JP5753644B2 - ワイヤーボンディング作業における酸化軽減のためのガス配送システム - Google Patents

ワイヤーボンディング作業における酸化軽減のためのガス配送システム Download PDF

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JP5753644B2
JP5753644B2 JP2011513596A JP2011513596A JP5753644B2 JP 5753644 B2 JP5753644 B2 JP 5753644B2 JP 2011513596 A JP2011513596 A JP 2011513596A JP 2011513596 A JP2011513596 A JP 2011513596A JP 5753644 B2 JP5753644 B2 JP 5753644B2
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Japan
Prior art keywords
gas
wire bonding
delivery mechanism
gas delivery
hole
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JP2011513596A
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Japanese (ja)
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JP2012504317A5 (enExample
JP2012504317A (ja
Inventor
ギロッティ、ゲーリー、エス．
シュツェスニャク、スタンレー
エメリック、ピーター、ジェイ． バン
エメリック、ピーター、ジェイ． バン
Original Assignee
クリック アンド ソッファ インダストリーズ、インク．
クリック アンド ソッファ インダストリーズ、インク．
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Publication of JP2012504317A5 publication Critical patent/JP2012504317A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
JP2011513596A 2008-06-10 2009-06-08 ワイヤーボンディング作業における酸化軽減のためのガス配送システム Active JP5753644B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US6018908P 2008-06-10 2008-06-10
US61/060,189 2008-06-10
PCT/US2009/046535 WO2009152066A2 (en) 2008-06-10 2009-06-08 Gas delivery system for reducing oxidation in wire bonding operations

Publications (3)

Publication Number Publication Date
JP2012504317A JP2012504317A (ja) 2012-02-16
JP2012504317A5 JP2012504317A5 (enExample) 2012-07-26
JP5753644B2 true JP5753644B2 (ja) 2015-07-22

Family

ID=41417368

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011513596A Active JP5753644B2 (ja) 2008-06-10 2009-06-08 ワイヤーボンディング作業における酸化軽減のためのガス配送システム

Country Status (6)

Country Link
US (2) US8066170B2 (enExample)
JP (1) JP5753644B2 (enExample)
KR (1) KR101434001B1 (enExample)
CN (1) CN101971314B (enExample)
SG (1) SG179409A1 (enExample)
WO (1) WO2009152066A2 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101121849B1 (ko) * 2010-03-31 2012-03-21 앰코 테크놀로지 코리아 주식회사 와이어 본딩 장치
US8186562B1 (en) * 2010-12-14 2012-05-29 Asm Technology Singapore Pte Ltd Apparatus for increasing coverage of shielding gas during wire bonding
JP2012244093A (ja) * 2011-05-24 2012-12-10 Renesas Electronics Corp 半導体装置の製造方法
JP5618974B2 (ja) * 2011-08-16 2014-11-05 株式会社新川 ワイヤボンディング装置
JP5651575B2 (ja) * 2011-12-27 2015-01-14 株式会社カイジョー ワイヤボンディング装置及びワイヤボンディング方法
SG11201403542XA (en) * 2012-01-26 2014-10-30 Shinkawa Kk Antioxidant gas supply unit
US8752751B2 (en) * 2012-07-13 2014-06-17 Asm Technology Singapore Pte Ltd Lead frame support plate and window clamp for wire bonding machines
JP2014075519A (ja) 2012-10-05 2014-04-24 Shinkawa Ltd 酸化防止ガス吹き出しユニット
US9245761B2 (en) * 2013-04-05 2016-01-26 Lam Research Corporation Internal plasma grid for semiconductor fabrication
CN104148794B (zh) * 2013-12-05 2016-05-18 武汉电信器件有限公司 氮气保护封焊电极
TWI677068B (zh) * 2017-05-24 2019-11-11 日商新川股份有限公司 打線接合裝置
JP2020155425A (ja) * 2017-07-07 2020-09-24 ヤマハモーターロボティクスホールディングス株式会社 ワイヤボンディング装置
US11239197B2 (en) * 2019-11-27 2022-02-01 Asm Technology Singapore Pte Ltd Wire bonding apparatus threading system
US11826861B1 (en) * 2020-08-12 2023-11-28 Sion Power Corporation Joining systems, clamping fixtures, and related systems and methods
JP2022071993A (ja) * 2020-10-29 2022-05-17 アスリートＦａ株式会社 電子部品接合装置
US20220270937A1 (en) * 2021-02-23 2022-08-25 Kulicke And Soffa Industries, Inc. Methods of determining shear strength of bonded free air balls on wire bonding machines
US12629761B2 (en) * 2023-07-07 2026-05-19 SanDisk Technologies, Inc. Annular structure for an electronic flame off wand

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57154850A (en) * 1981-03-20 1982-09-24 Hitachi Ltd Capillary structure for wire bonding
JPS59150440A (ja) 1983-02-03 1984-08-28 Toshiba Corp ワイヤボンデイング方法
JPS59150437A (ja) 1983-02-15 1984-08-28 Toshiba Corp ワイヤボンデイング方法
JPS6054446A (ja) * 1983-09-05 1985-03-28 Mitsubishi Electric Corp ワイヤボンデイング装置
US4572772A (en) 1983-11-07 1986-02-25 Texas Instruments Incorporated Method for cleaning an electrode
JPS60244034A (ja) * 1984-05-18 1985-12-03 Mitsubishi Electric Corp ワイヤボンデイング用雰囲気形成装置
JPS6178131A (ja) 1984-09-25 1986-04-21 Toshiba Corp ワイヤボンデイング装置
JPS62136835A (ja) * 1985-12-10 1987-06-19 Mitsubishi Electric Corp 半導体装置の製造方法
JPH04186852A (ja) 1990-11-21 1992-07-03 Shinkawa Ltd ボンデイング装置
US5295619A (en) 1992-05-22 1994-03-22 Rohm Co., Ltd. Method and apparatus for performing wire bonding by using solder wire
JP2758819B2 (ja) 1993-12-22 1998-05-28 山形日本電気株式会社 ワイヤボンディング方法
JPH07263480A (ja) * 1994-03-18 1995-10-13 Shinkawa Ltd ワイヤボンデイング方法及び装置
JPH07273138A (ja) 1994-03-31 1995-10-20 Tatsuta Electric Wire & Cable Co Ltd ワイヤボンデイング法
JP3478510B2 (ja) * 1995-03-17 2003-12-15 芝浦メカトロニクス株式会社 ワイヤボンディング装置
US6180891B1 (en) * 1997-02-26 2001-01-30 International Business Machines Corporation Control of size and heat affected zone for fine pitch wire bonding
US6234376B1 (en) 1999-07-13 2001-05-22 Kulicke & Soffa Investments, Inc. Supplying a cover gas for wire ball bonding
EP1267989B1 (en) * 2000-04-05 2006-07-19 Pathway Medical Technologies, Inc. Intralumenal material removal systems and methods
JP2003179092A (ja) * 2001-12-10 2003-06-27 Nitto Denko Corp 半導体装置の製造方法及びそれに用いるワイヤボンディング装置
TWI287282B (en) 2002-03-14 2007-09-21 Fairchild Kr Semiconductor Ltd Semiconductor package having oxidation-free copper wire
US6866182B2 (en) 2002-10-08 2005-03-15 Asm Technology Singapore Pte Ltd. Apparatus and method to prevent oxidation of electronic devices
US7103959B2 (en) 2002-12-17 2006-09-12 Asm Technology Singapore Pte Ltd. Conduit for preventing oxidation of a electronic device
US7182793B2 (en) 2004-01-22 2007-02-27 Asm Technology Singapore Pty Ltd. System for reducing oxidation of electronic devices
US20070251980A1 (en) * 2006-04-26 2007-11-01 Gillotti Gary S Reduced oxidation system for wire bonding
US7614538B2 (en) 2006-05-15 2009-11-10 Kulicke And Soffa Industries, Inc. Device clamp for reducing oxidation in wire bonding
US7658313B2 (en) 2006-07-03 2010-02-09 Kabushiki Kaisha Shinkawa Ball forming device in a bonding apparatus and ball forming method
US7628307B2 (en) * 2006-10-30 2009-12-08 Asm Technology Singapore Pte Ltd. Apparatus for delivering shielding gas during wire bonding
JP4392015B2 (ja) * 2006-11-21 2009-12-24 株式会社カイジョー ワイヤボンディング装置
US7578423B1 (en) 2008-06-06 2009-08-25 Asm Technology Singapore Pte Ltd. Assembly for reducing oxidation of semiconductor devices

Also Published As

Publication number Publication date
KR101434001B1 (ko) 2014-08-25
US8313015B2 (en) 2012-11-20
WO2009152066A2 (en) 2009-12-17
WO2009152066A3 (en) 2010-03-11
WO2009152066A4 (en) 2010-04-29
US8066170B2 (en) 2011-11-29
JP2012504317A (ja) 2012-02-16
KR20100102674A (ko) 2010-09-24
CN101971314A (zh) 2011-02-09
US20110073635A1 (en) 2011-03-31
US20120031877A1 (en) 2012-02-09
SG179409A1 (en) 2012-04-27
CN101971314B (zh) 2013-10-09

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