JP5753644B2 - ワイヤーボンディング作業における酸化軽減のためのガス配送システム - Google Patents

ワイヤーボンディング作業における酸化軽減のためのガス配送システム Download PDF

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JP5753644B2
JP5753644B2 JP2011513596A JP2011513596A JP5753644B2 JP 5753644 B2 JP5753644 B2 JP 5753644B2 JP 2011513596 A JP2011513596 A JP 2011513596A JP 2011513596 A JP2011513596 A JP 2011513596A JP 5753644 B2 JP5753644 B2 JP 5753644B2
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gas
wire bonding
delivery mechanism
gas delivery
hole
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JP2012504317A5 (enExample
JP2012504317A (ja
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ギロッティ、ゲーリー、エス．
シュツェスニャク、スタンレー
エメリック、ピーター、ジェイ． バン
エメリック、ピーター、ジェイ． バン
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クリック アンド ソッファ インダストリーズ、インク．
クリック アンド ソッファ インダストリーズ、インク．
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
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    • H01L2924/3025—Electromagnetic shielding

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
JP2011513596A 2008-06-10 2009-06-08 ワイヤーボンディング作業における酸化軽減のためのガス配送システム Active JP5753644B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US6018908P 2008-06-10 2008-06-10
US61/060,189 2008-06-10
PCT/US2009/046535 WO2009152066A2 (en) 2008-06-10 2009-06-08 Gas delivery system for reducing oxidation in wire bonding operations

Publications (3)

Publication Number Publication Date
JP2012504317A JP2012504317A (ja) 2012-02-16
JP2012504317A5 JP2012504317A5 (enExample) 2012-07-26
JP5753644B2 true JP5753644B2 (ja) 2015-07-22

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JP2011513596A Active JP5753644B2 (ja) 2008-06-10 2009-06-08 ワイヤーボンディング作業における酸化軽減のためのガス配送システム

Country Status (6)

Country Link
US (2) US8066170B2 (enExample)
JP (1) JP5753644B2 (enExample)
KR (1) KR101434001B1 (enExample)
CN (1) CN101971314B (enExample)
SG (1) SG179409A1 (enExample)
WO (1) WO2009152066A2 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101121849B1 (ko) * 2010-03-31 2012-03-21 앰코 테크놀로지 코리아 주식회사 와이어 본딩 장치
US8186562B1 (en) * 2010-12-14 2012-05-29 Asm Technology Singapore Pte Ltd Apparatus for increasing coverage of shielding gas during wire bonding
JP2012244093A (ja) * 2011-05-24 2012-12-10 Renesas Electronics Corp 半導体装置の製造方法
JP5618974B2 (ja) * 2011-08-16 2014-11-05 株式会社新川 ワイヤボンディング装置
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JP2012504317A (ja) 2012-02-16
SG179409A1 (en) 2012-04-27
KR101434001B1 (ko) 2014-08-25
WO2009152066A2 (en) 2009-12-17
WO2009152066A4 (en) 2010-04-29
US8066170B2 (en) 2011-11-29
US20120031877A1 (en) 2012-02-09
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