WO2010082652A1 - Film conducteur transparent encapsulant une structure de type maillage faite de microparticules de métal, substrat sur lequel ledit film est appliqué et procédé de fabrication - Google Patents

Film conducteur transparent encapsulant une structure de type maillage faite de microparticules de métal, substrat sur lequel ledit film est appliqué et procédé de fabrication Download PDF

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WO2010082652A1
WO2010082652A1 PCT/JP2010/050504 JP2010050504W WO2010082652A1 WO 2010082652 A1 WO2010082652 A1 WO 2010082652A1 JP 2010050504 W JP2010050504 W JP 2010050504W WO 2010082652 A1 WO2010082652 A1 WO 2010082652A1
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transparent conductive
conductive film
substrate
fine particles
network structure
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PCT/JP2010/050504
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English (en)
Japanese (ja)
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柿原康男
鈴木教一
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戸田工業株式会社
フジコピアン株式会社
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/08—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances oxides

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  • the present invention relates to a transparent conductive film, a transparent conductive film laminated substrate, and a method for manufacturing the same, in which an oxide film mainly composed of silicon oxide containing a network structure composed of metal fine particles is laminated.
  • Transparent conductive films are used for electrodes such as display devices such as plasma displays and organic EL, input sensors such as touch panels, thin-film amorphous Si solar cells and dye-sensitized solar cells.
  • thin films mainly composed of ITO (In and Sn oxides) and ZnO, which are transparent oxides, are mainly used and may be produced by a coating method of a fine particle dispersion solution.
  • a coating method of a fine particle dispersion solution In order to obtain high conductivity, it is generally produced by a vapor phase method using a sputtering apparatus or a vapor deposition apparatus.
  • a metal film is formed in a lattice shape or a mesh shape in place of the continuous transparent conductive film by the vapor phase method as described above, and the metal film portion is A discontinuous transparent conductive film having a conductivity and a hole having a light transmission property is disclosed.
  • an EMI shield film for a plasma display in which Cu is etched in a lattice after forming a continuous film of Cu film is actually employed, and a metal fine particle dispersion solution is applied or printed for the same purpose.
  • a method of forming a conductive portion having a network structure and performing plating has been studied. Any of these methods does not require a vacuum apparatus necessary for the vapor phase method, and can improve conductivity while ensuring transparency.
  • Patent Document 1 a transparent conductive film laminated substrate having a mesh structure by screen printing a metal fine particle paste on a substrate in a mesh shape and heating and firing and a manufacturing method thereof are known.
  • Patent Document 2 a method of forming a transparent conductive film on a substrate by preparing a W / O type emulsion from a metal fine particle dispersion solution, forming a network structure on the substrate by applying and drying on a substrate.
  • Transparent conductive films and transparent conductive film laminated substrates composed of materials having high transmittance, high conductivity, flatness, and excellent heat resistance and weather resistance are currently most demanded. Although it is, it has not been obtained yet.
  • the above-mentioned discontinuous transparent conductive film can obtain a transparent conductive film laminated substrate having high transmittance and high conductivity which are important as a transparent conductive film.
  • the conductive part inevitably becomes convex on the upper surface of the transparent conductive film laminated substrate due to the manufacturing method, and the flatness is not sufficient. Therefore, when another functional thin film is laminated on the upper part, for example, when used for an electrode for organic EL or an electrode of a thin film type solar cell, there is a concern that the light emission efficiency and the power generation efficiency are lowered.
  • transparent conductive film laminated substrates used in solar cells that require sufficient weather resistance and performance maintenance for long-term outdoor use, organic substances contained inside decompose and precipitate over time. Then, since there exists a possibility of causing the fall of electric power generation efficiency, the transparent conductive film comprised with the material stable for a long period of time is desired.
  • the present invention provides a transparent conductive film and a transparent conductive film laminated substrate that are made of a material having high transmittance, high conductivity, improved flatness, and excellent heat resistance and weather resistance.
  • the present invention is a transparent conductive film composed of an oxide film mainly composed of silicon oxide containing a network structure composed of metal fine particles (Invention 1).
  • the metal fine particles are a metal selected from Au, Ag, Cu, Pt, Pd, Fe, Co, Ni, Al, In, and Sn, or an alloy containing two or more of the above metals. 1.
  • the present invention is the transparent conductive film according to the first or second aspect of the present invention, wherein the silicon oxide is generated using one or more of silica fine particles, silica-based compounds, and polysilazanes (Invention 3).
  • the present invention is a transparent conductive film laminated substrate in which the transparent conductive film according to any one of the first to third aspects of the present invention is laminated on a glass substrate or a ceramic substrate (Invention 4).
  • a glass substrate or an adhesive layer containing silica fine particles, one or more types of silica-based compounds, and an organic binder is used. It is a manufacturing method of the transparent conductive film laminated substrate of this invention 4 characterized by heat-baking, after transferring an adhesive layer with a network structure on a ceramic substrate (this invention 5).
  • the present invention is the manufacturing method according to the fifth aspect of the present invention, wherein a solution containing polysilazane as a main component is applied to the surface of the transparent conductive film laminated substrate, followed by heating and baking and / or humidification (the sixth aspect of the present invention).
  • the present invention is the manufacturing method according to the present invention 6 (invention 7) in which the surface of the transparent conductive film laminated substrate is subjected to chemical wet etching and / or physical polishing (etching or polishing).
  • a metal fine particle dispersion solution or an ink containing metal fine particles is applied or printed on the substrate 10, and then a conductive portion having a network structure is formed by heating and / or chemical treatment ((A in FIG. 1). )).
  • the conductive portion having the network structure is applied on the substrate 10 and dried to form an adhesive layer. . ((B) of FIG. 1). Further, it is bonded to a glass substrate 11 or a ceramic substrate having excellent optical transparency and heat resistance ((C) in FIG. 1). After confirming that it is sufficiently adhered, the substrate 10 is removed and the network structure is transferred together with the adhesive layer ((D) of FIG. 1).
  • a transparent conductive film and a transparent conductive film laminated substrate (5) composed of a material excellent in weather resistance can be obtained ((E) in FIG. 1).
  • a transparent conductive film 4 and a transparent conductive film laminated substrate 5 which are made of a material having high rate, high conductivity, improved flatness, and excellent heat resistance and weather resistance ((( G)).
  • the surface may be subjected to chemical wet etching and / or physical polishing (etching or polishing) for the purpose of further improving the flatness and conductivity of the transparent conductive film having improved surface flatness ( (H) of FIG.
  • the meaning of “contain” the network structure in which the transparent conductive film is composed of metal fine particles means that the network structure is completely formed as shown in FIG. An embedded mode and a mode in which at least a part of the network structure forms a surface as shown in FIG.
  • the adhesive layer may be formed on the glass substrate or ceramic substrate side, and the network structure may be transferred to the network structure by removing the base material by aligning the network structure with the substrate.
  • the metal species of the metal fine particles of the present invention Au, Ag, Cu, Pt, Pd, Fe, Co, Ni, Al, In, Sn, etc. can be used.
  • an alloy containing two or more of the above metals may be used.
  • the metal fine particles can be prepared using a gas phase method, a liquid phase method, a metal salt thermal decomposition method, or the like, which has been conventionally disclosed.
  • a method in which a network structure is formed using the metal salt or organometallic compound of the metal and then chemically or physically reduced can be used.
  • Metal fine particles are prepared in a dispersion solution or printing ink, and applied or printed on a substrate. Therefore, the surface of the metal fine particles is preferably treated with an appropriate surface treatment agent or dispersant.
  • an appropriate surface treatment agent or dispersant a surface treatment agent or dispersant that is optimally dispersed in each dispersion solution or each printing ink is preferably used.
  • a substrate for applying or printing a metal fine particle dispersion solution or printing ink containing metal fine particles can withstand the formation of a conductive part having a network structure with the metal fine particle dispersion solution or printing ink containing metal fine particles. And heat resistance.
  • polyester resins such as polyethylene terephthalate and polyethylene naphthalate, polyimide resins, A polyamide resin or the like is preferable.
  • a conductive part having a network structure containing metal fine particles After forming a conductive part having a network structure containing metal fine particles, it is preferable to perform heating and / or chemical treatment within a range that the substrate can withstand for the purpose of improving conductivity.
  • the thickness of the conductive part having a network structure containing metal fine particles is preferably 0.4 to 10 ⁇ m. When it is thinner than 0.4 ⁇ m, sufficient conductivity cannot be obtained. This is because when the thickness exceeds 10 ⁇ m, the line width of the net portion tends to be widened at the same time, resulting in a decrease in transmittance.
  • the entire surface of the base material on which the conductive portion having a network structure is formed is covered with a highly transparent adhesive to form the adhesive layer 2.
  • the adhesive used in the adhesive layer of the present invention is mainly composed of silica fine particles, one or more types of silica compounds, and an organic binder.
  • Organic binders include polyvinyl chloride, polycarbonate, polystyrene, polymethyl methacrylate, polybutyl methacrylate, polyester, polysulfone, polyvinyl butyral, polyvinyl acetal, polyphenylene oxide, polybutadiene, poly (N-vinylcarbazole), polyvinyl pyrrolidone, hydrocarbon resin , Ketone resin, phenoxy resin, polyamide, chlorinated polypropylene, polyimide, urea, cellulose, vinyl acetate, ABS resin, polyurethane, phenol resin, melamine resin, unsaturated polyester resin, alkyd resin, epoxy resin, silicone resin Examples include at least one of the group consisting of polymers, and / or any mixture thereof.
  • colloidal silica in which colloidal silica fine particles are dispersed in water or an organic solvent, alkyl silicate, silane coupling agent, or a mixture thereof can be used.
  • the colloidal silica is preferably ultrafine particles having a particle diameter (diameter) of about 1 to 50 nm.
  • the particle diameter of the colloidal silica in the present invention is an average particle diameter according to the BET method (a surface area is measured by the BET method, and the average particle diameter is calculated by converting the particles to be true spheres).
  • the colloidal silica is a known one, and examples of commercially available ones include “methanol silica sol”, “MA-ST-M”, “IPA-ST”, “EG-ST”, “EG-ST-ZL”. “,” NPC-ST “,” DMAC-ST “,” MEK-ST “,” XBA-ST “,” MIBK-ST “(all products of Nissan Chemical Industries, Ltd., all trade names),” OSCAL1132 ”,“ OSCAL1232 ”,“ OSCAL1332 ”,“ OSCAL1432 ”,“ OSCAL1532 ”,“ OSCAL1632 ”,“ OSCAL1132 ”(above, products of Catalyst Chemical Industry Co., Ltd., all trade names). be able to.
  • alkyl silicate examples include, for example, methyl silicate, ethyl silicate, butyl silicate, or a hydrolysis polymerization reaction product obtained by mixing these together with a solvent, water and a hydrolysis polymerization catalyst, followed by hydrolysis and polymerization.
  • silane coupling agent examples include methyltrimethoxysilane, dimethyldimethoxysilane, phenyltrimethoxysilane, diphenyldimethoxysilane, methyltriethoxysilane, dimethyldiethoxysilane, phenyltriethoxysilane, diphenyldiethoxysilane, isobutyltrimethoxysilane, Vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris ( ⁇ -methoxyethoxy) silane, 3,3,3-trifluoropropyltrimethoxysilane, methyl-3,3,3-trifluoropropyldimethoxysilane, ⁇ - (3 , 4-epoxycyclohexyl) ethyltrimethoxysilane, ⁇ -glycidoxymethyltrimethoxysilane, ⁇ -glycidoxymethyltriexylsilane, ⁇ -glycidoxyethy
  • the content of the silica fine particles and the silica-based compound contained in the adhesive layer in the present invention is preferably in the range of 10% by weight to 80% by weight in the adhesive layer.
  • the content of the silica fine particles and the silica-based compound is outside the above range, the flatness of the finally obtained transparent conductive film laminated substrate is inferior, which is not preferable.
  • an ultraviolet absorber a color pigment, an antistatic agent, an antioxidant, a silane coupling agent, and the like can be used as necessary as additives in the adhesive layer.
  • the adhesive layer may be provided on one surface of the transfer substrate (glass substrate or ceramic substrate) instead of being provided on the base material side.
  • a coating agent in which the above-mentioned adhesive material is dissolved or dispersed in an organic solvent or water to adjust the viscosity is prepared and applied and dried by a conventionally known coating method such as gravure coating or spin coating. The method can be used.
  • the thickness of the adhesive layer is preferably 0.5 to 50 ⁇ m, more preferably 1.0 to 30 ⁇ m. If the thickness of the adhesive layer is less than 0.5 ⁇ m, sufficient adhesion to the substrate may not be obtained. In addition, if the thickness of the adhesive layer is greater than 50 ⁇ m, it is not preferable because the firing time becomes longer when performing the heat firing in the next step.
  • the base material and the glass substrate 11 are bonded together, heat treatment and pressure treatment are performed as necessary, the base material is peeled off, and the transparent conductive film is formed.
  • a known transfer method can be used, and it may be appropriately selected according to the base material to be used, the material of the substrate to be transferred, and the adhesive layer.
  • a transfer method using a laminator, a transfer method using a press, a thermal transfer method using a thermal head, and the like can be used.
  • the substrate onto which the transparent conductive film has been transferred is heated and fired using a commonly used heating and firing furnace to decompose and scatter the organic binder.
  • the heating and baking temperature is preferably in the temperature range of 300 ° C. to 600 ° C. If the heating and baking temperature is less than 300 ° C., not only will the baking process take a long time and the productivity will decrease, but also the organic binder will remain in the transparent conductive film without being decomposed or scattered and the transmittance will decrease. This is not preferable because there is a possibility. On the other hand, when the heating and baking temperature is higher than 600 ° C., the glass substrate may be warped, which is not preferable.
  • the heating and baking time may be appropriately adjusted together with the baking temperature in accordance with the organic binder used for the adhesive layer, and may be usually treated for about 5 minutes to 10 hours, but is not particularly limited.
  • a transparent conductive film and a transparent conductive film laminated substrate made of a material having high transmittance, high conductivity, flatness, and excellent heat resistance and weather resistance are obtained. I can do it.
  • the transparent conductive film laminated substrate may be a silica fine particle and / or a silica-based material depending on a metal type, a film thickness, a line width, a heating temperature at the time of heating and firing, and a time of the conductive portion having a network structure including metal fine particles.
  • Surface flatness may deteriorate due to the difference in volume shrinkage between the compound and the metal fine particles. A method for further improving the surface flatness will be described below.
  • a solution containing polysilazane as a main material is applied to the surface of the transparent conductive film laminated substrate obtained by the above-described production method.
  • Polysilazane is a general term for linear or cyclic compounds having a silazane bond, —SiR 1 2 —NR 2 —SiR 1 2 — (R 1 and R 2 each independently represents a hydrogen atom or a hydrocarbon gas).
  • the Si—NR 2 —Si bond is decomposed by heating or reaction with moisture to form a Si—O—Si network.
  • perhydropolysilazane in which R 1 and R 2 in the above general formula are hydrogen, or partially organicized polysilazane in which R 2 is a methyl group is preferably used.
  • the solution prepared using polysilazane as a main raw material may contain a metal fine particle catalyst (such as Pd fine particle) or an amine catalyst in order to improve the reactivity of the silazane bond of polysilazane.
  • a metal fine particle catalyst such as Pd fine particle
  • an amine catalyst in order to improve the reactivity of the silazane bond of polysilazane.
  • the content of polysilazane in a solution containing polysilazane as a main raw material is preferably 40 wt% or less. More preferably, it is 20 wt% or less. If it is thicker than 40 wt%, it is not preferable because the viscosity increases when it is applied or there is a problem in storage stability.
  • the lower limit of the concentration is not particularly limited, but if it is 1 wt% or less, it is not preferable because the productivity is poor because it is necessary to repeatedly apply the coating several times in order to obtain a desired thickness.
  • the solvent used in the solution containing polysilazane as a main raw material is not particularly limited as long as it is a solvent that dissolves polysilazane and does not react rapidly with polysilazane.
  • Specific examples include aliphatic hydrocarbons, aromatic hydrocarbons, ketones, esters, ethers, and halogenated hydrocarbons. These solvents may be used alone or in combination.
  • aliphatic hydrocarbons such as octane, nonane, decane, undecane, dodecane, tridecane, and tetradecane
  • aromatic hydrocarbons such as benzene, toluene, and xylene are preferable.
  • the method of applying a solution containing polysilazane as a main raw material is not particularly limited.
  • dip coating, spin coating, spray coating, flexographic printing, screen printing, gravure printing, roll coating, meniscus coating And die coating method is not particularly limited.
  • the glass substrate on which the silicon oxide gel body film is laminated at 100 to 500 ° C. in the air is vitrified by heating for 10 minutes to 24 hours.
  • a transparent conductive film laminated substrate having improved properties can be obtained ((H) in FIG. 1).
  • a transparent conductive film laminated substrate having improved surface flatness can be obtained by allowing it to stand for 1 to 4 weeks in the atmosphere at room temperature for vitrification.
  • etching or polishing it is preferable to perform a chemical wet etching method and / or a physical polishing method (etching or polishing) for the purpose of improving the surface property and conductivity of the transparent conductive film laminated substrate obtained by the above-described production method.
  • a mixed acid such as hydrofluoric acid or ammonium fluoride used in general wet etching of glass, or a commercially available glass etching agent (for example, glass etching agent manufactured by Flosstec) is used. It is preferable to use it.
  • Etching conditions are preferably determined by appropriately determining optimum conditions while confirming the surface flatness and conductivity of the transparent conductive film substrate.
  • polishing As a physical polishing method, a general glass polisher cloth, a glass polisher apparatus, or the like can be used. When a large area and high-speed workability are required, polishing may be performed using a commercially available apparatus for polishing display glass.
  • the surface resistance value in the transparent conductive laminated substrate according to the present invention is preferably 100 ⁇ / ⁇ or less, more preferably 50 ⁇ / ⁇ or less, and even more preferably 10 ⁇ / ⁇ or less. When it is 100 ⁇ / ⁇ or more, it is difficult to say that it is a highly conductive film, which is not preferable.
  • the center line surface roughness (Ra) in the transparent conductive laminated substrate according to the present invention is preferably 1.0 ⁇ m or less, more preferably 0.5 ⁇ m or less, and even more preferably 0.1 ⁇ m.
  • the thickness is larger than 1.0 ⁇ m, the function is deteriorated when the functional thin film is laminated, which is not preferable.
  • the total light transmittance in the transparent conductive laminated substrate according to the present invention is preferably 60% or more, more preferably 70% or more, and even more preferably 80% or more. If it is 60% or less, it is difficult to say that it is highly transparent, which is not preferable.
  • a typical embodiment of the present invention is as follows.
  • silver fine particles are exemplified as the metal fine particles, but the metal species is not limited.
  • the centerline surface roughness (Ra) was measured using a stylus type surface roughness meter (manufactured by DEKTAK).
  • the surface resistance was measured at three points of the sample using MCP-T600 (manufactured by Mitsubishi Chemical Corporation), and the average value was defined as the surface resistance value.
  • the total light transmittance was determined by measuring the total light transmittance of the sample at three points using a haze meter NDH2000 (manufactured by Nippon Denshoku Industries Co., Ltd.), and taking the average value as the transmittance.
  • Silver fine particles 1 had an average primary particle size of 60 nm as observed with an electron microscope.
  • ⁇ Preparation Method of Silver Fine Particle Dispersion Solution 2> (Prepared with reference to JP 2005-530005) 4 g of silver fine particles 1, 30 g of toluene, and 0.2 g of BYK-410 (manufactured by Big Chemie Japan) are mixed, dispersed for 1.5 minutes with an ultrasonic disperser with an output of 180 W, and 15 g of pure water is added. The obtained emulsion was subjected to a dispersion treatment for 30 seconds with an ultrasonic disperser with an output of 180 W to prepare a silver fine particle dispersion solution 2.
  • PET substrate polyethylene terephthalate resin substrate
  • heat treatment is performed at 70 ° C. in the atmosphere for 30 seconds, and further heat treatment is performed at 70 ° C. for 30 minutes in an atmosphere containing formic acid vapor, thereby forming a network composed of silver fine particles
  • stacked was produced.
  • Example 1 The following adhesive layer coating solution 1 is applied on a PET base material on which a network structure containing silver fine particles prepared by the above-described method is laminated so that the thickness after drying is 5 ⁇ m, and is 5 at a temperature of 100 ° C. The layer was dried to form an adhesive layer.
  • ⁇ Adhesive layer coating solution 1> After dissolving 8 g of polyvinyl butyral resin (Sekisui Chemical Co., Ltd., ESREC BL-2) in 52 g of normal butanol, 40 g of a methanol dispersion of silica sol (silica sol 30% by weight, average particle size 15 nm) is added and stirred to form an adhesive layer coating. Liquid 1 was produced.
  • a hot laminator (manufactured by Taisei Laminator, Taisei First Laminator) is made to face a surface of a glass substrate having a thickness of 1 mm on which the adhesive layer of a PET substrate having a network structure containing silver fine particles and an adhesive layer is formed.
  • VAII-700 the film was heat-welded at 180 ° C. and left to cool to room temperature, and then the PET base material was peeled off to transfer the network structure containing silver fine particles and the adhesive layer onto the glass substrate.
  • the glass substrate on which the network structure containing silver fine particles and the adhesive layer are laminated is heated and baked for 30 minutes in a baking furnace (Advantech Toyo Co., Ltd., electric muffle furnace KM-280) heated to 500 ° C. A glass substrate on which a conductive film was laminated was produced.
  • a baking furnace Advanced Technology Toyo Co., Ltd., electric muffle furnace KM-280
  • a perhydropolysilazane solution (manufactured by AZ-Electronic Materials, trade name: Aquamica NP-110) was applied to the surface of the transparent conductive film laminated substrate using a spin coater.
  • the center line average roughness (Ra) was 0.3 ⁇ m, and the surface flatness was excellent as compared with the conventional transparent conductive film.
  • the surface resistance value was 5 ⁇ / ⁇ , and the total light transmittance was 81%.
  • As a heat resistance test it was heated at 300 ° C. for 1 hour as a heat resistance test, but had the same surface resistance value and total light transmittance as before heating.
  • Example 2 Similar to Example 1 described above, a transparent conductive film laminated substrate having a network structure composed of silver fine particles and laminated with an oxide film mainly composed of silicon oxide was prepared.
  • the surface of the transparent conductive film laminated substrate was polished using a commercially available glass etchant to produce a transparent conductive film laminated substrate with improved surface properties.
  • the center line average roughness (Ra) was 0.1 ⁇ m, and the surface flatness was improved.
  • the surface resistance value was 3 ⁇ / ⁇ , and the total light transmittance was 81%.
  • Comparative Example 1 The silver fine particle dispersion solution was applied and dried on a PET substrate by the method described above, heat treatment and chemical treatment were performed, and a network structure containing silver fine particles was laminated.
  • the surface resistance value was 6 ⁇ / ⁇ , and the total light transmittance was 86%.
  • the center line average roughness (Ra) measured with a surface roughness meter was 1.2 ⁇ m, and the surface was poor in flatness.
  • the PET film contracted, and at the same time it turned yellow and lost its function as a transparent conductive film.
  • the transparent conductive film and the transparent conductive film stack substrate according to the present invention have low resistance and high transmittance, excellent heat resistance and flatness, and the transparent conductive film and the transparent conductive film laminated substrate according to the present invention. Since the production method can be easily produced without using a special apparatus, it is suitable for a thin film solar cell or a transparent electrode for organic EL.

Abstract

Cette invention concerne un film conducteur transparent, qui est un film d'oxyde dont le composant primaire est un oxyde de silicium et qui encapsule une structure de type maillage constituée de microparticules de métal. L'invention concerne également un substrat sur lequel est appliqué un film conducteur transparent, ledit film étant appliqué sur un substrat de verre ou de céramique. Est également décrit un procédé de fabrication correspondant. Le substrat sur lequel le film conducteur transparent est appliqué possède un indice de transmission et une conductivité élevés, sa surface est lisse et il comprend une structure de type maillage faite de microparticules de métal caractérisées par une grande résistance à la chaleur et aux intempéries.
PCT/JP2010/050504 2009-01-19 2010-01-18 Film conducteur transparent encapsulant une structure de type maillage faite de microparticules de métal, substrat sur lequel ledit film est appliqué et procédé de fabrication WO2010082652A1 (fr)

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JP2009009136A JP5363125B2 (ja) 2009-01-19 2009-01-19 透明導電性膜積層基板とその製造方法

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* Cited by examiner, † Cited by third party
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EP3294048B1 (fr) * 2016-09-08 2020-12-02 Goodrich Corporation Appareil et procédés de revêtement de semi-conducteur optique électriquement conducteur

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JP2012185933A (ja) * 2011-03-03 2012-09-27 Panasonic Corp 透明導電膜付基材、及び、有機エレクトロルミネッセンス素子
JP6212556B2 (ja) * 2012-08-16 2017-10-11 シーマ ナノテック イスラエル リミテッド 透明な導電性コーティングを調製するためのエマルション
CN103677357B (zh) * 2012-09-06 2016-12-28 宸鸿科技(厦门)有限公司 用于触控面板的盖板结构及其制造方法与触控面板
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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10182191A (ja) * 1996-12-25 1998-07-07 Mitsubishi Materials Corp 透明導電膜およびその形成用組成物
JPH1135855A (ja) * 1997-07-14 1999-02-09 Sumitomo Osaka Cement Co Ltd 透明導電膜および表示装置
JP2002083518A (ja) * 1999-11-25 2002-03-22 Sumitomo Metal Mining Co Ltd 透明導電性基材とその製造方法並びにこの透明導電性基材が適用された表示装置、および透明導電層形成用塗液とその製造方法
JP2005048056A (ja) * 2003-07-28 2005-02-24 Sumitomo Metal Mining Co Ltd 低透過率透明導電膜形成用塗布液、低透過率透明導電膜、低透過率透明導電性基材及びこの基材が適用された表示装置
JP2005050668A (ja) * 2003-07-28 2005-02-24 Sumitomo Metal Mining Co Ltd 低透過率透明導電膜形成用塗布液、低透過率透明導電膜、低透過率透明導電性基材、及びこの基材が適用された表示装置
WO2005024853A1 (fr) * 2003-09-08 2005-03-17 Sumitomo Metal Mining Co., Ltd. Corps multicouche conducteur transparent, dispositif electroluminescent organique utilisant ce corps et procedes pour produire ceux-ci
JP2005209350A (ja) * 2004-01-20 2005-08-04 Sumitomo Metal Mining Co Ltd 透明導電膜及び透明導電膜の製造方法
JP2010012714A (ja) * 2008-07-04 2010-01-21 Toda Kogyo Corp 機能性薄膜の製造方法、機能性薄膜、機能性薄膜積層基材の製造方法及び機能性薄膜積層基材

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10182191A (ja) * 1996-12-25 1998-07-07 Mitsubishi Materials Corp 透明導電膜およびその形成用組成物
JPH1135855A (ja) * 1997-07-14 1999-02-09 Sumitomo Osaka Cement Co Ltd 透明導電膜および表示装置
JP2002083518A (ja) * 1999-11-25 2002-03-22 Sumitomo Metal Mining Co Ltd 透明導電性基材とその製造方法並びにこの透明導電性基材が適用された表示装置、および透明導電層形成用塗液とその製造方法
JP2005048056A (ja) * 2003-07-28 2005-02-24 Sumitomo Metal Mining Co Ltd 低透過率透明導電膜形成用塗布液、低透過率透明導電膜、低透過率透明導電性基材及びこの基材が適用された表示装置
JP2005050668A (ja) * 2003-07-28 2005-02-24 Sumitomo Metal Mining Co Ltd 低透過率透明導電膜形成用塗布液、低透過率透明導電膜、低透過率透明導電性基材、及びこの基材が適用された表示装置
WO2005024853A1 (fr) * 2003-09-08 2005-03-17 Sumitomo Metal Mining Co., Ltd. Corps multicouche conducteur transparent, dispositif electroluminescent organique utilisant ce corps et procedes pour produire ceux-ci
JP2005209350A (ja) * 2004-01-20 2005-08-04 Sumitomo Metal Mining Co Ltd 透明導電膜及び透明導電膜の製造方法
JP2010012714A (ja) * 2008-07-04 2010-01-21 Toda Kogyo Corp 機能性薄膜の製造方法、機能性薄膜、機能性薄膜積層基材の製造方法及び機能性薄膜積層基材

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3294048B1 (fr) * 2016-09-08 2020-12-02 Goodrich Corporation Appareil et procédés de revêtement de semi-conducteur optique électriquement conducteur
US10955747B2 (en) 2016-09-08 2021-03-23 Goodrich Corporation Apparatus and methods of electrically conductive optical semiconductor coating
US11852977B2 (en) 2016-09-08 2023-12-26 Danbury Mission Technologies, Llc Apparatus and methods of electrically conductive optical semiconductor coating

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