WO2010053185A1 - Composition de résine pour carte de circuit imprimés - Google Patents

Composition de résine pour carte de circuit imprimés Download PDF

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Publication number
WO2010053185A1
WO2010053185A1 PCT/JP2009/069070 JP2009069070W WO2010053185A1 WO 2010053185 A1 WO2010053185 A1 WO 2010053185A1 JP 2009069070 W JP2009069070 W JP 2009069070W WO 2010053185 A1 WO2010053185 A1 WO 2010053185A1
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WO
WIPO (PCT)
Prior art keywords
resin composition
printed wiring
resin
wiring board
film
Prior art date
Application number
PCT/JP2009/069070
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English (en)
Japanese (ja)
Inventor
宏 織壁
剛充 相坂
啓之 阪内
勇士 萩原
智 成塚
Original Assignee
味の素株式会社
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Filing date
Publication date
Application filed by 味の素株式会社 filed Critical 味の素株式会社
Priority to JP2010536815A priority Critical patent/JP5594144B2/ja
Priority to CN200980144733XA priority patent/CN102209754B/zh
Publication of WO2010053185A1 publication Critical patent/WO2010053185A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/246—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using polymer based synthetic fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/163—Metal in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

Definitions

  • the present invention includes the following contents.
  • a resin composition for a printed wiring board containing (A) a polyimide resin having a hexafluoroisopropanol group and a siloxane structure, and (B) a thermosetting resin.
  • the resin composition for a printed wiring board according to the above (1) further comprising (C) an inorganic filler.
  • the polyimide resin is represented by the following formulas (1) and (2);
  • R1 represents a tetravalent organic group
  • R2 represents a divalent diamine residue having a hexafluoroisopropanol group
  • R3 represents a divalent siloxane diamine residue, and is represented by the formula (1)).
  • the resin composition containing the polyimide resin and the thermosetting resin of the present invention has excellent heat resistance and solvent resistance while having low elasticity, and by using the resin composition, It is possible to provide a resin composition for a printed wiring board that is excellent and has a small temperature change in elastic modulus and excellent heat resistance.
  • Examples of the diamine compound having an HFA group represented by the formula (4) include those represented by the following formula.
  • the upper limit of the content of the siloxane structure is preferably 80% by weight, more preferably 75% by weight, still more preferably 70% by weight, and particularly preferably 65% by weight from the viewpoint of maintaining heat resistance at high temperatures.
  • the lower limit of the content of the siloxane structure is preferably 50% by weight, more preferably 54% by weight, and still more preferably 58% by weight from the viewpoint of developing flexibility.
  • reaction operation is not particularly limited, for example, it is more preferable to carry out heat dehydration imidization in a polymerization solution in view of simplicity of work.
  • a solvent azeotropic with water such as toluene and xylene
  • tetrabasic acid dianhydride is added and reacted at 80 ° C. or lower, preferably 0 to 50 ° C. for 1 to 24 hours to obtain a polyamic acid solution.
  • the resulting polyamic acid solution is heated at 100 to 200 ° C., preferably 150 to 200 ° C., and the polyimide solution can be obtained by ring-closing while removing water azeotropically with toluene. At this time, the reaction was completed when it was confirmed that almost the theoretical amount of water was distilled off and that no outflow of water was observed. On the other hand, apart from this method, the polyamic acid dehydration ring closure reaction can also be carried out at a low temperature using an acetic anhydride / pyridine mixed solution.
  • carboxylic acid compound those having two or more carboxyl groups are preferable.
  • examples include organic acids such as terephthalic acid, isophthalic acid, hexahydrophthalic acid, tetrahydrophthalic acid, pyromellitic acid, trimellitic acid, methyl nadic acid, dodecyl succinic acid, chlorendic acid, maleic acid, and adipic acid. It can be used alone or in combination of two or more.
  • solder resist ink, coverlay film, and adhesive film it can be used to form the outermost insulating protective film.
  • an adhesive film an adhesive film with a metal foil, a prepreg, and a prepreg with a metal foil, it can be used for producing a multilayer substrate other than the outermost layer.
  • soldering resist ink of this invention can be used conveniently for manufacture of a flexible circuit board.
  • a wiring board can be obtained.
  • the drying conditions can be set as appropriate by those skilled in the art depending on the type of solder resist used, but at least the solvent constituting the solder resist ink is sufficiently dried and the resin composition is sufficiently thermoset. It is necessary to satisfy the conditions.
  • the adhesive film of the present invention can be suitably used as an insulating protective film on the outermost layer of the circuit board, similarly to the solder resist ink and coverlay film described above. Specifically, first, the adhesive film of the present invention is bonded to a predetermined portion of the flexible printed wiring board using a method such as lamination with a vacuum laminator or press lamination with a metal plate. Then, after peeling a support body film (B), the flexible printed wiring board by which the whole surface or one part surface was protected with the adhesive film of this invention by hardening a resin composition layer (A) is obtained. Can do.
  • the adhesive film of this invention can be used conveniently for manufacture of a multilayer flexible circuit board.
  • the adhesive film of the present invention is bonded to one side or both sides of a double-sided flexible circuit board prepared in advance using a method such as lamination with a vacuum laminator or press lamination with a metal plate.
  • the support film layer (B) is peeled off, and another double-sided flexible circuit board prepared in advance is bonded to the exposed surface of the resin composition layer (A) using a vacuum laminator.
  • a multilayer flexible printed wiring board can be obtained by hardening the resin composition layer (A) and finally obtaining conduction between the layers by forming through holes.
  • the circuit board to be used can be a single-sided circuit board or a double-sided circuit board that can be combined at the same time. Furthermore, a rigid circuit board using a glass epoxy board or the like and a flexible circuit board can be combined to produce a flex-rigid circuit board. .
  • a varnish containing 55% by weight of a polyimide resin (B4) having a phenol group but not having an HFA group was prepared.
  • the content of the siloxane structure in the resin is 65.3% by weight, and the OH equivalent is 1744 g / mol.
  • a resin composition was prepared in the same manner as described above, applied to the glossy surface of the copper foil so that the thickness when dried was in the range of 40 to 100 ⁇ m, and 75 minutes at 75 to 120 ° C. After heating, the film was further heated at 180 ° C. for 90 minutes to obtain a cured film.
  • the copper foil on which the cured film was formed was immersed in a ferric chloride solution and etched away, and then dried at 100 ° C. for 10 minutes to produce a cured film from which the copper foil was removed.
  • the cured film with copper foil obtained by the above method was (1) 220 ° C in air for 30 minutes, (2) 250 ° C in air for 30 minutes, (3) 270 ° C in air for 30 minutes, respectively.
  • Heat treatment was performed.
  • the cured film with copper foil after heat treatment was immersed in a ferric chloride solution to remove the copper foil by etching, and then dried at 100 ° C. for 10 minutes to prepare a cured film from which the copper foil was removed.
  • Examples 1 to 3, 5, 6, and 8 which are compositions containing a siloxane structure-containing polyimide resin having an HFA group have a small rate of change in elastic modulus after heat treatment at 250 ° C. for 30 minutes, It showed excellent heat resistance and excellent solvent resistance.
  • Examples 4 and 7 although the elastic modulus change rate after heat treatment at 250 ° C. for 30 minutes is large, the elastic modulus before heat treatment itself is a very small value of 60 MPa or less, and the flexibility is sufficiently maintained. I understand.
  • the siloxane structure-containing polyimide resin having an HFA group is not too large, particularly the rate of change in elastic modulus is small and excellent in maintaining flexibility. I understand.
  • Example 13 Manufacture of coverlay film
  • the resin composition of Example 2 was applied onto a polyimide film having a thickness of 25 ⁇ m using a die coater so that the thickness after drying was 35 ⁇ m. After coating, the resin composition layer was formed by drying at 75 to 120 ° C. for 12 minutes to prepare a coverlay film. Subsequently, it wound up in roll shape, bonding the 15-micrometer-thick polypropylene film on the surface of a resin composition layer.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)

Abstract

L'invention concerne une composition de résine pour carte imprimée contenant (A) une résine polyimide contenant un groupe hexafluoroisopropanol et une structure siloxane et (B) une résine thermodurcissable, et présentant d'excellentes propriétés de résistance aux solvants, de faibles variations de températures de son module d'élasticité et de thermorésistance.
PCT/JP2009/069070 2008-11-10 2009-11-10 Composition de résine pour carte de circuit imprimés WO2010053185A1 (fr)

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JP2010536815A JP5594144B2 (ja) 2008-11-10 2009-11-10 プリント配線板用樹脂組成物
CN200980144733XA CN102209754B (zh) 2008-11-10 2009-11-10 印刷线路板用树脂组合物

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JP2015168733A (ja) * 2014-03-05 2015-09-28 住友電工プリントサーキット株式会社 インク組成物、保護膜及びフレキシブルプリント配線板
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WO2016052312A1 (fr) * 2014-10-02 2016-04-07 セントラル硝子株式会社 Substrat pour électroluminescence organique, et écran électroluminescent organique l'utilisant
JP2016076480A (ja) * 2014-10-02 2016-05-12 セントラル硝子株式会社 有機エレクトロルミネッセンス用基板およびそれを用いた有機エレクトロルミネッセンスディスプレイ
JPWO2014171345A1 (ja) * 2013-04-16 2017-02-23 東洋紡株式会社 金属箔積層体
WO2018062404A1 (fr) * 2016-09-29 2018-04-05 積水化学工業株式会社 Matériau isolant intercouche et carte de circuit imprimé multicouche
JP2019196459A (ja) * 2018-05-11 2019-11-14 セントラル硝子株式会社 電子部品用ポリイミド基板
WO2022224473A1 (fr) 2021-04-21 2022-10-27 昭和電工マテリアルズ株式会社 Substrat de câblage
WO2023090363A1 (fr) * 2021-11-18 2023-05-25 株式会社レゾナック Composition de résine, objet durci, feuille, produit stratifié et carte de circuit imprimé

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JP7003794B2 (ja) * 2017-03-29 2022-01-21 荒川化学工業株式会社 ポリイミド、接着剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法
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US9392689B2 (en) 2010-10-25 2016-07-12 Daikin Industries, Ltd. Metal-clad laminate, method for producing same, and flexible printed board
JP2012106491A (ja) * 2010-10-25 2012-06-07 Daikin Industries Ltd 金属張積層板及びその製造方法、並びに、フレキシブルプリント基板
CN103180138A (zh) * 2010-10-25 2013-06-26 大金工业株式会社 覆金属箔层压板及其制造方法、以及柔性印刷基板
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WO2012057124A1 (fr) * 2010-10-25 2012-05-03 ダイキン工業株式会社 Stratifié métallisé, procédé de fabrication associé, et carte de circuit imprimé flexible
JP2013147598A (ja) * 2012-01-20 2013-08-01 Asahi Kasei E-Materials Corp 未硬化接着性樹脂、積層体及びプリント配線板の製造方法
JPWO2014171345A1 (ja) * 2013-04-16 2017-02-23 東洋紡株式会社 金属箔積層体
JP2015168733A (ja) * 2014-03-05 2015-09-28 住友電工プリントサーキット株式会社 インク組成物、保護膜及びフレキシブルプリント配線板
JP2016020437A (ja) * 2014-07-14 2016-02-04 住友電気工業株式会社 プリント配線板用接着剤組成物、プリント配線板用ボンディングフィルム、プリント配線板用カバーレイ、銅張積層板及びプリント配線板
JP2016076480A (ja) * 2014-10-02 2016-05-12 セントラル硝子株式会社 有機エレクトロルミネッセンス用基板およびそれを用いた有機エレクトロルミネッセンスディスプレイ
WO2016052312A1 (fr) * 2014-10-02 2016-04-07 セントラル硝子株式会社 Substrat pour électroluminescence organique, et écran électroluminescent organique l'utilisant
WO2018062404A1 (fr) * 2016-09-29 2018-04-05 積水化学工業株式会社 Matériau isolant intercouche et carte de circuit imprimé multicouche
JP6391851B2 (ja) * 2016-09-29 2018-09-19 積水化学工業株式会社 層間絶縁材料及び多層プリント配線板
JPWO2018062404A1 (ja) * 2016-09-29 2018-10-04 積水化学工業株式会社 層間絶縁材料及び多層プリント配線板
US11873398B2 (en) 2016-09-29 2024-01-16 Sekisui Chemical Co., Ltd. Interlayer insulating material and multilayer printed wiring board
JP2019196459A (ja) * 2018-05-11 2019-11-14 セントラル硝子株式会社 電子部品用ポリイミド基板
JP7265113B2 (ja) 2018-05-11 2023-04-26 セントラル硝子株式会社 電子部品用ポリイミド基板
WO2022224473A1 (fr) 2021-04-21 2022-10-27 昭和電工マテリアルズ株式会社 Substrat de câblage
WO2023090363A1 (fr) * 2021-11-18 2023-05-25 株式会社レゾナック Composition de résine, objet durci, feuille, produit stratifié et carte de circuit imprimé

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CN102209754A (zh) 2011-10-05
TW201031708A (en) 2010-09-01
KR20110084526A (ko) 2011-07-25
CN102209754B (zh) 2013-07-17
KR101566768B1 (ko) 2015-11-06
JP5594144B2 (ja) 2014-09-24
TWI494373B (zh) 2015-08-01
JPWO2010053185A1 (ja) 2012-04-05

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