WO2009119515A1 - 粘着シート - Google Patents
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- WO2009119515A1 WO2009119515A1 PCT/JP2009/055682 JP2009055682W WO2009119515A1 WO 2009119515 A1 WO2009119515 A1 WO 2009119515A1 JP 2009055682 W JP2009055682 W JP 2009055682W WO 2009119515 A1 WO2009119515 A1 WO 2009119515A1
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- pressure
- sensitive adhesive
- adhesive sheet
- resin
- mass
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/10—Homopolymers or copolymers of propene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C08L23/0869—Acids or derivatives thereof
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/10—Homopolymers or copolymers of propene
- C08L23/14—Copolymers of propene
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/18—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet characterized by perforations in the adhesive tape
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/006—Presence of polyolefin in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2425/00—Presence of styrenic polymer
- C09J2425/006—Presence of styrenic polymer in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
- C09J2433/006—Presence of (meth)acrylic polymer in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
- Y10T428/24322—Composite web or sheet
- Y10T428/24331—Composite web or sheet including nonapertured component
Definitions
- the present invention relates to an adhesive sheet that can prevent or remove air pockets and blisters, for example.
- resin materials such as acrylic resin, ABS resin, polystyrene resin, and polycarbonate resin may generate gas either by heating or not by heating.
- blisters are generated in the adhesive sheet by the gas generated from the adherend.
- Patent Document 1 proposes an adhesive sheet in which through holes having a hole diameter of 0.1 to 300 ⁇ m are formed at a hole density of 30 to 50,000 holes / 100 cm 2 . . According to this pressure-sensitive adhesive sheet, it is possible to prevent air accumulation or blistering of the pressure-sensitive adhesive sheet by drawing air or gas on the pressure-sensitive adhesive side from the through hole to the surface side of the pressure-sensitive adhesive sheet.
- Laser processing may be used to form through holes in the adhesive sheet.
- Laser processing includes laser ablation processing in which an object is photolyzed by irradiation with an ultraviolet laser such as an excimer laser, and laser thermal processing in which an object is thermally decomposed by irradiation with an infrared laser such as a carbon dioxide laser.
- laser thermal processing with a carbon dioxide laser or the like is preferable, but when the base material is made of a general polyolefin-based material, an infrared laser such as a carbon dioxide gas laser passes through the base material, It was difficult to form a through hole by laser thermal processing.
- the present invention has been made in view of such a situation, and provides an olefin-based pressure-sensitive adhesive sheet that can prevent or remove air pockets and blisters and that can form through holes by laser thermal processing.
- the purpose is to do.
- the present invention provides a pressure-sensitive adhesive sheet comprising a base material and a pressure-sensitive adhesive layer, wherein a plurality of through-holes penetrating from one surface to the other surface are formed. And 50% by mass to 85% by mass of the polyolefin resin (A), and when the inflow gas is nitrogen, a 5% mass reduction temperature when the thermogravimetric measurement is performed at a temperature rising rate of 20 ° C./min, and the inflow gas is air. In some cases, from a resin composition containing 15 to 50% by mass of resin (B) having a difference from a 5% mass reduction temperature of 60 ° C. or less when thermogravimetric measurement is performed at a rate of temperature increase of 20 ° C./min. A pressure-sensitive adhesive sheet is provided (Invention 1).
- sheet includes the concept of film
- film includes the concept of sheet
- the resin (B) preferably has an absorption peak at the wavelength of the carbon dioxide laser (Invention 2).
- the resin (B) is preferably at least one selected from the group consisting of a styrene resin, a polyester resin and an acrylic resin (Invention 3).
- the polyolefin resin (A) is preferably a copolymer containing a monomer having polarity as a repeating unit (Invention 4).
- the through hole is preferably formed by laser thermal processing (Invention 5).
- the laser used in the laser thermal processing is preferably a carbon dioxide laser (Invention 6).
- the hole diameter of the through hole on the surface of the substrate is preferably smaller than the hole diameter of the through hole in the adhesive surface of the pressure-sensitive adhesive layer (Invention 7).
- an olefin-based pressure-sensitive adhesive sheet that can prevent or remove air pockets and blisters and that can form through holes by laser thermal processing.
- FIG. 1 is a cross-sectional view of an adhesive sheet according to an embodiment of the present invention.
- the pressure-sensitive adhesive sheet 1 As shown in FIG. 1, the pressure-sensitive adhesive sheet 1 according to this embodiment is formed by laminating a base material 11, a pressure-sensitive adhesive layer 12, and a release material 13. However, the release material 13 is peeled off when the pressure-sensitive adhesive sheet 1 is used.
- a plurality of through-holes 2 penetrating the base material 11 and the pressure-sensitive adhesive layer 12 and extending from the base material surface 1A to the pressure-sensitive adhesive surface 1B are formed.
- air generated between the adherend and the pressure-sensitive adhesive surface 1B of the pressure-sensitive adhesive layer 12 and gas generated from the adherend escape from the through hole 2 to the outside of the substrate surface 1A.
- the base material 11 is a resin film such as a film, a foamed film, or a laminated film made of a resin composition containing a polyolefin resin (A) and a resin (B) described later.
- polyolefin-based resin (A) examples include homopolymers or copolymers of olefins such as ethylene and propylene, and copolymers of olefins and other monomers, one of these alone or two of them. The above can be blended and used.
- a copolymer containing a polar monomer as a repeating unit has good dispersibility with the resin (B).
- the polar monomer include (meth) acrylic acid, (meth) acrylic acid ester, vinyl acetate, vinyl alcohol, maleic anhydride and the like.
- preferred polyolefin resins (A) include, for example, ethylene- (meth) acrylic acid copolymers, ethylene- (meth) acrylic acid alkyl ester copolymers, ethylene-vinyl acetate copolymers, ethylene-vinyl alcohol. Examples thereof include a copolymer and an ethylene-maleic anhydride copolymer.
- the mass average molecular weight of the polyolefin resin (A) is preferably 10,000 to 3,000,000, and particularly preferably 50,000 to 500,000.
- Resin (B) has a 5% mass loss temperature when thermogravimetric measurement is performed at a temperature rising rate of 20 ° C./min when the inflowing gas is nitrogen, and a temperature rising rate of 20 ° C. when the inflowing gas is air.
- a resin having a difference from the 5% mass decrease temperature (hereinafter referred to as “5% mass decrease temperature difference”) when thermogravimetric measurement is performed at a rate of 60 ° C./min.
- the thermogravimetric measurement is performed according to JIS K7120 “Plastic Thermogravimetric Measurement Method”, the gas inflow rate is 100 ml / min, and the standard mass of 5% mass reduction is the mass at 100 ° C.
- the through hole 2 can be formed by laser thermal processing such as carbon dioxide laser processing. .
- the resin (B) preferably has an absorption peak at the wavelength of the carbon dioxide laser, that is, at a wavelength of 9.2 to 10.6 ⁇ m, so that the through hole 2 can be formed with a small output.
- the resin (B) may be selected from known materials having the above-mentioned thermal decomposition characteristics, and is at least one selected from the group consisting of styrene resins, polyester resins, and acrylic resins. Is preferred.
- each of the above resins may be a homopolymer or a copolymer.
- the resin (B) include polystyrene resin, styrene-acrylic acid copolymer, styrene-acrylic acid ester copolymer, styrene-butadiene-styrene block copolymer, polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate. , Polybutylene succinate adipate, (meth) acrylic resin, (meth) acrylic acid alkyl ester resin, polycarbonate, polylactic acid, and the like. One of these may be used alone, or two or more may be used in combination. be able to.
- a copolymer containing a monomer having polarity as a repeating unit is preferable.
- Such a copolymer has good dispersibility with the olefin-based resin (A), is excellent in laser heat processing, and can form the through-hole 2 even with small irradiation energy.
- the mass average molecular weight of the resin (B) is preferably 10,000 to 1,000,000, and particularly preferably 50,000 to 500,000.
- the content of the resin (B) in the resin composition is 15 to 50% by mass, preferably 30 to 40% by mass.
- the through hole 2 cannot be formed when the content of the resin (B) is less than 15% by mass.
- the content of the resin (B) exceeds 50% by mass, the gasoline resistance of the substrate 11 becomes insufficient.
- the said resin composition may contain various additives, such as an inorganic filler, an organic filler, and an ultraviolet absorber.
- the resin film may be formed by a casting method using a carrier sheet.
- a decorative layer is formed on the surface of the resin film by a method such as printing, printing, coating of a coating material, transfer from a transfer sheet, vapor deposition, sputtering, or the like.
- an easy-adhesion coat for forming such a decorative layer, or a functional layer such as a gloss adjusting coat, a hard coat, an antifouling coat, or an ultraviolet absorbing coat may be formed.
- these decoration layers or functional layers may be formed on the whole surface of the said material, and may be formed partially.
- the thickness of the substrate 11 is usually 1 to 500 ⁇ m, preferably about 3 to 300 ⁇ m, but can be appropriately changed depending on the application of the pressure-sensitive adhesive sheet 1.
- the type of the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 12 is not particularly limited as long as the through-hole 2 can be formed, and any of acrylic, polyester, polyurethane, rubber, silicone, etc. It may be.
- the pressure-sensitive adhesive may be any of an emulsion type, a solvent type, or a solventless type, and may be a crosslinked type or a non-crosslinked type.
- the thickness of the pressure-sensitive adhesive layer 12 is usually 1 to 300 ⁇ m, preferably about 5 to 100 ⁇ m, but can be appropriately changed according to the use of the pressure-sensitive adhesive sheet 1.
- the material of the release material 13 is not particularly limited, for example, a film made of a resin such as polyethylene terephthalate, polypropylene, polyethylene, or a foamed film thereof, or paper such as glassine paper, coated paper, laminated paper, A silicone-based, fluorine-based, or long-chain alkyl group-containing carbamate or other release agent can be used.
- a resin such as polyethylene terephthalate, polypropylene, polyethylene, or a foamed film thereof
- paper such as glassine paper, coated paper, laminated paper,
- a silicone-based, fluorine-based, or long-chain alkyl group-containing carbamate or other release agent can be used.
- the thickness of the release material 13 is usually about 10 to 250 ⁇ m, preferably about 20 to 200 ⁇ m. Further, the thickness of the release agent in the release material 13 is usually 0.05 to 5 ⁇ m, preferably 0.1 to 3 ⁇ m.
- the hole diameter of the through hole 2 in the base material 11 and the pressure-sensitive adhesive layer 12 is preferably 0.1 to 300 ⁇ m, particularly preferably 0.5 to 150 ⁇ m.
- the hole diameter of the through hole 2 is less than 0.1 ⁇ m, it is difficult for air or gas to escape, and when it exceeds 300 ⁇ m, the through hole 2 becomes conspicuous and the appearance of the pressure-sensitive adhesive sheet is impaired.
- the hole diameter on the surface 1A of the substrate 11 is 40 ⁇ m or less.
- the hole density of the through holes 2 is preferably 30 to 50,000 / 100 cm 2 , and more preferably 100 to 10,000 / 100 cm 2 . If the hole density of the through holes 2 is less than 30/100 cm 2 , air or gas may be difficult to escape. If the hole density of the through holes 2 exceeds 50,000 / 100 cm 2 , There is a possibility that the tensile strength and tear strength may be lowered.
- the through hole 2 in the pressure-sensitive adhesive sheet 1 penetrates only the base material 11 and the pressure-sensitive adhesive layer 12, it may also penetrate the release material 13.
- the pressure-sensitive adhesive sheet 1 includes the release material 13, the present invention is not limited to this, and the release material 13 may not be provided. Furthermore, the magnitude
- the pressure-sensitive adhesive sheet 1 may be a tape-shaped material (adhesive tape) composed of only the base material 11 and the pressure-sensitive adhesive layer 12 and may be wound into a roll shape to be a wound body.
- the pressure-sensitive adhesive layer 12 is formed on the release treatment surface of the release material 13.
- a pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 12 and, if desired, a coating agent further containing a solvent are prepared, and a roll coater, a knife coater, a roll knife coater, an air knife coater, and a die coater.
- coating machines such as a bar coater, a gravure coater, and a curtain coater.
- the base material 11 is pressure-bonded to the surface of the pressure-sensitive adhesive layer 12 to obtain a laminate composed of the base material 11, the pressure-sensitive adhesive layer 12, and the release material 13.
- the release material 13 is peeled from the pressure-sensitive adhesive layer 12, and then penetrates through the laminate composed of the base material 11 and the pressure-sensitive adhesive layer 12 as shown in FIG. 2 (e). The hole 2 is formed, and the release material 13 is attached to the pressure-sensitive adhesive layer 12 again as shown in FIG.
- the formation of the through-hole 2 is preferably laser thermal processing that can easily form a fine through-hole having a good air escape property with a desired hole density.
- laser types used for laser thermal processing include carbon dioxide (CO 2 ) laser, TEA-CO 2 laser, YAG laser, UV-YAG laser, YVO 4 laser, YLF laser, etc. Among them, production efficiency and cost In view of the above, a carbon dioxide laser is preferable.
- the formation of the through hole 2 by laser thermal processing includes burst processing (burst mode) in which laser light is continuously irradiated to one place until one through hole 2 is formed, and laser light is sequentially applied to a plurality of places.
- burst processing burst mode
- cycle processing cycle mode
- the former is superior in terms of thermal efficiency, while the latter is superior in terms of reducing the thermal effect on the workpiece.
- the laser thermal processing may be performed in any mode.
- the hole diameter of the through hole 2 on the substrate surface 1A becomes smaller than the hole diameter on the pressure-sensitive adhesive surface 1B of the pressure-sensitive adhesive layer 12.
- the release energy 13 can be peeled once, and the laser output energy can be reduced by directly irradiating the adhesive layer 12 with a laser. If the output energy of the laser is small, it is possible to form a well-shaped through-hole 2 with few melts and heat-deformed portions due to heat.
- the melt may adhere to the periphery of the opening of the through-hole 2 by laser thermal processing, but by adhering a protective film to the surface of the base material 11, it is possible to prevent the melt from adhering.
- a protective film the well-known protective film used for a building material or a metal plate can be used.
- the pressure-sensitive adhesive layer 12 is formed on the release material 13 and the formed pressure-sensitive adhesive layer 12 and the base material 11 are bonded together, but the present invention is not limited to this, The pressure-sensitive adhesive layer 12 may be formed directly on the substrate 11.
- the adhesive sheet 1 is pressed against the adherend so that the adhesive surface 1B of the exposed adhesive layer 12 is in close contact with the adherend.
- the air between the adherend and the pressure-sensitive adhesive surface 1B of the pressure-sensitive adhesive layer 12 escapes from the through-hole 2 formed in the pressure-sensitive adhesive sheet 1 to the outside of the substrate surface 1A. It is difficult for air to be caught between the two, and it is possible to prevent air from being trapped.
- Even if air is entrained and an air pool is formed the air is re-press-bonded around the air pool portion or the air pool portion including the air pool portion, so that the air passes from the through hole 2 to the outside of the substrate surface 1A. It escapes and the air pocket disappears. Such removal of air pockets is possible even after a long time has elapsed since the adhesive sheet 1 was applied.
- Example 1 50% by mass of styrene-acrylic acid alkyl ester copolymer (manufactured by PS Japan, SC004) is added to 50% by mass of ethylene-methacrylic acid copolymer (Mitsui / DuPont Polychemical Co., Ltd., NUCREL N0903HC). Kneaded pellets were prepared using an extrusion kneader (manufactured by Technobel, KZW25TWIN-30MG-STM). Subsequently, a film having a film thickness of 100 ⁇ m was produced from the kneaded pellets using an extrusion tester (manufactured by Toyo Seiki Seisakusho, Labo Plast Mill 30C150). The obtained film was used as the base material of the pressure-sensitive adhesive sheet.
- styrene-acrylic acid alkyl ester copolymer manufactured by PS Japan, SC004
- ethylene-methacrylic acid copolymer Mitsubishi Chemical Co., Ltd., NUCR
- Acrylic solvent-based adhesive on the release surface of a release material (Lintec Corp., FPM-11, thickness: 175 ⁇ m) obtained by laminating both sides of a high-quality paper with polyethylene resin and one side with a silicone release agent.
- the coating agent of Lintec Co., Ltd. (PK) was applied with a knife coater so that the thickness after drying was 30 ⁇ m, and dried at 90 ° C. for 1 minute.
- the above-mentioned film as a base material is pressure-bonded to the pressure-sensitive adhesive layer thus formed, and a protective sheet having a re-peelable pressure-sensitive adhesive layer on the surface of the base material (S-20, E-2035, thickness) : 60 ⁇ m) was applied to obtain a laminate having a four-layer structure.
- the release material is peeled off from the laminate, and the laminate is irradiated with a carbon dioxide laser from the adhesive layer side (Matsushita Industrial Equipment Co., Ltd., YB-HCS03 is used, 2-shot burst processing, frequency: 10000 Hz, pulse width: 25 ⁇ sec. (First shot) / 12 ⁇ sec (second shot)) Through holes were formed at a hole density of 2500/100 cm 2 . And the said peeling material was crimped
- Example 2 30 mass% of styrene-acrylic acid alkyl ester copolymer (PS Japan, SC004) is added to 70 mass% of ethylene-methacrylic acid copolymer (Mitsui / DuPont Polychemical Co., Ltd., NUCREL N0903HC), and biaxial Kneaded pellets were prepared using an extrusion kneader (manufactured by Technobel, KZW25TWIN-30MG-STM). A pressure-sensitive adhesive sheet was produced in the same manner as in Example 1 except that this kneaded pellet was used.
- Example 3 15% by mass of a styrene-acrylic acid alkyl ester copolymer (PS004, SC004) is added to 85% by mass of an ethylene-methacrylic acid copolymer (Mitsui / DuPont Polychemical Co., Ltd., NUCREL N0903HC). Kneaded pellets were prepared using an extrusion kneader (manufactured by Technobel, KZW25TWIN-30MG-STM). A pressure-sensitive adhesive sheet was produced in the same manner as in Example 1 except that this kneaded pellet was used.
- Example 4 30% by mass of a styrene-butadiene-styrene block copolymer (Clayton Polymer Japan, MD6459) was added to 70% by mass of an ethylene-methacrylic acid copolymer (Mitsui / DuPont Polychemical Co., Ltd., NUCREL N0903HC). Kneaded pellets were prepared using a shaft extrusion kneader (manufactured by Technobel, KZW25TWIN-30MG-STM). A pressure-sensitive adhesive sheet was produced in the same manner as in Example 1 except that this kneaded pellet was used.
- a shaft extrusion kneader manufactured by Technobel, KZW25TWIN-30MG-STM
- Example 5 50% by mass of butylene succinate adipate (manufactured by Showa Polymer Co., Ltd., Bionore 3010) is added to 50% by mass of an ethylene-methacrylic acid copolymer (Mitsui / DuPont Polychemical Co., Ltd., NUCREL N0903HC), and a twin-screw extruder kneader. Kneaded pellets were prepared using (Technobel, KZW25TWIN-30MG-STM). A pressure-sensitive adhesive sheet was produced in the same manner as in Example 1 except that this kneaded pellet was used.
- Example 6 30% by mass of a styrene-acrylic acid alkyl ester copolymer (manufactured by PS Japan, SC004) is added to 70% by mass of an ethylene-methyl methacrylate copolymer (Sumitomo Chemical Co., Ltd., Aklift WD301), and biaxial extrusion kneading. Kneaded pellets were prepared using a machine (Technobel, KZW25TWIN-30MG-STM). A pressure-sensitive adhesive sheet was produced in the same manner as in Example 1 except that this kneaded pellet was used.
- Example 7 50% by mass of polymethyl methacrylate (ALDRICH) is added to 50% by mass of an ethylene-methacrylic acid copolymer (Mitsui / DuPont Polychemical Co., Ltd., NUCREL N0903HC), and a twin-screw extrusion kneader (manufactured by Technobel, KZW25TWIN-30MG-STM) was used to prepare kneaded pellets.
- a pressure-sensitive adhesive sheet was produced in the same manner as in Example 1 except that this kneaded pellet was used.
- Example 4 A pressure-sensitive adhesive sheet was prepared in the same manner as in Example 1 except that the additive resin was not added to the ethylene-methacrylic acid copolymer (Mitsui / Dupont Polychemical Co., Ltd., NUCREL N0903HC).
- thermogravimetric measurement was performed using the inflow gas as air.
- thermogravimetric curve Based on the obtained thermogravimetric curve, the temperature at which the mass was reduced by 5% relative to the mass at a temperature of 100 ° C. (5% mass reduction temperature) was determined. The difference between the 5% mass reduction temperature when the inflowing gas was nitrogen and the 5% mass reduction temperature when the inflowing gas was air was calculated. The results are shown in Table 1.
- the pressure-sensitive adhesive sheet (size: 30 mm ⁇ 30 mm) from which the release material had been peeled was attached to a melamine-coated plate, and the appearance of the pressure-sensitive adhesive sheet surface was examined with the naked eye under an indoor fluorescent lamp.
- the distance from the eyes to the adhesive sheet was about 30 cm, and the angle at which the adhesive sheet was viewed was variously changed.
- ⁇ a case where the through-hole cannot be recognized by the naked eye
- ⁇ a case where the through-hole can be recognized
- the pressure-sensitive adhesive sheet adhered to the melamine-coated plate as in (4) and allowed to stand for 24 hours is soaked in gasoline at room temperature for 0.5 hours, taken out of it and dried, and then the appearance in the same manner as in (4) above. Observed. As a result, a case where the through-hole cannot be recognized by the naked eye is indicated by ⁇ , and a case where the through-hole can be recognized by ⁇ .
- Air reservoir disappearance test 1 About the adhesive sheet obtained by the Example and the comparative example, the air clogging disappearance test was done as follows. The results are shown in Table 3.
- the pressure-sensitive adhesive sheet (size: 50 mm x 50 mm) from which the release material has been peeled is affixed to a flat melamine-coated plate so that an air pocket with a diameter of about 15 mm is formed, and the pressure-sensitive adhesive sheet is pressure-bonded with a squeegee. It was confirmed whether or not can be removed. As a result, the case where the air pocket was removed is represented by ⁇ , and the case where the air pool was not removed (including the remaining one even if the air pool was small).
- Air reservoir disappearance test 2 About the adhesive sheet obtained by the Example and the comparative example, the air clogging disappearance test was done as follows. The results are shown in Table 3.
- the pressure-sensitive adhesive sheet (size: 50 mm ⁇ 50 mm) from which the release material has been peeled is affixed to a 70 mm ⁇ 70 mm melamine coated plate having a partial spherical recess (recess) having a diameter of 15 mm and a maximum depth of 1 mm (recess and pressure-sensitive adhesive sheet).
- the pressure-sensitive adhesive sheet was pressure-bonded with a squeegee to confirm whether the air pocket could be removed.
- the pressure-sensitive adhesive sheet follows the concave portion of the melamine-coated plate and the air pocket is removed, and the pressure-sensitive adhesive sheet does not follow the concave portion of the melamine-coated plate and the air pocket is not removed (the air pocket is (Including those remaining even if small) is represented by x.
- the pressure-sensitive adhesive sheets (Examples 1 to 7) using the base material meeting the conditions of the present invention are excellent in air bleeding and the diameter of the through holes on the base material surface is small.
- the through-holes could not be recognized with the naked eye and had a good appearance.
- the through hole could not be recognized with the naked eye and had good gasoline resistance.
- the pressure-sensitive adhesive sheet of the present invention is generally used when air accumulation or blistering is likely to occur in the pressure-sensitive adhesive sheet, for example, when the area of the pressure-sensitive adhesive sheet is large or when gas is generated from the adherend, under normal circumstances.
- it can be preferably used when a good appearance is required even in an environment where a liquid such as gasoline adheres.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
11…基材
12…粘着剤層
13…剥離材
1A…基材表面
1B…粘着面
2…貫通孔
〔粘着シート〕
図1は、本発明の一実施形態に係る粘着シートの断面図である。
上記実施形態に係る粘着シート1の製造方法の一例を図2(a)~(f)を参照して説明する。
粘着シート1を被着体に貼付する際には、まず、剥離材13を粘着剤層12から剥離する。
エチレン-メタクリル酸共重合体(三井・デュポンポリケミカル社製,NUCREL N0903HC)50質量%に、スチレン-アクリル酸アルキルエステル共重合体(PSジャパン社製,SC004)を50質量%添加し、二軸押出混練機(テクノベル社製,KZW25TWIN-30MG-STM)を用いて混練ペレットを作製した。次いで、押出試験機(東洋精機製作所社製,ラボプラストミル30C150)を用い、上記混練ペレットから膜厚100μmのフィルムを作製した。得られたフィルムを粘着シートの基材とした。
エチレン-メタクリル酸共重合体(三井・デュポンポリケミカル社製,NUCREL N0903HC)70質量%に、スチレン-アクリル酸アルキルエステル共重合体(PSジャパン社製,SC004)を30質量%添加し、二軸押出混練機(テクノベル社製,KZW25TWIN-30MG-STM)を用いて混練ペレットを作製した。この混練ペレットを使用する以外、実施例1と同様にして粘着シートを作製した。
エチレン-メタクリル酸共重合体(三井・デュポンポリケミカル社製,NUCREL N0903HC)85質量%に、スチレン-アクリル酸アルキルエステル共重合体(PSジャパン社製,SC004)を15質量%添加し、二軸押出混練機(テクノベル社製,KZW25TWIN-30MG-STM)を用いて混練ペレットを作製した。この混練ペレットを使用する以外、実施例1と同様にして粘着シートを作製した。
エチレン-メタクリル酸共重合体(三井・デュポンポリケミカル社製,NUCREL N0903HC)70質量%に、スチレン-ブタジエン-スチレンブロック共重合体(クレイトンポリマージャパン社製,MD6459)を30質量%添加し、二軸押出混練機(テクノベル社製,KZW25TWIN-30MG-STM)を用いて混練ペレットを作製した。この混練ペレットを使用する以外、実施例1と同様にして粘着シートを作製した。
エチレン-メタクリル酸共重合体(三井・デュポンポリケミカル社製,NUCREL N0903HC)50質量%に、ブチレンサクシネートアジペート(昭和高分子社製,ビオノーレ3010)を50質量%添加し、二軸押出混練機(テクノベル社製,KZW25TWIN-30MG-STM)を用いて混練ペレットを作製した。この混練ペレットを使用する以外、実施例1と同様にして粘着シートを作製した。
エチレン-メタクリル酸メチル共重合体(住友化学社製,アクリフトWD301)70質量%に、スチレン-アクリル酸アルキルエステル共重合体(PSジャパン社製,SC004)を30質量%添加し、二軸押出混練機(テクノベル社製,KZW25TWIN-30MG-STM)を用いて混練ペレットを作製した。この混練ペレットを使用する以外、実施例1と同様にして粘着シートを作製した。
エチレン-メタクリル酸共重合体(三井・デュポンポリケミカル社製,NUCREL N0903HC)50質量%に、ポリメタクリル酸メチル(ALDRICH社製)を50質量%添加し、二軸押出混練機(テクノベル社製,KZW25TWIN-30MG-STM)を用いて混練ペレットを作製した。この混練ペレットを使用する以外、実施例1と同様にして粘着シートを作製した。
エチレン-メタクリル酸共重合体(三井・デュポンポリケミカル社製,NUCREL N0903HC)70質量%に、ポリカプロラクトン(ダイセル化学工業社製,プラクセルH7)を30質量%添加し、二軸押出混練機(テクノベル社製,KZW25TWIN-30MG-STM)を用いて混練ペレットを作製した。この混練ペレットを使用する以外、実施例1と同様にして粘着シートを作製した。
エチレン-メタクリル酸共重合体(三井・デュポンポリケミカル社製,NUCREL N0903HC)70質量%に、スチレン-メタクリル酸アルキルエステル-アクリル酸アルキルエステル共重合体、スチレン-ブタジエン共重合体及び石油樹脂の混合物(PSジャパン社製,SS700)を30質量%添加し、二軸押出混練機(テクノベル社製,KZW25TWIN-30MG-STM)を用いて混練ペレットを作製した。この混練ペレットを使用する以外、実施例1と同様にして粘着シートを作製した。
エチレン-メタクリル酸共重合体(三井・デュポンポリケミカル社製,NUCREL N0903HC)40質量%に、スチレン-アクリル酸アルキルエステル共重合体(PSジャパン社製,SC004)を60質量%添加し、二軸押出混練機(テクノベル社製,KZW25TWIN-30MG-STM)を用いて混練ペレットを作製した。この混練ペレットを使用する以外、実施例1と同様にして粘着シートを作製した。
エチレン-メタクリル酸共重合体(三井・デュポンポリケミカル社製,NUCREL N0903HC)に添加樹脂を添加しなかったこと以外は実施例1と同様にして粘着シートを作製した。
(1)5%質量減少温度差の測定
実施例および比較例で使用した基材の添加樹脂について、示差熱・熱重量同時測定装置(島津製作所社製,DTG-60)を用い、流入ガスを窒素として、ガス流入速度100ml/min、昇温速度20℃/minで、40℃から550℃まで昇温させて熱重量測定を行った(JIS K7120「プラスチックの熱重量測定方法」に準拠)。同様にして、流入ガスを空気として、熱重量測定を行った。得られた熱重量曲線に基づいて、温度100℃での質量に対して質量が5%減少する温度(5%質量減少温度)を求めた。そして、流入ガスが窒素のときの5%質量減少温度と、流入ガスが空気のときの5%質量減少温度との差を算出した。結果を表1に示す。
実施例および比較例で使用した基材の添加樹脂について、フーリエ変換赤外分光光度計(パーキンエルマー社製,Spectrum One)を用いて、ATR法によって吸収スペクトルを測定し、炭酸ガスレーザの波長(10.6μm)における吸収ピークの有無を調べた。結果を表1に示す。
実施例および比較例で得られた粘着シートを貫通孔の部分で切断し、デジタル顕微鏡(キーエンス社製,VHX-200)を使用して、貫通孔の基材表面の直径、基材と粘着剤層との界面の直径および粘着面の直径を測定した。また、100cm2あたりの貫通している孔の数を数えた。結果を表2に示す。
実施例および比較例で得られた粘着シートについて、以下のようにして外観検査を行った。結果を表3に示す。
実施例および比較例で得られた粘着シートについて、以下のようにして耐ガソリン性試験を行った。結果を表3に示す。
実施例および比較例で得られた粘着シートについて、以下のようにして空気溜まり消失性試験を行った。結果を表3に示す。
実施例および比較例で得られた粘着シートについて、以下のようにして空気溜まり消失性試験を行った。結果を表3に示す。
Claims (7)
- 基材と粘着剤層とを備え、一方の面から他方の面に貫通する貫通孔が複数形成されている粘着シートであって、
前記基材は、
ポリオレフィン系樹脂(A)50~85質量%と、
流入ガスが窒素である場合に昇温速度20℃/minで熱重量測定を行ったときの5%質量減少温度と、流入ガスが空気である場合に昇温速度20℃/minで熱重量測定を行ったときの5%質量減少温度との差が60℃以下である樹脂(B)15~50質量%と
を含有する樹脂組成物からなることを特徴とする粘着シート。 - 前記樹脂(B)は、炭酸ガスレーザの波長に吸収ピークを有することを特徴とする請求項1に記載の粘着シート。
- 前記樹脂(B)は、スチレン系樹脂、ポリエステル系樹脂およびアクリル系樹脂からなる群から選ばれる少なくとも1種であることを特徴とする請求項1または2に記載の粘着シート。
- 前記ポリオレフィン系樹脂(A)は、繰り返し単位として極性を有するモノマーを含む共重合体であること特徴とする請求項1~3のいずれかに記載の粘着シート。
- 前記貫通孔は、レーザ熱加工で形成されていることを特徴とする請求項1~4に記載の粘着シート。
- 前記レーザ熱加工で使用するレーザが炭酸ガスレーザであることを特徴とする請求項5に記載の粘着シート。
- 前記基材の表面における前記貫通孔の孔径は、前記粘着剤層の粘着面における前記貫通孔の孔径よりも小さくなっていることを特徴とする請求項1~6のいずれかに記載の粘着シート。
Priority Applications (5)
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JP2010505635A JP5663302B2 (ja) | 2008-03-26 | 2009-03-23 | 粘着シート |
US12/933,601 US20110039065A1 (en) | 2008-03-26 | 2009-03-23 | Pressure-sensitive adhesive sheet |
CN200980114555.6A CN102015941B (zh) | 2008-03-26 | 2009-03-23 | 粘接片 |
EP09723921A EP2267091A1 (en) | 2008-03-26 | 2009-03-23 | Adhesive sheet |
CA2719210A CA2719210A1 (en) | 2008-03-26 | 2009-03-23 | Pressure-sensitive adhesive sheet |
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JP2008-080538 | 2008-03-26 | ||
JP2008080538 | 2008-03-26 |
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PCT/JP2009/055682 WO2009119515A1 (ja) | 2008-03-26 | 2009-03-23 | 粘着シート |
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US (1) | US20110039065A1 (ja) |
EP (1) | EP2267091A1 (ja) |
JP (1) | JP5663302B2 (ja) |
CN (1) | CN102015941B (ja) |
CA (1) | CA2719210A1 (ja) |
WO (1) | WO2009119515A1 (ja) |
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WO2011010507A1 (ja) * | 2009-07-23 | 2011-01-27 | 株式会社ニトムズ | 粘着シート |
JP2012126823A (ja) * | 2010-12-15 | 2012-07-05 | Lintec Corp | 粘着シート |
JP2013043822A (ja) * | 2011-08-26 | 2013-03-04 | Kwansei Gakuin | 半導体ウエハの製造方法及び半導体ウエハ |
EP2590207A1 (en) * | 2010-09-13 | 2013-05-08 | Sumitomo Bakelite Company Limited | Dicing film |
JP2014034619A (ja) * | 2012-08-08 | 2014-02-24 | C I Kasei Co Ltd | 太陽電池セル固定用粘着テープ |
JP2014034648A (ja) * | 2012-08-09 | 2014-02-24 | C I Kasei Co Ltd | 太陽電池セル固定用テープ |
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JP5674570B2 (ja) * | 2011-06-29 | 2015-02-25 | 日東電工株式会社 | 粘着テープ用支持体及び粘着テープ |
CN105408105B (zh) * | 2013-08-01 | 2017-08-25 | 琳得科株式会社 | 保护膜形成用复合片 |
KR102646045B1 (ko) * | 2017-08-25 | 2024-03-11 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 무손상 제거가 가능한 접착 물품 |
DE102018216865A1 (de) * | 2018-10-01 | 2020-04-02 | Tesa Se | Verwendung einer verdickten alkoholischen Zusammensetzung zur vertikalen, blasenfreien Verklebung von Substraten sowie Verfahren zur vertikalen Fügung zweier Substrate |
GB2624648A (en) * | 2022-11-23 | 2024-05-29 | Spandex Ltd | Protective film assembly |
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EP2590207A1 (en) * | 2010-09-13 | 2013-05-08 | Sumitomo Bakelite Company Limited | Dicing film |
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JP2014034648A (ja) * | 2012-08-09 | 2014-02-24 | C I Kasei Co Ltd | 太陽電池セル固定用テープ |
Also Published As
Publication number | Publication date |
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JPWO2009119515A1 (ja) | 2011-07-21 |
EP2267091A1 (en) | 2010-12-29 |
JP5663302B2 (ja) | 2015-02-04 |
CA2719210A1 (en) | 2009-10-01 |
US20110039065A1 (en) | 2011-02-17 |
CN102015941B (zh) | 2014-01-01 |
CN102015941A (zh) | 2011-04-13 |
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