WO2011001978A1 - 静電吸着構造体及びその製造方法 - Google Patents

静電吸着構造体及びその製造方法 Download PDF

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Publication number
WO2011001978A1
WO2011001978A1 PCT/JP2010/061059 JP2010061059W WO2011001978A1 WO 2011001978 A1 WO2011001978 A1 WO 2011001978A1 JP 2010061059 W JP2010061059 W JP 2010061059W WO 2011001978 A1 WO2011001978 A1 WO 2011001978A1
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WIPO (PCT)
Prior art keywords
sheet members
electrode
dielectric
adsorbed
electrostatic
Prior art date
Application number
PCT/JP2010/061059
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English (en)
French (fr)
Japanese (ja)
Inventor
博 藤澤
慈 河合
良昭 辰己
Original Assignee
株式会社クリエイティブ テクノロジー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社クリエイティブ テクノロジー filed Critical 株式会社クリエイティブ テクノロジー
Priority to JP2011520931A priority Critical patent/JP5500172B2/ja
Priority to SG2011097516A priority patent/SG177448A1/en
Priority to CN201080028921.9A priority patent/CN102473668B/zh
Priority to EP10794147.8A priority patent/EP2450948B1/en
Priority to US13/381,868 priority patent/US20120120545A1/en
Priority to KR1020177001490A priority patent/KR101806926B1/ko
Publication of WO2011001978A1 publication Critical patent/WO2011001978A1/ja
Priority to HK12108910.6A priority patent/HK1168200A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Definitions

  • the present invention relates to an electrostatic attraction structure that electrically adsorbs an object to be adsorbed, and a method for manufacturing the same, and more particularly, forms a solid integrated structure when used and freely changes the configuration of the structure after use.
  • the present invention relates to an electrostatic adsorption structure that can be performed, and a method for manufacturing the same.
  • the electrostatic adsorption structure that electrically adsorbs and holds objects to be adsorbed is used to adsorb and hold semiconductor substrates and glass substrates, and also used to adsorb and hold sheet materials such as paper and resin. It is used in a wide range of applications. Electrostatic adsorption structure is usually used by adsorbing an object to be adsorbed with the surface of one dielectric as an adsorption surface by sandwiching the electrode from above and below with a dielectric and applying a voltage to the electrode with an adsorption power source. Further, for example, when used in a semiconductor manufacturing process or the like, it is integrally bonded to a metal base provided with a conduit through which a coolant such as a cooling gas flows.
  • the Coulomb force type that uses the electrostatic adsorption force generated between the electrode and the object to be adsorbed, or between the dielectric and the object to be adsorbed placed
  • a non-uniform electric field is formed by generating a potential difference between two comb-shaped electrodes.
  • Gradient force types that use the generated attracting force are known, and there are structures that use these attracting forces individually and structures that use a combination of multiple forces.
  • the electrostatic adsorption structure is formed while selecting the type and characteristics of the dielectric as well as making the electrode monopolar or bipolar.
  • a ceramic material having a predetermined volume resistivity is used as a dielectric, and the electrode is embedded in the dielectric by hot pressing so as to sandwich the electrode.
  • an insulating film is used for the purpose of preventing dust generation.
  • an electrode is sandwiched between polyimide films, and thermocompression bonding is performed via an adhesive film or an adhesive.
  • the adsorption force is expressed regardless of the material to be adsorbed, and therefore, it is used to adsorb things other than the semiconductor substrate.
  • the present inventors have proposed the apparatus suitable for adsorb
  • the gradient force usually, a larger adsorption force can be obtained by narrowing the distance between the electrodes.
  • the discharge between the electrodes becomes a problem when the distance becomes shorter, a high voltage cannot be applied. Therefore, in the apparatus proposed by the present inventors, two electrodes are arranged one above the other, and an electrostatic adsorption structure having an interelectrode insulating layer (dielectric) interposed between them is used. The reliability of insulation is increased.
  • an electrostatic adsorption structure is usually formed by firmly adhering a dielectric and an electrode to form a strong integrated structure for the purpose of uniformly expressing an adsorption force.
  • they are firmly bonded to each other for the purpose of ensuring the thermal conductivity to the object to be adsorbed. Therefore, once formed electrostatic adsorption structure, for example, even if the adsorption surface is scratched or partially consumed, it is difficult to partially remove the adsorption surface and replace it. Then, it is necessary to perform a process such as mechanically scraping all the dielectric on the surface and forming a separate dielectric.
  • the present inventors have made it possible to more easily obtain an electrostatic adsorption structure in which electrodes are arranged one above the other through a dielectric, and the structure of the structure once formed.
  • a plurality of sheet members each having an electrode sandwiched between dielectrics are superposed, and the electrostatic attraction force generated between the electrodes of each sheet member is reduced.
  • the object to be adsorbed can be adsorbed while maintaining a strong integrated structure during use, and between these sheet members can be easily removed by removing the voltage application after use.
  • the present invention has been completed.
  • an object of the present invention is to provide an electrostatic attraction structure that can maintain a strong integrated structure during use and can freely change the structure of the structure after use.
  • Another object of the present invention is to obtain an electrostatic adsorption structure in which electrodes are arranged vertically via a dielectric, and can easily and reliably change the structure after use. It is an object of the present invention to provide a method for manufacturing an electrostatic adsorption structure that can be made.
  • the present invention is an electrostatic attraction structure that uses an object to be adsorbed by being electrically adsorbed, and includes a plurality of sheet members in which electrodes are sandwiched between two dielectrics, and at least one adsorption power source. And stacking a plurality of sheet members and applying a voltage between the electrodes of the opposing sheet members by an adsorption power source to electrically adsorb and fix between the opposing sheet members, and the surface outermost layer or The sheet member corresponding to the outermost layer on the back surface is used by adsorbing an object to be adsorbed on the dielectric of one or both outermost sheet members, and after use, a plurality of layers are stacked by releasing the application of voltage.
  • An electrostatic attraction structure characterized in that the sheet members can be separated from each other.
  • the present invention is a method for manufacturing the electrostatic adsorption structure, wherein a plurality of sheet members are stacked while being positioned to each other, and a voltage is applied between the electrodes of the opposing sheet members by an adsorption power source,
  • An electrostatic adsorption structure characterized in that a plurality of laminated sheet members can be separated from each other after the application of voltage is released by integrally forming the sheet members opposite to each other and integrally forming them. It is a manufacturing method of a body.
  • the electrostatic adsorption structure of the present invention has a plurality of sheet members and at least one adsorption power source, and applies a voltage from the adsorption power source between the electrodes of the opposing sheet members while laminating the plurality of sheet members.
  • the sheet members are attracted to each other by the electrostatic attraction force generated between the electrodes of the opposing sheet members, and are integrally formed. That is, the sheet member has an electrode sandwiched between two dielectrics, and when a voltage is applied by an adsorption power source, an electrostatic adsorption force can be developed between the electrodes of the opposed sheet members.
  • outermost layer sheet member one or both of the sheet members positioned in the outermost layer on the front side or the back side.
  • the body can be used as an adsorption surface to adsorb the object to be adsorbed.
  • a plurality of sheet members are preferably used in order to generate an adsorption force that reaches the adsorption surface side between the sheet member and the electrode of the opposite sheet member. It is preferable that an electrode having an opening is provided so that the lines of electric force generated between the electrodes of the opposing sheet member can reach the suction surface side. In order to obtain a larger adsorbing force, it is preferable that the sheet member laminated opposite to the outermost layer sheet member having an electrode having an opening corresponds to at least the electrode opening of the outermost layer sheet member. The electrode should be present at the position.
  • the opposing sheet member has an electrode at the projected position.
  • both the outermost layer sheet members have electrodes having openings, it is needless to say that they can be used as a double-sided adsorption structure that adsorbs an object to be adsorbed on both sides.
  • the electrode having a plurality of openings examples include a mesh electrode having a plurality of openings having a predetermined shape such as a circle, a grid electrode, and a pattern electrode such as a comb-like electrode, The present invention is not limited to these, and the number, size, shape, and the like of the openings can be appropriately designed according to the type and size of the object to be adsorbed.
  • the electrode of the sheet member that does not adsorb the object to be adsorbed may be an electrode having a plurality of openings, or may be provided with a planar electrode having no openings.
  • the suction power source for applying a voltage between the electrodes of the opposed sheet members the same power source as that used in a general electrostatic suction structure can be used, and light energy is converted into electrical energy.
  • one suction power source may be used for each facing sheet member, and one suction power source may be used between all the facing sheet member electrodes. A voltage may be applied.
  • a voltage is applied between the electrodes of the opposing sheet members by the adsorption power source so that the opposing sheet members are adsorbed and an adsorption force for the object to be adsorbed is also generated on the adsorption surface side.
  • the sheet member may be provided with a bipolar electrode, and a voltage is applied between the electrodes in the sheet member to develop an adsorption force between the opposing sheet members. You may make it express the adsorption power with respect to a to-be-adsorbed object.
  • Ceramics are formed by thermal spraying ceramic films such as alumina (Al 2 O 3 ) powder, aluminum nitride (AlN) powder, zirconia (ZrO 2 ) powder, in addition to insulating films such as polyimide and ceramic plates.
  • Thermal spray film etc. can be mentioned, but it should be used for exhibition equipment used indoors and outdoors or dust collection equipment that adsorbs dust and dirt in the atmosphere by adsorbing exhibits made of paper or resin sheet.
  • plastic films such as polyethylene terephthalate (PET), polyester, acrylic resin, epoxy resin, polyethylene, celluloid, and polyvinyl chloride.
  • PET polyethylene terephthalate
  • the dielectric may be formed by printing insulating ink.
  • the thickness of the dielectric varies depending on the materials used and the purpose of use of the structure. For example, when used for an exhibition apparatus or a dust collector used indoors or outdoors, a PET film or an insulating ink is used. It is preferable to form a structure including a dielectric having a thickness of about 20 to 70 ⁇ m.
  • the two dielectrics sandwiching the electrode may be made of different materials, or each dielectric may be formed of a plurality of layers of two or more layers.
  • the electrode forming the sheet member is not particularly limited in terms of its material, manufacturing method, etc.
  • the metal film formed by metal foil, sputtering method, ion plating method or the like may be obtained by etching into a predetermined shape.
  • a predetermined shape may be obtained by spraying a metal material or printing a conductive ink.
  • the thickness of the electrode varies depending on the purpose of use of the structure, but is generally about 5 to 20 ⁇ m.
  • the laminated sheet members are electrically adsorbed and fixed to each other by applying a voltage between the electrodes of the respective sheet members by an adsorption power source.
  • it may be fixed in advance by a fixing means.
  • a fixing means it is possible to maintain a positioned state until a voltage is applied to each electrode of the laminated sheet member, and the application of the voltage is released. Later, it should be easy to separate between the sheet members, so-called temporary fastening means, for example, a double-sided adhesive tape with adhesive applied on both sides. It can be used suitably.
  • the electrostatic attraction structure of the present invention can adsorb an object to be adsorbed while maintaining a strong integrated structure at the time of use, and after use, by canceling the application of voltage, a plurality of stacked sheets Since the members can be separated from each other, for example, a part of the laminated sheet member is turned over so that the other dielectric is used as a new attracting surface, the lamination order of the sheet members is changed, or some sheets are It is possible to easily replace only the member with a new one, and furthermore, the number of sheet members to be stacked can be easily increased or decreased. The adsorptive power to be developed can be changed accordingly.
  • the electrostatic adsorption structure of the present invention in use, a strong integrated structure in which electrodes are arranged on both sides of the dielectric is maintained, and the object to be adsorbed is adsorbed using the dielectric of the outermost sheet member as the adsorption surface. Since the sheet members can be easily separated after use, the configuration of the structure itself can be freely changed.
  • an electrostatic attraction structure having electrodes arranged vertically through a dielectric can be obtained easily and reliably, and the configuration of the structure itself can be changed. Can be obtained.
  • FIG. 1 is a cross-sectional explanatory view for explaining an electrostatic attraction structure adopted as an attraction / holding means in the electrostatic chuck device of Example 1 of the present invention.
  • FIG. 2 is an explanatory plan view (A) and (B) of an electrode employed in the electrostatic attraction structure according to Example 1 of the present invention.
  • FIG. 3 is a cross-sectional explanatory view for explaining an exhibition / posting apparatus according to Embodiment 2 of the present invention.
  • FIG. 4 is an explanatory plan view (A) and (B) of an electrode employed in an electrostatic attraction structure according to Embodiment 2 of the present invention.
  • FIG. 5 is an explanatory diagram for explaining an electrostatic attraction structure according to Embodiment 2 of the present invention.
  • FIG. 6 is a cross-sectional explanatory view for explaining an electrostatic attraction structure according to Embodiment 3 of the present invention.
  • Example 1 there is an electrostatic chuck device that uses the electrostatic adsorption structure X according to the first embodiment of the present invention as means for adsorbing and holding a semiconductor substrate such as a silicon wafer in a semiconductor manufacturing process such as plasma etching. It is shown.
  • the electrostatic chucking structure X as the semiconductor substrate chucking / holding unit includes sheet members 5 and 15 and a chucking power source 4 and is not shown in the figure.
  • An electrostatic chuck device is formed integrally with an aluminum base 7 provided with a pipe and the like, and a semiconductor substrate 8 such as a silicon wafer is formed using the dielectric 2 of the sheet member 5 in the electroadsorption structure X as an adsorption surface. Can be adsorbed and held.
  • the sheet member 5 is etched so that copper is vapor-deposited on the surface of the dielectric 1 made of a polyimide film having a size of 320 mm long ⁇ 320 mm wide ⁇ 50 ⁇ m thick, and then formed into a predetermined shape.
  • An electrode 3 having a length of 300 mm ⁇ width of 300 mm ⁇ thickness of 3 ⁇ m is formed, and a polyimide film is laminated via a bonding sheet (not shown) so as to cover the electrode 3, and the length of 320 mm ⁇ width of 320 mm ⁇ thickness of 50 ⁇ m.
  • the dielectric 2 is formed.
  • the electrode 3 as a plan view in FIG.
  • the other sheet member 15 is formed by depositing copper to form a planar electrode 13 having a length of 300 mm, a width of 300 mm, and a thickness of 3 ⁇ m without an opening.
  • the dielectric member 11 is made of a polyimide film and has a thickness of 50 ⁇ m
  • the dielectric member 12 is also made of a polyimide film and has a thickness of 50 ⁇ m.
  • a double-sided adhesive tape 6 is affixed to the edge of the body 11, and the dielectric 1 side is overlapped and fixed while positioning the remaining sheet member 5.
  • a DC power source (adsorption power source) 4 is connected between the electrode 3 of the sheet member 5 and the electrode 13 of the sheet member 15 via a connection terminal and a switch (both not shown). Is +1 kV, and a voltage of ⁇ 1 kV can be applied to the electrode 13.
  • the switch of the suction power source 4 constituting the electroadsorption structure X is turned on, and the electrodes 3 and 13 are connected.
  • an electrostatic attracting force is generated between the sheet member 5 and the sheet member 15 to be attracted and fixed to each other.
  • the dielectric 2 of the sheet member 5 is passed through the opening 3a. Since the lines of electric force generated between the electrode 3 and the electrode 13 reach and an adsorption force is developed, the semiconductor substrate 8 can be adsorbed.
  • the semiconductor substrate 8 is made dielectric by opening the switch of the adsorption power source 4 and releasing the application of voltage. While being able to remove from the body 2, since the electrostatic attraction force which generate
  • Example 2] 3 to 5 show an exhibition / posting apparatus that uses the electrostatic adsorption structure X according to the second embodiment of the present invention as display means for display / posting.
  • the electrostatic adsorption structure X as the display means includes sheet members 25 and 35 and an adsorption power source 14, and the dielectric member 32 side of the sheet member 35 is, for example, the wall surface 10.
  • the posting 9 made of a sheet of paper or resin can be adsorbed on the dielectric 22 side of the sheet member 25.
  • the sheet member 25 is obtained by screen-printing carbon ink (JELCON model CH-10 manufactured by Jujo Chemical Co., Ltd.) on a PET film (dielectric) 21 having a size of 400 mm long ⁇ 600 mm wide ⁇ 50 ⁇ m thick.
  • An electrode 23 having a length of 350 mm, a width of 550 mm, and a thickness of 10 ⁇ m is formed, and an insulating ink (JELCON model AC-3G manufactured by Jujo Chemical Co., Ltd.) is screen-printed so as to cover the electrode 23, and the length is 400 mm ⁇ width 600 mm ⁇ thickness. It is obtained by forming a dielectric 22 having a thickness of 50 ⁇ m.
  • the electrodes 23 as plan view in FIG.
  • electrode width d 1 is 3 mm
  • the opening width d 2 is formed with a plurality of openings 23a of 1 mm.
  • the other sheet member 35, as a plan view in FIG. 4 (B) are shown, electrode width d 1 of the electrode 33 is 3 mm, while allowing the opening width d 2 has a plurality of openings 33a of 1 mm, the opening It is formed in the same manner as the sheet member 25 except that the position of the portion 33a is different from the pattern of the electrode 23.
  • the adsorption power source 14 includes a solar cell 14a and a booster circuit 14b that boosts the power generated by the solar cell 14a, and stores the power generated by the solar cell 14a.
  • a large-capacitance capacitor 14c having an energy capacity of 200 mWh is provided so that a voltage can be applied to the electrode 23 and the electrode 33 even when the power generation capacity of the solar cell 14a is temporarily stopped or decreased.
  • the booster circuit 14b is provided with a power switch 14d for turning on and off the application of voltage to the electrodes 23 and 33.
  • the sheet members 25 and 35 constituting the electrostatic adsorption structure X and the adsorption power source 14 are integrally formed. It is only necessary to connect the electrodes 23 and 33 so that a voltage is applied, and these are connected by a relatively long connection cable, and the adsorption power source 14 is installed in a place convenient for power generation by the solar cell 14a. You may make it do.
  • the PET film 21 of the sheet member 25 and the PET film 31 of the sheet member 35 are overlapped and positioned while being fixed with, for example, a double-sided adhesive tape (not shown).
  • the sheet member 35 is positioned so that the electrode exists at a position corresponding to the opening 23 a of the electrode 23 that forms the sheet member 25, and the sheet member 25 is positioned on the electrode 33 that forms the sheet member 35.
  • Positioning is performed so that the electrode exists at a position corresponding to the opening 33a. That is, as shown in FIG.
  • the electrodes 23 and 33 both have a gap of 1 mm in width, and the PET of the opposing sheet member
  • the other electrode is formed so as to block the portion corresponding to the gap between the one electrode through the films 21 and 31, and the opening 23a in the electrode 23 of the sheet member 25 is formed as shown by an arrow i in FIG.
  • the electrode 33 of the sheet member 35 exists, and as indicated by the arrow ii, the opening 33a of the electrode 33 of the sheet member 35 is projected at the position projected in the thickness direction.
  • the member 25 is positioned so that the electrode 23 exists. As indicated by an arrow iii, the overlapping portion in the thickness direction of the electrode 23 and the electrode 33 is 1 mm at both ends.
  • the dielectric member 32 side of the overlapped sheet member 25 and sheet member 35 is positioned on the predetermined wall surface 10 with the power switch 14d turned off.
  • the power switch 14d is turned on, and a voltage is applied between the electrodes 23 and 33 to electrically adsorb and fix the sheet member 25 and the sheet member 35.
  • the body X is adsorbed and fixed, and the posting material 9 is attached to the surface of the dielectric 22 of the sheet member 25 for posting.
  • the power switch 14d is turned off and the posting 9 is once removed.
  • the electrostatic adsorption structure X is removed from the wall surface 10, for example, the electrostatic adsorption structure X is turned over, and the dielectric member 22 side of the sheet member 25 faces the wall surface 10, and is posted on the dielectric 32 of the sheet member 35. 9 may be used by pasting.
  • the electrostatic adsorbing structure X is formed by making the dielectric 22 of the sheet member 25 and the PET film 31 of the sheet member 35 face each other so that only the sheet member 25 is turned over and the PET film 21 side becomes the adsorption surface of the posting. You may make it form.
  • the electrostatic chuck structure X according to the third embodiment uses two sheet members 25 on which the electrostatic chuck structure X according to the second embodiment is formed, and further includes a sheet member 45 interposed therebetween. Thus, three sheet members are laminated. Among these, the sheet member 45 is the same as the sheet member 25 except that the opening 43 is not provided and the electrode 43 having a length of 350 mm ⁇ width of 550 mm ⁇ thickness of 10 ⁇ m is provided so that the entire surface becomes an electrode. Is formed. Further, in the electrostatic chucking structure X according to the third embodiment, the same as in the second embodiment except that two suction power sources 14 are used and a voltage is applied between the electrodes of the facing sheet members. It is formed.
  • the suction force generated between the facing sheet members can be increased as compared with the second embodiment.
  • the electrostatic chuck structure The body X itself can be made larger to adsorb larger postings, etc., or can be used in various ways by changing the purpose of use or the purpose of use.
  • the electrostatic adsorption structure X of the present invention described in the first to third embodiments can be used for applications other than the apparatuses described in the respective embodiments. In addition to other applications in the field, etc., it can be used as an air cleaning device that collects dust and dust in the air, sterilizes and sterilizes viruses and pathogenic bacteria, etc.
  • the present invention can also be used for a device that collects metal in liquid by using it in water or liquid, or a chip removal device that removes cutting waste generated at various work sites.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Manipulator (AREA)
  • Treatment Of Fiber Materials (AREA)
  • Jigs For Machine Tools (AREA)
PCT/JP2010/061059 2009-07-02 2010-06-29 静電吸着構造体及びその製造方法 WO2011001978A1 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2011520931A JP5500172B2 (ja) 2009-07-02 2010-06-29 静電吸着構造体及びその製造方法
SG2011097516A SG177448A1 (en) 2009-07-02 2010-06-29 Electrostatic attracting structure and fabricating method therefor
CN201080028921.9A CN102473668B (zh) 2009-07-02 2010-06-29 静电吸附构造体及其制造方法
EP10794147.8A EP2450948B1 (en) 2009-07-02 2010-06-29 Electrostatic attracting structure and fabricating method therefor
US13/381,868 US20120120545A1 (en) 2009-07-02 2010-06-29 Electrostatic attracting structure and fabricating method therefor
KR1020177001490A KR101806926B1 (ko) 2009-07-02 2010-06-29 양면 흡착 구조체, 양면 흡착 구조체의 제조방법, 및 양면 흡착 구조체를 이용한 피흡착물의 흡착방법
HK12108910.6A HK1168200A1 (zh) 2009-07-02 2012-09-12 靜電吸附構造體及其製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009157460 2009-07-02
JP2009-157460 2009-07-02

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WO2011001978A1 true WO2011001978A1 (ja) 2011-01-06

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US (1) US20120120545A1 (zh)
EP (1) EP2450948B1 (zh)
JP (1) JP5500172B2 (zh)
KR (2) KR20120100883A (zh)
CN (1) CN102473668B (zh)
HK (1) HK1168200A1 (zh)
SG (1) SG177448A1 (zh)
TW (1) TW201130081A (zh)
WO (1) WO2011001978A1 (zh)

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WO2012123188A1 (en) 2011-03-17 2012-09-20 Asml Netherlands B.V. Electrostatic clamp, lithographic apparatus, and device manufacturing method
WO2015111616A1 (ja) * 2014-01-22 2015-07-30 株式会社アルバック プラズマ処理装置、及びウェハ搬送用トレイ
TWI514510B (zh) * 2013-12-23 2015-12-21
JP2017506429A (ja) * 2014-02-05 2017-03-02 マイクロン テクノロジー， インク． 静電力による半導体ボンディング強化用のデバイス、システムおよび方法
KR20180014068A (ko) * 2015-06-11 2018-02-07 프라운호퍼 게젤샤프트 쭈르 푀르데룽 데어 안겐반텐 포르슝 에. 베. 기판 캐리어로의 기판의 정전기적 커플링을 위한 필름을 갖는 장치
JP6435481B1 (ja) * 2017-09-04 2018-12-12 株式会社プロセス・ラボ・ミクロン ワーク吸着冶具とワーク吸着装置
WO2019188341A1 (ja) 2018-03-29 2019-10-03 株式会社クリエイティブテクノロジー 吸着パッド
WO2020027246A1 (ja) 2018-08-02 2020-02-06 株式会社クリエイティブテクノロジー 静電吸着体
CN112313871A (zh) * 2018-06-28 2021-02-02 3M创新有限公司 低电压静电挤压装置
WO2024100948A1 (ja) * 2022-11-09 2024-05-16 株式会社クリエイティブテクノロジー 集塵機及び半導体製造装置

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US20120120545A1 (en) 2012-05-17
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CN102473668B (zh) 2015-01-14
JP5500172B2 (ja) 2014-05-21

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