WO2010073891A1

WO2010073891A1 - Acf attachment device and display device manufacturing method

Info

Publication number: WO2010073891A1
Application number: PCT/JP2009/070365
Authority: WO
Inventors: 長谷川雄一
Original assignee: Ｎｅｃ液晶テクノロジー株式会社
Priority date: 2008-12-26
Filing date: 2009-11-27
Publication date: 2010-07-01
Also published as: CN102227760B; CN102227760A; JP2010152205A; KR20110074568A; TW201025471A; JP5266582B2; TWI419244B; KR101264489B1

Abstract

Disclosed is an ACF attachment device capable of solving the problem occurring when a clamping chuck moves with an unnecessary ACF region adhering thereto; further disclosed is a display device manufacturing method. This ACF attachment device comprises: an ACF tape comprised of an ACF attached to a separator; a mechanism which moves the ACF tape; an alignment mechanism which controls the movement position of the ACF tape; a mechanism which cuts a portion of the ACF tape; a clamping chuck mechanism which clamps the ACF tape; a panel pedestal on which a display panel can be placed; and a heating/pressing head which is capable of making contact with the separator of the ACF tape; and heats the ACF tape being clamped by the heating/pressing head and the display panel placed on the panel pedestal to transfer the ACF to the display panel. In addition, this ACF attachment device is provided with a means which changes the adhesive property of a portion of the ACF before the ACF tape is clamped by the clamping mechanism.

Description

ACF sticking device and display device manufacturing method

The present invention relates to a device for attaching an anisotropic conductive film tape (hereinafter abbreviated as an ACF (Anisotropic Conductive Film) tape) to a display panel, and a method of manufacturing a display device using the device.

As shown in FIG. 9, the conventional ACF sticking apparatus includes an ACF supply reel 101, a separator collection reel 104, a half-cut mechanism 105, a peeling roller 107, a clamping chuck 109, a liquid crystal panel cradle 113, a heating unit / It is comprised by the pressurization head 114.
The pasting operation using this conventional ACF sticking apparatus will be described with reference to FIG.
First, in “operation 1”, two cuts are made by the cutter 106 of the half-cut mechanism 105 at the boundary between the unnecessary ACF portion 197 that is not required to be attached to the liquid crystal panel and the panel attachment ACF portion 198 that is attached to the liquid crystal panel. Put in.
In “Operation 2”, the tape cradle 120 provided on the separator 103 side is lowered with respect to the position of the ACF 102 where the cut is made, and comes into contact with the separator 103. Next, the peeling roller 107 is raised, the adhesive tape 108 provided between the adhesive tape supply reel 121 and the adhesive tape recovery reel 122 is brought into contact with the ACF 102, and the peeling roller 107 is rotated so that the adhesive force of the adhesive tape 108 is increased. Thus, only the cut unnecessary ACF portion 197 is removed (separated) from the separator 103.
In “operation 3”, the clamping chuck 109 moves to a position where the unnecessary ACF portion 197 is removed. The clamping chuck 109 is composed of an upper chuck 110 and a lower chuck 111, and sandwiches and holds the position where the unnecessary ACF portion 197 is removed by the vertical movement of the upper chuck 110 and the lower chuck 111. Then, in a state where the position where the unnecessary ACF portion 197 is removed is held, the holding chuck 109 arbitrarily moves to the attachment position of the liquid crystal panel 112 on the liquid crystal panel support 113.
In “Operation 4”, after the panel pasting ACF portion 198 has moved to the pasting position of the liquid crystal panel 112, the heating / pressurizing head 114 provided on the upper side with respect to the liquid crystal panel 112 is lowered to the panel pasting ACF portion 198. When heat is conducted by contact, thermocompression bonding to the liquid crystal panel 112 is performed. After thermocompression bonding, the heating / pressure head 114 is raised. The separator 103 is collected by the separator collection reel 104.
Regarding such a conventional configuration and operation, Japanese Patent Laid-Open No. 6-6019 (Patent Document 1) similarly describes a technique for removing an unnecessary ACF portion with an adhesive tape.
Japanese Patent Application Laid-Open No. 9-6251 (Patent Document 2) discloses a structure in which ACF is led out by a chuck to prevent the ACF from sticking to a chuck claw (lower).
According to Patent Document 2, when the ACF part is held by a chuck, the ACF is easy to stick to the chuck claw (bottom), so that an ACF pickup error occurs, as shown in FIG. It is stated that the chuck claw (lower) and the ACF can be reliably separated by providing gas blowing means on the chuck claw (lower) and blowing gas to the stuck ACF with the gas blowing means of the chuck (lower). Has been.

However, the conventional ACF sticking device has the following problems.
1) The conventional ACF sticking apparatus needs to remove the unnecessary adhesive ACF portion 197 in advance when the ACF tape 199 is held by the holding chuck 109, and the adhesive tape 108 is used as the unnecessary ACF portion 197. Although they are brought into contact with each other and peeled and removed by the adhesive force of the adhesive tape 108, they cannot be completely removed, and a part of the unnecessary ACF portion 197 remains on the ACF tape 199. In this state, when the clamping chuck 109 performs the clamping operation, the unnecessary ACF portion 197 remaining on the ACF tape 199 adheres to the lower chuck 111.
9, when the holding chuck 109 is opened while the lower chuck 111 is attached to a part of the unnecessary ACF portion 197, the ACF tape 199 is pulled, and the driving of the holding chuck 109 is performed. The shaft is overloaded, the drive shaft is overloaded, and the device is brought to an emergency stop. As a result, the operating rate of the equipment is reduced.
2) As a second drawback of the conventional ACF sticking device, the unnecessary ACF portion 197 remaining on the ACF tape 199 adheres to the lower chuck 111 in the operation of 1), and the unnecessary ACF portion 197 is attached to the lower chuck 111. When the clamping chuck 109 is opened while being attached to a part, the ACF tape 199 is pulled, and the panel pasting ACF portion 198 that should be left on the separator 103 is also pulled from the clamping chuck 109 and peeled off. The liquid crystal panel 112 is not attached to the regular position, and as a result, a defective product of ACF sticking occurs. Further, when the peeled panel sticking ACF portion 198 sticks to the clamping chuck 109 and its peripheral devices, the problem described in 1) occurs.
3) As a third drawback of the conventional ACF sticking device, the unnecessary ACF portion 197 remaining on the ACF tape 199 adheres to the lower chuck 111 in the operation of 1), and the unnecessary ACF portion 197 is attached to the lower chuck 111. When the clamping chuck 109 is released while being attached to a part, the ACF tape 199 is pulled, and the panel pasting ACF portion 198 that should remain on the separator 103 is also peeled off by the tension pulled from the clamping chuck 109. End up.
When the ACF scraps of the peeled panel sticking ACF portion 198 stick to the device of the apparatus, the problem as described in the above 2) occurs. However, when sticking to the display area portion of the liquid crystal panel 112, When the liquid crystal display device is turned on and displayed through the above steps, the portion where the ACF waste is attached cannot be displayed normally, resulting in a product defect (display defect). The liquid crystal display device having the display defect can be made into a non-defective product by disassembling and removing the ACF waste adhering to the liquid crystal panel. However, it affects the man-hour and yield required for the repair work. There's a problem.
4) As a disadvantage of Patent Document 2 (Japanese Patent Laid-Open No. 9-6251), when the ACF tape is led out by the chuck, it is necessary to sufficiently bite the ACF tape so that the ACF tape is pulled out without slipping. In the state where the ACF tape is sufficiently bitten by the chuck, it may be difficult to separate due to the adhesive force of the ACF part, and the problem that it is difficult to peel off the ACF part from the chuck by only gas blowing cannot be avoided. In addition, if the amount of chucking is reduced to such an extent that the ACF part can be peeled off from the chuck by gas blowing, the ACF tape becomes slippery this time, and it is necessary to find the optimal amount of biting every time. Therefore, it is impossible to avoid the problem that it is necessary to adjust each variation. Therefore, in the ACF adhering apparatus and the adhering method of Patent Document 2, the amount of biting that achieves both of making the ACF tape difficult to slip and making it easy to peel off is determined each time with respect to variations in the adhesive strength of the ACF tape. It needs to be adjusted.
An object of the present invention is to provide an ACF sticking device and a method for manufacturing a display device that can solve the above-mentioned problems.

According to one aspect of the present invention, an ACF tape having an ACF attached to a separator, a mechanism for moving the ACF tape, an alignment mechanism for controlling a moving position of the ACF tape, and a part of the ACF of the ACF tape A mechanism for cutting the ACF tape, a clamping chuck mechanism for clamping the ACF tape, a panel cradle on which a display panel can be placed, and a heating / pressurizing head capable of contacting the separator of the ACF tape. In the ACF adhering device for transferring the ACF to the display panel by sandwiching and heating the ACF tape between the display panel placed on the panel cradle and the heating / pressurizing head, the ACF Before the tape is clamped by the clamping chuck mechanism, an ACF sticking device including means for changing the adhesiveness of a part of the ACF is obtained.
The ACF adhering device has a tape adhering mechanism for adhering the tape to the ACF at the nipping portion before the ACF tape is nipped by the nipping chuck mechanism instead of means for changing the adhesiveness of a part of the ACF. You may make it have.
According to another aspect of the present invention, in a method for manufacturing a display device in which ACF is attached to a display panel, a step of cutting a part of the ACF of an ACF tape in which ACF is attached to a separator, and the ACF tape A step of holding and moving the ACF tape, and heating and pressurizing the ACF tape to affix the ACF to the display panel. And a step of changing the adhesiveness of a part of the ACF so that the ACF of the part to be sandwiched does not stick to the sandwiching chuck.
Further, in the manufacturing method of the display device, instead of the step of changing the adhesiveness of a part of the ACF, before the ACF tape is clamped by the clamping chuck, the tape is attached to the surface of the ACF at the clamping portion. You may do it.

According to the manufacturing method of the ACF sticking device and the display device of the present invention, an increase in the process stop time due to trouble such as device stop (abnormal stop) caused by moving with the unnecessary ACF part attached to the clamping chuck. , ACF sticking failure and yield loss due to ACF waste can be prevented, and the cost of auxiliary materials (adhesive tape cost) and man-hours can be reduced.
The reason is that the unnecessary ACF part is pre-heated and heat-cured to reduce the adhesiveness, or tape is attached to the unnecessary ACF part so that it is not in direct contact with the clamping chuck, so that it is not necessary for the subsequent clamping chuck. This is because even when the ACF part is sandwiched, the unnecessary ACF part does not stick to the sandwiching chuck, and it is not always necessary to remove the unnecessary ACF part using an adhesive tape.
Moreover, according to the manufacturing method of the ACF sticking device and the display device of the present invention, ACF sticking with high positional accuracy and quality can be performed on the liquid crystal panel.
The reason is that the unnecessary ACF part is preheated, and if necessary, the panel-adhered ACF part adjacent to the unnecessary ACF part is cooled, so that the unnecessary ACF part and the panel-attached ACF part can be easily separated and separated from the boundary surface. This is because the end face shape of the panel-attached ACF portion can be cleaned.

FIG. 1 is a cross-sectional view schematically showing a configuration of an ACF sticking apparatus and an ACF sticking operation according to the first embodiment of the present invention.
FIG. 2 is a perspective view showing the configuration of the liquid crystal display device according to the first embodiment of the present invention.
FIG. 3 is a cross-sectional view schematically showing the configuration of the ACF sticking apparatus and the ACF sticking operation according to the second embodiment of the present invention.
FIG. 4 is a cross-sectional view schematically showing the configuration of the ACF sticking apparatus and the ACF sticking operation according to the third embodiment of the present invention.
FIG. 5 is a cross-sectional view schematically showing the configuration of the ACF sticking apparatus and the ACF sticking operation according to the fourth embodiment of the present invention.
FIG. 6 is a cross-sectional view schematically showing the configuration of the ACF sticking apparatus and the ACF sticking operation according to the fifth embodiment of the present invention.
FIG. 7 is a cross-sectional view schematically showing the configuration of the ACF sticking device and the ACF sticking operation according to the sixth embodiment of the present invention.
FIG. 8 is a cross-sectional view schematically showing the configuration of the ACF sticking device and the ACF sticking operation according to the seventh embodiment of the present invention.
FIG. 9 is a cross-sectional view schematically showing the configuration of the conventional ACF sticking apparatus and the ACF sticking operation.
FIG. 10 is a side view of a chuck unit of an ACF adhering apparatus of a known example (Japanese Patent Laid-Open No. 9-6251).

As shown in the background art, when positioning of the ACF is performed, the ACF having adhesiveness is cut with a cutter to remove unnecessary ACF sites that are not attached to the display device. Then, the unnecessary ACF part is not completely removed, and the unnecessary ACF part sticks to the clamping chuck, and various problems occur.
Therefore, in the present invention, measures are taken to prevent the unnecessary ACF site from sticking to the chuck to solve the above problem.
For example, the unnecessary ACF portion that is not attached to the display device is preheated and cured before being sandwiched by the chuck to reduce or eliminate the adhesiveness of the unnecessary ACF portion. This pre-processing eliminates the need to remove unnecessary ACF sites that are not attached to the display device as in the prior art. A cooling mechanism is provided around the preheating mechanism for heating the unnecessary ACF region. Thereby, it is suppressed that ACF other than an unnecessary ACF site | part is heated and hardened.
As another method, a tape is attached before the unnecessary ACF portion that is not attached to the display device is held by the chuck, so that the unnecessary ACF portion and the holding chuck are not in direct contact with each other. As a result, unnecessary ACF sites do not stick to the clamping chuck, and there is no need to remove unnecessary ACF sites that are not pasted to the display device as in the prior art. At that time, the mechanism for attaching the tape and the half-cut mechanism are combined and integrated, and the mechanism for attaching the tape is provided in the clamping chuck to improve work efficiency.

In order to describe the above-described embodiment of the present invention in more detail, a first example of the present invention will be described with reference to FIGS.
As shown in FIG. 1, the ACF sticking apparatus of the present embodiment includes at least an ACF supply reel 1, a separator collection reel 4, a half-cut mechanism 5, a preheating mechanism 65, a sandwiching chuck 66, a heating / heating unit. A pressure head 60 and a liquid crystal panel cradle 62 are included. In addition, the ACF tape 99 is usually constituted by a two-layer structure of a cover film called ACF 2 and a separator 3.
Hereinafter, the operation of the ACF sticking apparatus of the embodiment will be described.
From “Operation 1”, first, the ACF tape 99 to which thermosetting property is imparted and in which the ACF 2 and the separator 3 are integrated is half-cut by the cutter 6 of the half-cut mechanism 5.
Half-cutting is carried out by bringing the cutter 6 into contact with the ACF 2 side, and the cutting amount (depth) is set so that at least the separator 3 is not cut. The separator 3 is held by the ACF supply reel 1 and the separator collection reel 4 and is tensioned. Therefore, the depth of the half cut is preferably set such that the ACF 2 is cut but the separator 3 is not damaged.
The ACF cut position is a boundary between an ACF site (hereinafter referred to as a panel pasted ACF site 98) to be pasted on the liquid crystal panel and a site (hereinafter referred to as an unnecessary ACF site 97) that is not pasted.
Next, before the “operation 2” is performed, the following processing (not shown) is performed.
The ACF tape 99 held by the ACF supply reel 1 and the separator collection reel 4 moves to the preheating processing position by rotating both the reels. The stop position is a place where the unnecessary ACF portion 97 and the preheating mechanism 65 coincide.
The alignment between the unnecessary ACF portion 97 and the pre-heating mechanism 65 is controlled by a stepping motor or the like even with a known optical alignment method using an optical camera, for example. A mechanical alignment method may be used, and a general alignment method may be employed.
From the “operation 2”, the unnecessary ACF portion 97 of the ACF tape 99 that has been half-cut in the “operation 1” is heated by the preheating mechanism 65.
The purpose is to reduce the adhesiveness (tackiness) of the ACF, and the purpose can be achieved by setting the temperature and time for heating the ACF. For example, in an ACF made of an acrylic thermosetting resin material generally used for a liquid crystal display device, the ACF material is cured by heating at 150 ° C. for about 30 seconds, and the adhesiveness of the ACF is significantly reduced by the curing. .
In addition, since hardening here aims at reducing adhesiveness, hardening to ensure an electrical property and reliability like the part affixed on a display panel etc. is not necessarily required. Therefore, as described in “Operation 3”, the heating may be performed to such an extent that the unnecessary ACF portion 97 that is in contact with and held between the lower chuck 68 can be easily separated from the lower chuck 68. Therefore, the heating temperature is lower and the time can be set shorter than the heating of the part to be attached to the display panel or the like. The heating may be a contact method using a heating body or the like, or a non-contact method such as hot blow. In this embodiment, the case of hot blow is illustrated.
In heating by the contact method, it is preferable to preheat the unnecessary ACF portion 97 by bringing it into contact with the separator 3 side of the ACF tape 99. The reason is that the heating body is brought into contact with the unnecessary ACF portion 97 so that the unnecessary ACF portion 97 does not adhere to the heating body. Further, the contact-type heating element may be a constant-temperature heater that is always maintained at a constant temperature and heated, or may be a pulse-type heater that is usually heated at a normal temperature.
From “Operation 3”, the ACF tape 99 at the unnecessary ACF portion 97 that has been cured by heating and has reduced adhesiveness is sandwiched and sandwiched by the sandwiching chuck 66. The clamping chuck 66 includes an upper chuck 67 and a lower chuck 68, and the unnecessary ACF portion 97 is clamped by narrowing the gap between the chucks. The structure of the upper chuck 67 and the lower chuck 68 of the clamping chuck 66 is more accurate than making the flat shape by forming an uneven shape on the unnecessary ACF portion 97 and the separator 3 to which the tape 42 to be sandwiched is attached. It can be clamped well.
The clamping chuck 66 that sandwiches the ACF tape 99 of the unnecessary ACF portion 97 moves to a position where the liquid crystal panel 61 and the panel pasting ACF portion 98 can come into contact (pasting position) while maintaining the sandwiched state. At this time, the ACF supply reel 1 feeds out the ACF tape 99, and the separator collection reel 4 performs a synchronized operation so as to pull it in, and pulls out the ACF tape 99.
In the present embodiment, an example is shown in which the unnecessary ACF part 97 and the part range in which the adhesiveness is reduced by preheating are matched, and the entire range of the unnecessary ACF part 97 is held by the holding chuck 66. However, as in this embodiment, it is not always necessary to preheat the entire range of the unnecessary ACF site 97, and it is not necessary to sandwich the entire range of the preheated portion.
In other words, when the ACF tape 99 is pulled out when the clamping chuck 66 and the unnecessary ACF portion 97 which has been cured by heating and the adhesiveness has decreased, the tape and the clamping chuck 66 slip, the clamping chuck 66 and the ACF tape 99 It is only necessary to cure and hold an amount whose relative position does not change.
By the above operation, the liquid crystal panel 61 and the panel pasting ACF portion 98 of the ACF tape 99 are aligned with the pasting position, but there is a clearance (interval).
In “Operation 4”, the heating / pressurizing head 60 installed on the upper part of the liquid crystal panel 61 is lowered and comes into contact with the panel application ACF portion 98 of the ACF tape 99. The pasted ACF portion 98 is sandwiched between the heating / pressurizing head 60 and the liquid crystal panel 61.
The panel-attached ACF portion 98 that is sandwiched is cured by the heat supplied from the heating / pressurizing head 60 through the separator 3. The curing here may be carried out to such an extent that the panel attachment ACF portion 98 remains on the liquid crystal display panel side and does not remain on the separator side when the panel attachment ACF portion 98 is peeled off from the separator. That is, it is preferable that the panel pasting ACF part 98 remains partially in the separator, or the panel pasting ACF part 98 is not divided in the ACF resin layer and left in the separator.
Furthermore, since the circuit components such as TCP (Tape Carrier Package) are disposed after the separator is peeled off, the panel-attached ACF portion 98 needs to be set to a heating amount enough to maintain adhesiveness even after heating. . The heating time and heating temperature may be heated at 60 ° C. for about 5 seconds for an ACF made of an acrylic thermosetting resin material generally used for a liquid crystal display device, for example.
In the explanation of the operation here, the example in which the heating / pressurizing head 60 is lowered and the ACF tape 99 is sandwiched between the heating / pressurizing head 60 and the liquid crystal panel 61 is shown. However, the liquid crystal that holds the liquid crystal panel 61 is shown. The panel cradle 62 may be raised, or the operation of lowering the heating / pressurizing head 60 and raising the liquid crystal panel cradle 62 may be used in combination. Here, the panel pasting ACF part 98 and the liquid crystal panel 61 are in contact with each other, and the heat of the heating / pressurizing head 60 may be transmitted to the panel pasting ACF part 98. The operation is not limited.
From “Operation 5”, the TCP 80 is mounted on the panel pasting ACF portion 98 pasted on the liquid crystal panel 61. Then, the heating / pressurizing head 70 is lowered from above the TCP 80 and brought into contact with the TCP 80 to heat and cure the ACF.
In this curing, it is necessary to cure to the extent that the electrical characteristics and reliability of the liquid crystal display device are ensured. The heating time and heating temperature may be heated at 180 ° C. for about 30 seconds for an ACF made of an acrylic thermosetting resin material generally used for a liquid crystal display device, for example. Although an example in which the TCP 80 is attached to the liquid crystal panel 61 is shown here, the TCP 80 is not necessarily required, and may be a COG (Chip On Glass), an FPC (Flexible Printed Circuit), or the like.
As shown in FIG. 2, the liquid crystal panel to which the TCP 80 is connected becomes a liquid crystal display device 90 by disposing a circuit board 82, a backlight 84, a circuit board protection cover 86, a chassis (shield front) 88, and the like. .
Hereinafter, the effect of the present embodiment will be described.
Conventionally, the unnecessary ACF part is stuck to the clamping chuck due to a part of the remaining adhesive, and the ACF sticking device is stopped or the device operation rate is lowered by trying to move in that state. . To solve this problem, the present embodiment shows an example in which the unnecessary ACF portion 97 and the portion range in which the adhesiveness is reduced by preheating are matched, and the entire range of the unnecessary ACF portion 97 is held by the holding chuck 66. It was. By doing so, the unnecessary ACF portion 97 does not adhere to the lower chuck 68 of the clamping chuck 66. Therefore, the trouble of the apparatus stop (abnormal stop) due to the trouble such as the entanglement of the ACF tape 99 caused by the movement with the unnecessary ACF portion 97 attached to the clamping chuck 66 does not occur. Note that the entire range of the unnecessary ACF site 97 is not preheated, and further, it is not necessary to sandwich the preheated entire range. Here, the sandwiching chuck 66 and the unnecessary ACF portion 97 which has been cured by heating and has reduced adhesiveness abuts, and the relative position between the sandwiching chuck 66 and the ACF tape 99 does not change due to the sliding of the ACF tape 99 or the like. What is necessary is just to pinch.
Conventionally, an unnecessary ACF portion is stuck to the sandwiching chuck, and the ACF tape is pulled by moving the sandwiching chuck in that state, and the ACF portion to be attached to the panel is torn off, resulting in an ACF sticking failure. In order to solve this problem, the occurrence of an abnormality in the apparatus is prevented, so that the clamping chuck 66 and the ACF tape 99 which are secondary disasters at the time of the apparatus abnormality are entangled, and the clamping chuck 66 moves in this state, so that the ACF tape 99 is moved. As a result, it is possible to prevent the occurrence of an ACF sticking position defect and an ACF sticking length defect, which are caused by tearing of the ACF tape 99 as a result.
Conventionally, when the ACF tape is clamped by the clamping chuck, it is necessary to remove the unnecessary ACF site in advance, and as a method for removing the ACF tape, an adhesive tape having high adhesiveness is used as a secondary material and the adhesive force is removed. In order to solve this problem, the unnecessary ACF portion 97 of this embodiment is preheated to reduce the adhesiveness, so there is no need to remove it using an adhesive tape, resulting in a secondary material cost (adhesive tape cost). Can be reduced.
Conventionally, the boundary surface between the unnecessary ACF part of the ACF tape and the panel-attached ACF part is cut with a cutter, and then the unnecessary ACF part is removed by the adhesive force of the adhesive tape. The end face shape of this was torn off a part of the cut portion, resulting in a rough and rough shape, and when pasted on the liquid crystal panel, an ACF sticking failure occurred because a part of the liquid crystal panel terminal part could not be covered. For this problem, by preheating the unnecessary ACF site, the unnecessary ACF site and the panel application site can be easily separated, and the end surface shape of the panel application ACF site divided from the boundary surface can be made smooth. Therefore, it is possible to eliminate the problem of ACF sticking failure that has conventionally occurred and improve the sticking accuracy, shape, and quality of the ACF attached to the liquid crystal panel.

Next, a second embodiment of the present invention will be described with reference to FIG.
The basic configuration of the ACF sticking apparatus of the present embodiment is the same as that of the first embodiment, but in order to suppress the hardening of the panel sticking ACF portion 98 adjacent to the unnecessary ACF portion 97 as shown in “Operation 2” in FIG. Further, the point that the cooling mechanism 69 is installed is different from the first embodiment. Below, a difference is demonstrated.
In the present embodiment, the cooling mechanism 69 is lowered before the pre-heating mechanism 65 is turned on so that the separator 3 in the panel pasting ACF portion 98 and the cooling mechanism 69 come into contact with each other. By carrying out like this, the heating of the panel sticking ACF site | part 98 can be suppressed.
After the unnecessary ACF portion 97 is cured, the preheating mechanism 65 is turned off to stop the blowing of warm air, and the cooling mechanism 69 is further raised. By such a series of operations, the unnecessary ACF part 97 is cured, and the panel pasting ACF part 98 is suppressed from being cured.
Thus, according to the present embodiment, when the cooling mechanism 69 is installed on the panel pasting ACF part 98 adjacent to the unnecessary ACF part 97 and the unnecessary ACF part 97 is thermally cured, the panel pasting ACF part 98 due to the cooling action is provided. In addition to the effects of the first embodiment, there is an effect that the unnecessary ACF portion 97 can be reliably cured while maintaining the adhesiveness (quality) to the panel pasting ACF portion 98.
In this embodiment, the hot blow type is shown as an example of the non-contact type preheating mechanism. However, similarly to the first embodiment, a laser may be used, and various other heating means methods / systems may be used. You may use.

Next, a third embodiment of the present invention will be described with reference to FIG.
In the present embodiment, as shown in “Operation 2” in FIG. 4, the cooling mechanism 69 is installed in order to suppress the hardening of the panel pasting ACF portion 98 adjacent to the unnecessary ACF portion 97. Similarly, the preheating mechanism 64 is changed from a non-contact type hot blow to a contact type heating body, and the unnecessary ACF portion 97 is recovered before the ACF tape 99 is clamped by the clamping chuck 66. The difference is that the mechanism 57 is removed.
Below, a difference is demonstrated.
As shown in “Operation 2” in FIG. 4, after the unnecessary ACF portion 97 of the ACF tape 99 and the preheating mechanism 64 are matched, the preheating mechanism 64 moves upward toward the unnecessary ACF portion 97. At this time, the tape 55 located between the preheating mechanism 64 and the ACF tape 99 rises while being supported by the preheating mechanism 64 in conjunction with the tape supply mechanism 56 and the tape recovery mechanism 57. At this time, since tension is applied to the tape 55, it is desirable to adjust the tension by the tape collecting mechanism 57 and the tape supply mechanism 56 so that the tape 55 is not cut.
Then, the preheating mechanism 64 and the unnecessary ACF portion 97 come into contact with each other with the tape 55 interposed therebetween. Due to the contact, the heat of the preheating mechanism 64 is conducted to the unnecessary ACF portion 97. At that time, in order to ensure the conduction of heat, it is preferable to arrange the tape receiving table 58 on the separator 3 side so as to face the preheating mechanism 64 and to bring it into contact with the unnecessary ACF portion 97.
The heating condition at this time is preferably set to a temperature and a time at which the ACF in the unnecessary ACF portion 97 is peeled off from the separator 3 and transferred to the tape 55. The heating time and heating temperature may be heated at 150 ° C. for about 30 seconds, for example, in an ACF made of an acrylic thermosetting resin material generally used for a liquid crystal display device.
Furthermore, in order for ACF 2 in the unnecessary ACF portion 97 to be peeled off from the separator 3 and transferred to the tape 55, the adhesive force with the pre-heated ACF 2 may be set so that the tape 55 is higher than the separator 3. By setting it high, it is possible to avoid the ACF 2 in the unnecessary ACF portion 97 remaining in the separator 3. For that purpose, the material and the material of the separator 3 and the tape 55 in contact with the ACF 2 may be selected. For example, the surface of the separator 3 may be a fluororesin such as PTFE (polytetrafluoroethyne) or PFA (tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer), and the tape 55 may be a material selected as a cellulose resin. While the separator 3 and the tape 55 are made of the same cellulose resin material, the material may be selected so that an adhesive layer made of an acrylic material is disposed only on the tape 55 side, or the separator 3 and the tape 55 are made of the same material. A material whose surface roughness of the tape 55 is rougher than that of the separator 3 may be selected.
After the preheating is finished, the preheating mechanism 64 starts to descend. Then, as the preheating mechanism 64 is lowered, the tape collecting mechanism 57 is rotated so that the tape 55 is drawn into this. By pulling, the unnecessary ACF portion 97 is transferred from the separator 3 to the tape 55. Due to this transition, the ACF tape 99 has no unnecessary portion ACF portion 97 and only the separator 3. Therefore, in the subsequent “operation 3”, the clamping chuck 66 clamps only the separator 3.
As described above, according to this embodiment, the contact-type preheating mechanism 64 is disposed with respect to the unnecessary ACF portion 97, the tape 55 is interposed between the unnecessary ACF portion 97 and the preheating mechanism 64, and the tape 55 is configured to be supplied / collected by a tape supply mechanism 56 and a tape recovery mechanism 57. Furthermore, the material of the tape 55 is made of a material or surface roughness that allows the unnecessary ACF portion 97 to be transferred more easily than the separator 3, so that the unnecessary ACF portion 97 can be reliably separated and removed from the ACF tape 99, and the clamping chuck is the subsequent operation. There is an effect that the panel sticking ACF portion 98 can be attached to the liquid crystal panel 61 with high accuracy and high reliability without causing a pinching problem when pinching at 66.

Next, a fourth embodiment of the present invention will be described with reference to FIG.
As shown in FIG. 5, the ACF sticking apparatus of this embodiment includes at least an ACF supply reel 1, a separator collection reel 4, a half-cut mechanism 5, a tape sticking mechanism 41, a clamping chuck 66, a heating / heating unit. A pressure head 60 and a liquid crystal panel cradle 62 are included. The ACF tape has a two-layer structure of a cover film called ACF 2 and separator 3.
From “Operation 1”, first, the ACF tape 99 to which thermosetting property is imparted and in which the ACF 2 and the separator 3 are integrated is half-cut by the cutter 6 of the half-cut mechanism 5.
Half-cutting is carried out by bringing the cutter 6 into contact with the ACF 2 side, and the cutting amount (depth) is set so that at least the separator 3 is not cut. The separator 3 is held by the ACF supply reel 1 and the separator collection reel 4 and is tensioned. Therefore, the depth of the half cut is preferably set such that the ACF 2 is cut but the separator 3 is not damaged. The ACF cut position is a boundary between a panel pasting ACF portion 98 to be pasted on the liquid crystal panel later and an unnecessary ACF portion 97 not pasted.
Next, before the “operation 2” is performed, the following processing (not shown) is performed.
The ACF tape 99 held by the ACF supply reel 1 and the separator collection reel 4 moves to the tape application position by rotating both the reels. The stop position is a place where the unnecessary ACF portion 97 and the tape applying mechanism 41 coincide.
The alignment between the unnecessary ACF portion 97 and the tape applying mechanism 41 is controlled by a stepping motor or the like, even if a known optical alignment method using an optical camera, for example, is used. A general alignment method may be employed.
From “operation 2”, the tape applying mechanism 41 and the tape receiving base 43, which are provided with the tape 42 on the unnecessary ACF portion 97 of the ACF tape 99 which has been half-cut in the “operation 1”, move up and down to apply the tape 42. To process.
The purpose is that the ACF tape 99 needs to be clamped by the clamping chuck 66 in the operation 3, and the ACF and the clamping chuck 66 are not attached to the clamping chuck 66 due to the adhesiveness (tackiness) of the ACF. A tape 42 is provided as a protective film between them.
Note that the tape 42 used here may be pasted in the size of the entire range of the unnecessary ACF portion 97, or the size of the holding chuck 66 that holds the unnecessary ACF portion 97 may be used.
In addition, the method of attaching the tape 42 to the unnecessary ACF portion 97 is such that only the tape applying mechanism 41 on which the tape 42 is placed is raised, and the tape 42 may be attached in contact with the unnecessary ACF portion 97. The tape cradle 43 provided on the opposite surface of the unnecessary ACF portion 97 (the upper portion in this figure) is lowered, and the ACF tape 99 may be pressed and brought into contact with the tape 42 to be attached. It may be an operation in a sandwiched state in which 41 is raised and the tape cradle 43 is lowered. In this embodiment, the operation in the sandwiched state in which the tape applying mechanism 41 is raised and the tape cradle 43 is lowered is illustrated.
From “Operation 3”, the clamping chuck 66 moves to the position of the unnecessary ACF portion 97 where the tape 42 is stuck.
The sandwiching chuck 66 includes an upper chuck 67 and a lower chuck 68, and the unnecessary ACF portion 97 is sandwiched by narrowing the interval between the chucks. The sandwiching chuck 66 sandwiching the ACF tape 99 including the unnecessary ACF portion 97 moves to a position where the liquid crystal panel 61 and the panel pasting ACF portion 98 can come into contact (attachment position) while maintaining the sandwiched state.
At this time, the ACF supply reel 1 feeds out the ACF tape 99, and the separator collection reel 4 performs a synchronized operation so as to pull it in, and pulls out the ACF tape 99.
In the present embodiment, the range of the unnecessary ACF portion 97 and the tape 42 is made to coincide with each other, and the entire range of the unnecessary ACF portion 97 is pinched by the clamping chuck 66. It is not always necessary to apply the tape 42 to the range, and it is not necessary to sandwich the entire range where the tape 42 is applied.
In other words, when the ACF tape 99 is pulled out when the clamping chuck 66 and the unnecessary ACF portion 97 to which the tape 42 is attached are brought into contact with each other, the ACF tape 99 and the clamping chuck 66 slip to each other. What is necessary is just to stick and hold | maintain the tape 42 of the quantity which does not change a position.
Further, the structure of the upper chuck 67 and the lower chuck 68 of the clamping chuck 66 is flattened by forming an uneven shape with respect to the unnecessary ACF portion 97 and the separator 3 to which the tape 42 to be clamped is attached. It is possible to pinch with higher accuracy.
The tape 42 to be attached to the unnecessary ACF portion 97 does not require adhesiveness, and a commercially available paper tape can be used, but the unnecessary ACF portion 97 is sandwiched by selecting a shape having a rough tape surface. In doing so, it is possible to pinch with high accuracy.
By the above operation, the liquid crystal panel 61 and the panel pasting ACF portion 98 of the ACF tape 99 are aligned at the pasting position, but there is a clearance (interval) in the vertical direction.
From “Operation 4”, the heating / pressurizing head 60 installed on the upper part of the liquid crystal panel 61 is lowered and comes into contact with the panel pasting ACF portion 98 of the ACF tape 99. The pasted ACF portion 98 is sandwiched between the heating / pressurizing head 60 and the liquid crystal panel 61.
The panel-attached ACF portion 98 that is sandwiched is cured by the heat supplied from the heating / pressurizing head 60 through the separator 3. The thermosetting here may be performed to the extent that the panel-attached ACF portion 98 remains on the liquid crystal display panel side and does not remain on the separator side when the panel-attached ACF portion 98 is peeled from the separator. That is, it is preferable that the panel pasting ACF part 98 remains partially in the separator or the panel pasting ACF part 98 is not separated in the ACF resin layer and left in the separator.
Furthermore, since the circuit components such as TCP are arranged after the separator is peeled off, the panel pasting ACF portion 98 needs to be set to a heating amount enough to maintain adhesiveness even after heating. The heating time and heating temperature may be heated at 60 ° C. for about 5 seconds for an ACF made of an acrylic thermosetting resin material generally used for a liquid crystal display device, for example.
In the explanation of the operation here, the example in which the heating / pressurizing head 60 is lowered and the ACF tape 99 is sandwiched between the heating / pressurizing head 60 and the liquid crystal panel 61 is shown. However, the liquid crystal that holds the liquid crystal panel 61 is shown. The panel cradle 62 may be raised, or the operation of lowering the heating / pressurizing head 60 and raising the liquid crystal panel cradle 62 may be used in combination. Here, the panel pasting ACF part 98 and the liquid crystal panel 61 are in contact with each other, and the heat of the heating / pressurizing head 60 may be transmitted to the panel pasting ACF part 98. The operation is not limited.
The unnecessary ACF portion 97 remaining on the separator 3 and the tape 42 attached to the unnecessary ACF portion 97 are recovered by the separator recovery reel 4.
From “Operation 5”, the TCP 80 is mounted on the panel pasting ACF portion 98 pasted on the liquid crystal panel 61. Then, the heating / pressurizing head 70 is lowered from above the TCP 80 and brought into contact with the TCP 80 to heat and cure the ACF.
In this curing, it is necessary to cure to the extent that the electrical characteristics and reliability of the liquid crystal display device are ensured. The heating time and heating temperature may be heated at 180 ° C. for about 30 seconds for an ACF made of an acrylic thermosetting resin material generally used for a liquid crystal display device, for example. Although an example in which the TCP 80 is attached to the liquid crystal panel 61 is shown here, the TCP 80 is not necessarily required, and COG, FPC, or the like may be used.

Next, a fifth embodiment of the present invention will be described with reference to FIG.
The basic configuration of the ACF sticking apparatus of the present embodiment is the same as that of the fourth embodiment, but in this embodiment, the boundary between the unnecessary ACF portion 97 and the panel sticking ACF portion 98 is shown in “Operation 1” in FIG. The point from which the tape sticking mechanism stuck to the unnecessary ACF site | part 97 is integrated with the mechanism which half-cuts a surface differs from Example 4. FIG. Below, a difference is demonstrated.
In this embodiment, when the boundary surface between the unnecessary ACF portion 97 and the panel pasting ACF portion 98 is half-cut, the tape 42 cut in advance is mounted on the tape pasting / half-cut mechanism 45.
Next, the tape cradle 43 provided on the upper portion of the unnecessary ACF portion 97 is lowered, the tape sticking / half-cut mechanism 45 carrying the tape 42 is raised, and the cutter 6 firstly has the unnecessary ACF portion 97 and the panel sticking ACF portion. An operation of cutting the boundary surface with 98 is performed. In this state, the portion on which the tape 42 is mounted rises, and the tape 42 is brought into contact with the unnecessary ACF portion 97. By doing so, it is possible to perform the operation of attaching the tape 42 to the unnecessary ACF portion 97 while performing the half-cut operation.
After the tape 42 is attached to the unnecessary ACF portion 97, the tape cradle 43 is raised, the tape attaching / half-cut mechanism 45 is lowered, and is separated from the ACF tape 99.
Thereafter, the unnecessary ACF portion 97 to which the tape 42 is attached is sandwiched between the upper chuck 67 and the lower chuck 68 of the “operation 2” clamping chuck 66, whereby the tape 42 is completely attached to the unnecessary ACF portion 97. .
In the present embodiment, the tape attaching / half-cut mechanism 45 and the tape cradle 43 are illustrated as moving up and down, but the tape cradle 43 does not move down and only the tape attaching / half-cut mechanism 45 is operated. The tape application / half-cut mechanism 45 may be moved upward, and the tape application / half-cut mechanism 45 is not moved upward, and only the tape cradle 43 is moved downward while pressing the unnecessary ACF portion 97. The half cutting operation and the tape applying operation may be performed by contacting with the tape applying / half cutting mechanism 45, and the operation is not limited to the operation of the device.
As described above, according to the present embodiment, by performing the half-cut operation and the tape application operation on the unnecessary ACF portion 97 at the same time, there is an effect that the tact time of the apparatus can be shortened and the production efficiency can be improved.

Next, a sixth embodiment of the present invention will be described with reference to FIG.
In this embodiment, as shown in “Operation 2” in FIG. 7, the tape 42 is attached to the unnecessary ACF region 97 without using the tape applying mechanism 41 of the fourth embodiment and the tape applying / half-cut mechanism 45 of the fifth embodiment. The difference is that the pasting method is performed by the existing lower chuck 68. Below, a difference is demonstrated.
In this embodiment, as shown in “Operation 2” in FIG. 7, the boundary surface between the unnecessary ACF portion 97 and the panel pasting ACF portion 98 is half-cut and then cut in advance onto the lower chuck 68 of the sandwiching chuck 66. The tape 42 is mounted.
Next, the position of the unnecessary ACF portion 97 and the position of the lower chuck 68 on which the tape 42 is mounted are aligned. After the alignment, the lower chuck 68 is raised, and the unnecessary ACF portion 97 and the tape 42 are brought into contact with each other.
Next, in “operation 3”, the upper chuck 67 is aligned with the upper position of the unnecessary ACF portion 97 and is moved downward to come into contact with the separator 3 on the unnecessary ACF portion 97. As it is, the tape 42 is completely attached to the unnecessary ACF portion 97 by the clamping operation between the upper chuck 67 and the lower chuck 68.
As described above, according to this embodiment, the tape 42 can be attached to the unnecessary ACF portion 97 with the existing lower chuck 68, so that the tape attaching mechanism required in the embodiments 4 and 5 is necessarily required. The effect is that the dedicated tape attaching mechanism can be omitted.

Next, a seventh embodiment of the present invention will be described with reference to FIG.
In this embodiment, as shown in “Operation 2” in FIG. 8, the tape 47 is attached by the lower chuck 68 without using the tape attaching mechanism as in the sixth embodiment, and the vicinity of the lower chuck 68 is further provided. The difference is that a tape supply mechanism 46 is provided. Below, a difference is demonstrated.
In this embodiment, as shown in “operation 2” in FIG. 8, the tape provided near the lower chuck 68 of the sandwiching chuck 66 after half-cutting the boundary surface between the unnecessary ACF portion 97 and the panel pasting ACF portion 98. The supply mechanism 46 operates to supply the tape 47 onto the lower chuck 68.
Next, the position of the unnecessary ACF portion 97 and the position of the lower chuck 68 on which the tape 47 is mounted are aligned. After the alignment, the lower chuck 68 is raised, and the unnecessary ACF portion 97 and the tape 47 are brought into contact with each other.
Next, in operation 3, the upper chuck 67 is aligned with the upper position of the unnecessary ACF portion 97, and moves downward to come into contact with the separator 3 on the unnecessary ACF portion 97. As it is, the tape 47 is completely attached to the unnecessary ACF portion 97 by the clamping operation between the upper chuck 67 and the lower chuck 68.
Further, after the upper chuck 67 and the lower chuck 68 are clamped, the unnecessary ACF portion 97 is arbitrarily moved to the position where the liquid crystal panel 61 is attached while the clamp 66 holds and holds the unnecessary ACF portion 97.
After “operation 4”, after the ACF has moved to the position where the liquid crystal panel 61 is attached, the heating / pressurizing head 60 provided on the upper side of the liquid crystal panel 61 is lowered, and thermocompression bonding of the ACF to the liquid crystal panel 61 is performed. It is.
After thermocompression bonding, the heating / pressurizing head 60 is raised. When the heating / pressurizing head 60 is raised, the unnecessary ACF portion 97 which is not attached to the liquid crystal panel 61 of the ACF and becomes unnecessary is separated by the cutting of the half-cut mechanism 5 and remains in the separator 3. Unnecessary ACF portions 97 remaining on the separator 3 are recovered by the separator recovery reel 4. Further, the tape 47 attached to the unnecessary ACF portion 97 is also recovered to the separator recovery reel 4 in the same manner as the separator 3 recovery operation.
Thus, according to the present embodiment, the tape 47 is attached to the unnecessary ACF portion 97 with the existing lower chuck 68, and the mechanism for supplying the tape 47 in the vicinity of the lower chuck 68 is provided. The operation of cutting and supplying the tape in advance in Examples 4 to 6 is necessary, but there is an effect that it can be made unnecessary.
In each of the above embodiments, the case where the ACF is pasted to the liquid crystal panel has been described. However, the present invention is not limited to the above embodiments, and a sticky member is cut and pasted to a desired size. The present invention is applicable to any sticking device and any device to which an adhesive member is stuck using the sticking device.

The present invention is applicable to an ACF sticking device and a display device manufactured using the ACF sticking device.
This application claims the priority on the basis of Japanese application Japanese Patent Application No. 2008-331986 for which it applied on December 26, 2008, and takes in those the indications of all here.

Claims

An ACF attaching device for attaching an anisotropic conductive film (ACF) tape to a display panel,
ACF tape with ACF attached to the separator;
A mechanism for moving the ACF tape;
An alignment mechanism for controlling the moving position of the ACF tape;
A mechanism for cutting a part of the ACF of the ACF tape;
A clamping chuck mechanism for clamping the ACF tape;
A panel cradle on which a display panel can be placed;
A heating / pressurizing head capable of contacting the separator of the ACF tape;
Before the ACF tape is clamped by the clamping chuck mechanism, and a means for changing the adhesiveness of a part of the ACF,
An ACF adhering device characterized in that the ACF tape is sandwiched between the display panel placed on the panel cradle and the heating / pressurizing head and heated to transfer the ACF to the display panel. .
The ACF sticking device according to claim 1, further comprising a preheating mechanism for heating a part of the ACF at a portion to be clamped before the ACF tape is clamped by the clamping chuck mechanism.
3. The ACF sticking apparatus according to claim 2, further comprising a mechanism for cooling the portion of the ACF tape attached to the display panel in the vicinity of the preheating mechanism.
An ACF removing mechanism that is attached to the ACF tape and abuts on the ACF at a portion cut by the mechanism for cutting the ACF, and transfers the cut ACF from the separator of the ACF tape to the removing tape; The ACF sticking device according to claim 2 or 3, wherein
The ACF sticking apparatus according to any one of claims 2 to 4, wherein the preheating mechanism is a heating source that is not in contact with or in contact with the sandwiched ACF.
An ACF attaching device for attaching an anisotropic conductive film (ACF) tape to a display panel,
ACF tape with ACF attached to the separator;
A mechanism for moving the ACF tape;
An alignment mechanism for controlling the moving position of the ACF tape;
A mechanism for cutting a part of the ACF of the ACF tape;
A clamping chuck mechanism for clamping the ACF tape;
A panel cradle on which a display panel can be placed;
A heating / pressurizing head capable of contacting the separator of the ACF tape;
A tape application mechanism for attaching the tape to the ACF of the portion to be clamped before the ACF tape is clamped by the clamping chuck mechanism;
An ACF adhering device characterized in that the ACF tape is sandwiched between the display panel placed on the panel cradle and the heating / pressurizing head and heated to transfer the ACF to the display panel. .
The ACF sticking apparatus according to claim 6, wherein the mechanism for cutting the ACF and the tape sticking mechanism are integrated.
The ACF sticking device according to claim 6, wherein the tape sticking mechanism is composed of the clamping chuck alone.
The ACF sticking device according to any one of claims 6 to 8, further comprising a tape supply mechanism in the vicinity of the tape sticking mechanism.
In a manufacturing method of a display device in which an anisotropic conductive film (ACF) is stuck on a display panel,
Cutting a part of the ACF of the ACF tape with the ACF attached to the separator;
Clamping and moving the ACF tape with a clamping chuck;
Heating and pressurizing the ACF tape, and attaching the ACF to the display panel.
Furthermore, before the ACF tape is clamped by the clamping chuck, there is a step of changing the adhesiveness of a part of the ACF so that the ACF in the clamping section does not stick to the clamping chuck. Manufacturing method.
11. The method for manufacturing a display device according to claim 10, wherein a part of the ACF to be sandwiched is heated before the ACF tape is sandwiched by the sandwiching chuck.
The method for manufacturing a display device according to claim 11, wherein the portion of the ACF tape attached to the display panel is not heated.
The method for manufacturing a display device according to claim 12, wherein the ACF tape at a portion attached to the display panel is cooled.
When heating a part of the ACF of the portion of the ACF tape that is clamped by the clamping chuck, the ACF is removed from the separator of the ACF tape by bringing the removal tape into contact with the cut ACF. The method for manufacturing a display device according to claim 10, wherein the display device is transferred to a tape.
15. The method for manufacturing a display device according to claim 14, wherein an adhesion force between the ACF and the removal tape is higher than an adhesion force between the ACF and the separator.
In a manufacturing method of a display device in which an anisotropic conductive film (ACF) is stuck on a display panel,
Cutting a part of the ACF of the ACF tape with the ACF attached to the separator;
Clamping and moving the ACF tape with a clamping chuck;
Heating and pressurizing the ACF tape, and attaching the ACF to the display panel.
A method of manufacturing a display device, comprising: adhering a tape to a surface of the ACF at a portion to be clamped before the ACF tape is clamped by the clamping chuck.