Classifications

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  • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
  • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
  • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
  • B23K20/004—Wire welding
  • B23K20/005—Capillary welding
  • B23K20/007—Ball bonding
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  • H01L24/78—Apparatus for connecting with wire connectors
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2101/00—Articles made by soldering, welding or cutting
  • B23K2101/36—Electric or electronic devices
  • B23K2101/42—Printed circuits
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Definitions

• the present invention relates to wire bonding of semiconductor devices, and more particularly, to providing a cover gas to certain areas of a wire bonding machine.
• wire bonding techniques are often used to connect components in the devices.
• wire bonds or wire loops
• An exemplary conventional wire bonding operation involves (1) bonding a free air ball to a first bonding location on a die (e.g., using ball bonding) to form a first bond, (2) extending a wire from the first bond toward a second bonding location on a leadframe, (3) bonding the end of the extended wire to the second bonding location to form a second bond, and (4) cutting the wire.
• an electronic flame off i.e., EFO
• EFO electronic flame off
• gold wire which is substantially non-reactive with oxygen
• more reactive metals e.g., copper, silver, palladium, aluminum, etc.
• these more reactive metals may react, for example, in the presence of oxygen and form oxides/oxidation on the wires (and/or wire ends or tails) which are undesirable for wire bonding.
• certain wire bonding systems include subsystems for providing a cover gas to the end of a wire during formation of the free air ball by the EFO wand.
• various subsystems of wire bonding machines are used to provide the cover gas to the bond site area of the wire bonding machine to reduce the potential for oxidation of the bonding wire in the bond site area.
• Exemplary subsystems for providing a cover gas in the bond site area include U. S Patent Application Publication Nos. 2007/0284421; 2007/0251980; and U.S. Patent Nos. 5,265,788; 5,395,037; 6,866,182; and 7,182,793.
• a wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine.
• the wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation.
• the wire bonding machine also includes a gas delivery mechanism/system (e.g., a gas delivery structure) configured to provide a cover gas to: (1) the bond site area whereby the cover gas is ejected through at least one aperture of the gas delivery mechanism to the bond site area, and (2) the free air ball formation area.
• FIG. IA is a perspective view of a portion of a wire bonding system in accordance with an exemplary embodiment of the present invention.
• FIG. IB is a detailed view of a portion of FIG. IA;
• FIG. 1C is a perspective view of a gas delivery mechanism including a cover for covering a portion of a window of a device clamp in accordance with an exemplary embodiment of the present invention
• FIG. ID is a top detailed view of a portion of FIG. IA;
• FIG. IE is a top view of a portion of the gas delivery mechanism for the wire bonding machine of FIG. IA in accordance with an exemplary embodiment of the present invention
• FIG. IF is a front view of a portion of FIG. IG taken along line 1F-1F;
• FIG. IG is a perspective view of a bottom portion of a housing of the gas delivery mechanism for the wire bonding machine of FIG. IA with an insulator adjacent a tip end portion of an electrode in accordance with an exemplary embodiment of the present invention
• FIG. IH is a perspective view of a bottom portion of a housing of the gas delivery mechanism for the wire bonding machine of FIG. IA without an insulator adjacent a tip end portion of an electrode in accordance with an exemplary embodiment of the present invention
• FIG. 2 is a top perspective view of a portion of another gas delivery mechanism in accordance with an exemplary embodiment of the present invention
• FIG. 3 is a top perspective view of a portion of yet another gas delivery mechanism in accordance with an exemplary embodiment of the present invention.
• FIG. 4A is a top perspective view of a portion of yet another gas delivery mechanism in accordance with an exemplary embodiment of the present invention.
• FIG. 4B is a bottom perspective view of the portion of the gas delivery mechanism of FIG. 4A;
• FIG. 5A is a front perspective view of elements of a wire bonding machine including gas delivery mechanism elements in accordance with an exemplary embodiment of the present invention
• FIG. 5B is a bottom perspective view of the elements of FIG. 5A;
• FIG. 5C is a front view of the elements of FIG. 5A;
• FIG. 6A is a front perspective view of a portion of a gas delivery mechanism integrated with certain components of a wire bonding machine in accordance with an exemplary embodiment of the present invention
• FIG. 6B is a side perspective view of a portion of the gas delivery mechanism of FIG. 6A;
• FIG. 6C is a top view of a portion of the gas delivery mechanism of FIG. 6A with certain internal details shown in hidden lines;
• FIG. 6D is a cut-away front perspective view of a portion of the gas delivery mechanism of FIG. 6A;
• FIG. 7A is a front perspective view of a portion of a gas delivery mechanism integrated with certain components of a wire bonding machine in accordance with an exemplary embodiment of the present invention
• FIG. 7B is a side perspective view of a portion of the gas delivery mechanism of FIG. 7A;
• FIG. 7C is a top view of a portion of the gas delivery mechanism of FIG. 7A with certain internal details shown in hidden lines;
• FIG. 7D is a bottom perspective view of a portion of the gas delivery mechanism of FIG. 7A.
• FIG. 7E is a cut-away front perspective view of a portion of the gas delivery mechanism of FIG. 7A.
• the bond site area refers to the portion of a wire bonding machine where the actual formation of wire bonds (i.e., bonding or welding a portion of a wire to a bonding location) occurs.
• a leadframe strip carrying devices may be supported by a heat block of the wire bonding machine, and may be secured by a clamp of the wire bonding machine, during a wire bonding operation.
• the portion of the leadframe/devices accessible through a device aperture(s) of the window clamp may be viewed as the bond site area.
• free air ball formation area is the location where free air balls are formed during wire bonding. Such a location tends to be defined by other components including the location of the tip of an electrode for forming the free air balls, the location of the bonding tool, the location/length of the wire extending from the bonding tool, etc. (which locations may differ or be altered from machine to machine).
• the present invention relates to gas delivery mechanisms/systems that integrate a cover gas (e.g., a forming gas) flow into each of (1) the electronic flame-off area where free air balls are to be formed (i.e., the free air ball formation area), and (2) the bond site area.
• a cover gas e.g., a forming gas
• an EFO electrode is positioned at least partially within the gas delivery system without interfering with gas flow to either of the locations.
• the cover gas provided to the EFO area reduces the potential for oxidation during free-air-ball formation (e.g., during free air ball formation of copper wire) while the cover gas provided to the bond site area reduces the potential for oxidation of the wire during the bonding operation.
• cover gas By providing cover gas to the free air ball formation area and the bond site area using a single mechanism/structure, a number of advantages are achieved. For example, a simple cost effective mechanism is provided. Additionally, visibility and access during the wire bonding operation are facilitated by the reduction of multiple structures on the wir ebonding machine. Further still, a desirable range of motion for the bond head may be facilitated in contrast to other arrangements.
• a gas e.g., a cover gas such as a gas including nitrogen, argon, etc.
• a reducing gas such as hydrogen
• a constant (or variable or controlled) supply of the gas may be provided: (1) in the vicinity of the electronic flame off operation of a wire bonding machine; and (2) in the vicinity of the bond site area of a wire bonding machine, such that during the wire bonding operation there is a reduced potential for oxidation of the wires.
• a constant (or variable or controlled) supply of the gas may be provided: (1) in the vicinity of the electronic flame off operation of a wire bonding machine; and (2) in the vicinity of the bond site area of a wire bonding machine, such that during the wire bonding operation there is a reduced potential for oxidation of the wires.
• there may also be a reduction of oxide/oxidation already present on the wires similar to the effect of applying a reducing gas during formation of a free air ball.
• a wire tail e.g., the end portion of wire suspended from a capillary tip
• oxygen or the like may be subjected to oxygen or the like resulting in oxides forming on the wire tail.
• oxides may be undesirable for bonding, even if the wire tail is later formed into a free air ball.
• there are other phases of the wire bonding operation during which it is desirable to reduce the potential for oxidation of the wire (and/or wire ends) such as, for example, (1) when forming the second bond in the bond site area, (2) when lowering a formed free air ball to the bond site area, amongst others.
• the present invention addresses these situations by providing a supply of the gas: (1) in the vicinity of the electronic flame off operation of a wire bonding machine; and (2) in the vicinity of the bond site area of a wire bonding machine.
• FIG. IA illustrates wire bonding machine 10 (with various components removed for simplicity).
• Wire bonding machine 10 includes bond head assembly 100 which includes various components which are moved (e.g., using an XY table of the wire bonding machine) to form wire loops between bonding locations.
• Wire bonding machine 10 also includes device clamp 102 (sometimes referred to as a window clamp or a clamp insert) which secures the device to be wire bonded into place (e.g., on a heat block of the wire bonding machine).
• device clamp 102 sometimes referred to as a window clamp or a clamp insert
• FIG. IB various elements carried by bond head 100 are illustrated including transducer 104 and bonding tool 106. Also shown is gas delivery mechanism 110, through which bonding tool 106 extends.
• bonding tool 106 extends through aperture 110c of gas delivery mechanism 110.
• Bonding tool 106 is used to form wire loop interconnects between bonding locations.
• the bonding locations are part of bond site area 108 which is accessible to bonding tool 106 through device aperture 102a (also known as a window) of device clamp 102.
• gas delivery mechanism 110 is used to provide a gas (e.g., a cover gas) to (1) the vicinity of the electronic flame off operation of a wire bonding machine, and (2) the vicinity of the bond site area of a wire bonding machine.
• gas delivery mechanism 110 is supported by EFO (electronic flame-off) electrode support structure 100a, which is carried by the XY table of wire bonding machine 10.
• FIG. 1C illustrates an exemplary embodiment of the present invention in which cover 112 is provided over a portion of device aperture 102a of device clamp 102.
• cover 112 may be secured to gas delivery mechanism 110 (or some other portion of EFO electrode support structure 100a) such that cover 112 is presented KSI-517WO PATENT
• FIG. ID is a cross sectional perspective view of gas delivery mechanism
• bonding tool 106 illustrating a portion of cavities 110a and 110b of gas delivery mechanism 110.
• bonding tool 106 is shown in a bonding position where the tip end of the bonding tool is used to bond a portion of wire (not shown) to bonding locations in bond site area 108; however, it is understood that in a free air ball forming position, bonding tool 106 is raised (in comparison to the view of FIG. ID) such that the tip end portion of bonding tool 106 is within/adjacent gas delivery mechanism 110.
• an electronic flame off wand shown in FIGS. IG and IH
• the free air balls may be formed in an environment with a reduced potential for oxidation.
• Gas delivery mechanism 110 may include a top portion and a bottom portion which collectively define cavities HOa and HOb.
• FIG. IE illustrates internal portions of gas delivery mechanism 110 (i.e., the top of gas delivery mechanism 110 is transparent in the illustration).
• Gas delivery mechanism 110 defines cavity HOa and cavity HOb.
• Cavity HOa defines a gas delivery path between (1) a first gas inlet 114 (e.g., a gas supply pipe or tube 114), and (2) the vicinity of the electronic flame-off operation. More specifically, as shown in FIG. IE by the arrows, gas flow (e.g., a controlled gas supply) is provided to first gas inlet 114. The gas flows from first gas inlet 114 along the path provided by cavity HOa.
• a first gas inlet 114 e.g., a gas supply pipe or tube 114
• gas flow e.g., a controlled gas supply
• the path provided by cavity HOa extends to the area where free air balls are to be (i.e., the vicinity of the electronic flame-off operation, also known as the free air ball formation location).
• electrode 118 i.e., an electrode of an electronic flame-off device used to form free air balls
• an electronic flame-off device typically includes an electrode (such as electrode 118) which is used to melt an end of a wire extending from a bonding tool (such as bonding tool 106) to form a free air ball.
• cavity 110b defines a gas delivery path between (1) second gas inlet 116 (a gas supply pipe or tube 116), and (2) the vicinity of the bond site area of a wire bonding machine. More specifically, as shown in FIG. IE in by the arrows, gas flow (e.g., a controlled gas supply) is provided to second gas inlet 116. The gas flows from second gas inlet 116 along the path provided by cavity 110b.
• the path provided by cavity 110a extends to a plurality of through holes 110b3, 110b4, 110b5, 110b6, and 110b7. As shown in FIG.
• gas flows through cavity 110b, leading to (and through) through holes 110b3, 110b4, 110b5, 110b6, and 110b7.
• the gas then flows from through holes 110b3, 110b4, 110b5, 110b6, and 110b7 downward toward the bond site area of the wire bonding machine, thereby providing gas to the bond site area to reduce the potential for oxidation of the wire and/or wire ends.
• FIG. IF is a front view of a portion of FIG. IE taken along line IE-IE which illustrates top portion HOB and bottom portion HOA of gas delivery mechanism 110.
• This sectional view provides a view of a portion of cavities HOa and HOb, as well as a view of a portion of through holes 110b3 and 110b6.
• gas flows as indicated by the arrows
• bond site area 108 device 120, to be wirebonded, is located at bond site area 108).
• gas delivery mechanism HO includes top portion
• FIGS. 1G-1H illustrate two variations of bottom portion HOB.
• bottom portion HOB defines bottom portion HOaI of cavity HOa.
• bottom portion HOB defines bottom portion HObI of cavity HOb (including through holes 110b3, 110b4, 110b5, 110b6, and 110b7).
• Top portion HOB not shown in FIGS. 1G-1H, defines corresponding portions of cavities HOa and HOb).
• bottom portion HOA defines aperture portion HOcI of aperture HOc configured to receive bonding tool 106 (e.g., see FIG. IB) (top portion HOB, not shown, defines a corresponding portion of aperture HOc). Also shown in FIGS.
• FIGS. 1G-1H also illustrate two different configurations for the tip end of electrode 118. That is, in FIG, IG insulator 120 (e.g., an insulative bushing made of ceramic or the like) is provided at the tip end of electrode 118. Insulator 120 is provided to direct the spark from electrode 118 towards the end of the wire to form a free air ball (the wire is not shown in FIG. IG). More specifically, the spark is directed from the very tip of electrode 118 as opposed to KSI-517WO PATENT
• an insulative sealant or adhesive may be provided at the opening of insulator 120 which receives the tip end of electrode 118 to further direct the spark.
• an insulative sealant or adhesive may be provided at the opening of insulator 120 which receives the tip end of electrode 118 to further direct the spark.
• the tip end of electrode 118 is not received by an insulator such as insulator 120.
• FIGS. 1A-1H includes two gas supply sources (i.e., gas provided through gas inlets/pipes 114 and 116), it is understood that a single gas supply source/pipe could supply gas to gas supply mechanism 110.
• FIGS. 1A-1L a gas delivery mechanism for providing gas (1) in the vicinity of the electronic flame off operation of a wire bonding machine, and (2) in the vicinity of the bond site area of a wire bonding machine, is provided.
• the present invention is not limited to the configuration shown in FIGS. 1A-1H. In fact, there are multiple configurations contemplated within the scope of the present invention.
• bottom portion 210A of a gas delivery mechanism is illustrated (the top portion, which acts in a manner similar to top portion HOB described above, is omitted for simplicity).
• a gas delivery cavity is defined in the gas delivery mechanism, with the cavity being partially defined by bottom cavity portion 210al (and also by the top portion, not shown).
• Bottom portion 210A receives gas from gas inlet 214 (e.g., gas supply pipe 214).
• a tip end of electrode 218 extends into area 210cl where the flame-off operation for forming free air balls is to be conducted.
• Bottom portion 210A also defines apertures 210a3, 210a4, 210a5, 210a6, 210a7, and 210a8.
• gas When gas is delivered to the gas delivery mechanism via gas inlet/pipe 214, the gas extends through the cavity and to: (1) area 210cl for forming free air balls, where the gas travels from the cavity to area 210cl through apertures 212a and 212b, and (2) the bond site area via apertures 210a3, 210a4, 210a5, 210a6, 210a7, and 210a8.
• the bottom portion 310A of a gas delivery mechanism is illustrated (the top portion, which acts in a manner similar to top portion HOB described above, is omitted for simplicity).
• a gas delivery cavity is defined in the gas delivery mechanism, with the cavity being partially defined by bottom cavity portion 310al (and also by the top portion, not shown).
• Bottom portion 310A receives KSI-517WO PATENT
• Electrode 318 extends through gas inlet/pipe 314, and the tip end of electrode 318 extends into area 310cl where the flame-off operation for forming free air balls is to be conducted.
• Bottom portion 310A also defines apertures 310a3, 310a4, 310a5, 310a6, 310a7, and 310a8.
• gas inlet/pipe 314 When gas is delivered to the gas delivery mechanism via gas inlet/pipe 314, the gas extends through the cavity and to: (1) area 310cl for forming free air balls, where the gas travels from the cavity to area 310cl through apertures 312a and 312b and (2) the bond site area via 310a3, 310a4, 310a5, 310a6, 310a7, and 310a8.
• FIGS. 4A-4B illustrate gas delivery mechanism 410.
• Gas delivery mechanism 410 includes top portion 410A and bottom portion 410B which collectively define an internal cavity for receiving gas from gas inlet/supply pipe 414.
• Gas delivery mechanism 410 includes anchoring structure 420 for anchoring gas delivery mechanism 410 to a support structure of the wire bonding machine.
• a tip end of electrode 418 extends to area 410cl for forming free air balls.
• Bottom portion 410B defines apertures 410a3, 410a4, 410a5, 410a6, 410a7, 410a8, 410a9 and 41OaIO.
• gas delivery mechanism 410 When gas is delivered to the gas delivery mechanism 410 via gas inlet/pipe 414, the gas extends through the internal cavity and to: (1) the area 410cl for forming free air balls, where the gas travels from the cavity to area 210cl through aperture 414a (see arrows indicating gas flow), and (2) the bond site area via 410a3, 410a4, 410a5, 410a6, 410a7, 410a8, 410a9 and 41OaIO.
• Gas delivery mechanism 410 also defines side opening 430 which allows, for example, access for an operator and/or for a wire bonding tool to be positioned (e.g., swung or otherwise moved) adjacent area 410cl for forming free air balls.
• gas delivery mechanism 510 When gas is delivered to the gas delivery mechanism 510 via gas delivery pipe 514, the gas extends to: (1) the area inside gas delivery mechanism 510 for forming free air balls, and (2) the bond site area via the enlarged opening at the bottom of gas delivery mechanism 510 (as illustrated in FIG. 5B).
• the funnel-shaped sidewalls of gas delivery mechanism 510 are tapered, and aperture 510c at the top of gas delivery mechanism 510 is KSI-517WO PATENT
• an end of a wire extending from bonding tool 606 is positioned in the free air ball formation area (i.e., in through hole 610c).
• a tip end of electrode 618 which is used to form a free air ball on the end of the wire, is also positioned in the free air ball formation area.
• a cover gas is provided via gas inlet 614, and the cover gas travels through cavity/path 622 and exits at gas outlet 622a into through hole 610c.
• the cover gas provides protection against oxidation during the formation of free air balls in through hole 610c.
• bonding tool 606 extends further downward into (and at least partially past) through hole 610c to form wire bumps or wire loops on a device to be wirebonded at the bond site area.
• the cover gas that was ejected from gas outlet 622a into through hole 610c tends to travel downward through the lower opening of through hole 610c to bond site area. More specifically, because through hole 610 is tapered, the diameter of through hole 610c is smaller at the top of gas delivery mechanism 610 when compared to the diameter of the through hole at the bottom (i.e., diameter Dl is smaller than diameter D2 in FIG. 6D). Thus, more cover gas would tend to exit through hole 610c at the bottom than at the top.
• bonding tool 606 will block a large portion of the upper portion of through hole 610c, thus substantially reducing the potential for the escape of cover gas through the top of through hole 610c.
• a large portion of the cover gas that exits through hole 610c will be directed KSI-517WO PATENT
• FIGS. 7A-7E illustrates another gas delivery mechanism 710 (and corresponding portions of a wire bonding machine) that operates very similar to the mechanism 610 shown in FIGS. 6A-6D. More specifically, the wire bonding machine includes device clamp 702, transducer 704, bonding tool 706, electrode 718 (including a tip portion extending through aperture 718a), and gas delivery mechanism 710. Gas delivery mechanism 710 defines through hole 710c (i.e., free air ball formation area 710c) which is configured to receive bonding tool 706 during a wire bonding operation.
• through hole 710c i.e., free air ball formation area 710c
• FIGS. 7A-7E also illustrate an additional gas inlet 716 which provides a cover gas through cavity/path 624, exiting gas delivery mechanism 710 at gas outlet 624a.
• Gas outlet 624a is provided on a bottom surface of gas delivery mechanism 710 such that the exiting cover gas is directed toward a bond site area of the wire bonding machine.
• gas delivery mechanism 710 also includes an additional source of cover gas to the bond site area via gas inlet 616, cavity/path 624, and gas outlet 624a.
• additional protection in addition to the protection provided by the gas extending downward out of the free air ball formation area against potential oxidation at the bond site area is provided.
• the various exemplary gas delivery mechanisms disclosed herein may be supported by various structures of a wire bonding machine, for example, the bond head of a wire bonding machine.
• the gas delivery mechanisms may be supported by the EFO structure, amongst others.
• the body of the gas delivery mechanism may be formed from an insulative, and perhaps heat resistant, material such as ceramic, polyimide, amongst others.
• the flow of cover gas from a gas supply source may be a continuous flow of cover gas during the entire wire bonding operation.
• the flow may be a controlled flow (e.g., controlled using a controller integrated with the wire bonding machine) that is provided, for example, during periods of greatest concern regarding potential oxidation (e.g., during free air ball formation, etc.).
• the drawings provided herein illustrate exemplary structures for directing a cover gas to (1) the vicinity of the electronic flame off operation of a wire bonding machine, and (2) the vicinity of the bond site area of a wire bonding machine; however, the invention is not limited to the illustrated configurations.
• the present invention contemplates any type of structure, system or process for providing cover gas to both (1) the vicinity of the electronic flame off operation of a wire bonding machine, and (2) the vicinity of the bond site area of a wire bonding machine.
• the gas delivery mechanism can include any number of gas inlets (e.g., inlet gas pipes) to provide the desired gas flow and distribution to the free air ball formation area and the bond site area.
• the cover gas is desirably non-reactive with the metal and may be reducing.
• the cover gas may be an effectively inert gas such as nitrogen or argon.
• a reducing gas e.g., hydrogen
• the cover gas system of the present invention may be utilized to exclude air from the bond site area without the need for hydrogen in the cover gas.
• teachings of the present invention may also be utilized in connection with non-reactive bonding wire, such as gold wire.
• the cover gas may be utilized to provide a shield of clean gas at the bond site area, thereby providing a desirable environment for formation of gold wire loops.
• the present invention may be applicable to a wire bonding machine that forms wire loops, a wire bonding machine that forms conductive bumps (a bumping machine or a wafer bumping machine), a machine that forms both wire loops and conductive bumps, etc.

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• Power Engineering (AREA)
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• 2009
  • 2009-06-08 CN CN2009801082769A patent/CN101971314B/zh active Active
  • 2009-06-08 SG SG2012013447A patent/SG179409A1/en unknown
  • 2009-06-08 WO PCT/US2009/046535 patent/WO2009152066A2/en not_active Ceased
  • 2009-06-08 JP JP2011513596A patent/JP5753644B2/ja active Active
  • 2009-06-08 US US12/739,100 patent/US8066170B2/en active Active
  • 2009-06-08 KR KR1020107016250A patent/KR101434001B1/ko active Active
• 2011
  • 2011-10-13 US US13/272,664 patent/US8313015B2/en active Active

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