JPS60244034A - ワイヤボンデイング用雰囲気形成装置 - Google Patents

ワイヤボンデイング用雰囲気形成装置

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Publication number
JPS60244034A
JPS60244034A JP59098484A JP9848484A JPS60244034A JP S60244034 A JPS60244034 A JP S60244034A JP 59098484 A JP59098484 A JP 59098484A JP 9848484 A JP9848484 A JP 9848484A JP S60244034 A JPS60244034 A JP S60244034A
Authority
JP
Japan
Prior art keywords
wire
bonding
cylindrical cover
ball
reducing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59098484A
Other languages
English (en)
Other versions
JPH0428136B2 (ja
Inventor
Hideo Ichimura
英男 市村
Masamitsu Okamura
将光 岡村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
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Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP59098484A priority Critical patent/JPS60244034A/ja
Publication of JPS60244034A publication Critical patent/JPS60244034A/ja
Publication of JPH0428136B2 publication Critical patent/JPH0428136B2/ja
Granted legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
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    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2224/788—Means for moving parts
    • H01L2224/78801—Lower part of the bonding apparatus, e.g. XY table
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    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
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  • Engineering & Computer Science (AREA)
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  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明は、ワイヤポンディング用雰囲気形成装置に関す
るものであって、更に詳しくはアルミニウムまたは銅を
用いたワイヤボンディングにおいて、放電によりワイヤ
先端にボールを形成する際の酸化全防ぐため、還元雰囲
気あるいは不活性雰囲気を形成する装置に関する。
〔従来技術〕
ダイボンディングされた半導体チップの電極薄膜とリー
ドフレームを結ぶワイヤボンディングでは、金線を用い
るのが一般的であるが、近年原価低減のためにアルミニ
ウム線や銅線を用いる試みがなされている。しかし、ポ
ールボンディングに藷いては、トーチ電極上の放電によ
りワイヤ先端にボールを形成する際に酸化するため、良
好で安定したボンディングを行うにはワイヤ先端部を還
元雰囲気あるいは不活性雰囲気に保つ必要がある。
従来、このための還元雰囲気あるいは不活性雰囲気を形
成する装置としては、キャピラリにガス噴射装置ｆｔ取
付けたものがある。しかしこの装置では、ワイヤ先端に
作られるボールの下面まで十分に還元雰囲気あるいは不
活性雰囲気を保つのが困難であるのに加えて、キャピラ
リの重量が増加するため、特に超音波熱圧着方式のボン
ディングでは、超音波ホーンの先端負荷増大により振動
モ−ドが変化してボンディングが不安定になり易いとい
った欠点がある。
また、トーチ電極外壁面に沿って還元ガスあるいは不活
１！４：ガスを導くことにより、放電空間を還元雰囲気
あるいは不活性雰囲気に保つ装置がある。
しかしこの装置では、トーチ電極が振り込まれている時
にしか雰囲気を形成することができないという欠点があ
る。
さらに、還元ガスあるいは不活性ガスケ充満させたチャ
ンバーでヘッド空間全体を囲む方法もある。しかしこの
方法では、密閉性が悪いのに加え、チャンバーの構造が
複雑になる欠点がある。
〔発明の概要〕
本発明は、上記のような従来技術の欠点を除去し、ポー
ル形成時からボンディング点に至るまでワイヤ先端部を
還元雰囲気あるいは不活性雰囲気に保つことを目的とす
るものであって、その骨子とするところは、ボールボン
ディング装置のボンディングヘッドあるいはＸ、Ｙテー
ブルに固定された円筒カバーをキャピラリ？包み込むよ
うに置き、該円筒カバーの側面から還元性あるいは不活
性ガスを円筒内に噴出させるという簡単な構造により、
ポール形成時からボンディング点に至るまでボール周辺
部を還元あるいは不活性雰囲気に保つようにしたワイヤ
ボンディング用雰囲気形成装置に関するものである。
〔発明の実施例〕
以下、本発明装置の一実施例全第１図により説明する。
第１図ｒａ）はボール形成時を、第１図ｒｂ）はボンデ
ィング時？それぞれ示す。図中の符号（１）ｔ；ｊ：本
発明で重要な円筒カバーであり、図のようにボンディン
グヘッドあるいはＸ、Ｙテーブルに固定し、電気的に絶
縁されていて、キャピラリ（２）會包み込むように構成
されている。該円筒カバー＜１）の側面にはガス吸入孔
（３）が設けてあり、ここからガスを注入することによ
り、円筒カバー（１）内を還元雰囲気あるいは不活性雰
囲気に保つ。また側面には、トーチ電極（４）が出入り
する電極穴（５）ヲ設けである。
次に、上記の本発明装置の動作について説明する。捷ず
、キャピラリ（２）の先端が円筒カバー（１）の上口部
から出ない位置まで上昇した後、トーチ電極（４）が電
極穴（５）より振り込まれ、ワイヤ（６）の先端との間
で放電を起こすことによりボール（７）が形成される。
その後トーチ電極（４）が円筒カバー（１）の外部に退
避する。次いで、キャピラリ（２）が降下し、ボール（
８）？半導体チップ面（８）に押しつけ熱圧着あるいは
超音波熱圧着により接合する。
従って、ワイヤ先端部を、ポール形成時はもとより、円
筒カバー（１）の下口部から流出するガスによりボンデ
ィング点直前まで、還元雰囲気あるいは不活性雰囲気に
保つことができ、放電により加熱・溶融して形ＦＭ、さ
れるボール（７）の酸化を防ぐため、金線以外の例えば
アルミニウム線や銅線を用いても常に良好で安定したボ
ンディングが可能になる。また、本発明装置は構造が簡
単なのに加えて、円筒カバー（１）は水平面内を移動す
るだけで上下方向には動かないため、少ないガス消費量
で効率よく雰囲気を形成することができる。
第２図は本発明の他の実施例ケ示す。ここでは円筒カバ
ー（１）は二重構造になっており、ガス吸入孔（３）か
ら注入されたガスは中空部（９）に充満し、内壁０１に
設けられた複数個の噴出口αηから円筒カバー（１）の
内部に噴き出す構成にしである。
この実施例装置の場合は、ワイヤ先端部により均一な還
元雰囲気あるいは不活性雰囲気を形成することができる
。なお、円筒カバー（１）の上口部からガスが流出する
のを防ぐため、上］」部にフランジα２を設けてもよい
。また、ボール（７）が円筒カッく−（１）の下口部か
ら出てボンディング点に達するまでのボール（７）周辺
部のガス濃度ケ上げるために、噴出口（１１）の一部あ
るいは全部？下向きに設けて、下口部からのガス流出量
ヲ増やしてもよい。
〔発明の効果〕
以上のように、本発明によれば金線以外のワイヤ、例え
ばアルミニウム線や銅線を用いても良好で安定したワイ
ヤボンディング管行うことができ、半導体製造コストの
大幅な低減が可能となる。
【図面の簡単な説明】
第１図（ａ）（ｂ）は本発明の一実施例による雰囲気形
成装置？示す断面図、第２図は本発明の他の実施例を示
す断面図である。 （１）・・・円ｍカバー、（２）・・・キャピラリ、（
３）・・・ガス吸入孔、（４）・・・トーチ電４Ｎ、　
（５）・・・電極穴、（６）・・・ワイヤ、（７）・・
・ボール、（８）・・・半導体チップ面、（９）・・・
中空部、００・・・内壁、０１）・・・噴出１コ、０の
・・・フランジ。 なお、図中同一符号は同一、又は相当部分會示す。 代理人　升埋士　木　村　三　期 間　同　佐々木　宗　治 １８７− 手続補正書（自発〕 昭和５９年９月２０日 特許庁長官殿 １、事件の表示　特願昭　５９−９８４８４号２、発明
の名称 ワイヤボンディング用雰囲気形成装置 ３、補正をする者 代表者片１１１仁八部 ４、代理人

Claims (1)

    【特許請求の範囲】
  1. ワイヤの先端にトーチ電極からの放電によりボールヲ形
    成してボンディングを行うポールボンデインク装置に、
    該装置のボンディングヘッドアルいはＸ、Ｙテーブルに
    固定されていて、上下するキャピラリを包み込むように
    位置する電気的に絶縁された円筒カバーを設け、該円筒
    カバーの内部に還元ガスあるいは不活性ガスを注入して
    ワイヤ先端部を常に還元雰囲気あるいは不活性雰囲気に
    保つように構成したことを％徴とするワイヤポンディン
    グ用雰囲気形成装置。
JP59098484A 1984-05-18 1984-05-18 ワイヤボンデイング用雰囲気形成装置 Granted JPS60244034A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59098484A JPS60244034A (ja) 1984-05-18 1984-05-18 ワイヤボンデイング用雰囲気形成装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59098484A JPS60244034A (ja) 1984-05-18 1984-05-18 ワイヤボンデイング用雰囲気形成装置

Publications (2)

Publication Number Publication Date
JPS60244034A true JPS60244034A (ja) 1985-12-03
JPH0428136B2 JPH0428136B2 (ja) 1992-05-13

Family

ID=14220921

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59098484A Granted JPS60244034A (ja) 1984-05-18 1984-05-18 ワイヤボンデイング用雰囲気形成装置

Country Status (1)

Country Link
JP (1) JPS60244034A (ja)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5031821A (en) * 1988-08-19 1991-07-16 Hitachi, Ltd. Semiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the method
JP2008130825A (ja) * 2006-11-21 2008-06-05 Kaijo Corp ワイヤボンディング装置
US7628307B2 (en) * 2006-10-30 2009-12-08 Asm Technology Singapore Pte Ltd. Apparatus for delivering shielding gas during wire bonding
US7644852B2 (en) * 2006-07-03 2010-01-12 Kabushiki Kaisha Shinkawa Bonding apparatus, ball forming device in said bonding apparatus, and ball forming method using said bonding apparatus
US7658313B2 (en) * 2006-07-03 2010-02-09 Kabushiki Kaisha Shinkawa Ball forming device in a bonding apparatus and ball forming method
US20120031877A1 (en) * 2008-06-10 2012-02-09 Kulicke And Soffa Industries, Inc. Gas delivery system for reducing oxidation in wire bonding operations
US8186562B1 (en) * 2010-12-14 2012-05-29 Asm Technology Singapore Pte Ltd Apparatus for increasing coverage of shielding gas during wire bonding
US8586416B2 (en) 2011-05-24 2013-11-19 Renesas Electronics Corporation Method of manufacturing semiconductor device
JPWO2013111452A1 (ja) * 2012-01-26 2015-05-11 株式会社新川 酸化防止ガス吹き出しユニット

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5031821A (en) * 1988-08-19 1991-07-16 Hitachi, Ltd. Semiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the method
US7644852B2 (en) * 2006-07-03 2010-01-12 Kabushiki Kaisha Shinkawa Bonding apparatus, ball forming device in said bonding apparatus, and ball forming method using said bonding apparatus
US7658313B2 (en) * 2006-07-03 2010-02-09 Kabushiki Kaisha Shinkawa Ball forming device in a bonding apparatus and ball forming method
US7628307B2 (en) * 2006-10-30 2009-12-08 Asm Technology Singapore Pte Ltd. Apparatus for delivering shielding gas during wire bonding
JP2008130825A (ja) * 2006-11-21 2008-06-05 Kaijo Corp ワイヤボンディング装置
JP2012504317A (ja) * 2008-06-10 2012-02-16 クリック アンド ソッファ インダストリーズ、インク． ワイヤーボンディング作業における酸化軽減のためのガス配送システム
US20120031877A1 (en) * 2008-06-10 2012-02-09 Kulicke And Soffa Industries, Inc. Gas delivery system for reducing oxidation in wire bonding operations
US8313015B2 (en) 2008-06-10 2012-11-20 Kulicke And Soffa Industries, Inc. Gas delivery system for reducing oxidation in wire bonding operations
KR101434001B1 (ko) * 2008-06-10 2014-08-25 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 와이어 본딩 작업에서 산화 감소를 위한 가스 전달 시스템
US8186562B1 (en) * 2010-12-14 2012-05-29 Asm Technology Singapore Pte Ltd Apparatus for increasing coverage of shielding gas during wire bonding
KR101409731B1 (ko) * 2010-12-14 2014-06-19 에이에스엠 테크놀러지 싱가포르 피티이 엘티디 와이어 본딩 동안 차폐 가스의 커버리지를 증가시키기 위한 장치
US8586416B2 (en) 2011-05-24 2013-11-19 Renesas Electronics Corporation Method of manufacturing semiconductor device
JPWO2013111452A1 (ja) * 2012-01-26 2015-05-11 株式会社新川 酸化防止ガス吹き出しユニット

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