WO2009139453A1 - Ｌｅｄパッケージ、リードフレーム及びその製造法 - Google Patents

Ｌｅｄパッケージ、リードフレーム及びその製造法 Download PDF

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Publication number
WO2009139453A1
WO2009139453A1 PCT/JP2009/059034 JP2009059034W WO2009139453A1 WO 2009139453 A1 WO2009139453 A1 WO 2009139453A1 JP 2009059034 W JP2009059034 W JP 2009059034W WO 2009139453 A1 WO2009139453 A1 WO 2009139453A1
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WIPO (PCT)
Prior art keywords
led
lead
cup
holding surface
lead frame
Prior art date
Application number
PCT/JP2009/059034
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
達彦 坂井
省三郎 亀田
Original Assignee
株式会社明王化成
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008130065A external-priority patent/JP2009278012A/ja
Priority claimed from JP2008272150A external-priority patent/JP2010103243A/ja
Application filed by 株式会社明王化成 filed Critical 株式会社明王化成
Priority to CN200980117720.3A priority Critical patent/CN102027607A/zh
Publication of WO2009139453A1 publication Critical patent/WO2009139453A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements

Definitions

  • the present invention relates to a method for manufacturing a package of an LED device that can improve heat dissipation and reflection efficiency and can be made thin.
  • the present invention relates to a lead frame, a lead frame manufacturing method, and a LED package manufacturing method for providing a low-cost LED device package focusing on applications of high-power LEDs and white LEDs.
  • a light emitting diode (hereinafter referred to as “LED”) device is a device that can be used for illumination by being used with other red and green light emitting diodes, etc., according to the invention of a blue light emitting diode.
  • LED light emitting diode
  • an LED In the case of an LED element, part of the input power is converted into light energy, and the rest is converted into heat. Therefore, for example, an LED has a feature that it generates less heat than an incandescent bulb. Since a large current flows in the (high brightness) type LED element, a non-negligible level of heat generation and temperature rise occurs. On the other hand, there is a high demand for miniaturization and thinning of devices, and the development of small and thin LED devices is progressing. As LED devices, competition for the development of small and thin packages with high heat dissipation effects Has been expanded.
  • the LED element emits light at a predetermined radiation angle in the upper surface direction of the element, but emits a non-negligible amount of light also in the lateral direction of the element.
  • a method of arranging a reflector next to the element has been conventionally employed.
  • the side surface on which the LED element is mounted is inclined and white plastic is adopted.
  • White plastics are relatively excellent in reflection characteristics, but have the following problems with high-power LEDs and white LEDs. That is,
  • Patent Document 2 there is a semiconductor light emitting device in which an LED element is mounted by providing a recess in one of a pair of lead materials (see Patent Document 2).
  • This proposal is similar to Patent Document 1 described above in that the back surface of the lead is exposed, but has the following problems. That is, (1) Because the lead soldering part and the LED element mounting part have different thicknesses, it is necessary to prepare deformed strips with partially different plate thicknesses in advance. The deformed strip has a cutting method, a rolling method, and the like, but in any case, it is an expensive material, resulting in an increase in cost. (2) The depth of the recess formed by coining etc.
  • the recess of the lead material is shallow, the reflection is carried by the resin recess around the recess, and as described above, the plastic itself has a high light absorption rate, and the reflection efficiency is higher than that of the metal reflector. Is low, and the absorptivity of blue and ultraviolet light with a short wavelength is extremely high. Therefore, the color changes to brownish brown in a short time, and this discoloration has the disadvantages of a decrease in reflectance and color shift of white light.
  • An object of the present invention is to obtain a thin LED package that improves heat dissipation and reflection efficiency without degrading the insulating resin even when a high-power ultraviolet LED or blue LED is used.
  • the purpose of this invention is to obtain an inexpensive lead frame with high productivity by high-speed pressing using a normal metal punching, bending and drawing press technique using a sheet metal strip such as a hoop material.
  • the gap between the cup-shaped LED element mounting portion and the lead portion can be narrowed to the limit by using the above-described ordinary press technology, and the LED device using this lead frame can be miniaturized. It becomes possible.
  • the back of the cup bottom is flat and flush with the resin part, and the area of the cup back is as large as possible to improve the heat dissipation effect, and the cup inner surface is the main reflective surface Therefore, it is necessary to improve the completeness of the package by making the mirror finish in the pressing process, making the cup depth as deep as possible, and also by the lead frame insert molding process.
  • An object of the present invention is to provide a highly reliable LED package that is robust and stable with respect to subsequent processes.
  • the LED device package according to claim 1 includes an LED holding surface including a holding region for LED elements, and a frame member surrounding the LED holding surface, and the LED holding surface and the frame member.
  • the LED device package according to the invention described in claim 2 is such that the surface height position on the LED holding surface of the lead portion of claim 1 is higher than the surface height position on the LED holding surface of the heat sink plate. It is characterized by being at the top.
  • the package for an LED device according to the invention described in claim 3 is a cup-shaped member in which the heat radiating plate portion according to claim 1 or 2 holds the LED element inside,
  • the cup-shaped member includes a bottom plate portion that comes into thermal contact with the LED element, and a reflective surface portion formed on a peripheral portion of the bottom plate portion,
  • the reflection surface portion is configured such that the emitted light of the LED element thermally contacted with the bottom plate portion inside the reflection surface portion is irradiated to the outside LED holding surface and the frame member via the reflection surface portion. It is characterized by being formed at a height to prevent.
  • the LED device package according to the third aspect of the present invention there is provided the LED device package according to the third aspect of the present invention.
  • a reflection layer having a high reflectance with respect to the entire wavelength region is formed.
  • the lead frame for an LED package according to the invention described in claim 5 includes an LED holding surface including a holding area for the LED element, a resin frame member surrounding the LED holding surface, and an LED holding surface of the resin frame member.
  • LED comprising: a lead portion electrically connected to the LED element exposed to wire by wire bonding; and a light transmissive resin that seals an element holding space formed by the LED holding surface and the frame member Of the LED package comprising the LED holding surface, the resin frame member and the lead portion constituting the device, a lead frame for constituting the LED holding surface and the lead portion, A cup-shaped member that holds an LED element inside as the LED holding surface, a sub-lead frame portion including one or more lead portions, and a connecting bar that connects the cup-shaped member and the sub-lead frame portion.
  • the connecting bar further includes a bending portion that reduces a gap between the cup-shaped member and the sub lead frame portion to a predetermined gap distance.
  • a lead frame for an LED package according to an invention described in claim 6 is characterized in that the pair of sub lead frame parts according to claim 5 are arranged to face each other with the cup-shaped member in between. It is what.
  • an LED package lead frame manufacturing method comprising: an LED holding surface including an LED element holding region; a resin frame member surrounding the LED holding surface; A lead portion electrically connected to the LED element exposed on the LED holding surface by wire bonding, and a light-transmitting resin that seals an element holding space constituted by the LED holding surface and the frame member Among the LED packages composed of the LED holding surface, the resin frame member and the lead portion constituting the LED device provided, a method of manufacturing a lead frame for constituting the LED holding surface and the lead portion, A cup-shaped member that holds the LED element on the inner side as the LED holding surface, a sub lead frame portion that includes one or more lead portions that are electrically connected to the LED element by wire bonding, and the cup-shaped member and sub A lead frame forming step of forming a lead frame composed of components of a connecting bar for connecting the lead frame portion to a metal thin plate by drawing and punching; and And a bending step of bending the connecting bar to reduce a gap distance
  • the manufacturing method of the LED package according to the invention described in claim 8 is a manufacturing method of the LED package using the lead frame obtained by claim 7,
  • the cup-shaped member is insert-molded such that the back surface of the cup bottom and the back surface of the resin frame member are flush with each other.
  • the present invention has an effect that it is possible to provide an LED device that can improve heat dissipation and can be made thin. Moreover, even if it uses blue LED or ultraviolet LED, there is no possibility of deteriorating the insulating resin, the heat dissipation can be improved, the light output of the LED device can be improved, and the LED can be made thin. There is an effect that a device package can be provided.
  • the present invention has the effect of using a sheet metal strip such as a hoop material to obtain a highly productive and inexpensive lead frame by a high-speed press using a normal punching, bending and drawing press technology. is there.
  • the gap between the cup-shaped LED element mounting portion and the lead portion can be narrowed to the limit by using the above-described ordinary press technology, and the LED device using this lead frame can be miniaturized. There is an effect that can be done.
  • the back of the cup bottom is flat and flush with the resin part, and the area of the cup back is as large as possible to improve the heat dissipation effect, and the cup inner surface is the main reflective surface Therefore, it is necessary to improve the completeness of the package by making the mirror finish in the pressing process, making the cup depth as deep as possible, and also by the lead frame insert molding process. In addition, there is an effect that it is possible to provide an LED package which is robust and stable with respect to the post-process and has high reliability.
  • FIG. 2 is a cross-sectional view taken along the line AA in FIG.
  • FIG. 3 is a cross-sectional view taken along the line BB in FIG.
  • FIG. 2 is a cross-sectional view taken along the line CC of FIG.
  • FIG. 2 is a DD sectional view of FIG. 1.
  • FIG. 2 is a cross-sectional view taken along line EE in FIG. 1.
  • FIG. 5 is a sectional view taken along line FF in FIG. 1.
  • FIG. 6 is a bottom view of FIG. 5.
  • FIG. 5 is a sectional view taken along line FF in FIG. 5.
  • FIG. 6 is a cross-sectional view taken along line AA in FIG. 5.
  • FIG. 6 is a sectional view taken along line BB in FIG. 5.
  • FIG. 6 is a cross-sectional view taken along the line CC of FIG.
  • FIG. 6 is a DD sectional view of FIG. 5.
  • FIG. 6 is a cross-sectional view taken along line EE in FIG. 5.
  • FIG. 6 is a sectional view taken along line FF in FIG. 5.
  • It is a perspective view of the LED device using the package for LED devices of FIG. It is explanatory drawing which shows the manufacturing process of the LED apparatus package of FIG. 5, and the LED apparatus using this package. It is a top view which shows the structure of another Example of the package for LED devices of this invention.
  • FIG. 12 is a bottom view of FIG. 11.
  • FIG. 17 is a bottom view of FIG. 16.
  • FIG. 17 is a front view of FIG. 16.
  • FIG. 21b is a front view of FIG. 21a.
  • FIG. 21b is a side view of FIG. 21a.
  • FIG. 21b is a front view of FIG. 21a.
  • FIG. 22 is a plan view after the lead frame of FIG. 21 is formed by punching and forming a portion that becomes a sub lead frame portion and a connecting bar outside the cup-shaped member.
  • FIG. 22b is a front view of FIG. 22a.
  • FIG. 22b is a side view of FIG. 22a.
  • FIG. 23 is a plan view after bending a predetermined portion of a sub lead frame portion and a connecting bar of the lead frame of FIG. 22;
  • FIG. 23b is a front view of FIG. 23a.
  • FIG. 23b is a side view of FIG. 23a. It is AA sectional drawing of FIG. 23a.
  • FIG. 23b is a sectional view taken along line BB of FIG. 23a.
  • FIG. 23b is a bottom view of FIG. 23a.
  • FIG. 24 is a plan view showing a state in which the lead frame of FIG. 23 is mounted on an insert molding die. It is AA sectional drawing of FIG. 24a.
  • FIG. 24b is a sectional view taken along line BB of FIG. 24a. It is CC sectional drawing of FIG. 24a. It is a top view of the package for LED after performing insert molding using the metal mold
  • FIG. 25b is a front view of FIG. 25a.
  • FIG. 25b is a side view of FIG. 25a.
  • FIG. 25b is a cross-sectional view taken along the line BB of FIG. 25a.
  • FIG. 25b is a bottom view of FIG. 25a.
  • FIG. 6 is a plan view after drawing and punching another example of an LED package lead frame of the present invention to form a cup-shaped member, a sub lead frame part, and a crosspiece part.
  • FIG. 26b is a front view of FIG. 26a.
  • FIG. 26b is a side view of FIG. 26a.
  • FIG. 27 is a plan view after bending a lead portion of a sub lead frame portion of the lead frame of FIG. 26.
  • FIG. 27B is a front view of FIG. 27A.
  • FIG. 27b is a side view of FIG. 27a. It is AA sectional drawing of FIG. 27a.
  • FIG. 27B is a sectional view taken along line BB in FIG. 27a.
  • FIG. 27b is a bottom view of FIG. 27a.
  • FIG. 28 is a plan view after a predetermined portion of the connecting bar of the lead frame of FIG. 27 is bent and bent.
  • FIG. 28b is a front view of FIG. 28a.
  • FIG. 28b is a side view of FIG. 28a. It is AA sectional drawing of FIG. 28a.
  • FIG. 28b is a cross-sectional view taken along the line BB of FIG. 28a.
  • FIG. 28b is a bottom view of FIG. 28a.
  • FIG. 28 is a bottom view showing a state where the lead frame of FIG. 27 is mounted on an insert molding die. It is AA sectional drawing of FIG. 29a.
  • FIG. 29B is a sectional view taken along line BB in FIG. 29a.
  • FIG. 30b is a side view of FIG. 30a.
  • FIG. 30B is a sectional view taken along line AA in FIG. 30a.
  • FIG. 30B is a cross-sectional view taken along the line BB of FIG. 30a.
  • FIG. 30b is a bottom view of FIG. 30a.
  • an LED holding surface including a holding region for LED elements and a frame member surrounding the LED holding surface are provided, and light is transmitted through an element holding space formed by the LED holding surface and the frame member.
  • a heat radiating plate part that contacts, and an insulating partition part that partitions the lead part and the heat radiating plate part with an insulating resin are exposed, and the back surface side of the LED holding surface is the back surface of the heat radiating plate part of the insulating partition part. Since it is exposed flush with the back surface, heat dissipation can be improved and a package for manufacturing an LED device that can be made thin can be obtained.
  • the back surface of the heat radiating plate portion that is in thermal conduction contact with the LED element on the surface is exposed flush with the back surface of the insulating partition portion made of insulating resin. Therefore, the heat generated in the LED element can be released from the back surface of the heat radiating plate portion to the substrate. Further, by reducing the thickness of the heat radiating plate portion, the thickness of the package or the LED device can be reduced.
  • the heat sink plate of the present invention has the same thickness as the lead portion, and when the lead portion is punched from the metal plate constituting the lead portion, the heat sink portion can be punched simultaneously with the lead portion. Accordingly, since the heat radiating plate portion and the lead portion can be manufactured at the same time, the number of components is small, and it can be easily and in large numbers. In general, since the thickness of the metal plate constituting the lead portion is about 0.3 mm, the heat radiating plate portion can also be constituted with the same thickness. As a result, the thickness of the LED device is 0.8 mm. It becomes possible to make the degree.
  • the back surface of the heat radiating plate portion is exposed flush with the back surface of the insulating partition portion, and if the external heat radiating member and the conductor portion of the printed circuit board are in close contact with the back surface of the heat radiating plate portion, The heat dissipation effect is improved.
  • the package and the LED device of the present invention that are electrically insulated from the LED, there is no problem even if a heat radiating member made of a conductive material such as a metal is brought into contact, and therefore, a good heat radiating effect can be easily realized.
  • the frame member is preferably applied so that a part of the frame member overlaps a part of all the heat radiating plate portions and the lead portions of the package.
  • This frame member is not only configured by simply partitioning the element holding space sealed with the light transmissive resin, but before the step of sealing the element holding space with the light transmissive resin, the frame member is insulated with an insulating resin. It has a role of holding the heat radiating plate part and the lead part together with the partition part.
  • the resin constituting the frame member and the insulating partition formed between the heat radiating plate and the lead may be made of a different resin, but preferably the same resin. This is because the same resin can be easily formed in one insert molding process.
  • the resin used is preferably a thermoplastic resin that can be used in insert molding.
  • the LED element is bonded to the heat dissipation plate part by die bonding so that the heat conduction is good, and the strength is secured in a process that can safely make electrical connection to the LED element by wire bonding or the like.
  • a resin with excellent rigidity and impact strength is selected. For example, nylon resin or liquid crystal polymer resin is used.
  • the heat sink part of the present invention is not electrically coupled, and is insulated from the lead part by an insulating partition part. This is because, when a heat dissipation means for promoting heat dissipation of the heat dissipation plate portion is provided on the substrate on which the LED device using this package is mounted, if the heat dissipation plate portion is electrically coupled, the heat dissipation means of the substrate is also electrically connected. This is because there is a general limitation. Therefore, the LED element electrode and the lead part, which are in thermal conduction contact with the surface of the heat sink, are electrically coupled by wire bonding or the like, but the structure is not electrically coupled with the heat sink. it can.
  • the lead part of the present invention includes two terminal parts on the anode side and the cathode side for one LED element arranged in contact with the surface of the heat sink part. Further, a plurality of LED elements may be arranged in one package. When LED elements are connected in series, it is standard to provide at least two heat radiating plate portions and lead portions adjacent thereto. It is standard that a relay portion for connecting the LED elements arranged in each of the heat dissipation plate portions as a lead portion is provided between two adjacent heat dissipation plate portions.
  • a plurality of rows of LED elements connected in series may be provided.
  • a backlight unit for a liquid crystal display or a light source for illumination that has a high luminous intensity and is extremely thin due to a plurality of lines connected in series can be manufactured.
  • the series connection is a red LED group, a green LED group, and a blue LED group, respectively, it is possible to blink in each color and adjust the light intensity, and a liquid crystal display that does not require a color filter, and the light intensity and color temperature can be varied.
  • An illumination light source can be realized. Furthermore, since the voltage applied to each color LED group becomes high by connecting in series, there is also an advantage that the efficiency of the power supply becomes high.
  • the LED element that is thermally conductively contacted with the heat radiating plate portion of the present invention may include only one or a plurality of single-color LED elements such as white LED, blue LED, red LED, green LED, and yellow LED.
  • white LED blue LED
  • red LED red LED
  • green LED green LED
  • yellow LED yellow LED
  • the mechanical strength of the package of the present invention is such that the LED element is brought into thermal contact with the heat sink by die bonding, and the LED element is electrically contacted by wire bonding or the like to seal the light-transmitting resin.
  • the strength of the process is necessary.
  • strength which does not cause a malfunction also in the work of reflow and soldering is required. For this reason, you may perform various devices which raise the intensity
  • the contact area of the member with the resin can be increased.
  • the height position of the lead portion of the present invention on the LED holding surface may be disposed higher than the height position of the heat sink plate on the LED holding surface. That is, if a part of the lead part punched from the same metal plate as the heat sink part is bent and the surface of the lead part is placed higher than the surface height position of the heat sink part, the back side of the lead part Thus, the insulating resin wraps around, and the strength of the package can be increased so that the LED element can withstand the process of thermally and electrically connecting the LED element by die bonding or wire bonding.
  • the height position of the surface of the lead portion does not exceed the frame member, and by making it equal to the height position of the electrode of the LED element, there is also an advantage that the wire bonding between the LED element and the lead portion can be favorably performed. . Furthermore, since the electrically connected lead part is not exposed near the back of the heat sink, it is possible to directly contact the back of the heat sink and the external heat dissipation structure. Can be realized.
  • the heat radiating plate portion is a cup-shaped member that holds the LED element inside
  • the cup-shaped member includes a bottom plate portion that comes into thermal contact with the LED element, and a reflective surface portion formed on a peripheral portion of the bottom plate portion
  • the reflection surface portion is configured such that the emitted light of the LED element thermally contacted with the bottom plate portion inside the reflection surface portion is irradiated to the outside LED holding surface and the frame member via the reflection surface portion. Since it is formed at the height to prevent, even if blue LED or ultraviolet LED is used, there is no risk of deteriorating the insulating resin, heat dissipation can be improved, and it is possible to make it thin A package for producing an LED device that can be obtained can be obtained.
  • the cup-shaped member that holds the LED element on the inner side includes a bottom plate portion that is in thermal contact with the LED element, and a reflective surface portion that is formed on the peripheral portion of the bottom plate portion. Since the reflective surface portion prevents the radiated light of the LED element from being applied to the frame member, even if a blue LED or ultraviolet LED is used, the light reflection characteristics of the insulating resin disposed outside the reflective surface portion are deteriorated. There is no fear. Further, the back surface of the bottom plate portion of the cup-shaped member that comes into thermal contact with the LED element on the surface is made to be flush with the back surface of the insulating partition portion made of insulating resin.
  • the heat generated in the LED element can be released from the back surface of the bottom plate portion of the cup-shaped member to the substrate.
  • the thickness of the package or the LED device can be reduced by reducing the rising height of the reflection surface portion of the cup-shaped member as much as possible.
  • the periphery of the cup-shaped member is bent by press working simultaneously with the punching process or after the punching process to form the bottom plate portion and the reflection surface portion.
  • the rising height of the reflecting surface portion is determined so that the emitted light of the LED element thermally contacted with the bottom plate portion on the inner side of the reflecting surface portion is the LED holding surface and the frame member on the outer side through the reflecting surface portion.
  • one formed in an annular shape on the entire periphery of the bottom plate portion is most desirable for preventing the radiated light from being applied to the frame member, but on the part around the bottom plate portion.
  • a plurality of formed cup-shaped members may be arranged side by side so as to surround the edges of the plurality of bottom plate portions with a plurality of reflection surface portions.
  • one or more LED elements are mounted on a heat radiating plate part or a cup-shaped member in thermal conductive contact by die bonding, and two electrodes of the LED element are connected to the lead part by wire bonding. Thereafter, an element holding space constituted by an LED holding surface holding the LED element and a frame member surrounding the LED holding surface is sealed with a light-transmitting resin to obtain an LED device.
  • the light transmissive resin As the light transmissive resin, the light emitted from the LED element is radiated to the outside without being attenuated, or the light emitted from the blue LED, the purple LED, or the ultraviolet LED is incorporated into the light transmissive resin by using these materials. It is also possible to change the color of the light source, for example, converting the light into visible light having a long wavelength and making the light emission of the entire LED device white. Furthermore, by appropriately devising the shape of the light-transmitting resin, it is possible to provide a lens effect that enhances the emitted light in a specific direction. Furthermore, there is also a role of protecting the sealed LED element from humidity and the like. As the light transmissive resin, for example, an acrylic resin, a silicon transparent resin, or the like is used.
  • the heat radiating plate portion or the inner surface of the cup-shaped member of the present invention is subjected to a treatment that increases the light reflectance.
  • a reflection layer having a high reflectance with respect to almost the entire wavelength range of light emitted from the LED element thermally contacted with the bottom plate portion is formed on the inner surface of the cup-shaped member. .
  • the package of the present invention includes an LED holding surface for mounting an LED element and a frame member surrounding the LED holding surface, and transmits light through an element holding space composed of the LED holding surface and the frame member.
  • a method of manufacturing a package for constituting an LED device sealed with a conductive resin, a lead part electrically connected to the LED element and constituting a part of the LED holding surface, and heat conduction on the surface of the LED element A step of extracting a lead frame plate material having a heat radiating plate portion that comes into contact with the same metal plate from the punched lead frame plate material, and insulation between the frame member and the lead portion and the heat radiating plate portion.
  • a hoop material can be used as the metal plate for punching the heat radiation plate portion and the lead portion of the present invention, and the hoop material is used to form the frame member and the lead portion and the heat radiation plate portion.
  • the insulating resin wraps around the back surface side of the lead portion, and the LED element is thermally conductive on the heat radiating plate portion.
  • the strength of the package can be increased during electrical connection to the LED element by wire bonding or the like.
  • the LED holding surface including the holding region of the LED element, a resin frame member surrounding the LED holding surface, and the LED element exposed on the LED holding surface of the resin frame member are electrically connected by wire bonding.
  • LED holding surface and resin frame member constituting an LED device comprising: a lead portion that is electrically connected; and a light transmissive resin that seals an element holding space composed of the LED holding surface and the frame member 2 is a lead frame for constituting the LED holding surface and the lead portion of the LED package comprising the lead portion and the lead portion.
  • the present invention relates to a lead frame.
  • This lead frame is used when an LED package comprising an LED holding surface, a resin frame member, and a lead portion is formed by, for example, insert molding.
  • the obtained LED package has an LED element mounted on the LED holding surface, and after wire bonding to the lead portion, the element holding space composed of the LED holding surface and the surrounding frame member is sealed with a light transmissive resin.
  • a light transmissive resin is obtained.
  • the lead frame of the present invention includes a cup-shaped member that holds an LED element on the inside as an LED holding surface, a sub lead frame portion having one or more lead portions, and a connection that connects the cup-shaped member and the sub lead frame portion. And a bending portion for reducing the gap between the cup-shaped member and the sub lead frame portion to a predetermined gap distance.
  • a thin lead metal strip such as a hoop material can be used to obtain an inexpensive lead frame with high productivity by high-speed pressing using a normal punching, bending, and drawing press technique.
  • the gap can be reduced by the bent portion, for example, the gap can be reduced to a gap distance shorter than the thickness of the thin metal plate, which is impossible by normal punching, and the LED package can be reduced in size.
  • Lead frame can be realized.
  • a metal thin plate capable of ordinary punching, bending, and drawing press forming is used. More preferably, by using a metal hoop material, continuous molding becomes possible.
  • the metal thin plate should just have electroconductivity at least in the lead part electrically connected to the LED element exposed on the LED holding surface by wire bonding.
  • one pair is disposed opposite to each other with the cup-shaped member in between, and the lead portion can be disposed on each of the long sides facing the cup-shaped member. Therefore, since a large number of LED elements can be arranged on the cup-shaped member, it is possible to obtain a small LED device with high light emission performance.
  • the inner surface is preferably mirror-finished so as to improve the reflection efficiency. Also in this case, the mirror surface of the reflecting surface can be obtained by the drawing action of the mold having a mirror finish by drawing.
  • FIG. 1 is a plan view showing a configuration of an embodiment of an LED device package according to the present invention
  • FIG. 2 is a bottom view of FIG. 1
  • FIG. 3 is a longitudinal sectional view of FIG. 1
  • FIG. 3b is a sectional view taken along the line BB
  • FIG. 3c is a sectional view taken along the line CC.
  • 4 is a transverse sectional view of FIG. 1,
  • FIG. 4a is a DD sectional view,
  • FIG. 3b is a EE sectional view, and
  • FIG. 3c is a FF sectional view.
  • the package 10 of this embodiment is an LED device that seals an element holding space 13 composed of an LED holding surface 11 for holding an LED element and a frame member 12 surrounding the LED holding surface 11 with a light-transmitting resin. It is used for.
  • the LED holding surface 11 includes a lead portion 14 that is electrically connected to an LED element (not shown) and a heat radiating plate portion 15 that makes the LED element come into thermal contact with the surface. It is expressed through the insulating partition part 16 by.
  • the lead portion 14 and the heat radiating plate portion 15 are formed by punching from a metal plate 17 having a plate thickness of 0.3 mm, as shown in FIG. There are four heat radiating plate portions 15 and twelve lead portions 14. Of the lead parts 14, four lead parts arranged at intermediate positions are relay parts 14b that connect the LED elements in series.
  • the back surface of the LED holding surface 11 is flush with the back surface of the lead portion 14 and the heat radiating plate portion 15 with the back surface of the insulating partition portion 16 made of insulating resin.
  • this package 10 two LED elements are mounted on one heat radiating plate portion 15, the electrodes of each LED element and the lead portion 14 are electrically connected by wire bonding, and the element holding space 13 is sealed with a light transmissive resin. After stopping or before it is cut off from the metal plate 17, it becomes an LED device.
  • the pair of holes formed above and below the metal plate 17 are positioning holes 18 used when processed as a hoop material.
  • the four small holes formed immediately below the frame member 12 of the lead part 14 and the heat radiating plate part 15 are the lead part 14 and the heat radiating plate part 15, the insulating partition part 16 and the frame member 12 of these insulating resins. This is a drilling hole 19 for improving the bonding strength with the resin.
  • FIG. 5 is a plan view showing the configuration of another embodiment of the LED device package of the present invention
  • FIG. 6 is a bottom view of FIG. 5
  • FIG. 7 is a longitudinal sectional view of FIG. 5, and FIG. A sectional view
  • FIG. 7b is a BB sectional view
  • FIG. 7c is a CC sectional view
  • 8 is a cross-sectional view of FIG. 5,
  • FIG. 8a is a DD cross-sectional view
  • FIG. 8b is a EE cross-sectional view
  • FIG. 8c is a FF cross-sectional view.
  • FIG. 9 is a perspective view of an LED device using the LED device package of FIG.
  • the package 50 transmits an element holding space 53 including an LED holding surface 51 that holds the LED element 61 and a frame member 52 that surrounds the LED holding surface 51. It is used for the LED device 60 sealed with the resin 63.
  • the LED holding surface 51 includes a lead portion 54 that is electrically connected to the LED element 61 by a wire 62 and a heat radiating plate portion 55 that is in thermal conductive contact with the LED element on the surface. It is exposed via the insulating partition 56.
  • the lead portion 54 and the heat radiating plate portion 55 are formed by being extracted from a metal plate 57 having a plate thickness of 0.3 mm, as shown in FIG. There are four heat radiating plate portions 55 and twelve lead portions 54. Of the lead portions 54, the four lead portions arranged at the intermediate positions are relay portions 54b that connect the LED elements in series.
  • the lead portion 54 (relay portion 54 b) is bent at a position below the frame member 52, and the surface height position of the LED holding surface 51 of the lead portion 54 is the surface of the heat radiating plate portion 55. It is higher than the height position. For this reason, as shown in FIG. 6, the back surface of the LED holding surface 51 is exposed only on the back surface of the heat radiating plate portion 55 and is flush with the back surface of the insulating partition portion 56 made of insulating resin.
  • the pair of holes formed above and below the metal plate 57 are positioning holes 58 that are used when the hoop material 65 is processed. Further, the four small holes formed immediately below the frame member 52 of the lead portion 54 and the heat radiating plate portion 55 are the lead portion 54 and the heat radiating plate portion 55, the insulating partition portion 56 and the frame member 52 made of these insulating resins. This is a perforation hole 59 for improving the bonding strength with the resin.
  • FIG. 10 is an explanatory view showing the LED device package of FIG. 5 and a manufacturing process of the LED device using the package.
  • the metal plate 57 is a hoop material 87 used in insert molding.
  • the hoop material 87 is punched and formed to extract the lead portion 54 and the heat radiating plate portion 55.
  • the lead portion 54 below the frame member 52 is bent.
  • the frame member 52 and the insulating resin 56 are produced by insert molding.
  • the heat sink 55 is exposed flush with the insulating resin 56 on the back surface on which the frame member 52 is formed.
  • the hoop material 87 is cut to obtain the package 50 in which the metal plate 57 remains around.
  • the package 50 is obtained by being cut from the metal plate 57.
  • the package 50 brings two LED elements 61 into thermal conduction contact with one heat radiating plate portion 55, and electrically connects the electrodes of each LED element 61 and the lead portions 54 with wires 62. Then, the element holding space 53 is sealed with the light-transmitting resin 63 to form the LED device 60. Note that the mounting of the LED element 61, the connection of the wire bonding 62, and the sealing of the light-transmitting resin 63 may be performed in the steps shown in FIGS. 10e and 10f.
  • FIG. 10 includes the step of bending the lead portion as shown in FIG. 10c. By omitting this step, the LED device package of FIG. 1 and the LED device using this package are manufactured. It is possible.
  • FIG. 11 is a plan view showing the configuration of still another embodiment of the LED device package of the present invention
  • FIG. 12 is a bottom view of FIG. 13 is a front view of FIG. 11, and
  • FIG. 14 is a right side view of FIG.
  • FIG. 15 is a perspective view of an LED device using the LED device package of FIG.
  • the package 110 of this embodiment is an LED device that seals an element holding space 113 composed of an LED holding surface 111 for holding an LED element and a frame member 112 surrounding the LED holding surface 111 with a light-transmitting resin. It is used for.
  • the LED holding surface 111 includes eight lead portions 114 that are electrically connected to the LED elements, and one cup-shaped member 115 having a substantially rectangular planar shape that makes the LED elements come into thermal contact with the surface. Are expressed through an insulating partition 117 made of insulating resin.
  • the package 110 transmits light in an element holding space 113 including an LED holding surface 111 that holds the LED element 121 and a frame member 112 that surrounds the LED holding surface 111.
  • the LED device 120 is sealed with a resin 123.
  • a pattern line indicating the insulating partition 117 made of insulating resin is omitted.
  • the substantially rectangular cup-shaped member 115 includes a bottom plate portion 115 a that is in thermal contact with the LED element 121, and a reflective surface portion 115 b that is formed at the edge of the bottom plate portion 115 a.
  • the reflective surface portion 115b is formed in an annular shape around the entire periphery of the bottom plate portion 115a.
  • the reflective surface portion 115b is configured to receive the radiated light of the LED element 121 thermally contacted with the bottom plate portion 115a inside the reflective surface portion 115b. It is formed to a height that prevents direct irradiation of the outer LED holding surface 111 and the frame member 112 via 115b.
  • the back surface of the LED holding surface 111 is flush with the back surface of the insulating partition portion 117 made of insulating resin.
  • the insulating partition portion 117 made of insulating resin.
  • four LED elements 121 are mounted on one cup-shaped member 115, the electrodes of each LED element 121 and lead portions 114 are electrically connected by wires 22, and the element holding space 113 is made of a light-transmitting resin.
  • the LED device 120 is formed by sealing with 123.
  • the inner surface of the cup-shaped member 115 needs to be processed so as to increase the reflectance of light, and is preferably further mirror-finished.
  • the cup-shaped member made of aluminum or the surface of silver can have a high reflectance with respect to almost the entire wavelength range of the light emitted from the LED element.
  • a cup-shaped member made of metal such as copper for example, by forming a reflective layer made of silver and mirroring the surface, similarly, it is high for almost all wavelength ranges of light emitted from the LED element. It can have reflectivity.
  • FIG. 16 is a plan view showing the configuration of another embodiment of the LED device package of the present invention. 17 is a bottom view of FIG. 16, FIG. 18 is a front view of FIG. 16, and FIG. 19 is a right side view of FIG. 20 is a perspective view of an LED device using the LED device package of FIG.
  • the package 160 of this embodiment includes an LED that seals an element holding space 163 that includes an LED holding surface 161 that holds an LED element and a frame member 162 that surrounds the LED holding surface 161 with a light transmissive resin 173. It is used for the device.
  • the LED holding surface 161 has two lead portions 164 that are electrically connected to the LED element by a wire, and one cup having a substantially circular planar shape in which the LED element is in thermal contact with the surface.
  • the member 165 is exposed through an insulating partition 167 made of an insulating resin.
  • the substantially circular cup-shaped member 165 transmits light through an element holding space 163 including an LED holding surface 161 that holds the LED element 171 and a frame member 162 that surrounds the LED holding surface 161. It is used for the LED device 170 sealed with the conductive resin 173.
  • a pattern line indicating the insulating partition 167 made of insulating resin is omitted.
  • the cup-shaped member 165 includes a bottom plate portion 165a that comes into thermal contact with the LED element 171 and a reflection surface portion 165b formed on an edge of the bottom plate portion 165a.
  • the reflection surface portion 165b is formed in an annular shape around the entire periphery of the bottom plate portion 165a, and the reflection surface portion 165b is formed by the reflection surface portion 165b. It is formed at a height that prevents direct irradiation of the outer LED holding surface 161 and the frame member 162 via the 165b.
  • the inner surface of the cup-shaped member 165 needs to be processed so as to increase the reflectance of light, and is preferably further mirror-finished.
  • the cup-shaped member made of aluminum or the surface of silver can have a high reflectance with respect to almost the entire wavelength range of the light emitted from the LED element.
  • a cup-shaped member made of metal such as copper for example, by forming a reflective layer made of silver and mirroring the surface, similarly, it is high for almost all wavelength ranges of light emitted from the LED element. It can have reflectivity.
  • FIG. 21 is an explanatory view after the punching process of an embodiment of the lead frame for LED package of the present invention
  • FIG. 21a is a plan view
  • FIG. 21b is a front view
  • FIG. 21c is a side view.
  • a cup-shaped member 212 is drawn at a substantially central portion of a section of the lead frame 211 that is a hoop-shaped thin metal plate
  • a cup peripheral slit 213 is formed at each of the upper and lower portions of the cup-shaped member 212. Has been punched.
  • a lead frame made of, for example, a copper alloy or iron-nickel alloy of about 0.15 mm is employed. Either the drawing process or the punching process may be performed first. However, by performing the punching process after the drawing process, a change in the outer shape of the cup-shaped member 212 is reduced. Both side portions of the cup-shaped member 212 serve as connection portions 214 connected to the lead frame 211.
  • FIG. 21 shows only one section of a hoop-like thin metal plate, which is continuous to the left and right of FIG. 21a.
  • the lead frame 211 is arranged in a horizontal row, but if a wide lead frame is used or a smaller package is created, two or more rows may be arranged.
  • FIG. 22 is an explanatory view after the lead frame shown in FIG. 21 is punched and formed to form the sub lead frame portion and the connecting bar outside the cup-shaped member.
  • FIG. 22a is a plan view and FIG. 22b is a front view.
  • Figures 22c are side views.
  • a U-shaped sub lead frame portion 216 is formed at an opposing position with the cup-shaped member 212 sandwiched outside the cup-shaped member 212.
  • each sub lead frame portion 216 two lead portions 217 are further extended in the direction of the cup-shaped member 212 by further removing the pair of cup peripheral slits 213 formed in FIG. 21.
  • a U-shaped sub lead frame portion outer slit 219 is formed on the outer side of the sub lead frame portion 216 so as to be connected to the cup connecting portion 214 to form a connecting bar 218.
  • the sub lead frame portion 216 is formed.
  • the lead portion 217 extending from the sub lead frame portion 216 is formed with a bent raised portion 220 that is bent in an L shape before the tip portion, and the height of the surface of the lead portion 217 is the lead frame 211. It is higher than the surface.
  • a pilot hole 215 of the sub lead frame portion 216 is formed at a position facing the cup-shaped member 212 of the sub lead frame portion 216.
  • FIG. 23 is an explanatory view after bending a predetermined portion of the sub lead frame portion and the connecting bar of the lead frame of FIG. 22,
  • FIG. 23a is a plan view
  • FIG. 23b is a front view
  • FIG. 23c is a side view
  • 23d is a sectional view taken on line AA
  • FIG. 23e is a sectional view taken on line BB
  • FIG. 23f is a bottom view.
  • a bent portion 222 is formed by bending each of the pair of connecting bars 218 connecting the sub lead frame portion 216 and the cup connecting portion 214 of FIG.
  • the bent portion 222 has the two rising portions not the same length, but the height of the rising portion far from the cup-shaped member 212 is increased, so that the height position of the back surface of the sub lead frame portion 216 is cup-shaped.
  • the depth is the same plane as the back surface of the member 212. Further, this causes the rising portion of the bending raising portion 220 in FIG. 22 so that the height position of the lead portion 217 connected to the sub lead frame portion 216 is the same height position as the edge height of the cup-shaped member 212. Is adjusted in advance.
  • the bending depth (bending magnitude) of the bending portion 222 for pulling the sub lead frame portion 216 toward the cup-shaped member 212 is the gap between the tip position of the lead portion 217 and the edge position of the cup-shaped member 212. What is necessary is just to design so that L may become a predetermined gap distance. Since the gap L can be reduced by the bending portion 222, for example, it is possible to reduce the gap distance to be shorter than the thickness of the metal thin plate, which is impossible by normal punching.
  • FIG. 24 is an explanatory view showing a state in which the lead frame of FIG. 23 is mounted on an insert molding die
  • FIG. 24a is a plan view
  • FIG. 24b is an AA sectional view
  • FIG. 24c is a BB sectional view
  • a sub lead frame portion 216 formed inside the lead frame 211 of FIG. 23 is sandwiched between upper and lower molds 223 and 224, and a set of sub portions including a cup-shaped member 212 and four lead portions 217.
  • the lead frame portion 216 is mounted inside the upper and lower molds 223 and 224.
  • a pin is provided in the lower mold 224, and the pilot hole 221 of the sub lead frame portion 216 is fitted therein, thereby positioning the lower mold 224 and the lead frame 211 in the horizontal direction.
  • the lead part 217 is fixed by the upper and lower molds 223 and 224 and at the same time the bottom surface of the cup-shaped member 212 is pressed by the upper mold 223 and the edge of the cup-shaped member 212 is supported by the lower mold 224.
  • the bottom surface of the cup-shaped member 212 is the upper surface.
  • the resin When the resin is injected from the resin injection gate 225 of the upper mold 223 in the state shown in FIG. 24, the resin is filled into the cavities (voids) 226 inside the upper and lower molds, and the package manufacturing process is completed.
  • the protruding member 227 that protrudes around the bottom back surface of the cup-shaped member 212 of the upper mold 223 is for preventing the resin from rotating around this portion, and the resin crawls up on the back surface of the cup-shaped member 212. This prevents the LED device from being lifted by inducing solder flux when the final user solders the LED device to the substrate or the like.
  • FIG. 25 is an explanatory view of the LED package after insert molding using the mold of FIG. 24, FIG. 25a is a plan view, FIG. 25b is a front view, FIG. 25c is a side view, and FIG. A sectional view, FIG. 25e is a BB sectional view, and FIG. 25f is a bottom view. As shown in FIG. 25, the package 230 is cut off from the lead frame 211.
  • the package 230 of this embodiment includes an LED holding surface 228 as an inner surface of the cup-shaped member 212, a resin frame member 229 surrounding the LED holding surface 228, and leads exposed on the inner surface of the resin frame member 229. Part 217.
  • an LED element is mounted on the LED holding surface 228, and after the mounted LED element and the lead portion are electrically connected by wire bonding, an element holding composed of the LED holding surface and the resin frame member is held.
  • An LED device is obtained by sealing the space with a light-transmitting resin.
  • the height position of the edge part of the cup-shaped member 212 and the lead part 217 is the same, it does not need to be the same height substantially.
  • the LED element is mounted on the bottom of the cup-shaped member 212 and the electrode on the upper surface of the element is connected to the lead part 217 with a bonding wire, the height of the lead part 217 may be set to an optimum height. Above, it is almost the same height.
  • the inclination of the surrounding cup slope with respect to the bottom surface of the cup-shaped member 212 is ideally 45 ° with respect to the radiation light in the horizontal direction, but the radiation angle from the LED element cannot be specified. It is selected in the range of 45 ° to 80 ° in consideration of the demand to reduce W.
  • the resin slope 231 provided around the cup-shaped member 212 of the resin frame member 229 re-reflects the leaked light when part of the light reflected by the bottom surface of the cup-shaped member 212 and the cup slope leaks. Therefore, since it becomes a sub-reflection plate, a resin of a color that is easily reflected such as white (for example, a nylon resin, a liquid crystal polymer resin, or the like) is used.
  • white for example, a nylon resin, a liquid crystal polymer resin, or the like
  • the gap gap L is desirably small from the request of reducing the vertical width of the package 230 and the request of shortening the bonding wire, but is preferably large from the viewpoint of reliably filling the gap between the gaps.
  • the gap gap L can be reduced to 0.1 mm.
  • the individual lead frames 211 are separated and processed, but may be separated when the processing steps shown in FIG. 24 or FIG. 25 are completed without being separated.
  • FIG. 26 is an explanatory view after the cup-shaped member, the sub lead frame portion, and the crosspiece portion are formed by drawing and punching another embodiment of the lead frame for LED package of the present invention
  • FIG. 26a is a plan view
  • 26b is a front view
  • FIG. 26c is a side view.
  • the present embodiment is an application example to a smaller package having a smaller number of leads than the above-described embodiment.
  • a cup-shaped member 262 is drawn at a substantially central portion of a section of the lead frame 261 that is a hoop-like thin metal plate, and a cup peripheral slit 263 is punched around the cup-shaped member 262. Yes.
  • the cup peripheral slit 263 includes one sub lead frame portion 266 that forms two lead portions 267, a connecting bar 268 that connects the sub lead frame portion 266 to the upper edge portion of the cup member 262, and the cup member 262.
  • a connecting portion 264 that is connected to the lead frame 261 from the lower edge portion thereof, and two lead portions 267 that are formed inside the lead frame portion 261 are configured.
  • the lead frame 261 of the present embodiment also employs a lead frame made of a copper alloy or iron-nickel alloy of about 0.15 mm. Either the drawing process or the punching process may be performed first. However, by performing the punching process after the drawing process, a change in the outer shape of the cup-shaped member 262 is reduced.
  • the cup bottom surface and the cup slant surface of the cup-shaped member 262 are reflective portions as in the above-described embodiment, the surface roughness was finished to a mirror surface with a surface roughness of 1 ⁇ m or less by a die and punch of a press mold.
  • the holes formed in the upper and lower edge portions of the lead frame 261 and the sub lead frame portion 266 are pilot holes 265.
  • FIG. 26 shows only one section of a hoop-like thin metal plate, which is continuous to the left and right of FIG. 26a.
  • the lead frame 261 is arranged in a horizontal row, but two or more rows may be arranged if a wide lead frame is used or a smaller package is created.
  • FIG. 27 is an explanatory view after bending the lead part of the sub lead frame part of the lead frame of FIG. 26,
  • FIG. 27a is a plan view
  • FIG. 27b is a front view
  • FIG. 27c is a side view
  • FIG. 27e is a BB sectional view
  • FIG. 27f is a bottom view.
  • a bent raised portion 270 is formed in which the front end portion of the lead portion 267 arranged around the cup-shaped member 262 is bent in an L shape, and the height of the surface of the lead portion 267 is formed. The position is higher than the surface of the lead frame 261.
  • FIG. 28 is an explanatory view after folding and bending predetermined portions of the connecting frame of the lead frame of FIG. 27,
  • FIG. 28a is a plan view
  • FIG. 28b is a front view
  • FIG. 28c is a side view
  • FIG. 28e is a BB sectional view
  • FIG. 28f is a bottom view.
  • a stepped bending portion 271 is formed at a position near the cup-shaped member 262 of the connecting portion 264 and the connecting bar 268, and a bent portion 272 bent in a convex shape is formed at a far position.
  • stepped bending portions 271 by applying step bending to the connecting portion 264 and the connecting bar 268, the lead frame 261 descends vertically downward, and at the same time, the lead portion 267 is also lowered by the same dimension.
  • the stepped bending dimension is such that the back surface of the lead frame 211 and the back surface of the cup-shaped member 262 are in the same plane.
  • the bent portion 272 is formed by applying an R-shaped or convex bent process to the connecting portion 264 and the connecting bar 268, thereby forming the lead portion 267 of the sub lead frame portion 261 and the inside of the lead frame 261.
  • the gap distance between the formed lead portion 267 and the cup-shaped member 262 is reduced. It should be noted that the order of formation of the stepped bending portion 271 and the R-shaped or convex bending portion 272 may be either.
  • the bending depth (bending magnitude) of the bending portion 272 formed in the connecting portion 264 and the connecting bar 268 for narrowing the space between the lead portion 267 and the cup-shaped member 262 is the tip position of the lead portion 267.
  • the gap gap L with respect to the edge position of the cup-shaped member 262 may be designed to be a predetermined gap distance. Since the gap gap L can be reduced by the bent portion 272, for example, it is possible to reduce the gap distance to be shorter than the thickness of the thin metal plate, which is impossible by normal punching.
  • FIG. 29 is an explanatory view showing a state where the lead frame of FIG. 28 is mounted on an insert molding die
  • FIG. 29a is a bottom view
  • FIG. 29b is an AA sectional view
  • FIG. 29c is a BB sectional view.
  • the lead frame 261 of FIG. 28 is cut off, and a cup-shaped member 262 and four lead portions 267 are mounted inside the upper and lower molds 273 and 274.
  • the resin When the resin is injected from the resin injection gate 275 of the upper mold 273 in the state shown in FIG. 29, the resin is filled into the cavities (voids) 276 inside the upper and lower molds, and the package manufacturing process is completed.
  • the protruding member 277 that protrudes from the bottom back surface of the cup-shaped member 262 of the upper mold 273 is for preventing the resin from rotating around this portion, and the resin crawls up to the back surface of the cup-shaped member 262. This prevents the LED device from being lifted by inducing solder flux when the final user solders the LED device to the substrate or the like.
  • the pilot hole 265 of the lead frame 261 is a reference hole when the lead frame 261 is fed by a progressive press.
  • the lead frame 261 is used as a reference hole for horizontal positioning by attaching the lead frame 261 to the upper and lower molds 273 and 274. .
  • FIG. 30 is an explanatory view of the LED package after insert molding using the mold of FIG. 29, FIG. 30a is a plan view, FIG. 30b is a front view, FIG. 30c is a side view, and FIG. A sectional view, FIG. 30e is a BB sectional view, and FIG. 30f is a bottom view. As shown in FIG. 30, the package 280 is cut off from the lead frame 261.
  • the inclination of the surrounding cup slope with respect to the bottom surface of the cup-shaped member 262 is selected in the range of 45 ° to 80 ° in consideration of the desire to reduce the vertical width W of the package 280, as in the previous embodiment.
  • the gap gap L is preferably small from the demand for reducing the vertical width of the package 280 and the demand for shortening the bonding wire. However, the gap gap L is larger from the viewpoint of reliably filling the resin between the gaps. desirable. In this molding technique, the gap gap L can be reduced to 0.1 mm.
  • the package 280 of this embodiment includes an LED holding surface 278 as an inner surface of the cup-shaped member 262, a resin frame member 279 surrounding the LED holding surface 278, and leads exposed on the inner surface of the resin frame member 279. Part 267.
  • an LED element is mounted on the LED holding surface 278, and after the mounted LED element and the lead portion are electrically connected by wire bonding, an element holding composed of the LED holding surface and the resin frame member is held.
  • An LED device is obtained by sealing the space with a light-transmitting resin.
  • cup-shaped member 115a, 165a ... bottom plate, 115b, 165b ... reflective surface portion, 117, 167... Insulating partition, 120 170 ... LED device, 121 171 ... LED element, 122 172 ... wire, 123, 173 ... light transmissive resin, 211, 261 ... lead frame member, 212, 262 ... Cup-shaped member, 213, 263 ... slits around the cup, 214 ... Cup connecting part, 264 ... connecting part, 215, 265 ... pilot holes, 216, 266... Sub lead frame part, 217, 267 ... lead part, 218, 268 ... connecting bars, 219 ... Sub lead frame part outer slit, 220, 270 ...

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  • Manufacturing & Machinery (AREA)
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  • Led Device Packages (AREA)
PCT/JP2009/059034 2008-05-16 2009-05-15 Ｌｅｄパッケージ、リードフレーム及びその製造法 WO2009139453A1 (ja)

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KR101837758B1 (ko) * 2010-07-30 2018-03-13 이치코 고교가부시키가이샤 차량용 등기구의 반도체형 광원의 광원 유닛, 차량용 등기구

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CN110918775A (zh) * 2019-11-26 2020-03-27 昆山市飞荣达电子材料有限公司 一种超薄金属工件加工方法

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