TW201007988A - LED package, lead frame and method for producing the same - Google Patents
LED package, lead frame and method for producing the same Download PDFInfo
- Publication number
- TW201007988A TW201007988A TW98116005A TW98116005A TW201007988A TW 201007988 A TW201007988 A TW 201007988A TW 98116005 A TW98116005 A TW 98116005A TW 98116005 A TW98116005 A TW 98116005A TW 201007988 A TW201007988 A TW 201007988A
- Authority
- TW
- Taiwan
- Prior art keywords
- led
- lead
- cup
- package
- holding surface
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 18
- 229920005989 resin Polymers 0.000 claims abstract description 129
- 239000011347 resin Substances 0.000 claims abstract description 129
- 230000017525 heat dissipation Effects 0.000 claims abstract description 38
- 238000005192 partition Methods 0.000 claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims description 54
- 239000002184 metal Substances 0.000 claims description 54
- 238000000034 method Methods 0.000 claims description 36
- 230000008569 process Effects 0.000 claims description 26
- 238000005452 bending Methods 0.000 claims description 25
- 238000000465 moulding Methods 0.000 claims description 19
- 238000004080 punching Methods 0.000 claims description 19
- 238000007789 sealing Methods 0.000 claims description 16
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 238000003780 insertion Methods 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 6
- 230000005855 radiation Effects 0.000 claims description 6
- 239000000470 constituent Substances 0.000 claims description 2
- 238000003754 machining Methods 0.000 claims description 2
- 230000001976 improved effect Effects 0.000 abstract description 7
- 239000000463 material Substances 0.000 description 22
- 238000010586 diagram Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 10
- 239000011295 pitch Substances 0.000 description 8
- 238000012545 processing Methods 0.000 description 6
- 239000004033 plastic Substances 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000008093 supporting effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000009194 climbing Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000006880 cross-coupling reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000002305 electric material Substances 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008130065A JP2009278012A (ja) | 2008-05-16 | 2008-05-16 | Ｌｅｄ装置用パッケージ |
| JP2008272150A JP2010103243A (ja) | 2008-10-22 | 2008-10-22 | Ｌｅｄパッケージ用リードフレーム及びその製造法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201007988A true TW201007988A (en) | 2010-02-16 |
Family
ID=41318813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW98116005A TW201007988A (en) | 2008-05-16 | 2009-05-14 | LED package, lead frame and method for producing the same |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR20110013401A (ko) |
| CN (1) | CN102027607A (ko) |
| TW (1) | TW201007988A (ko) |
| WO (1) | WO2009139453A1 (ko) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101103674B1 (ko) | 2010-06-01 | 2012-01-11 | 엘지이노텍 주식회사 | 발광 소자 |
| JP5488310B2 (ja) * | 2010-07-30 | 2014-05-14 | 市光工業株式会社 | 車両用灯具の半導体型光源の光源ユニット、車両用灯具 |
| CN104766920A (zh) * | 2015-01-26 | 2015-07-08 | 广州华微电子有限公司 | 一种大功率led驱动芯片的sop8封装引线框架 |
| CN110918775A (zh) * | 2019-11-26 | 2020-03-27 | 昆山市飞荣达电子材料有限公司 | 一种超薄金属工件加工方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2859144B2 (ja) * | 1994-11-11 | 1999-02-17 | 三洋電機株式会社 | リードフレームと半導体装置の製造方法 |
| JP3205235B2 (ja) * | 1995-01-19 | 2001-09-04 | シャープ株式会社 | リードフレーム、樹脂封止型半導体装置、その製造方法及び該製造方法で用いる半導体装置製造用金型 |
| JP3391372B2 (ja) * | 1998-03-02 | 2003-03-31 | サンケン電気株式会社 | 絶縁物封止型電子装置及びその製造方法 |
| JP2005026395A (ja) * | 2003-07-01 | 2005-01-27 | Toshiba Corp | 半導体発光素子及び半導体発光装置 |
| JP2007194519A (ja) * | 2006-01-23 | 2007-08-02 | Matsushita Electric Ind Co Ltd | 発光モジュールとその製造方法 |
| JP2007214522A (ja) * | 2006-02-10 | 2007-08-23 | Intekkusu Kk | 光源装置及びこれを用いた照明装置 |
| JP2008010564A (ja) * | 2006-06-28 | 2008-01-17 | Toshiba Corp | 光半導体装置及びその製造方法 |
| US8044418B2 (en) * | 2006-07-13 | 2011-10-25 | Cree, Inc. | Leadframe-based packages for solid state light emitting devices |
| JP2008098543A (ja) * | 2006-10-16 | 2008-04-24 | Yohohama Electron Kk | Ｌｅｄランプ |
-
2009
- 2009-05-14 TW TW98116005A patent/TW201007988A/zh unknown
- 2009-05-15 KR KR1020107025564A patent/KR20110013401A/ko not_active Application Discontinuation
- 2009-05-15 WO PCT/JP2009/059034 patent/WO2009139453A1/ja active Application Filing
- 2009-05-15 CN CN200980117720.3A patent/CN102027607A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR20110013401A (ko) | 2011-02-09 |
| CN102027607A (zh) | 2011-04-20 |
| WO2009139453A1 (ja) | 2009-11-19 |
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