TW201130081A - Electrostatic attracting structure and fabricating method therefor - Google Patents

Electrostatic attracting structure and fabricating method therefor

Info

Publication number
TW201130081A
TW201130081A TW099121707A TW99121707A TW201130081A TW 201130081 A TW201130081 A TW 201130081A TW 099121707 A TW099121707 A TW 099121707A TW 99121707 A TW99121707 A TW 99121707A TW 201130081 A TW201130081 A TW 201130081A
Authority
TW
Taiwan
Prior art keywords
sheet members
attracted
electrostatic attracting
laminated
method therefor
Prior art date
Application number
TW099121707A
Other languages
English (en)
Inventor
Hiroshi Fujisawa
Megumu Kawae
Yoshiaki Tatsumi
Original Assignee
Creative Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Creative Tech Corp filed Critical Creative Tech Corp
Publication of TW201130081A publication Critical patent/TW201130081A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Manipulator (AREA)
  • Treatment Of Fiber Materials (AREA)
  • Jigs For Machine Tools (AREA)
TW099121707A 2009-07-02 2010-07-01 Electrostatic attracting structure and fabricating method therefor TW201130081A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009157460 2009-07-02

Publications (1)

Publication Number Publication Date
TW201130081A true TW201130081A (en) 2011-09-01

Family

ID=43411050

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099121707A TW201130081A (en) 2009-07-02 2010-07-01 Electrostatic attracting structure and fabricating method therefor

Country Status (9)

Country Link
US (1) US20120120545A1 (zh)
EP (1) EP2450948B1 (zh)
JP (1) JP5500172B2 (zh)
KR (2) KR20120100883A (zh)
CN (1) CN102473668B (zh)
HK (1) HK1168200A1 (zh)
SG (1) SG177448A1 (zh)
TW (1) TW201130081A (zh)
WO (1) WO2011001978A1 (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9360771B2 (en) 2011-03-17 2016-06-07 Asml Netherlands B.V. Electrostatic clamp, lithographic apparatus, and device manufacturing method
CN104733364B (zh) * 2013-12-23 2017-11-03 中微半导体设备(上海)有限公司 一种静电夹盘
KR102247439B1 (ko) * 2014-01-22 2021-05-03 가부시키가이샤 아루박 플라즈마 처리 장치 및 웨이퍼 반송용 트레이
US10153190B2 (en) * 2014-02-05 2018-12-11 Micron Technology, Inc. Devices, systems and methods for electrostatic force enhanced semiconductor bonding
DE102015210736B3 (de) * 2015-06-11 2016-10-27 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung mit folie zum elektrostatischen koppeln eines substrats mit einem substratträger
CN107068592B (zh) * 2017-02-28 2023-07-25 广东工业大学 一种静电吸附拾取夹具系统
JP6811144B2 (ja) * 2017-05-30 2021-01-13 東京エレクトロン株式会社 プラズマ処理装置の静電チャックを運用する方法
JP6435481B1 (ja) * 2017-09-04 2018-12-12 株式会社プロセス・ラボ・ミクロン ワーク吸着冶具とワーク吸着装置
FR3074957A1 (fr) * 2017-12-08 2019-06-14 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede de collage par adhesion directe d'un premier substrat a un deuxieme substrat
KR102614668B1 (ko) * 2018-03-29 2023-12-19 가부시키가이샤 크리에이티브 테크놀러지 흡착 패드
CN112313812A (zh) 2018-06-28 2021-02-02 3M创新有限公司 具有挤压部件的柔性装置
CN112313871A (zh) * 2018-06-28 2021-02-02 3M创新有限公司 低电压静电挤压装置
TWI819046B (zh) 2018-08-02 2023-10-21 日商創意科技股份有限公司 靜電吸附體
CN110228283B (zh) * 2019-07-18 2020-10-09 清华大学 基于静电吸附的快速、选择性转印装置及其制造方法
WO2024100948A1 (ja) * 2022-11-09 2024-05-16 株式会社クリエイティブテクノロジー 集塵機及び半導体製造装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01135141U (zh) * 1988-03-10 1989-09-14
JPH0746437Y2 (ja) * 1989-04-17 1995-10-25 東陶機器株式会社 静電チャック
JP2804664B2 (ja) * 1992-01-21 1998-09-30 株式会社日立製作所 試料の静電吸着機構及び電子線描画装置
JPH0833359A (ja) * 1994-07-19 1996-02-02 Mitsubishi Chem Corp 静電アクチュエータの製造方法
US5532903A (en) * 1995-05-03 1996-07-02 International Business Machines Corporation Membrane electrostatic chuck
JP3847920B2 (ja) * 1997-10-06 2006-11-22 株式会社アルバック 静電吸着ホットプレート、真空処理装置、及び真空処理方法
JPH11168134A (ja) * 1997-12-03 1999-06-22 Shin Etsu Chem Co Ltd 静電吸着装置およびその製造方法
JP4013386B2 (ja) * 1998-03-02 2007-11-28 住友電気工業株式会社 半導体製造用保持体およびその製造方法
JP2003124298A (ja) * 2001-10-17 2003-04-25 Anelva Corp プラズマ支援ウェハー処理反応容器の二重静電チャックウェハーステージ
CN100470755C (zh) * 2004-03-19 2009-03-18 创意科技股份有限公司 双极型静电吸盘
JP4684222B2 (ja) 2004-03-19 2011-05-18 株式会社クリエイティブ テクノロジー 双極型静電チャック
US7352554B2 (en) * 2004-06-30 2008-04-01 Axcelis Technologies, Inc. Method for fabricating a Johnsen-Rahbek electrostatic wafer clamp
CN101326627B (zh) * 2005-12-06 2010-06-09 创意科技股份有限公司 静电卡盘用电极片以及静电卡盘

Also Published As

Publication number Publication date
CN102473668A (zh) 2012-05-23
JPWO2011001978A1 (ja) 2012-12-13
HK1168200A1 (zh) 2012-12-21
EP2450948B1 (en) 2018-11-07
EP2450948A1 (en) 2012-05-09
SG177448A1 (en) 2012-02-28
KR20120100883A (ko) 2012-09-12
US20120120545A1 (en) 2012-05-17
WO2011001978A1 (ja) 2011-01-06
KR20170010105A (ko) 2017-01-25
KR101806926B1 (ko) 2017-12-08
EP2450948A4 (en) 2012-11-07
CN102473668B (zh) 2015-01-14
JP5500172B2 (ja) 2014-05-21

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