KR101152411B1 - An apparatus for mounting a film package - Google Patents

Abstract

A film package mounting device is provided. One aspect of the film package mounting apparatus of the present invention includes a support for supporting a panel assembly; A mounting part for mounting a plurality of film packages on the panel assembly; An alignment unit for aligning the mounting unit to mount the plurality of film packages; And a buffer unit moving in association with the movement of the mounting unit and providing an additional film package to the mounting unit.

Mounting Devices, Buffers, Displays, Semiconductor Chips

Description

An apparatus for mounting a film package

The present invention relates to a film package mounting apparatus, and more particularly, to a mounting apparatus for efficiently mounting a plurality of film packages.

In general, TCP is one of the wireless bonding methods of assembling and mounting high density semiconductor chips such as LSI, which is called “tape carrier method”. It connects IC chip to tape film and seals with resin. It is a package using TAB (Tape Automated Bonding) technology. It is a high-tech product that requires more sophisticated technology than the existing semiconductor assembly technology. It is used for various OA and consumer devices such as wall-mounted TV, Note Book PC, and Car Navigation Monitor. It is used as an ultra-thin semiconductor device that drives the LCD screen.

COF is a film type circuit board called Chip On Flexible Board or Chip On Film, and has a plurality of holes (sprocket holes) formed in a row at the top and bottom. Thin substrates can be used, and the pitch (lead-to-lead distance) can be further refined, which can be used in LCD driver ICs with the rapid trend for light and small size in the field of communication devices such as mobile phones.

Meanwhile, as the display device becomes larger and larger in capacity, flat panel display devices such as a liquid crystal display device, an organic EL display device, a plasma display device, and the like are emerging or commercially available.

Accordingly, there is a need for an apparatus for efficiently mounting a plurality of driving chips for driving such display apparatuses as they become large in area.

SUMMARY OF THE INVENTION An object of the present invention is to provide an apparatus for efficiently mounting a plurality of film packages on a large area panel assembly.

The objects of the present invention are not limited to the above-mentioned objects, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

One aspect of the film package mounting apparatus of the present invention to achieve the above object is a support for supporting a panel assembly; A mounting part for mounting a plurality of film packages on the panel assembly; An alignment unit for aligning the mounting unit to mount the plurality of film packages; And a buffer unit moving in association with the movement of the mounting unit and providing an additional film package to the mounting unit.

According to one embodiment of the present invention, a plurality of film packages can be efficiently mounted on the edge of a large area panel assembly.

In addition, it is possible to reduce the tack type loss by reducing the moving time to the position where the film package is mounted by the buffer unit.

Effects of the present invention are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

Specific details of other embodiments are included in the detailed description and the drawings. Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms, and only the embodiments make the disclosure of the present invention complete, and the general knowledge in the art to which the present invention belongs. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

When an element is referred to as being "connected to" or "coupled to" with another element, it may be directly connected to or coupled with another element or through another element in between. This includes all cases. On the other hand, when one device is referred to as "directly connected to" or "directly coupled to" with another device indicates that no other device is intervened. Like reference numerals refer to like elements throughout. “And / or” includes each and all combinations of one or more of the items mentioned.

Although the first, second, etc. are used to describe various elements, components and / or sections, these elements, components and / or sections are of course not limited by these terms. These terms are only used to distinguish one element, component or section from another element, component or section. Therefore, the first device, the first component, or the first section mentioned below may be a second device, a second component, or a second section within the technical spirit of the present invention.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. As used herein, “comprises” and / or “comprising” refers to the presence of one or more other components, steps, operations and / or elements. Or does not exclude additions.

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used in a sense that can be commonly understood by those skilled in the art. In addition, the terms defined in the commonly used dictionaries are not ideally or excessively interpreted unless they are specifically defined clearly.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view illustrating a part of a liquid crystal panel assembly in a general display device. Referring to FIG. 1, the liquid crystal panel assembly 200 includes a liquid crystal panel 210, a first flexible film 250, a second flexible film 260 and 270, a first printed circuit board 220, and a second printed circuit. It may include a substrate 225.

The liquid crystal panel 210 may face the lower panel 212 in a smaller size than the lower panel 212 and the lower panel 212 including the storage electrode line 235, the data line 234, the thin film transistor, and the pixel electrode. The upper panel 214 is stacked and includes a black matrix, a color filter, a common electrode, and the like. In addition, a liquid crystal layer (not shown) is interposed between the upper panel 214 and the lower panel 212.

The first flexible film 250 is connected to the gate line 232 and the storage electrode line 235 formed on the lower panel 212. The second flexible films 260 and 270 are connected to the data line 234 formed on the lower panel 212, and a data driving chip 275 for transmitting a data driving signal to the data line 234 is mounted.

The first printed circuit board 220 includes a plurality of driving components for applying a gate driving voltage. Such driving components may be composed of semiconductor chips designed by one chip technology. The first printed circuit board 220 is connected to the lower panel 212 by the first flexible film 250.

Meanwhile, the first printed circuit board 220 applies a storage voltage to the storage electrode line 235. The first printed circuit board 220 applies a storage voltage to the storage electrode line 235 through the first flexible film 250. In this case, the storage voltage may be applied to the storage electrode line 235 through a driving chip mounted on the first flexible film 250 such as a gate driving chip.

The second printed circuit board 225 mounts a plurality of driving components for applying a data voltage, and is connected to the lower display panel 212 by the second flexible films 260 and 270. The second flexible films 260 and 270 include a data driving chip 275 and apply a data voltage to the data line 234.

The common contact unit 240 may be disposed to supply common power to the common electrode of the upper panel 214 at predetermined intervals near the upper or lower edge of the lower panel 212. The common contact unit 240 is connected to the common electrode line 237 to provide a passage for receiving a predetermined common power signal input from the data driving chip 275 and transferring a common voltage to the upper panel 214.

The first flexible film 250 may include a gate and storage electrode wiring pattern and a gate driving chip 255 formed on the base film. The gate driving chip 255 is a type of semiconductor chip, and may be mounted on the first flexible film 250 by, for example, a wiring pattern and a tape automated bonding (TAB) method. The gate driving chip 255 is electrically connected to the gate line 232 and the storage electrode line 235 to apply a gate voltage and a storage voltage to the gate line 232 and the storage electrode line 235, respectively. The first flexible film 250 transfers the gate driving signal output from the first printed circuit board 220 to the thin film transistor of the lower panel 212.

Here, the second flexible films 260 and 270 may be formed of a wiring pattern formed on the base film and a data driving chip 275 electrically connected to the wiring pattern. The data driving chip 275 is a kind of semiconductor chip and may be mounted in a wiring pattern and a tap method. In addition, the second flexible films 260 and 270 transfer data driving signals output from the second printed circuit board 225 to the thin film transistors of the lower panel 212.

As described above, a plurality of flexible films such as the first flexible film 250 and the second flexible films 260 and 270 in the liquid crystal panel assembly in the general display device are mounted on the edge of the liquid crystal panel 210. Each flexible film 250, 260, 270 is connected to a gate line 232 or a data line 234 to precisely align each flexible film 250, 260, 270 at a predetermined position. At the same time, it is necessary to efficiently mount a plurality of flexible films.

On the other hand, in one embodiment of the present invention relates to mounting the plurality of flexible films as described above in a liquid crystal panel assembly, etc., the flexible film is only one example and a variety of TCP and / or COP to the panel or display of the display device It can be applied to mounting on the panel. In an embodiment of the present invention described below, TCP and / or COP, in which a semiconductor chip is embedded, are collectively referred to as a "film package." Thus, each of the aforementioned flexible films 250, 260, 270 corresponds to one example of a film package in one embodiment of the present invention.

2 shows a schematic perspective view of a film package mounting apparatus according to an embodiment of the present invention. 2, the film package mounting apparatus according to an embodiment of the present invention may include a frame 510, a support 520, a mounting part 550, an alignment part 570, and a buffer part 590. have.

The frame 510 constitutes a body of the film package mounting apparatus, and serves to support the mounting apparatus. The frame 510 may provide a predetermined space for the mounting apparatus to perform a process of mounting the plurality of film packages P at a predetermined position of the panel assembly W.

The support 520 supports the panel assembly W to fix the panel assembly W during the process of mounting the film package. However, the support part 520 may adjust the position of the panel assembly W in the state of being fixed by a predetermined grip, such as up, down, left, and right.

The mounting part 550 mounts a plurality of film packages on the panel assembly. Here, mounting refers to attaching the film package to the panel assembly in a static position. Here, it can be understood as simply mounting the film package at a predetermined position of the panel assembly called attachment, or it can be understood as securing by heat or pressure.

The mounting unit 550 may include a mounting frame 551, mounting heads 552 and 553, a driving unit 555, and a controller 556. The mounting frame 551 includes a plurality of mounting heads 552 and 553, and mounts the plurality of film packages P using the plurality of mounting heads 552 and 553. The mounting heads 552 and 553 may be configured in plural, and the film packages may be mounted at predetermined positions of the panel assembly W by holding the plurality of film packages P at each mounting head. The driving unit 555 may drive the mounting frame 551 and / or the mounting heads 552 and 553 to move to a predetermined position. The controller 556 controls the operation of the mounting frame 551 and / or the mounting heads 552 and 553 by providing a driving signal to the driving unit 555. The mounting heads 552 and 553 are configured in plural, and the number of mounting heads disclosed as two in FIG. 2 corresponds to an example, and is not limited thereto. Meanwhile, the mounting unit 550 may further include a backup frame 560 supporting a corresponding point of the panel assembly when mounting the film package to the panel assembly by the mounting heads 552 and 553. The backup frame 560 may be linked with the movement of the mounting heads 552 and 553 to move along the guide groove (not shown) in the left and right directions.

Mounting heads 552 and 553 according to an embodiment of the present invention may be driven by three directions of vertical directions (for example, x, y, and z axes) perpendicular to each other by the driving unit 555 and planar rotation in which the liquid crystal panel assembly is placed. T-direction). Therefore, by having the degrees of freedom in the four directions, it is possible to have a relatively high precision with respect to the predetermined position of the liquid crystal panel assembly (W).

The alignment unit 570 aligns the mounting unit 550 to accurately mount the film package at a predetermined position of the panel assembly W. FIG. The alignment unit 570 may include alignment cameras 571 and 572 for capturing positions corresponding to the mounting heads 551 and 553 on the panel assembly. The alignment cameras 571 and 572 provide the captured image to the controller 556, and the controller 556 transmits a driving signal to the driver 555 to finely adjust the positions of the mounting heads 552 and 553. have.

The buffer unit 590 serves to provide the plurality of film packages P to the mounting unit 550. The buffer unit 590 moves in association with the movement of the mounting unit 550, and serves to provide the plurality of film packages to the mounting unit 550 in a close position after mounting the film package.

The buffer unit 590 includes a buffer stage 591 for individually storing a plurality of film packages, a buffer driver 595 for driving the buffer stage 591, and a buffer controller 596 for providing a driving signal to the buffer driver. can do. The buffer stage 591 may temporarily store the number of film packages corresponding to the number in the mounting heads 552 and 553. The buffer driver 595 moves the buffer stage 591 in conjunction with the mounting unit 550. In addition, the buffer driver 595 may also serve to move the buffer stage 591 to the film package storage unit (not shown) so that an additional film package is provided when the film package is empty in the buffer stage 591.

As described above, in an embodiment of the present invention, after mounting the film package by the mounting unit 550 having the buffer stage 591, the logistics movement such as a long stroke or the panel assembly is moved to mount the film package again. You can't let that happen. Accordingly, the mounting unit 550 may receive a film package from an interlocking buffer stage 591, thereby reducing a movement time to a position at which the film package is mounted, thereby significantly reducing a tack type loss.

In addition, by providing the mounting head of the mounting unit 550 with a plurality of axes, the induction of relatively high precision and degrees of freedom for mounting the film package using the plurality of mounting heads 552 and 553, thereby increasing the mounting efficiency. It can increase.

Although embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art to which the present invention pertains have various permutations, modifications, and modifications without departing from the spirit or essential features of the present invention. It is to be understood that modifications may be made and other embodiments may be embodied. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

1 is a perspective view illustrating a part of a liquid crystal panel assembly in a general display device.

2 is a schematic perspective view of a film package mounting apparatus according to an embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

510: frame 520: support

550: mounting portion 570: alignment portion

590: buffer section

551: mounting frame 552, 553: mounting head

555: drive unit 556: control unit

571, 572: alignment camera

591: buffer stage 595: buffer driver

596: buffer control unit

Claims (5)

A support for supporting the panel assembly; A mounting part for mounting a plurality of film packages on the panel assembly; An alignment unit for aligning the mounting unit to mount the plurality of film packages; And And mounting the plurality of film packages to the panel assembly, wherein the mounting unit includes a buffer unit to provide an additional film package to the mounting unit. The method of claim 1, wherein the mounting portion A plurality of mounting heads respectively holding the plurality of film packages; And And a drive unit for driving the plurality of mounting heads. The method of claim 2, wherein the buffer unit And a buffer stage for storing additional film packages to correspond to the number of mounting heads. The method of claim 3, wherein the buffer unit And a buffer driver for moving the buffer end to a film package storage to receive the additional film package when the film package is emptied in the buffer end. The method of claim 1, wherein the alignment unit An alignment camera photographing a position at which the mounting head of the mounting unit corresponds to the panel assembly; And And an alignment driving unit for adjusting the position of the mounting unit according to the image photographed by the alignment camera.

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