SG179409A1 - Gas delivery system for reducing oxidation in wire bonding operations - Google Patents

Gas delivery system for reducing oxidation in wire bonding operations

Info

Publication number
SG179409A1
SG179409A1 SG2012013447A SG2012013447A SG179409A1 SG 179409 A1 SG179409 A1 SG 179409A1 SG 2012013447 A SG2012013447 A SG 2012013447A SG 2012013447 A SG2012013447 A SG 2012013447A SG 179409 A1 SG179409 A1 SG 179409A1
Authority
SG
Singapore
Prior art keywords
wire bonding
gas delivery
delivery system
free air
bonding machine
Prior art date
Application number
SG2012013447A
Other languages
English (en)
Inventor
Gary S Gillotti
Stanley Szczesniak
Emmerik Peter J Van
Original Assignee
Kulicke & Soffa Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kulicke & Soffa Ind Inc filed Critical Kulicke & Soffa Ind Inc
Publication of SG179409A1 publication Critical patent/SG179409A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
SG2012013447A 2008-06-10 2009-06-08 Gas delivery system for reducing oxidation in wire bonding operations SG179409A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US6018908P 2008-06-10 2008-06-10

Publications (1)

Publication Number Publication Date
SG179409A1 true SG179409A1 (en) 2012-04-27

Family

ID=41417368

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2012013447A SG179409A1 (en) 2008-06-10 2009-06-08 Gas delivery system for reducing oxidation in wire bonding operations

Country Status (6)

Country Link
US (2) US8066170B2 (enExample)
JP (1) JP5753644B2 (enExample)
KR (1) KR101434001B1 (enExample)
CN (1) CN101971314B (enExample)
SG (1) SG179409A1 (enExample)
WO (1) WO2009152066A2 (enExample)

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* Cited by examiner, † Cited by third party
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KR101121849B1 (ko) * 2010-03-31 2012-03-21 앰코 테크놀로지 코리아 주식회사 와이어 본딩 장치
US8186562B1 (en) * 2010-12-14 2012-05-29 Asm Technology Singapore Pte Ltd Apparatus for increasing coverage of shielding gas during wire bonding
JP2012244093A (ja) * 2011-05-24 2012-12-10 Renesas Electronics Corp 半導体装置の製造方法
JP5618974B2 (ja) * 2011-08-16 2014-11-05 株式会社新川 ワイヤボンディング装置
JP5651575B2 (ja) * 2011-12-27 2015-01-14 株式会社カイジョー ワイヤボンディング装置及びワイヤボンディング方法
JP5592029B2 (ja) * 2012-01-26 2014-09-17 株式会社新川 酸化防止ガス吹き出しユニット
US8752751B2 (en) * 2012-07-13 2014-06-17 Asm Technology Singapore Pte Ltd Lead frame support plate and window clamp for wire bonding machines
JP2014075519A (ja) 2012-10-05 2014-04-24 Shinkawa Ltd 酸化防止ガス吹き出しユニット
US9245761B2 (en) * 2013-04-05 2016-01-26 Lam Research Corporation Internal plasma grid for semiconductor fabrication
CN104148794B (zh) * 2013-12-05 2016-05-18 武汉电信器件有限公司 氮气保护封焊电极
TWI677068B (zh) * 2017-05-24 2019-11-11 日商新川股份有限公司 打線接合裝置
JP2020155425A (ja) * 2017-07-07 2020-09-24 ヤマハモーターロボティクスホールディングス株式会社 ワイヤボンディング装置
US11239197B2 (en) * 2019-11-27 2022-02-01 Asm Technology Singapore Pte Ltd Wire bonding apparatus threading system
US11826861B1 (en) * 2020-08-12 2023-11-28 Sion Power Corporation Joining systems, clamping fixtures, and related systems and methods
JP2022071993A (ja) * 2020-10-29 2022-05-17 アスリートＦａ株式会社 電子部品接合装置

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Publication number Priority date Publication date Assignee Title
JPS57154850A (en) * 1981-03-20 1982-09-24 Hitachi Ltd Capillary structure for wire bonding
JPS59150440A (ja) 1983-02-03 1984-08-28 Toshiba Corp ワイヤボンデイング方法
JPS59150437A (ja) 1983-02-15 1984-08-28 Toshiba Corp ワイヤボンデイング方法
JPS6054446A (ja) * 1983-09-05 1985-03-28 Mitsubishi Electric Corp ワイヤボンデイング装置
US4572772A (en) * 1983-11-07 1986-02-25 Texas Instruments Incorporated Method for cleaning an electrode
JPS60244034A (ja) * 1984-05-18 1985-12-03 Mitsubishi Electric Corp ワイヤボンデイング用雰囲気形成装置
JPS6178131A (ja) 1984-09-25 1986-04-21 Toshiba Corp ワイヤボンデイング装置
JPS62136835A (ja) * 1985-12-10 1987-06-19 Mitsubishi Electric Corp 半導体装置の製造方法
JPH04186852A (ja) * 1990-11-21 1992-07-03 Shinkawa Ltd ボンデイング装置
US5295619A (en) * 1992-05-22 1994-03-22 Rohm Co., Ltd. Method and apparatus for performing wire bonding by using solder wire
JP2758819B2 (ja) 1993-12-22 1998-05-28 山形日本電気株式会社 ワイヤボンディング方法
JPH07263480A (ja) * 1994-03-18 1995-10-13 Shinkawa Ltd ワイヤボンデイング方法及び装置
JPH07273138A (ja) 1994-03-31 1995-10-20 Tatsuta Electric Wire & Cable Co Ltd ワイヤボンデイング法
JP3478510B2 (ja) * 1995-03-17 2003-12-15 芝浦メカトロニクス株式会社 ワイヤボンディング装置
US6180891B1 (en) * 1997-02-26 2001-01-30 International Business Machines Corporation Control of size and heat affected zone for fine pitch wire bonding
US6234376B1 (en) * 1999-07-13 2001-05-22 Kulicke & Soffa Investments, Inc. Supplying a cover gas for wire ball bonding
US6818001B2 (en) * 2000-04-05 2004-11-16 Pathway Medical Technologies, Inc. Intralumenal material removal systems and methods
JP2003179092A (ja) * 2001-12-10 2003-06-27 Nitto Denko Corp 半導体装置の製造方法及びそれに用いるワイヤボンディング装置
TWI287282B (en) * 2002-03-14 2007-09-21 Fairchild Kr Semiconductor Ltd Semiconductor package having oxidation-free copper wire
US6866182B2 (en) * 2002-10-08 2005-03-15 Asm Technology Singapore Pte Ltd. Apparatus and method to prevent oxidation of electronic devices
US7103959B2 (en) * 2002-12-17 2006-09-12 Asm Technology Singapore Pte Ltd. Conduit for preventing oxidation of a electronic device
US7182793B2 (en) * 2004-01-22 2007-02-27 Asm Technology Singapore Pty Ltd. System for reducing oxidation of electronic devices
US20070251980A1 (en) * 2006-04-26 2007-11-01 Gillotti Gary S Reduced oxidation system for wire bonding
US7614538B2 (en) * 2006-05-15 2009-11-10 Kulicke And Soffa Industries, Inc. Device clamp for reducing oxidation in wire bonding
US7658313B2 (en) * 2006-07-03 2010-02-09 Kabushiki Kaisha Shinkawa Ball forming device in a bonding apparatus and ball forming method
US7628307B2 (en) * 2006-10-30 2009-12-08 Asm Technology Singapore Pte Ltd. Apparatus for delivering shielding gas during wire bonding
JP4392015B2 (ja) * 2006-11-21 2009-12-24 株式会社カイジョー ワイヤボンディング装置
US7578423B1 (en) * 2008-06-06 2009-08-25 Asm Technology Singapore Pte Ltd. Assembly for reducing oxidation of semiconductor devices

Also Published As

Publication number Publication date
US20120031877A1 (en) 2012-02-09
JP5753644B2 (ja) 2015-07-22
KR20100102674A (ko) 2010-09-24
US8313015B2 (en) 2012-11-20
WO2009152066A4 (en) 2010-04-29
JP2012504317A (ja) 2012-02-16
KR101434001B1 (ko) 2014-08-25
CN101971314A (zh) 2011-02-09
US8066170B2 (en) 2011-11-29
US20110073635A1 (en) 2011-03-31
CN101971314B (zh) 2013-10-09
WO2009152066A3 (en) 2010-03-11
WO2009152066A2 (en) 2009-12-17

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