WO2009118855A1 - Guide de support, unité de support, appareil de test de composant électronique et procédé de commande de température de support - Google Patents

Guide de support, unité de support, appareil de test de composant électronique et procédé de commande de température de support Download PDF

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Publication number
WO2009118855A1
WO2009118855A1 PCT/JP2008/055843 JP2008055843W WO2009118855A1 WO 2009118855 A1 WO2009118855 A1 WO 2009118855A1 JP 2008055843 W JP2008055843 W JP 2008055843W WO 2009118855 A1 WO2009118855 A1 WO 2009118855A1
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WO
WIPO (PCT)
Prior art keywords
socket
flow path
unit
fluid
guide
Prior art date
Application number
PCT/JP2008/055843
Other languages
English (en)
Japanese (ja)
Inventor
有朋 菊池
光男 石川
Original Assignee
株式会社アドバンテスト
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社アドバンテスト filed Critical 株式会社アドバンテスト
Priority to JP2009506845A priority Critical patent/JP5161870B2/ja
Priority to PCT/JP2008/055843 priority patent/WO2009118855A1/fr
Priority to TW098104917A priority patent/TW200950686A/zh
Publication of WO2009118855A1 publication Critical patent/WO2009118855A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0458—Details related to environmental aspects, e.g. temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Definitions

  • the present invention relates to a socket guide provided on a test head of an electronic component testing apparatus, a socket unit, an electronic component testing apparatus equipped with them, and a socket temperature control method.
  • an electronic component testing apparatus In the manufacturing process of electronic components such as IC devices, an electronic component testing apparatus is used to test the performance and functions of the finally manufactured electronic components.
  • the electronic component test apparatus generally includes a tester body, a handler, and a test head, and a socket on which a device under test is mounted is provided on the test head.
  • a test signal is supplied from the tester main body to the test head with the IC device mounted in the socket, the test signal is applied from the socket to the IC device, and a response signal read from the IC device is received.
  • the test head By sending the test head to the tester body, the electrical characteristics of the IC device are measured.
  • the IC device is often tested by applying high or low temperature heat stress.
  • a method of applying thermal stress to the IC device for example, there is a method of heating or cooling the IC device in advance before transporting it to the test head.
  • the IC device under test is heated or cooled in advance, and the socket in which the IC device under test is mounted is also heated or cooled. If there is a temperature difference between the IC device under test and the socket, heat transfer occurs between the IC device under test and the socket when the IC device under test is attached to the socket, and the IC device was supplied with the IC device under test. This is because thermal stress may be relieved.
  • Patent Document 1 As a method of heating the IC socket, as shown in Patent Document 1, a method of heating a socket guide in contact with the socket with a heater and a method of flowing heated gas into the socket as shown in Patent Document 2 There is. JP-A-11-271389 JP 2002-236140 A
  • the material of the socket body is usually a plastic resin having low thermal conductivity
  • the socket cannot be efficiently heated only by heating the socket guide with a heater as in Patent Document 1, and the socket It was difficult to bring the temperature to the desired temperature.
  • the present invention has been made in view of such a situation, and an object thereof is to provide a socket guide, a socket unit, an electronic component testing apparatus, and a temperature control method capable of efficiently controlling a socket to a desired temperature.
  • the present invention is provided adjacent to a socket having a connection terminal capable of contacting an external terminal of an electronic device under test, and the electronic device under test is provided at a predetermined position of the socket.
  • a socket guide characterized in that a flow path is formed (Invention 1).
  • the fluid may be a gas such as air or a liquid such as water.
  • the socket guide is heated or cooled to a desired temperature by a heat source. Since the socket guide is adjacent to the socket, the socket is also heated or cooled by heat conduction from the heated or cooled socket guide. Second, when the fluid passes through the flow path of the socket guide heated or cooled by the heat source, the fluid is also heated or cooled, and the fluid is supplied to the socket. Because the socket guide is adjacent to the socket, the heated or cooled fluid is supplied to the socket at its original temperature, thereby heating or cooling the socket to the desired temperature.
  • a socket can be efficiently controlled to desired temperature.
  • the fluid is heated or cooled by the socket guide, it is not necessary to adjust the temperature of the fluid before being supplied to the socket guide in advance, and a heat source different from the heat source of the socket guide is not necessary.
  • the provision of the other heat source is also included in the scope of the present invention.
  • one end of the said flow path becomes a fluid inlet, and the other end of the said flow path becomes a fluid outlet opened with respect to the said socket (invention 2).
  • an introduction path for introducing the fluid from the outside into the socket and a discharge path for discharging the fluid from the socket to the outside may be formed as the flow path (Invention). 3).
  • the flow path meanders so that the fluid passing through the flow path has a desired temperature by the heat source (Invention 4).
  • the present invention provides a socket unit comprising a socket having a connection terminal that can come into contact with an external terminal of an electronic device under test, and the socket guide (inventions 1 to 4). Invention 5).
  • the socket includes a connection terminal and a socket body that holds the connection terminal.
  • the socket body communicates with a flow path of the socket guide, and the fluid is supplied to the socket body.
  • a flow path that can be supplied to the connection terminal may be formed (invention 6).
  • the socket includes a floating member that positions and supports the electronic component under test and through which the connection terminal slidably penetrates, and is formed in the socket body. One end of the flow path may be opened toward the gap between the socket body and the floating member (Invention 7).
  • the present invention includes the socket guide (inventions 1 to 4) provided on the test head, and a fluid supply device capable of supplying a fluid to the flow path of the socket guide.
  • An electronic component testing apparatus is provided (Invention 8).
  • the present invention includes the socket unit (inventions 5 to 7) provided on the test head, and a fluid supply device capable of supplying a fluid to the flow path of the socket guide in the socket unit.
  • An electronic component testing apparatus characterized by the above is provided (Invention 9).
  • the fluid supply device may not include a heat source (Invention 10).
  • the present invention is a temperature control method for a socket having a connection terminal that can come into contact with an external terminal of an electronic device under test, using the socket guide (Invention 1 to 4),
  • a temperature control method for a socket characterized in that a fluid is supplied to a passage (Invention 11).
  • the present invention provides a temperature control method for a socket having a connection terminal that can come into contact with an external terminal of an electronic device under test, using the socket unit (invention 5 to 7), and Provided is a temperature control method for a socket, characterized in that a fluid is supplied to a flow path of the socket guide (Invention 12).
  • the socket can be efficiently controlled to a desired temperature. Further, the fluid supply device that supplies fluid to the socket guide does not need to include a heat source different from the heat source of the socket guide.
  • FIG. 1 is a plan view of an electronic component test apparatus according to an embodiment of the present invention.
  • FIG. 2 is a side partial cross-sectional view (II cross-sectional view in FIG. 1) of the electronic component test apparatus according to the same embodiment. It is a plane sectional view of the socket unit in the electronic parts testing device. It is side surface sectional drawing of the socket unit in the same electronic component test apparatus.
  • FIG. 1 is a plan view of a handler according to an embodiment of the present invention
  • FIG. 2 is a side partial sectional view of the handler according to the embodiment (II sectional view in FIG. 1)
  • FIG. FIG. 4 is a side sectional view of the socket unit in the electronic component testing apparatus.
  • the form of the IC device under test shown in FIG. 4 is, for example, a BGA package or a CSP (Chip Size Package) package having solder balls as external terminals, but the present invention is not limited to this.
  • a QFP (Quad Flat Package) package or a SOP (Small Outline Package) package having lead pins as external terminals may be used.
  • the electronic component testing apparatus 1 in this embodiment includes a handler 10, a test head 300, and a tester 20, and the test head 300 and the tester 20 are connected via a cable 21.
  • the pre-test IC device on the supply tray stored in the supply tray stocker 401 of the handler 10 is conveyed and pressed against the socket 80 of the contact portion 301 of the test head 300, and the test head 300 and the cable 21 are passed through this IC device.
  • the IC device test is executed, the IC device for which the test has been completed is mounted on the classification tray stored in the classification tray stocker 402 according to the test result.
  • the handler 10 mainly includes a test unit 30, an IC device storage unit 40, a loader unit 50, and an unloader unit 60.
  • the IC device storage unit 40 is a part that stores IC devices before and after the test, and mainly includes a supply tray stocker 401, a classification tray stocker 402, an empty tray stocker 403, and a tray transport device 404. Consists of
  • the supply tray stocker 401 a plurality of supply trays loaded with a plurality of IC devices before the test are stacked and stored.
  • a stocker 401 is provided.
  • the classification tray stocker 402 is loaded with a plurality of classification trays loaded with a plurality of IC devices after the test. In this embodiment, as shown in FIG. Is provided. By providing these four classification tray stockers 402, the IC devices can be sorted and stored in a maximum of four classifications according to the test results.
  • the empty tray stocker 403 stores empty trays after all the pre-test IC devices 20 mounted on the supply tray stocker 401 have been supplied to the test unit 30.
  • the number of stockers 401 to 403 can be appropriately set as necessary.
  • the tray transfer device 404 is a transfer device that can move in the X-axis and Z-axis directions in FIG. 1, and mainly includes an X-axis direction rail 404a, a movable head 404b, and four suction pads 404c.
  • a range including the supply tray stocker 401, a part of the sorting tray stocker 402, and the empty tray stocker 403 is defined as an operation range.
  • an X-axis direction rail 404a fixed on the base 12 of the handler 10 supports the movable head unit 404b in a cantilevered manner so as to be movable in the X-axis direction.
  • the Z-axis direction actuator not to be used and four suction pads 404c are provided at the tip.
  • the tray transport device 404 sucks and holds the empty tray emptied by the supply tray stocker 401 by the suction pad 404c, lifts it by the Z-axis direction actuator, and slides the movable head portion 404b on the X-axis direction rail 404a. By moving it, it is transferred to the empty tray stocker 401.
  • the empty tray is sucked and held from the empty tray stocker 403, and is lifted by the Z-axis direction actuator.
  • the movable head unit 404b is slid on the rail 404a to be transferred to the sorting tray stocker 402.
  • the loader unit 50 is a part that supplies the IC device before the test from the supply tray stocker 401 of the IC device storage unit 40 to the test unit 30, and mainly includes a loader unit transport device 501 and two loader buffer units 502 ( In FIG. 1, it is composed of two in the negative X-axis direction) and a heat plate 503.
  • the loader unit transport device 501 moves the IC device on the supply tray of the supply tray stocker 401 of the IC device storage unit 40 onto the heat plate 503, and moves the IC device on the heat plate 503 onto the loader buffer unit 502.
  • This is a device to be moved, and mainly comprises a Y-axis direction rail 501a, an X-axis direction rail 501b, a movable head part 501c, and a suction part 501d.
  • the loader unit transport device 501 has an operation range including a supply tray stocker 401, a heat plate 503, and two loader buffer units 502.
  • the two Y-axis direction rails 501a of the loader unit transport device 501 are fixed on the base 12 of the handler 10, and the X-axis direction rail 502b slides in the Y-axis direction between them. It is supported movably.
  • the X-axis direction rail 502b supports a movable head portion 501c having a Z-axis direction actuator (not shown) so as to be slidable in the X-axis direction.
  • the movable head portion 501c includes four suction portions 501d each having a suction pad 501e at the lower end, and the four suction portions 501d are independent of each other by driving the Z-axis direction actuator. Thus, it can be moved up and down in the Z-axis direction.
  • Each suction portion 501d is connected to a negative pressure source (not shown), and can suck and hold an IC device by sucking air from the suction pad 501e to generate a negative pressure.
  • the IC device can be released by stopping the suction of air from the pad 501e.
  • the heat plate 503 is a heating source for applying a predetermined thermal stress to the IC device.
  • the heat plate 503 is a metal heat transfer plate having a heat generation source (not shown) at the bottom.
  • a plurality of recesses 503a for dropping an IC device are formed.
  • a cooling source may be provided instead of the heating source.
  • the loader buffer unit 502 is a device that reciprocates the IC device between the operation range of the loader unit transport device 501 and the operation range of the test unit transport device 310, and mainly includes a buffer stage 502a and an X-axis direction actuator. 502b.
  • a buffer stage 502a is supported at one end of an X-axis direction actuator 502b fixed on the base 12 of the handler 10, and an IC device is dropped onto the upper surface side of the buffer stage 502a as shown in FIG.
  • Four recesses 502c having a rectangular shape in plan view are formed.
  • the IC device before the test is moved from the supply tray stocker 401 to the heat plate 503 by the loader unit conveyance device 501 and heated to a predetermined temperature by the heat plate 503, and then again loaded by the loader unit conveyance device 501 by the loader buffer.
  • the loader buffer unit 502 introduces the data into the test unit 30.
  • the test unit 30 is a part that performs a test by bringing the external terminal (solder ball) of the IC device 2 under test into electrical contact with the contact pin 82 of the socket 80 of the contact unit 301.
  • the test unit 30 mainly includes a test unit transport device 310.
  • the test unit transport device 310 is a device that moves the IC device between the loader buffer unit 502 and the unloader buffer unit 602 and the test head 300.
  • the test section transport device 310 supports two X-axis direction support members 311a slidable in the Y-axis direction on two Y-axis direction rails 311 fixed on the base 12 of the handler 10.
  • a movable head portion 312 is supported at the central portion of each X-axis direction support member 311a, and the movable head portion 312 includes a loader buffer portion 502, an unloader buffer portion 602, and a test head 300. Is the operating range. Note that the movable head unit 312 supported by each of the two X-axis direction support members 311a operating simultaneously on the pair of Y-axis direction rails 311 is controlled so that the mutual operations do not interfere with each other.
  • Each movable head portion 312 includes four contact arms 315 at the lower portion thereof.
  • the four contact arms 315 are provided corresponding to the arrangement of the sockets 80, and as shown in FIG. 2, a suction portion 317 is provided at the lower end of each contact arm 315.
  • Each suction part 317 is connected to a negative pressure source (not shown), and can suck and hold an IC device by sucking air from the suction part 317 to generate a negative pressure. By stopping the suction of air from the portion 317, the IC device can be released.
  • the four IC devices 2 held by the contact arm 315 can be moved in the Y-axis direction and the Z-axis direction and pressed against the contact unit 301 of the test head 300.
  • the contact portion 301 of the test head 300 includes four sockets 80, and the four sockets 80 are substantially arranged in the arrangement of the contact arms 315 of the movable head portion 312 of the test unit conveyance device 310. Arranged so that they match. Details of the socket unit 70 including the socket 80 will be described later.
  • an opening 11 is formed in the base 12 of the handler 10, and the contact portion 301 of the test head 300 protrudes from the opening 11 and the IC device is pressed against it. It is supposed to be.
  • the four pre-test IC devices placed on the loader buffer unit 502 are moved to the contact unit 301 of the test head 300 by the test unit transport device 310 and simultaneously subjected to the test, and then the test unit again.
  • the unloader buffer unit 602 moves to the unloader buffer unit 602 and the unloader buffer unit 602 discharges the unloader unit 60 to the unloader unit 60.
  • the unloader unit 60 is a part for discharging the tested IC device from the test unit 30 to the IC device storage unit 40.
  • the unloader unit 60 mainly includes an unloader unit transport device 601 and two unloader buffer units 602 (in FIG. Two directions).
  • the unloader buffer unit 602 is a device that reciprocates the operating range of the test unit transport apparatus 310 and the IC device between the operation range of the unloader unit transport apparatus 601, and mainly includes a buffer stage 602a and an X-axis direction actuator 602b. It consists of and.
  • a buffer stage 602a is supported at one end of an X-axis direction actuator 602b fixed on the base 12 of the handler 10, and four recesses 602c for dropping an IC device are provided on the upper surface side of the buffer stage 602a. Is formed.
  • the unloader unit conveying device 601 is a device that moves and mounts the IC device on the unloader buffer unit 602 to the classification tray of the classification tray stocker 402, and mainly includes a Y-axis direction rail 601a, an X-axis direction rail 601b, and the like.
  • the movable head portion 601c and the suction portion 601d are configured.
  • the unloader transport device 601 has an operation range that includes two unloader buffers 602 and a sorting tray stocker 402.
  • the two Y-axis direction rails 601a of the unloader unit conveying device 601 are fixed on the base 12 of the handler 10, and the X-axis direction rail 602b slides in the Y-axis direction between them. It is supported movably.
  • the X-axis direction rail 602b supports a movable head portion 601c having a Z-axis direction actuator (not shown) so as to be slidable in the X-axis direction.
  • the movable head portion 601c includes four suction portions 601d each having a suction pad at the lower end portion, and the four suction portions 601d are independently raised and lowered in the Z-axis direction by driving the Z-axis direction actuator. be able to.
  • the IC device after the test placed on the unloader buffer unit 602 is ejected from the test unit 30 to the unloader unit 60, and the unloader unit transport device 601 extracts the classification tray of the classification tray stocker 402 from the unloader buffer unit 602. Mounted on.
  • the socket unit 70 in this embodiment will be described in detail.
  • the socket unit 70 shown in FIGS. 3 and 4 is provided in the contact portion 301 of the test head 300 shown in FIG. 2, and includes a socket 80 and a socket guide 90 that contacts the socket 80.
  • the socket 80 includes a plurality of contact pins 82, a socket body 81 that supports the contact pins 82, and a floating plate 83 provided on the socket body 81.
  • the socket body 81 has a concave portion at the center and a convex portion around the socket body 81, and the plurality of contact pins 82 are arranged so as to substantially match the arrangement of the solder balls of the IC device 2. It is provided in the recess.
  • the floating plate 83 is positioned in a floating state in the recess of the socket main body 81 by an elastic member (not shown), and the floating plate 83 is provided with a plurality of holes through which the contact pins 82 can slide.
  • the floating plate 83 positions and supports the IC device 2 at a predetermined position, and prevents the contact pin 82 from falling down. As shown in FIG. 4, a gap exists between the upper surface of the concave portion of the socket body 81 and the bottom surface of the floating plate 83, and the base portion of the contact pin 82 exists in the gap.
  • the socket body 81 is formed with an air flow path (air flow path) 84 that is a fluid. As shown in FIG. 4, one end of the air flow path 84 is opened at the upper surface of the convex portion of the socket body 81, and this one end is an air inlet 841. The other end of the air flow path 84 opens toward the gap between the upper surface of the concave portion of the socket body 81 and the bottom surface of the floating plate 83, and the other end serves as an air outlet 842.
  • air flow path air flow path
  • the socket guide 90 guides the contact arm 315 that holds the IC device 2 under test so that the IC device 2 under test is mounted at a predetermined position of the socket 80, as shown in FIGS. 3 and 4.
  • a socket guide main body 91 provided so as to surround the socket 80 and a heat source section 93 that contacts the socket guide main body 91 and can heat or cool the socket guide main body 91 are provided.
  • the central portion of the socket guide main body 91 is a rectangular opening, and the contact pin 82 of the socket 80 is exposed in this opening.
  • the socket guide body 91 is preferably made of a material having good thermal conductivity, for example, a metal such as an aluminum alloy. As shown in FIG. 4, the socket guide 90 is in contact with the upper surface of the convex portion of the socket body 81 at the lower surface near the opening of the socket guide body 91.
  • an air introduction path 92a for introducing air from the outside to the socket 80 and an air discharge path 92b for discharging air from the socket 80 to the outside are formed as a flow path of air that is a fluid. .
  • One end of the air introduction path 92 a is opened at the outer peripheral edge of the socket guide main body 91, and this one end is an air inlet 921.
  • a pipe connected to an air supply device (not shown) is connected to the air inlet 921.
  • the other end of the air introduction path 92 a opens at the lower surface near the opening of the socket guide body 91, and the other end serves as an air outlet 922.
  • the air outlet 922 of the air introduction path 92a formed in the socket guide body 91 is formed at a position corresponding to the air inlet 841 of the air flow path 84 formed in the socket body 81, whereby the socket guide body
  • the air introduction path 92 a 91 and the air flow path 84 of the socket main body 81 communicate with each other.
  • two air introduction paths 92a are formed across the opening of the socket guide body 91, each meandering as shown in FIG.
  • the length of the air introduction path 92a can be made about 2 to 10 times longer than when the air introduction path 92a is made straight.
  • One end of the air discharge path 92b opens at the inner peripheral edge of the socket guide main body 91, and this one end is an air inlet 923.
  • the other end of the air discharge path 92 b opens at the outer peripheral edge of the socket guide main body 91, and the other end serves as an air outlet 924.
  • two air discharge passages 92b are formed across the opening of the socket guide main body 91, and each has a linear shape as shown in FIG.
  • the air inlet 923 of the air discharge path 92b and the air outlet 922 of the air introduction path 92a are located at or near the side adjacent to the opening of the socket guide body 91, respectively.
  • Air is supplied from an air supply device (not shown) to the air inlet 921 of the air introduction path 92a through a pipe.
  • the air supply device in the present embodiment does not include a heat source for heating or cooling the air, and supplies room temperature air.
  • the heat source unit 93 includes, for example, a heater and a Peltier element, and may further include a temperature sensor as desired. Although the heat source part 93 in this embodiment is attached to the upper surface side part of the socket guide main body 91 as shown in FIG. 4, it is not limited to this.
  • a method for controlling the temperature of the socket 80 in the socket unit 70 will be described.
  • the temperature of the socket 80 is controlled to a high temperature.
  • the heat source unit 93 heats the socket guide body 91 to a desired temperature. Since the socket guide body 91 and the socket body 81 are in contact with each other, when the socket guide body 91 is heated, the socket body 81 and the contacts provided on the socket body 81 by heat conduction from the socket guide body 91 are provided. The pin 82 is also heated. However, since the socket body 81 is usually made of a plastic resin having low thermal conductivity, it may not be heated to a desired temperature by itself.
  • the air supplied from the air supply device flows into the air inlet 921 of the air introduction path 92a of the socket guide body 91, and reaches the air outlet 922 through the meandering air introduction path 92a. Since the socket guide main body 91 is heated by the heat source section 93, the air passing through the air introduction path 92a is also heated. In particular, the air introduction path 92a meanders and the staying time of the air in the socket guide body 91 becomes long, so that the air is sufficiently heated.
  • the air heated by the socket guide main body 91 flows from the air outlet 922 of the air introduction path 92 a of the socket guide main body 91 into the air inlet 841 of the air flow path 84 of the socket main body 81, and passes through the air flow path 84. It flows out from the outlet 842.
  • the air heated by the socket guide main body 91 heated air
  • the air outlet 842 of the air flow path 84 of the socket main body 81 the flow of the heated air is halfway through the flow path. There is almost no risk of temperature drop.
  • the heated air flowing out from the air outlet 842 of the air flow path 84 of the socket body 81 flows into the gap between the upper surface of the concave portion of the socket body 81 and the bottom surface of the floating plate 83 to heat the socket body 81 and the floating plate 83. Then, the base of the contact pin 82 existing in the gap is heated. The heated air passes through the gap between the contact pin 82 and the hole of the floating plate 83 and escapes to the upper side of the floating plate 83. At this time, the heated air heats the entire contact pin 82. In this way, the socket 80 is heated to a desired temperature (the same temperature as the IC device 2).
  • the heated air that has escaped to the upper side of the floating plate 83 sprays onto the IC device 2 and then opens to the inner peripheral edge of the socket guide body 91. It flows into the air inlet 923 of 92b, is discharged
  • the air discharged from the air outlet 924 may be returned to the air supply device via a pipe and circulated.
  • the socket 80 can be efficiently controlled to a desired temperature as described above. Further, the air supplied to the socket 80 is sufficiently heated by the socket guide 90 adjacent to the socket 80 and does not cool down until reaching the socket 80, so the air supply device does not need to include a heat source such as an air heater.
  • the loader unit conveyance device 501 sucks four IC devices on the supply tray located at the uppermost stage of the supply tray stocker 401 of the IC device storage unit 40 by the suction pads 501e of the four suction units 501d. Hold.
  • the loader unit transport device 501 raises the four IC devices by the Z-axis direction actuator of the movable head unit 501c while holding the four IC devices, and slides the X-axis direction rail 501b on the Y-axis direction rail 501a.
  • the movable head unit 501c is slid on the X-axis direction rail 501b and moved to the loader unit 50.
  • the loader unit transport device 501 performs positioning above the recess 503a of the heat plate 503, extends the Z-axis direction actuator of the movable head unit 501c, releases the suction pad 501e, and places the IC device in the recess of the heat plate 503. Drop into 503a.
  • the loader unit transfer device 501 holds the four IC devices that have been heated again, and moves above one of the loader buffer units 502 that is on standby. To do.
  • the loader unit transport device 501 performs positioning above the buffer stage 502a of one waiting loader buffer unit 502, extends the Z-axis direction actuator of the movable head unit 501c, and the suction pad 501e of the suction unit 501d
  • the IC device held by suction is released, and the IC device 2 is placed in the recess 502c of the buffer stage 502a.
  • the loader buffer unit 502 extends the X-axis direction actuator 502b while the four IC devices are mounted in the recess 502c of the buffer stage 502a, and tests the test unit 30 from the operating range of the loader unit transport device 501 of the loader unit 50.
  • the four IC devices are moved to the operation range of the partial transfer device 310.
  • the movable head unit 312 of the test unit transport apparatus 310 is mounted on the recess 502c of the buffer stage 502a. Move to the IC device. Then, the Z-axis direction actuator of the movable head unit 312 extends, and the four IC devices positioned in the concave portion 502c of the buffer stage 502a of the loader buffer unit 502 by the suction units 317 of the four contact arms 315 of the movable head unit 312. Adsorb and hold.
  • the movable head unit 312 holding the four IC devices is raised by the Z-axis direction actuator of the movable head unit 312.
  • test unit conveyance device 310 slides the X-axis direction support member 311 a that supports the movable head unit 312 on the Y-axis direction rail 311, and holds it by the suction unit 317 of the contact arm 315 of the movable head unit 312.
  • the four IC devices are conveyed above the four sockets 80 in the contact portion 301 of the test head 300.
  • the movable head unit 312 extends the Z-axis direction actuator.
  • the contact arm 315 holding the IC device 2 attaches the IC device 2 to the socket 80 while being guided by the socket guide 90, and brings the external terminal of the IC device 2 into contact with the contact pin 82 (see FIG. 4). ).
  • electrical signals are transmitted / received via the contact pins 82, and the IC device 2 is tested.
  • the socket 80 is heated to a desired temperature, there is no possibility that the temperature of the IC device 2 is lowered due to the mounting on the socket 80. Therefore, the IC device 2 is heated to a desired temperature. The test can be performed in a stressed state.
  • the test unit transport apparatus 310 raises the IC device after the test by contraction of the Z-axis direction actuator of the movable head unit 312 and supports the movable head unit 312 in the X-axis direction supporting member.
  • One unloader that stands by within the operating range of the test unit transporting device 310 by sliding the 311a on the Y-axis direction rail 311 and holding the four IC devices held by the contact arm 315 of the movable head unit 312 It is conveyed above the buffer stage 602a of the buffer unit 602.
  • the movable head unit 312 extends the Z-axis direction actuator and releases the suction pad 317c to drop the four IC devices into the recess 602c of the buffer stage 602a.
  • the unloader buffer unit 602 drives the X-axis actuator 602b while mounting the four IC devices after the test, and from the operating range of the test unit transport device 310 of the test unit 30, the unloader unit transport device 601 of the unloader unit 60.
  • the IC device is moved to the operation range.
  • the Z-axis direction actuator of the movable head unit 601c of the unloader unit transport device 601 located above the unloader buffer unit 602 is extended, and the four suction units 601d of the movable head unit 601c are used to expand the unloader buffer unit 602.
  • the four IC devices after the test located in the recess 602c of the buffer stage 602a are sucked and held.
  • the unloader unit transport device 601 lifts the four IC devices by the Z-axis direction actuator of the movable head unit 601c while holding the four IC devices after the test, and slides the X-axis direction rail 601b on the Y-axis direction rail 601a.
  • the movable head unit 601c is slid on the X-axis direction rail 601b and moved onto the classification tray stocker 402 of the IC device storage unit 40. Then, according to the test result of each IC device, each IC device is mounted on the classification tray located at the uppermost stage of each classification tray stocker 402. As described above, the IC device is tested once.
  • the air discharge path 92b of the socket guide main body 91 may be omitted.
  • the air flow path 84 of the socket body 81 may be omitted, and the heated air that has flowed out from the air introduction path 92a of the socket guide body 91 may be directly sprayed onto the contact pins 82 of the socket 80.
  • the socket 80 may not include the floating plate 83.
  • the present invention is useful for an electronic component test apparatus that performs a test by applying a high or low temperature thermal stress to the electronic component.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)

Abstract

L'invention concerne un guide de support (90) qui comprend un corps principal (91) de guide de support en contact avec un support (80) et avec une partie de source de chaleur (93) pouvant chauffer ou refroidir le corps principal (91) du guide de support. Dans le corps principal (91) du guide de support, des canaux d'introduction d'air (92a) permettant d'introduire de l'air dans le support (80) en provenance de l'extérieur et un canal d'évacuation d’air (92b) permettant d'éjecter l’air à l'extérieur du support (80) sont formés comme passages d'air. Le support (80) comprend une pluralité de broches de contact (82), un corps principal (81) de support permettant de supporter les broches de contact (82), ainsi qu'une plaque flottante (83) utilisée au-dessus du corps principal (81) du support. Dans le corps principal (81) de support, sont formés des passages d'air (84) qui communiquent avec les canaux d'introduction d'air (92a) formés dans le corps principal (91) du guide de support.
PCT/JP2008/055843 2008-03-27 2008-03-27 Guide de support, unité de support, appareil de test de composant électronique et procédé de commande de température de support WO2009118855A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009506845A JP5161870B2 (ja) 2008-03-27 2008-03-27 ソケットガイド、ソケットユニット、電子部品試験装置およびソケットの温度制御方法
PCT/JP2008/055843 WO2009118855A1 (fr) 2008-03-27 2008-03-27 Guide de support, unité de support, appareil de test de composant électronique et procédé de commande de température de support
TW098104917A TW200950686A (en) 2008-03-27 2009-02-17 Socket guide, socket unit, electronic component test apparatus, and method of controlling socket temperature

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2008/055843 WO2009118855A1 (fr) 2008-03-27 2008-03-27 Guide de support, unité de support, appareil de test de composant électronique et procédé de commande de température de support

Publications (1)

Publication Number Publication Date
WO2009118855A1 true WO2009118855A1 (fr) 2009-10-01

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PCT/JP2008/055843 WO2009118855A1 (fr) 2008-03-27 2008-03-27 Guide de support, unité de support, appareil de test de composant électronique et procédé de commande de température de support

Country Status (3)

Country Link
JP (1) JP5161870B2 (fr)
TW (1) TW200950686A (fr)
WO (1) WO2009118855A1 (fr)

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JPWO2013051099A1 (ja) * 2011-10-04 2015-03-30 富士通株式会社 試験用治具及び半導体装置の試験方法
CN106185301A (zh) * 2014-09-30 2016-12-07 精工爱普生株式会社 电子部件输送装置以及电子部件检查装置
CN106185259A (zh) * 2014-09-30 2016-12-07 精工爱普生株式会社 电子部件输送装置以及电子部件检查装置
JP2018087790A (ja) * 2016-11-30 2018-06-07 三菱電機株式会社 半導体デバイスの位置決め加圧機構
EP3527994A1 (fr) * 2018-02-20 2019-08-21 Rasco GmbH Douille de contacteur et appareil de test de circuit intégré
IT201800007609A1 (it) * 2018-07-30 2020-01-30 Microtest Srl Una macchina integrata per condurre test in temperatura su componenti elettronici quali i chip
JP2020144039A (ja) * 2019-03-07 2020-09-10 株式会社東芝 Ｉｃトレイおよびテスト治具
WO2021132488A1 (fr) * 2019-12-25 2021-07-01 株式会社エンプラス Élément de guidage de jet d'air, unité de dispositif de test, dispositif de test, prise pour composant électrique, et dispositif de test ayant une pluralité de prises pour composant électrique
CN114296493A (zh) * 2022-03-11 2022-04-08 杭州长川智能制造有限公司 一种芯片温度调节方法

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KR102133414B1 (ko) * 2014-04-24 2020-07-15 (주)테크윙 전자부품 테스트용 핸들러 및 그 작동방법
JP6361346B2 (ja) * 2014-07-17 2018-07-25 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
JP2016075550A (ja) * 2014-10-06 2016-05-12 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置
TWI600911B (zh) * 2015-08-27 2017-10-01 Seiko Epson Corp Electronic parts conveying apparatus and electronic parts inspection apparatus
US10782316B2 (en) 2017-01-09 2020-09-22 Delta Design, Inc. Socket side thermal system
KR102332664B1 (ko) * 2020-05-14 2021-12-01 주식회사 티에프이 반도체 패키지 테스트 장치 및 반도체 패키지 테스트용 소켓 테스트 장치
KR20220011885A (ko) 2020-07-22 2022-02-03 삼성전자주식회사 테스트 핸들러 및 이를 포함하는 반도체 소자 테스트 장치
KR20240027784A (ko) 2021-06-30 2024-03-04 델타 디자인, 인코포레이티드 접촉기 어셈블리를 포함하는 온도 제어 시스템

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JP2000040571A (ja) * 1998-07-23 2000-02-08 Nec Ibaraki Ltd Ｉｃソケット
JP2002236140A (ja) * 2000-12-07 2002-08-23 Advantest Corp 電子部品試験用ソケットおよびこれを用いた電子部品試験装置

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JPH11271389A (ja) * 1998-03-23 1999-10-08 Advantest Corp Ｉｃ試験装置
JP2000040571A (ja) * 1998-07-23 2000-02-08 Nec Ibaraki Ltd Ｉｃソケット
JP2002236140A (ja) * 2000-12-07 2002-08-23 Advantest Corp 電子部品試験用ソケットおよびこれを用いた電子部品試験装置

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2013051099A1 (ja) * 2011-10-04 2015-03-30 富士通株式会社 試験用治具及び半導体装置の試験方法
CN106185301A (zh) * 2014-09-30 2016-12-07 精工爱普生株式会社 电子部件输送装置以及电子部件检查装置
CN106185259A (zh) * 2014-09-30 2016-12-07 精工爱普生株式会社 电子部件输送装置以及电子部件检查装置
JP2018087790A (ja) * 2016-11-30 2018-06-07 三菱電機株式会社 半導体デバイスの位置決め加圧機構
EP3527994A1 (fr) * 2018-02-20 2019-08-21 Rasco GmbH Douille de contacteur et appareil de test de circuit intégré
IT201800007609A1 (it) * 2018-07-30 2020-01-30 Microtest Srl Una macchina integrata per condurre test in temperatura su componenti elettronici quali i chip
WO2020026092A1 (fr) * 2018-07-30 2020-02-06 Microtest S.R.L. Machinerie intégrée pour effectuer des essais dépendant de la température sur des composants électroniques tels que des puces
JP2020144039A (ja) * 2019-03-07 2020-09-10 株式会社東芝 Ｉｃトレイおよびテスト治具
JP7191735B2 (ja) 2019-03-07 2022-12-19 株式会社東芝 テスト治具
WO2021132488A1 (fr) * 2019-12-25 2021-07-01 株式会社エンプラス Élément de guidage de jet d'air, unité de dispositif de test, dispositif de test, prise pour composant électrique, et dispositif de test ayant une pluralité de prises pour composant électrique
CN114296493A (zh) * 2022-03-11 2022-04-08 杭州长川智能制造有限公司 一种芯片温度调节方法
WO2023168893A1 (fr) * 2022-03-11 2023-09-14 杭州长川科技股份有限公司 Procédé de régulation de température de puce

Also Published As

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TWI377005B (fr) 2012-11-11
JPWO2009118855A1 (ja) 2011-07-21
JP5161870B2 (ja) 2013-03-13
TW200950686A (en) 2009-12-01

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