WO2010073891A1 - Dispositif de fixation d'un acf et procédé de fabrication d'un dispositif d'affichage - Google Patents

Dispositif de fixation d'un acf et procédé de fabrication d'un dispositif d'affichage Download PDF

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Publication number
WO2010073891A1
WO2010073891A1 PCT/JP2009/070365 JP2009070365W WO2010073891A1 WO 2010073891 A1 WO2010073891 A1 WO 2010073891A1 JP 2009070365 W JP2009070365 W JP 2009070365W WO 2010073891 A1 WO2010073891 A1 WO 2010073891A1
Authority
WO
WIPO (PCT)
Prior art keywords
acf
tape
separator
heating
unnecessary
Prior art date
Application number
PCT/JP2009/070365
Other languages
English (en)
Japanese (ja)
Inventor
長谷川雄一
Original Assignee
Ｎｅｃ液晶テクノロジー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｎｅｃ液晶テクノロジー株式会社 filed Critical Ｎｅｃ液晶テクノロジー株式会社
Priority to KR1020117009487A priority Critical patent/KR101264489B1/ko
Priority to CN200980148197.0A priority patent/CN102227760B/zh
Publication of WO2010073891A1 publication Critical patent/WO2010073891A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

La présente invention concerne un dispositif de fixation d'un ACF capable de résoudre le problème survenant lorsqu'un mandrin de serrage se déplace, une région d'ACF inutile y adhérant ; l'invention concerne également un procédé de fabrication d'un dispositif d'affichage. Ledit dispositif de fixation d'ACF comprend : un ruban d'ACF composé d'un ACF fixé à un séparateur ; un mécanisme qui déplace le ruban d'ACF ; un mécanisme d'alignement qui commande la position du mouvement du ruban d'ACF ; un mécanisme qui coupe une partie du ruban d'ACF ; un mécanisme de mandrin de serrage qui serre le ruban d'ACF ; un socle de panneau sur lequel peut être positionné un panneau d'affichage ; et une tête de chauffage/pressage qui est capable d'établir le contact avec le séparateur du ruban d'ACF et qui chauffe le ruban d'ACF étant serré par la tête de chauffage/pressage et le panneau d'affichage positionné sur ledit socle pour transférer l'ACF vers le panneau d'affichage. Par ailleurs, ce dispositif de fixation d'ACF est doté d'un moyen qui modifie la propriété adhésive d'une partie de l'ACF avant que le ruban d'ACF soit serré par le mécanisme de serrage.
PCT/JP2009/070365 2008-12-26 2009-11-27 Dispositif de fixation d'un acf et procédé de fabrication d'un dispositif d'affichage WO2010073891A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020117009487A KR101264489B1 (ko) 2008-12-26 2009-11-27 Ａｃｆ 첩부 장치 및 표시 장치의 제조 방법
CN200980148197.0A CN102227760B (zh) 2008-12-26 2009-11-27 Acf粘贴装置及显示装置的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008331986A JP5266582B2 (ja) 2008-12-26 2008-12-26 Ａｃｆ貼付装置及び表示装置の製造方法
JP2008-331986 2008-12-26

Publications (1)

Publication Number Publication Date
WO2010073891A1 true WO2010073891A1 (fr) 2010-07-01

Family

ID=42287509

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2009/070365 WO2010073891A1 (fr) 2008-12-26 2009-11-27 Dispositif de fixation d'un acf et procédé de fabrication d'un dispositif d'affichage

Country Status (5)

Country Link
JP (1) JP5266582B2 (fr)
KR (1) KR101264489B1 (fr)
CN (1) CN102227760B (fr)
TW (1) TWI419244B (fr)
WO (1) WO2010073891A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102749727B (zh) * 2011-04-18 2014-12-03 京东方科技集团股份有限公司 一种异方性导电胶膜的贴附方法
JP5838305B2 (ja) * 2012-05-31 2016-01-06 パナソニックＩｐマネジメント株式会社 Ａｃｆ貼着装置及びａｃｆ貼着方法
TWI508787B (zh) * 2013-12-31 2015-11-21 Shuz Tung Machinery Ind Co Ltd 沾黏機構
CN104914595B (zh) * 2014-03-10 2018-01-09 旭东机械工业股份有限公司 基板压制机构
CN104516130B (zh) * 2014-12-18 2017-06-20 福建华冠光电有限公司 Oec设备acf多段式贴付‑分段式acf压头及其使用方法
KR101663006B1 (ko) * 2015-02-17 2016-10-06 주식회사 제이스텍 Acf 본딩 장치의 acf 리젝트 장치
KR20180041186A (ko) 2015-12-23 2018-04-23 선전 로욜 테크놀로지스 컴퍼니 리미티드 접합 장치 및 가요성 디스플레이 모듈의 접합 방법
CN105751270A (zh) * 2016-03-25 2016-07-13 深圳市华星光电技术有限公司 Acf贴附设备及其切割装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07114964A (ja) * 1993-10-20 1995-05-02 Toshiba Corp 異方性導電膜の接着装置
JPH08107268A (ja) * 1994-10-06 1996-04-23 Matsushita Electric Ind Co Ltd 異方性導電テープの貼着装置及び異方性導電テープの貼着方法
JPH10290064A (ja) * 1997-04-14 1998-10-27 Sony Corp 異方性導電膜の貼付装置
JP2002280418A (ja) * 2001-03-15 2002-09-27 Asuriito Fa Kk 異方性導電体貼り付け方法及び異方性導電体貼り付け装置
JP2003051517A (ja) * 2001-08-02 2003-02-21 Shibaura Mechatronics Corp テープ部材貼着装置
JP2008150144A (ja) * 2006-12-15 2008-07-03 Shibaura Mechatronics Corp 粘着性テープの貼着装置及び貼着方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3704502B2 (ja) * 2002-01-15 2005-10-12 松下電器産業株式会社 粘着シート貼付装置、粘着シート貼付方法、部品実装機、及びディスププレイパネルの製造方法。
JP3852378B2 (ja) * 2002-07-09 2006-11-29 株式会社日立ハイテクノロジーズ Ａｃｆ供給装置及びａｃｆ供給方法
JP4346535B2 (ja) * 2004-09-30 2009-10-21 芝浦メカトロニクス株式会社 接着膜テープ送り機構
JP4819602B2 (ja) * 2006-07-05 2011-11-24 パナソニック株式会社 Ａｃｆ貼付装置及びａｃｆ貼付方法
CN101315500B (zh) * 2007-05-29 2010-08-18 纳瑞精密设备有限公司 用于连续地供给和收集各向异性导电薄膜的装置以及具有该装置的粘接设备
CN201166757Y (zh) * 2008-03-13 2008-12-17 北京京东方光电科技有限公司 各向异性导电胶剪切和剥离装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07114964A (ja) * 1993-10-20 1995-05-02 Toshiba Corp 異方性導電膜の接着装置
JPH08107268A (ja) * 1994-10-06 1996-04-23 Matsushita Electric Ind Co Ltd 異方性導電テープの貼着装置及び異方性導電テープの貼着方法
JPH10290064A (ja) * 1997-04-14 1998-10-27 Sony Corp 異方性導電膜の貼付装置
JP2002280418A (ja) * 2001-03-15 2002-09-27 Asuriito Fa Kk 異方性導電体貼り付け方法及び異方性導電体貼り付け装置
JP2003051517A (ja) * 2001-08-02 2003-02-21 Shibaura Mechatronics Corp テープ部材貼着装置
JP2008150144A (ja) * 2006-12-15 2008-07-03 Shibaura Mechatronics Corp 粘着性テープの貼着装置及び貼着方法

Also Published As

Publication number Publication date
TWI419244B (zh) 2013-12-11
JP2010152205A (ja) 2010-07-08
JP5266582B2 (ja) 2013-08-21
KR20110074568A (ko) 2011-06-30
KR101264489B1 (ko) 2013-05-14
TW201025471A (en) 2010-07-01
CN102227760B (zh) 2014-11-05
CN102227760A (zh) 2011-10-26

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