CN102749727B - Adhesion method for anisotropic conductive film - Google Patents
Adhesion method for anisotropic conductive film Download PDFInfo
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- CN102749727B CN102749727B CN201110096903.0A CN201110096903A CN102749727B CN 102749727 B CN102749727 B CN 102749727B CN 201110096903 A CN201110096903 A CN 201110096903A CN 102749727 B CN102749727 B CN 102749727B
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Abstract
The invention discloses an adhesion method for an anisotropic conductive film, the method comprises the steps that anisotropic conductive film (ACF) to be adhered is carried out a semi-cutting treatment, an adhesion zone and a handling zone are formed on ACF to be adhered, and conductive adhesive of the handling zone is removed; and ACF to be adhered is subjected to a fully-cutting treatment on a junction of the adhesion zone and the handling zone, and ACF to be adhered with the adhesion zone and the handling zone is obtained. According to the technical scheme disclosed by the invention, the ACF is adhered on a COF (chip on film) while pollution from particles is reduced.
Description
Technical field
The present invention relates to Thin Film Transistor (TFT)-liquid crystal display (TFT-LCD, Thin Film Transistor-Liquid Crystal Display) anisotropic conductive film (ACF, Anisotropic Conducitve Film) attaching technology, relate in particular to the attaching method of a kind of ACF.
Background technology
At present, in TFT-LCD field, the attaching technology of ACF refers to, utilizes certain pressure and temperature that ACF is attached to and covered on brilliant film (COF, Chip On Film), this attaching Technology Need relates to ACF is carried out after hemisection processing, then ACF is attached on COF; Or ACF is cut after processing entirely, then ACF is attached on COF.Wherein, ACF is as conducting resinl, and its surface is covered with layer protecting film, to ACF carry out hemisection processing refer to by conducting resinl cut off but diaphragm do not cut off; ACF is cut to process entirely and refer to conducting resinl and diaphragm are all cut off.
But the attaching technology of existing ACF has the following disadvantages: the first, ACF is carried out after hemisection processing, then ACF is attached in the process on COF, attaching or moving process extremely easily cause particle contamination; The second, to ACF entirely cut process and by ACF be attached to COF upper after, the COF that is pasted with ACF is tied to panel (Panel) is front need be removed diaphragm.Now, diaphragm is not easy to remove.
In view of the deficiency of above-mentioned ACF attaching technology, it is that the clean room of factory area in TFT-LCD field carries out that ACF is attached to technological process on COF, but, along with the demand of cost, in TFT-LCD field, in factory area, set up non-clean room to become main flow trend, therefore, be attached at ACF the particle contamination that needs to avoid extremely easy generation in the technological process on COF.
Summary of the invention
In view of this, fundamental purpose of the present invention is to provide the attaching method of a kind of ACF, in reducing generation particle contamination, is convenient to ACF to be attached on COF.
For achieving the above object, technical scheme of the present invention is achieved in that
The attaching method that the invention provides a kind of anisotropic conductive film, comprising:
Anisotropic conductive film to be attached (ACF) is carried out to hemisection processing, on ACF to be attached, form adhesion zone and holding area, and the conducting resinl of described holding area is removed;
At the intersection of described adhesion zone and described holding area, ACF to be attached is cut to processing entirely, obtain having the ACF to be attached of an adhesion zone and a holding area.
In said method, described ACF to be attached is carried out to hemisection processing, on ACF to be attached, forms adhesion zone and holding area and be:
The ACF that utilizes half cutting edge to treat attaching carries out hemisection processing, after ACF to be attached is moved, utilize half cutting edge again ACF to be attached to be carried out to hemisection processing, the region of carrying out for twice on ACF to be attached between hemisection processing is holding area, and the region beyond the holding area on ACF to be attached is adhesion zone.
In said method, the described conducting resinl by described holding area is removed and is:
Utilize adsorption module to adsorb the diaphragm of the holding area on ACF to be attached, utilize the sticky instrument of getting to gluing and get through the upper holding area forming of hemisection ACF to be attached after treatment, remove the conducting resinl of described holding area.
In said method, the described intersection in described adhesion zone and described holding area, ACF to be attached is entirely cut and is treated to:
At the intersection of adhesion zone and the holding area of ACF to be attached, utilize full cutting edge entirely to cut processing to ACF to be attached.
In said method, upper adhesion zone and the holding area that has one or more groups of described ACF to be attached, and adhesion zone and holding area alternative arrangement, described intersection is any one in two intersections of adhesion zone and holding area.
In said method, the method also comprises:
The ACF to be attached obtaining is attached to and covers brilliant film (COF) above, before COF is attached on panel, remove the diaphragm that is attached to the ACF on COF.
In said method, the described ACF to be attached obtaining is attached on COF is:
First with pre-bonding instrument, the ACF to be attached with an adhesion zone and a holding area obtaining is positioned to COF upper, then the ACF to be attached being positioned on COF is bonded on COF with master bond instrument.
In said method, the described use instrument that bonds is in advance positioned at the ACF to be attached with an adhesion zone and a holding area obtaining on COF and is:
The adhesion station that boning instrument in advance and carries COF is moved to respectively the ACF to be attached with an adhesion zone and a holding area that obtains directly over and under, the instrument that bonds is in advance bonded in the adhesion zone of the ACF to be attached with an adhesion zone and a holding area obtaining on COF.
In said method, be describedly bonded on COF and be being positioned at ACF to be attached on COF with master bond instrument:
Pre-bonding instrument rises, the adhesion station that carrying has been bonded with the COF of ACF moves under master bond instrument, it is upper that the adhesion zone that is positioned at the ACF to be attached on COF is bonded in COF by master bond instrument, completes ACF to be attached is attached to the technological process on COF.
The attaching method of ACF provided by the invention, carries out hemisection processing to ACF to be attached, forms adhesion zone and holding area on ACF to be attached, and the conducting resinl of described holding area is removed; At the intersection of described adhesion zone and described holding area, ACF to be attached is cut to processing entirely, obtain having the ACF to be attached of an adhesion zone and a holding area.Utilize said method, full cutting process in ACF attachment process and half cutting process are combined, ACF is processed, realize that ACF is attached to COF is upper, can greatly reduce the particle contamination that ACF very likely produces in attaching in flow process and completing the moving process of COF of attaching simultaneously; In addition, the present invention can also make the diaphragm on ACF remove like a cork, greatly improves the success ratio boning on module plant produced line, has great importance for improving the production capacity of module plant produced line and reducing production costs.
Brief description of the drawings
Fig. 1 is the realization flow schematic diagram of the attaching method of ACF of the present invention;
Fig. 2 is the schematic diagram that in the present invention, ACF to be attached is carried out hemisection processing;
Fig. 3 is the schematic diagram of in the present invention, ACF to be attached being cut full processing;
Fig. 4 is that in the present invention, ACF to be attached is bonded in the schematic diagram on COF by pre-bonding instrument;
Fig. 5 is that in the present invention, ACF to be attached is bonded in the schematic diagram on COF by master bond instrument.
Embodiment
Basic thought of the present invention is: ACF to be attached is carried out to hemisection processing, form adhesion zone and holding area on ACF to be attached, and the conducting resinl of described holding area is removed; At the intersection of described adhesion zone and described holding area, ACF to be attached is cut to processing entirely, obtain having the ACF to be attached of an adhesion zone and a holding area.
Below by drawings and the specific embodiments, the present invention is described in further detail again.
Fig. 1 is the realization flow schematic diagram of the attaching method of ACF of the present invention, and as shown in Figure 1, the attaching method of this ACF comprises the following steps:
Step 101, carries out hemisection processing to ACF to be attached, forms adhesion zone and holding area on ACF to be attached;
Concrete, as shown in Figure 2, ACF to be attached is made up of one deck conducting resinl and the layer protecting film overlaying on this conducting resinl, and the ACF that utilizes half cutting edge to treat attaching carries out hemisection processing, that is: only the conducting resinl of ACF to be attached is cut off, do not cut off the diaphragm on ACF to be attached; A clip is set on ACF to be attached, and this clip is clamped ACF to be attached and is moved, and after ACF to be attached is moved, utilizes half cutting edge again ACF to be attached to be carried out to hemisection processing, and wherein the position of hemisection is positioned at the position near ACF volume; The region of carrying out for twice on ACF to be attached between hemisection processing is holding area, and the region beyond the holding area on ACF to be attached is adhesion zone;
Said process can repeatedly carry out on ACF to be attached, can form many group adhesion zones and holding area on ACF to be attached that is:, and adhesion zone and holding area are alternative arrangements.
Step 102, removes the conducting resinl of the holding area on ACF to be attached after treatment hemisection;
Concrete, as shown in Figure 2, adsorption module is for adsorbing the diaphragm of the holding area on ACF to be attached, make sticky when getting instrument and getting gluing through the upper holding area forming of hemisection ACF to be attached after treatment, can only remove the conducting resinl of the upper holding area of ACF to be attached, the diaphragm of the upper holding area of ACF to be attached can't be removed in the lump, like this, only have diaphragm to adhere to through the upper holding area forming of hemisection ACF to be attached after treatment, obtain only having the holding area of diaphragm on ACF to be attached; It is here described, that sticky to get instrument can be invisible tape or adhesive tape.
Step 103, at the intersection of adhesion zone and the holding area of ACF to be attached, cuts processing entirely to ACF to be attached, obtains having the ACF to be attached of an adhesion zone and a holding area;
Concrete, as shown in Figure 3, at the intersection of adhesion zone and the holding area of ACF to be attached, utilize full cutting edge entirely to cut processing to ACF to be attached, that is: the adhesion zone with conducting resinl and diaphragm on ACF to be attached is together cut, obtain having the ACF to be attached of an adhesion zone and a holding area; Wherein, on ACF to be attached, can there is one or more groups adhesion zone and holding area, and adhesion zone and holding area are alternative arrangements, therefore the intersection of adhesion zone and holding area exists two, can select one of them intersection according to putting in order of holding area and adhesion zone, as long as ensure that entirely cutting the ACF to be attached for being attached on COF obtaining after processing has an adhesion zone and a holding area.
Step 104, attaches to the ACF to be attached obtaining on COF;
Concrete, as shown in Figure 4, bond in advance instrument and adhesion station are moved to respectively the ACF to be attached with an adhesion zone and a holding area that obtains directly over and under, in described adhesion station, carry COF, then bonding instrument declines in advance, makes the adhesion zone of the ACF to be attached with an adhesion zone and a holding area obtaining in last step be bonded in the relevant position on COF; Here, the operation object of the instrument that bonds is in advance that the adhesion zone of ACF to be attached is positioned to COF above, to further fix.
As shown in Figure 5, pre-bonding instrument rises, the adhesion station of carrying the COF that is bonded with ACF moves under master bond instrument, master bond instrument declines, with certain pressure and temperature, the adhesion zone that is positioned at the ACF to be attached on COF is bonded in to COF upper, so far completes ACF to be attached is attached to the technological process on COF; Wherein, need to, according to the type of the ACF adopting, determine described pressure and temperature, for example, the ACF of employing is the ACF that Sony is produced, and pressure size is 0.5～2Mpa, and temperature is 65 DEG C～85 DEG C; Here, the operation object of master bond instrument is that the adhesion zone and the COF that are positioned at the ACF to be attached on COF are further fixed; Wherein, the effect of described holding area is the convenient removal of the diaphragm by holding area, and then carries out other follow-up binder-treatment.
Step 105, removes the diaphragm that is attached to the ACF on COF;
Concrete, after the ACF to be attached that contains holding area and adhesion zone is attached on COF, and before COF is attached on panel; pinch holding area; the diaphragm that is attached to the ACF on COF is removed, and the method for removing the diaphragm of ACF belongs to prior art, repeats no more here.
Before the ACF to be attached that contains holding area and adhesion zone is attached on COF, the diaphragm of ACF is not removed, and can prevent particle contamination; In addition, on ACF, there is holding area, before COF is attached on panel, can be easily by the removing of the diaphragm of ACF.
The above, be only preferred embodiment of the present invention, is not intended to limit protection scope of the present invention, all any amendments of doing within the spirit and principles in the present invention, is equal to and replaces and improvement etc., within all should being included in protection scope of the present invention.
Claims (8)
1. an attaching method for anisotropic conductive film, is characterized in that, the method comprises:
Anisotropic conductive film to be attached (ACF) is carried out to hemisection processing, on ACF to be attached, form adhesion zone and holding area, and the conducting resinl of described holding area is removed;
At the intersection of described adhesion zone and described holding area, ACF to be attached is cut to processing entirely, obtain having the ACF to be attached of an adhesion zone and a holding area;
The ACF to be attached obtaining is attached to and covers brilliant film (COF) above, before COF is attached on panel, remove the diaphragm that is attached to the ACF on COF.
2. method according to claim 1, is characterized in that, described ACF to be attached is carried out to hemisection processing, forms adhesion zone and holding area and be on ACF to be attached:
The ACF that utilizes half cutting edge to treat attaching carries out hemisection processing, after ACF to be attached is moved, utilize half cutting edge again ACF to be attached to be carried out to hemisection processing, the region of carrying out for twice on ACF to be attached between hemisection processing is holding area, and the region beyond the holding area on ACF to be attached is adhesion zone.
3. method according to claim 1, is characterized in that, the described conducting resinl by described holding area is removed and is:
Utilize adsorption module to adsorb the diaphragm of the holding area on ACF to be attached, utilize the sticky instrument of getting to gluing and get through the upper holding area forming of hemisection ACF to be attached after treatment, remove the conducting resinl of described holding area.
4. method according to claim 1, is characterized in that, the described intersection in described adhesion zone and described holding area is entirely cut and is treated to ACF to be attached:
At the intersection of adhesion zone and the holding area of ACF to be attached, utilize full cutting edge entirely to cut processing to ACF to be attached.
5. according to the method described in claim 1 or 4, it is characterized in that,
Upper adhesion zone and the holding area that has one or more groups of described ACF to be attached, and adhesion zone and holding area alternative arrangement, described intersection is any one in two intersections of adhesion zone and holding area.
6. method according to claim 1, is characterized in that, the described ACF to be attached obtaining is attached on COF is:
First with pre-bonding instrument, the ACF to be attached with an adhesion zone and a holding area obtaining is positioned to COF upper, then the ACF to be attached being positioned on COF is bonded on COF with master bond instrument.
7. method according to claim 6, is characterized in that, the described use instrument that bonds is in advance positioned at the ACF to be attached with an adhesion zone and a holding area obtaining on COF and is:
The adhesion station that boning instrument in advance and carries COF is moved to respectively the ACF to be attached with an adhesion zone and a holding area that obtains directly over and under, the instrument that bonds is in advance bonded in the adhesion zone of the ACF to be attached with an adhesion zone and a holding area obtaining on COF.
8. method according to claim 6, is characterized in that, is describedly bonded on COF and is being positioned at ACF to be attached on COF with master bond instrument:
Pre-bonding instrument rises, the adhesion station that carrying has been bonded with the COF of ACF moves under master bond instrument, it is upper that the adhesion zone that is positioned at the ACF to be attached on COF is bonded in COF by master bond instrument, completes ACF to be attached is attached to the technological process on COF.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110096903.0A CN102749727B (en) | 2011-04-18 | 2011-04-18 | Adhesion method for anisotropic conductive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110096903.0A CN102749727B (en) | 2011-04-18 | 2011-04-18 | Adhesion method for anisotropic conductive film |
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| Publication Number | Publication Date |
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| CN102749727A CN102749727A (en) | 2012-10-24 |
| CN102749727B true CN102749727B (en) | 2014-12-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110096903.0A Active CN102749727B (en) | 2011-04-18 | 2011-04-18 | Adhesion method for anisotropic conductive film |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103752939B (en) * | 2013-12-20 | 2017-03-22 | 京东方科技集团股份有限公司 | Cutter adjustment device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1996102A (en) * | 2005-12-28 | 2007-07-11 | 上海广电Nec液晶显示器有限公司 | ACF attaching method |
| CN101126875A (en) * | 2006-06-29 | 2008-02-20 | Sfa工程股份有限公司 | Apparatus, method and its case type shell for supplying, joining drive circuit board |
| CN101566735A (en) * | 2008-04-25 | 2009-10-28 | 深超光电（深圳）有限公司 | Method for jointing display panel and wafers |
| JP2010152205A (en) * | 2008-12-26 | 2010-07-08 | Nec Lcd Technologies Ltd | Acf sticking device and method for manufacturing display |
| CN101995677A (en) * | 2009-08-20 | 2011-03-30 | 友达光电(厦门)有限公司 | Anisotropies conductor film (ACF) attaching device and attaching method |
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2011
- 2011-04-18 CN CN201110096903.0A patent/CN102749727B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1996102A (en) * | 2005-12-28 | 2007-07-11 | 上海广电Nec液晶显示器有限公司 | ACF attaching method |
| CN101126875A (en) * | 2006-06-29 | 2008-02-20 | Sfa工程股份有限公司 | Apparatus, method and its case type shell for supplying, joining drive circuit board |
| CN101566735A (en) * | 2008-04-25 | 2009-10-28 | 深超光电（深圳）有限公司 | Method for jointing display panel and wafers |
| JP2010152205A (en) * | 2008-12-26 | 2010-07-08 | Nec Lcd Technologies Ltd | Acf sticking device and method for manufacturing display |
| CN101995677A (en) * | 2009-08-20 | 2011-03-30 | 友达光电(厦门)有限公司 | Anisotropies conductor film (ACF) attaching device and attaching method |
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| CN102749727A (en) | 2012-10-24 |
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