CN102422164B - 微芯片 - Google Patents

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Publication number
CN102422164B
CN102422164B CN201080020713.4A CN201080020713A CN102422164B CN 102422164 B CN102422164 B CN 102422164B CN 201080020713 A CN201080020713 A CN 201080020713A CN 102422164 B CN102422164 B CN 102422164B
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CN
China
Prior art keywords
resin substrate
space part
hole
composition surface
jut
Prior art date
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Expired - Fee Related
Application number
CN201080020713.4A
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English (en)
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CN102422164A (zh
Inventor
鹫巢贵志
平山博士
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Fujifilm Wako Pure Chemical Corp
Original Assignee
Wako Pure Chemical Industries Ltd
Konica Minolta Opto Inc
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Publication of CN102422164A publication Critical patent/CN102422164A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502715—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by interfacing components, e.g. fluidic, electrical, optical or mechanical interfaces
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    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
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    • B29C66/53—Joining single elements to tubular articles, hollow articles or bars
    • B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
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    • B01L2300/0816—Cards, e.g. flat sample carriers usually with flow in two horizontal directions
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    • B01L2300/0861—Configuration of multiple channels and/or chambers in a single devices
    • B01L2300/0877—Flow chambers
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/10—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using hot gases (e.g. combustion gases) or flames coming in contact with at least one of the parts to be joined
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    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
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    • Y10T428/24289—Embedded or interlocked

Abstract

在二个树脂基板中的至少一个树脂基板表面形成流路用槽，使形成了流路用槽的面在内侧地接合二个树脂基板，在二个树脂基板的任何一个树脂基板上，形成从二个树脂基板的接合面的反面连通流路用槽的略圆形截面形状的贯通孔，同时，在反面上形成围着贯通孔设置的在树脂基板的厚度方向上突出的突起部，在从略垂直于接合面的方向投影突起部时的接合面上，形成与贯通孔同心的略圆形截面形状的在树脂基板厚度方向的相同方向上具有深度的空隙部，若以从略垂直方向在接合面上投影贯通孔的底端侧边时贯通孔的底端侧边的径为φa，与接合面相接的空隙部的边缘的径为φc，则满足以下关系：φc＞φa。

Description

微芯片
技术领域
本发明涉及接合的微芯片，尤其涉及二个树脂基板之一具有立体构造的微芯片。
背景技术
利用微细加工技术在硅和玻璃基板上形成微细流路和回路、在微小空间进行核酸、蛋白质或血液等液体试剂的化学反应、分离、分析等的微芯片，或被称之为μTAS(MicroTotalAnalysisSystems)的装置，已经实用化。这种微芯片的优点在于可以减少样品和试剂的使用量或废液排出量，实现省空间能够携带的廉价系统。
微芯片是通过粘合在至少一个部件上实施了微细加工的二个部件来制造的。以往的微芯片中采用玻璃基板，有建议各种微细加工方法。但是玻璃基板不适合于大量生产，成本非常高，所以，希望开发廉价的能够一次性使用的树脂制微芯片。
制造树脂微芯片时，是接合表面具有流路用槽的树脂基板和覆盖流路用槽的树脂基板。具有流路用槽的树脂基板通过注射成型法、模压成型法或机械加工等方法制造。然后使流路用槽在内侧地接合表面具有流路用槽的树脂基板和覆盖用树脂基板。通过该接合，覆盖用树脂基板起到流路用槽的盖子的功能，通过流路用槽形成微细流路，由此制造内部具有微细流路的微芯片。树脂基板与树脂基板的接合可以举出用热板、热风、热辊、超声波、振动、激光等加热压接树脂基板的熔接方法、用粘结剂和溶剂接合树脂基板的粘结方法、利用树脂基板本身粘性接合的方法以及在树脂基板上实施等离子处理等表面处理来互相接合基板的方法等。
另外，在具有流路用槽的树脂基板上形成了贯通树脂基板厚度方向的贯通孔。该贯通孔与流路用槽连通。并且在具有流路用槽的树脂基板上，在形成了流路用槽之表面的反面上，设有围着贯通孔的筒状突起部(例如专利文献1)。在该突起部上嵌合插管、管嘴等，将液体试剂导入流路用槽，或从流路用槽排出液体试剂。
如图7所示，用上述方法接合二个树脂基板100、200(以下称之为“基板”)时，用夹具D夹住二个基板100、200。图7(a)表示被夹具D夹住的二个基板100、200。接合二个基板100、200时，必须使夹具D均匀地接触必须与夹具D接触的基板100、200的全面。
先行技术文献
专利文献
专利文献1：特开2006-234600号公报
发明内容
发明欲解决的课题
用夹具夹住二个平坦基板时比较容易使夹具均匀地接触必须与夹具接触的基板的全面。但如图7(a)所示，在一个基板100具有突起部120等立体构造时，则难以使夹具D与其他平坦部位一样均匀地接触突起部120的上面122，存在问题。例如在夹具D上加工立体构造时，接触突起部120上面122的夹具D的实际尺寸与接触突起部120下部121的夹具D的实际尺寸，相互之间相对设计值有数十μm程度的加工尺寸误差。用具有这种加工尺寸误差的夹具D夹持基板100、200时，出现由于夹具D对突起部120上面122的作用力强对其他平坦部位面的作用力弱而施加在突起部120上的压力P超过所定值的情况，相反，还有由于夹具D对突起部120上面122的作用力弱对其他平坦部位面的作用力强而施加在突起部120上的压力P不满所定值的情况。
施加在突起部120上的压力P超过所定值时，贯通孔130的底端侧边131变形，压损具有深度Ta的流路用槽110，2个基板100、200在流路用槽100被压损的状态下接合，存在问题。图7(b)中出示了压损状态的流路用槽110。反之，施加在突起部120上面122的压力不满所定压力时，贯通孔130底端侧边131周边(突起部120正下方)出现未接合部分，存在问题。图7(c)中出示贯通孔130底端侧边131周边出现的未接合部分。
在上述液体试剂的化学反应等试验中，采用如上所述在流路用槽110被压损状态下接合的2个基板100、200的微芯片，或贯通孔130底端侧边131周边有未接合部分的微芯片时，从同样的试剂和条件并不一定能够得到同样的结果，即再现性低下。
本发明的目的在于解决上述问题，提供一种再现性优异的微芯片。
用来解决课题的手段
为了解决上述课题，本发明的第一形态是一种微芯片，它是在二个树脂基板中的至少一个树脂基板表面形成流路用槽，使形成了所述流路用槽的面在内侧地接合所述二个树脂基板，在所述二个树脂基板的任何一个树脂基板上，形成从所述二个树脂基板的接合面的反面连通所述流路用槽的略圆形截面形状的贯通孔，同时，在所述反面上形成围着所述贯通孔设置的在所述树脂基板的厚度方向上突出的突起部，微芯片的特征在于，在所述二个树脂基板的一个或另一个树脂基板的所述接合面的、从略垂直于所述接合面的方向投影所述突起部时的所述接合面上，形成与所述贯通孔同心的略圆形截面形状的在所述树脂基板厚度方向的相同方向上具有深度的空隙部，若以从所述略垂直方向在所述接合面上投影所述贯通孔的底端侧边时所述贯通孔的底端侧边的径为φa，与所述接合面相接的所述空隙部的边缘的径为φc，则满足关系：φc＞φa。
本发明的第二形态是第一形态涉及的微芯片，其特征在于，若以从所述略垂直方向在所述接合面上投影所述突起部的底端时所述突起部底端的径为φb，则满足关系：2.5×φb＞φc。
本发明的第三形态是第二形态涉及的微芯片，其特征在于，满足关系：φb≥φc。
本发明的第四形态，是第一至第三形态的任何之一涉及的微芯片，其特征在于，所述空隙部被形成在所述二个树脂基板中形成了所述流路用槽的树脂基板的所述接合面上，并且，所述空隙部具有即使在接合所述二个树脂基板时也在所述贯通孔的底端侧边与所述接合面之间留有间隙的所述深度。
本发明的第五形态是第四形态涉及的微芯片，其特征在于，若以所述空隙部的深度为Tc、所述树脂基板的厚度为T、所述流路用槽的深度为Ta，则满足关系：Ta≤Tc≤T/2。
本发明的第六形态是第四形态涉及的微芯片，其特征在于，所述空隙部具有从所述空隙部的边缘向所述贯通孔的底端侧边倾斜的周壁面。
本发明的第七形态是第四形态涉及的微芯片，其特征在于，所述空隙部具有从所述空隙部的边缘向所述贯通孔的先端侧边倾斜的周壁面。
发明的效果
根据本发明的第一形态，在一个树脂基板上具有突起部时接合二个基板的情况时，能够保持流路用槽所望的形状，防止出现未接合部分，能够提高再现性。
另外，根据本发明的第二及第三形态，能够提高再现性。
并且，根据本发明的第四形态，接合二个基板时，能够保持流路用槽所定的形状。
并且，根据本发明的第五至第七形态，接合二个基板时，进一步能够保持流路用槽所定的形状。
附图说明
图1：(a)～(c)是本发明第一实施方式微芯片沿贯通孔中心截开的截面图，是空隙部形状各不相同的图。
图2：(a)是微芯片制造装置的截面图，(b)是(a)的b-b线截面图，(c)是(a)的c-c线截面图。
图3：(a)～(c)是本发明第二实施方式微芯片沿贯通孔中心截开的截面图，是空隙部形状各不相同的图。
图4：(a)～(c)是本发明第三实施方式微芯片沿贯通孔中心截开的截面图，是空隙部形状各不相同的图。
图5：(a)及(b)是本发明第四实施方式微芯片沿贯通孔中心截开的截面图，是空隙部形状各不相同的图。
图6：微芯片的试验结果示意图。
图7：以往例子微芯片制造装置的截面图。
具体实施方式
第一实施方式
参照图1、图2，对本发明第一实施方式的微芯片作说明。图1(a)～(c)是本发明第一实施方式微芯片沿贯通孔中心截开的截面图，图2(a)是微芯片制造装置的截面图，(b)是(a)的b-b线截面图，(c)是(a)的c-c线截面图。
本实施方式的微芯片备有树脂基板10和树脂基板20。树脂基板10表面形成了流路用槽11。与树脂基板10接合的对方树脂基板20是平板状基板，采用片状和薄膜状等基板。然后，使形成了流路用槽11的面在内侧地接合树脂基板10和树脂基板20。于是，树脂基板20起到流路用槽11的盖子的功能，通过流路用槽11形成微细流路，制造内部具有由流路用槽11形成的微细流路的微芯片。
树脂基板10上形成了在基板厚度方向上贯通的贯通孔13。该贯通孔13与流路用槽11相接，从树脂基板10与树脂基板20接合的面的反面，与流路用槽11连通。这里的“接合面”是指：形成了流路用槽11之树脂基板10的面，以及/或者，与树脂基板10的面接合的树脂基板20的面。通过接合树脂基板10与树脂基板20，成为连接流路用槽11和外部的开口部。因为贯通孔13与流路用槽11相通，所以，贯通孔13的开口部与微细流路连通。开口部(贯通孔13)是用来导入、保存或排出凝胶体、液体试剂或缓冲液等的孔。在该开口部(贯通孔13)上连接分析装置上设有的试管和管嘴，经由试管和管嘴，向微细流路导入或从流路用槽11排出凝胶体、液体试剂或缓冲液等。
树脂基板10上，在形成了流路用槽11之表面的相反表面，进一步设有凹凸部件。例如如图1(a)所示，树脂基板10上，在形成了流路用槽11之表面的相反表面上，设有圆锥台状的突起部12。该突起部12在树脂基板10的厚度方向上突出，围着贯通孔13。本例中，突起部12与树脂基板10构成一体，但也可以作为分开的部件成型突起部12，再接合到树脂基板10上。在该突起部12上嵌合试管和管嘴，进行液体试剂等的导入和排出。图1(a)中所示的突起部12具有截面形状呈圆锥台状的形状，但这只不过是一例，也可以具有圆柱状、角柱状、圆锥台状、角锥台状等形状。
树脂基板10的外形形状只要是容易操作和分析的形状即可，优选正方形、长方形等形状。作为一例，可以是10mm方～200mm方的大小。也可以是10mm方～100mm方的大小。贯通孔13的内径只要与分析手法和分析装置相适即可，例如可以为2mm左右。
至于微细流路的形状，考虑可以减少分析试剂试药的使用量和成型模具的制作精度、转印性、脱模性等，优选宽、深度值都为10μm～20μm范围内，但并不局限于此。另外，流路用槽11的宽和深度可以根据微芯片的用途决定。流路用槽11的截面形状可以是矩形形状也可以是曲面形状。
形成流路用槽11的树脂基板10的板厚，考虑成型性优选0.2mm～5mm，较优选0.5mm～2mm。起到用来覆盖流路用槽11之盖子功能的树脂基板20的板厚，考虑成型性优选0.2mm～5mm，较优选0.5mm～2mm。另外，在起到盖子功能的树脂基板20上不形成流路用槽11时，也可以不采用板状部件而采用薄膜(片状部件)。此时，薄膜的厚度优选30μm～300μm，较优选50μm～150μm。
本实施方式中，突起部12的外径向着贯通孔13的开口方向渐渐减小。突起部12的最先端部分是平坦面。另外，贯通孔13的直径在突起部12的高度方向一定。在图1(a)、图2中出示突起部12的底端12a以及贯通孔13的底端侧边13a。
以从垂直于接合面的方向在接合面上投影贯通孔13的底端侧边13a时贯通孔13底端侧边13a的径为φa。另外，以从垂直于接合面的方向在接合面上投影突起部12底端12a时突起部12底端12a的径为φb。在图1(a)中出示投影时贯通孔13的底端侧边13b以及投影时突起部12的底端12b。
作为注入孔的贯通孔13，是用来供给包括电泳用缓冲液、分子筛选用聚合物等分离用媒质的泳动液和包括分析对象物质的试剂液等的液体滞留部，必须是贯通板厚方向的形状，且形成一个以上的孔。注入孔的尺寸只要是能够注入泳动液和试剂液的大小即可，没有特殊限定，但从注入操作观点出发，优选内径设定在0.5～10mm范围，较优选1～5mm。
作为排出孔的贯通孔13，是用来排出包括电泳用缓冲液、分子筛选用聚合物等分离用媒质的泳动液和包括分析对象物质的试剂液等的液体滞留部，必须是贯通或非贯通板厚方向的形状，且形成一个以上的孔。排出孔的尺寸只要是足够能够排出被注入注入孔的泳动液和试剂液的大小即可，没有特殊限定，但从操作上的观点出发，优选内径设定在1～10mm范围，较优选2～5mm。
在从略垂直于二树脂基板10、20接合面的方向在接合面上投影突起部12底端12a时的接合面上，形成了与贯通孔13同心的略圆形截面形状的、在树脂基板10厚度方向的相同方向具有深度的空隙部14。空隙部14可以设在树脂基板10的接合面或树脂基板20的接合面的至少一面上。图1(a)中出示了形成在树脂基板10接合面上的空隙部14、与接合面相接的空隙部14的边缘14a、以及空隙部14边缘14a的径φc。
空隙部14边缘14a的径φc只要满足关系：φc＞φa，没有特殊限定，但优选满足关系：2.5×φb＞φc，更优选满足关系：φb≥φc。图1(a)中出示满足关系：φb＝φc的空隙部14。在图1(b)出示满足关系：2.5×φb＞φc＞φb的空隙部14。在图1(c)出示满足关系：φb＞φc＞φa的空隙部14。
空隙部14具有即使在二树脂基板10、20接合时也在贯通孔13底端侧边13a与接合面之间留有间隙之深度。若以接合时贯通孔13底端侧边13a的变形量(树脂基板板厚方向的变形量)为δ，空隙部14深度为Tc，则空隙部14深度Tc只要满足关系：Tc＞δ即可，没有特殊限定。然而，若以树脂基板10板厚为T，流路用槽11深度为Ta，则出于防止突起部12强度低下，优选持有关系：Ta≤Tc≤T/2，出于树脂基板10的成型容易度，更优选满足关系：Ta＝Tc。
在图1(a)、图2中出示树脂基板10板厚T、流路用槽11深度Ta以及空隙部14深度Tc。满足上关系的空隙部14的深度Tc，在图1(b)、(c)中分别出示的径的大小不同的空隙部14的情况时也都一样。
所采用的树脂基板10、20的材料，考虑通过UV吸收和荧光等检测，必须是透明或半透明的材料，但没有特殊限定。从提高再现性之观点出发，优选能够注射成型的玻璃、热固化性树脂、热塑性树脂等能够用模具成型的材料。出于绝缘性和成型自由度，较优选树脂材料。另外，树脂材料具有弹性，可以通过面压确保接触面积，与玻璃基材相比电条件有利，优选。
从生产性面来说，树脂基板10、20采用热塑性树脂材料。作为热塑性树脂材料，优选采用例如聚碳酸酯、聚甲基丙烯酸甲酯、聚苯乙烯、聚丙烯腈、聚氯乙烯、聚对苯二甲酸乙二醇酯、尼龙6、尼龙66、聚醋酸乙烯酯、聚偏二氯乙烯、聚丙烯、聚异戊二烯、聚乙烯、聚二甲基硅氧烷、环状聚烯烃等。尤其优选采用聚甲基丙烯酸甲酯、环状聚烯烃等。
树脂基板10和树脂基板20可以采用相同材料，也可以采用不同材料。另外，不形成流路用槽的树脂基板20除了热塑性树脂之外还可以采用热固化性树脂和紫外线固化性树脂等。作为热固化性树脂，优选采用聚甲基矽氧烷。
树脂基板10、20可以通过挤压成型法、T-die成型法、膨胀成型法、碾压成型法、注射成型法、模压成型法或机械加工法等方法制作。例如可以通过注射成型法在树脂基板表面形成流路用槽和突起部，也可以通过机械加工法在树脂基板表面形成流路用槽和突起部。
本实施方式中采用的薄膜状树脂基板20是具有电极(图示省略)的部件，为了形成微细流路，必须与板状树脂基板10上形成了流路用槽11的面接合。这里是设想电泳试剂分析，以薄膜状树脂基板20上设有电极的方式作说明，但也可以是电极设在树脂基板10上从贯通孔13导入的方式。非电泳试剂分析时，当然可以不设电极。
接下去参照图2，对树脂基板10与树脂基板20的接合作说明。图2是具有满足φb＝φc关系的图1(a)所示的空隙部14的树脂基板10、20和夹具D的示意图。
树脂基板10与树脂基板20的接合采用以往技术的接合方法进行。用例如热板、热风、热辊、超声波、振动或激光等加热压接树脂基板10和树脂基板20。也可以用粘结剂和溶剂接合树脂基板10和树脂基板20，但如果粘结剂和溶剂引起流路径变动的话，则分析再现性有时恶化，所以优选加热压接方式。
树脂基板10、20接合时，以树脂基板10突起部12的底端12a为境界，使夹具D接触底端12a外侧(突起部12中心的相反侧)的树脂基板10表面。这样夹具D不接触突起部12。
在图2(a)中出示作为境界的突起部12底端12a，以及夹具D与突起部12上面(最先端面)之间设有的空隙S。因为夹具D只要接触突起部12以外的平坦面部分，不需要夹具D靠压突起部12，所以，即使是在存在加工精度误差的情况时，也能够防止突起部12变形和向接合面方向推出突起部12引起流路变形。
以往技术中，由于夹具D对突起部120的作用较强，超过所定值的压力P施加在突起部120上，所以如图7(b)所示，贯通孔130底端侧边131的变形量δ与流路用槽110的深度几乎为相同值，流路用槽110有可能被压损。而本实施方式中，因为夹具D不接触突起部12，所以，能够使贯通孔13底端侧边13a的变形量δ相对流路用槽11的深度来说是微小值。因此，树脂基板10、20接合时，不会由于贯通孔13底端侧边13a变形而压损流路用槽11。
另外以往技术中，由于夹具D对突起部120的作用较弱或不接触，不满所定值的压力P施加在突起部120上，所以如图7(c)所示，贯通孔130底端侧边131周边有可能出现未接合的部分，本实施方式中，由于存在空隙部14，通过施加在平坦部上的压力，夹具D能够对贯通孔130底端侧边131周边也施加所定的压力P，所以能够防止发生未接合部分。
详细如下，因为夹具D接触并对树脂基板10突起部12底端12a施加所定压力P，所以，在接合面上投影突起部12底端12a时的突起部12底端12b被与树脂基板20接合。这是因为突起部12底端12b的径φb与空隙部14边缘14a的径φc满足关系：φb＝φc，所以空隙部14边缘14a被接合到树脂基板20上，能够防止发生未接合部分。在图2(b)、(c)中出示夹具D接触并施加所定压力P的树脂基板10的突起部12的底端12a。
以上，对具有满足关系：φb＝φc的图1(a)所示的空隙部14的树脂基板10和树脂基板20的接合作了说明。
接下去，对具有满足关系2.5×φb＞φc的图1(b)所示空隙部14的树脂基板10和树脂基板20的接合，以及具有满足关系φc＞φa的图1(c)所示空隙部14的树脂基板10和树脂基板20的接合作说明。
如图1(b)所示，具有满足关系2.5×φb＞φc的空隙部14的树脂基板10和树脂基板20接合时，夹具D可以至突起部12底端12a外周为止加压，也可以使夹具D接触相当于空隙部14边缘14a外侧的树脂基板10表面并加压。
由于空隙部14边缘14a在突起部12底端12a的外侧，夹具D一直充分加压到边缘14a，所以空隙部14边缘14a被接合到树脂基板20上，能够防止发生未接合部分。另外，使空隙部14边缘14a的径φc小于贯通孔13底端侧边13a的径φb的2.5倍，这样，即使夹具D一直加压到突起部12底端12a，也能够避免流路用槽11发生变形地确切接合，优选。
具有满足关系φb＞φc＞φa的图1(c)所示空隙部14的树脂基板10和树脂基板20接合时，夹具D与树脂基板10、20的关系，与具有满足关系φb＝φc的图1(a)所示空隙部14的树脂基板10和树脂基板20接合时的情况相同。以突起部12底端12a为境界，优选夹具D接触相当于底端12a外侧的树脂基板10的表面。
通过夹具D接触突起部12底端12a并施加所定的压力P，空隙部14边缘14a也被施加最小所需以上的压力。于是，空隙部14边缘14a被接合到树脂基板20上，能够防止发生未接合部分。为了得到本发明的效果，只要φc＞φa即可，但为了到空隙部14边缘14a都确切接合，在φb＞φc＞φa时，进一步优选满足φc≥φa+(φb-φa)/2。通过满足这一范围，能够对空隙部14边缘14a施加恰当的压力。
第二实施方式
参照图3，对本发明第二实施方式微芯片作说明。图3(a)～(c)是微芯片沿贯通孔中心截开时的截面图，是各空隙部形状不同的图。
以下主要说明第二实施方式微芯片的结构与第一实施方式的不同点，省略说明与第一实施方式相同的点。第二实施方式中，空隙部14设在起到用来覆盖流路用槽11之盖子的功能的树脂基板20上。
空隙部14边缘14a的径φc只要满足关系：φc＞φa，没有特殊限定，但优选满足关系：2.5×φb＞φc，更优选满足关系：φb≥φc。在图3(a)出示满足关系：φb＝φc的空隙部14。在图3(b)出示满足关系：2.5×φb＞φc＞φb的空隙部14。在图3(c)出示满足关系：φb＞φc＞φa的空隙部14。
空隙部14具有即使在二树脂基板10、20接合时也在贯通孔13底端侧边13a与接合面之间留有间隙之深度。若以接合时贯通孔13底端侧边13a的变形量(树脂基板板厚方向的变形量)为δ，空隙部14深度为Tc，则空隙部14深度Tc只要满足关系：Tc＞δ即可，没有特殊限定。然而，若以树脂基板20板厚为T，则出于防止树脂基板20强度低下，优选持有关系：Tc≤T/2。在图3(a)中出示树脂基板20板厚T及空隙部14深度Tc。满足上关系的空隙部14的深度Tc，在图3(b)、(c)中分别出示的径的大小不同的空隙部14的情况时也都一样。
树脂基板10、20接合时，以树脂基板10突起部12的底端12a为境界，使夹具D接触底端12a外侧的树脂基板10表面。这样夹具D不接触突起部12。因为夹具D不接触突起部12，所以，能够使贯通孔13底端侧边13a的变形量δ相对流路用槽11的深度来说是微小值。因此，树脂基板10、20接合时，不会由于贯通孔13底端侧边13a变形而压损流路用槽11。另外，空隙部14边缘14a被接合到树脂基板20上，能够防止发生未接合部分。
具有满足关系2.5×φb＞φc的图3(b)所示空隙部14的树脂基板10和树脂基板20接合时，夹具D可以直至突起部12底端12a外周为止加压，也可以使夹具D接触相当于空隙部14边缘14a外侧的树脂基板10表面并加压。
第三实施方式
参照图4，对本发明第三实施方式微芯片作说明。图4(a)～(c)是微芯片沿贯通孔中心截开时的截面图，是各空隙部形状不同的图。
以下主要说明第三实施方式微芯片的结构与第一实施方式的不同点，省略说明与第一实施方式相同的点。第三实施方式中，空隙部14设在形成了流路用槽11的树脂基板20上。
空隙部14具有从空隙部14边缘14a向贯通孔13底端侧边13a倾斜的周壁面14b。以在接合面上投影贯通孔13底端侧边13a时贯通孔13底端侧边13b的径为φa。若以与接合面相接的空隙部14边缘14a的径为φc，则满足关系：φc＞φa。另外，若以在接合面上投影突起部12底端12a时突起部12底端12b的径为φb，则满足关系：φb≥φc。由上述可以得到，空隙部14边缘14a的径φc满足关系：φb≥φc＞φa。在图4(a)中出示满足关系φb＝φc的空隙部14。在图4(c)中出示满足关系φb＞φc＞φa的空隙部14。
若以树脂基板10板厚为T，空隙部14深度为Tc，流路用槽11深度为Ta，则出于防止树脂基板20强度低下，优选空隙部14维持关系：Ta＜Tc≤T。在图4(a)～(c)中出示满足关系Tc＝T的空隙部14。满足上关系的空隙部14的深度Tc，在图4(b)、(c)中分别出示的径的大小不同的空隙部14的情况时也都一样。
第四实施方式
参照图5，对本发明第四实施方式微芯片作说明。图5(a)～(c)是微芯片沿贯通孔中心截开时的截面图，是各空隙部形状不同的图。
以下主要说明第四实施方式微芯片的结构与第一实施方式的不同点，省略说明与第一实施方式相同的点。第四实施方式中，空隙部14设在形成了流路用槽11的树脂基板20上。
空隙部14具有从空隙部14边缘14a向贯通孔13先端侧边13c倾斜的周壁面14b。此时，贯通孔13的先端侧边13c也是贯通孔13的底端侧边13a。因此，以在接合面上投影贯通孔13先端侧缘13c时贯通孔13底端侧边13b的径为φa。
若以与接合面相接的空隙部14边缘14a的径为φc，则满足关系：φc＞φa。另外，若以在接合面上投影突起部12底端12a时突起部12底端12b的径为φb，则满足关系：φb≥φc。由上述可以得到，空隙部14边缘14a的径φc满足关系：φb≥φc＞φa。
出于防止树脂基板20强度低下，优选空隙部14满足关系：φb≥φc。在图5(a)中出示满足关系φb＝φc的空隙部14。在图5(b)中出示满足关系φb＞φc＞φa的空隙部14。
若以树脂基板10板厚为T，空隙部14深度为Tc，以贯通孔深度为Td，则空隙部14满足关系：T＜Tc≤Td。在图5(a)、(b)中出示满足关系Tc＝Td的空隙部14。
实施例
接下去对上述实施方式的具体实施例作说明。
[树脂基板]
用注射成型机成型透明树脂材料丙烯(三菱丽阳株式会社生产的“ACRYPLEN”)，制作形成了多个流路用槽、多个贯通孔、突起部的带流路树脂基板。该带流路树脂基板相当于上述实施方式中形成了流路用槽11、突起部12、贯通孔13的树脂基板10一例。
带流路树脂基板的尺寸如下：
一边的长度＝50mm
厚度＝1mm
流路用槽11的宽、深度＝50μm
另外，采用透明树脂材料丙烯，制作基板厚度为75μm、一边长度为50mm的盖子树脂基板。该盖子树脂基板相当于上述实施方式中的树脂基板20。
[接合]
接下去使形成了流路用槽的表面在内地重合带流路树脂基板和盖子树脂基板。在重合的状态下用夹具D夹住2树脂基板，在90℃加热下施加1kg/cm2压力，保持1分钟，制作微芯片。
树脂基板10、20接合时，以树脂基板10突起部12的底端12a为境界，使夹具D接触底端12a外侧(突起部12中心的相反侧)的树脂基板10表面。这样夹具D不接触突起部12。该接合方法在以下制作实施例1至实施例6及比较例1的微芯片时也同样。
改变空隙部14各值制作带流路树脂基板，然后制作微芯片。在图6表中出示实施例1至实施例6及比较例1的结果。实施例1至实施例6及比较例1中，空隙部14深度Tc和流路用槽11深度Ta满足关系：Ta＝Tc。
实施例1至实施例6中，贯通孔13底端的径φa、突起部底端的径φb及空隙部14边缘的径φc满足关系：φa＜φc。
例如实施例1中，在树脂基板10上制作φa+(φb-φa)/4的空隙部，热压接合三菱丽阳株式会社生产的“ACRYPLEN”制75μm的树脂基板20。
实施例2中，在树脂基板10上制作φb的空隙部，热压接合三菱丽阳株式会社产生的“ACRYPLEN”制75μm的树脂基板20。
实施例3中，在树脂基板10上制作2×φb的空隙部，热压接合三菱丽阳株式会社产生的“ACRYPLEN”制75μm的树脂基板20。
实施例4中，在树脂基板10上制作2.5×φb的空隙部，热压接合三菱丽阳株式会社产生的“ACRYPLEN”制75μm的树脂基板20。
实施例5中，在树脂基板10上制作φa+(φb-φa)/2的空隙部，热压接合三菱丽阳株式会社生产的“ACRYPLEN”制75μm的树脂基板20。
实施例6中，在三菱丽阳株式会社生产的“ACRYPLEN”制75μm的树脂基板20上，将模具加热到80℃按下，形成φb的空隙部，与没有空隙部的树脂基板10热压接合。
比较例1中，热压接合没有空隙部的树脂基板和三菱丽阳株式会社生产的“ACRYPLEN”制75μm的树脂基板20。
如上所述，实施例1到实施例3、实施例5及实施例6中空隙部的径φc满足关系：φa＜φc＜2.5×φb，实施例4中不满足关系：φc＜2.5×φb。
[评价]
对实施例1到实施例6，评价本发明效果的微芯片的再现性。对用相同条件制作的样品作三次评价，取平均值作为评价结果。
[再现性试验]
如图6所示，在制成的样品的流路用槽中注入10μ升纯水，用注射器施加0.1Mpa压力，测量从施加压力到纯水到达相反侧突起部的时间差。
图6表中，「×」表示差在1秒以上，「△」表示差在1秒以内，「○」表示差在0.5秒以内，「◎」表示差在0.1秒以内。
实施例1到实施例6中，确认到时间差在1秒以内。可以认为，实施例1到实施例6的样品因为接合面上没有发生未接合部分，所以得到了充分的再现性。
比较例中确认到时间差在1秒以上。可以认为，比较例1的样品因为在贯通孔底端侧边周边发生未接合部分，所以没能得到充分的再现性。
进一步对实施例1到实施例6评价了微芯片的强度。强度试验中与再现性试验相同，对用相同条件制作的样品作三次评价。
[强度试验]
用ASONE制造的小型模压机对突起部上部施加3kN压力，检查样品的变形程度。
图6表中，「△」表示三次试验中有样品出现使用上不成问题范围的微小裂缝；「○」表示三次试验中有样品出现突起部底端(根基)变形，且停止加压后微小变形残留；「◎」表示三次试验中样品虽然有加压引起的突起部底端变形，但停止加压后变形完全消失。
实施例1、实施例2、实施例5及实施例6中，停止加压后变形完全消失，表示出优异的强度。由此，确认到实施例1至实施例3、实施例5及实施例6的样品能够得到充分的强度。
实施例3中，有时停止加压突起部底端(根基)也出现微小变形。实施例4中，有时突起部底端(根基)出现使用上不成问题的微小裂缝。
[归纳]
比较例1中制作的样品再现性试验结果不良，3个样品出现不同的值。可以认为这是因为突起部底端(根基)等出现未接合部分，还有加压粘结不充分的部分剥离，流动不均匀，而本发明样品都显示出优异的再现性，尤其是满足关系φa+(φb-φa)/2≤φc的空隙部较优选。实施例4中制作的样品虽然使用上不成问题但由于空隙部大，所以突起部底端比较脆弱，对样品上下施加加压时出现微小裂缝。由上述可知，空隙部在φa+(φb-φa)/2≤φc＜2.5×φc范围较优选。
上述实施例中出示的树脂基板的材料和尺寸只不过是一例，本发明并不局限于此。例如上述实施例中，空隙部14的略圆形截面形状在深度方向上是相同的形状，但也可以使空隙部14略圆形截面形状的径在深度方向渐渐减小，由此，使之具有从空隙部14边缘14a向贯通孔13底端侧边13a倾斜的周壁面，还可以使之具有从空隙部14边缘14a向贯通孔13先端侧缘13c倾斜的周壁面。采用例如上述实施方式中例举的树脂时，也能够得到与实施例同样的结果。
符号说明
10树脂基板
11流路用槽
12突起部
12a底端
12b投影到接合面上时的突起部的底端
13贯通孔
13a底端侧边
13b投影到接合面上时的贯通孔的底端侧边
13c先端侧边
14空隙部
14a边缘
20树脂基板

Claims (5)

1.一种微芯片，是在二个树脂基板中的至少一个树脂基板表面形成流路用槽，使形成了所述流路用槽的面在内侧地接合所述二个树脂基板，在所述二个树脂基板的任何一个树脂基板上，形成从所述二个树脂基板的接合面的反面连通所述流路用槽的圆形截面形状的贯通孔，同时，在所述反面上形成围着所述贯通孔设置的在所述树脂基板的厚度方向上突出的突起部，微芯片的特征在于，
在所述二个树脂基板的一个或另一个树脂基板的所述接合面的、从垂直于所述接合面的方向投影所述突起部时的所述接合面上，形成与所述贯通孔同心的圆形截面形状的在所述树脂基板厚度方向的相同方向上具有深度的空隙部，
若以从所述垂直方向在所述接合面上投影所述贯通孔的底端侧边时所述贯通孔的底端侧边的径为φa，与所述接合面相接的所述空隙部的边缘的径为φc，则满足以下关系：φc＞φa，
所述空隙部被形成在所述二个树脂基板中形成了所述流路用槽的树脂基板的所述接合面上，
所述空隙部具有从所述空隙部的边缘向所述贯通孔的底端侧边的周壁面或从所述空隙部的边缘向所述贯通孔的先端侧边倾斜的周壁面。
2.如权利要求1中记载的微芯片，其特征在于，若以从所述垂直方向在所述接合面上投影所述突起部的底端时所述突起部底端的径为φb，则满足以下关系：2.5×φb＞φc。
3.如权利要求2中记载的微芯片，满足以下关系：φb≥φc。
4.如权利要求1至3的任何一项中记载的微芯片，其特征在于，
所述空隙部具有即使在接合所述二个树脂基板时也在所述贯通孔的底端侧边与所述接合面之间留有间隙的所述深度。
5.如权利要求4中记载的微芯片，其特征在于，若以所述空隙部的深度为Tc、所述形成了所述流路用槽的树脂基板的厚度为T、所述流路用槽的深度为Ta，则满足以下关系：Ta≤Tc≤T/2。
CN201080020713.4A 2009-05-15 2010-03-05 微芯片 Expired - Fee Related CN102422164B (zh)

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