CN101971314B - 用于在引线接合操作中降低氧化的输气系统 - Google Patents

用于在引线接合操作中降低氧化的输气系统 Download PDF

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Publication number
CN101971314B
CN101971314B CN2009801082769A CN200980108276A CN101971314B CN 101971314 B CN101971314 B CN 101971314B CN 2009801082769 A CN2009801082769 A CN 2009801082769A CN 200980108276 A CN200980108276 A CN 200980108276A CN 101971314 B CN101971314 B CN 101971314B
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gas
delivery mechanism
wire bonding
gas delivery
balloon
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CN101971314A (zh
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加里·S·吉洛蒂
斯坦利·什切希利亚克
彼得·J·范·艾默里奇
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Kulicke and Soffa Industries Inc
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Kulicke and Soffa Industries Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
CN2009801082769A 2008-06-10 2009-06-08 用于在引线接合操作中降低氧化的输气系统 Active CN101971314B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US6018908P 2008-06-10 2008-06-10
US61/060,189 2008-06-10
PCT/US2009/046535 WO2009152066A2 (en) 2008-06-10 2009-06-08 Gas delivery system for reducing oxidation in wire bonding operations

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Publication Number Publication Date
CN101971314A CN101971314A (zh) 2011-02-09
CN101971314B true CN101971314B (zh) 2013-10-09

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US (2) US8066170B2 (enExample)
JP (1) JP5753644B2 (enExample)
KR (1) KR101434001B1 (enExample)
CN (1) CN101971314B (enExample)
SG (1) SG179409A1 (enExample)
WO (1) WO2009152066A2 (enExample)

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KR101121849B1 (ko) * 2010-03-31 2012-03-21 앰코 테크놀로지 코리아 주식회사 와이어 본딩 장치
US8186562B1 (en) * 2010-12-14 2012-05-29 Asm Technology Singapore Pte Ltd Apparatus for increasing coverage of shielding gas during wire bonding
JP2012244093A (ja) * 2011-05-24 2012-12-10 Renesas Electronics Corp 半導体装置の製造方法
JP5618974B2 (ja) * 2011-08-16 2014-11-05 株式会社新川 ワイヤボンディング装置
JP5651575B2 (ja) * 2011-12-27 2015-01-14 株式会社カイジョー ワイヤボンディング装置及びワイヤボンディング方法
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US8752751B2 (en) * 2012-07-13 2014-06-17 Asm Technology Singapore Pte Ltd Lead frame support plate and window clamp for wire bonding machines
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