JP4760736B2 - ワイヤボンディング方法およびワイヤボンディング装置 - Google Patents
ワイヤボンディング方法およびワイヤボンディング装置 Download PDFInfo
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- JP4760736B2 JP4760736B2 JP2007052639A JP2007052639A JP4760736B2 JP 4760736 B2 JP4760736 B2 JP 4760736B2 JP 2007052639 A JP2007052639 A JP 2007052639A JP 2007052639 A JP2007052639 A JP 2007052639A JP 4760736 B2 JP4760736 B2 JP 4760736B2
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- Wire Bonding (AREA)
Description
キャピラリ(100)の内孔(101)の内部からキャピラリ(100)の先端部(102)へと、気体を吹き出させることによって、キャピラリ(100)の先端部(102)から被接合部材(10、20)へ向かう気流を形成するとともに気体の一部を抜け穴(105)から放出する状態で、ワイヤ(40)を被接合部材(10、20)に接合することを特徴とする。
また、請求項1に記載の発明では、キャピラリ(100)に、内孔(101)から当該キャピラリ(100)の側面の外方へ通じる気体の抜け穴(105)を設け、気体の一部を抜け穴(105)から放出するようにしているから、ワイヤ(40)の被接合部材(10、20)への接合を行うときなどに、キャピラリ(100)の先端部(102)にて内孔(101)が塞がっても、抜け穴(105)から気体を抜け出させることが可能となる。これにより、気体を常時流しても、ボンディング時に、キャピラリ(100)とワイヤ(40)との接触が悪化しないため、ボンディング性の低下を極力抑制できる。
キャピラリ(100)の先端部(102)から被接合部材(10、20)へ向かう気流を形成する気流形成手段を設け、
この気流形成手段は、ホーン(110)に接続されたホース(210)と、
ホース(210)内に気体を流し込む気体供給部(200)と、
ホーン(110)におけるホース(210)の接続部からキャピラリ(100)の取付部までホーン(110)の内部を貫通するようにホーン(110)に設けられた孔であるホーン貫通孔(111)と、
ホーン貫通孔(111)と内孔(101)とを接続するようにキャピラリ(100)に設けられた孔であるキャピラリ貫通孔(104)とを備え、
気体供給部(200)からの気体を、ホース(210)、ホーン貫通孔(111)およびキャピラリ貫通孔(104)を介して、内孔(101)に流し込むことにより、キャピラリ(100)の先端部(102)から被接合部材(10、20)へ向かう気流を形成するものであり、
さらに、キャピラリ貫通孔(104)は、キャピラリ(100)のうち、ホーン(110)におけるキャピラリ(100)の取付部に対向する部位に複数個設けられていることを特徴とする。
この気流の形成によって、被接合部材(10、20)から発生するヒュームを被接合部材(10、20)側へ押し戻すことができるので、キャピラリ(100)の先端部(102)に被接合部材(10、20)の材料が付着しにくくなり、ワイヤボンディング性能を向上させることが可能となる。
図1は、本発明の第1実施形態に係る電子装置S1の概略断面図である。
図5は、本発明の第2実施形態に係るワイヤボンディング装置における気流形成手段を示す概略断面図である。本実施形態は、上記第1実施形態において気流形成手段を変形したワイヤボンディング装置を提供するものであり、当該気流形成手段以外は、上記第1実施形態と同様である。なお、図5中、キャピラリ100の内孔101中に挿入されているボンディングワイヤ40は省略してある。
図7は、本発明の第3実施形態に係るワイヤボンディング装置の要部を示す概略断面図であり、キャピラリ100の長手方向すなわちキャピラリ100の軸に沿った方向の概略断面を示している。
図8は、本発明の第4実施形態に係るワイヤボンディング装置の要部を示す概略断面図であり、キャピラリ100の長手方向とは直交する方向すなわちキャピラリ100の径方向に沿った断面を概略的に示している。
図9は、本発明の第5実施形態に係るワイヤボンディング装置の要部を示す図であり、キャピラリ100の側面図である。
なお、被接合部材としては、上記した基板10やICチップ20に限定されるものではなく、上記したワイヤボンディング法によりワイヤ40が接続できるものであるならば、それ以外のものでもよい。
40…ボンディングワイヤ、
100…キャピラリ、101…キャピラリの内孔、
102…キャピラリの先端部、103…キャピラリの根元部、
104…キャピラリ貫通孔、105…抜け穴、106…溝、110…ホーン、
111…ホーン貫通孔、120…ワイヤ供給用パイプ、200…気体供給部、
210…ホース。
Claims (3)
- キャピラリ(100)の内孔(101)にワイヤ(40)を挿入し、前記キャピラリ(100)の先端部(102)から導出された前記ワイヤ(40)の部分を、被接合部材(10、20)に押し当てた状態で、前記キャピラリ(100)を振動させることにより、前記ワイヤ(40)を前記被接合部材(10、20)に接合するようにしたワイヤボンディング方法において、
前記キャピラリ(100)には、前記内孔(101)から当該キャピラリ(100)の側面の外方へ通じる気体の抜け穴(105)を設け、
前記キャピラリ(100)の前記内孔(101)の内部から前記キャピラリ(100)の先端部(102)へと、気体を吹き出させることによって、前記キャピラリ(100)の先端部(102)から前記被接合部材(10、20)へ向かう気流を形成するとともに前記気体の一部を前記抜け穴(105)から放出する状態で、前記ワイヤ(40)を前記被接合部材(10、20)に接合することを特徴とするワイヤボンディング方法。 - 前記内孔(101)の内面には、前記キャピラリ(100)の先端部(102)へ向かう溝(106)を設けることを特徴とする請求項1に記載のワイヤボンディング方法。
- ホーン(110)に取り付けられ前記ホーン(110)によって移動および振動させられるキャピラリ(100)を有しており、
前記キャピラリ(100)の内孔(101)にワイヤ(40)を挿入し、前記キャピラリ(100)の先端部(102)から導出された前記ワイヤ(40)の部分を、被接合部材(10、20)に押し当てた状態で、前記キャピラリ(100)を振動させることにより、前記ワイヤ(40)を前記被接合部材(10、20)に接合するようにしたワイヤボンディング装置において、
前記キャピラリ(100)の先端部(102)から前記被接合部材(10、20)へ向かう気流を形成する気流形成手段が設けられており、
前記気流形成手段は、前記ホーン(110)に接続されたホース(210)と、
前記ホース(210)内に気体を流し込む気体供給部(200)と、
前記ホーン(110)における前記ホース(210)の接続部から前記キャピラリ(100)の取付部まで前記ホーン(110)の内部を貫通するように前記ホーン(110)に設けられた孔であるホーン貫通孔(111)と、
前記ホーン貫通孔(111)と前記内孔(101)とを接続するように前記キャピラリ(100)に設けられた孔であるキャピラリ貫通孔(104)とを備え、
前記気体供給部(200)からの気体を、前記ホース(210)、前記ホーン貫通孔(111)および前記キャピラリ貫通孔(104)を介して、前記内孔(101)に流し込むことにより、前記キャピラリ(100)の先端部(102)から前記被接合部材(10、20)へ向かう気流を形成するものであり、
さらに、前記キャピラリ貫通孔(104)は、前記キャピラリ(100)のうち、前記ホーン(110)における前記キャピラリ(100)の取付部に対向する部位に複数個設けられていることを特徴とするワイヤボンディング装置。
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