WO2010131514A1 - マイクロチップ - Google Patents
マイクロチップ Download PDFInfo
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- WO2010131514A1 WO2010131514A1 PCT/JP2010/053638 JP2010053638W WO2010131514A1 WO 2010131514 A1 WO2010131514 A1 WO 2010131514A1 JP 2010053638 W JP2010053638 W JP 2010053638W WO 2010131514 A1 WO2010131514 A1 WO 2010131514A1
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- hole
- resin substrate
- joined
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
- B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
- B01L3/502715—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by interfacing components, e.g. fluidic, electrical, optical or mechanical interfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/13—Single flanged joints; Fin-type joints; Single hem joints; Edge joints; Interpenetrating fingered joints; Other specific particular designs of joint cross-sections not provided for in groups B29C66/11 - B29C66/12
- B29C66/131—Single flanged joints, i.e. one of the parts to be joined being rigid and flanged in the joint area
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
- B29C66/53—Joining single elements to tubular articles, hollow articles or bars
- B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
- B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/735—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the extensive physical properties of the parts to be joined
- B29C66/7352—Thickness, e.g. very thin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/02—Adapting objects or devices to another
- B01L2200/026—Fluid interfacing between devices or objects, e.g. connectors, inlet details
- B01L2200/027—Fluid interfacing between devices or objects, e.g. connectors, inlet details for microfluidic devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/06—Fluid handling related problems
- B01L2200/0689—Sealing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/04—Closures and closing means
- B01L2300/041—Connecting closures to device or container
- B01L2300/042—Caps; Plugs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/08—Geometry, shape and general structure
- B01L2300/0809—Geometry, shape and general structure rectangular shaped
- B01L2300/0816—Cards, e.g. flat sample carriers usually with flow in two horizontal directions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/08—Geometry, shape and general structure
- B01L2300/0861—Configuration of multiple channels and/or chambers in a single devices
- B01L2300/0877—Flow chambers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/08—Geometry, shape and general structure
- B01L2300/0887—Laminated structure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/06—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using friction, e.g. spin welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/10—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using hot gases (e.g. combustion gases) or flames coming in contact with at least one of the parts to be joined
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
- B29C65/20—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools with direct contact, e.g. using "mirror"
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4895—Solvent bonding, i.e. the surfaces of the parts to be joined being treated with solvents, swelling or softening agents, without adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
- B29C66/73921—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/756—Microarticles, nanoarticles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/263—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer having non-uniform thickness
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
- Y10T428/24281—Struck out portion type
- Y10T428/24289—Embedded or interlocked
Definitions
- the present invention relates to a bonded microchip, and more particularly to a microchip having a three-dimensional structure on one of two resin substrates.
- a micro-analysis chip that uses microfabrication technology to form fine channels and circuits on silicon and glass substrates to perform chemical reactions, separation, and analysis of liquid samples such as nucleic acids, proteins, or blood in a minute space
- ⁇ TAS Micro Total Analysis Systems
- a microchip is manufactured by bonding two members having at least one member subjected to microfabrication.
- a glass substrate is used for the microchip, and various fine processing methods have been proposed.
- glass substrates are not suitable for mass production and are extremely expensive, development of inexpensive and disposable resin microchips is desired.
- a resin substrate having a channel groove on the surface and a resin substrate covering the channel groove are joined.
- a resin substrate having a channel groove is manufactured by an injection molding method, a press molding method, a machining method, or the like.
- the resin substrate having the channel groove on the surface and the resin substrate for the cover are joined with the channel groove inside.
- the resin substrate for the cover functions as a lid (cover) for the channel groove, and a fine channel is formed by the channel groove.
- the microchip which has a microchannel inside is manufactured.
- a welding method that heats and presses a resin substrate using a hot plate, hot air, hot roll, ultrasonic wave, vibration, laser, etc., and a resin substrate using an adhesive or a solvent are used.
- Examples include a bonding method for bonding, a method for bonding using the adhesiveness of the resin substrate itself, and a method for bonding substrates by performing a surface treatment such as plasma treatment on the resin substrate.
- a through-hole penetrating in the thickness direction of the resin substrate is formed in the resin substrate having the flow path groove. This through hole is connected to the channel groove. Furthermore, a resinous substrate having a channel groove is provided with a cylindrical projection on the surface opposite to the surface on which the channel groove is formed so as to surround the through hole (for example, a patent). Reference 1). A tube, a nozzle, or the like is fitted to the protruding portion to introduce the liquid sample into the channel groove, and the liquid sample is discharged from the channel groove.
- a jig D for sandwiching the two substrates 100 and 200 is used.
- Two substrates 100 and 200 sandwiched between the jigs D are shown in FIG.
- the jig D needs to be brought into uniform contact with all surfaces of the substrates 100 and 200 to be in contact with the jig D.
- FIG. 7B shows the channel groove 110 in a collapsed state.
- FIG. 7C shows an unjoined portion generated around the base end side edge 131 of the through hole 130.
- the microchip in which the two substrates 100 and 200 are joined in a state where the channel groove 110 is crushed, or the base end side edge 131 of the through hole 130 is used, the same result is not always obtained from the same sample and conditions, and reproducibility is lowered.
- An object of the present invention is to solve the above problems and to provide a microchip having excellent reproducibility.
- the surface to be joined is substantially concentric with the through hole.
- a void portion having a shape cross-sectional shape and having a depth in the same direction as the thickness direction of the resin substrate is formed, and the base side edge of the through hole is projected onto the joining surface from the substantially orthogonal direction If the diameter on the base end side of the through hole is ⁇ a and the diameter on the edge side of the gap portion in contact with the surface to be joined is ⁇ c, the microchip satisfies the relationship ⁇ c> ⁇ a.
- a second aspect of the present invention is the microtic according to the first aspect, wherein the protrusion has a base end projected from the substantially orthogonal direction onto the joining surface.
- the diameter on the base end side is ⁇ b
- the relationship of 2.5 ⁇ ⁇ b> ⁇ c is satisfied.
- a third aspect of the present invention is a microchip according to the second aspect, characterized in that the relationship ⁇ b ⁇ ⁇ c is satisfied.
- a fourth aspect of the present invention is the microchip according to any one of the first to third aspects, wherein the gap portion is formed with the channel groove of the two resin substrates.
- the gap is formed between the base side edge of the through hole and the surface to be joined even when the two resin substrates are joined. It has the depth which leaves
- the fifth aspect of the present invention is the microchip according to the fourth aspect, wherein the depth of the gap is Tc, the thickness of the resin substrate is T, and the depth of the channel groove is When Ta is Ta, the relationship of Ta ⁇ Tc ⁇ T / 2 is satisfied.
- a sixth aspect of the present invention is the microchip according to the fourth aspect, wherein the gap portion is inclined obliquely from an end edge side of the gap portion toward a base end side edge of the through hole. It has a peripheral wall surface.
- a seventh aspect of the present invention is the microchip according to the fourth aspect, wherein the gap portion is inclined obliquely from the edge side of the gap portion toward the tip side edge of the through hole. It has a wall surface.
- the channel groove is kept in a desired shape, Occurrence can be prevented and reproducibility can be improved.
- (A) to (c) are cross-sectional views when the microchip according to the first embodiment of the present invention is cut along the center of the through hole, and the shapes of the respective gaps are different. is there.
- (A) is a cross-sectional view of the microchip manufacturing apparatus
- (b) is a cross-sectional view taken along the line bb of (a)
- (c) is a cross-sectional view taken along the line cc of (a).
- (A) to (c) are cross-sectional views when the microchip according to the second embodiment of the present invention is cut along the center of the through hole, and the shapes of the respective gaps are different. is there.
- FIG. 1 A) to (c) are cross-sectional views when the microchip according to the third embodiment of the present invention is cut along the center of the through hole, and the shapes of the respective gaps are different. is there.
- (A) And (b) is sectional drawing at the time of cut
- FIGS. 1A to 1C are cross-sectional views when the microchip according to the first embodiment of the present invention is cut along the center of the through hole
- FIG. 2A is a cross-sectional view of the microchip manufacturing apparatus.
- (B) is a sectional view taken along the line bb of (a)
- (c) is a sectional view taken along the line cc of (a).
- the microchip according to this embodiment includes a resin substrate 10 and a resin substrate 20.
- a channel groove 11 is formed on the surface of the resin substrate 10.
- the resin substrate 20 which is a mating side of the resin substrate 10 is a flat substrate, and a sheet or film is used. Then, the resin substrate 10 and the resin substrate 20 are joined with the surface on which the flow channel grooves 11 are formed facing inward. Thereby, the resin substrate 20 functions as a lid (cover) for the channel groove 11, a micro channel is formed by the channel groove 11, and the micro channel having the micro channel formed by the channel groove 11 inside. Chips are manufactured.
- the resin substrate 10 is formed with a through hole 13 penetrating in the thickness direction of the substrate.
- the through-hole 13 is in contact with the flow path groove 11 and is connected to the flow path groove 11 from a surface opposite to the surface where the resin substrate 10 and the resin substrate 20 are joined.
- the “surface to be bonded” refers to the surface of the resin substrate 10 on which the flow path grooves 11 are formed and / or the surface of the resin substrate 20 bonded to the surface of the resin substrate 10. .
- the opening (through hole 13) is a hole for introducing, storing, or discharging gel, a liquid sample, or a buffer solution.
- a tube or nozzle provided in the analyzer is connected to the opening (through-hole 13), and a gel, a liquid sample, or a buffer solution is introduced into the fine channel through the tube or nozzle, or Discharge from the channel groove 11.
- the resin substrate 10 is provided with a concavo-convex member on the surface opposite to the surface on which the flow path grooves 11 are formed.
- the resin substrate 10 is provided with a truncated cone-shaped protrusion 12 on the surface opposite to the surface on which the flow channel grooves 11 are formed.
- the protrusion 12 protrudes in the thickness direction of the resin substrate 10 and is provided so as to surround the through hole 13.
- the protrusion 12 is integrally provided on the resin substrate 10, but may be formed as a separate member and bonded to the resin substrate 10.
- a tube or nozzle is fitted to the projection 12 to introduce or discharge a liquid sample or the like.
- the projection part 12 shown to Fig.1 (a) has cross-sectional shape in a truncated cone shape, this is an example and is cylindrical, prismatic shape, truncated cone shape, truncated pyramid shape, etc. You may have the shape of.
- the outer shape of the resin substrate 10 may be any shape that is easy to handle and analyze, and is preferably a square or a rectangle.
- the size may be 10 mm square to 200 mm square. Further, the size may be 10 mm square to 100 mm square.
- the inner diameter of the through hole 13 may be adjusted to the analysis method or the analysis apparatus, and may be about 2 mm, for example.
- the shape of the micro flow path is within the range of 10 ⁇ m to 200 ⁇ m in both width and depth in consideration of the fact that the amount of analysis sample and reagent used can be reduced, and the fabrication accuracy of molds, transferability and releasability are taken into consideration. Although it is preferably a value, it is not particularly limited. Further, the width and depth of the channel groove 11 may be determined according to the use of the microchip. The cross-sectional shape of the channel groove 11 may be rectangular or curved.
- the plate thickness of the resin substrate 10 on which the channel groove 11 is formed is preferably 0.2 mm to 5 mm, more preferably 0.5 mm to 2 mm in consideration of moldability.
- the plate thickness of the resin substrate 20 functioning as a lid (cover) for covering the channel groove 11 is preferably 0.2 mm to 5 mm, more preferably 0.5 mm to 2 mm in consideration of moldability.
- a film sheet-like member may be used instead of a plate-like member.
- the thickness of the film is preferably 30 ⁇ m to 300 ⁇ m, and more preferably 50 ⁇ m to 150 ⁇ m.
- the outer diameter of the protrusion 12 is gradually reduced toward the opening direction of the through hole 13.
- the most advanced portion of the protrusion 12 is a flat surface.
- the diameter of the through hole 13 is constant in the height direction of the protrusion 12.
- the diameter on the base end side edge 13a side of the through hole 13 when the base end side edge 13a of the through hole 13 is projected onto the surface to be joined from the direction orthogonal to the surface to be joined is defined as ⁇ a.
- the diameter on the base end 12a side of the protrusion 12 when the base end 12a of the protrusion 12 is projected onto the surface to be bonded from the direction orthogonal to the surface to be bonded is defined as ⁇ b.
- FIG. 1A shows the base end side edge 13b of the through hole 13 when projected and the base end 12b of the projection 12 when projected.
- the through-hole 13 serving as an injection hole is a liquid reservoir for supplying an electrophoresis solution containing a separation medium such as an electrophoresis buffer and a polymer for molecular sieving, a sample solution containing a substance to be analyzed, and the like. It is necessary that one or more holes be formed so as to penetrate in the direction.
- the size of the injection hole is not particularly limited as long as the electrophoresis solution or the sample solution can be injected, but the inner diameter is preferably set in the range of 0.5 to 10 mm from the viewpoint of injection work, and is preferably 1 to 5 mm. Is more preferable.
- the through-hole 13 serving as a discharge hole is a liquid reservoir for discharging an electrophoresis solution containing a separation medium such as an electrophoresis buffer or a polymer for molecular sieving or a sample solution containing a substance to be analyzed. It is necessary that one or more holes be formed in a through or non-through manner in the direction.
- the size of the discharge hole is not particularly limited as long as the electrophoresis solution or the sample solution injected into the injection hole can be sufficiently discharged, but the inner diameter may be set in the range of 1 to 10 mm from the viewpoint of work. 2 to 5 mm is more preferable.
- FIG. 1A shows the gap portion 14 formed on the surface to be joined on the resin substrate 10 side, the end edge 14a of the gap portion 14 in contact with the surface to be joined, and the diameter ⁇ c on the end edge 14a side of the gap portion 14. Show.
- the diameter ⁇ c on the edge 14a side of the gap 14 is not particularly limited as long as the relationship ⁇ c> ⁇ a is satisfied, but preferably satisfies the relationship 2.5 ⁇ ⁇ b> ⁇ c, and ⁇ b ⁇ ⁇ c More preferably, the relationship is satisfied.
- FIG. 1B shows the gap 14 that satisfies the relationship of 2.5 ⁇ ⁇ b> ⁇ c> ⁇ b.
- a gap 14 that satisfies the relationship ⁇ b> ⁇ c> ⁇ a is shown in FIG.
- the gap 14 has a depth that leaves a gap between the base end side edge 13a of the through hole 13 and the surface to be joined.
- the depth Tc of the gap portion 14 Is not particularly limited as long as the relationship of Tc> ⁇ is satisfied.
- the thickness of the resin substrate 10 is T and the depth of the channel groove 11 is Ta
- there is a relationship of Ta ⁇ Tc ⁇ T / 2 from the viewpoint of preventing the strength of the protrusion 12 from being reduced. It is preferable that the relationship of Ta Tc is satisfied from the viewpoint of easy molding of the resin substrate 10.
- the plate thickness T of the resin substrate 10, the depth Ta of the channel groove 11, and the depth Tc of the gap 14 are shown in FIGS. It should be noted that the depth Tc of the gap 14 satisfying the above relationship is the same in the gaps 14 having different diameters shown in FIGS. 1B and 1C.
- the material used for the resin substrates 10 and 20 needs to be a transparent or translucent material in consideration of detection by UV absorption or fluorescence, but is not particularly limited. From the viewpoint of improving reproducibility, those that can be molded with a mold such as castable glass, thermosetting resin, and thermoplastic resin are preferable. A resin material is more preferable in terms of insulation and flexibility in molding. In addition, since the resin material has elasticity, the contact area can be secured by the surface pressure, which is preferable because the electrical condition is more advantageous than that of the glass substrate.
- thermoplastic resin material is used for the resin substrates 10 and 20.
- the thermoplastic resin material include polycarbonate, polymethyl methacrylate, polystyrene, polyacrylonitrile, polyvinyl chloride, polyethylene terephthalate, nylon 6, nylon 66, polyvinyl acetate, polyvinylidene chloride, polypropylene, polyisoprene, polyethylene, poly It is preferable to use dimethylsiloxane, cyclic polyolefin or the like. Particular preference is given to using polymethyl methacrylate, cyclic polyolefins and the like.
- thermosetting resin an ultraviolet curable resin, or the like may be used for the resin substrate 20 in which the channel groove is not formed. It is preferable to use polymethylsiloxane as the thermosetting resin.
- the resin substrates 10 and 20 can be produced by a method such as an extrusion molding method, a T-die molding method, an inflation molding method, a calendar molding method, an injection molding method, a press molding method, or a machining method.
- a method such as an extrusion molding method, a T-die molding method, an inflation molding method, a calendar molding method, an injection molding method, a press molding method, or a machining method.
- the flow path grooves and protrusions may be formed on the surface of the resin substrate by injection molding, or the flow path grooves and protrusions may be formed on the surface of the resin substrate by machining. Also good.
- the film-shaped resin substrate 20 used in the present embodiment is a member having an electrode (not shown), and the flow path groove 11 of the plate-shaped resin substrate 10 is formed in order to form a fine flow path. It is necessary to make it join to the surface which is done.
- the electrode is provided on the film-like resin substrate 20, but the electrode may be provided on the resin substrate 10 side, and from the through hole 13. It may be a form to be introduced. Further, in the case where the sample analysis is not performed by electrophoresis, it is needless to say that no electrode is provided.
- the bonding between the resin substrate 10 and the resin substrate 20 is performed by a bonding method according to the prior art.
- the resin substrate 10 and the resin substrate 20 are heated and pressed using a hot plate, hot air, a hot roll, ultrasonic waves, vibration, laser, or the like.
- the resin substrate 10 and the resin substrate 20 may be joined using an adhesive or a solvent.
- the form which presses and presses is preferable.
- the surface of the resin substrate 10 is located outside the base end 12a (opposite to the center of the protrusion 12) with the base end 12a of the protrusion 12 of the resin substrate 10 as a boundary.
- Jig D is in contact with. By doing so, the jig D does not contact the protrusion 12.
- FIG. 2A shows a gap S provided between the base end 12a of the projection 12 as a boundary, the jig D, and the upper surface (the most advanced portion) of the projection 12.
- FIG. 2A Since the jig D only needs to be in contact with a portion of the flat surface other than the protrusion 12, it is not necessary to press the protrusion 12 with the jig D, and even if a processing accuracy error occurs, the protrusion 12 is It is possible to prevent the flow path from being deformed by being deformed or by the protrusion 12 being pushed out toward the bonding surface.
- the jig D when the jig D is in strong contact with the protruding portion 120, the pressure P exceeding a predetermined value applied to the protruding portion 120 causes the proximal end edge 131 of the through hole 130 as shown in FIG.
- the amount of deformation ⁇ is approximately the same as the depth of the channel groove 110, and the channel groove 110 may be crushed.
- the deformation amount ⁇ of the base end side edge 13a of the through-hole 13 is a slight value with respect to the depth of the channel groove 11. It becomes possible to do. Therefore, when the resin substrates 10 and 20 are joined, the flow path groove 11 is not crushed by the base end side edge 13a of the through-hole 13 which is deformed.
- the through-hole is caused by the pressure P that does not reach a predetermined value applied to the protrusion 120 due to the jig D weakly contacting or not contacting the protrusion 120.
- the predetermined pressure P can be applied to the periphery of the edge 131 by the jig D, it is possible to prevent the occurrence of an unjoined portion.
- FIG. 1 that satisfies the relationship of 2.5 ⁇ ⁇ b> ⁇ c, which satisfies the relationship of ⁇ c> ⁇ a, and the bonding between the resin substrate 10 having the gap portion 14 and the resin substrate 20 shown in FIG.
- the joining of the resin substrate 10 having the gap 14 shown in (c) and the resin substrate 20 will be described.
- the jig D has the protrusion 12
- Pressurization may be applied to the outer periphery of the base end 12a, or pressurization may be performed so that the jig D is in contact with the surface of the resin substrate 10 corresponding to the outside from the end edge 14a of the gap portion 14a.
- the edge 14a of the gap 14 is more outward than the base end 12a of the protrusion 12, pressure by the jig D is sufficiently applied to the edge 14a. Therefore, the edge 14a of the gap 14 is made of resin. It is possible to prevent generation of an unbonded portion bonded to the substrate 20. Further, the diameter ⁇ c of the end edge 14a of the gap 14 may be smaller than 2.5 times the diameter ⁇ b of the base end side edge 13a of the through hole 13 until the base end 12a of the protrusion 12 is reached. Even when pressure is applied by the jig D, it is preferable because the bonding can be reliably performed without causing deformation of the channel groove 11.
- ⁇ c> ⁇ a may be satisfied.
- ⁇ c ⁇ ⁇ a + ( ⁇ b More preferably, ⁇ a) / 2 is satisfied.
- FIGS. 3A to 3C are cross-sectional views when the microchip is cut along the center of the through-hole, and the shapes of the respective gaps are different.
- the gap portion 14 is provided on the resin substrate 20 that functions as a lid (cover) for covering the flow path groove 11.
- the diameter ⁇ c on the edge 14a side of the gap 14 is not particularly limited as long as the relationship ⁇ c> ⁇ a is satisfied, but preferably satisfies the relationship 2.5 ⁇ ⁇ b> ⁇ c, and ⁇ b ⁇ ⁇ c More preferably, the relationship is satisfied.
- FIG. 3B shows the gap 14 that satisfies the relationship of 2.5 ⁇ ⁇ b> ⁇ c> ⁇ b.
- a gap 14 that satisfies the relationship ⁇ b> ⁇ c> ⁇ a is shown in FIG.
- the gap 14 has a depth that leaves a gap between the base end side edge 13a of the through hole 13 and the surface to be joined.
- the depth Tc of the gap portion 14 Is not particularly limited as long as the relationship of Tc> ⁇ is satisfied.
- the thickness of the resin substrate 20 is T, it is preferable to have a relationship of Tc ⁇ T / 2 from the viewpoint of preventing the strength reduction of the resin substrate 20.
- the plate thickness T of the resin substrate 20 and the depth Tc of the gap 14 are shown in FIG. Note that the depth Tc of the gap 14 satisfying the above relationship is the same in the gaps 14 having different diameters shown in FIGS. 3B and 3C.
- the jig D When the resin substrates 10 and 20 are joined, the jig D is brought into contact with the surface of the outer resin substrate 10 from the base end 12a with the base end 12a of the protrusion 12 of the resin substrate 10 as a boundary. Therefore, the jig does not contact the protrusion 12. Since the jig D does not contact the protrusion 12, the deformation amount ⁇ of the base end side edge 13 a of the through hole 13 is a small value with respect to the depth Ta of the flow path groove 11. Therefore, when the resin substrates 10 and 20 are joined, the flow path groove 11 is not crushed by the base end side edge 13a of the through-hole 13 which is deformed. Further, the end edge 14a of the gap portion 14 is bonded to the resin substrate 20, and generation of an unbonded portion can be prevented.
- the jig D is the base of the protrusion 12. Pressure may be applied to the outer periphery of the end 12a, or pressure may be applied so that the jig D is in contact with the surface of the resin substrate 10 corresponding to the outside from the end edge 14a of the gap portion 14.
- FIG. 4 (a) to 4 (c) are cross-sectional views when the microchip is cut along the center of the through hole, and the shapes of the respective void portions are different.
- the gap portion 14 is provided on the resin substrate 20 on which the flow path grooves 11 are formed.
- the gap portion 14 has a peripheral wall surface 14b that is inclined obliquely from the end edge 14a side of the gap portion 14 toward the proximal end side edge 13a of the through hole 13.
- ⁇ a be the diameter of the through hole 13 on the base end side edge 13b side when the base end side edge 13a of the through hole 13 is projected onto the surface to be joined.
- ⁇ c the diameter on the edge 14a side of the gap portion 14 in contact with the surfaces to be joined.
- the relationship ⁇ c> ⁇ a is satisfied.
- the diameter on the base end 12b side of the projection 12 when projected on the surface to which the base end 12a of the projection 12 is joined is ⁇ b
- the relationship of ⁇ b ⁇ ⁇ c is satisfied.
- FIG. 4B shows the gap 14 that satisfies the relationship ⁇ b> ⁇ c> ⁇ a.
- FIGS. 5A and 5B are cross-sectional views when the microchip is cut along the center of the through hole, and the shapes of the respective void portions are different.
- the gap portion 14 is provided on the resin substrate 20 on which the flow path grooves 11 are formed.
- the gap portion 14 has a peripheral wall surface 14b that is inclined obliquely from the end edge 14a side of the gap portion 14 toward the front end side edge 13c of the through hole 13.
- the front end side edge 13 c of the through hole 13 is also the base end side edge 13 a of the through hole 13. Therefore, the diameter of the through hole 13 on the base end side edge 13b side when projected on the surface to which the front end side edge 13c of the through hole 13 is joined is defined as ⁇ a.
- the diameter on the edge 14a side of the gap 14 in contact with the surfaces to be joined is ⁇ c
- the relationship ⁇ c> ⁇ a is satisfied.
- the diameter on the base end 12b side of the projection 12 when projected on the surface to which the base end 12a of the projection 12 is joined is ⁇ b
- the relationship of ⁇ b ⁇ ⁇ c is satisfied.
- the diameter ⁇ c on the edge 14a side of the gap 14 satisfies the relationship ⁇ b ⁇ ⁇ c> ⁇ a.
- the gap portion 14 preferably satisfies the relationship ⁇ b ⁇ ⁇ c from the viewpoint of preventing the strength reduction of the resin substrate 20.
- the gap 14 satisfies the relationship T ⁇ Tc ⁇ Td.
- (Resin substrate) By molding acrylic resin (Acryprene manufactured by Mitsubishi Rayon Co., Ltd.), which is a transparent resin material, using an injection molding machine, a resin substrate on the channel side in which a plurality of channel grooves, a plurality of through holes, and protrusions are formed is produced. did.
- the resin substrate on the flow path side corresponds to an example of the resin substrate 10 on which the flow path grooves 11, the protrusions 12, and the through holes 13 are formed in the above-described embodiment.
- Example 1 to Example 6 and Comparative Example 1 A resin substrate on the flow path side in which each value of the gap portion 14 was changed was produced to produce a microchip.
- Example 1 to Example 6 the diameter ⁇ a on the base end side of the through hole 13, the diameter ⁇ b on the base end side of the protrusion, and the diameter ⁇ c on the end edge side of the gap 14 satisfy the relationship of ⁇ a ⁇ c. ing.
- Example 1 a void portion of ⁇ a + ( ⁇ b ⁇ a) / 4 was created in the resin substrate 10, and a resin substrate 20 of acrylene 75 ⁇ m manufactured by Mitsubishi Rayon Co., Ltd. was thermocompression bonded.
- Example 2 a ⁇ b gap was created in the resin substrate 10, and a resin substrate 20 of 75 ⁇ m acrylene manufactured by Mitsubishi Rayon Co., Ltd. was thermocompression bonded.
- Example 3 a 2 ⁇ ⁇ b gap was created in the resin substrate 10, and the acrylic substrate 75 ⁇ m resin substrate 20 manufactured by Mitsubishi Rayon Co., Ltd. was thermocompression bonded.
- Example 4 a 2.5 ⁇ ⁇ b void was created in the resin substrate 10, and the acrylic substrate 75 ⁇ m resin substrate 20 manufactured by Mitsubishi Rayon Co., Ltd. was thermocompression bonded.
- Example 5 a void portion of ⁇ a + ( ⁇ b ⁇ a) / 2 was created in the resin substrate 10, and the resin substrate 20 of acrylprene 75 ⁇ m manufactured by Mitsubishi Rayon Co., Ltd. was thermocompression bonded.
- Example 6 the mold was pressed against a resin substrate 20 of acrylylene 75 ⁇ m manufactured by Mitsubishi Rayon Co., Ltd. while being heated to 80 ° C. to form a ⁇ b void, and the resin substrate 10 having no void Thermocompression bonding was performed.
- Comparative Example 1 a resin substrate having no void portion and a resin substrate 20 having an acrylene of 75 ⁇ m manufactured by Mitsubishi Rayon Co., Ltd. were thermocompression bonded.
- Example 1 to Example 3 Example 5, and Example 6, the diameter ⁇ c of the gap satisfies the relationship of ⁇ a ⁇ c ⁇ 2.5 ⁇ ⁇ b. Does not satisfy the relationship of ⁇ c ⁇ 2.5 ⁇ ⁇ b.
- Example 6 the reproducibility of the microchip which is the effect of this invention was evaluated. The evaluation was performed three times on the sample prepared under the same conditions, and the average value was evaluated. (Reproducibility test) As shown in FIG. 6, 10 ⁇ l of pure water is put into the channel groove as shown in FIG. 6, and a pressure of 0.1 MPa is applied using a syringe. After applying the pressure, pure water is applied to the protrusion on the opposite side. Measured the time difference to reach.
- ⁇ indicates a difference of 1 second or more
- ⁇ indicates a difference within 1 second
- ⁇ indicates a difference within 0.5 seconds
- ⁇ indicates a difference of 0. Indicates that it is within 1 second.
- Example 1 to Example 6 it was confirmed that the time difference was within 1 second. In the samples according to Examples 1 to 6, it was considered that sufficient reproducibility was obtained because unjoined portions did not occur on the surfaces to be joined.
- the strength of the microchip was evaluated. Similarly to the reproducibility test, the strength test was performed three times on a sample prepared under the same conditions. (Strength test) Using a small press manufactured by AS ONE, a pressure of 3 kN was applied to the upper part of the protrusion, and the deformation state of the sample was examined.
- ⁇ indicates that a microcrack has occurred in any of the three tests within a range where there is no problem in use, and “ ⁇ ” indicates that the test was performed three times.
- deformation occurred at the base end (base) of the protruding portion indicating that minute deformation remained after the pressurization was stopped.
- ⁇ indicates any sample among the three tests. Also, although the base end of the protrusion is deformed by pressurization, no deformation remains when the pressurization is stopped.
- Example 1 Example 2, Example 5, and Example 6, no deformation remained after the pressurization was stopped, and excellent strength was exhibited. Thus, it was confirmed that the samples according to Example 1 to Example 3, Example 5, and Example 6 had sufficient strength.
- Example 3 Even when pressurization was stopped, there was a case where minute deformation occurred at the base end (base) of the protrusion.
- Example 4 although there was no problem in use, a minute crack sometimes occurred at the base end (base) of the protrusion.
- the sample produced in Comparative Example 1 had a poor reproducibility test result and different values for the three samples. This is presumably because an unbonded portion is generated at the base end (base) of the protruding portion, or the insufficiently bonded portion is peeled off by pressurization, resulting in uneven flow.
- the material and dimensions of the resin substrate shown in the above-described embodiments are only examples, and the present invention is not limited to these.
- the substantially circular cross-sectional shape of the gap portion 14 is the same shape in the depth direction, but by gradually reducing the diameter of the substantially circular cross-sectional shape of the gap portion 14 in the depth direction.
- a peripheral wall surface inclined from the end edge 14a side of the gap portion 14 toward the base end side edge 13a of the through hole 13 may be provided, and the through hole 13 may be formed from the end edge 14a side of the gap portion 14. You may make it have the surrounding wall surface which inclines toward the front end side edge 13c diagonally.
- the resin mentioned in the above-described embodiment is used, the same result as in the example can be obtained.
Abstract
Description
この発明の第1実施形態に係るマイクロチップについて図1及び図2を参照して説明する。図1(a)~(c)はこの発明の第1実施形態に係るマイクロチップを貫通孔の中心に沿って切断した場合の断面図、図2(a)はマイクロチップの製造装置の断面図、(b)は(a)のb-b線断面図、(c)は(a)のc-c線断面図である。
(第2実施形態)
この発明の第2実施形態に係るマイクロチップについて図3を参照して説明する。図3(a)~(c)はマイクロチップを貫通孔の中心に沿って切断した場合の断面図であって、それぞれの空隙部の形状を異ならせた図である。
(第3実施形態)
この発明の第3実施形態に係るマイクロチップについて図4を参照して説明する。図4(a)~(c)はマイクロチップを貫通孔の中心に沿って切断した場合の断面図であって、それぞれの空隙部の形状を異ならせた図である。
(第4実施形態)
この発明の第4実施形態に係るマイクロチップについて図5を参照して説明する。図5(a)~(b)はマイクロチップを貫通孔の中心に沿って切断した場合の断面図であって、それぞれの空隙部の形状を異ならせた図である。
(樹脂製基板)
射出成形機で透明樹脂材料のアクリル(三菱レーヨン株式会社製アクリプレン)を成形することで、複数の流路用溝と複数の貫通孔と突起部とが形成された流路側の樹脂製基板を作製した。この流路側の樹脂製基板が、上述した実施形態における流路用溝11と突起部12と貫通孔13とが形成された樹脂製基板10の1例に相当する。
厚さ=1mm
流路用溝11の幅、深さ=50μm
また、透明樹脂材料としてアクリルを用いて、基板の厚さが75μmで、一辺の長さが50mmのカバー側の樹脂製基板を作製した。このカバー側の樹脂製基板が、上述した実施形態における樹脂製基板20に相当する。
(接合)
次に、流路用溝が形成された表面を内側にして、流路側の樹脂製基板とカバー側の樹脂製基板とを重ねた。その状態で2つの樹脂製基板を治具Dで挟み、90℃の加熱下で、1kg/cm2の圧力を加えて、1分間保持することでマイクロチップを作製した。
(評価)
そして、実施例1から実施例6について、本発明の効果であるマイクロチップの再現性を評価した。評価は同じ条件で作成したサンプルに対して3回行いその平均値により評価した。
(再現性試験)
作製したサンプルに図6に示すように流路用溝中に10μリットルの純水を入れ、シリンジを用いて、0.1MPaの圧力を加え、圧力を加えてから逆側の突起部に純水が到達するまでの時間の差を計測した。
(強度試験)
AS ONE製 小型プレス機を用いて突起部上部に3kNの圧力を加圧して、サンプルの変形具合を調べた。
(まとめ)
比較例1で作製したサンプルは、再現性試験の結果が悪く、3つのサンプルとも違った値となった。これは、突起部の基端(付け根)等に未接合部が発生していたり、加圧することで接着不十分な部分が剥がれてしまい、流れが不均一になっていると考えられる。これに対して、本発明のサンプルは、いずれも優れた再現性を示しており、特に、φa+(φb-φa)/2≦φcの関係を満たす空隙部がより好ましかった。実施例4で作製したサンプルは、使用には問題ないものの、空隙部が大きく、突起部の基端が比較的脆いため、サンプルを上下から加圧したときに微小なクラックを発生した。以上より空隙部はφa+(φb-φa)/2≦φc<2.5×φcの範囲であることがより好ましい。
11 流路用溝
12 突起部
12a 基端
12b 接合する面に投影した場合の突起部の基端
13 貫通孔
13a 基端側縁
13b 接合する面に投影した場合の貫通孔の基端側縁
13c 先端側縁
14 空隙部
14a 端縁
20 樹脂製基板
Claims (7)
- 2つの樹脂製基板のうち少なくとも1つの樹脂製基板の表面には流路用溝が形成され、前記流路用溝が形成される面を内側にして前記2つの樹脂製基板が接合され、前記2つの樹脂製基板のいずれか一方の樹脂製基板には、2つの樹脂製基板が接合する面とは反対側の面から前記流路用溝に繋がる略円形断面形状の貫通孔が形成されると共に、前記反対側の面に、前記貫通孔を囲むように設けられた前記樹脂製基板の厚さ方向に突出する突起部が形成されたマイクロチップにおいて、
前記2つの樹脂製基板の一方又は他方の樹脂製基板の前記接合する面であって、前記接合する面に対して略直交する方向から前記突起部を投影させた場合の前記接合する面に、前記貫通孔と同心の略円形断面形状で前記樹脂製基板の厚さ方向と同方向の深さを有する空隙部が形成され、
前記略直交する方向から前記接合する面に前記貫通孔の基端側縁を投影させた場合の前記貫通孔の基端側の径をφaとし、前記接合する面に接する前記空隙部の端縁側の径をφcとすると、以下の関係
φc>φa
を満たすことを特徴とするマイクロチップ。 - 前記略直交する方向から前記接合する面に前記突起部の基端を投影させた場合の前記突起部の基端側の径をφbとすると、以下の関係
2.5×φb>φc
を満たすことを特徴とする請求項1に記載のマイクロチップ。 - 以下の関係
φb≧φc
を満たすことを特徴とする請求項2に記載のマイクロチップ。 - 前記空隙部は、前記2つの樹脂製基板のうち前記流路用溝が形成された樹脂製基板の前記接合する面に形成され、
さらに、前記空隙部は、前記2つの樹脂製基板を接合した場合でも、前記貫通孔の基端側縁と前記接合する面との間に隙間を残しておくような前記深さを有していることを特徴とする請求項1から請求項3のいずれかに記載のマイクロチップ。 - 前記空隙部の深さをTc、前記樹脂製基板の厚さをT、前記流路用溝の深さをTaとすると、以下の関係
Ta≦Tc≦T/2
を満たすことを特徴とする請求項4に記載のマイクロチップ。 - 前記空隙部は、前記空隙部の端縁側から前記貫通孔の基端側縁に向かって斜めに傾斜する周壁面を有することを特徴とする請求項4に記載のマイクロチップ。
- 前記空隙部は、前記空隙部の端縁側から前記貫通孔の先端側縁に向かって斜めに傾斜する周壁面を有することを特徴とする請求項4に記載のマイクロチップ。
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US13/320,214 US9238224B2 (en) | 2009-05-15 | 2010-03-05 | Microchip |
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JP2011513278A JP5187442B2 (ja) | 2009-05-15 | 2010-03-05 | マイクロチップ |
EP10774773.5A EP2431748B1 (en) | 2009-05-15 | 2010-03-05 | Microchip |
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US (1) | US9238224B2 (ja) |
EP (1) | EP2431748B1 (ja) |
JP (1) | JP5187442B2 (ja) |
CN (1) | CN102422164B (ja) |
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CN102422164B (zh) | 2015-12-16 |
CN102422164A (zh) | 2012-04-18 |
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US20120052240A1 (en) | 2012-03-01 |
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