WO2010001851A1 - 圧着端子及びこれを備えた端子付電線並びにこれらの製造方法 - Google Patents
圧着端子及びこれを備えた端子付電線並びにこれらの製造方法 Download PDFInfo
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- WO2010001851A1 WO2010001851A1 PCT/JP2009/061839 JP2009061839W WO2010001851A1 WO 2010001851 A1 WO2010001851 A1 WO 2010001851A1 JP 2009061839 W JP2009061839 W JP 2009061839W WO 2010001851 A1 WO2010001851 A1 WO 2010001851A1
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- terminal
- plating layer
- electric wire
- tin plating
- crimp
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/10—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation
- H01R4/18—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping
- H01R4/183—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping for cylindrical elongated bodies, e.g. cables having circular cross-section
- H01R4/184—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping for cylindrical elongated bodies, e.g. cables having circular cross-section comprising a U-shaped wire-receiving portion
- H01R4/185—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping for cylindrical elongated bodies, e.g. cables having circular cross-section comprising a U-shaped wire-receiving portion combined with a U-shaped insulation-receiving portion
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/49218—Contact or terminal manufacturing by assembling plural parts with deforming
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49224—Contact or terminal manufacturing with coating
Definitions
- the present invention relates to a crimp terminal crimped to a terminal of an electric wire routed in an automobile or the like, an electric wire with a terminal having the crimp terminal, and a manufacturing method thereof.
- a crimping technique as shown in Patent Document 1 is frequently used as a means for attaching a terminal to an end of an insulated wire. This crimping is performed by caulking a wire crimping portion (for example, a conductor barrel) previously formed on the terminal to the end of the conductor of the insulated wire.
- a wire crimping portion for example, a conductor barrel
- the crimping technique makes it difficult to set the degree of deformation of the wire crimping part.
- the wire crimping portion is a conductor barrel
- the tensile strength stress at which the crimp terminal holds the electric wire
- the mechanical strength can be kept high, but there is a disadvantage that the contact resistance between the conductor barrel and the conductor of the electric wire is increased.
- Patent Document 1 discloses a technique for simultaneously forming a portion with a high crimping height and a portion with a small crimping height on the conductor barrel.
- the portion having a large crimping height is formed at the tip end portion of the conductor and contributes to the maintenance of the mechanical strength.
- the portion where the crimping height is small contributes to a decrease in contact resistance.
- An object of the present invention is to provide a possible crimp terminal, an electric wire with a terminal provided with the terminal, and a manufacturing method thereof.
- the present inventors paid attention to the structure of the metal plate constituting the crimp terminal, particularly the presence of the tin plating layer constituting the surface thereof.
- the metal plate generally includes a main body portion made of copper or a copper alloy and the tin plating layer covering the surface thereof.
- This tin plating layer plays an important role in stabilizing the contact with the counterpart terminal. Specifically, by covering the surface of the main body, a copper oxide film that causes a decrease in contact resistance is prevented from being formed on the surface. A tin oxide film is also formed on the surface of the tin plating layer. However, the tin oxide film is more fragile than the copper oxide film, and therefore does not significantly affect the contact resistance.
- the tin plating layer has the above advantages, it has been found that the tin plating layer can be a factor that hinders a decrease in contact resistance between the crimp terminal and the conductor of the end of the electric wire to which the crimp terminal is crimped. This is because the tin plating layer has a characteristic that it is slippery (as compared with copper or a copper alloy) with respect to the conductor of the terminal, and the slip prevents adhesion between the crimping terminal and the conductor due to the press contact. It is presumed that the decrease in contact resistance due to the adhesion is inhibited.
- the present invention has been made from such a point of view, and is an electric connection part that is fitted and electrically connected to the other terminal, and an electric wire crimping that is crimped to the terminal of the electric wire from which the conductor is exposed at the terminal.
- the crimp terminal is formed of a metal plate having a main body including copper and a tin plating layer covering the surface thereof, and the wire crimping portion is in contact with the terminal of the wire.
- the thickness of the tin plating layer is smaller than the thickness of the tin plating layer at the electrical contact surface where the electrical contact portion comes into contact with the counterpart terminal.
- the presence of the tin plating layer on the electrical contact surface makes it possible to ensure good electrical contact with the counterpart terminal as in the conventional crimp terminal, while wire crimping.
- the thickness of the tin plating layer on the crimping surface is smaller than the thickness of the tin plating layer on the electrical contact surface, the thickness of the tin plating layer on the crimping surface is tin plating on the electrical contact surface Compared with the conventional crimp terminal which is equivalent to the thickness of the layer, it is possible to improve the adhesion between the crimp surface and the conductor of the wire end and to reduce the contact resistance between them. That is, the contact resistance can be kept low without increasing the degree of deformation for crimping the wire crimping portion (for example, without lowering the crimping height of the conductor barrel).
- FIG. 1 shows a terminal-attached electric wire according to an embodiment of the present invention.
- the electric wire with terminal includes the electric wire 20 and the crimp terminal 10, and is manufactured by a process of manufacturing the crimp terminal 10 and a process of crimping the crimp terminal 10 to the terminal of the electric wire 20.
- the electric wire 20 includes a conductor 22 composed of a plurality of strands and an insulating coating 24 that covers the conductor 22 from the outside.
- the insulating coating 24 is partially removed at the end thereof, whereby the conductor 22 is Exposed.
- the crimp terminal 10 is crimped to the end of the electric wire 20.
- the material of the conductor 22 is not particularly limited, and various conductive materials can be used in addition to commonly used copper and copper alloys. However, the present invention is particularly effective for a material such as aluminum or an aluminum alloy in which an oxide film that tends to increase contact resistance is easily formed on the surface.
- the crimp terminal 10 is formed by bending a single metal plate, like the conventional terminal, and has an electrical contact portion 12 and a wire crimp portion 14 at the front and rear.
- the electrical contact portion 12 is a female type, and is formed by folding back from the front inside a box-like portion 12a into which a male terminal (mating terminal) (not shown) can be inserted.
- An electrical contact portion of the male terminal is inserted between the contact spring piece 12b and the back surface of the top wall of the box-like portion 12a. Therefore, the upper surface of the contact spring piece 12b and the rear surface of the top wall of the box-shaped portion 12a include an electrical contact surface that can contact the counterpart terminal.
- the crimp terminal according to the present invention may be a male terminal having a tab-like electrical contact portion.
- the wire crimping portion 14 includes a base portion 15 extending rearward from the electrical contact portion 12 along the axial direction, and a pair of left and right conductor barrels extending from the base portion 15 in a direction intersecting the axial direction (a direction orthogonal to the drawing). 16 and a pair of left and right insulation barrels 18 extending substantially parallel to the conductor barrels 16.
- the two conductor barrels 16 are U-shaped when viewed from the rear before bending for crimping, and the two insulation barrels 18 have the same shape.
- the two conductor barrels 16 are crimped to the conductors 22 so as to embrace the conductors 22 exposed at the ends of the electric wires 20 by the bending process.
- both the insulation barrels 18 are pressure-bonded to the insulating coating 24 by the bending process so as to embrace the insulating coating 24 covering the conductor 22 immediately behind the exposed portion of the conductor 22. Therefore, the inner side surfaces of the base portion 15 and the two conductor barrels 16 constitute a crimping surface that comes into pressure contact with the conductor 22 exposed at the end of the wire 20.
- the metal plate constituting the crimp terminal 10 includes a main body portion including copper and a tin plating layer formed on the surface thereof.
- the main body portion may be composed only of a base material made of copper or a copper alloy (for example, brass or other heat-resistant copper alloy), or a base material containing zinc and the zinc diffuses into the tin plating layer.
- a barrier layer having a predetermined thickness formed on the surface of the base material may be used.
- this barrier layer for example, a layer made of copper or a copper alloy (for example, brass) and having a thickness of about 0.5 ⁇ m to 1 ⁇ m is suitable.
- the crimp terminal 10 is characterized in that the thickness of the tin plating layer on the crimp surface where the wire crimping portion 14 contacts the conductor 22 of the terminal of the wire 20 is different from that of the mating terminal. It is smaller than the thickness of the tin plating layer on the electrical contact surface that comes into contact. Such a setting of the thickness of the tin plating layer is to ensure good electrical contact between the electrical contact portion 12 and the counterpart terminal, and between the wire crimping portion 14 and the conductor 22 at the end of the wire 20. Realization of coexistence with suppression of contact resistance.
- the thickness of the tin plating layer on the electric contact surface in the electric contact portion 12 is preferably at least 0.2 ⁇ m or more, more preferably 1 ⁇ m or more.
- the thickness of the tin plating layer is preferably 10 ⁇ m or less.
- the contact due to the presence of the tin plating layer is such that the thickness of the tin plating layer on the crimping surface is suppressed to be smaller than the thickness of the tin plating layer on the electric contact surface.
- the tin plating layer existing on the crimping surface has a small coefficient of friction with the mating conductor 22 to which the crimping surface is to be crimped and is slippery. It is considered that the adhesion of the resin is prevented, and the decrease in contact resistance due to the adhesion is prevented. Therefore, thinning the tin plating layer on the crimping surface to reduce its influence makes it possible to reduce the contact resistance without significantly reducing the crimping height of the conductor barrel 16.
- the thickness of the tin plating layer on the pressure-bonding surface is preferably as small as possible, and is preferably 1 ⁇ m or less, more preferably 0.6 ⁇ m, still more preferably 0.4 ⁇ m or less, and even more preferably 0.2 ⁇ m or less. Good. Further, when it is not necessary to consider the influence of the formation of the copper oxide film on the crimping surface, the thickness of the tin plating layer on the crimping surface may be set to 0 ⁇ m to expose the main body.
- the contact resistance between the crimping surface and the conductor 22 at the end of the electric wire 20 is equivalent to the thickness of the tin plating layer on the crimping surface being smaller than the thickness of the tin plating layer on the electrical contact surface. Reduced.
- a metal plate manufacturing process for manufacturing a metal plate including a tin plating layer having a thickness set as described above, and a terminal original plate having a predetermined shape is punched from the metal plate and bent.
- a method including a terminal forming step of forming the crimp terminal 10 by processing is effective.
- This metal plate can be manufactured by the following method A or B, for example.
- This method includes a plating step in which a tin plating layer is formed on the surface of a main body portion (portion made of copper or copper alloy) constituting the metal plate, and this plating step is performed on the entire surface of the main body portion.
- a second plating step for forming a layer Applying the second plating step only to the specific region makes it possible to make the thickness of the tin plating layer in the specific region larger than the thickness of the tin plating layer in the other region. In other words, the thickness of the tin plating layer on the crimping surface can be made smaller than the thickness of the tin plating layer on the electrical contact surface.
- FIG. 2 shows a strip 30 made of the metal plate, and a large number of crimp plates 10 are punched from the strip 30.
- a plurality of terminal blanks having a shape corresponding to a developed view of the crimp terminal 10, and these terminal blanks are longitudinal directions of the strip 30.
- the bridge 32 extending in the longitudinal direction of the strip 30 is punched out so as to connect the rear ends of the terminal original plates.
- the crimp terminal 10 is separated from the bridge 32.
- the bridge 32 is formed with a positioning hole 34 used for positioning in the mold.
- a broken line L shown in FIG. 2 indicates a front side portion 30a where the electrical contact portion 12 of the crimp terminal 10 is punched and a rear side portion where the wire crimp portion 14 and the bridge 32 of the crimp terminal 10 are punched.
- the boundary with 30b is shown.
- the second plating step is performed only on the front portion 30a, for example, so that the electric power is finally obtained. It becomes possible to manufacture the crimp terminal 10 in which the thickness of the tin plating layer in the wire crimping portion 14 is smaller than the thickness of the tin plating layer in the contact portion 12.
- This plating step can be performed using, for example, the first plating bath 40A and the second plating bath 40B shown in FIGS.
- each of the plating baths 40 ⁇ / b> A and 40 ⁇ / b> B is a container that opens upward, and slits 44 that open upward are formed on the side walls on both sides in the longitudinal direction.
- These slits 44 have a shape that allows the strip 30 in a state before the tin plating layer is formed (that is, a state consisting of only the main body portion) to pass in a vertical state.
- both plating baths 40A and 40B are arranged so that both slits 44 of plating bath 40A and both slits 44 of plating bath 40B are aligned in a straight line.
- a plating solution 42 made of molten tin is injected into each of the plating baths 40A and 40B, and continuously in the plating baths 40A and 40B at a speed corresponding to the speed at which the plating solution 42 flows out of the slit 44.
- the liquid level of the plating solution 42 is held at a certain height position above the lower end of the slit 44.
- the level 42a of the plating solution 42 in the first plating bath 40A is higher than the level 42b of the plating solution 42 in the second plating bath 40B.
- the strip 30 is passed at a height position where the entire strip 30 is immersed in the plating solution 42 of the first plating bath 40A, and only the front side portion 30a of the strip 30 is the second plating bath 40B.
- the first plating step and the second plating step can be performed continuously and efficiently by passing the plate at a height position immersed in the plating solution 42.
- the method for performing the first plating step and the second plating step is not limited to the method of giving the height difference to the liquid levels 42a and 42b as described above.
- the second plating step is performed only on the front portion 30a by passing the strip 30 through the plating solution 42 in the second plating bath 40B in a state where the rear portion 30b of the strip 30 is masked. Can be applied.
- the boundary of both the parts 30a and 30b can be changed suitably. In short, it is sufficient that the electrical contact surface is included in the portion where the second plating step is performed and the crimping surface is not included.
- the second plating step may be performed before the first plating step. That is, after tin plating is performed only on the front portion 30a, further tin plating may be performed over the entire surface of the strip 30 from above.
- the plating step includes a first plating step in which a tin plating layer is formed in a region including the electrical contact surface in the main body portion of the metal plate and excluding the crimping surface, and the first plating step.
- the first tin plating layer is inverted by 180 ° to replace the remaining rear portion 30b with the plating solution.
- a second plating layer thinner than the first tin plating layer may be formed by dipping in 42.
- Method B is a region that includes a plating step of forming a tin plating layer on the surface of a body portion (portion made of copper or a copper alloy) constituting the metal plate, and then includes the pressure-bonding surface.
- a heat treatment step for heating only the region excluding the electrical contact surface, and the heating causes at least a part of the tin plating layer to be dissolved in the main body portion to reduce the thickness of the tin plating layer. It is.
- FIG. 5 shows an example of a laminated structure of metal plates after the plating step.
- a base material 50 made of a copper alloy (for example, brass or a heat-resistant copper alloy), a barrier layer 52 made of copper, and a tin plating layer 54 are sequentially laminated.
- the barrier layer 52 constitutes the main body together with the base material 50, and plays a role of preventing the zinc contained in the base material 50 from diffusing into the tin plating layer 54, and may be omitted in some cases. Is possible.
- a part of tin contained in the tin plating layer 54 is dissolved in copper diffusing from the barrier layer 52 or the base material 50 in the vicinity thereof.
- a copper-tin alloy for example, Cu6Sn5
- the thickness of the tin plating layer 54 is reduced accordingly. Therefore, it is possible to apply such heat treatment only to a specific region (for example, the rear portion 30b of the strip 30 shown in FIG. 2) including the crimping surface and excluding the electrical contact surface.
- the thickness of the tin plating layer above can be made smaller than the thickness of the tin plating layer on the electrical contact surface.
- the heating conditions in the heat treatment step may be set as appropriate as long as the thickness of the tin plating layer can be reduced. In general, heating at about 200 ° C. to 600 ° C. is preferably performed for 3 to 60 seconds.
- the heating means is not particularly limited, and various burners, electric heaters, hot air, infrared rays, lasers, and the like can be used.
- the heating device includes a pair of heating sources (for example, a burner device and an electric heater) 60 disposed above and below, and a masking member 62 disposed between the heating sources 60, and the strip 30 between the two heating sources 60. Passes in a predetermined direction (depth direction in the figure).
- the masking member 62 has a shape that blocks between the front portion 30a of the strip 30 and the two heating sources 60 when the strip 30 passes. This masking allows local heating only on the rear portion 30b.
- This heat treatment may be performed until the tin plating layer on the pressure-bonding surface disappears.
- the pressure-bonding surface includes a portion where the main body portion is exposed, but the portion is a copper-tin alloy formed by solid solution of tin in the main body portion. Compared to the case where the copper alloy is exposed as it is, the oxide film is less likely to be formed.
- a plating process and a heat treatment process are performed in advance before forming a crimp terminal from a metal plate. These processes are performed during or after the process of forming the crimp terminal. Also good. For example, after the terminal original plate as shown in FIG. 2 is punched out from the metal plate composed only of the main body portion, the terminal original plate is subjected to the plating process and the heat treatment step before being bent. Alternatively, the plating step and the heat treatment step may be performed on the one formed from the terminal original plate to the final terminal shape.
- the plating process and the heat treatment process are performed at a stage before the terminal original plate is punched from the strip, that is, at a stage where the main body of the metal plate is a simple flat plate. This makes it very easy to perform these steps.
- the crimp terminal according to the comparative example has a configuration equivalent to that of the crimp terminal 10 shown in FIG. 1, and the metal plate constituting the crimp terminal 10 is laminated on a main body portion made of brass and on the surface thereof. And a tin plating layer having a thickness of 0.8 to 1.5 ⁇ m.
- the tin plating layer on the crimp surface is reduced to a thickness of about 0.3 ⁇ m by a local heat treatment at 150 ° C.
- the horizontal axis represents the clamp height (crimp height) of the conductor barrel
- the vertical axis represents the adhesion force (force at which the conductor barrel adheres to the wire terminal) and the contact resistance at the wire crimp portion.
- a possible crimp terminal, a terminal-equipped electric wire including the same, and a method of manufacturing the same are provided.
- the crimp terminal according to the present invention has an electrical connection portion that is electrically connected by being mated with a counterpart terminal, and a wire crimp portion that is crimped to the terminal of the electric wire where the conductor is exposed at the terminal. And a metal plate having a tin plating layer covering the surface thereof.
- the thickness of the tin plating layer at the crimping surface where the wire crimping portion contacts the terminal of the wire is such that the tin plating layer at the electrical contact surface where the electrical contact portion contacts the counterpart terminal. Less than the thickness of
- the presence of the tin plating layer on the electrical contact surface makes it possible to ensure good electrical contact with the counterpart terminal as in the conventional crimp terminal, while wire crimping.
- the thickness of the tin plating layer on the crimping surface is smaller than the thickness of the tin plating layer on the electrical contact surface, the thickness of the tin plating layer on the crimping surface is tin plating on the electrical contact surface Compared with the conventional crimp terminal which is equivalent to the thickness of the layer, it is possible to improve the adhesion between the crimp surface and the conductor of the wire end and to reduce the contact resistance between them. That is, the contact resistance can be kept low without increasing the degree of deformation for crimping the wire crimping portion (for example, without lowering the crimping height of the conductor barrel).
- the thickness of the tin plating layer on the pressure-bonding surface is preferably 0.1 ⁇ m or more and 1.0 ⁇ m or less, for example, depending on specifications.
- the pressure-bonding surface may include a portion where the main body portion is exposed without the tin plating layer.
- the main body portion is made of an alloy of, for example, copper (contained in the main body portion) and tin (which constitutes the tin plating layer), Compared with the case where the exposed portion is copper or a copper alloy, formation of an oxide film at that portion can be suppressed.
- the manufacturing method of the crimp terminal which concerns on this invention is for manufacturing the said crimp terminal,
- the combination of the first plating step and the second plating step gives a difference between the thickness of the tin plating layer on the crimping surface and the thickness of the tin plating layer on the electrical contact surface. Enable.
- the plating step includes a first plating step in which a tin plating layer is formed in a region including the electrical contact surface in the main body portion of the metal plate and excluding the crimping surface, and the first plating step.
- the plating step may be performed during the terminal molding step (for example, immediately after punching out from a metal plate) or after the terminal molding step. More preferably, the plating step is performed before the terminal molding step. Is performed to form a metal plate having the main body and the tin plating layer, and the terminal forming step is preferably performed using the metal plate. In this method, a tin plating layer can be easily formed on the surface of the main body portion of a simple metal plate.
- the manufacturing method of the crimp terminal according to the present invention includes a terminal molding step of molding the terminal having the electrical contact portion and the wire crimp portion by a metal plate having a main body portion containing copper, and before the terminal molding step, Includes a plating step for forming a tin plating layer on the surface of the main body of the metal plate during the terminal molding step or after the terminal molding step, and the crimping surface of the metal plate on which the tin plating layer is formed. Heating only to reduce the thickness of the tin plating layer by dissolving at least a part of the tin plating layer with copper contained in the main body portion only in the region excluding the electrical contact surface. It may include a heat treatment step of performing.
- the subsequent local heat treatment step for the pressure-bonding surface is performed by disposing the tin plating layer on the pressure-bonding surface below it. It is possible to make the thickness of the tin plating layer smaller than the thickness of the tin plating layer on the electrical contact surface by dissolving with copper contained in the main body. Furthermore, it is also possible to eliminate the tin plating layer on the pressure-bonding surface and expose a portion (that is, an alloy portion) in which the copper and tin in the main body portion are dissolved.
- the plating step and the heat treatment step are performed to form a metal plate having the main body portion and the tin plating layer, and the terminal molding step is performed using this metal plate. It is more preferable to carry out.
- the electric wire with terminal includes an electric wire from which a conductor is exposed at the terminal and the crimp terminal, and the electric wire crimping portion of the crimp terminal is crimped to the conductor at the terminal of the electric wire.
- the tin plating layer in the electric contact portion of the crimp terminal enables good electrical contact between the electric contact portion and the counterpart terminal, while the electric wire in the electric wire crimp portion of the crimp terminal. Since the thickness of the tin plating layer on the crimping surface is suppressed, the contact resistance between the wire crimping portion and the conductor of the wire terminal is also reduced.
- the present invention is also a method for manufacturing a terminal-attached electric wire having an electric wire from which a conductor is exposed at a terminal and a crimp terminal crimped to the terminal, the terminal molding step for molding the crimp terminal, A crimping step of setting a conductor of the end of the electric wire on the electric wire crimping portion of the crimping terminal and crimping the crimping surface to the surface of the conductor by plastically deforming the electric wire crimping portion.
- the above-mentioned electric wire with terminal and the manufacturing method thereof are particularly effective when the conductor of the electric wire is made of aluminum or an aluminum alloy.
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- Engineering & Computer Science (AREA)
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- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (12)
- 端末において導体が露出する電線の当該端末に圧着される圧着端子であって、
相手方の端子と嵌合して電気的に接続される電気接続部と、
前記端末に圧着される電線圧着部とを有し、
この圧着端子は、銅を含む本体部及びその表面を覆うスズめっき層を有する金属板により形成され、前記電線圧着部が前記電線の端末に接触する圧着面での前記スズめっき層の厚みが、前記電気接触部が前記相手方の端子と接触する電気接触面での前記スズめっき層の厚みよりも小さい、圧着端子。 - 請求項1記載の圧着端子において、
前記圧着面での前記スズめっき層の厚みが0.1μm以上1.0μm以下である、圧着端子。 - 請求項1記載の圧着端子において、
前記圧着面は前記スズめっき層が存在せずに前記本体部が露出する部分を含み、この露出する部分の本体部が銅とスズの合金からなる、圧着端子。 - 請求項1または2記載の圧着端子を製造するための方法であって、
銅を含む本体部を有する金属板により前記電気接触部及び前記電線圧着部を有する端子を成形する端子成形工程と、
前記端子成形工程の前、前記端子成形工程中、または前記端子成形工程の後に、前記金属板の本体部の表面にスズめっき層を形成するめっき工程とを含み、このめっき工程は、前記金属板の本体部の表面全体にスズめっき層を形成する第1めっき工程と、この第1めっき工程の前または後に前記電気接触面を包含する領域であって前記圧着面を除く領域にのみスズめっき層を形成する第2めっき工程とを含む、圧着端子の製造方法。 - 請求項1または2記載の圧着端子を製造するための方法であって、
銅を含む本体部を有する金属板により前記電気接触部及び前記電線圧着部を有する端子を成形する端子成形工程と、
前記端子成形工程の前、前記端子成形工程中、または前記端子成形工程の後に、前記金属板の本体部の表面にスズめっき層を形成するめっき工程とを含み、このめっき工程は、前記金属板の本体部のうち前記電気接触面を包含する領域であって前記圧着面を除く領域にスズめっき層を形成する第1めっき工程と、この第1めっき工程の前または後に前記圧着面を包含する領域であって前記電気接触面を除く領域に前記第1めっき工程により形成されたスズめっき層よりも厚みの小さいスズめっき層を形成する第2めっき工程とを含む、圧着端子の製造方法。 - 請求項4または5記載の圧着端子の製造方法において、
前記端子成形工程の前に前記めっき工程が行われることにより前記本体部及び前記スズめっき層を有する金属板が形成され、この金属板を用いて前記端子成形工程が行われる、圧着端子の製造方法。 - 請求項1~3のいずれかに記載の圧着端子を製造するための方法であって、
銅を含む本体部を有する金属板により前記電気接触部及び前記電線圧着部を有する端子を成形する端子成形工程と、
前記端子成形工程の前、前記端子成形工程中、または前記端子成形工程の後に、前記金属板の本体部の表面にスズめっき層を形成するめっき工程と、
前記スズめっき層が形成された金属板のうち前記圧着面を包含する領域であって前記電気接触面を除く領域に対してのみ、当該スズめっき層の少なくとも一部を前記本体部に含まれる銅と固溶させて当該スズめっき層の厚みを減少させるような加熱を行う熱処理工程とを含む、圧着端子の製造方法。 - 請求項7記載の圧着端子の製造方法において、
前記端子成形工程の前に前記めっき工程及び前記熱処理工程が行われることにより前記本体部及び前記スズめっき層を有する金属板が形成され、この金属板を用いて前記端子成形工程が行われる、圧着端子の製造方法。 - 端子付電線であって、端末において導体が露出する電線と、請求項1~3のいずれかに記載の圧着端子とを有し、この圧着端子の電線圧着部が前記電線の端末の導体に圧着されている、端子付電線。
- 請求項9記載の端子付電線において、
前記電線の導体がアルミニウムまたはアルミニウム合金からなる、端子付電線。 - 端末において導体が露出する電線と、その端末に圧着される圧着端子とを有する端子付電線を製造するための方法であって、
請求項1~3のいずれかに記載の圧着端子を製造する工程と、
前記圧着端子の電線圧着部に前記電線の端末の導体をセットし、この電線圧着部を塑性変形させることによりその圧着面を前記導体の表面に圧着させる工程とを含む、端子付電線の製造方法。 - 請求項11記載の端子付電線の製造方法において、
前記電線の導体がアルミニウムまたはアルミニウム合金からなる、端子付電線の製造方法。
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US12/990,589 US8496504B2 (en) | 2008-06-30 | 2009-06-29 | Crimp terminal, terminal-equipped electric wire with the crimp terminal, and methods for producing them |
DE112009001530T DE112009001530T8 (de) | 2008-06-30 | 2009-06-29 | Crimpanschluss, mit Anschluss versehenes Kabel mit derartigem Crimpanschluss und Herstellungsverfahren hierfür |
CN200980125416.3A CN102077424B (zh) | 2008-06-30 | 2009-06-29 | 压接端子、具有其的带端子电线以及它们的制造方法 |
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JP (1) | JP5079605B2 (ja) |
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Also Published As
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CN102077424A (zh) | 2011-05-25 |
US20110045713A1 (en) | 2011-02-24 |
CN102077424B (zh) | 2012-12-26 |
JP2010010013A (ja) | 2010-01-14 |
DE112009001530T8 (de) | 2013-03-21 |
JP5079605B2 (ja) | 2012-11-21 |
US8496504B2 (en) | 2013-07-30 |
DE112009001530T5 (de) | 2011-05-12 |
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