JP5651575B2 - ワイヤボンディング装置及びワイヤボンディング方法 - Google Patents
ワイヤボンディング装置及びワイヤボンディング方法 Download PDFInfo
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- JP5651575B2 JP5651575B2 JP2011285197A JP2011285197A JP5651575B2 JP 5651575 B2 JP5651575 B2 JP 5651575B2 JP 2011285197 A JP2011285197 A JP 2011285197A JP 2011285197 A JP2011285197 A JP 2011285197A JP 5651575 B2 JP5651575 B2 JP 5651575B2
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- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
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Description
図1は、本発明のボンディング装置の構成を示す図である。尚、図8に示す従来のワイヤボンディング装置の構成部分と同一のものに関しては、同一の符号を用い、構成に関する詳細な説明は省略する。
図2は、熱風ヒータの構成を示す図である。図2に示すように、熱風ヒータ5は、ケーシング7と、ケーシング7に内蔵された発熱体(ヒータ)6と、ケーシング7の外周に設けられた支持体8とで構成される。ケーシング7は、ノズル形状を成し、先端から加熱された高圧空気又はガス等の気体を吹き出す熱風吹出口7bと他端に高圧の気体が流入するエア流入口7aとを有する。発熱体(ヒータ)6は、コイル状のフィラメント6から成り、フィラメント6は、抵抗温度係数が大きく、また、加熱の繰り返しでの抵抗温度係数が安定している部材が望ましい。発熱体(ヒータ)6の部材として、白金が好適である。フィラメント6の両端はリード線6aに接続されており、リード線6aに外部のヒータ駆動回路(図3に示す)からの電流を流して、ジュール熱により、フィラメント6が加熱する。熱風ヒータ5は、エア流入口7aから供給された気体がフィラメント6で加熱されて、加熱された気体がノズル形状のケーシング7先端の熱風吹出口7bから吹き出すように構成されている。
図3は、熱風ヒータを駆動するための熱風ヒータ駆動ユニットの構成を示す図である。図3に示すように、熱風ヒータ駆動ユニット10は、熱風ヒータ5のフィラメント6に通電を行うヒータ駆動回路11と、熱風ヒータ5のエア流入口7aに気体を供給する配管に
挿入された電磁開閉弁26と、電磁開閉弁26とガス供給元の間に可変絞り弁27とが設けられている。ヒータ駆動回路11及び電磁開閉弁26は、コントロールユニット30に接続されており、コントロールユニットにより熱風ヒータ5のフィラメント6への通電制御、熱風ヒータ5へのガスの供給、遮断が行われる。また、ヒータ駆動回路11は、通電によりヒータの抵抗値が所定の値を維持するように制御して、温度センサーを用いることなしに、熱風ヒータ5のフィラメント6の発熱温度を制御するように構成されている。これにより、コントロールユニット30からの制御によって、ボンディング動作に応じて、ヒータ電流のオン/オフ (ON/OFF)、設定温度のデータ設定等がなされる。熱風ヒータ5へのガスの配管には電磁開閉弁26が挿入され、ワイヤボンディング装置1のコントロールユニット30によりボンディング動作に応じたガス等の供給の開閉が行われる。ボンディング中でのガスの影響や無用な加熱を避けるため、開閉の応答速度(望ましくは1ms以下)の早い電磁開閉弁26が望ましい。また、ガス圧力の応答遅れを減らすため、熱風ヒータ5と電磁開閉弁26は可能な限り短く配管するようにする。電磁開閉弁26とガス供給元の間に可変絞り弁27を設けて、適正なガス流量に保つようにする。尚、熱風ヒータ5のエア流入口7aに供給される気体は、空気又は不活性ガスであり、熱風ヒータ5の熱風吹出口7bから加熱された空気又は不活性ガスが放出される。
次に、図4を用いて、ヒータ駆動回路の構成について説明する。図4に示すように、ヒータ駆動回路11は、ブリッジ回路16、差動増幅器14、比較器15、高電圧駆動回路12及び低電圧駆動回路13を有している。
図5は、ヒータ駆動回路の動作を示すタイミングチャートである。尚、図5に示す波形は、上から順に、指令電圧入力の波形、差動増幅器に入力されるヒータの抵抗の割合の変化を示す図、差動増幅器出力電圧の波形、比較器出力の波形、ヒータ駆動電圧の波形、ヒータ温度の波形をそれぞれ示す。
次に、上記構成からなるワイヤボンディング装置におけるボンディング動作について、図6及び図7を用いて説明する。図6は、ボンディング動作における熱風の印加のタイミングを示す図、図7は、ボンディング動作における熱風印加の制御を示すフローチャートである。以下の動作は、コントロールユニットにおけるマイクロコンピュータのメモリに内蔵されたプログラムを実行することにより実行される。尚、被ボンディング部品は、搬送装置(図示せず)により搬送されて、ボンディングステージ39に位置しているものとする。
5 熱風ヒータ
6 発熱体(ヒータ)、フィラメント(白金)
6a リード線
7 ケーシング
7a エア流入口
7b 熱風吹出口
8 支持体
10 熱風ヒータ駆動ユニット
11 ヒータ駆動回路
12 高電圧駆動回路
12a 高圧電源
12b、12c FET
13 低電圧駆動回路
13a 低圧電源
13b、13c FET
14 差動増幅器
15 比較器
16 ブリッジ回路
17、18、19 抵抗(ブリッジ回路用)
20 デジタルポテンショメータ
23、24 抵抗
25 ダイオード
26 電磁開閉弁
27 絞り弁
28 取付金具
31 ボンディングヘッド
32 ボンディングアーム
33 超音波ホーン
34 ボンディングツール(キャピラリ)
35 エンコーダ
36 支軸
37 リニアモータ
38 カメラ
39、43 ボンディングステージ
40 XYステージ
45 ヒータブロック
45a ヒータ
46 ヒータプレート
30、50 コントロールユニット
55 駆動ユニット
60 ICチップ
61 リード
Claims (3)
- ボンディングツールによりボンディング点としての半導体チップ上の電極であるパッドと外部端子であるリードとをワイヤで接続するワイヤボンディング装置であって、
内部に瞬間的に加熱可能な抵抗温度係数が大きい金属から成るヒータを内蔵し、先端からボンディング点を含むボンディング部材に熱風を吹き出す吹出口と他端に圧縮気体が流入する流入口とを有するノズル形状を成すケーシングと、
前記ヒータを加熱する加熱制御手段と、
前記ケーシングへの圧縮気体の供給、遮断を行う圧縮気体供給制御手段とを有し、
前記ケーシングの前記吹出口から吹き出された熱風の位置を前記ボンディングツールの着地点となるように設定し、前記加熱制御手段及び前記圧縮気体供給制御手段は、前記ボンディング点毎の前記ボンディングツールの下降速度が高速から低速に切り変わるときのサーチ高さのタイミングに合わせて、前記ヒータの発熱温度、熱風の吹出し開始を制御して、前記ケーシングの前記吹出口から熱風を吹き出すようにしたことを特徴とするワイヤボンディング装置。 - 前記加熱制御手段は、通電により前記ヒータの抵抗値が所定の値を維持するように制御して、温度センサーを用いることなしに、前記ヒータの発熱温度を制御するようにしたことを特徴とする請求項1に記載のワイヤボンディング装置。
- ボンディングツールによりボンディング点としての半導体チップ上の電極であるパッドと外部端子であるリードとをワイヤで接続するワイヤボンディング方法であって、
内部に瞬間的に加熱可能な抵抗温度係数が大きい金属から成るヒータを内蔵し、先端からボンディング点を含むボンディング部材に熱風を吹き出す吹出口と他端に圧縮気体が流入する流入口とを有するノズル形状のケーシングと、
前記ヒータを加熱する加熱制御手段と、
前記ケーシングへの圧縮気体の供給、遮断を行う圧縮気体供給制御手段とを有し、
前記ケーシングの前記吹出口から吹き出された熱風の位置を前記ボンディングツールの着地点となるように設定し、前記加熱制御手段及び前記圧縮気体供給制御手段は、前記ボンディング点毎の前記ボンディングツールの下降速度が高速から低速に切り変わるときのサーチ高さのタイミングに合わせて、前記ヒータの発熱温度、熱風の吹出し開始を制御して、前記ケーシングの前記吹出口から熱風を吹き出すようにしたことを特徴とするワイヤボンディング方法。
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JP2011285197A JP5651575B2 (ja) | 2011-12-27 | 2011-12-27 | ワイヤボンディング装置及びワイヤボンディング方法 |
US14/110,693 US20140054277A1 (en) | 2011-12-27 | 2012-10-03 | Wire bonding apparatus and wire bonding method |
PCT/JP2012/075630 WO2013099383A1 (ja) | 2011-12-27 | 2012-10-03 | ワイヤボンディング装置及びワイヤボンディング方法 |
CN201280045062.3A CN103814433B (zh) | 2011-12-27 | 2012-10-03 | 引线接合装置以及引线接合方法 |
KR1020137028777A KR101511893B1 (ko) | 2011-12-27 | 2012-10-03 | 와이어 본딩 장치 및 와이어 본딩 방법 |
TW101142719A TWI528475B (zh) | 2011-12-27 | 2012-11-16 | Wire bonding method |
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JP2011285197A JP5651575B2 (ja) | 2011-12-27 | 2011-12-27 | ワイヤボンディング装置及びワイヤボンディング方法 |
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JP5950994B2 (ja) * | 2014-12-26 | 2016-07-13 | 株式会社新川 | 実装装置 |
JP6680239B2 (ja) * | 2017-02-20 | 2020-04-15 | 日亜化学工業株式会社 | 発光装置の製造方法 |
CN107579026B (zh) * | 2017-08-31 | 2020-02-07 | 长江存储科技有限责任公司 | 一种用于湿法刻蚀的干燥喷嘴、湿法刻蚀设备 |
US10763236B2 (en) * | 2018-01-09 | 2020-09-01 | Kulicke And Soffa Industries, Inc. | Systems and methods of operating wire bonding machines including clamping systems |
JP2020115528A (ja) * | 2019-01-18 | 2020-07-30 | 株式会社新川 | ボンディング装置、フレームフィーダ及びヒータユニット |
CN117727667B (zh) * | 2024-02-08 | 2024-05-03 | 东莞触点智能装备有限公司 | 一种芯片高精固晶机及其热压方法 |
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US4976393A (en) * | 1986-12-26 | 1990-12-11 | Hitachi, Ltd. | Semiconductor device and production process thereof, as well as wire bonding device used therefor |
US4971554A (en) * | 1988-08-30 | 1990-11-20 | Semiconductor Equipment Corporation | Multi-nozzle surface mount rework system |
JPH02128440A (ja) * | 1988-11-08 | 1990-05-16 | Nec Kyushu Ltd | ワイヤボンディング方法 |
JP3112116B2 (ja) * | 1991-03-20 | 2000-11-27 | 株式会社小松製作所 | プラズマ切断機及びその制御方法 |
EP1133219A4 (en) * | 1998-10-13 | 2004-10-27 | Matsushita Electric Ind Co Ltd | HEATING DEVICE AND HEATING METHOD |
JP3541307B2 (ja) * | 1999-05-26 | 2004-07-07 | 賢政 松原 | 半田ごて |
JP2001110840A (ja) * | 1999-10-13 | 2001-04-20 | Sony Corp | ワイヤボンド装置及び方法 |
JP3590319B2 (ja) * | 2000-03-10 | 2004-11-17 | 株式会社ジャパンユニックス | ガス噴射式はんだ付け方法及び装置 |
JP3676995B2 (ja) * | 2001-10-23 | 2005-07-27 | 松下電器産業株式会社 | バンプボンディング方法および装置 |
US7256371B2 (en) * | 2004-03-22 | 2007-08-14 | Integrated Electronic Solutions Pty Ltd. | Temperature control method for positive temperature coefficient type heating element |
JP4014579B2 (ja) * | 2004-04-01 | 2007-11-28 | 沖電気工業株式会社 | ワイヤボンディング装置及びワイヤボンディング方法 |
US20070010083A1 (en) * | 2005-07-07 | 2007-01-11 | Jong-Ning Aoh | Method of realizing direct bonding between metal wires and copper pads by means of thermosonic wire bonding using shielding gas spraying device |
US7544539B2 (en) * | 2005-12-29 | 2009-06-09 | Asm Technology Singapore Pte Ltd. | Forced heat transfer apparatus for heating stacked dice |
JP4369507B2 (ja) * | 2007-12-07 | 2009-11-25 | 株式会社新川 | ボンディング装置及びボンディング方法 |
KR101434001B1 (ko) * | 2008-06-10 | 2014-08-25 | 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 | 와이어 본딩 작업에서 산화 감소를 위한 가스 전달 시스템 |
CN102039466B (zh) * | 2009-10-19 | 2012-09-26 | 纬创资通股份有限公司 | 导热装置及其热熔焊锡方法 |
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- 2012-10-03 WO PCT/JP2012/075630 patent/WO2013099383A1/ja active Application Filing
- 2012-10-03 US US14/110,693 patent/US20140054277A1/en not_active Abandoned
- 2012-10-03 KR KR1020137028777A patent/KR101511893B1/ko not_active IP Right Cessation
- 2012-10-03 CN CN201280045062.3A patent/CN103814433B/zh active Active
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KR101511893B1 (ko) | 2015-04-13 |
JP2013135111A (ja) | 2013-07-08 |
CN103814433B (zh) | 2017-03-01 |
US20140054277A1 (en) | 2014-02-27 |
KR20140004215A (ko) | 2014-01-10 |
TWI528475B (zh) | 2016-04-01 |
TW201327701A (zh) | 2013-07-01 |
CN103814433A (zh) | 2014-05-21 |
WO2013099383A1 (ja) | 2013-07-04 |
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