CN101126875A - Apparatus, method and its case type shell for supplying, joining drive circuit board - Google Patents

Abstract

The invention discloses an apparatus for supplying driving circuit and a box shaped shell, a bonding apparatus and method of drive circuit, and a bonding system of drive circuit with the said bonding apparatus. The bonding system of drive circuit comprises a push unit for pushing the drive circuit on a bonding surface with substrate of drive circuit, wherein the push unit is composed of a push body to approach the bonding surface above the substrate and separated from the bonding surface; an adapter tool with press surface which is contacted with the drive circuit on pushing the drive circuit on the bonding surface; a number of height adjusting parts for adjusting displacement of the press surface ralative to the bonding surface to obtain planarity of press surface of the adapter tool; and rotation adjusting parts above the height adjusting parts to adjust the rotation of height adjusting parts and mounted above the area of the height adjusting parts between the push body and the adapter tool.

Description

Equipment, method and case type shell thereof that supply, bonding drive circuit board are used

Technical field

The present invention relates to junction apparatus and a kind of joint method thereof of a kind of equipment that is used to supply drive circuit board and case type shell thereof, a kind of drive circuit board, and a kind of mating system with drive circuit board of described junction apparatus, and more particularly, the junction apparatus and a kind of joint method thereof that relate to a kind of equipment that is used to supply drive circuit board and case type shell thereof, a kind of drive circuit board, and a kind of production of shortening joint technology mating system of the drive circuit board with described junction apparatus of (tact time) intermittently.

Background technology

Flat-panel display panel is the image-displaying member that can realize high quality graphic.Flat-panel display panel is liked as mobile monitors of future generation, wall-hanging TV and the multi-media image equipment of high quality graphic, because it has the advantage that high definition lookization, wide visual angle and low electric power consume.Recently, increase greatly, and carried out its large-scale production and constantly research thereof for the concern of flat-panel display panel.

Flat-panel monitor element panel comprises plasma display device (PDP), LCD (LCD), Organic Light Emitting Diode (OLED) and vacuum fluorescent display (VFD) or the like.The trend of flat-panel monitor element panel is that its thickness continues attenuation, and its size continues to become greatly.In order further to satisfy described trend, (for example, PCB, TCP, CBF etc.) directly join flat-panel display panel (that is substrate) to and manufacture unitized product with drive circuit board.

If drive circuit board is directly bonded to substrate, its assembling and maintenance are easier to so, because do not need complicated distribution, and owing to not needing independent distribution space to make the cause of product miniaturization, can produce the product that adapts to very much.

Therefore, constantly develop the mating system that drive circuit board is joined to the drive circuit board of substrate.

The joint technology of mating system mainly comprise with drive circuit board attached to the SUS attach process on the minor face edge of substrate and with drive circuit board attached to the ADD attach process on the long edge of substrate.SUS attach process and ADD attach process comprise ACF attach process, pre-joint technology and final joint technology.

The ACF attach process is that (anisotropic conductive film ACF) is adhered to the technology of substrate with anisotropic conductive film.Pre-joint technology is the technology on the zone that ACF was adhered to that in advance drive circuit board is bonded on the substrate.Final joint technology is that drive circuit board is adhered to the technology of the composition surface of substrate the most at last, and the contact maker instrument that described composition surface comprises well heater by use carries out hot pressing and pushed in advance.

In final joint technology, (for example, end TCP) is touched by the contact maker instrument and pushes by being pressed in drive circuit board on the substrate in advance.Continued about 12 to 15 seconds and TCP finally is bonded on the substrate by keeping by the pressed state of the heater heats that comprises in the contact maker instrument.

Simultaneously, giant display should be with more than on the long edge of 20 TCP attached to substrate.Usually, advantage is can shorten the process time of adhering to TCP by once pushing in the TCP attach process.Yet if long edge length increases, pushing length surface so increases.Therefore, because the causes such as thermal deformation that the error that causes of machining or well heater cause, be difficult to keep the good planarity (degree parallel) of pressure surface with the composition surface of substrate.

If the planarity variation of pressure surface, the pressing force that is applied to composition surface so can not be evenly.Therefore, substrate may be damaged in the position that is applied with strong pressing force, and can not be fully by being pressed on the substrate at the position TCP that is applied with weak pressing force.

In order to solve described problem, considered a kind of by the height that has the bolt member shape in preparation on the top of contact maker instrument regulate parts and last/below the described height that moves up regulate the method that parts are regulated the planarity of pushing the surface.

In the conventional junction apparatus of drive circuit board, the head that is installed in the end of bolt member shape should be in a clockwise direction or rotation counterclockwise, so as last/below the height that moves up with bolt member shape regulate parts.Because the bolt member shape is relatively long and head is formed on the end of bolt member shape, so need come mobile bolt member shape than high pulling torque.Therefore, the problem of existence is that in the time will being applied to the head of bolt member shape than high pulling torque, head can rupture.In addition, owing to the distortion of the bolt member shape continuous increase along with the length of bolt member shape enlarges,, make whereby to produce intermittently to prolong so regulate the planarity of the pressure surface difficulty that becomes.

The conventional mating system of drive circuit board only comprises a worktable that is loaded with substrate.Therefore, (for example, ACF attach process, pre-joint technology and final joint technology etc.) can't carry out any work in same technology when a worktable running.Therefore, the course of work time becomes very long, and the process efficiency step-down.

In order to shorten the process time and to improve process efficiency, the transfer velocity of worktable and the speed of the work of joint have been attempted improving.Yet the possibility of security incident increases in the worktable, and engages the increase of duration of work error.

In the mating system of drive circuit board, select and use various types of supply equipments according to the type of drive circuit board, hereinafter will explain the CBF supply equipment of supply in a schematic way attached to the CBF on the minor face edge of substrate (common block flexible printed circuit, common piece flexible print circuit).

As shown in Figure 1, usually with a plurality of drive circuit boards 3,4 and 5 attached on a long edge and two the minor face edge.The substrate G of the one exemplary embodiment of one exemplary embodiment of the present invention and prior art is used for about 50 inches PDP.About three CBF 3 are attached on one in the minor face edge of substrate G.About six FPC 5 are attached on another minor face edge, and about 20 TCP 6 are attached on one in the long edge of substrate G.

Fig. 2 is the perspective illustration of the conventional CBF case type shell of explanation, and Fig. 3 is the schematic front view that the CBF supply equipment of the conventional CBF case type shell that comprises Fig. 2 is described.Shown in Fig. 2 and 3, the CBF supply equipment comprises: case type shell 10, wherein a plurality of CBF supplies trays 30 form predetermined frame so that admit CBF 3, and lamination in vertical direction; Plate part 20, it is used to install case type shell 10; With driver 50, it moves plate part 20 in a predetermined direction.

Case type shell 10 is received in about 15 CBF supplies trays 30 of lamination on the vertical direction.CBF supplies trays 30 forms predetermined frame so that admit CBF 3.The workman isolates CBF 3 and CBF 3 is placed on the CBF supplies trays 30.Each CBF 3 produces static because it is made into film shape, and therefore the workman should carry out the process of removal static when being placed on CBF 3 on the CBF supplies trays 30.

15 CBF 3 of CBF supplies trays 30 receivabilities are because 5 CBF 3 dispose in the horizontal direction and 3 CBF 3 dispose in vertical direction.About 225 CBF 3 of case type shell 10 receivabilities, because because the cause of the height of CBF supplies trays 30 itself, case type shell 10 is admitted the CBF supplies trays 30 of 15 laminations usually.

The conventional supply equipment of drive circuit board, the problem that especially conventional CBF supply equipment has are, if should so only CBF3 can be fed to about 75 substrate G with 3 CBF, 3 supplies on the minor face edge of a substrate G.In addition, since when handling substrate G with CBF 3 manual configuration on each CBF supplies trays 30, so should arrange workman on duty.Therefore, operating efficiency significantly reduces, because needing setup time again after CBF 3 supplies are on several substrate G.

Referring to Fig. 1, on the long edge of drive circuit board (that is, TCP 6) attached to substrate.For with TCP attached on the substrate, at first adhere to ACF, it applies insulation and adhesion characteristic to being formed on pattern part on the substrate.In independent technology, carry out this process in advance by the ACF adhesion equipment.Then, by will finish that substrate that ACF adheres to moves to pre-joint unit (that is TCP junction apparatus) and with TCP attached to adhering to TCP on the substrate.Hereinafter disclose the TCP junction apparatus.

Fig. 4 is the schematic plan view of explanation according to the TCP junction apparatus of another one exemplary embodiment of prior art.Conventional TCP junction apparatus 700 comprises rotating mechanism 730 around longitudinal center line 731 rotations, be coupled to rotating mechanism 730 lower surface in case with four statures 750 of rotating mechanism 730 rotations, be formed on the substrate G eye mark (eye-mark) 715 and by 750 extracting and transfer so that adjoining land is taken the vision camera 760 of the aligned position of TCP 6.

Separating between two statures is the circumferential surface that 90 four statures 750 of spending are coupled to the lower surface of rotating mechanism 730.When four statures 750 during respectively around rotating mechanism 730 rotation, they by TCP loading depot (#10), TCP stand between two parties (#20), TCP adheres to station (#30) and recovery/wait is stood (#40).For the ease of explaining, four statures 750 are distinguished called afters first to four-head 751,752,753 and 754.

If explain each attach process of 750, then absorb a TCP 6 for first 751 and it is loaded in TCP loading depot (#10) by concentrating on first 751.If finished the loading of TCP 6 for first 751, first 751 clockwise direction revolved and turn 90 degrees and move to TCP and stand between two parties (#20) so, and the TCP 6 that is loaded in described position carried out simple placed in the middle.Four-head 754 works on so that another TCP 6 is loaded in TCP loading depot (#10).

If finished the placed in the middle of TCP 6 for first 751, first 751 clockwise direction rotation and move to TCP and adhere to station (#30) once more so, and with on the TCP attaching surface 711 of TCP 6 attached to substrate G.

First 751 with TCP 6 attached to the TCP attaching surface 711 of substrate G on before, should carry out the aligning of substrate 710.Can substrate G be aligned in the accurate location of substrate table 770 by following steps: the substrate table 770 of support substrates G is moved to a position of vision camera 760 so that aim at substrate G (step 1), make substrate table 770 retreat (step 2) and substrate G be moved to TCP by moving of substrate 10 after the alignment mark 713 on the inspection substrate and adhere to station (#30) (step 3) by aiming at substrate table 770 according to the information of alignment mark 713.

After finishing the aligning of substrate G, check the eye mark 715 that is provided on the TCP attaching surface 711 once more by vision camera 760.Then should carry out the aligning of a mark 715.Can after finishing substrate G and being formed on the aligning of the eye mark 715 on the TCP attaching surface 711 of substrate G, adhere to TCP 6.

If finished the aligning of eye mark 715, can move in vertical direction for first 751 so and with TCP 6 in advance by being pressed on the substrate G.If finish by compression technology in advance, first 751 clockwise direction revolved and turn 90 degrees and move to recovery/wait station (#40) so.When producing defective TCP 6 during the attach process, first 751 recoverys/wait stand (#40) locate to reclaim defective TCP 6.When not producing defective TCP 6, wait for for first 751 in case after pass by at the fixed time from recovery/wait stand (#40) move to TCP loading depot (#10).

Other 752,753 and 754 separates with the schedule time and to carry out and first 751 identical operations.Stand (#40) when locating to be scheduled to technology when first 751 in recovery/wait, adhere to station (#30) at TCP for second 752 and locate to carry out TCP 6 attach process, and stand between two parties at TCP for the 3rd 753 (#20) locates to carry out TCP 6 technologies placed in the middle, and four-head 754 is located to carry out TCP 6 in TCP loading depot (#10) and adhered to and loading technique.

In the TCP junction apparatus 700 according to another one exemplary embodiment of prior art, 750 only move on Z-direction, and should carry out above-mentioned steps 3 so that aim at the position of entire substrate G.Adhere to aligning owing to can finish TCP 6 by the aligning that carries out the eye mark 715 that substrate G go up to exist at every turn, need carry out many operations, make whereby and produce intermittently elongated and yield degradation so adhere to a TCP 6.

It is placed in the middle simply that TCP 6 misalignment but stand between two parties at TCP (#20) locate, and therefore can adhere to station (#30) at TCP and locate, and the process of the eye mark by checking TCP 6 and substrate G and the aligned position of vision camera 760 is carried out TCP 6 attach process.Therefore, the problem of existence is, because checking process makes and produces intermittently elongated and cause throughput rate to reduce.

Each of rotating mechanism 730 is divided into the zone and a stature 750 couplings of 4 parts.Therefore, the problem of existence is to adhere to many TCP by time per unit.

Summary of the invention

Therefore, a purpose of the present invention provides a kind of junction apparatus of drive circuit board, its can by when the contact maker instrument of regulating the composition surface push substrate push the planarity on surface the time prevent bolt member generation fracture damage, and the planarity of easily regulating pressure surface, the production of shortening joint technology whereby is intermittently.

According to another object of the present invention, a kind of mating system of junction apparatus and a kind of joint method and a kind of drive circuit board of drive circuit board is provided, it can shorten produces intermittently and improves operating efficiency and can too not overuse to worktable.

According to another purpose of the present invention, a kind of equipment and case type shell thereof that is used to supply drive circuit board is provided, and it can be by supplying drive circuit board and significantly reducing the bonding operation efficient that the required manpower on duty of supply drive circuit board improves drive circuit board effectively.

According to another purpose of the present invention, a kind of junction apparatus of drive circuit board is provided, it can shorten production intermittence and time per unit required when having drive circuit board on substrate has more drive circuit board, improves whereby and makes efficient.

Below describe in the content and will partly state additional advantage of the present invention, purpose and feature, and one of ordinary skill in the art will partly understand described additional advantage, purpose and feature by checking following description, maybe can understand described additional advantage, purpose and feature by putting into practice the present invention.

According to an aspect of the present invention, a kind of junction apparatus of drive circuit board is provided, described junction apparatus comprises: push the unit, its with drive circuit board by on the composition surface that is pressed in the substrate of drive circuit board, wherein pushing the unit comprises: push main body, its through providing so that separate near the composition surface on the last substrate with composition surface; The contact maker instrument, it has the surface of pushing, and when drive circuit board is pressed into composition surface, pushes the surface contact on drive circuit board; A plurality of height are regulated parts, its adjusting push the surface with respect to the displacement of composition surface to obtain the planarity of pushing the surface of contact maker instrument; Part is regulated in rotation, and it is provided at highly and regulates on the parts, and is provided at and highly regulates being in of parts and push on the zone between main body and the contact maker instrument so that the rotation of parts is highly regulated in adjusting.

According to a further aspect in the invention, provide a kind of junction apparatus of drive circuit board, described junction apparatus comprises: the working cell, and it is carried out drive circuit board is bonded on work on the substrate; A plurality of worktable, it arrives the working cell with substrate-transfer in support substrates; A plurality of load/unload parts, it is loaded into substrate worktable or unloads substrate from worktable; And control module, it controls described a plurality of worktable moving to the working cell alternately each other, make to be placed on the working cell when sentencing the work of just carrying out bonding drive circuit board when one in described a plurality of worktable, other worktable is in each load/unload part place execution loading or unloading.

According to another aspect of the invention, provide a kind of joint method of drive circuit board, described joint method comprises: first movable workbench that will be mounted with first substrate is to the working cell, and drive circuit board is bonded on the substrate at place, described working cell; When the place, working cell carries out the work of first substrate, second substrate being loaded on second worktable; And when the work of first substrate is finished, with first movable workbench to the first load/unload part unloading first substrate, and with second movable workbench to the working cell.

According to another aspect of the invention, provide a kind of mating system of drive circuit board, described mating system comprises: a plurality of junction apparatus of drive circuit board, and it is used for joining drive circuit board to be loaded on the worktable substrate; And loading bin, it is provided at respectively between described a plurality of junction apparatus of drive circuit board so that will be loaded into another adjacent junction apparatus of drive circuit board from the substrate of the junction apparatus unloading of a drive circuit board, wherein the junction apparatus of drive circuit board comprises: the working cell, and it is carried out drive circuit board is bonded on work on the substrate; First and second worktable, it arrives the working cell with substrate-transfer in support substrates; The first and second load/unload parts, it disposes toward each other and separates between the working cell that is provided so that corresponding to first and second worktable; And control module, it is controlled so that be placed on the working cell when sentencing the work of carrying out bonding drive circuit board when first worktable, second worktable is loaded in substrate on the second load/unload part, and when first worktable during from first load/unload part unloading substrate, second worktable is placed on the place, working cell.

According to another aspect of the invention, provide a kind of supply equipment of drive circuit board, described supply equipment comprises: a plurality of case type shells, its admittance are treated a plurality of drive circuit boards of lamination as the supply object; The shell mobile unit, it alternately moves to the working position each other with described a plurality of case type shells, and the working position of unloading is transferred to and described working position holding fix spaced apart by a predetermined distance from drive circuit board from case type shell.

According to another aspect of the invention, a kind of case type shell of supply equipment of drive circuit board is provided, described case type shell comprises: first shell body, its admittance are treated a plurality of drive circuit boards of lamination, and have the unload parts of unloading individual layer drive circuit board on a surface; Second shell body, it is coupled to another surface relative with described first shell body; Support part, its supporting layer is pressed in the drive circuit board in first shell body; And elastomeric element, its be provided between the support part and second shell body in case on the direction that support part separates each other with respect to second shell body resilient bias.

According to another aspect of the invention, provide a kind of junction apparatus of drive circuit board, described junction apparatus comprises: at least one stature, and it grasps on drive circuit board and the attaching surface attached to the drive circuit board of substrate; Driving mechanism, it is coupled at least one stature so that move at least one stature; Aligned position detecting unit, its acquisition be formed on the aligned position information of the eye mark on the attaching surface of drive circuit board and the aligned position information of the drive circuit board that grasps by head at least one; Control module, it comes moving of control head based on the information that obtains from the aligned position detecting unit, makes the drive circuit board that is grasped by head aim at so that corresponding to the aligned position of eye mark.

According to another aspect of the invention, a kind of joint method of drive circuit board is provided, described joint method comprises: obtain the information about the aligned position of the eye mark on the attaching surface of the drive circuit board that is formed on substrate G, with the standard of the attachment position of setting drive circuit board; Acquisition is treated attached to the information of aligned position on the head of the drive circuit board on the attaching surface of drive circuit board in extracting about drive circuit board; And come relatively moving of control head based on the information that in the aligned position information obtaining step of the aligned position information obtaining step of eye mark and drive circuit board, obtains, make the aligned position of drive circuit board to aim at the aligned position of eye mark.

Description of drawings

From the detailed description of making, will understand above and other objects of the present invention, feature and advantage more below in conjunction with accompanying drawing, wherein:

Fig. 1 is the skeleton view of explanation substrate.

Fig. 2 is the perspective illustration of explanation according to the CBF case type shell of an one exemplary embodiment of prior art.

Fig. 3 is the schematic front view that explanation comprises the CBF supply equipment of CBF case type shell.

Fig. 4 is the planimetric map of explanation according to the TCP junction apparatus of another one exemplary embodiment of prior art.

Fig. 5 is the synoptic diagram of explanation according to the junction apparatus of the drive circuit board of an one exemplary embodiment of the present invention.

Fig. 6 and 7 is respectively the pre-joint unit of key diagram 5 and the view of pushing the unit.

Fig. 8 and 9 be key diagram 7 push the unit on push the front view and the decomposition side view of unit.

Figure 10 and 11 are explanations according to another one exemplary embodiment of the present invention push the unit on push the decomposition side view of unit.

Figure 12 is the signal simulation drawing of explanation according to the mating system of the drive circuit board of another one exemplary embodiment of the present invention.

Figure 13 and 14 is respectively signal simulation drawing and the front view that the structure of the ACF adhesion unit that comprises in the mating system of Figure 12 is described.

Figure 15 and 16 is respectively signal simulation drawing and the front view that the structure of the pre-joint unit that comprises in the mating system of Figure 12 is described.

Figure 17 and 18 is respectively signal simulation drawing and the front view that the structure of pushing the unit that comprises in the mating system of Figure 12 is described.

Figure 19 is the planimetric map of explanation according to the CBF supply equipment of another one exemplary embodiment of the present invention.

Figure 20 and 21 is front view and side views of Figure 19.

Figure 22 is the skeleton view of the CBF case type shell shown in illustrative Figure 19.

Figure 23 is the exploded cross section views of Figure 22.

Figure 24 is the skeleton view of explanation according to the junction apparatus of the drive circuit board of another one exemplary embodiment of the present invention.

Figure 25 is the planimetric map of Figure 24.

Figure 26 is the skeleton view of header structure of explaining the junction apparatus of drive circuit board shown in Figure 24.

Figure 27 is the controlling party block diagram of the junction apparatus of explanation drive circuit board shown in Figure 24.

Figure 28 is the process flow diagram of joint method of the junction apparatus of explanation drive circuit board shown in Figure 24.

Figure 29 is the schematic plan view of explanation according to the junction apparatus of the drive circuit board of another one exemplary embodiment of the present invention.

Embodiment

Hereinafter, will describe the preferred embodiments of the present invention in detail referring to accompanying drawing.By referring to accompanying drawing with reference to embodiment to be described in detail, with the method for understanding each side of the present invention and feature and realizing described aspect and feature.Yet, the embodiment that the invention is not restricted to hereinafter disclose, but can implement by various forms.The specific detail that the content that defines in the description (for example, specifically constructing and element) just provides in order to help the present invention of one of ordinary skill in the art's complete understanding, and the present invention only defines within the scope of the appended claims.In to whole description of the present invention, among each figure, identical referenced drawings label is used to represent similar elements.

Hereinafter, substrate can be any substrate that can be used for the flat-panel display panel among LCD, PDP and the OLED.Circuit board can be FPC (flexible printed circuit, flexible print circuit), TCP (tape carriage package, band year encapsulation), PCB (printedcircuit board, printed circuit board (PCB)) any one and among the CBF (common block FPC, common piece FPC).

Fig. 5 is the synoptic diagram of explanation according to the junction apparatus of the drive circuit board of an one exemplary embodiment of the present invention.

Referring to Fig. 5, the junction apparatus 100 of drive circuit board comprises platform part 102, load/unload part 104, ACF adhesion unit 110, pre-joint unit 120 and final joint unit 130.

Platform part 102 receives substrate G (it is used for the flat-panel display panel on the substrate G upper surface) safely, and the substrate G that is received is moved to load/unload position, pre-depressed position and depressed position.

Load/unload part 104 is loaded into platform part 102 with substrate G, and the substrate G that finishes is unloaded to platform part 102.

ACF adhesion unit 110 cutting ACF (anisotropic conductive film) on the composition surface of ACF attached to substrate G, and push it.ACF is inserted between the composition surface of drive circuit board C and substrate G, and drive circuit board C is bonded on the composition surface of substrate G.

Referring to Fig. 6, pre-joint unit 120 comprises pre-joint unit 122.Pre-joint unit 122 comprises/below make progress on push unit 122b and lower support element 122a.

Pre-joint unit 122 gently with drive circuit board C by on the composition surface that is pressed in substrate G and it is fixed.On push unit 122b by the right cylinder in the top that is configured in pre-joint unit 122 last/below move up.Lower support element 122a is provided, makes the drive circuit board C of its area greater than pressurized.

In pre-joint unit 120, further provide visual unit (not shown) so that by each position of accurately measuring substrate G and drive circuit board C drive circuit board C is set on the exact position of composition surface of substrate G.Drive circuit board C should be accurately by the joint place that is pressed in substrate G.This is because need accurately grasp the position of substrate G and drive circuit board C, and therefore provides visual unit.Visual unit comprises the sighting device that is used to aim at the sighting device of substrate G and is used for driven in registry circuit board C.Substrate G accurately conforms to by using the positional information that is measured by two sighting devices with drive circuit board C.

Pre-joint unit 122 additionally comprises cartridge heater (not shown) so that the temperature of pre-joint unit 122 is brought up to proper temperature.Cartridge heater be installed in lower support element 122a and on push on the unit 122b, make the pre-joint that easily carries out drive circuit board C by when exerting pressure, improving the temperature of substrate G and drive circuit board C.

Referring to Fig. 7, final joint unit 130 comprise the automatic winding unit 160 of silicon chip, special teflon sheet automatic winding unit 160, on push unit 140 and unit 150 is pushed in support.

The automatic winding unit 160 of silicon chip is configured in the left side and the right side of pushing unit 140 respectively, and batches silicon chip automatically.The automatic winding unit 160 of special teflon sheet is configured in the left side and the right side of pushing unit 140 respectively, and batches special teflon sheet automatically.On push unit 140 by push on being configured in the unit 140 right cylinder and last/below move up, therefore and exert pressure to the direction of bottom on top from drive circuit board C.

Support pushes that unit 150 is configured in the downside of pushing unit 140 so that the bottom of support substrates G, and can last/below move up.

Between final joint aging time, substrate G that pushes in advance by pre-joint unit 120 and drive circuit board C be configured in final joint unit 130 on push unit 140 and support is pushed between the unit 150, and by on push moving down of unit 140 and be pressed.

Final joint unit 130 comprises to be configured in to be pushed unit 140 and supports to push electro-dissociator (not shown) on the pressure surface of unit 150, is used to remove substrate G and drive circuit board C goes up the ion that exists.

Fig. 8 be Fig. 7 final joint unit on push the front view of unit, and Fig. 9 be Fig. 4 final joint unit on push the decomposition side view of unit.

Referring to Fig. 8 and 9, on push that unit 140 comprises final conjugant 142, contact maker instrument 146, part 145 is regulated in the rotation highly regulating parts 144 and regulate the rotation of highly regulating parts 144.

Final conjugant 142 receives cylindrical driving force and pressing force is regulated parts 144 by a plurality of height transfer to contact maker instrument 146.Final conjugant 142 by last/move down and support to push the composition surface of the substrate G on the unit 150 and separate with described composition surface near being configured in.On the end portion of final conjugant 142, form the first threaded hole 142a that a plurality of inboards have screw thread, make that highly regulating parts 144 can be coupled to screw rod.

Referring to Fig. 9, contact maker instrument 146 comprises supporter 146b, well heater 146c and by pressure bar 146d.

On the upper part of supporter 146b, form the second threaded hole 146a, be used for spiral and be coupled to and highly regulate parts 144, and be used for the well heater 146c that heats by pressure bar 146d is installed in supporter 146b inside.

Before pushing substrate G, well heater 146c is to heating by pressure bar 146d, and when substrate G is pressed ACF by by pressure bar 146d with heat transferred to circuit board and substrate G, so that apply electric current and by ACF and contact with physical form by ACF.

Integrally be provided at by pressure bar 146d on the lower surface of supporter 146b.The lower surface (that is, pushing surface 147) of pressing pressure bar 146d contacts so that push the composition surface of substrate G with circuit board.

Regulate highly that parts 144 are coupled to contact maker instrument 146 and pre-engage body is pushed the displacements of surface 147 around composition surface with adjusting, to obtain the planarity of pushing surface 147 of contact maker instrument 146.A plurality of height adjusting parts 144 are provided and it is separated each other.What each regulated highly that parts 144 scalable push presumptive area in the surface 147 pushes surface 147 around the relative displacements of composition surface.

Highly regulating parts 144 comprises main body 144a, is provided at the first spiral part 144b on the upper part of main body 144a and is provided at the second spiral part 144c on the end portion of main body 144a.

The first spiral part 144b is integrally formed on the upper part of main body 144a.The screw thread of the screw thread equidirectional that in the circumference place of first spiral part forms inboard with the first threaded hole 142a that pushes main body 142, forms, but make the spiral part 144b that wins have the structure that spiral is coupled to the first threaded hole 142a.

The second spiral part 144c is integrally formed on the end portion of main body 144a.The screw thread of the screw thread equidirectional that in the circumference place of the second spiral part 144c forms inboard with the second threaded hole 146a of contact maker instrument, forms, but make the second spiral part 144c have the structure that spiral is coupled to the first threaded hole 146a.

The direction that is formed on the screw thread among the first threaded hole 142a and the first spiral part 144b is a left-hand thread (LHT), and the direction that is formed on the screw thread among the second threaded hole 146a and the second spiral part 144c is right-hand thread, so that form in an opposite direction each other.Certainly, opposite situation also is possible.

Rotation is regulated part 145 and is integrally formed, so as between the first spiral part 144b that highly regulates part 144 and the second spiral part 144c middle part of the longitudinal direction of main body 144a, give prominence to towards radial direction.Rotation is regulated part 145 and is had the six-sided nut shape, and can make and highly regulate part 144 clockwise or be rotated counterclockwise by for example using instruments such as spanner to apply moment of torsion.Rotation is regulated part 145 and is highly regulated part 144 and is integrally formed, but is not limited to this situation.Therefore, the rotation adjusting part 145 that is formed by separate part can be coupled to the main body 144a that highly regulates part 144.

Referring to Fig. 8 and 9, push the process of the planarity of pushing the surface of unit 140 on hereinafter will explaining in the final joint unit 130 of the junction apparatus 100 of regulating drive circuit board.

The pushing the surface and 147 should keep parallel that provides in the contact maker instrument 146 by pressure bar 146d so that constant pressure is applied to the overall composition surface of substrate G with composition surface.In other words, should keep the distance of totally pushing between surface 147 and the overall composition surface consistently.Yet, because the cause of the thermal deformation that error that mechanical treatment causes or well heater cause may not be kept the distance of pushing between surface 147 and the composition surface consistently.Thereby, should regulate the distance of pushing between surface 147 and the composition surface consistently.

Referring to Fig. 8, if right position of pushing surperficial 147b is higher than a left side and pushes surperficial 147a, that is to say, be longer than from a left side to the distance of composition surface and push the distance of surperficial 147a, so hereinafter will explain the method for regulating the planarity of pushing surface 147 to composition surface if push surperficial 147b from the right side.

Because each the first spiral part 144b and second spiral part 144c of highly controlling part 144 are made up of left-hand thread (LHT) and right-hand thread respectively, thus when making when highly controlling part 144 and being rotated counterclockwise, contact maker instrument 146 and finally conjugant 142 separate.

Be rotated counterclockwise by using spanner to make to be provided near the rotation of highly regulating in the part 144 pushing surperficial 147b on the right side to regulate part 145, make the right side push surface and final conjugant 142 separate the height of pushing the surface up to the right side become with a left side push surperficial height identical till.Then, the surface 147 of pushing of contact maker instrument 146 becomes the composition surface that is parallel to substrate G substantially.Be provided near the rotation of highly regulating in the part 144 pushing surperficial 147b on a left side and regulate part 145 and turn clockwise, make that pushing surperficial 147b can increase to the distance of composition surface from a left side.

Each spiral part 144b and 144c are provided at the upper and lower of the main body 144a that highly regulates parts 144 respectively, and rotation is regulated on the central area that part 145 is provided at the main body 144a that highly regulates parts 144 and highly regulated parts 144 so that apply torsion moment to.Then, regulate part 145 from rotation and compare with regular situation to the distance of spiral part 144b that highly regulates parts 144 and 144c and approximately reduce half, and be applied to by same torque that the stress of spiral part 144b and 144c is approximate to reduce half., compare with regular situation, the possibility of highly regulating parts 144 damages and warpage significantly reduces for this reason.

The spiral part 144b and the 144c that highly regulate parts 144 are provided at two positions, so that form screw thread each other in an opposite direction.Therefore, when the anglec of rotation of rotating adjusting part 145 is identical, contact maker instrument 146 approaching pre-engage body 142 or the distance increase that separates with pre-engage body 142, the feasible height of pushing surface 147 of regulating contact maker instrument 146 easily, and can be by shortening the production intermittence that the adjusting time shortens joint technology.

Hereinafter, will explain other one exemplary embodiment of the present invention.Hereinafter will omit for an one exemplary embodiment in the formation described and operate identical formation and the explanation of operation.

Figure 10 is according to the exploded perspective side view of pushing the unit on the final joint unit of another one exemplary embodiment of the present invention.

Pushing unit 240 on the final joint unit comprises and pushes main body 242, contact maker instrument 246, highly regulates parts 244 and part 245 is regulated in rotation.

The outside forms the threaded first spiral teat 242a and integrally is provided on the end portion of pushing main body 242.The outside forms the threaded second spiral teat 246a and integrally is provided on the top of contact maker instrument 246.

The threaded first threaded hole 244b of inboard formation is provided on the upper part of each main body 244a that highly regulates parts 244.The threaded second threaded hole 244c of inboard formation is provided on the end portion of main body 244a.

Push main body 242 and highly regulate parts 244 and can be coupled by the spiral between the first spiral teat 242a and the first threaded hole 244b.Highly regulating parts 244 and contact maker instrument 246 can be coupled by the spiral between the second threaded hole 244c and the second spiral teat 246a.

Be formed between the first spiral teat 242a and the first threaded hole 244b and the second threaded hole 244c and the second spiral teat 246a between screw thread each other in an opposite direction.Therefore, highly regulate parts 244 clockwise or be rotated counterclockwise contact maker instrument 146 is separated near pre-engage body 142 or with pre-engage body 142 by making, and can push surface 247 relative displacements by what a plurality of height of suitable adjusting regulated that parts 244 regulate contact maker instrument 246 with respect to composition surface.

Figure 11 be explanation according to another one exemplary embodiment of the present invention push the unit on push the decomposition side view of unit.

Referring to Figure 11, as above-mentioned embodiment, the middle part that part 345 is formed on the main body 344a that highly regulates parts 344 is in a longitudinal direction regulated in rotation.Yet different with described embodiment, a pair of instrument inserts groove 345 and is provided on the direction perpendicular to central shaft.The swingle instrument that is inserted into inserts in the groove 345, makes that highly regulating parts 344 can clockwise or be rotated counterclockwise.Therefore, can regulate parts 344 by a plurality of height of suitable adjusting and regulate surperficial 347 the relative displacements of pushing of contact maker instrument 346 with respect to composition surface.

In the above-described embodiments, the junction apparatus of drive circuit board comprises pre-joint unit and final junction apparatus.Push the unit comprise final junction apparatus on push the unit.Junction apparatus according to drive circuit board of the present invention can be pre-joint unit itself or final joint unit itself.If the junction apparatus according to drive circuit board of the present invention is pre-junction apparatus, the unit of pushing so according to the present invention can be pre-joint unit.

Figure 12 is the simulation drawing of illustrative according to the mating system of the drive circuit board of another one exemplary embodiment of the present invention.Figure 13 is the signal simulation drawing that the structure of the ACF adhesion unit that comprises in the mating system of Figure 12 is described.Figure 14 is the front view that the structure of the ACF adhesion unit that comprises in the mating system of Figure 12 is described.Figure 15 is the signal simulation drawing that the structure of the pre-joint unit that comprises in the mating system of Figure 12 is described.Figure 16 is the front view that the structure of the pre-joint unit that comprises in the mating system of Figure 12 is described.Figure 17 is the signal simulation drawing that the structure of pushing the unit that comprises in the mating system of Figure 12 is described.Figure 18 is the front view that the structure of pushing the unit that comprises in the mating system of Figure 12 is described.

The mating system 400 of drive circuit board comprises: ACF adhesion unit 410, and it is attached to substrate G with anisotropic conductive film (ACF); Pre-joint unit 420, it is fixed on drive circuit board C on the substrate G that is attached with ACF; Final joint unit 430, it is final to engage by pre-joint unit 420 and is fixed on drive circuit board C on the substrate G; And transfer equipment, its be provided between ACF adhesion unit 410 and the pre-joint unit 420 respectively and pre-joint unit 420 with finally between the joint unit 430.

Referring to Figure 12, ACF adhesion unit 410 comprises: worktable 411a and 411b, its support substrates G; Loading and unloading unit 412a and 412b, substrate G is loaded in worktable 411a for it and 411b goes up or unload substrate G from worktable 411a and 411b; ACF adhesion unit 415, it is adhered to the substrate G that is loaded on worktable 411a and the 411b with ACF and corresponding to the working cell of ACF adhesion unit 410; And control module (not shown), it controls the work of ACF adhesion unit 410 substantially.

Substrate G is placed on the upper surface of worktable 411a and 411b.Worktable 411a and 411b to-and-fro movement between load/unload part 412a and 412b and ACF adhesion unit 415 by mobile guide member 111.Need worktable 411a and 411b vacuum absorption substrate G so that support substrates G stably.For this reason, need form the vacuum absorption hole that is communicated with vacuum pump (not shown) at worktable 411a and 411b place, but be not limited to this situation.

Worktable 411a and 411b comprise the first worktable 411a and the second worktable 411b.Two worktable 411a and 411b correspond respectively to first and second load/unload unit 412a and the 412b, make two work (that is, ACF adheres to the load/unload work of work and substrate G) carry out simultaneously.

Load/unload part 412a and 412b comprise the first load/unload part 412a and the second load/unload part 412b, and its two ends that are provided at ACF adhesion unit 415 are so that toward each other.The first load/unload part 412a is corresponding to the first worktable 411a, and at the first load/unload part 412a place, substrate G is loaded on the first worktable 411a, or from first worktable 411a unloading substrate G.Similarly, the second load/unload part 412b is corresponding to the second worktable 411b, and at the second load/unload part 412b place, substrate G is loaded on the second worktable 411b, or from second worktable 411b unloading substrate G.

ACF adhesion unit 415 with ACF cutting, adhere to and by being pressed on the substrate G.As shown in figure 14, ACF adhesion unit 415 comprises: film cutter unit 416, and it cuts into required size with ACF; Boundary belt is peeled off unit 417, and its ACF from cutting peels off boundary belt; Film mobile unit 418, its ACF with cutting moves to attachment region; With film adhesive unit 419, it is adhered to substrate G with ACF.

Need film cutter unit 416 ACF to be cut into essential size, but be not limited to this situation by incomplete cutting method.Boundary belt is peeled off unit 417 and is peeled off the boundary belt of covering so that protection ACF makes it not be subjected to the influence of airborne moisture or foreign matter.Film adhesive unit 419 ACF is bonded on the adhesive surface of substrate G and apply heat and pressure so that bonding ACF.

Control module is controlled the electricity and the mechanically actuated of ACF adhesion unit 410 substantially.Control module comprise digital signal processor (digital signal processor, DSP), microprocessor and micro-control unit etc., or can be by wherein any one is formed.To explain the control procedure of control module with the principle of work and power of ACF adhesion unit 410.

Referring to Figure 13, if the first substrate G1 is placed on the upper surface of the first worktable 411a, the first worktable 411a vacuum absorption, the first substrate G1 so, and under the stable support state, follow mobile guide member 414 and enter in the ACF adhesion unit 415.If the first substrate G1 enters in the ACF adhesion unit 415, film cutter unit 416 cuts into appropriate size with ACF so, and peels off unit 417 by boundary belt and ACF moved to film adhesive unit 419 peeling off under the state.Film adhesive unit 419 by push ACF with ACF attached on the first substrate G1.

When carrying out this work, the second substrate G2 is loaded on the second worktable 411b that is positioned at the second load/unload part 412b place.

As shown in figure 13, if ACF attached on the first substrate G1, the first worktable 411a follows mobile guide member 414 and moves to the first load/unload part 412a so.Simultaneously, the second worktable 411b follows mobile guide member 414 and enters in the ACF adhesion unit 415.If the second substrate G2 enters in the ACF adhesion unit 415, film cutter unit 416 cuts into appropriate size with ACF so, and peels off unit 417 by boundary belt and ACF moved to film adhesive unit 419 peeling off under the state.Film adhesive unit 419 by push ACF with ACF attached on the second substrate G2.

In the work of carrying out the second substrate G2, unload the first substrate G1 from the first worktable 411a that is positioned at the first load/unload part 412a, and load the 3rd substrate (G3, shown in Figure 12).

Similarly, if ACF attached on the second substrate G2, the second worktable 411b follows mobile guide member 414 and moves to the second load/unload part 412b so, and the first worktable 411a follows mobile guide member 414 and enters in the ACF adhesion unit 415.When with ACF when being loaded in the 3rd substrate G3 on the first worktable 411a and going up, unload the second substrate G2 from the second worktable 411b, and load the 4th substrate (G4, shown in Figure 12).

Control module control ACF adhesion unit 410 is so that repeatedly carry out said procedure continuously.

Referring to Figure 15, pre-joint unit 420 comprises: worktable 421a and 421b; Load/unload part 422a and 422b, it is loaded in substrate G1 on worktable 421a and the 421b; Pre-joint unit 425, it is corresponding to the working cell of pre-joint unit 420, and wherein drive circuit board is fixed on the substrate G that is loaded on worktable 421a and the 421b; And control module (not shown), it controls the operation of pre-joint unit 420 substantially.

Explanation for worktable 421a and 421b and load/unload part 422a and 422b will be suitable equally with the explanation in the ACF adhesion unit 410.

Referring to Figure 16, pre-joint unit 425 comprises pre-joint unit 426, and it is pushed drive circuit board C insecurely and be fixed on the substrate G.Pre-joint unit 426 comprise support substrates G the bottom lower support element 427 and the last pressurizer 428 of pressure is provided from the top of substrate G.Last pressurizer 428 can be applied to pressure on the drive circuit board C by air pressure or hydraulic actuators.Yet the work of considering substrate G is to carry out in needing the clean room of high cleanliness, and more desirable is by driver elements such as for example linear motors pressure to be applied to drive circuit board C.

Control module is controlled the electricity and the mechanically actuated of pre-joint unit 420 substantially.Referring to Figure 15, will explain the control procedure of control module with the principle of work and power of pre-joint unit 420.

If the first substrate G1 is placed on the upper surface of the first worktable 421a, the first worktable 421a vacuum absorption, the first substrate G1 so, and under the stable support state, follow mobile guide member 424 and enter in the pre-joint unit 425.If the first substrate G1 enters in the pre-joint unit 425 and is placed on the lower support element, drive circuit board C is placed on the top of the first substrate G1 so, and last pressurizer 428 moves and applies lower temperature and pressure with downward direction, whereby drive circuit board C is fixed on the first substrate G1.

When carrying out this work, the second substrate G2 is loaded in is placed on the second worktable 421b that the second load/unload part (422b) locates.

If drive circuit board C is fixed on the first substrate G1, the first worktable 421a follows mobile guide member 424 and moves to the first load/unload part (422a) so.Simultaneously, the second worktable 421b follows mobile guide member 424 and enters in the pre-joint unit 425.If the second substrate G2 enters in the pre-joint unit 425 and is placed on the lower support element 427 of pre-joint unit, drive circuit board C is placed on the top of the second substrate G2 so, and last pressurizer 428 moves and applies lower temperature and pressure with downward direction, whereby drive circuit board C is fixed on the second substrate G2.

In the work of carrying out the second substrate G2, unload the first substrate G1 from the first worktable 421a that is placed on the first load/unload part (422a), and load the 3rd substrate G3.

Similarly, if drive circuit board C is fixed on the second substrate G2, the second worktable 421b follows mobile guide member 424 and moves to the second load/unload part (422b) so.Then, the first worktable 421a follows mobile guide member 414 and enters in the pre-joint unit 425.When with drive circuit board C attached to the 3rd substrate G 3 that is loaded on the first worktable 411a on the time, unload the second substrate G2 from the second worktable 411b, and load the 4th substrate G4.

Control module is controlled pre-joint unit 420 so that repeatedly carry out same program continuously.In the past, in the work of carrying out at a substrate, can't carry out any other work.Therefore, shortened and produced intermittently, and can improve low process efficiency.

Referring to Figure 17, final joint unit 430 comprises: worktable 431a and 431b, its support substrates G; Load/unload part 432a and 432b, substrate G1 is loaded in worktable 431a for it and 431b goes up and unload substrate G1 from worktable 431a and 431b; Final assembling parts 435, it is corresponding to the working cell of final joint unit 430, and wherein drive circuit board finally is bonded on the substrate G that is loaded on worktable 431a and the 431b; And control module (not shown), it controls the operation of final joint unit 430 substantially.

Explanation for worktable 431a and 431b and load/unload part 432a and 432b will be suitable equally with the explanation in the ACF adhesion unit 410.

Referring to Figure 18, final joint unit 435 comprises the lower support element 436 of the bottom of support substrates G, with exert pressure from the top of substrate G so that drive circuit board C finally is bonded on the last pressurizer 437 on the substrate G and heat is applied to the well heater (not shown) of lower support element 436 and last pressurizer 437.Last pressurizer 437 can be applied to pressure on the drive circuit board C by air pressure or hydraulic actuators.Yet the work of considering substrate G is to carry out in needing the clean room of high cleanliness, and more desirable is by driver elements such as for example linear motors pressure to be applied to drive circuit board C.Well heater is applied to lower support element 436 and last pressurizer 437 with heat of high temperature.Need described temperature in standard temperature to 350 ℃ scope.

Control module is controlled the electricity and the mechanically actuated of final joint unit 430 substantially.Referring to Figure 17, will explain the control procedure of control module with the principle of work and power of final joint unit 430.

If the first substrate G1 is placed on the upper surface of the first worktable 431a, the first worktable 431a vacuum absorption, the first substrate G1 so, and under the stable support state, follow mobile guide member 434 and enter in the final assembling parts 435.If the first substrate G1 enters in the final assembling parts 425 and is placed on the lower support element 436, go up pressurizer 437 so and move with downward direction, and well heater applies high temperature so that apply high pressure, make drive circuit board C fully by being pressed on the first substrate G1.

When carrying out this work, the second substrate G2 is loaded in is placed on the second worktable 431b that the second load/unload part (432b) locates.

If drive circuit board C finally is bonded on the first substrate G1, the first worktable 431a follows mobile guide member 434 and moves to the first load/unload part (432a) so.Simultaneously, the second worktable 431b follows mobile guide member 434 and enters in the final assembling parts 435.If the second substrate G2 enters in the final assembling parts 425 and is placed on the lower support element 436, go up pressurizer 437 so and move with downward direction so that apply high pressure and apply high temperature by well heater, make drive circuit board C fully by being pressed on the second substrate G2.

In the work of carrying out the second substrate G2, unload the first substrate G1 from the first worktable 431a that is placed on the first load/unload part 432a, and load the 3rd substrate G3.

Similarly, if drive circuit board C finally is bonded on the second substrate G2, the second worktable 431b follows mobile guide member 434 and moves to the second load/unload part 432b so.Then, the first worktable 431a follows mobile guide member 434 and enters in the final assembling parts 435.In the time of on drive circuit board C finally being bonded on the 3rd substrate G3 that is loaded on the first worktable 431a, unloading the second substrate G2 from the second worktable 431b, and load the 4th substrate G4.

Control module is controlled final joint unit 430 so that repeatedly carry out same program continuously.In the past, in the work of carrying out at a substrate, can't carry out any other work.Therefore, can solve intermittently increase and the low problem of process efficiency of producing.

A pair of loading bin 440 be provided between ACF adhesion unit 410 and the pre-joint unit 420 and pre-joint unit 420 with finally between the joint unit 430.Hereinafter, four loading bins 440 shown in Figure 12 are with simple called after first to the 4th loading bin 441,442,443 and 444.First loading bin 441 brings substrate G from substrate supply equipment 450, so that substrate G is loaded on the first worktable 411a of the first load/unload part 412a of ACF adhesion unit 410, and finished the substrate G that ACF adheres to, and the substrate G that finishes is loaded on the first worktable 421a at the first load/unload part 422a place that is placed on pre-joint unit 420 from the first worktable 411a unloading of the first load/unload part 412a that is placed on ACF adhesion unit 410.Provide second loading bin 442 so that relative with first loading bin 441, second loading bin 442 is carried out and first loading bin, 441 identical functions with respect to the second load/unload part 412a.

The 3rd loading bin 443 is fixed with the substrate G of drive circuit board C from the first worktable 421a unloading of the first load/unload part 422a that is placed on pre-joint unit 420, and the substrate G that finishes is loaded on the first worktable 431a at the first load/unload part 432a place that is placed on final joint unit 430.Provide the 4th loading bin 444 so that relative with the 3rd loading bin 443, the 4th loading bin 444 is carried out and the 3rd loading bin 443 identical functions with respect to the second load/unload part 422b.

The loading bin 440 that is used for the mating system 400 of drive circuit board comprises absorptive unit (not shown), it can absorb substrate G, and through constituting so that from load/unload part absorption substrate G, and by rotating to predetermined angular substrate G is loaded on other load/unload part, but be not limited to this situation around turning axle.The loading bin that is generally used for the automatic process system can be suitable equally, and can through constitute with by travelling belt etc. with substrate G from a load/unload parts transfer to other load/unload part.Therefore, the loading bin 440 that is used for this one exemplary embodiment can be implemented with various forms by the those skilled in the art, but all design variation all comprise within the scope of the appended claims.

Hereinafter will explain the principle of work and power of the mating system 400 of drive circuit board in detail.The pre-joint technology of the film attach process for ACF adhesion unit 410, pre-joint unit 420 and the finally explanation of the final joint technology of joint unit 430 will be omitted.

First loading bin 441 absorbs the first substrate G1 of substrate feeding unit 450, and the first substrate G1 is loaded on the first worktable 411a at the first load/unload part 412a place that is placed on ACF adhesion unit 410.The first worktable 411a that is mounted with the first substrate G1 follows mobile guide member 414 and enters in the ACF adhesion unit 415.When ACF went up attached to the first substrate G1, second loading bin 442 absorbed the second substrate G2, and the second substrate G2 is loaded on the second worktable 411b at the second load/unload part 412b place that is placed on ACF adhesion unit 410.

If film is fixed on the first substrate G1, the first worktable 411a follows mobile guide member 414 and moves to the first load/unload part 412a so.Simultaneously, the second worktable 411b that is mounted with the second substrate G2 follows mobile guide member 414 and enters in the ACF adhesion unit 415.When ACF adhesion unit 415 ACF of place attached to the second substrate G2 on the time, first loading bin 441 absorbs the first substrate G1 that is loaded on the first worktable 411a, and the first substrate G1 is loaded on the first worktable 421a at the first load/unload part 422a place that is placed on pre-joint unit 420.First loading bin 441 absorbs the 3rd new substrate G3 from substrate supply equipment 450, and the 3rd substrate G3 is loaded on the first worktable 411a at the first load/unload part 412a place that is placed on ACF adhesion unit 420.

If film is fixed on the second substrate G2, the second worktable 411b follows mobile guide member 414 and moves to the second load/unload part 412b so.Simultaneously, the first worktable 411a that is mounted with the 3rd substrate G3 follows mobile guide member 414 and enters in the ACF adhesion unit 415.When ACF adhesion unit 415 ACF of place attached to the 3rd substrate G3 on the time, second loading bin 442 absorbs the second substrate G2 that is loaded on the second worktable 411b, and the second substrate G2 is loaded on the second worktable 421b at the second load/unload part 422b place that is placed on pre-joint unit 420.Second loading bin 442 absorbs the 4th new substrate G4, and the 4th substrate G4 is loaded on the second worktable 411b at the second load/unload part 412b place that is placed on ACF adhesion unit 410.

Finish film and adhere to after the work, the first worktable 421a that is mounted with the first substrate G1 above follows mobile guide member 424 and enters in the pre-joint unit 425.When pre-joint unit 425 drive circuit board C of place attached to the first substrate G1 on the time, second loading bin 442 will have been finished the second substrate G2 that film adheres to work and be loaded on the second worktable 421b at the second load/unload part 422b place that is placed on pre-joint unit 420.

If drive circuit board C is fixed on the first substrate G1, the first worktable 421a follows mobile guide member 424 and moves to the first load/unload part (42a) so.Simultaneously, the second worktable 421b that is mounted with the second substrate G2 follows mobile guide member 424 and enters in the pre-joint unit 425.When the pre-joint unit 415 drive circuit board C of place attached to the second substrate G2 on the time, the 3rd loading bin 441 absorbs the first substrate G1 that is loaded on the first worktable 421b, and the first substrate G1 is loaded on the first worktable 431a at the first load/unload part 432a place that is placed on final joint unit 430.First loading bin 441 absorbs the 3rd substrate G3 from the first worktable 411a of the first load/unload part 412a that is placed on ACF adhesion unit 410, and the 3rd substrate G3 is loaded on the first worktable 421a of pre-joint unit 420.

If drive circuit board C is fixed on the second substrate G2, the second worktable 421b follows mobile guide member 424 and moves to the second load/unload part 422b so.Simultaneously, the first worktable 411a that is mounted with the 3rd substrate G3 follows mobile guide member 414 once more and enters in the pre-joint unit 415.When the pre-joint unit 415 drive circuit board C of place attached to the 3rd substrate G3 on the time, the 4th loading bin 444 absorbs the second substrate G2 that is loaded on the second worktable 421b, and the second substrate G2 is loaded on the second worktable 421b at the second load/unload part 432b place that is placed on final joint unit 430.Second loading bin 442 absorbs from the second worktable 411b of the second load/unload part 412b that is placed on ACF adhesion unit 410 have been finished film and has adhered to the 4th substrate G4 of work, and the 4th substrate G4 is loaded on the second worktable 421b at the second load/unload part 412b place that is placed on ACF adhesion unit 410.

Finish film and adhere to after the work, the first worktable 421a that is mounted with the first substrate G1 above follows mobile guide member 424 and enters in the pre-joint unit 425.When pre-joint unit 425 drive circuit board C of place attached to the first substrate G1 on the time, second loading bin 442 will have been finished the second substrate G2 that film adheres to work and be loaded on the second worktable 421b at the second load/unload part 422b place that is placed on pre-joint unit 420.

Finish after the pre-joint work of drive circuit board C, the first worktable 431a that is mounted with the first substrate G1 above follows mobile guide member 434 and enters in the final joint unit 435.When the final joint unit 435 drive circuit board C of place finally attached to the first substrate G1 on the time, the 4th loading bin 444 absorbs the second substrate G2 of the pre-joint work of having finished drive circuit board C from the second worktable 421b of pre-joint unit 420, and the second substrate G2 is loaded on the second worktable 431b of final joint unit 430.

If drive circuit board C finally is bonded on the first substrate G1, the first worktable 431a follows mobile guide member 424 and moves to the first load/unload part (432a) so.Simultaneously, the second worktable 431b that is mounted with the second substrate G2 follows mobile guide member 434 and enters in the final joint unit 435.When at final joint unit 435 places, drive circuit board C finally is bonded on the second substrate G2 when going up, and the 3rd loading bin 443 has been finished the first substrate G1 of all working above the first worktable 431b absorbs, and the first substrate G1 is moved to panel output unit 460.The 3rd loading bin 443 has been finished the 3rd substrate G3 of the pre-joint work of drive circuit board C above the first worktable 421b absorption of pre-joint unit 420, and the first substrate G1 is loaded on the first worktable 431a of final joint unit 430.

If drive circuit board C finally is bonded on the second substrate G2, the second worktable 431b follows mobile guide member 434 and moves to the second load/unload part 432b so.Simultaneously, the first worktable 431a that is mounted with the 3rd substrate G3 follows mobile guide member 434 once more and enters in the final joint unit 435.When at final joint unit 435 places, when drive circuit board C finally is bonded on the 3rd substrate G3, finished the second substrate G2 of all working above the 4th loading bin 444 absorbs, and the second substrate G2 has been moved to panel output unit 460.The 4th loading bin 444 has been finished the 4th substrate G4 of the pre-joint work of drive circuit board C above the second worktable 421b absorption of pre-joint unit 420, and the 4th substrate G4 is loaded on the second worktable 431b of final joint unit 430.

By repeating above-mentioned technology continuously, with ACF attached on the substrate G, and with drive circuit board C fixing and final the joint, thereby can finish the circuit board joint work of substrate G.In the mating system 100 according to the drive circuit board of this one exemplary embodiment, in worktable of operation, loading or unloading substrate on another worktable makes whereby to produce intermittently and shortens half and significantly improve process efficiency.

Explain the some loading bins that absorb panel by the robots arm in the above-mentioned one exemplary embodiment, but be not limited to this situation.Can proceed to next technology automatically by travelling belt etc. if finished the panel of a technology above, can use the loading bin of any kind so.

Figure 19 is the planimetric map of explanation according to the CBF supply equipment of another one exemplary embodiment of the present invention.Figure 20 is the front view of Figure 19, and Figure 20 is the side view of Figure 19.Figure 22 is the skeleton view of the CBF case type shell shown in illustrative Figure 19.Figure 23 is the exploded cross section views of Figure 22.

Can use according to drive circuit board supply equipment of the present invention so that for example drive circuit boards such as PCB (printedcircuit board, printed circuit board (PCB)), FPC, TCP and CBF are fed to for example flat-panel display panel of PDP, LCD, OLED and VFD.Yet,, hereinafter will only explain the situation of supply CBF for the ease of explaining.

Referring to Figure 19 and 23, CBF supply equipment 500 comprise four case type shells 510 admitting a plurality of lamination big envelopes 3, four case type shells 510 of configuration make its plate with equal angles 520, make plate 520 in a circumferential direction along the rotary drive unit 550 of axle core 551 rotations, remove and treat lamination and be received in the electro-dissociator of the static of the CBF 3 in the case type shell 510, case type shell 510 is fixed on the anchor clamps on the plate 520 and collects the collection box of the defectiveness circuit board of defective CBF 3.

Four case type shells 510 have rectangular shape, and are configured to equal angles around circumferencial direction onboard.Shown in Fig. 7 and 8, each case type shell 510 comprises: first shell body 511, and it has the predetermined admittance space of 1,300 CBF 3 that treats lamination usually; Second shell body 515, it is coupled to the lower surface of first shell body 511; Support part 517, it supports through lamination to be received in the CBF 3 in first shell body 511; With elastomeric element 518, it is coupling between the upper surface of the lower surface of support part 517 and second shell body 515 so that predetermined elastic force to be provided, and makes to be pressed in CBF 3 in the support part 517 to outside accommodating layer.

The unloading unit 512 that has unloaded monolithic CBF 3 is provided on the upper surface of first shell body 511, and a plurality of locking ridge 513 is provided at round lamination CBF 3 on the upper area of four inside surface of side wall of first shell body 511.Opening 514 is provided at each surface of four sidewalls and goes up the path that can flow through with the ion that forms the static that produces between the removal CBF 3.Hereinafter will explain in detail this.

Especially, some CBF 3 on the top that arrives first shell body are separated and supported to locking ridge 513, makes and can supply monolithic CBF 3 according to the lamination order of CBF 3.

When rising successively when the operation of the elastomeric element 518 of the bottom of support part 517 by being coupled to support part 517, the monolithic CBF 3 in the locking ridge 513 to progressively moving, and finally is unloaded to the outside by unloading unit with upward.Xie Zai CBF 3 does not transfer to the pre-joint of substrate and engages the working position by the transfer equipment of for example mechanical arm (not shown), and described transfer equipment comes transfer object by using vacuum absorption.

As mentioned above, four case type shells are configured on the plate 520 with equal angles.Because about 1300 lamination CBF 3 are received in the case type shell, so about 5200 CBF 3 of CBF supply equipment 500 receivabilities.

After about 200 to 300 CBF 3 of conventional CBF supply equipment (referring to Fig. 3) supply, the workman must manually reconfigure CBF 3 in the framework (referring to Fig. 3) of predetermined CBF supplies trays 30.Yet,,, allow significantly to improve operating efficiency whereby so the amount of the CBF 3 that can supply is higher than the supply of conventional CBF 3 far away because every circulation can be supplied 5200 CBF 3 altogether in this one exemplary embodiment.Although conventional case type shell 10 (referring to Fig. 2) can be fed to CBF 3 75 substrate G, but the CBF supply equipment 500 that comprises case type shell 510 in this one exemplary embodiment can be fed to about 1700 substrate (G with CBF 3 based on calculated value, referring to Fig. 2), and do not need special change or manual work, significantly improve operating efficiency whereby.

Rotary drive unit 550 makes plate 520 rotations of supporting case type shell 510, makes four case type shells circulate successively so that carry out predetermined work.Rotary drive unit 550 can make plate 520 around 551 rotations of axle core.

Each case type shell 510 is not supplied CBF 3 simultaneously.On the zone that case type shell 510 is rotated by rotary drive unit 550, exist first workstation (#1) and second to treat station (#2, #3 and #4) to the fourth class.When a case type shell 510 when first workstation (#1) locates to supply about 1300 CBF3, be placed on second and treat that to the fourth class three case type shells 510 that station (#2, #3 and #4) is located remain on waiting status.Finish if be placed on the CBF3 supply work of the case type shell of locating at the first wait station (#1) 510, supply all lamination CBF 3 that are received in other case type shell 510 by being rotated counterclockwise 90 degree so in the same way.

Because CBF 3 is films, so the problem that exists is can produce static between the CBF 3, and be not easy to supply one by one monolithic.Therefore, electro-dissociator 540 is installed in the zone that is adjacent to first workstation (#1).

Electro-dissociator 540 prevents to cling between the CBF 3 by spraying negatively charged ions so that remove from the static between the CBF 3 of case type shell 510 supplies by discharge to the opening on four wall surfaces that are provided at case type shell 510 514.Because electro-dissociator 540 is to opening 514 ejected ion of side direction or CBF 3, so almost can remove the static that exists on the CBF 3.The CBF 3 that has removed static passes through the interior zone and the locking ridge 513 of first shell body 511 with chip slice status, and finally can chip slice status pass through unloading unit 512.Electro-dissociator is installed is removed static, but also can use air gun to remove static.

Anchor clamps 560 are installed in the contact area of each case type shell 510 and plate 520 in the CBF supply equipment 500.Anchor clamps 560 are coupled to case type shell 510 and plate 520 forcefully, make case type shell 510 can slave plate 520 not move or vibrate, and if necessary, case type shell 510 are separated with plate 520.If finish a circulation of supply work in CBF supply equipment 500, lamination CBF 3 should be once again received in the case type shell so, because may be easy to work at case type shell 510 and plate 520 after separatings.

The collection box 570 of defectiveness circuit board is provided at the position that is adjacent to first workstation (#1) in the CBF supply equipment 500.The collection box 570 of defectiveness circuit board is collected defective CBF 3, prevents that whereby defective CBF 3 is pre-attached to substrate.The defectiveness circuit board mean CBF 3 because of the cause of static with multi-disc but not the form of monolithic provide, or CBF 3 has broken parts.

Hereinafter will explain the method for operating of CBF supply equipment 500.

At first, the CBF heap is filled into the predetermined altitude of four case type shells 510.Admit each case type shell 510 of lamination CBF to be configured on the plate 520 so that be coupled to plate 520 by anchor clamps 560.Each case type shell 510 by be positioned at by rotary drive unit 550 swivel plates 520 first workstation (#1) and second to the fourth class treat the station (#2, #3 and #4) locate.

Be placed on the case type shell 510 that first workstation (#1) locates and supply monolithic CBF 3 by the elastic force that is provided at the elastomeric element 518 in the case type shell 510 via unloading unit 512.The support part 517 that is provided in first shell body 511 supports a plurality of CBF 3, and rises on the direction that separates with second shell body 515 successively by the elastic force of elastomeric element 518.At this moment, must use elastomeric element 518 and eject monolithic CBF 3 via unloading unit 512 with suitable elasticity coefficient.

According to moving up of the CBF 3 that is piled up by support part 517, a plurality of locking ridge 513 on the inner wall surface of the upper area by being provided at first shell body 511 are separated monolithic CBF 3.A plurality of locking ridge 513 are used for by more definitely CBF 3 being divided into monolithic via unloading unit 512 supply monolithic CBF 3.That is to say, although locking ridge 513 (being provided at the locking ridge on the bottom among Figure 23) is caught described a plurality of CBF 3 when CBF 3 arrives for the first time, but CBF 3 is caught during moving to next locking ridge 513 once more, and in addition, CBF 3 is caught again during moving to next locking ridge 513, makes CBF 3 be divided into monolithic more definitely.

At this moment, can be by ion being supplied to the opening 514 on the wall surface that is provided at first shell body 511, and remove the static that exists between the CBF by discharge, provide the monolithic CBF 3 that has removed static via unloading unit 512 whereby.

Rise to by the elastic force of elastomeric element 518 after thereby the top supplied all CBF 3 that are stacked in the case type shell 510 at support part 517, this support part separates 90 degree by rotary drive unit 550 and is configured in case type shell 510 rotation counterclockwise that second workstation (#2) is located so that make, and case type shell 510 is positioned at first workstation (#1) locates, and carry out aforesaid supply work similarly.At this moment, can carry out supply work continuously, and can be owing to treating to pile up CBF 3 once more and interrupt in the case type shell 510 at station (#4) being configured to the fourth class.

So, because tens times CBF3 of the conventional supply equipment of CBF 3 supply equipments 500 receivabilities, so not only make the work efficiency maximization, but also there is a benefit, can not employ the routine operation personnel to dispose CBF 3, because with to need operating personnel to dispose the conventional CBF supply equipment (shown in Fig. 2 and 3) of CBF continually different, CBF 3 heaps can directly be stacked in a plurality of case type shells 510.

In the above-described embodiments, case type shell is coupled to circular slab and by rotating driver rotation, but can carry out CBF supply work by a plurality of case type shells that the track that moves along straight line is coupled to by removable drive in driving.

In addition, in described embodiment, always have four case type shells and be coupled to plate, but the number of case type shell may be greater or less than four.

Figure 24 is the skeleton view of explanation junction apparatus of the drive circuit board of another one exemplary embodiment according to the present invention, and Figure 25 is the planimetric map of Figure 24, and Figure 26 is the skeleton view of header structure of the junction apparatus of explanation drive circuit board shown in Figure 24, and Figure 27 is the controlling party block diagram of the junction apparatus of drive circuit board shown in Figure 24, and Figure 28 is the process flow diagram of joint method of the junction apparatus of explanation drive circuit board.The attaching surface 611 in order clearly to explain the drive circuit board among Figure 24 to 26 only is to illustrate the number of attaching surface 611 than peanut.

,, will only explain the junction apparatus and the joint method of drive circuit board herein, and therefore, the junction apparatus of drive circuit board is called the TCP junction apparatus at the situation of adhering to TCP for the ease of explaining.

As shown in the figure, TCP junction apparatus 600 comprises: whirligig 630, and it can be around the rotation of axle core; Four enemies 650, it is coupled to lower surface of whirligig 630 so that rotated by whirligig 630, and with on the TCP attaching surface 611 of TCP 6 attached to substrate G; Aligned position detecting unit 660, it is used to obtain about the information of the aligned position of TCP 6 with about the information of the aligned position of the eye mark 615 on the TCP attaching surface 611 that is formed on substrate G; With control module 680, its information that obtains based on aligned position detecting unit 660 is come control head 650 moving with respect to whirligig 630.

Herein, TCP 6 is configured in the periphery of whirligig 630, and by shifting by 650 extracting.Aligned position detecting unit 660 comprises: TCP aims at vision camera 661, and it is used to obtain the information about the aligned position of TCP 6; With two pairs of eye markers align vision camera 665, it is used to obtain the information about the aligned position of the eye mark on the TCP attaching surface 611 that is formed on substrate G.

In addition, according to described situation, aligned position detecting unit 660 can comprise substrate alignment vision camera 663, and it is used to obtain about the information of the aligned position of entire substrate G so that improve the accuracy of adhering to work.Hereinafter will make an explanation to this.

At first, whirligig 630 rotates regularly around axle core 631, and work is adhered in feasible four correct 650 execution of being coupled to the lower surface of whirligig 630.

650 directly load and aim at TCP 6, and TCP 6 is attached to the TCP attaching surface 611 of substrate G and waits for task again.Always have four enemies 650 and be coupled to the lower surface of whirligig 630, but be not limited to this situation.Hereinafter, for the ease of explaining, four enemies 650 are called first to four-head 651,652,653 and 654.The attach process of all is carried out successively and is identical in fact.Therefore, with the attach process of mainly explaining first 651, and with brief explanation or omit other attach process of 652,653 and 654.

First 651 by the rotation of whirligig 630 successively circulation aim at station (#20), TCP through TCP loading depot (#10), TCP and adhere to station (#30) and recovery/wait stand (#40).Each station (#10 is to #40) expression is corresponding to the precalculated position of four enemies 650 in the lower area of whirligig 630, and 650 can move to each station (#10 is to #40) successively by the rotation of whirligig 630.

Hereinafter, will explain the process of carrying out in each station (#10 is to #40) successively, and will more effectively explain TCP junction apparatus 600 by the explanation element relevant with each process.

At first, (#10) locates in the TCP loading depot, to first 651 supply TCP 6.Be configured in for first 651 TCP supply surface (not shown) go up in case make TCP 6 and the TCP supply schedule emaciated face that has disposed a plurality of TCP6 from, and absorb TCP 6 by absorbability.At this moment can be because have for first 651 in the structure of X, Y, Z and its position of Q axle adjusted, so can easily make for first 651 TCP 6 and TCP supply schedule emaciated face from.

Absorb for first 651 after the TCP 6, first 651 revolves and turn 90 degrees and move to TCP and aim at station (#20) to carry out next work.Yet, aim at the aligning that TCP 6 is located not finish in station (#20) at TCP.Because TCP aligning vision camera 661 is installed in TCP aligning station (#20) and locates, so TCP aims at vision camera 661 and (for example obtains aligned position information, the degree of spiraling around eye mark 615 by first 651 TCP that shifts 6), and information sent to control module 680, as mentioned below.

In other words, TCP aims at the position that station (#20) is the aligned position information of TCP aligning vision camera 661 acquisition TCP 6.When absorbing first 651 of TCP 6 when TCP aims at station (#20) and is recycled to TCP and adheres to station (#30), the information that obtains based on the aligned position information of TCP 6, by eye markers align vision camera 665 and aim at by the essence that the information that substrate alignment vision camera 663 obtains is finished TCP 6.

It is the position that is attached to the TCP attaching surface 611 of the eye mark 615 that is formed with substrate G at the TCP 6 that first 651 cycle period has been finished aligning that TCP adheres to station (#30).The predefined paths that moves of substrate table 670 be formed in the lower area that TCP adheres to station (#30) in case with substrate-transfer to the perform region.Substrate alignment mark 613 and eye mark 615 are formed on the substrate G, and described substrate G transfers to the lower area that TCP adheres to station (#30) under situation about being installed on the substrate table 670.Substrate alignment mark 613 is to be used for entire substrate G accurately is aligned in mark on the substrate table 670, and has all carried out mark at the two ends of the long side of substrate G so that information about the aligned position of entire substrate G is provided.On the other hand, on the TCP of substrate G attaching surface 611, form eye mark 615 so that the aligned position of each TCP attaching surface 611 is carried out mark.

TCP junction apparatus 600 comprises independent vision camera 663 and 665, and it is used for by substrate alignment mark 613 and eye mark 615 are taken the information that obtains about substrate alignment mark 613 and eye mark 615.

At first, substrate alignment vision camera 663 be installed in substrate table 670 from the upper area of outside load substrates G so that take the loading condition of substrate G on accurate aligned position, and with information transfer to control module 680.Control module 680 can be controlled the degree of spiraling by the information that shifts from substrate alignment vision camera 663.

Because substrate table 670 can be gone up at in-plane (direction of X-axis, Y-axis and Q axle) and move, so substrate table 670 can be aimed at the position of substrate G according to the order that receives from control module 680.Yet, substrate table 670 can't be on in-plane the control position, but can go up to-and-fro movement at predetermined direction (X-direction) along track 671.Even this is substrate G also can be attached to TCP 6 substrate that spirals when mobile in a predetermined direction adaptively with bank position a reason, because in described embodiment, can go up 650 the position that control absorbs and shift TCP6 in all directions (X, Y, Z and Q axle).

Because only can control the position of conventional 750 (shown in Figure 4) in vertical direction, so should control the position of substrate G separately, but 650 the position of described embodiment can be by being controlled to corresponding to the TCP attaching surface 611 that is formed on the substrate G with respect to moving of whirligig 630, and therefore, simplified work and can shorten the working time of adhering to.

On the other hand, two pairs of eye markers align vision camera 665 are installed in as substrate table 670 and TCP and adhere near the track 671 in path at station (#30) the zone., will before eye markers align vision camera 665, explain a structure of 650 herein, obtain the principle of the aligned position information of eye marks 615 so that clearly explain eye markers align vision camera 665.

Referring to Figure 24 and 25, because 650 have predetermined, so, may interrupt so if 650 be configured and be used for that TCP 6 is attached to continuity and be present in TCP attaching surface 611 on the substrate G.Therefore, a pair of first the first and the 3rd TCP attaching surface 611a and 611c that TCP 6 can be attached to TCP attaching surface 611.Then, described four-head 654 is arrived TCP and adheres to station (#30) by revolving to turn 90 degrees, so that TCP 6 is attached to the second and the 4th TCP attaching surface 611b and 611d.Equally, describedly arrive TCP to the 3rd 653 and adhere to station (#30), so that TCP 6 is attached to the 5th TCP attaching surface 611e and the 7th TCP attaching surface (not shown).That is to say that 650 have can be with TCP 6 attached on two TCP attaching surfaces and make an attaching surface 611 be inserted in structure between the head for each.

Because the structure for example mentioned above of head, so when described when eye markers align vision camera 665a is taken that a TCP attaching surface 611a goes up the positional information of the eye mark 615 of mark and the eye mark 615 that the 3rd TCP attaching surface 611c goes up mark and positional information transferred to control module 680, control module 680 can adhere to station (#30) at TCP to be located to move to TCP the moving to aim at first 651 of first 651 of control when adhering to station (#30) by aiming at station (#20) at first 651 from TCP, TCP 6 is attached to the first and the 3rd TCP attaching surface 611a and the 611c of substrate G.

In fact similarly, eye markers align vision camera 665b is taken the second and the 4th TCP attaching surface 611b for another and 611d goes up the eye mark 615 of mark and positional information is transferred to control module 680, control module 680 can adhere in the station (#30) at TCP controls the mobile to aim at four-head 654 of four-head 654 by moving to from TCP aligning station (#20) at four-head 654 when TCP adheres to station (#30), TCP 6 is attached to the second and the 4th TCP attaching surface 611b and the 611d of substrate G.

When finishing the adhering to of TCP 6, first 651 once more clockwise direction revolve and turn 90 degrees to move to recovery/wait station (#40).In recovery/wait station (#40), reclaim defective TCP 6 for first 651 or move to TCP loading depot (#10) and load another TCP 6 so that wait for.

So, each 650 circulation is adhered to work through four stations (#10 is to #40) with execution, but hereinafter, will explain control module 680, its head from the TCP aligning stand (#20) move to TCP control head 650 mobile when adhering to station (#30).

Referring to Figure 27, control module 680 comes relatively moving of control head 650 based on the aligned position information that aligned position detecting unit 660 obtains.In described embodiment, aligned position detecting unit 660 comprises substrate alignment vision camera 663, eye markers align vision camera 665 and TCP and aims at vision camera 661.Therefore, control module 680 receptions are by the aligned position information of the entire substrate G of substrate alignment vision camera 663 shootings, by the aligned position information that is marked at the eye mark 615 on the TCP attaching surface 611 of eye markers align vision camera 665 shootings and the aligned position information of being aimed at the TCP 6 of vision camera 661 shootings by TCP.Control module 680 adheres to the described information of station (#30) aggregate analysis before and finishes an aligning of 650 in advance by arriving TCP 650, and relatively moving of control head 650 adhered to station (#30) and afterwards TCP6 be attached to TCP attaching surface 611 exactly so that arrived TCP at head.

Therefore, because each 650 can arrive TCP at head and adhere to station (#30) and immediately TCP 6 is attached to TCP attaching surface 611 exactly afterwards, adhere to work so can fast and accurately carry out, and therefore, compare with conventional junction apparatus significantly to shorten and produce intermittently.

The joint method that hereinafter explanation is had the junction apparatus of this structure.

At first, four correct clockwise direction circulations by the revolving force of whirligig 630.Then, as mentioned above, describedly in TCP loading depot (#10), absorb TCP 6 respectively to first 651.And then, described first 651 is revolved to turn 90 degrees to move to TCP aim at station (#20), and the position that absorbs first 651 TCP 6 is aimed at TCP in the station (#20) and is aimed at vision camera 661 and take by being installed in TCP.Finished after the shooting, first 651 revolves once more to turn 90 degrees TCP 6 is moved to TCP and adheres to station (#30).

At this moment, aim at station (#20) at first 651 from TCP and move to TCP when adhering to station (#30), control module 680 is finished the aligning of TCP 6.The aligning of TCP 6 means moving so that TCP 6 is attached to exactly the TCP attaching surface 611 of the substrate G that comprises a mark 615 of control module 680 control heads.

For this reason, substrate alignment vision camera 663, eye markers align vision camera 665 and TCP aim at vision camera 661 obtain substrate G, be formed on the substrate G TCP attaching surface 611 and by the positional information of the TCP 6 of 650 deliveries, so that those positions are aimed at each other exactly, and control module 680 position-based information are come moving so that TCP 6 is attached to TCP attaching surface 611 of control head 650.

To explain this process in more detail.Substrate alignment vision camera 663 be installed in substrate table from the upper area of outside load substrates G.Referring to Figure 28, substrate alignment vision camera 663 obtains aligned position information (S11) about entire substrate G by two alignment marks 613 taking the corner place be formed on substrate G successively.To control module 680, make control module can calculate the degree that substrate G has spiraled to substrate table 670 the aligned position information transfer of the substrate G that obtained.

Then, take the eye mark 615 of the substrate G on the TCP attaching surface 611 that is provided at substrate G along the eye markers align vision camera 665 that track 671 is installed, and obtain aligned position information (S13).To control module 680, make control module can recognize the aligned position of a mark 615 the aligned position information transfer of the eye mark 615 that obtained.

At last, adhere in the station (#30) at TCP and TCP is installed aims at vision camera 661 to obtain by the aligned position information (S15) of the TCP 6 of 650 deliveries.With the aligned position information transfer of the TCP that obtained to control module 680.

Control module 680 is aimed at station (#20) at first 651 and is moved to TCP and come move (S17) of control head 650 with respect to whirligig 630 based on each of being aimed at by substrate alignment vision camera 663, eye markers align vision camera 665 and TCP the aligned position information that vision camera 661 obtains when adhering to station (#30) from TCP.

Aimed at by above-mentioned steps so that TCP 6 is attached to 650 of TCP attaching surface 611 exactly and can TCP 6 be attached to more accurate location (S19) by descending in vertical direction.When the aligning of TCP 6 had been finished, 650 rise to original position and clockwise direction revolved to turn 90 degrees to wait for and loads another TCP 6.

Hereinafter will explain this process in more detail.Locate to wait at recovery/wait station (#40) and bide one's time when first 651, four-head 654 is carried out attach process, and aim at the TCP aligning vision camera of locating at station (#20) 661 by TCP for the 3rd 653 simultaneously positional information is provided, and second (652) are located to absorb and load substrates G in TCP loading depot (#10).

So, the TCP junction apparatus 600 of described embodiment comprises control module 680, and it is by obtaining relatively moving of control head 650 about aligned position information and the described aligned position information of aggregate analysis of entire substrate G, eye mark 615 and TCP 6.Therefore, TCP junction apparatus 600 comparable conventional TCP junction apparatus 700 (shown in Figure 4) are more accurate and effective and carry out apace and adhere to work.

In addition because not the time that need be used to aim in addition but when moving alignment head 650, and therefore so can carry out the work of adhering to of TCP 6 apace,, not only can shorten and produce intermittently but also can significantly improve throughput rate.

In addition,,, can carry out the identical work of adhering to by the rotation number of half so compare with conventional equipment because always have the lower surface that four enemies 650 are coupled to whirligig 630, and can be by more rotation numbers per hour and improve process efficiency more.

Figure 29 is the schematic plan view that TCP junction apparatus according to still another embodiment of the invention is described.Hereinafter will only explain difference with the foregoing description.

TCP junction apparatus 600a comprises: two linear driving mechanism 630a and 630b, and it moves along each linear path; Two correct 651a, 652a, 651b and 652b, its be coupled to linear driving mechanism 630a and 630b lower surface and along linear driving mechanism 630a and 630b with linear mode reciprocating simultaneously with the TCP attaching surface 611 of TCP 6 attached to substrate G on; Aligned position detecting unit 660, it is used to obtain about the information of the aligned position of TCP 6 with about the information of the aligned position of the eye mark 615 on the TCP attaching surface 611 that is formed on substrate G; And control module (not shown), it is configured to control corresponding 651a, 652a, 651b and 652b moving with respect to each linear driving mechanism 630a and 630b based on the information that aligned position detecting unit 660 obtains.

Different with the TCP junction apparatus of the foregoing description (four enemies 651,652,653 and 654 (shown in Figure 24 and 25) are by carrying out the predetermined work of adhering to by whirligig 630 rotations), TCP junction apparatus 600a by linear reciprocal movement with on the TCP attaching surface 611 of TCP 6 attached to substrate G.Yet, for the ease of explaining, two linear driving mechanisms are called first and second linear driving mechanisms, and two enemies that will be coupled to first and second linear driving mechanisms are called first and second.

Herein, among linear driving mechanism 630a and the 630b each begins to load TCP 6 from each TCP loading depot (#10a, #10b), and cross TCP and aim at the aligned position that station (#20a, #20b) obtains TCP 6, and arrival TCP adheres to station (#30a) so that TCP 6 is attached to substrate G.At this moment, when first 651a of the first linear driving mechanism 630a and 652a when TCP adheres to station (#30) and locates with TCP 6, second 651b and the 652b of the second linear driving mechanism 630b locate to load TCP 6 in TCP loading depot (#10b).

In TCP junction apparatus 600a, come the method for the position of control head 651a, 652a, 651b and 652b to be similar to the foregoing description in fact by acquisition/aggregate analysis information according to described embodiment.Yet, because linear driving mechanism 630a and 630b not along a path with the linear mode to-and-fro movement, so each among TCP aligning vision camera 661a and the 661b can be installed in the precalculated position in each path, promptly near the zone TCP aims at station (#20a, #20b).

Among TCP aligning vision camera 661a and the 661b each is loaded TCP 6 in TCP loading depot (#10a, #10b), and be configured at TCP and adhere in the central area in path at station (#30) obtaining, and the information that is obtained is sent to control module (not shown) about the information of the position of a 651a, 652a, 651b and 652b with about by the TCP 6 of a 651a, 652a, 651b and 652b absorption/delivery information in the degree of spiraling each other.Because the position of each 651a, 652a, 651b and 652b can be controlled separately by the position control order of control module (not shown), so the TCP 6 that is grasped by each 651a, 652a, 651b and 652b can be attached to corresponding TCP attaching surface 611 exactly.

Describe in detail as mentioned, control module comes the position of control head 651a, 652a, 651b and 652b and platform 670 based on the aligned position information of the aligned position information of the eye mark 615 on the aligned position information of TCP 6, the substrate G and entire substrate G, so as with TCP 6 attached to the accurate position on the substrate G.

Hereinafter, signal is explained have the as above TCP joint method of the TCP junction apparatus 600a of structure.

At first, from first 651a and two TCP 6 of 652a supply of corresponding TCP loading depot (#10a) to linear driving mechanism 630a that comprises a correct 651a, 652a, 651b and 652b at each lower surface and the first linear driving mechanism 630a the 630b.Then, first moves to TCP along linear path and adheres to station (#30).At this moment, TCP is aimed in the central area that station (#20a) is configured in the path to aim at vision camera 661a by TCP and obtain aligned position information by the TCP 6 of first 651a and 652a absorption/delivery.

Control module moves to TCP when adhering to station (#30) by aiming at station (#20) at first 651a of the first linear driving mechanism 630a and 652a from TCP, the aligned position information of the eye mark 615 that obtains based on the aligned position information of TCP 6, by eye markers align vision camera 665 and the aligned position information of entire substrate G are controlled the position of first 651a and 652a exactly, finish aligning.

In the identical in fact time of the attach process of the first linear driving mechanism 630a, have second 651b and 652b two TCP 6 of loading in corresponding TCP loading depot (#10b) of the second linear driving mechanism 630b of different predefined paths.Second 651b of the second linear driving mechanism 630b also carries out aligning and the attach process identical with 652a with first 651a of the first linear driving mechanism 630a with 652b.Because first 651a and 652a have been attached to TCP 6 the first and the 3rd TCP attaching surface 611a and the 611c of substrate G, so second 651b and 652b should be attached to TCP 6 the second and the 4th TCP attaching surface 611b and 611d.This is the reason that TCP 6 directly can't be attached to contiguous TCP attaching surface 611, because each 651a, 652a, 651b and 652b have occupied the space.

So, the benefit that has according to the TCP junction apparatus 600a of described embodiment is, because a 651a, 652a, 651b and 652b move with linear mode and can shorten working hours.

Although be coupled in the above-described embodiments whirligig or linear driving mechanism a zone the head number be two, according to every kind of structure, the head number can be greater or less than two.

In addition, although the number of TCP aligning vision camera is two in the above-described embodiments, it can be single optimization structure.

As mentioned above, the junction apparatus of drive circuit board can control push the substrate composition surface the contact maker instrument push the planarity on surface the time bolt member be damaged, and by more easily controlling production that the planarity of pushing the surface shortens joint technology than prior art intermittently.

The junction apparatus of drive circuit board, joint method and mating system can by in worktable of operation on another worktable the loading or unloading substrate shorten the process time and improve process efficiency, and worktable is overused.

The junction apparatus of drive circuit board and case type shell thereof can improve the joint work efficiency of drive circuit board, because since admit lamination drive circuit board heap structure cause and more effectively supply drive circuit board, and the junction apparatus of described drive circuit board and case type shell thereof have significantly reduced and supply conventional drive circuit board required manpower on duty.

The junction apparatus of drive circuit board can have more drive circuit board in the unit interval, because by control module obtain about entire substrate, eye mark and drive circuit board aligned position information, analyze described aligned position information and relatively moving of control head and significantly shortened drive circuit board is attached to the required production of substrate intermittently, allow to improve production efficiency whereby.

One of ordinary skill in the art should be appreciated that, can make various alternative, the modifications and variations on form and the details in the present invention under the situation that does not break away from the spirit and scope of the present invention that defined by appended claims.Therefore, should be appreciated that the foregoing description only is used for illustrative purposes and should not be construed as for restriction of the present invention.

Claims (47)

1. the junction apparatus of a drive circuit board is characterized in that it comprises to push the unit, described push the unit with described drive circuit board by on the composition surface that is pressed in the substrate of described drive circuit board,

The wherein said unit of pushing comprises:

Push main body, its through providing so that separate near the composition surface on the top of described substrate and with composition surface;

The contact maker instrument, it has pressure surface, and when described drive circuit board was pressed into described composition surface, described pressure surface contacted with described drive circuit board;

A plurality of height are regulated parts, and it regulates described pressure surface with respect to the displacement of the described composition surface planarity with the pressure surface that obtains described contact maker instrument; And

Part is regulated in rotation, and it is provided at described height and regulates on the parts so that regulate the rotation that described height is regulated parts, and is provided at described height and regulates being on the described zone of pushing between main body and the described contact maker instrument of parts.

2. the junction apparatus of drive circuit board according to claim 1 is characterized in that wherein said a plurality of height regulates parts and separate each other so that regulate described pressure surface with respect to the displacement of the described composition surface planarity with the pressure surface that obtains described contact maker instrument.

3. the junction apparatus of drive circuit board according to claim 1, it is characterized in that wherein said height regulate parts respectively spiral be coupled to and describedly push main body and described contact maker instrument, and treated make be formed on described height regulate parts with described push between the main body and described height adjusting parts and described contact maker instrument between the direction of screw thread become each other and be on the relative direction.

4. the junction apparatus of drive circuit board according to claim 3 is characterized in that wherein said height regulates parts and comprise:

Main body;

First spiral part, it is provided on the upper part of described main body and forms first screw thread, and described first thread helix is coupled to and is formed on described first threaded hole of pushing in the main body; And

Second spiral part, it is provided on the end portion of described main body and forms second screw thread, and described second thread helix is coupled to second threaded hole that is formed in the described contact maker instrument.

5. the junction apparatus of drive circuit board according to claim 4, it is characterized in that wherein said rotation regulates part and have the six-sided nut shape, described six-sided nut shape integrally is coupled so that give prominence to towards the radial direction of described main body between first spiral part of regulating parts at described height and second spiral part.

6. the junction apparatus of drive circuit board according to claim 4, it is characterized in that wherein said rotation adjusting part is provided between first spiral part and second spiral part that is in described height adjusting parts in the described main body, and it is that instrument inserts groove that part is regulated in described rotation, and described instrument inserts groove and is inserted into through forming the swingle that makes the described height of rotation regulate parts.

7. the junction apparatus of drive circuit board according to claim 1 is characterized in that wherein said contact maker instrument comprises:

Supporter, it is coupled to described height regulates parts;

Press pressure bar, it pushes the composition surface of described substrate; And

Well heater, it is inner so that heat by pressure bar described that it is provided at described supporter.

8. the junction apparatus of a drive circuit board is characterized in that it comprises:

The working cell, it is carried out described drive circuit board is bonded on work on the substrate;

A plurality of worktable, it arrives described working cell with described substrate-transfer when supporting described substrate;

A plurality of load/unload parts, it provides corresponding to described a plurality of worktable so that be loaded in described substrate on the described worktable or unload described substrate from described worktable; And

Control module, it controls described a plurality of worktable moving to described working cell alternately each other, make and to sentence when carrying out the work that engages described drive circuit board that other worktable is in described load/unload part place execution loading or unloading when one in the described worktable is placed on described working cell.

9. the junction apparatus of drive circuit board according to claim 8, it is characterized in that wherein said control module is controlled with box lunch is about to described drive circuit board when being bonded on work on the described substrate, the described substrate of loading or unloading on another worktable that is placed on described load/unload part place in that a worktable that is placed on place, described working cell is enterprising.

10. the junction apparatus of drive circuit board according to claim 8, it is characterized in that wherein said a plurality of worktable comprises first worktable and second worktable, and the two ends that described a plurality of load/unload part is configured in described working cell are so that toward each other, and comprise the first load/unload part and the second load/unload part that corresponds respectively to described first worktable and described second worktable.

11. the junction apparatus of drive circuit board according to claim 10 is characterized in that wherein

When described first worktable that is mounted with first substrate was placed on place, described working cell, described control module was loaded in second substrate on described second worktable,

When the work of described first substrate is finished, with described first movable workbench to the described first load/unload part to unload described first substrate from described first worktable, and with described second movable workbench that is mounted with described second substrate to described working cell

When described second worktable that is mounted with described second substrate is placed on place, described working cell, the 3rd substrate is loaded on described first worktable, and

When the work of described second substrate is finished, with described second movable workbench to the described second load/unload part unloading described second substrate from described second worktable, and with described first movable workbench of described the 3rd substrate that is mounted with to described working cell.

12. the junction apparatus of drive circuit board according to claim 8 is characterized in that wherein said working cell is any one that is selected from the following

The ACF adhesion unit, wherein anisotropic conductive film (ACF) is adhered to described substrate, pre-joint unit, wherein said drive circuit board is fixed on the described substrate, and final joint unit, and wherein said drive circuit board finally is bonded on the described substrate.

13. the joint method of a drive circuit board is characterized in that it comprises:

(a) first movable workbench that will be mounted with first substrate is to the working cell, and described drive circuit board joins substrate at place, described working cell;

(b) when place, described working cell carries out the work of described first substrate, second substrate is loaded on second worktable; And

(c) when the work of described first substrate is finished, with described first movable workbench to the first load/unload part unloading described first substrate, and with described second movable workbench to described working cell.

14. the joint method of drive circuit board according to claim 13 is characterized in that further comprising:

When carrying out the work of described second substrate, the 3rd substrate is loaded on described first worktable at place, described working cell; And

When the work of described second substrate is finished, with described second movable workbench to the second load/unload part unloading described second substrate, and with described first movable workbench to described working cell.

15. the mating system of a drive circuit board is characterized in that it comprises:

A plurality of junction apparatus of drive circuit board, it is configured to join described drive circuit board to be loaded on the worktable substrate; And

Loading bin, it is provided at respectively between described a plurality of junction apparatus of described drive circuit board so that will be loaded into another adjacent junction apparatus of described drive circuit board from the substrate of a junction apparatus unloading of described drive circuit board,

The described junction apparatus of wherein said drive circuit board comprises:

The working cell, it is carried out described drive circuit board is bonded on work on the described substrate;

First and second worktable, it arrives described working cell with described substrate-transfer when supporting described substrate;

The first and second load/unload parts, it is provided and corresponds respectively to described first and second worktable toward each other; And

Control module, its control make when described first worktable when the described first load/unload part unloads described substrate, described second worktable is placed on place, described working cell, and when described first worktable is placed on described working cell when sentencing the work that carry out to engage described drive circuit board, described second worktable is loaded in the described second load/unload part place with described substrate.

16. the mating system of drive circuit board according to claim 15 is characterized in that described a plurality of junction apparatus of wherein said drive circuit board are:

The ACF adhesion unit, it is adhered to described substrate with anisotropic conductive film (ACF);

Pre-joint unit, it is fixed to described substrate with described anisotropic conductive film (ACF) with described drive circuit board; And

Final joint unit, it finally joins described substrate with described to by the fixing drive circuit board of described pre-joint unit.

17. an equipment that is used to supply drive circuit board is characterized in that it comprises:

A plurality of case type shells, its admittance treat that lamination is with a plurality of described drive circuit board as the supply object; And

The shell mobile unit, it alternately moves to the working position each other with described a plurality of case type shells, make described a plurality of case type shell described drive circuit board from the described working position of described case type shell unloading and and described working position separate between the holding fix of a preset distance and move.

18. the equipment that is used to supply drive circuit board according to claim 17 is characterized in that wherein said shell mobile unit comprises:

Plate, it supports described case type shell; And

Rotary drive unit, it makes the rotation of described plate, makes to separate each other on described plate and supported described a plurality of case type shells move to described working position successively.

19. the equipment that is used to supply drive circuit board according to claim 18 is characterized in that wherein four case type shells are configured so that have angle same at interval along circumferencial direction on described plate.

20. the equipment that is used to supply drive circuit board according to claim 19, it is characterized in that wherein four case type shells rotate by described rotary drive unit under the state that is supported by described plate, make described four case type shells wait to stand and circulate to the fourth class around second of first workstation of described working position and described holding fix respectively.

21. the equipment that is used to supply drive circuit board according to claim 20 is characterized in that wherein after all drive circuit boards in having supplied the corresponding case type shell that is placed on the described first workstation place, described rotary drive unit makes described plate rotation.

22. the equipment that is used to supply drive circuit board according to claim 20, it is characterized in that wherein providing on the zone that is adjacent to described first workstation collection box, described collection box is collected defective drive circuit board from the described case type shell that is placed on described first workstation.

23. the equipment that is used to supply drive circuit board according to claim 18 is characterized in that wherein providing anchor clamps on described plate is coupled to each zone of described case type shell, described anchor clamps are fixed on described case type shell on the described plate respectively.

24. the equipment that is used to supply drive circuit board according to claim 17 is characterized in that wherein said case type shell comprises:

First shell body, its admittance are treated a plurality of drive circuit boards of lamination, and have the unload parts of the described drive circuit board of unloading monolithic on a surface;

Second shell body, it is coupled to another surface relative with described first shell body;

Support part, its support wait to be laminated to the described drive circuit board in described first shell body; And

Elastomeric element, it is provided between described support part and described second shell body, and flexibly skew on the direction that described support part separates each other with respect to described second shell body.

25. the equipment that is used to supply drive circuit board according to claim 24 is characterized in that wherein said a plurality of locking ridge is provided on the inner wall surface of described first shell body, makes described drive circuit board move successively one by one.

26. the equipment that is used to supply drive circuit board according to claim 24 is characterized in that wherein said a plurality of locking ridge is provided in the presumptive area that provides described unload parts of office, upper end of described first shell body.

27. the equipment that is used to supply drive circuit board according to claim 24, it is characterized in that further providing electro-dissociator in the zone of at least one in being adjacent to described a plurality of case type shell wherein, described electro-dissociator is removed from the static of the described drive circuit board of described case type shell supply, and

Prodefined opening is formed at least one side surface of described first case type shell, makes to be supplied to the described drive circuit board that is laminated to the described case type shell from the ion of described electro-dissociator supply.

28. the equipment that is used to supply drive circuit board according to claim 17, it is characterized in that the accompanying described substrate of wherein said drive circuit board is PDP (plasma display device) substrate, and described drive circuit board is CBF (a common piece flexible print circuit).

29. a case type shell that is used to supply the equipment of drive circuit board is characterized in that comprising:

First shell body, its admittance are treated described a plurality of drive circuit boards of lamination, and have the unload parts of the described drive circuit board of unloading monolithic on a surface;

Second shell body, it is coupled to another surface relative with described first shell body;

Support part, its support wait to be laminated to the described drive circuit board in described first shell body; And

Elastomeric element, it is provided between described support part and described second shell body, and flexibly skew on the direction that described support part separates each other with respect to described second shell body.

30. the junction apparatus of a drive circuit board is characterized in that comprising:

At least one stature, it grasps described drive circuit board so that be attached to the attaching surface of the described drive circuit board of substrate;

Driving mechanism, it is coupled at least one stature so that move at least one stature;

Detecting unit, it obtains in the aligned position information that is formed on the eye mark on the described attaching surface of described drive circuit board and selected at least one aligned position information between by the aligned position information of described described drive circuit board that grasps; And

Control module, it is based on controlling moving of described head from the described information that described detecting unit obtained of described aligned position, make the described drive circuit board that is grasped by described head aim at so that corresponding to the described aligned position of described eye mark.

31. the junction apparatus of drive circuit board according to claim 30 it is characterized in that wherein said drive circuit board is TCP (band carries encapsulation), and the described attaching surface of described drive circuit board is the TCP attaching surface.

32. the junction apparatus of drive circuit board according to claim 31 is characterized in that wherein at least one stature is a plurality of heads, and described driving mechanism is to move described a plurality of linear driving mechanism with linear mode,

Described a plurality of head adheres between the station at TCP loading depot and TCP by described linear driving mechanism and circulates,

Adhere to when station when the head of the described TCP of described extracting moves to described TCP, relatively moving of the described head of described control module control makes described crawled TCP aim at corresponding to described TCP attaching surface.

33. the junction apparatus of drive circuit board according to claim 32 is characterized in that wherein

Described a plurality of become two to be coupled to described linear driving mechanism over the ground, and

Described control module is controlled described linear driving mechanism, makes an enemy adhere between the station alternately mobile each other in described TCP loading depot and described TCP.

34. the junction apparatus of drive circuit board according to claim 31 is characterized in that wherein at least one stature is a plurality of heads, and described driving mechanism is around the axle core and the whirligig that rotates,

Described a plurality of head is coupled to described whirligig so that separate each other, and on described whirligig, aim at the station along circumferencial direction around described TCP loading depot, described TCP, described TCP adheres to the station and recoverys/wait is stood and circulated, and

Adhere to when station when the head of the described TCP of described extracting moves to described TCP, relatively moving of the described head of described control module control makes described crawled TCP aim at corresponding to described TCP attaching surface.

35. the junction apparatus of drive circuit board according to claim 34 is characterized in that wherein said a plurality of head has identical angle intervals each other along the circumferential surfaces of described whirligig, and four pairs of described heads are coupled to described whirligig, and

Each to described head simultaneously successively around described TCP loading depot, described TCP aim at the station, described TCP adheres to the station and described recovery/waits stood and circulated.

36., it is characterized in that wherein said detecting unit comprises according to the junction apparatus of claim 32 or 34 described drive circuit boards:

TCP aims at vision camera, and it grasps and obtain described TCP aligned position information by described head; And

Eye markers align vision camera, it obtains described eye markers align positional information,

Wherein about the information transmission of the described eye markers align positional information of aiming at described TCP aligned position information that vision camera obtained by described TCP and being obtained by described eye markers align vision camera to described control module, make described control module control moving of described head based on described information transmitted.

37. the junction apparatus of drive circuit board according to claim 36 is characterized in that wherein said TCP aims at vision camera and is installed in the position of aiming at the station corresponding to described TCP, makes that aiming at the place, station at described TCP obtains described TCP aligned position information.

38. the junction apparatus of drive circuit board according to claim 36 is characterized in that wherein two pairs of described eye markers align vision camera are installed in adhering on the upper area at station corresponding to described TCP of described substrate, and

A pair of described eye markers align vision camera obtains two eye label informations of each odd number in the described eye mark successively, and

Another obtains two eye label informations of each even number in the described eye mark successively to described eye markers align vision camera.

39. the junction apparatus of drive circuit board according to claim 36, the detecting unit that it is characterized in that wherein said aligned position comprises the substrate alignment vision camera, it obtains the substrate alignment position by the alignment mark that shooting is formed in the described substrate, and

Described control module is based on the described substrate alignment positional information that is obtained by described substrate alignment vision camera, aim at described TCP aligned position information that vision camera obtained and control moving of described head by the described eye markers align positional information that described eye markers align vision camera is obtained by described TCP.

40. junction apparatus according to the described drive circuit board of claim 39, it is characterized in that the described substrate alignment positional information that wherein acquisition is obtained by described substrate alignment vision camera before described substrate-transfer is adhered to the station to described TCP, and described substrate alignment positional information is transferred to described control module.

41. the junction apparatus of drive circuit board according to claim 30, it is characterized in that further comprising substrate table, along the predefined paths to-and-fro movement, and described substrate table supports described substrate so that move to described substrate table on the plate surface direction at described substrate on the described path when supporting described substrate.

42. the joint method of a drive circuit board is characterized in that comprising:

Acquisition is about the information of the aligned position of the eye mark on the attaching surface of the described drive circuit board that is formed on substrate, so that set the standard of the attachment position of described drive circuit board;

Acquisition is treated attached to the information of aligned position on the head of the described drive circuit board on the described attaching surface of described drive circuit board in extracting about described drive circuit board; And

Control relatively moving of described head based on the described information that in the described aligned position information obtaining step of the described aligned position information obtaining step of described eye mark and described drive circuit board, obtains, make the described aligned position of described drive circuit board to aim at respect to the described aligned position of described eye mark.

43. according to the joint method of the described drive circuit board of claim 42, it is characterized in that wherein said drive circuit board is TCP (band carry encapsulation), and the described attaching surface of described drive circuit board is the TCP attaching surface,

Described a plurality of head is with the linear mode to-and-fro movement, and it is coupled to and makes described head with the reciprocating linear driving mechanism of linear mode,

Described a plurality of head circulates to adhere to stand around described TCP loading depot and described TCP by described linear driving mechanism, and

Adhere to when station when the head of the described TCP of described extracting moves to described TCP, carry out the control of moving described head.

44. according to the joint method of the described drive circuit board of claim 42, it is characterized in that wherein said a plurality of head separates each other and is coupled to the whirligig that rotates around the axle core so that rotate along described whirligig,

Described a plurality of head is aimed at the station along circumferencial direction around described TCP loading depot, described TCP on described whirligig, described TCP adheres to the station and described recovery/waits stood and circulated, and

Adhere to when station when the head of the described TCP of described extracting moves to described TCP, carry out the control of moving described head.

45. according to the joint method of claim 43 or 44 described drive circuit boards, it is characterized in that wherein being placed on described TCP when aiming at the place, station, carry out the described TCP aligned position information that obtains when corresponding head.

46., it is characterized in that further being included in the information that obtains before about the aligned position of whole substrates that moves of the described head of control according to the joint method of the described drive circuit board of claim 42.

47., it is characterized in that wherein based on the control of carrying out by the described information of described eye markers align positional information obtaining step, described TCP aligned position information obtaining step and the acquisition of described substrate alignment information obtaining step described head of moving according to the joint method of the described drive circuit board of claim 46.

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