WO2010106853A1 - 有機エレクトロニクスパネルおよび有機エレクトロニクスパネルの製造方法 - Google Patents
有機エレクトロニクスパネルおよび有機エレクトロニクスパネルの製造方法 Download PDFInfo
- Publication number
- WO2010106853A1 WO2010106853A1 PCT/JP2010/052045 JP2010052045W WO2010106853A1 WO 2010106853 A1 WO2010106853 A1 WO 2010106853A1 JP 2010052045 W JP2010052045 W JP 2010052045W WO 2010106853 A1 WO2010106853 A1 WO 2010106853A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- organic
- layer
- metal foil
- thickness
- polymer film
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 238000000034 method Methods 0.000 title description 25
- 239000011888 foil Substances 0.000 claims abstract description 104
- 229910052751 metal Inorganic materials 0.000 claims abstract description 80
- 239000002184 metal Substances 0.000 claims abstract description 80
- 239000012790 adhesive layer Substances 0.000 claims abstract description 51
- 229920006254 polymer film Polymers 0.000 claims abstract description 48
- 238000010030 laminating Methods 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims description 115
- 239000010410 layer Substances 0.000 claims description 108
- 238000007789 sealing Methods 0.000 claims description 87
- 238000006243 chemical reaction Methods 0.000 claims description 58
- 229910052782 aluminium Inorganic materials 0.000 claims description 35
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 32
- 238000010438 heat treatment Methods 0.000 claims description 26
- 150000002894 organic compounds Chemical class 0.000 claims description 9
- 238000005401 electroluminescence Methods 0.000 claims description 7
- 230000006866 deterioration Effects 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 abstract 3
- 239000000853 adhesive Substances 0.000 description 37
- 230000001070 adhesive effect Effects 0.000 description 36
- 239000010408 film Substances 0.000 description 29
- 239000000463 material Substances 0.000 description 28
- 229920005989 resin Polymers 0.000 description 25
- 239000011347 resin Substances 0.000 description 25
- 229920000139 polyethylene terephthalate Polymers 0.000 description 24
- 239000005020 polyethylene terephthalate Substances 0.000 description 24
- 206010040844 Skin exfoliation Diseases 0.000 description 20
- 238000001723 curing Methods 0.000 description 18
- 239000011521 glass Substances 0.000 description 18
- -1 polyethylene terephthalate Polymers 0.000 description 18
- 229920001187 thermosetting polymer Polymers 0.000 description 18
- 230000005525 hole transport Effects 0.000 description 10
- 238000011156 evaluation Methods 0.000 description 9
- 239000002346 layers by function Substances 0.000 description 8
- 239000000872 buffer Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 238000000605 extraction Methods 0.000 description 7
- 239000007789 gas Substances 0.000 description 7
- 229920000728 polyester Polymers 0.000 description 7
- 230000003746 surface roughness Effects 0.000 description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- 239000004033 plastic Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 5
- 239000004743 Polypropylene Substances 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000003475 lamination Methods 0.000 description 5
- 229920001155 polypropylene Polymers 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 229920001169 thermoplastic Polymers 0.000 description 5
- 229920005992 thermoplastic resin Polymers 0.000 description 5
- 239000004416 thermosoftening plastic Substances 0.000 description 5
- 238000001771 vacuum deposition Methods 0.000 description 5
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000010248 power generation Methods 0.000 description 4
- 239000003566 sealing material Substances 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- VQGHOUODWALEFC-UHFFFAOYSA-N 2-phenylpyridine Chemical compound C1=CC=CC=C1C1=CC=CC=N1 VQGHOUODWALEFC-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000004305 biphenyl Substances 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000009820 dry lamination Methods 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 3
- 239000011112 polyethylene naphthalate Substances 0.000 description 3
- 229940005642 polystyrene sulfonic acid Drugs 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- 230000037303 wrinkles Effects 0.000 description 3
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 2
- UJOBWOGCFQCDNV-UHFFFAOYSA-N 9H-carbazole Chemical compound C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- 229920000144 PEDOT:PSS Polymers 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 229920006223 adhesive resin Polymers 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- 238000006757 chemical reactions by type Methods 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 239000002274 desiccant Substances 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000301 poly(3-hexylthiophene-2,5-diyl) polymer Polymers 0.000 description 2
- 229920003227 poly(N-vinyl carbazole) Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- BBEAQIROQSPTKN-UHFFFAOYSA-N pyrene Chemical compound C1=CC=C2C=CC3=CC=CC4=CC=C1C2=C43 BBEAQIROQSPTKN-UHFFFAOYSA-N 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- FKASFBLJDCHBNZ-UHFFFAOYSA-N 1,3,4-oxadiazole Chemical compound C1=NN=CO1 FKASFBLJDCHBNZ-UHFFFAOYSA-N 0.000 description 1
- ZHFLRRPGAVPNMB-UHFFFAOYSA-N 1-[3-(9h-carbazol-1-yl)phenyl]-9h-carbazole Chemical compound C12=CC=CC=C2NC2=C1C=CC=C2C1=CC(C2=C3NC=4C(C3=CC=C2)=CC=CC=4)=CC=C1 ZHFLRRPGAVPNMB-UHFFFAOYSA-N 0.000 description 1
- IERDDDBDINUYCD-UHFFFAOYSA-N 1-[4-[4-(9h-carbazol-1-yl)phenyl]phenyl]-9h-carbazole Chemical group C12=CC=CC=C2NC2=C1C=CC=C2C(C=C1)=CC=C1C(C=C1)=CC=C1C1=C2NC3=CC=CC=C3C2=CC=C1 IERDDDBDINUYCD-UHFFFAOYSA-N 0.000 description 1
- NBUKAOOFKZFCGD-UHFFFAOYSA-N 2,2,3,3-tetrafluoropropan-1-ol Chemical compound OCC(F)(F)C(F)F NBUKAOOFKZFCGD-UHFFFAOYSA-N 0.000 description 1
- YTQQIHUQLOZOJI-UHFFFAOYSA-N 2,3-dihydro-1,2-thiazole Chemical compound C1NSC=C1 YTQQIHUQLOZOJI-UHFFFAOYSA-N 0.000 description 1
- MUNFOTHAFHGRIM-UHFFFAOYSA-N 2,5-dinaphthalen-1-yl-1,3,4-oxadiazole Chemical compound C1=CC=C2C(C3=NN=C(O3)C=3C4=CC=CC=C4C=CC=3)=CC=CC2=C1 MUNFOTHAFHGRIM-UHFFFAOYSA-N 0.000 description 1
- PQYIVUDIIIJJDM-UHFFFAOYSA-N 2,5-dinaphthalen-1-yl-1,3,4-thiadiazole Chemical compound C1=CC=C2C(C3=NN=C(S3)C=3C4=CC=CC=C4C=CC=3)=CC=CC2=C1 PQYIVUDIIIJJDM-UHFFFAOYSA-N 0.000 description 1
- SSABEFIRGJISFH-UHFFFAOYSA-N 2-(2,4-difluorophenyl)pyridine Chemical compound FC1=CC(F)=CC=C1C1=CC=CC=N1 SSABEFIRGJISFH-UHFFFAOYSA-N 0.000 description 1
- MWKLOMOIKCPLOY-UHFFFAOYSA-N 3,5-dinaphthalen-1-yl-1h-1,2,4-triazole Chemical compound C1=CC=C2C(C3=NN=C(N3)C=3C4=CC=CC=C4C=CC=3)=CC=CC2=C1 MWKLOMOIKCPLOY-UHFFFAOYSA-N 0.000 description 1
- UAPNUNDZDVNTDQ-UHFFFAOYSA-N 4,5-diphenyl-1,2,3-triazole Chemical compound C1=CC=CC=C1C1=NNN=C1C1=CC=CC=C1 UAPNUNDZDVNTDQ-UHFFFAOYSA-N 0.000 description 1
- YOPJQOLALJLPBS-UHFFFAOYSA-N 4,5-diphenyloxadiazole Chemical compound C1=CC=CC=C1C1=C(C=2C=CC=CC=2)ON=N1 YOPJQOLALJLPBS-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 239000004716 Ethylene/acrylic acid copolymer Substances 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- ZCQWOFVYLHDMMC-UHFFFAOYSA-N Oxazole Chemical compound C1=COC=N1 ZCQWOFVYLHDMMC-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- FZWLAAWBMGSTSO-UHFFFAOYSA-N Thiazole Chemical compound C1=CSC=N1 FZWLAAWBMGSTSO-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229920002978 Vinylon Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 125000005595 acetylacetonate group Chemical group 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- GVEPBJHOBDJJJI-UHFFFAOYSA-N fluoranthrene Natural products C1=CC(C2=CC=CC=C22)=C3C2=CC=CC3=C1 GVEPBJHOBDJJJI-UHFFFAOYSA-N 0.000 description 1
- 239000007850 fluorescent dye Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 150000002503 iridium Chemical class 0.000 description 1
- CECAIMUJVYQLKA-UHFFFAOYSA-N iridium 1-phenylisoquinoline Chemical compound [Ir].C1=CC=CC=C1C1=NC=CC2=CC=CC=C12.C1=CC=CC=C1C1=NC=CC2=CC=CC=C12.C1=CC=CC=C1C1=NC=CC2=CC=CC=C12 CECAIMUJVYQLKA-UHFFFAOYSA-N 0.000 description 1
- UEEXRMUCXBPYOV-UHFFFAOYSA-N iridium;2-phenylpyridine Chemical compound [Ir].C1=CC=CC=C1C1=CC=CC=N1.C1=CC=CC=C1C1=CC=CC=N1.C1=CC=CC=C1C1=CC=CC=N1 UEEXRMUCXBPYOV-UHFFFAOYSA-N 0.000 description 1
- COLNWNFTWHPORY-UHFFFAOYSA-M lithium;8-hydroxyquinoline-2-carboxylate Chemical compound [Li+].C1=C(C([O-])=O)N=C2C(O)=CC=CC2=C1 COLNWNFTWHPORY-UHFFFAOYSA-M 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229920003145 methacrylic acid copolymer Polymers 0.000 description 1
- 229940117841 methacrylic acid copolymer Drugs 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- WCPAKWJPBJAGKN-UHFFFAOYSA-N oxadiazole Chemical compound C1=CON=N1 WCPAKWJPBJAGKN-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical class N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 229920000123 polythiophene Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 150000003220 pyrenes Chemical class 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229940042055 systemic antimycotics triazole derivative Drugs 0.000 description 1
- VLLMWSRANPNYQX-UHFFFAOYSA-N thiadiazole Chemical compound C1=CSN=N1.C1=CSN=N1 VLLMWSRANPNYQX-UHFFFAOYSA-N 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
- NVCBVYYESHBQKS-UHFFFAOYSA-L zinc;2-carboxyquinolin-8-olate Chemical compound [Zn+2].C1=C(C([O-])=O)N=C2C(O)=CC=CC2=C1.C1=C(C([O-])=O)N=C2C(O)=CC=CC2=C1 NVCBVYYESHBQKS-UHFFFAOYSA-L 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
- H10K30/88—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8423—Metallic sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8721—Metallic sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention In the organic electronics panel sealed by bonding a sealing substrate (metal foil / conductivity), the present invention has problems such as electrode short circuit / substrate warpage and peeling at the sealing end when the sealing material is cured.
- the present invention relates to a method for manufacturing a solved organic electronics panel.
- organic electronics panels consisting of organic electroluminescence elements and organic photoelectric conversion elements.
- the material and the light emitting unit constituting the light emitting layer in the organic electroluminescence element absorb moisture, the light emission luminance is significantly impaired.
- the organic photoelectric conversion element in the case of the material and the power generation unit constituting the photoelectric conversion layer, the power generation performance is impaired when moisture is absorbed. Therefore, it is necessary to lower the humidity inside the organic electroluminescence element (organic EL element) or the organic photoelectric conversion element, and a means for protecting the inside from the outside air is provided.
- a casing type method is disclosed in which a glass cap or a metal can is sealed with an adhesive to create a confidential space, and a desiccant is placed therein.
- an adhesion type method has been disclosed in which an organic light-emitting layer or the like is formed on a plastic or glass substrate, and then the surface is sealed with an adhesive using a flexible thin high barrier film or metal foil.
- thin and lightweight organic EL elements and organic photoelectric conversion elements excellent in moisture resistance have been proposed.
- metal plate, foil
- it is conductive, it can be electrically connected by contact with an organic EL element or an extraction electrode. There is a problem that a short circuit occurs and light emission failure and uniform light emission characteristics cannot be obtained, and various methods have been proposed. Similarly, it was found that when an organic photoelectric conversion element is used, a leak failure during power generation is likely to occur.
- a particulate spacer is mixed into the adhesive layer between the substrate and the sealing member to provide clearance (contact limit, gap) ) Has been proposed.
- a method has also been proposed in which a resin layer is disposed on the surface (one side or both sides) of a metal member and subjected to insulation treatment (for example, Patent Documents 1 and 2).
- a short circuit may occur, and the current situation is that no fundamental measures have been taken.
- the phenomenon that the sealing substrate warps to the electrode side due to the curing shrinkage of the adhesive layer and the edges contact (short-circuit) has also been clarified.
- the object of the present invention is to suppress the warping (deformation) of a member when a metal member is used as a sealing member, thereby preventing an electrical short circuit and preventing the occurrence of light emission defects and the occurrence of leaks during power generation. There is to do.
- a sealing substrate is bonded and laminated via an adhesive layer on an organic electronics element formed of an anode layer including at least a first electrode, an organic compound layer, and a cathode layer including a second electrode formed on the substrate,
- the sealing substrate is made of a metal foil, a polymer film is laminated on the surface of the metal foil opposite to the adhesive layer, and the thickness of the polymer film is equal to or less than the thickness of the metal foil.
- organic electronics panel as described in 1 above, wherein the organic compound layer includes a light emitting layer, and the organic electronics element is an organic electroluminescence element.
- a method for producing an organic electronics panel comprising producing the organic electronics panel according to any one of 1 to 8 above.
- the present invention it is possible to suppress warpage (deformation) due to shrinkage and hardening of the adhesive layer when sealed using a metal member, and to prevent a short circuit with the extraction electrode.
- the seal gap can be narrowed, gas permeation from the seal portion is suppressed, and the sealing performance is improved.
- the panel can be thinned.
- the present invention provides an organic electroluminescence device (also referred to as an organic EL device) formed on a substrate and comprising an anode layer including at least a first electrode, an organic compound layer including a light emitting layer, and a cathode layer including a second electrode, or
- the sealing substrate is pasted on the organic photoelectric conversion element formed on the substrate, which includes the anode layer including the first electrode, the organic compound layer including the photoelectric conversion coarse, and the cathode layer including the second electrode, through the adhesive layer.
- An organic electroluminescence panel or an organic photoelectric conversion panel (both of which is referred to as an organic electronics element) to be formed by stacking and stacking, wherein the sealing substrate is made of a metal foil, and the metal foil faces the organic electronics element.
- the polymer film is laminated on the surface opposite to the adhesive layer, and the thickness of the polymer film is equal to or less than the thickness of the metal foil.
- Ri is characterized in that the heating during bonding-laminating time or adhesive layer hardening of the sealing substrate.
- the heating temperature is preferably 50 ° C. or higher and 200 ° C. or lower, more preferably 80 ° C. to 160 ° C.
- curing proceeds in the case of thermosetting resins, and in the case of thermoplastic resins, it is plasticized by heat at the time of laminating and laminating, and in the course of cooling Adhere to the element.
- rate can be raised by implementing light irradiation and a heating simultaneously after sealing substrate bonding.
- the metal foil used as the sealing substrate in the present invention has a thickness of 9 to 500 ⁇ m, and a polymer film is laminated thereon, and the thickness of the polymer film is preferably 10 to 100% with respect to the metal foil. .
- the metal foil is preferably aluminum because it is inexpensive and flexible.
- the surface roughness Ra of the polished surface of the aluminum foil is 10 nm or more, preferably 50 nm or more, and most preferably 100 nm or more.
- the surface roughness of the scraped surface is preferably 0.8 ⁇ m or less, more preferably 0.5 ⁇ m or less. When this value is small, peeling occurs easily when laminated with a polymer film. When the surface roughness of the scraped surface increases, there is a risk that the element surface may be damaged when used on the organic electronics element side.
- the glossy surface is a glossy surface having a surface roughness Ra of less than 10 nm.
- FIG. 1 An example of a conventional organic electronics panel is shown in cross-sectional view in FIG. 1
- an organic electronic element comprising a first electrode 2, an organic functional layer 3 including, for example, a light-emitting layer, and a second electrode 4 is formed on a substrate 1, and a sealing substrate 5 is adhered thereon as an adhesive layer.
- 6 shows a sealed organic electronics panel having a configuration sealed at 6 at its end.
- Such a short circuit at the end portion gradually occurs, for example, due to curing shrinkage of the adhesive layer during sealing, pressure bonding during pasting of the sealing substrate, and over time.
- an organic electronic panel is individually manufactured by punching from a large panel, it also occurs by cutting with a cutter, for example.
- FIG. 1 is a cross-sectional view showing an example of a conventional organic electronics panel sealed with a sealing substrate.
- the metal foil sealing substrate is placed at the end on the first electrode side due to curing shrinkage of the adhesive layer.
- Patent Document 1 or 2 it is effective to apply an insulating layer to a metal foil that is a conductive sealing substrate.
- the edge of the sealing substrate is also cut, so that the conductive portion Will be exposed.
- the electrical short circuit occurs when the sealing substrate warps to the electrode side due to the curing shrinkage of the adhesive layer and the edge contacts, so that the warping of the sealing substrate to the electrode side is prevented.
- the present inventors have found that electrical short-circuits can be greatly reduced, and have reached the present invention.
- the present invention is characterized in that the warpage (deformation) of the sealing substrate due to the curing shrinkage when the sealing material is cured and the stress when the sealing substrate is bonded is prevented.
- a polymer film is laminated on a surface (back surface: anti-adhesion layer surface) opposite to the adhesive layer surface side of the metal foil that is the sealing substrate.
- the present invention is characterized by heating using a metal foil laminated with a polymer film as a sealing substrate.
- FIG. 2 is a schematic sectional view showing the configuration of the organic electronics panel of the present invention.
- a metal foil laminated with a polymer film is used as a sealing substrate.
- a polymer film 7 is laminated on the metal foil 5. This prevents warping of the sealing substrate.
- the adhesive layer When the adhesive layer is a thermosetting type, the adhesive layer can be cured and the polymer film can be simultaneously contracted by heating after bonding the sealing substrate.
- the adhesive layer When the adhesive layer is a photo-curing type, it can be dealt with by performing light irradiation and heating at the same time after the sealing substrate is bonded.
- the adhesive layer When the adhesive layer is a thermoplastic resin, it can be handled by bonding the sealing substrate and the adhesive layer while heating (melting the adhesive layer).
- the thickness of the metal foil and the thickness of the polymer film are preferable to select the relationship between the thickness of the metal foil and the thickness of the polymer film as follows.
- the metal foil used as the sealing substrate used in the present invention preferably has a thickness in the range of 9 to 500 ⁇ m.
- the thickness is less than 9 ⁇ m, pinholes are easily formed during use, and required barrier performance (moisture permeability, oxygen permeability) may not be obtained.
- the thickness exceeds 500 ⁇ m, the cost increases depending on the material used for the metal foil, and the organic electronics panel becomes thick, and the merit of thinning is reduced.
- the thickness of the polymer film should not exceed the thickness of the metal foil, and the thickness of the polymer film should be 10 to 10 times the thickness of the metal foil. It is preferable to set it as 100%.
- the thickness is less than 10% with respect to the thickness of the metal foil, the stress due to the polymer film is small and the effect of suppressing deformation of the metal foil cannot be obtained.
- the thickness of the metal foil is larger than 100%, when there is thermal shrinkage, the stress due to thermal shrinkage becomes large and the metal foil warps to the polymer film side (deformation), and the sealing substrate at the bonded end. There is a risk of peeling.
- the thermal shrinkage rate of the polymer film is preferably 0.2 to 3% at the heating temperature when the sealing substrate is bonded and laminated or when the adhesive layer is cured. If this is 0.2% or less, the thermal shrinkage rate is too small, and the effect of suppressing deformation of the metal foil (to the first electrode substrate side) is small. There is a possibility that warpage becomes large and peeling of the sealing substrate itself is caused.
- the heat shrinkage rate can be measured by the following method.
- Heat shrinkage As a polymer film sample, three test pieces each having a width of 30 mm and a length of 120 mm are collected. Holes of 6 mm ⁇ are punched at 100 mm intervals on both ends of the test piece. This is conditioned for at least 3 hours in a room at 23 ⁇ 3 ° C. and a relative temperature of 65 ⁇ 5%. Using an automatic pin gauge (manufactured by Shinto Kagaku Co., Ltd.), the original size (L 1 ) of the punch interval is measured to the minimum scale / 1000 mm. Next, the test piece is hung on a thermostat set to the heating temperature at the time of curing and heat-treated for 3 hours.
- Thermal contraction rate (L 1 ⁇ L 2 / L 1 ) ⁇ 100
- the thermal contraction rate of PET is about 0.8% at 120 ° C.
- the Tg of the polymer film is lower than the heating temperature at the time of sealing substrate lamination and lamination or at the time of curing of the adhesive layer. This allows the polymer film to follow and shrink as the adhesive cures and shrinks, reducing the difference in thermal shrinkage and reducing the deformation (curl and breakage) caused by curing and bonding at the edges. This also makes it difficult for the part to occur.
- thermosetting temperature (heating temperature)
- the metal foil surface on the adhesive layer side is a glossy surface (Ra is less than 10 nm). Since the smooth surface is on the organic electronics element side, scratches and irregularities on the surface hardly damage the surface of the element sensitive to pressure.
- the substrate used for the organic electronics panel is a substrate such as glass or plastic, but is not limited thereto.
- Transparent resin films include polyethylene, ethylene-vinyl acetate copolymer, ethylene-vinyl alcohol copolymer, polymethyl methacrylate, polyether ether ketone, polyether sulfone, and tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer. Examples include, but are not limited to, coalescence, polyester, polycarbonate, polyurethane, polyimide, and polyetherimide.
- a gas barrier film having a high gas barrier property can also be used.
- the gas barrier film include a film having a gas barrier film having a sealing function of 50 nm to 50 ⁇ m in thickness, such as a metal oxide film, an oxynitride film, a nitride film, and a metal thin film, specifically, an alumina deposited film, a resin There is a metal foil laminated with a film.
- the metal foil used as the sealing substrate is not particularly limited in the type of metal.
- a particularly preferred metal foil is an Al foil.
- the metal foil mainly refers to a metal foil or film formed by metal rolling or the like, but a metal thin film formed by sputtering or vapor deposition on a polymer film, or a fluid electrode such as a conductive paste.
- a conductive film formed of a material may be used.
- polymer film material laminated with the metal foil various polymer materials described in “New development of functional packaging materials (Toray Research Center, Inc.)” can be used.
- polyethylene resin polypropylene resin, polyethylene terephthalate resin, polyamide resin, ethylene-vinyl alcohol copolymer resin, ethylene-vinyl acetate copolymer resin, acrylonitrile-butadiene copolymer resin, cellophane resin, vinylon Resin, vinylidene chloride resin and the like.
- Resins such as polypropylene resin and nylon resin may be stretched and further coated with vinylidene chloride resin. Moreover, a low density or a high density thing can also be used for a polyethylene-type resin.
- a generally used laminating machine can be used as a method of laminating a polymer film on one side of a metal foil.
- the adhesive polyurethane-based, polyester-based, epoxy-based, acrylic-based adhesives and the like can be used. You may use a hardening
- a hot melt lamination method, an extrusion lamination method and a coextrusion lamination method can also be used, but a dry lamination method is preferred.
- the thickness of the adhesive is preferably in the range of 0.5 to 10 ⁇ m.
- the metal foil is formed by sputtering or vapor deposition, or is formed from a fluid electrode material such as a conductive paste, it is created by using a polymer film as a base material and forming the metal foil on this. Also good.
- thermosetting resin for the adhesive layer used in the present invention, a thermosetting resin, a photocurable resin, a thermoplastic resin, or the like can be used.
- a curable resin an epoxy resin, an acrylic resin, a silicone resin, and the like can be given.
- the thickness of the adhesive layer is preferably 0.1 ⁇ m to 100 ⁇ m.
- thermosetting adhesive resin that is excellent in moisture resistance and water resistance and has little shrinkage upon curing.
- thermosetting adhesive for example, the adhesive is uniformly applied to the adhesive surface of the sealing substrate, and the adhesive surface is closely adhered to the substrate so as to cover the adhesive layer via the adhesive layer, and thermocompression bonding is performed. And cured and bonded. What is necessary is just to adhere
- the heating temperature is preferably 50 ° C. or higher and 200 ° C. or lower, more preferably 80 ° C. to 160 ° C. It is preferable that it is higher than Tg of the polymer film used for the sealing substrate.
- the curing (adhesion) speed can be increased by simultaneously performing light irradiation and heating after the sealing substrate is bonded.
- thermoplastic resin an acid-modified product of polyolefin such as polyethylene, polypropylene, ethylene / propylene copolymer, an acid-modified product of ethylene / vinyl acetate copolymer, ethylene / acrylic acid copolymer, ethylene / methacrylic acid copolymer.
- polymers, ionomers, and the like can be used.
- thermoplastic adhesive a thermoplastic adhesive (thermoplastic resin) (for example, an acid-modified product of polypropylene; Mitsui Chemicals QE050) is laminated and bonded to the adhesive surface (shiny surface) of the aluminum foil of the sealing substrate. Deposit layers. Thereafter, the sealing substrate may be heated and bonded by adhering and laminating the adhesive surface on the substrate on which the element is formed.
- the pressure at the time of bonding is preferably in the range of 0.05 to 5 MPa, and the heating temperature is preferably 50 ° C. or higher and 200 ° C. or lower, more preferably 80 ° C. to 160 ° C. It is preferable that it is higher than Tg of the polymer film used for the sealing substrate.
- thermoplastic adhesive resin
- it is plasticized by the heat at the time of pasting and laminating, and then adhered to the element in the process of cooling.
- a coating method such as roll coating, spin coating, screen printing, spray coating, or the like can be used depending on the material.
- a desiccant such as barium oxide or calcium oxide may be mixed.
- the sealing structure may be a hollow structure, a sealing material-filled adhesion structure, or the like.
- Organic EL element has a structure in which one or more organic layers are laminated between electrodes.
- various organic compounds such as anode layer / hole injection / transport layer / light emitting layer / electron injection / transport layer / cathode layer, etc.
- the functional layer made of is laminated as necessary. Most simply, it has a structure comprising an anode layer / a light emitting layer / a cathode layer.
- Organic materials used for the hole injection / transport layer are typified by phthalocyanine derivatives, heterocyclic azoles, aromatic tertiary amines, polyvinyl carbazole, polyethylenedioxythiophene / polystyrene sulfonic acid (PEDOT: PSS), and the like.
- a polymer material such as a conductive polymer is used.
- carbazole-based luminescent materials such as 4,4′-dicarbazolylbiphenyl, 1,3-dicarbazolylbenzene, (di) azacarbazoles, 1,3,5-
- carbazole-based luminescent materials such as 4,4′-dicarbazolylbiphenyl, 1,3-dicarbazolylbenzene, (di) azacarbazoles, 1,3,5-
- low-molecular light-emitting materials typified by pyrene-based light-emitting materials such as tripyrenylbenzene, polymer light-emitting materials typified by polyphenylene vinylenes, polyfluorenes, polyvinyl carbazoles, and the like.
- a low molecular weight light emitting material having a molecular weight of 10,000 or less is preferably used as the light emitting material.
- the light emitting material may preferably contain about 0.1 to 20% by mass of a dopant.
- the dopant include known fluorescent dyes such as perylene derivatives and pyrene derivatives, phosphorescent dyes, For example, orthometalated iridium complexes represented by tris (2-phenylpyridine) iridium, bis (2-phenylpyridine) (acetylacetonato) iridium, bis (2,4-difluorophenylpyridine) (picolinato) iridium, etc. And complex compounds.
- Examples of the electron injection / transport layer material include metal complex compounds such as 8-hydroxyquinolinate lithium and bis (8-hydroxyquinolinate) zinc, and the following nitrogen-containing five-membered ring derivatives. That is, oxazole, thiazole, oxadiazole, thiadiazole or triazole derivatives are preferred.
- a material used for these light emitting layers and each functional layer a material having a polymerization reactive group such as a vinyl group in the molecule may be used, and a crosslinked / polymerized film may be formed after film formation.
- the conductive material used for the anode layer those having a work function larger than 4 eV are suitable, and metal oxides such as silver, gold, platinum, palladium and their alloys, tin oxide, indium oxide, ITO, etc. Furthermore, organic conductive resins such as polythiophene and polypyrrole are used.
- the conductive material used for the cathode layer those having a work function smaller than 4 eV are suitable, such as magnesium and aluminum.
- the alloy include magnesium / silver and lithium / aluminum.
- each functional layer described above may be formed by a dry method such as vacuum deposition or sputtering, or may be formed by a wet method such as coating or printing.
- Organic photoelectric conversion element Although an organic photoelectric conversion element is demonstrated, it is not limited to the following forms.
- organic photoelectric conversion element which can be used by this invention, If it is an element which has an anode and a cathode and at least 1 or more photoelectric conversion layer pinched
- the configuration of the photoelectric conversion layer is not particularly limited as long as it is a configuration in which an organic semiconductor material is stacked.
- a heterojunction type in which a p-type semiconductor material and an n-type semiconductor material are stacked, or both a p-type and an n-type semiconductor are used.
- a so-called bulk heterojunction type in which materials are mixed and have a microphase separation structure can be given. From the viewpoint of improving internal quantum efficiency, a configuration excellent in charge separation efficiency is preferable, and a bulk heterojunction structure is more preferable in the present application.
- the organic photoelectric conversion element of the present invention when used as a solar cell, it is preferable to use an organic semiconductor material having an absorption characteristic optimal for the sunlight spectrum, and an organic material having a blacker appearance from the viewpoint of efficiency and designability.
- a photoelectric conversion element is preferable.
- a transparent electrode, a photoelectric conversion layer, and a counter electrode are sequentially laminated on one surface of a support.
- the present invention is not limited thereto, and for example, a hole transport layer, an electron transport layer, a hole block layer, an electron block layer, an electrode buffer layer, a smoothing layer, or the like between the transparent electrode or the counter electrode and the photoelectric conversion layer.
- the organic photoelectric conversion element may be configured with the above layer. Further, it may be an electron transport layer having a hole blocking ability or a hole transport layer having an electron blocking ability.
- an organic photoelectric conversion element having a bulk heterojunction type photoelectric conversion layer a hole transport layer and / or an electron block layer are provided between the photoelectric conversion layer and the anode (usually the transparent electrode side), By forming an electron transport layer and / or a hole blocking layer between the conversion layer and the cathode (usually the counter electrode side), the charges generated in the bulk heterojunction photoelectric conversion layer can be taken out more efficiently. Therefore, it is preferable to have these layers.
- the same materials as those used in the organic EL element can be used.
- anode / hole transport layer / electron block layer / photoelectric conversion layer / hole block layer / electron transport layer / cathode (ii) Anode / hole transport layer having electron blocking ability / photoelectric conversion layer / hole block Electron transport layer / cathode buffer layer / cathode (iii) anode / anode buffer layer / hole transport layer / electron block layer / photoelectric conversion layer / hole block layer / electron transport layer / cathode (iv) anode / anode Buffer layer / hole transport layer / electron block layer / photoelectric conversion layer / hole block layer / electron transport layer / cathode buffer layer / cathode As described above, the organic photoelectric conversion element is layered on the substrate by overlapping each layer.
- each functional layer can be formed by various known methods such as a vacuum deposition method, a dry method such as a sputtering method, and a wet method such as a coating method and a printing method.
- Each functional layer described above is formed on the substrate and sealed with a sealing substrate to constitute an organic electronics panel.
- Example 1 An organic EL panel was prepared according to the configuration of FIG.
- a transparent support substrate was prepared by depositing 100 nm of ITO (indium tin oxide) as an anode on a glass substrate of 100 mm ⁇ 100 mm ⁇ 1.1 mm. This was ultrasonically cleaned with isopropyl alcohol, dried with dry nitrogen gas, and further subjected to UV ozone cleaning for 5 minutes.
- ITO indium tin oxide
- a luminescent composition having the following composition was adjusted to 1 ml and spin-coated. (Thickness of about 25 nm).
- Luminescent composition Solvent Toluene 100% by mass Host material: HA 1% by mass Blue material: Ir-A 0.10% by mass Green material: Ir (ppy) 3 0.004 mass% Red material: Ir (piq) 3 0.005 mass%
- an electron transport layer coating solution was prepared as follows, and applied with a spin coater under the conditions of 1500 rpm and 30 seconds to provide an electron transport layer. The film thickness was 20 nm when it apply
- the sample on which the electron transport layer was formed was transferred to a vacuum deposition apparatus, the vacuum chamber was depressurized to 4 ⁇ 10 ⁇ 4 Pa, and lithium fluoride 10 nm as a cathode buffer layer and aluminum 110 nm as a cathode on the electron transport layer.
- the layers were sequentially deposited to produce an organic EL device.
- the matte surface (scratch surface) has a different thickness (described in Table 1) and a polyethylene terephthalate (PET) film adhesive for dry lamination (two-component reaction type) (Urethane-based adhesive) was laminated (adhesive layer thickness 1.5 ⁇ m).
- PET polyethylene terephthalate
- the surface roughness of the cut surface (matt surface) of this aluminum foil was Ra 470 nm, and Ra of the polished surface was 1 nm or less.
- the prepared PET laminated aluminum foil is made approximately the same size (100 mm ⁇ 100 mm) as the glass substrate on which the organic EL element is formed, and the following thermosetting adhesive is used on the glossy surface (opposite side of the PET laminated surface). And glued.
- Thermosetting adhesive Epoxy adhesive Bisphenol A diglycidyl ether (DGEBA) Dicyandiamide (DICY) Epoxy adduct curing accelerator Thermosetting adhesive is applied uniformly along the adhesive surface (glossy surface) of the aluminum foil using a dispenser, and then the sealing substrate is removed from the organic EL so that the take-out electrode is exposed.
- the adhesive surface was closely attached and arranged on the glass substrate on which the element was formed, and was pressure-bonded (pressure 0.15 MPa, time 30 seconds) and temporarily adhered.
- the temporarily bonded organic EL panel was placed on a hot plate and heated (temperature: 120 ° C., 30 minutes) to thermally cure the thermosetting adhesive, thereby producing an organic EL panel.
- Organic EL panels 2 to 7 having different thicknesses of the PET film used for producing the sealing substrate were obtained.
- the aluminum foil is not laminated with the polyester sheet, and only the aluminum foil (PET thickness 0) is sealed.
- PET thickness 0 the aluminum foil
- the organic EL panel sealed with metal foil has a low rectification ratio and a short circuit. Moreover, in the thing using the metal foil which laminated
- Example 2 In the same manner as in Example 1, an organic EL panel was prepared according to the configuration of FIG.
- Example 1 ⁇ Creation of organic EL panel> As in Example 1, an anode, a hole transport layer, a light-emitting composition, an electron transport layer, a cathode buffer layer, and a cathode were sequentially formed on a 100 mm ⁇ 100 mm ⁇ 1.1 mm glass substrate to form an organic EL device.
- an anode, a hole transport layer, a light-emitting composition, an electron transport layer, a cathode buffer layer, and a cathode were sequentially formed on a 100 mm ⁇ 100 mm ⁇ 1.1 mm glass substrate to form an organic EL device.
- a 50 ⁇ m thick aluminum foil (manufactured by Toyo Aluminum Co., Ltd.) was used, and a 25 ⁇ m thick polyethylene terephthalate (PET) film was laminated on the mat surface using an adhesive for dry lamination (two-component reaction type urethane adhesive).
- PET polyethylene terephthalate
- Adhesive layer thickness 1.5 ⁇ m The surface roughness of the cut surface (matt surface) of this aluminum foil was Ra 470 nm, and Ra of the polished surface was 1 nm or less.
- thermoplastic adhesive polypropylene acid-modified product; Mitsui Chemicals QE050
- the thickness of the thermoplastic adhesive was 30 ⁇ m.
- the prepared PET laminated aluminum foil with an adhesive layer is made approximately the same size (100 mm ⁇ 100 mm) as the glass substrate on which the organic EL element is formed, and then the organic EL element is formed so that the take-out electrode is exposed from the sealing substrate.
- the adhesive surface was closely placed and disposed on the glass substrate so as to cover the glass substrate and bonded by thermocompression bonding.
- the pressure at the time of pasting was 0.15 MPa, the time was 30 seconds, the heating temperature was changed (described in Table 2), and a plurality of organic EL panels 8 to 14 were produced under different conditions of the shrinkage rate of the PET film.
- the organic EL panel having a small PET shrinkage ratio has a low rectification ratio and a short circuit. Moreover, when the shrinkage rate of PET is 0.2% or more, the rectification ratio is high and no short circuit occurs. When the shrinkage rate of PET exceeded 3%, the warping amount at the end of the sealing member was increased, and peeling was confirmed. The effectiveness of the present invention was confirmed. This was particularly effective when the shrinkage of PET was 0.8-3.
- Example 3 An organic photoelectric conversion panel was prepared according to the configuration of FIG.
- a transparent support substrate was prepared by depositing 100 nm of ITO (indium tin oxide) as an anode on a glass substrate of 100 mm ⁇ 100 mm ⁇ 1.1 mm. This was ultrasonically cleaned with isopropyl alcohol, dried with dry nitrogen gas, and further subjected to UV ozone cleaning for 5 minutes.
- ITO indium tin oxide
- the substrate was brought into the glove box and worked in a nitrogen atmosphere.
- the substrate was heat-treated at 140 ° C. for 3 minutes in a nitrogen atmosphere.
- the substrate on which the series of functional layers is formed is moved into a vacuum deposition apparatus chamber, the inside of the vacuum deposition apparatus is depressurized to 1 ⁇ 10 ⁇ 4 Pa or less, and then fluorinated at a deposition rate of 0.01 nm / second.
- Lithium was laminated to 0.6 nm, and then passed through a shadow mask with a width of 2 mm (deposition so that the light receiving portion was 2 ⁇ 2 mm), and 100 nm of Al metal was laminated at a deposition rate of 0.2 nm / sec. To form an organic photoelectric conversion element.
- the matte surface had a different thickness (described in Table 3).
- the surface roughness (matte surface) of this aluminum foil was Ra 470 nm, and Ra of the polished surface was 1 nm or less.
- the prepared PET laminated aluminum foil is made approximately the same size (100 mm ⁇ 100 mm) as the glass substrate on which the organic photoelectric conversion element is formed, and the following thermosetting adhesive is used on the glossy surface (opposite side of the PET laminated surface). And glued.
- Thermosetting adhesive Epoxy adhesive Bisphenol A diglycidyl ether (DGEBA) Dicyandiamide (DICY) Epoxy adduct curing accelerator Thermosetting adhesive is applied uniformly along the adhesive surface (glossy surface) of the aluminum foil using a dispenser, and then the sealing substrate is removed from the organic EL so that the take-out electrode is exposed. The adhesive surface was closely attached and disposed on the glass substrate on which the element organic photoelectric conversion element was formed, and the sealing substrate was pressure-bonded (pressure 0.15 MPa, time 30 seconds) and temporarily adhered.
- the temporarily bonded organic photoelectric conversion panel was placed on a hot plate and heated (temperature: 120 ° C., 30 minutes) to thermally cure the thermosetting adhesive, thereby producing an organic photoelectric conversion panel.
- Organic photoelectric conversion panels SP2 to SP7 having different thicknesses of the PET film used for producing the sealing substrate were obtained.
- organic photoelectric conversion panel SP7 comparative sample
- aluminum foil is not laminated with polyester sheet, and only aluminum foil (PET thickness 0) is sealed.
- An organic photoelectric conversion panel SP1 sealed in the same manner as a substrate was prepared for comparison.
- + 1V (forward direction) and -1V (reverse direction) are applied to the created organic photoelectric conversion panel from each extraction electrode in the dark using a low-voltage power supply (DC voltage / current source R6243 manufactured by ADC Corporation).
- the organic photoelectric conversion panel sealed with metal foil has a low rectification ratio and a short circuit. Moreover, in the thing using the metal foil which laminated
- Example 4 In Example 1, instead of the glass substrate of the organic EL panel, an organic EL panel was prepared using a polyethylene naphthalate (PEN) film having a thickness of 125 ⁇ m as a substrate, and the same test as in Example 1 was performed. Even when a plastic substrate was used, the same effect as in Example 1 was obtained.
- PEN polyethylene naphthalate
- Example 5 In Example 2, instead of the glass substrate of the organic EL panel, an organic EL panel was prepared by using a polyethylene naphthalate (PEN) film having a thickness of 125 ⁇ m as a substrate, and the same test as in Example 2 was performed. Even when a plastic substrate was used, essentially the same effect was obtained.
- PEN polyethylene naphthalate
- Example 6 In Example 3, it replaced with the glass substrate of the organic photoelectric conversion panel, the organic photoelectric conversion panel was similarly created using the polyethylene naphthalate (PEN) film of thickness 125 micrometers as a board
- PEN polyethylene naphthalate
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
封止基板が金属箔からなり、該金属箔の前記接着層とは反対側の面に、ポリマーフィルムが積層され、かつ、ポリマーフィルムの厚みが金属箔の厚み以下であり、封止基板の貼合・積層時または接着層硬化時に加熱することを特徴とする有機エレクトロニクスパネル。
ポリマーフィルム試料として、30mm幅×120mm長さの試験片を各3枚採取する。試験片の両端に6mmφの穴をパンチで100mm間隔に開ける。これを23±3℃、相対温度65±5%の室内で3時間以上調湿する。自動ピンゲージ(新東科学(株)製)を用いてパンチ間隔の原寸(L1)を最小目盛り/1000mmまで測定する。次に試験片を硬化時の加熱温度に設定した恒温器に吊して3時間熱処理し、23±3℃、相対湿度65±5%の室内で3時間以上調湿した後、自動ピンゲージで熱処理後のパンチ間隔の寸法(L2)を測定する。そして、以下の式により熱収縮率を算出する。
例えばPETの熱収縮率は120℃で0.8%程度である。
有機EL素子は、電極間に単数又は複数の有機層を積層した構造であり、例えば、陽極層/正孔注入・輸送層/発光層/電子注入・輸送層/陰極層等、各種の有機化合物からなる機能層が必要の応じ積層された構成をもつ。最も単純には、陽極層/発光層/陰極層からなる構造を有する。
次に、有機光電変換素子について説明するが、以下の形態に限定されるものではない。
本発明を適用した有機光電変換素子は、支持体の一方面上に、透明電極、光電変換層及び対電極が順次積層されている。
(ii)陽極/電子ブロック能を有する正孔輸送層/光電変換層/正孔ブロック能を有する電子輸送層/陰極バッファー層/陰極
(iii)陽極/陽極バッファー層/正孔輸送層/電子ブロック層/光電変換層/正孔ブロック層/電子輸送層/陰極
(iv)陽極/陽極バッファー層/正孔輸送層/電子ブロック層/光電変換層/正孔ブロック層/電子輸送層/陰極バッファー層/陰極
上記のように、有機光電変換素子は基板上に各層を重ね合わせて重層され構成される。有機光電変換素子においても、上記各機能層は、真空蒸着法、またスパッタ法等の乾式法、また塗布、印刷法等の湿式法等、種々の公知の方法により成膜することができる。
図2の構成に従って、有機ELパネルを作成した。
100mm×100mm×1.1mmのガラス基板上に、陽極としてITO(インジウムチンオキシド)を100nm成膜した透明支持基板を準備した。これをイソプロピルアルコールで超音波洗浄し、乾燥窒素ガスで乾燥し、UVオゾン洗浄を更に5分間行った。
溶媒:トルエン 100質量%
ホスト材料:H-A 1質量%
青色材料:Ir-A 0.10質量%
緑色材料:Ir(ppy)3 0.004質量%
赤色材料:Ir(piq)3 0.005質量%
次いで、電子輸送層用塗布液を下記のように調製し、スピンコーターにて、1500rpm、30秒の条件で塗布し、電子輸送層を設けた。別途用意した基板にて、同条件にて塗布を行い、測定をしたところ、膜厚は20nmであった。
2,2,3,3-テトラフルオロ-1-プロパノール 100ml
ET-A 0.50g
次いで封止基板として、ポリエステルシートでラミネートされたアルミ箔を作成した。
次いで、作成したPETラミネートアルミ箔を、有機EL素子を形成したガラス基板と略同じサイズ(100mm×100mm)とし、そのつや面(PETラミネート面の反対側)に以下の熱硬化性接着剤を用いて接着した。
ビスフェノールAジグリシジルエーテル(DGEBA)
ジシアンジアミド(DICY)
エポキシアダクト系硬化促進剤
熱硬化接着剤はディスペンサを使用してアルミ箔の接着面(つや面)に沿って均一に塗布し、しかる後、封止基板を、取り出し電極が露出するよう、有機EL素子を形成したガラス基板上にこれを覆うようにして接着面を密着・配置して、圧着(圧力0.15MPa、時間30秒)し仮接着した。仮接着された有機ELパネルをホットプレート上に載置し加熱し(温度120℃、30分)熱硬化接着剤を熱硬化させ、有機ELパネルを作成した。封止基板の作成に用いたPETフィルムの厚みが異なる有機ELパネル2~7を得た。
作成した有機ELパネルに、各取り出し電極から、低電圧電源(株式会社エーディーシー製、直流電圧・電流源R6243)にて+5V(正方向)、-5V(逆方向)を印加しその時の電流値を測定し、正逆電流値の比(正方向電流値÷逆方向電流値=整流比)を算出し比較を実施した。
◎:1000以上
○:100以上、1000未満
△:10以上、100未満
×:10未満
また、熱硬化後の、封止端部の剥れを測定した。具体的には封止基板端部において、ポリマーフィルム側への反り量(浮き上がり量)をハイトゲージにより測定し、剥れ量とした。
○:0.05mm未満
△:0.05mm以上、0.3mm未満
×:0.3mm以上
表1に結果を示す。
実施例1と同様に、図2の構成に従って、有機ELパネルを作成した。
実施例1と同様に、100mm×100mm×1.1mmのガラス基板上に、陽極、正孔輸送層、発光組成物、電子輸送層、陰極バッファー層、陰極を順次成膜して、有機EL素子を作製した。
次いで封止基板として、ポリエステルシートでラミネートされたアルミ箔を作成した。
作成した接着層付きPETラミネートアルミ箔を、有機EL素子を形成したガラス基板と略同じサイズ(100mm×100mm)とし、しかる後、封止基板を、取り出し電極が露出するよう、有機EL素子を形成したガラス基板上にこれを覆うようにして接着面を密着・配置して加熱圧着し貼合した。貼合時の圧力は0.15MPa、時間は30秒とし、加熱温度を変化させ(表2に記載)、PETフィルムの収縮率が異なる条件で複数の有機ELパネル8~14を作成した。
作成した有機ELパネルに、各取り出し電極から、低電圧電源(株式会社エーディーシー製、直流電圧・電流源R6243)にて+5V(正方向)、-5V(逆方向)を印加しその時の電流値を測定し、正逆電流値の比(正方向電流値÷逆方向電流値=整流比)を算出し比較を実施した。
◎:1000以上
○:100以上、1000未満
△:10以上、100未満
×:10未満
また、貼合後の、封止端部の剥れを測定した。具体的には封止部材端部において、ポリマーフィルム側への反り量(浮き上がり量)をハイトゲージにより測定し、剥れ量とした。
○:0.05mm未満
△:0.05mm以上、0.3mm未満
×:0.3mm以上
表2に結果を示す。
図2の構成に従って、有機光電変換パネルを作成した。
100mm×100mm×1.1mmのガラス基板上に、陽極としてITO(インジウムチンオキシド)を100nm成膜した透明支持基板を準備した。これをイソプロピルアルコールで超音波洗浄し、乾燥窒素ガスで乾燥し、UVオゾン洗浄を更に5分間行った。
次いで封止基板として、ポリエステルシートでラミネートされたアルミ箔を作成した。
次いで、作成したPETラミネートアルミ箔を有機光電変換素子を形成したガラス基板と略同じサイズ(100mm×100mm)とし、そのつや面(PETラミネート面の反対側)に以下の熱硬化性接着剤を用いて接着した。
ビスフェノールAジグリシジルエーテル(DGEBA)
ジシアンジアミド(DICY)
エポキシアダクト系硬化促進剤
熱硬化接着剤はディスペンサを使用してアルミ箔の接着面(つや面)に沿って均一に塗布し、しかる後、封止基板を、取り出し電極が露出するよう、有機EL素子有機光電変換素子を形成したガラス基板上にこれを覆うようにして接着面を密着・配置して、封止基板を圧着(圧力0.15MPa、時間30秒)し仮接着した。仮接着された有機光電変換パネルをホットプレート上に載置し加熱し(温度120℃、30分)熱硬化接着剤を熱硬化させ、有機光電変換パネルを作成した。封止基板の作成に用いたPETフィルムの厚みが異なる有機光電変換パネルSP2~SP7を得た。
作成した有機光電変換パネルに、各取り出し電極から、低電圧電源(株式会社エーディーシー製、直流電圧・電流源R6243)にて+5V(正方向)、-5V(逆方向)を印加しその時の電流値を測定し、正逆電流値の比(正方向電流値÷逆方向電流値=整流比)を算出し比較を実施した。
◎:1000以上
○:100以上、1000未満
△:10以上、100未満
×:10未満
また、熱硬化後の、封止端部の剥れを測定した。具体的には封止基板端部において、ポリマーフィルム側への反り量(浮き上がり量)をハイトゲージにより測定し、剥れ量とした。
○:0.05mm未満
△:0.05mm以上、0.3mm未満
×:0.3mm以上
表3に結果を示す。
実施例1において、有機ELパネルのガラス基板に代えて、厚み125μmのポリエチレンナフタレート(PEN)フィルムを基板として用いて有機ELパネル作成し、実施例1と同様の試験を行った。プラスチック基板を用いた場合でも本質的に実施例1と全く同様の効果が得られた。
実施例2において、有機ELパネルのガラス基板に代えて、厚み125μmのポリエチレンナフタレート(PEN)フィルムを基板として用いて有機ELパネル作成し、実施例2と同様の試験を行ったが、その結果、プラスチック基板を用いた場合でも本質的に全く同様の効果が得られた。
実施例3において、有機光電変換パネルのガラス基板に代え、同様に厚み125μmのポリエチレンナフタレート(PEN)フィルムを基板として用いて有機光電変換パネルを作成し、実施例3と同様の試験を行った。その結果プラスチック基板を用いた場合でも有機光電変換パネルにおいて同様の効果であり、同様の結果であった。
2 第一電極
3 有機機能層
4 第二電極
5 封止基板
6 接着層
7 ポリマーフィルム
Claims (9)
- 基板上に形成された、少なくとも第1電極を含む陽極層、有機化合物層および第2電極を含む陰極層からなる有機エレクトロニクス素子に、接着層を介して封止基板を貼合・積層して、形成する有機エレクトロニクスパネルにおいて、
封止基板が金属箔からなり、該金属箔の前記接着層とは反対側の面に、ポリマーフィルムが積層され、かつ、ポリマーフィルムの厚みが金属箔の厚み以下であり、封止基板の貼合・積層時または接着層硬化時に加熱することを特徴とする有機エレクトロニクスパネル。 - 前記有機化合物層が発光層を含み、有機エレクトロニクス素子が有機エレクトロルミネッセンス素子であることを特徴とする請求項1に記載の有機エレクトロニクスパネル。
- 前記有機化合物層が光電変換層を含み、有機エレクトロニクス素子が有機光電変換素子であることを特徴とする請求項1に記載の有機エレクトロニクスパネル。
- 前記金属箔の厚みが9~500μmであり、ポリマーフィルムの厚みが金属箔に対し、10~100%の厚みであることを特徴とする請求項1~3のいずれか1項に記載の有機エレクトロニクスパネル。
- 前記金属箔がアルミニウムであることを特徴とする請求項1~4のいずれか1項に記載の有機エレクトロニクスパネル。
- 前記金属箔がアルミニウムであり、かつ、該金属箔の接着層側の面がつや面であることを特徴とする請求項1~4のいずれか1項に記載の有機エレクトロニクスパネル。
- 前記ポリマーフィルムのTgが、前記封止基板の貼合・積層時または接着層硬化時の加熱温度より低いことを特徴とする請求項1~4のいずれか1項に記載の有機エレクトロニクスパネル。
- 前記ポリマーフィルムの熱収縮率が、前記封止基板の貼合・積層時または接着層硬化時の加熱温度において0.2~3%であることを特徴とする請求項1~4のいずれか1項に記載の有機エレクトロニクスパネル。
- 請求項1~8のいずれか1項に記載の有機エレクトロニクスパネルを製造することを特徴とする有機エレクトロニクスパネルの製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/255,851 US8445899B2 (en) | 2009-03-16 | 2010-02-12 | Organic electronic panel and method for manufacturing organic electronic panel |
JP2011504779A JP5660030B2 (ja) | 2009-03-16 | 2010-02-12 | 有機エレクトロニクスパネルおよび有機エレクトロニクスパネルの製造方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009-062888 | 2009-03-16 | ||
JP2009062888 | 2009-03-16 | ||
JP2009279222 | 2009-12-09 | ||
JP2009-279222 | 2009-12-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2010106853A1 true WO2010106853A1 (ja) | 2010-09-23 |
Family
ID=42739519
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2010/052045 WO2010106853A1 (ja) | 2009-03-16 | 2010-02-12 | 有機エレクトロニクスパネルおよび有機エレクトロニクスパネルの製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8445899B2 (ja) |
JP (1) | JP5660030B2 (ja) |
WO (1) | WO2010106853A1 (ja) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012238463A (ja) * | 2011-05-11 | 2012-12-06 | Konica Minolta Holdings Inc | 有機エレクトロルミネッセンス素子、及び、有機エレクトロルミネッセンス素子の製造方法 |
WO2013061757A1 (ja) * | 2011-10-27 | 2013-05-02 | シャープ株式会社 | 合わせガラス構造太陽電池モジュール |
JP2013183139A (ja) * | 2012-03-05 | 2013-09-12 | Konica Minolta Inc | 面状発光体及び照明装置 |
JP2013541158A (ja) * | 2010-09-27 | 2013-11-07 | コーニンクレッカ フィリップス エヌ ヴェ | 可撓性の被覆層を持つoled |
JP2014127575A (ja) * | 2012-12-26 | 2014-07-07 | Nitto Denko Corp | 封止シート |
KR101611924B1 (ko) * | 2012-12-31 | 2016-04-12 | 엘지디스플레이 주식회사 | 유기 발광 다이오드 표시 장치 |
JP2016514895A (ja) * | 2013-08-21 | 2016-05-23 | エルジー・ケム・リミテッド | 有機発光素子およびその製造方法 |
JP2017103258A (ja) * | 2011-07-08 | 2017-06-08 | 株式会社半導体エネルギー研究所 | 表示装置 |
KR101772661B1 (ko) * | 2010-11-29 | 2017-09-13 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
KR101803537B1 (ko) * | 2012-02-09 | 2017-11-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 소자 |
JP2018500731A (ja) * | 2014-12-03 | 2018-01-11 | 深▲セン▼市華星光電技術有限公司 | フレキシブルoled基板及びフレキシブルoled実装方法 |
JPWO2018221510A1 (ja) * | 2017-05-31 | 2019-06-27 | リンテック株式会社 | シート状接着剤、ガスバリア性積層体、及び封止体 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5010758B2 (ja) * | 2010-06-04 | 2012-08-29 | 三井金属鉱業株式会社 | 電極箔および有機デバイス |
JP2012234974A (ja) * | 2011-05-02 | 2012-11-29 | Ma Packaging:Kk | 太陽電池モジュール用バックシート |
CN103337595B (zh) * | 2013-07-04 | 2016-04-06 | 上海和辉光电有限公司 | 柔性封装衬底及其制造方法和使用该衬底的oled封装方法 |
CN103779511B (zh) * | 2014-01-26 | 2016-01-20 | 江苏天楹之光光电科技有限公司 | 一种oled封装的制造方法 |
US10333100B2 (en) | 2014-08-29 | 2019-06-25 | Sumitomo Chemical Company, Limited | Organic electroluminescent device |
CN108475730A (zh) * | 2016-02-12 | 2018-08-31 | 沙特基础工业全球技术有限公司 | 感光层压板、制造方法和图像传感器装置 |
KR102316563B1 (ko) * | 2017-05-22 | 2021-10-25 | 엘지디스플레이 주식회사 | 금속으로 형성된 상부 기판을 포함하는 유기 발광 표시 장치 및 이의 제조 방법 |
CN107731749B (zh) * | 2017-11-27 | 2020-02-07 | 合肥鑫晟光电科技有限公司 | 一种封装薄膜及其制备方法和一种oled显示装置 |
TWI667820B (zh) * | 2018-03-30 | 2019-08-01 | 財團法人工業技術研究院 | 發光元件 |
KR20210079898A (ko) * | 2019-12-20 | 2021-06-30 | 엘지디스플레이 주식회사 | 표시장치 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02192691A (ja) * | 1989-01-20 | 1990-07-30 | Kohjin Co Ltd | El発光素子 |
JP2002093573A (ja) * | 2000-09-14 | 2002-03-29 | Nisshin Steel Co Ltd | 有機el素子用絶縁性封止部材 |
JP2003168555A (ja) * | 2001-11-29 | 2003-06-13 | Sumitomo Electric Ind Ltd | エレクトロルミネッセンス表示装置 |
JP2006299145A (ja) * | 2005-04-22 | 2006-11-02 | Konica Minolta Holdings Inc | ガスバリア性フィルム、ガスバリア性フィルムを用いた有機エレクトロルミネッセンス用樹脂基材および有機エレクトロルミネッセンス素子 |
WO2007123006A1 (ja) * | 2006-04-21 | 2007-11-01 | Konica Minolta Holdings, Inc. | ガスバリアフィルム、有機エレクトロルミネッセンス用樹脂基材、それを用いた有機エレクトロルミネッセンス素子及びガスバリアフィルムの製造方法 |
JP2009054606A (ja) * | 2007-08-23 | 2009-03-12 | Fujifilm Corp | 有機半導体材料、該材料を含む膜、有機電子デバイス及び赤外色素組成物 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001043970A (ja) | 1999-07-30 | 2001-02-16 | Auto Network Gijutsu Kenkyusho:Kk | 有機el表示装置 |
US6700185B1 (en) * | 1999-11-10 | 2004-03-02 | Hitachi Chemical Co., Ltd. | Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method for manufacturing semiconductor device |
JP2004171806A (ja) | 2002-11-18 | 2004-06-17 | Toppan Printing Co Ltd | 有機エレクトロルミネッセンス素子 |
-
2010
- 2010-02-12 US US13/255,851 patent/US8445899B2/en active Active
- 2010-02-12 WO PCT/JP2010/052045 patent/WO2010106853A1/ja active Application Filing
- 2010-02-12 JP JP2011504779A patent/JP5660030B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02192691A (ja) * | 1989-01-20 | 1990-07-30 | Kohjin Co Ltd | El発光素子 |
JP2002093573A (ja) * | 2000-09-14 | 2002-03-29 | Nisshin Steel Co Ltd | 有機el素子用絶縁性封止部材 |
JP2003168555A (ja) * | 2001-11-29 | 2003-06-13 | Sumitomo Electric Ind Ltd | エレクトロルミネッセンス表示装置 |
JP2006299145A (ja) * | 2005-04-22 | 2006-11-02 | Konica Minolta Holdings Inc | ガスバリア性フィルム、ガスバリア性フィルムを用いた有機エレクトロルミネッセンス用樹脂基材および有機エレクトロルミネッセンス素子 |
WO2007123006A1 (ja) * | 2006-04-21 | 2007-11-01 | Konica Minolta Holdings, Inc. | ガスバリアフィルム、有機エレクトロルミネッセンス用樹脂基材、それを用いた有機エレクトロルミネッセンス素子及びガスバリアフィルムの製造方法 |
JP2009054606A (ja) * | 2007-08-23 | 2009-03-12 | Fujifilm Corp | 有機半導体材料、該材料を含む膜、有機電子デバイス及び赤外色素組成物 |
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013541158A (ja) * | 2010-09-27 | 2013-11-07 | コーニンクレッカ フィリップス エヌ ヴェ | 可撓性の被覆層を持つoled |
KR101772661B1 (ko) * | 2010-11-29 | 2017-09-13 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
US11251396B2 (en) | 2010-11-29 | 2022-02-15 | Samsung Display Co., Ltd. | Organic light emitting diode display |
US10050225B2 (en) | 2010-11-29 | 2018-08-14 | Samsung Display Co., Ltd. | Organic light emitting diode display |
JP2012238463A (ja) * | 2011-05-11 | 2012-12-06 | Konica Minolta Holdings Inc | 有機エレクトロルミネッセンス素子、及び、有機エレクトロルミネッセンス素子の製造方法 |
JP2017103258A (ja) * | 2011-07-08 | 2017-06-08 | 株式会社半導体エネルギー研究所 | 表示装置 |
US9966560B2 (en) | 2011-07-08 | 2018-05-08 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting module, light-emitting device, and method for manufacturing the light-emitting module |
JP2019070852A (ja) * | 2011-07-08 | 2019-05-09 | 株式会社半導体エネルギー研究所 | 表示装置 |
JPWO2013061757A1 (ja) * | 2011-10-27 | 2015-04-02 | シャープ株式会社 | 合わせガラス構造太陽電池モジュール |
WO2013061757A1 (ja) * | 2011-10-27 | 2013-05-02 | シャープ株式会社 | 合わせガラス構造太陽電池モジュール |
US11997860B2 (en) | 2012-02-09 | 2024-05-28 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting element |
US10693093B2 (en) | 2012-02-09 | 2020-06-23 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting element |
KR101803537B1 (ko) * | 2012-02-09 | 2017-11-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 소자 |
US11495763B2 (en) | 2012-02-09 | 2022-11-08 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting element |
US10326093B2 (en) | 2012-02-09 | 2019-06-18 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting element |
JP2013183139A (ja) * | 2012-03-05 | 2013-09-12 | Konica Minolta Inc | 面状発光体及び照明装置 |
JP2014127575A (ja) * | 2012-12-26 | 2014-07-07 | Nitto Denko Corp | 封止シート |
KR101611924B1 (ko) * | 2012-12-31 | 2016-04-12 | 엘지디스플레이 주식회사 | 유기 발광 다이오드 표시 장치 |
US9876190B2 (en) | 2013-08-21 | 2018-01-23 | Lg Display Co., Ltd. | Organic light-emitting diode and method for manufacturing same |
JP2016514895A (ja) * | 2013-08-21 | 2016-05-23 | エルジー・ケム・リミテッド | 有機発光素子およびその製造方法 |
JP2018500731A (ja) * | 2014-12-03 | 2018-01-11 | 深▲セン▼市華星光電技術有限公司 | フレキシブルoled基板及びフレキシブルoled実装方法 |
CN110709485A (zh) * | 2017-05-31 | 2020-01-17 | 琳得科株式会社 | 片状粘接剂、阻气层叠体及密封体 |
JPWO2018221510A1 (ja) * | 2017-05-31 | 2019-06-27 | リンテック株式会社 | シート状接着剤、ガスバリア性積層体、及び封止体 |
CN110709485B (zh) * | 2017-05-31 | 2022-06-28 | 琳得科株式会社 | 片状粘接剂、阻气层叠体及密封体 |
Also Published As
Publication number | Publication date |
---|---|
JP5660030B2 (ja) | 2015-01-28 |
US20110315977A1 (en) | 2011-12-29 |
JPWO2010106853A1 (ja) | 2012-09-20 |
US8445899B2 (en) | 2013-05-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5660030B2 (ja) | 有機エレクトロニクスパネルおよび有機エレクトロニクスパネルの製造方法 | |
JP5943057B2 (ja) | 有機エレクトロニクスパネルおよびその製造方法 | |
JP6001595B2 (ja) | 有機エレクトロルミネセンスデバイス | |
TWI462358B (zh) | 經保護之聚合膜 | |
WO2011070951A1 (ja) | 有機エレクトロニクスパネル及びその製造方法 | |
WO2011114882A1 (ja) | 有機エレクトロルミネッセンスパネル及び有機エレクトロルミネッセンスパネルの製造方法 | |
JP2009054420A (ja) | 電子デバイス用可撓性基板の製造方法、電子デバイスの製造方法およびそれによって製造された電子デバイス | |
JP2007290369A (ja) | ガスバリア性積層フィルムとその製造方法、および画像表示素子 | |
JP2009123690A (ja) | 塗布層形成後或いは対電極層形成後に乾燥剤フィルムを貼合して巻き取る有機エレクトロニクス素子とその製造方法 | |
JP4747401B2 (ja) | 有機エレクトロルミネッセンス素子及びその製造方法 | |
EP3188572B1 (en) | Organic electroluminescent element | |
US20050252602A1 (en) | Organic thin-film device and its production method | |
JP5772819B2 (ja) | 有機エレクトロルミネッセンスパネルの製造方法及びその製造方法で製造された有機エレクトロルミネッセンスパネル | |
JPWO2008023626A1 (ja) | 有機エレクトロルミネッセンス素子およびその製造方法 | |
JP5532887B2 (ja) | 有機エレクトロニクスパネル | |
JP2003297561A (ja) | 有機薄膜素子の製造方法及び有機薄膜素子 | |
JP2004171806A (ja) | 有機エレクトロルミネッセンス素子 | |
WO2011105141A1 (ja) | 有機エレクトロルミネッセンス素子及びその製造方法 | |
WO2011099362A1 (ja) | 有機エレクトロルミネッセンスパネルの製造方法 | |
JP5578180B2 (ja) | 有機エレクトロルミネッセンスパネルの製造方法とこれを用いて製造された有機エレクトロルミネッセンスパネル | |
WO2011096308A1 (ja) | 有機エレクトロルミネッセンスパネルの製造方法 | |
US20100044738A1 (en) | Preparation of organic light emitting diodes by a vapour deposition method combined with vacuum lamination | |
JP2004079325A (ja) | 有機電界発光素子の製造方法及び転写材料 | |
JP2004288441A (ja) | 有機電界発光素子の製造方法、及び有機電界発光素子 | |
JP2002216974A (ja) | エレクトロルミネッセンス素子 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 10753348 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2011504779 Country of ref document: JP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 13255851 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 10753348 Country of ref document: EP Kind code of ref document: A1 |