate P.
  • the transfer robot 4 retracts the transfer hand 12 from the substrate holder 9.
  • the mask M shown in FIG. 2 is illuminated with the exposure light IL by the illumination system.
  • the pattern of the mask M illuminated with the exposure light IL is projected and exposed to the substrate P placed on the substrate holder 9 via the projection optical system PL.
  • the substrate P can be placed on the substrate holder 9 satisfactorily (that is, in a state in which generation of distortion is suppressed) as described above. Therefore, predetermined exposure can be performed at an appropriate position on the substrate P with high accuracy, and highly reliable exposure processing can be realized.
  • the exposure apparatus 1 can smoothly transfer the substrate P to the tray T and the substrate holder 9 as described above, the exposure processing for the substrate P can be performed without delay.
  • the transport hand 12 is described as carrying the substrate P out, but another transport hand in the double hand structure may be carried out.
  • the transport robot 4 drives the transport hand 12 and inserts the transport hand 12 from the ⁇ Y direction side on both sides in the X-axis direction of the substrate holder 9 below the tray T placed on the substrate holder 9. To do. At the same time, suction by the vacuum pump is released by a control device (not shown), and the adsorption of the substrate P by the substrate holder 9 is released.
  • the transport hand 12 comes into contact with the lower surfaces of the side portions 18, 18 of the tray 20.
  • the transport hand 12 is further driven upward, the substrate P placed on the holding unit 31 of the substrate holder 9 is transferred to the tray T.
  • the substrate P is flattened on the mounting portion 20 of the tray T as compared with the conventional case. It can be placed in a state.
  • the tray T supporting the substrate P is lifted above the substrate holder 9, and the placement unit 20 is separated from the substrate holder 9.
  • the tray T holding the substrate P is retracted from the substrate holder 9 by the transport hand 12. In this way, the carry-out operation of the substrate P with respect to the exposure apparatus main body 3 is completed.
  • the tray T The substrate P is not distorted as in the prior art when the substrate P is placed on the side, and the both side portions 18 and 18 of the tray T on which the substrate P is placed are held and transported by the transport hand 12.
  • the substrate P can be delivered to the holding portion 31 of the substrate holder 9 in a flat state in which distortion and bending are suppressed. Therefore, the problem due to the bending of the substrate P as shown in FIGS. 10 (a) to 10 (c), the distortion due to the compression of the substrate P shown in FIGS. 11 (a) to 11 (c), Alternatively, all problems due to the combination of these can be solved.
  • the configuration in which the tray held portions are provided on both sides has been described.
  • the supported portions may be provided on portions other than both sides, such as an intermediate portion on both sides. Good.
  • the substrate disposed below the substrate is moved upward with respect to the substrate.
  • the substrate disposed above the tray is placed on the tray. On the other hand, it may be moved downward and placed on the tray.
  • the substrate P in the above-described embodiment not only a glass substrate for a display device but also a semiconductor wafer for manufacturing a semiconductor device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus ( Synthetic quartz, silicon wafer) or the like is applied.
  • a step-and-scan type scanning exposure apparatus that moves the mask M and the substrate P synchronously to scan and expose the substrate P with the exposure light IL through the pattern of the mask M.
  • the present invention may be applied to a step-and-repeat projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the mask M and the substrate P are stationary, and the substrate P is sequentially moved stepwise. it can.
  • the present invention also relates to a twin-stage type exposure having a plurality of substrate stages as disclosed in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, and the like. It can also be applied to devices.
  • the present invention relates to a substrate stage for holding a substrate as disclosed in US Pat. No. 6,897,963, European Patent Application No. 1713113, etc., and a reference mark without holding the substrate.
  • the present invention can also be applied to an exposure apparatus that includes a formed reference member and / or a measurement stage on which various photoelectric sensors are mounted.
  • An exposure apparatus including a plurality of substrate stages and measurement stages can be employed.
  • a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used.
  • a variable shaped mask also called an electronic mask, an active mask, or an image generator
  • a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element.
  • the exposure apparatus of the above-described embodiment is manufactured by assembling various subsystems including the constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy.
  • various optical systems are adjusted to achieve optical accuracy
  • various mechanical systems are adjusted to achieve mechanical accuracy
  • various electrical systems are Adjustments are made to achieve electrical accuracy.
  • the assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection, and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus.
  • comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus.
  • the exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.
  • a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a base material of the device.
  • Manufacturing step 203 including substrate processing (exposure processing) including exposing the substrate with exposure light using a mask pattern and developing the exposed substrate (photosensitive agent) according to the above-described embodiment
  • the substrate is manufactured through a substrate processing step 204, a device assembly step (including processing processes such as a dicing process, a bonding process, and a packaging process) 205, an inspection step 206, and the like.
  • the photosensitive agent is developed to form an exposure pattern layer (developed photosensitive agent layer) corresponding to the mask pattern, and the substrate is processed through the exposure pattern layer. It is.
  • 2nd linear member (second member), 20 mounting part, 20b concave part (restriction part), 22 base part, 23 contact part, 24 connection part (elastic member), 25 base part, 26 connection part (Elastic member), 27 sliding part, 30 groove part, 31 holding part (holder part), 51b substrate support pin (supporting pin), 61 base part (restriction part), 63 contact part, 64 base part, 64b restriction part, 65 Contact part, 222 base part, 223 first part, 223a first movement restriction part, 224 second part, 224a second movement restriction part, IL exposure light, M1, M2, M3, M4 magnetic member, P substrate, T, 1, T2, T3, T4, T5 tray (substrate support device, substrate support member), TM, TM2, TM3, TM4, TM5 support movable part (support part, projection part), TM11 ... bottom support part (support part, projection) Part), TM12 ... outer edge support part (support part, projection part).

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
PCT/JP2010/068499 2009-10-20 2010-10-20 基板支持装置、基板支持部材、基板搬送装置、露光装置、及びデバイス製造方法 WO2011049133A1 (ja)

Priority Applications (3)

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KR1020127010331A KR101925151B1 (ko) 2009-10-20 2010-10-20 기판 지지 장치, 기판 지지 부재, 기판 반송 장치, 노광 장치 및 디바이스 제조 방법
JP2011537283A JPWO2011049133A1 (ja) 2009-10-20 2010-10-20 基板支持装置、基板支持部材、基板搬送装置、露光装置、及びデバイス製造方法
CN201080046237.3A CN102648518B (zh) 2009-10-20 2010-10-20 基板支承、搬送、曝光装置、支承构件及元件制造方法

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US27267709P 2009-10-20 2009-10-20
US61/272,677 2009-10-20
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TWI612390B (zh) * 2012-09-04 2018-01-21 克奧哈貝特技術公司 曝光裝置
KR20180011012A (ko) * 2016-07-21 2018-01-31 도쿄엘렉트론가부시키가이샤 기판의 후면 마찰 감소

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JP7438018B2 (ja) * 2020-05-11 2024-02-26 東京エレクトロン株式会社 基板載置方法及び基板載置機構

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KR100825691B1 (ko) 1999-07-26 2008-04-29 가부시키가이샤 니콘 기판지지장치 및 기판처리장치
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TWI612390B (zh) * 2012-09-04 2018-01-21 克奧哈貝特技術公司 曝光裝置
KR20180011012A (ko) * 2016-07-21 2018-01-31 도쿄엘렉트론가부시키가이샤 기판의 후면 마찰 감소
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KR101925151B1 (ko) 2019-02-27
CN102648518A (zh) 2012-08-22
CN102648518B (zh) 2016-08-03
JPWO2011049133A1 (ja) 2013-03-14
TW201135372A (en) 2011-10-16

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