WO2010116654A1 - 薄膜形成装置及び薄膜形成方法 - Google Patents

薄膜形成装置及び薄膜形成方法 Download PDF

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Publication number
WO2010116654A1
WO2010116654A1 PCT/JP2010/002176 JP2010002176W WO2010116654A1 WO 2010116654 A1 WO2010116654 A1 WO 2010116654A1 JP 2010002176 W JP2010002176 W JP 2010002176W WO 2010116654 A1 WO2010116654 A1 WO 2010116654A1
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WO
WIPO (PCT)
Prior art keywords
workpiece
thin film
work
holding
resin
Prior art date
Application number
PCT/JP2010/002176
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
廣瀬治道
瀧澤洋次
西垣寿
Original Assignee
芝浦メカトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 芝浦メカトロニクス株式会社 filed Critical 芝浦メカトロニクス株式会社
Priority to JP2011508220A priority Critical patent/JPWO2010116654A1/ja
Priority to CN201080014333XA priority patent/CN102369572A/zh
Publication of WO2010116654A1 publication Critical patent/WO2010116654A1/ja

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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
    • G11B7/266—Sputtering or spin-coating layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers

Definitions

  • the present invention relates to a thin film forming apparatus and a thin film forming method for forming a thin film on the surface of a flat workpiece, for example.
  • Protective hard coat layers are provided on the surfaces of liquid crystal panels and cover panels for mobile phones and the like, and on the surfaces of substrates such as optical disks.
  • the hard coat layer is formed by curing a resin thin film.
  • a resin thin film serving as an adhesive to one or both substrates.
  • a spin coating method As a method of forming a resin thin film on the surface of such a flat panel member (hereinafter referred to as a workpiece) such as a display panel, a protective panel, or a substrate, a spin coating method is generally used ( Patent Document 1).
  • the application of the resin by the spin coat method is performed, for example, as follows.
  • the nozzle N drops the resin R on the work W placed on the turntable T.
  • the resin R spreads on the surface of the workpiece W due to the centrifugal force.
  • JP 2002-343701 A JP-A-6-343908
  • the formation of a thin film by the spin coating method as described above has the following problems. That is, there is a possibility that surrounding dust falls on the work placed on the turntable. The dust that falls in this way becomes a factor that hinders the spread of the resin during the rotation of the workpiece, and affects the quality and yield of the product.
  • the resin moves toward the periphery of the workpiece by the centrifugal force of rotation, and the excess resin is scattered. Since the resin that has moved to the periphery of the work in this way moves downward due to gravity, the resin tends to adhere to the side of the work. For example, as shown in FIG. 12, when the workpiece W is a rectangular liquid crystal panel or a cover panel, a step or a groove is formed on the side. When a thin film is formed on the surface of the workpiece W, the adhesion of the resin to the side part is not preferable because it causes an electric system or a problem in mounting.
  • the present invention has been proposed to solve the above-described problems of the prior art, and its purpose is to prevent the adhesion of dust to the workpiece and the adhesion of the film material to the sides of the workpiece.
  • Another object of the present invention is to provide a thin film forming apparatus and a thin film forming method capable of forming a thin film having a uniform thickness.
  • the thin film forming apparatus of the present invention supplies a film material to a holding portion that holds the upper surface of a flat workpiece and a lower surface in the vertical direction of the workpiece held by the holding portion. It has a supply part, and a rotation mechanism which rotates the work held by the holding part so that the film material supplied by the supply part is spread on the lower surface of the work.
  • the holding unit holds the upper surface of the flat plate-shaped workpiece
  • the supply unit supplies the film material to the lower surface in the vertical direction of the workpiece held by the holding unit
  • the rotation mechanism includes the supply unit. The work held by the holding part is rotated so that the film material supplied by the step is spread on the lower surface of the work.
  • the supply surface of the film material to the workpiece is directed downward, so that falling dust is difficult to adhere and the factors that hinder the spread can be eliminated, improving the quality and yield. To do.
  • the resin that has moved on the lower surface of the work is directed downward by gravity, it does not adhere to the side of the work.
  • the supply unit includes an application unit that attaches a film material to the lower surface of the workpiece.
  • the film material can be easily spread by rotating the work after the film material is attached to the lower surface of the work.
  • Another aspect is characterized in that a plurality of the application sections are provided.
  • the film thickness uniformity can be adjusted by applying the film material to a plurality of points by a plurality of application portions.
  • the supply unit has an ejection part for ejecting a film material toward the lower surface of the workpiece.
  • the film material can be spread on the lower surface of the workpiece at a higher speed by ejecting the film material.
  • Another aspect is characterized in that a plurality of the ejection portions are provided.
  • the film thickness can be made uniform or partially changed by changing the ejection amount or ejection speed at the plurality of ejection portions.
  • the holding portion includes a holding member having an outer shape equal to or smaller than the outer shape of the workpiece.
  • the holding member since the holding member is smaller than the workpiece, the scattered film material can be prevented from adhering to the holding member.
  • Another aspect is characterized by having an elevating mechanism that changes a relative position between the workpiece and the supply unit so that a vertical distance between the workpiece and the supply unit changes.
  • the supply mechanism contains the film material so that the film mechanism spreads on the lower surface of the workpiece by causing the lowering mechanism to approach or contact the lower surface of the rotating workpiece to the surface of the film material. It is characterized by having a container.
  • Another aspect is characterized in that the airflow on the lower surface side of the work caused by the rotation of the work is changed by changing the distance between the work and the film material.
  • the holding unit is moved to a plurality of locations including the supply unit.
  • the holding unit can be moved from the previous process to the subsequent process while holding the work upper surface, and it is not necessary to invert the work. And cost reduction.
  • a thin film forming apparatus and a thin film formation capable of forming a thin film with a uniform thickness while preventing the adhesion of dust to the workpiece and the adhesion of the film material to the side of the workpiece.
  • a method can be provided.
  • the present embodiment is a thin film forming apparatus that forms a protective hard coat film on the surface of a liquid crystal panel (hereinafter referred to as a workpiece) of a mobile phone.
  • a workpiece a liquid crystal panel
  • work to this embodiment since well-known all techniques are applicable, description is abbreviate
  • the present embodiment includes a holding unit 2 that holds the workpiece 1, a supply unit 3 and a curing unit 4 that are appropriately positioned below the holding unit 2, as shown in FIGS. 1 to 3.
  • the holding unit 2 includes a holding mechanism 21, a rotating mechanism 22, an elevating mechanism 23, a moving mechanism 24, and the like. As shown in FIG. 2, the holding mechanism 21 has a holding member 21a and a suction nozzle 21b.
  • the holding member 21 a is a flat plate and is rotatably provided by the rotation mechanism 22.
  • the holding member 21a has an outer shape that is equal to or smaller than the outer shape of the workpiece 1 when viewed from the plane direction.
  • the suction nozzle 21b is a nozzle that holds the workpiece 1 by suction.
  • the suction nozzle 21b is connected to a vacuum source (not shown) and can suck and release the upper surface of the workpiece 1 by switching a valve or the like.
  • the rotation mechanism 22 is means for rotating the holding mechanism 21 by a motor 22a that is a drive source.
  • the rotating mechanism 22 is provided so as to be lifted and lowered by a lifting mechanism 23.
  • the elevating mechanism 23 is a drive mechanism having a column portion 23a, an arm portion 23b, and the like.
  • the column portion 23 a is a vertical member, and is provided so as to be movable in the horizontal direction by the moving mechanism 24.
  • the arm part 23b is a member in the horizontal direction, and one end is provided so as to be movable in the vertical direction with respect to the column part 23a.
  • a mechanism for moving the arm portion 23b any known technique such as a mechanism using a feed screw driven by a motor or a mechanism using a cylinder can be applied.
  • the rotation mechanism 22 is attached to the other end of the arm portion 23b.
  • the moving mechanism 24 is a mechanism that moves the holding unit 2 between the supply unit 3 and the curing unit 4 by moving the support column 23 a in the horizontal direction.
  • the moving mechanism 24 for example, a mechanism that moves linearly along a guide member 24b such as a rail or a guide shaft by a motor-driven feed screw 24a can be considered.
  • the present invention is not limited to this, and any known mechanism can be applied as long as it can be moved horizontally.
  • the supply unit 3 includes a tank 31, a supply nozzle 32, a pump 33, a filter 34, a receiving unit 35, and the like.
  • the tank 31 is a container that stores an ultraviolet curable resin R as a film material.
  • the supply nozzle 32 is a nozzle (application unit) that supplies the resin R delivered from the tank 31 to the lower surface of the workpiece 1 in the vertical direction (gravity direction).
  • the receiving part 35 is a container that receives the resin R dropped from the supply nozzle 32 and the workpiece 1.
  • the resin R received in the receiving portion 35 is returned to the tank 31 through the recovery path 35a.
  • the curing unit 4 includes a receiving unit 41, an irradiation device 42, a protective member 43, and the like.
  • the receiving portion 41 is a container that receives the resin R dropped from the work 1.
  • the resin R received in the receiving portion 41 is discarded through the discard path 41a.
  • the irradiation device 42 is provided at the center of the receiving portion 41.
  • the irradiation device 42 is a device that irradiates the entire lower surface of the work 1 held by the holding mechanism 21 with ultraviolet rays UV.
  • the protective member 43 is a glass plate attached to the upper part of the irradiation device 42 in the receiving portion 41.
  • the protection member 43 protects the irradiation device 42 from the resin R dripping from the work 1 and can transmit the ultraviolet rays UV from the irradiation device 42.
  • the operations of the elevating mechanism 23, the moving mechanism 24, the motor 22a, the pump 33, the irradiation device 42, the vacuum source (including valves, etc.) are controlled by the control device.
  • This control device can be realized by, for example, a dedicated electronic circuit or a computer operating with a predetermined program. Therefore, a computer program for controlling the operation of the apparatus according to the procedure described below and a recording medium recording the computer program are also one aspect of the present invention.
  • the holding unit may be configured to continuously carry in from the previous process and carry it out to the next process as it is while holding the workpiece. This eliminates the need for work such as changing the workpiece.
  • the moving mechanism for moving the holding unit may be rotated by a turntable or the like.
  • a plurality of holding units 2 may be mounted on the turntable 5.
  • the turntable 5 is moved by an index mechanism into a loading position 5A for loading the workpiece 1, a supply position 5B provided with the feeding portion 3, a curing position 5C provided with the curing portion 4, and a loading position 5D for unloading the workpiece 1.
  • it is configured to rotate intermittently.
  • the workpieces 1 held by the holding units 2 are loaded with the workpiece 1 at the loading position 5A, supplied with resin at the supply position 5B, cured resin at the curing position 5C, and workpiece 1 at the unloading position 5D as the turntable 5 rotates. Is carried out.
  • this embodiment since it is possible to perform processing in parallel at a plurality of positions, manufacturing efficiency is improved.
  • the film thickness can be adjusted by repeatedly supplying the resin to the work in multiple steps.
  • the resin can be repeatedly spread in a single supply unit, but the holding unit may spread the resin multiple times with respect to the workpiece while sequentially moving between the plurality of supply units.
  • the resin may be cured for each of a plurality of resin spreads, or may be cured together after a plurality of spreads. Also in that case, it may be performed by a single cured portion or may be performed by a plurality of cured portions.
  • the positions of the holding unit and the supply unit or the curing unit may be changed relatively. Therefore, for example, the supply unit or the curing unit in the above embodiment may be moved in the horizontal direction by the movement mechanism, or both the holding unit and the supply unit or the curing unit may be moved in the horizontal direction by the movement mechanism.
  • the moving mechanism in this case may be either a linear movement as exemplified above or a rotational movement, and any known mechanism can be applied.
  • any one end portion of the moving mechanism 24 may be set as the carry-in and carry-out positions.
  • One end of the moving mechanism 24 may be a carry-in position, and the other end may be a carry-out position.
  • the supply unit or the curing unit may be lifted and lowered by the lifting mechanism, or both the holding unit and the supply unit or the curing unit may be lifted and lowered by the lifting mechanism. Any well-known technique can be applied to the lifting mechanism in this case as illustrated above.
  • the method of supplying the film material by the supply unit is not limited to the one shown in the above embodiment.
  • the application of the film material by the supply nozzle may be performed only at the center of the workpiece, at a plurality of locations, or in any form such as a linear shape, an annular shape, and a wave shape.
  • a plurality of supply nozzles may be provided and applied to multiple points at the same time to adjust the film thickness. In such a case, depending on the type and size of the workpiece, the number of application points of the film material, the viscosity, and the like can be changed, and the application target is expanded.
  • the supply nozzle 32 (spout portion) of the supply portion 3 spouts the resin R while rotating the workpiece 1 held by the holding mechanism 21 by the rotation mechanism 22 of the holding portion 2.
  • the resin R can be quickly spread on the lower surface of the workpiece 1.
  • the resin R can be spread on the lower surface of the rotating workpiece 1 by ejecting the resin R from the plurality of supply nozzles 32.
  • the film thickness can be made uniform or partially changed by changing the ejection amount or ejection speed of each supply nozzle 32.
  • the rotating mechanism 22 rotates the work 1 held by the holding mechanism 21 and causes the lifting mechanism 23 to approach the surface of the resin R filled in the container.
  • R may be spread on the lower surface of the work 1. This is because, due to Bernoulli's law, a negative pressure is generated between the lower surface of the workpiece 1 and the surface of the resin R, and the resin R is sucked.
  • the supply of the film material by the supply unit in the claims is a wide concept including the case where the film material is brought into contact with the work 1 and the case where the film material is introduced below the work 1.
  • the distance between the lower surface of the workpiece 1 and the surface of the resin R is preferably a distance that does not generate a turbulent gas flow at the side of the workpiece 1.
  • the resin R can also be spread by bringing the lower surface of the work 1 into contact with the surface of the resin R.
  • the base B of the resin R container is moved up and down by a lifting mechanism (not shown), and the distance or contact of the resin R with respect to the lower surface of the workpiece 1 by the lifting and lowering of the base B.
  • the amount can be controlled to adjust the film thickness.
  • Such an embodiment is advantageous when the resin R has a high viscosity. That is, in the case where the high-viscosity resin R is ejected, there is a possibility that it is difficult to uniformly coat the entire surface of the work 1. Therefore, using the base B, the resin R is prepared in advance so as to be thinly stretched on the surface of the base B. Then, by bringing the workpiece 1 into contact with the resin R, the resin R can be uniformly applied to the entire surface of the workpiece 1.
  • the holding member 21a is smaller than the work 1, and thus the resin R is prevented from adhering to the holding member 21a. it can. Since the distance between the base B and the work 1 may be changed relatively, the work 1 may be moved up and down by the lifting mechanism with the base B fixed. Moreover, you may rotate either the workpiece
  • the viscosity may be adjusted by incorporating heating means such as a heater in the base B and increasing the temperature of the resin R. Further, there may be any number of holes for feeding the resin R to the upper surface of the base B.
  • any known technique such as a vacuum chuck, an electrostatic chuck, or a mechanical chuck can be applied to the work holding method in the holding unit.
  • a guide portion 21c for guiding the outer periphery of the workpiece 1 is attached to the holding member 21a in order to prevent the workpiece 1 from shifting. Also good.
  • the supply unit and the curing unit are housed individually or in a common vacuum chamber, and coating, spreading, curing, and the like of the film material in vacuum can prevent adhesion of dust and inhibition of curing. it can.
  • size, a shape, a material, etc. are free, and it can apply to what has to apply
  • the film material those used for the protective layer and adhesive layer of any workpiece can be applied.
PCT/JP2010/002176 2009-03-30 2010-03-26 薄膜形成装置及び薄膜形成方法 WO2010116654A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011508220A JPWO2010116654A1 (ja) 2009-03-30 2010-03-26 薄膜形成装置及び薄膜形成方法
CN201080014333XA CN102369572A (zh) 2009-03-30 2010-03-26 薄膜形成装置及薄膜形成方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009083002 2009-03-30
JP2009-083002 2009-03-30

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WO2010116654A1 true WO2010116654A1 (ja) 2010-10-14

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JP (1) JPWO2010116654A1 (ko)
KR (1) KR20120002596A (ko)
CN (1) CN102369572A (ko)
TW (1) TW201107045A (ko)
WO (1) WO2010116654A1 (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012157797A (ja) * 2011-01-31 2012-08-23 Shin-Etsu Chemical Co Ltd スピンコーター
JP2015217362A (ja) * 2014-05-20 2015-12-07 中外炉工業株式会社 基板の塗布装置及び基板の塗布方法
TWI736426B (zh) * 2019-09-27 2021-08-11 日商芝浦機械電子裝置股份有限公司 成膜裝置及埋入處理裝置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102048276B1 (ko) * 2018-06-26 2020-01-22 일성기계공업 주식회사 Smc 제조방법 및 그 제조장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH039512A (ja) * 1989-06-07 1991-01-17 Fujitsu Ltd レジストの現像方法
JPH067276U (ja) * 1991-08-30 1994-01-28 ミツミ電機株式会社 スプレー式フラクサー
JPH0864521A (ja) * 1994-05-26 1996-03-08 Able:Kk 薄膜形成方法およびこの方法に用いられる装置
JP2000036134A (ja) * 1998-05-11 2000-02-02 Origin Electric Co Ltd 光ディスクの貼り合わせ方法および装置
JP2007253101A (ja) * 2006-03-24 2007-10-04 Nippon Steel Materials Co Ltd スプレーフラクサー装置

Family Cites Families (4)

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Publication number Priority date Publication date Assignee Title
JPS5656231A (en) * 1979-10-11 1981-05-18 Kuraray Yuka Kk Stabilization of recovered oxidation catalyst
JPS59208832A (ja) * 1983-05-13 1984-11-27 Hitachi Tokyo Electronics Co Ltd 塗布装置
JP5010825B2 (ja) * 2005-11-04 2012-08-29 株式会社トクヤマ コーティング装置
JP4812704B2 (ja) * 2007-07-10 2011-11-09 東京エレクトロン株式会社 基板処理装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH039512A (ja) * 1989-06-07 1991-01-17 Fujitsu Ltd レジストの現像方法
JPH067276U (ja) * 1991-08-30 1994-01-28 ミツミ電機株式会社 スプレー式フラクサー
JPH0864521A (ja) * 1994-05-26 1996-03-08 Able:Kk 薄膜形成方法およびこの方法に用いられる装置
JP2000036134A (ja) * 1998-05-11 2000-02-02 Origin Electric Co Ltd 光ディスクの貼り合わせ方法および装置
JP2007253101A (ja) * 2006-03-24 2007-10-04 Nippon Steel Materials Co Ltd スプレーフラクサー装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012157797A (ja) * 2011-01-31 2012-08-23 Shin-Etsu Chemical Co Ltd スピンコーター
JP2015217362A (ja) * 2014-05-20 2015-12-07 中外炉工業株式会社 基板の塗布装置及び基板の塗布方法
TWI736426B (zh) * 2019-09-27 2021-08-11 日商芝浦機械電子裝置股份有限公司 成膜裝置及埋入處理裝置

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JPWO2010116654A1 (ja) 2012-10-18
TW201107045A (en) 2011-03-01
CN102369572A (zh) 2012-03-07
KR20120002596A (ko) 2012-01-06

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