CN102027607A - Led封装、引线框及其制造方法 - Google Patents

Led封装、引线框及其制造方法 Download PDF

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Publication number
CN102027607A
CN102027607A CN200980117720.3A CN200980117720A CN102027607A CN 102027607 A CN102027607 A CN 102027607A CN 200980117720 A CN200980117720 A CN 200980117720A CN 102027607 A CN102027607 A CN 102027607A
Authority
CN
China
Prior art keywords
led
mentioned
face
lead frame
keeps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200980117720.3A
Other languages
English (en)
Chinese (zh)
Inventor
坂井达彦
龟田省三郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MEIOH PLASTICS MOLDING Co Ltd
Original Assignee
MEIOH PLASTICS MOLDING Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008130065A external-priority patent/JP2009278012A/ja
Priority claimed from JP2008272150A external-priority patent/JP2010103243A/ja
Application filed by MEIOH PLASTICS MOLDING Co Ltd filed Critical MEIOH PLASTICS MOLDING Co Ltd
Publication of CN102027607A publication Critical patent/CN102027607A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
CN200980117720.3A 2008-05-16 2009-05-15 Led封装、引线框及其制造方法 Pending CN102027607A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2008130065A JP2009278012A (ja) 2008-05-16 2008-05-16 Ｌｅｄ装置用パッケージ
JP2008-130065 2008-05-16
JP2008272150A JP2010103243A (ja) 2008-10-22 2008-10-22 Ｌｅｄパッケージ用リードフレーム及びその製造法
JP2008-272150 2008-10-22
PCT/JP2009/059034 WO2009139453A1 (ja) 2008-05-16 2009-05-15 Ｌｅｄパッケージ、リードフレーム及びその製造法

Publications (1)

Publication Number Publication Date
CN102027607A true CN102027607A (zh) 2011-04-20

Family

ID=41318813

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980117720.3A Pending CN102027607A (zh) 2008-05-16 2009-05-15 Led封装、引线框及其制造方法

Country Status (4)

Country Link
KR (1) KR20110013401A (ko)
CN (1) CN102027607A (ko)
TW (1) TW201007988A (ko)
WO (1) WO2009139453A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110918775A (zh) * 2019-11-26 2020-03-27 昆山市飞荣达电子材料有限公司 一种超薄金属工件加工方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101103674B1 (ko) * 2010-06-01 2012-01-11 엘지이노텍 주식회사 발광 소자
JP5488310B2 (ja) * 2010-07-30 2014-05-14 市光工業株式会社 車両用灯具の半導体型光源の光源ユニット、車両用灯具
CN104766920A (zh) * 2015-01-26 2015-07-08 广州华微电子有限公司 一种大功率led驱动芯片的sop8封装引线框架

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2859144B2 (ja) * 1994-11-11 1999-02-17 三洋電機株式会社 リードフレームと半導体装置の製造方法
JP3205235B2 (ja) * 1995-01-19 2001-09-04 シャープ株式会社 リードフレーム、樹脂封止型半導体装置、その製造方法及び該製造方法で用いる半導体装置製造用金型
JP3391372B2 (ja) * 1998-03-02 2003-03-31 サンケン電気株式会社 絶縁物封止型電子装置及びその製造方法
JP2005026395A (ja) * 2003-07-01 2005-01-27 Toshiba Corp 半導体発光素子及び半導体発光装置
JP2007194519A (ja) * 2006-01-23 2007-08-02 Matsushita Electric Ind Co Ltd 発光モジュールとその製造方法
JP2007214522A (ja) * 2006-02-10 2007-08-23 Intekkusu Kk 光源装置及びこれを用いた照明装置
JP2008010564A (ja) * 2006-06-28 2008-01-17 Toshiba Corp 光半導体装置及びその製造方法
US8044418B2 (en) * 2006-07-13 2011-10-25 Cree, Inc. Leadframe-based packages for solid state light emitting devices
JP2008098543A (ja) * 2006-10-16 2008-04-24 Yohohama Electron Kk Ｌｅｄランプ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110918775A (zh) * 2019-11-26 2020-03-27 昆山市飞荣达电子材料有限公司 一种超薄金属工件加工方法

Also Published As

Publication number Publication date
WO2009139453A1 (ja) 2009-11-19
TW201007988A (en) 2010-02-16
KR20110013401A (ko) 2011-02-09

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Application publication date: 20110420