KR101925151B1 - 기판 지지 장치, 기판 지지 부재, 기판 반송 장치, 노광 장치 및 디바이스 제조 방법 - Google Patents

기판 지지 장치, 기판 지지 부재, 기판 반송 장치, 노광 장치 및 디바이스 제조 방법 Download PDF

Info

Publication number
KR101925151B1
KR101925151B1 KR1020127010331A KR20127010331A KR101925151B1 KR 101925151 B1 KR101925151 B1 KR 101925151B1 KR 1020127010331 A KR1020127010331 A KR 1020127010331A KR 20127010331 A KR20127010331 A KR 20127010331A KR 101925151 B1 KR101925151 B1 KR 101925151B1
Authority
KR
South Korea
Prior art keywords
substrate
tray
support
supporting
arrangement
Prior art date
Application number
KR1020127010331A
Other languages
English (en)
Korean (ko)
Other versions
KR20120091103A (ko
Inventor
구니히로 가와에
다다시 세키
무네야스 요코타
기요시 고구레
Original Assignee
가부시키가이샤 니콘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 니콘 filed Critical 가부시키가이샤 니콘
Publication of KR20120091103A publication Critical patent/KR20120091103A/ko
Application granted granted Critical
Publication of KR101925151B1 publication Critical patent/KR101925151B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020127010331A 2009-10-20 2010-10-20 기판 지지 장치, 기판 지지 부재, 기판 반송 장치, 노광 장치 및 디바이스 제조 방법 KR101925151B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US27267709P 2009-10-20 2009-10-20
US61/272,677 2009-10-20
JP2010002005 2010-01-07
JPJP-P-2010-002005 2010-01-07
PCT/JP2010/068499 WO2011049133A1 (ja) 2009-10-20 2010-10-20 基板支持装置、基板支持部材、基板搬送装置、露光装置、及びデバイス製造方法

Publications (2)

Publication Number Publication Date
KR20120091103A KR20120091103A (ko) 2012-08-17
KR101925151B1 true KR101925151B1 (ko) 2019-02-27

Family

ID=43900356

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127010331A KR101925151B1 (ko) 2009-10-20 2010-10-20 기판 지지 장치, 기판 지지 부재, 기판 반송 장치, 노광 장치 및 디바이스 제조 방법

Country Status (5)

Country Link
JP (1) JPWO2011049133A1 (zh)
KR (1) KR101925151B1 (zh)
CN (1) CN102648518B (zh)
TW (1) TW201135372A (zh)
WO (1) WO2011049133A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012108211A1 (de) * 2012-09-04 2014-03-06 Kleo Halbleitertechnik Gmbh Belichtungsanlage
US10784100B2 (en) * 2016-07-21 2020-09-22 Tokyo Electron Limited Back-side friction reduction of a substrate
JP7438018B2 (ja) * 2020-05-11 2024-02-26 東京エレクトロン株式会社 基板載置方法及び基板載置機構

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003149361A (ja) * 2001-11-07 2003-05-21 Horiba Ltd 測定台
JP2004273702A (ja) * 2003-03-07 2004-09-30 Nikon Corp 搬送装置及び搬送方法、露光装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999039999A1 (fr) * 1998-02-09 1999-08-12 Nikon Corporation Appareil de support d'une plaque de base, appareil et procede de transport de cette plaque, appareil de remplacement de cette plaque et appareil d'exposition et procede de fabrication dudit appareil
JP2000091406A (ja) * 1998-09-08 2000-03-31 Mitsubishi Materials Silicon Corp ウェーハ保持具
KR100825691B1 (ko) 1999-07-26 2008-04-29 가부시키가이샤 니콘 기판지지장치 및 기판처리장치
JP4363401B2 (ja) * 2003-03-26 2009-11-11 信越半導体株式会社 熱処理用ウェーハ支持具及び熱処理装置
JP4935002B2 (ja) * 2005-06-30 2012-05-23 ウシオ電機株式会社 加熱ユニット
US7564536B2 (en) * 2005-11-08 2009-07-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4903027B2 (ja) * 2006-01-06 2012-03-21 東京エレクトロン株式会社 基板搬送装置および基板支持体
JP2008004856A (ja) * 2006-06-26 2008-01-10 Matsushita Electric Ind Co Ltd 部材支持方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003149361A (ja) * 2001-11-07 2003-05-21 Horiba Ltd 測定台
JP2004273702A (ja) * 2003-03-07 2004-09-30 Nikon Corp 搬送装置及び搬送方法、露光装置

Also Published As

Publication number Publication date
WO2011049133A1 (ja) 2011-04-28
KR20120091103A (ko) 2012-08-17
CN102648518A (zh) 2012-08-22
CN102648518B (zh) 2016-08-03
JPWO2011049133A1 (ja) 2013-03-14
TW201135372A (en) 2011-10-16

Similar Documents

Publication Publication Date Title
JP6780732B2 (ja) 搬送装置、露光装置、及びデバイス製造方法
JP6245308B2 (ja) 基板搬送方法、デバイス製造方法、基板搬送装置および露光装置
KR102005610B1 (ko) 반송 핸드 및 리소그래피 장치
CN113238461B (zh) 曝光装置、平板显示器的制造方法、元件制造方法、及曝光方法
JP5469852B2 (ja) 搬送装置、搬送方法、露光装置、露光方法、及びデバイス製造方法
US20080068580A1 (en) Substrate-retaining unit
JP2004273702A (ja) 搬送装置及び搬送方法、露光装置
KR101925151B1 (ko) 기판 지지 장치, 기판 지지 부재, 기판 반송 장치, 노광 장치 및 디바이스 제조 방법
TW201723674A (zh) 移動體裝置、曝光裝置、平面顯示器之製造方法、及元件製造方法、以及物體之移動方法
KR102458992B1 (ko) 기판 반송 장치, 노광 장치, 플랫 패널 디스플레이의 제조 방법, 디바이스 제조 방법, 기판 반송 방법, 및 노광 방법
KR101982454B1 (ko) 기판 반송 장치, 노광 장치, 기판 지지 장치 및 디바이스 제조 방법
JP7107352B2 (ja) 基板搬送装置、露光装置、フラットパネルディスプレイ製造方法、デバイス製造方法、基板搬送方法、及び露光方法
JP2011113086A (ja) 受け渡し機構、ステージ装置、搬送装置、露光装置、及びデバイス製造方法
JP2010267807A (ja) 基板保持装置、ステージ装置、露光装置、及びデバイス製造方法
JP2011086764A (ja) 基板支持部材、搬送装置、露光装置、及びデバイス製造方法

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant