WO2009107324A1 - 切断装置及び切断方法 - Google Patents
切断装置及び切断方法 Download PDFInfo
- Publication number
- WO2009107324A1 WO2009107324A1 PCT/JP2009/000377 JP2009000377W WO2009107324A1 WO 2009107324 A1 WO2009107324 A1 WO 2009107324A1 JP 2009000377 W JP2009000377 W JP 2009000377W WO 2009107324 A1 WO2009107324 A1 WO 2009107324A1
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- WIPO (PCT)
- Prior art keywords
- cutting
- grooves
- groove
- cut
- jig
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/0042—Devices for removing chips
- B23Q11/005—Devices for removing chips by blowing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
Definitions
- the present invention relates to a cutting apparatus and a cutting method used when a plurality of articles each corresponding to a region is manufactured by cutting a workpiece having a plurality of regions provided in a lattice shape. .
- FIG. 7 is a schematic perspective view for explaining a conventional method of cutting an object to be cut.
- a resin encapsulant formed by resin-sealing chip-like elements respectively attached to a plurality of regions of the substrate will be described.
- a plurality of electronic components corresponding to each region are manufactured by cutting the resin sealing body.
- all drawings described below are schematically omitted and exaggerated as appropriate.
- the resin sealing body 1 is a composite material having a substrate 2 made of a lead frame, a printed circuit board such as a glass epoxy substrate, a ceramic substrate, and the like, and a cured resin 3.
- the substrate 2 includes lattice-like boundary lines 4 that are virtually provided, and a plurality of regions 5 that are partitioned by the boundary lines 4.
- Each region 5 is provided with one or a plurality of chip-like elements (semiconductor chips or the like, hereinafter referred to as “chips” as appropriate), and these chips are resin-sealed with a cured resin 3.
- chips chip-like elements
- a cutting device for electronic parts that cuts the resin sealing body 1 is provided with a suction jig 6 that sucks and fixes the resin sealing body 1.
- the suction jig 6 is attached to the base 7.
- the base 7 is movable in the X direction, the Y direction, and the Z direction, and is provided so as to be rotatable in a ⁇ direction that is a rotation direction with the Z direction as an axis.
- the suction jig 6 is provided with a plurality of columnar projections 8 that suck and hold (fix) the plurality of regions 5 of the substrate 2. Further, each protrusion 8 sucks and holds each electronic component (package) formed by cutting the resin sealing body 1 into regions 5 units.
- a recess 9 that is a space for suction and a suction hole 10 provided in the recess 9 are provided.
- the suction hole 10 passes through a projection 8, a suction jig 6, a suction pipe (not shown) provided inside the base 7 and a suction pipe 11 in order, and a suction source such as a vacuum pump or a decompression tank. 12 is connected.
- a groove 13 extending in the X direction and a groove 14 extending in the Y direction are provided between the protrusions 8.
- a cutting mechanism 15 is provided in the vicinity of the suction jig 6 so as to be movable in the Y direction.
- the cutting mechanism 15 is provided with a rotary shaft 16 of a motor (not shown), a rotary blade 17 fixed to the rotary shaft 16, and a cutting water nozzle 18.
- the place where the nozzle 18 for cutting water is provided is the destination side where the cutting mechanism 15 is relatively advanced with respect to the resin sealing body 1, and the peripheral end portion of the rotary blade 17 is the resin sealing body. 1 is near the point to be cut, which is a portion in contact with 1. Further, when the resin sealing body 1 is cut, the peripheral end portion of the rotary blade 17 is accommodated in the groove 13 or the groove 14.
- the rotary blade 17 is aligned in the X, Y, and Z directions with respect to the boundary line 4 along the Y direction to be cut.
- the cutting mechanism 15 is moved in the + Y direction toward the resin sealing body 1.
- the resin sealing body 1 can be completely cut (full cut) along the boundary line 4.
- the base 7 is rotated by 90 ° in the ⁇ direction.
- the resin sealing body 1 is completely cut (full cut) at each of the boundary lines 4 that are newly along the Y direction. Thereby, the resin sealing body 1 can be cut
- the cutting water nozzle 18 discharges the cutting water 19 from the upper side or the diagonally upper side toward the cutting point.
- the cutting water 19 includes a reduction in processing resistance between the rotary blade 17 and the resin sealing body 1 (in other words, lubrication), cooling of the rotary blade 17 and the resin sealing body 1, and removal of generated cutting waste. Play a role.
- the cutting waste adhering to the electronic component causes the first problem of generating a defect in the subsequent process.
- a large amount of resin-based cutting waste generated by cutting the glass epoxy substrate or the like and the cured resin 3 causes contact failure.
- metal-based cutting waste resulting from the copper foil used as the wiring material in the substrate 2 causes a short circuit.
- the cutting waste adhering to the electronic component causes a second problem that the number of man-hours increases because a process of cleaning the electronic component and completely removing the cutting waste is required.
- the problem to be solved by the present invention is that it is difficult to remove cutting waste in a groove provided in a jig of a cutting device.
- a cutting device includes: A jig (6) for fixing a workpiece (1) having a plurality of regions (5) provided in a lattice shape to a fixed surface; A plurality of grooves (13, 14) provided so as to overlap the boundary lines (4) of the plurality of regions (5) on the fixed surface; A rotary blade (17) for cutting the workpiece (1) along the boundary line (4), A cutting device used when manufacturing a plurality of articles each corresponding to a region (5), It overlaps with the to-be-cut line (20) which consists of one boundary line (4) which the rotary blade (17) cut
- the cutting device includes: A jig (6) for fixing a workpiece (1) having a plurality of regions (5) provided in a lattice shape to a fixed surface; A plurality of grooves (13, 14) provided so as to overlap the boundary lines (4) of the plurality of regions (5) on the fixed surface; A rotary blade (17) for cutting the workpiece (1) along the boundary line (4), A cutting device used when manufacturing a plurality of articles each corresponding to a region (5), One groove (26) provided on the side of the jig (6) toward one groove (26) that overlaps the boundary line (25) that has already been cut among the plurality of grooves (13, 14). It has an injection means (24) for injecting cleaning fluid (23) in the direction which extends.
- the cutting device according to the present invention is the above-described cutting device
- the ejection means (22, 24, 27, 28) includes a single groove (21, 26) and is directed toward one or a plurality of grooves extending in the same direction as the single groove (21, 26).
- At least one groove (26) among the one or more grooves is a groove (26) that overlaps the boundary line (25) cut before the cutting line (20).
- the cutting device includes: A jig (6) for fixing a workpiece (1) having a plurality of regions (5) provided in a lattice shape to a fixed surface; A plurality of grooves (13, 14) provided so as to overlap the boundary lines (4) of the plurality of regions (5) on the fixed surface; A rotary blade (17) for cutting the workpiece (1) along the boundary line (4), A cutting device used when manufacturing a plurality of articles each corresponding to a region (5), A plurality of suction holes (30) provided in the bottom surfaces of the plurality of grooves (13, 14); A plurality of suction pipes respectively connected to the plurality of suction holes (30), The plurality of suction pipes are characterized in that the liquid accumulated in the plurality of grooves (13, 14) is sucked and discharged to the outside of the jig (6).
- the cutting device according to the present invention is the above-described cutting device, While having a plurality of supply holes (34) provided in the bottom surface of the plurality of grooves (13, 14), The plurality of supply holes (34) supply the cleaning liquid (37) to the plurality of grooves (13, 14).
- the cutting device according to the present invention is the above-described cutting device,
- the plurality of suction holes (30) and the plurality of supply holes (34) are respectively provided at the intersections of the plurality of grooves (13, 14),
- the suction holes (30) and the supply holes (34) are alternately arranged at adjacent intersections.
- the cutting method according to the present invention includes: A cutting method for forming a plurality of articles each corresponding to a region (5) by cutting a workpiece (1) having a plurality of regions (5) provided in a lattice shape, A plurality of grooves (13, 14) and a plurality of boundary lines (4) provided on the fixed surface of the jig (6) corresponding to the plurality of boundary lines (4) dividing the plurality of regions (5), respectively.
- Each aligning step Fixing the workpiece (1) to the fixed surface; Cutting the workpiece (1) along the cutting line (20) comprising one boundary line (4) among the plurality of boundary lines (4) by the rotary blade (17); The cleaning liquid (23 in the direction in which one groove (21) extends from the side of the jig (6) toward one groove (21) that overlaps the line to be cut (20) among the plurality of grooves (13, 14). , 29).
- the cutting method according to the present invention includes: A cutting method for forming a plurality of articles each corresponding to a region (5) by cutting a workpiece (1) having a plurality of regions (5) provided in a lattice shape, A plurality of grooves (13, 14) and a plurality of boundary lines (4) provided on the fixed surface of the jig (6) corresponding to the plurality of boundary lines (4) dividing the plurality of regions (5), respectively.
- Each aligning step Fixing the workpiece (1) to the fixed surface; Cutting the workpiece (1) along the cutting line (20) comprising one boundary line (4) among the plurality of boundary lines (4) by the rotary blade (17); The direction in which one groove (26) extends from the side of the jig (6) toward one groove (26) that overlaps the boundary line (25) that has already been cut among the plurality of grooves (13, 14). And a step of spraying the cleaning liquid (23).
- the cutting method according to the present invention is the above-described cutting method
- the cleaning liquid (23, 29) is included toward one or a plurality of grooves including one groove (21, 26) and extending in the same direction as the one groove (21, 26).
- At least one groove (26) among the one or more grooves is a groove (26) that overlaps the boundary line (25) cut before the cutting line (20).
- the cutting method according to the present invention includes: A cutting method for forming a plurality of articles each corresponding to a region (5) by cutting a workpiece (1) having a plurality of regions (5) provided in a lattice shape, A plurality of grooves (13, 14) and a plurality of boundary lines (4) provided on the fixed surface of the jig (6) corresponding to the plurality of boundary lines (4) dividing the plurality of regions (5), respectively.
- the plurality of grooves (13) are sequentially passed through the plurality of suction holes (30) provided on the bottom surfaces of the plurality of grooves (13, 14) and the plurality of suction pipes respectively connected to the plurality of suction holes (30). , 14) and sucking the liquid accumulated in the jig (6) and discharging it to the outside of the jig (6).
- the cleaning liquid (37) is supplied to the plurality of grooves (13, 14) from the plurality of supply holes (34) provided on the bottom surfaces of the plurality of grooves (13, 14). ) Is provided.
- the plurality of suction holes (30) and the plurality of supply holes (34) are respectively provided at the intersections of the plurality of grooves (13, 14).
- the suction holes (30) and the supply holes (34) are alternately arranged at adjacent intersections.
- a workpiece to be cut consisting of one boundary line (4) cut by the rotary blade (17) among the plurality of grooves (13, 14) provided on the side of the jig (6).
- the one groove (21, 26) extends toward one groove (21) overlapping the line (20) and / or one groove (26) overlapping the boundary line (25) which has already been cut.
- Injecting means (22, 24, 27, 28) for injecting the cleaning liquid (23, 29) in the direction is provided.
- the cleaning liquid (23, 29) sprayed directly in the extending direction flows in all the lengthwise portions of the one groove (21, 26). Accordingly, the liquid remaining in one groove (21, 26) is removed from the one groove (21, 26).
- an injection means (22,24,27,28) is extended in the same direction with respect to one groove
- the cleaning liquid (23, 29) is sprayed toward one or a plurality of grooves.
- the boundary line (25) cut before the cutting line (20) cut at that time that is, the boundary line that has already been cut.
- a groove (26) overlapping (25) is included. Accordingly, in addition to the groove (21) overlapping the line to be cut (20) cut at that time, the cleaning liquid (23, 29) is also applied to the groove (26) overlapping the previously cut boundary line (25). ) Can be injected directly.
- channel (13,14) and the several suction pipe respectively connected with the several suction hole (30) are provided.
- the plurality of suction pipes sucks the liquid accumulated in the plurality of grooves (13, 14) and discharges it to the outside of the jig (6).
- the liquid remaining in the plurality of grooves (13, 14) is discharged to the outside of the jig (6), and thus to the outside of the cutting device. Therefore, the inside of the plurality of grooves (13, 14) is cleaned.
- the plurality of supply holes (34) provided on the bottom surfaces of the plurality of grooves (13, 14) are provided, and the plurality of supply holes (34) are provided. Supplies the cleaning liquid (37) to the plurality of grooves (13, 14). Thereby, the cleaning liquid (37) supplied from the supply hole (34) is sucked by the suction hole (30) and discharged to the outside of the jig (6) and thus to the outside of the cutting device. Therefore, the inside of the groove (13, 14) between the supply hole (34) and the suction hole (30) is cleaned.
- the plurality of suction holes (30) and the plurality of supply holes (34) are respectively provided at the intersections of the plurality of grooves (13, 14), and the suction holes (30) and the supply holes are provided. (34) are alternately arranged at adjacent intersections. Accordingly, since the cleaning liquid (37) flows between the suction holes (30) and the supply holes (34) provided at the adjacent intersections, the inside of the grooves (13, 14) between them is effectively cleaned. Is done.
- the suction hole (30) and the supply hole (34) are arranged at the intersection where the liquid is difficult to be removed in the groove (13, 14), that is, the part where the liquid is likely to remain. Therefore, the liquid remaining in the vicinity of the intersection is discharged outside the jig (6) and thus outside the cutting device.
- FIG. It is a schematic perspective view which shows the principal part of the cutting device which concerns on Example 1.
- FIG. It is a schematic perspective view which shows the principal part of the cutting device which concerns on Example 2.
- FIG. It is a schematic perspective view which shows the principal part of the cutting device which concerns on Example 3.
- FIG. It is a schematic perspective view which shows the principal part of the cutting device which concerns on Example 4.
- FIG. It is a schematic perspective view which shows the principal part of the cutting device which concerns on Example 5.
- FIG. It is a schematic perspective view which shows the principal part of the cutting device which concerns on Example 6.
- FIG. It is a schematic perspective view explaining the cutting method of the conventional to-be-cut object.
- FIG. 1 is a schematic perspective view showing a main part of the cutting apparatus according to the present embodiment.
- the resin sealing body 1 is adsorbed and fixed to the adsorption jig 6 included in the cutting apparatus according to the present embodiment.
- the resin sealing body 1 is cut
- the cut line 20 is overlapped with a cut portion groove 21 which is one of the grooves 14 extending in the Y direction when viewed in plan.
- the cut end groove 21 accommodates a peripheral end portion that is an outer edge of the rotary blade 17.
- a cleaning water nozzle 22 is provided integrally with the rotary blade 17 in the vicinity of the side (front in FIG. 1) of the suction jig 6.
- the cleaning water nozzle 22 is provided horizontally or slightly downward so that the central axis of the cleaning water nozzle 22 is substantially along the direction in which the cut groove 21 extends.
- the cleaning water nozzle 22 is provided in a direction ( ⁇ Y direction) in which the generated cutting waste is discharged by the cutting water 19.
- “the vicinity of the side” when referred to as “the vicinity of the side of the suction jig 6” means the vicinity of the four side surfaces (front, back, right side, left side) of the illustrated jig. Means.
- the cleaning water nozzle 22 directly injects the high-pressure cleaning water 23 toward the cutting portion groove 21 in the direction in which the cutting portion groove 21 extends and the cutting waste is discharged, thereby cleaning the high pressure.
- the water 23 can flow at a high speed inside the cut groove 21. Further, by providing the cleaning water nozzle 22 so that the central axis thereof is slightly downward, the cleaning water 23 is caused to flow at a high speed inside the cutting portion groove 21 after colliding with the bottom surface of the cutting portion groove 21. be able to.
- the cutting apparatus shown in FIG. 1 cuts the resin sealing body 1 as follows. First, the rotary blade 17 is aligned in the X, Y, and Z directions with respect to the boundary line 4 along the Y direction to be cut.
- the cutting mechanism 15 is moved in the + Y direction toward the resin sealing body 1 while spraying the cutting water 19 and the cleaning water 23.
- the resin sealing body 1 is cut along the line 20 to be cut.
- the cleaning water nozzle 22 directly supplies the high-pressure cleaning water 23 in the direction in which the cutting portion groove 21 extends toward the cutting portion groove 21 and in the direction in which cutting waste is discharged ( ⁇ Y direction). Spray. Accordingly, the cutting waste generated by the rotary blade 17 is removed from the cutting portion groove 21 to the outside of the suction jig 6 by the cleaning water 23 that flows at high speed in the ⁇ Y direction inside the cutting portion groove 21.
- the base 7 (see FIG. 7) to which the suction jig 6 is attached is the rotation direction about the Z direction. It is rotated by 90 ° in the ⁇ direction. Thereafter, the resin sealing body 1 is cut at each of the boundary lines 4 that are newly along the Y direction. Injecting the cleaning water 23 is the same as in the first cutting in the Y direction. Through the steps so far, the resin encapsulant 1 can be cut and separated into electronic components corresponding to the respective regions 5.
- high-pressure cleaning water is formed in the direction in which the cut groove 21 extends toward the cut groove 21 that overlaps the line 20 to be cut and in the direction ( ⁇ Y direction) in which cutting waste is discharged. 23 is jetted directly.
- the cleaning water 23 sprayed directly toward the cutting portion groove 21 flows at a high speed in the direction in which cutting waste is discharged in all the lengthwise portions inside the cutting portion groove 21. Therefore, the liquid that remains inside the cutting portion groove 21 and contains cutting waste is removed from the inside of the cutting portion groove 21 to the outside of the suction jig 6.
- FIG. 2 is a schematic perspective view illustrating a main part of the cutting device according to the present embodiment.
- two washing water nozzles 22 and 24 are provided integrally with the cutting mechanism 15 in the vicinity of the side (front in FIG. 1) of the suction jig 6. Yes.
- the cleaning water nozzle 24 is provided toward the groove 26 that overlaps the boundary line 25 that is cut immediately before the cutting line 20 that is being cut at that time.
- the cleaning water nozzle 24 directly injects the high-pressure cleaning water 23 in the direction in which the groove 26 extends and in the direction in which the cutting waste is discharged ( ⁇ Y direction).
- the high-pressure washing water 23 is directly injected into the cut groove 21 that overlaps the line 20 to be cut at that time.
- the cleaning water 23 is directly jetted also into the groove 26 that overlaps the boundary line 25 cut immediately before. Therefore, in the groove 26 that overlaps the boundary line 25 cut immediately before, the workpiece 1 is cut at the boundary line 25 itself, and immediately after that at the cutting line 20 that is the adjacent boundary line.
- the washing water 23 is directly jetted twice when the object 1 is cut.
- the groove 26 that overlaps the boundary line 25 that has been cut immediately before in other words, the liquid that contains cutting waste remaining inside the groove 26 that overlaps the boundary line 25 that has already been cut is removed from the one groove 26. Increased effect.
- the cleaning water nozzle 24 is provided toward a groove that overlaps a boundary line (not limited to the boundary line that was cut immediately before) that is cut before the cutting line 20 that is being cut at that time. It only has to be. Further, two or more cleaning water nozzles 24 may be provided toward a groove that overlaps a boundary line that has been cut before the cutting target line 20 that is cut at that time. In addition, at least one of the two or more cleaning water nozzles 24 is provided toward the groove that overlaps the boundary line that was cut before the cutting line 20 that is cut at that time. Just do it. Further, the two or more cleaning water nozzles 24 may include a nozzle provided toward a groove overlapping a boundary line to be cut.
- the cleaning water 23 is sprayed toward the groove 26 that overlaps the boundary line 25 that has already been cut without spraying the cleaning water 23 toward the groove 21 that overlaps the line 20 to be cut at that time. It is good as well. In other words, only one or a plurality of cleaning water nozzles 24 may be provided. Further, the cleaning water 23 may be jetted toward the groove 26 that overlaps the boundary line 25 that has already been cut and the groove 14 that overlaps the boundary line 4 that has not been cut yet.
- the cleaning water nozzles 22 and 24 are provided integrally with the cutting mechanism 15. Not only this but the nozzles 22 and 24 for washing water can also be provided separately from the cutting mechanism 15. In this case, the cleaning water nozzles 22 and 24 may be moved in the X direction in synchronization with the cutting mechanism 15 and may be moved in the Y direction asynchronously with the cutting mechanism 15.
- FIG. 3 is a schematic perspective view illustrating a main part of the cutting device according to the present embodiment.
- the cleaning water nozzle 27 has a plurality of injection ports (not shown) respectively facing all the grooves 14 along the direction to be cut (Y direction).
- the plurality of jets of the cleaning water nozzle 27 have high pressure in all the grooves 14 in the direction in which the grooves 14 extend and in the direction in which cutting waste is discharged ( ⁇ Y direction).
- the washing water 23 is sprayed directly.
- the high-pressure washing water 23 is directly sprayed to all the grooves 14 at all times. Accordingly, in addition to the groove 21 that overlaps the line 20 to be cut at that time, the groove (including the groove 26) that overlaps the boundary line that was cut before that (including the boundary line 25 that was cut immediately before).
- the high-pressure washing water 23 is also directly sprayed into the other grooves 14 including Therefore, even after the workpiece 1 is cut at the boundary line 4 that overlaps all the grooves 14, the cleaning water 23 is directly jetted toward all the grooves 14. Therefore, in all the grooves 14, the effect of removing the liquid remaining inside and including cutting waste is increased.
- FIG. 4 is a schematic perspective view illustrating a main part of the cutting device according to the present embodiment.
- the long cleaning water is separated from the rotary blade 17 and extends along the X direction.
- a nozzle 28 is provided.
- the washing water nozzle 28 has one slit-like injection port extending along the X direction so as to face all the grooves 14 along the direction to be cut (Y direction).
- the cleaning water nozzle 28 extends in the X direction and the Y direction with respect to all the grooves 14 in the direction in which the grooves 14 extend and in the direction in which the cutting waste is discharged ( ⁇ Y direction).
- the high-pressure washing water 29 is directly jetted in a film shape (curtain shape) having a small thickness in the Z direction.
- the cleaning water 29 since the cleaning water 29 has a film shape, the high-pressure cleaning water 23 is always directly sprayed to all the grooves 14. Therefore, the same effect as in the third embodiment can be obtained.
- the cleaning water nozzle 28 has one slit-like injection port.
- the ejection port of the cleaning water nozzle 28 may be a plurality of slit-shaped ejection ports extending along the X direction.
- a plurality of cleaning water nozzles 28 may be provided along the X direction.
- the conditions necessary for the cleaning waters 23 and 29 are that the cleaning waters 23 and 29 are cut scraps in all the lengthwise portions inside the cutting groove 21 and the groove 26. Is to flow at high speed in the direction of discharge. Accordingly, the pressure, spray speed, cross-sectional shape, cross-sectional area, and the like of the cleaning water 23 sprayed toward the cut groove 21 and the groove 26 may be determined so as to satisfy the above-described conditions. What is necessary is just to determine so that the distance of the injection port of the nozzles 22,24,27,28 for washing water and the opening of the cutting part groove
- FIG. 5 is a schematic perspective view showing a main part of the cutting apparatus according to the present embodiment.
- a plurality of suction holes 30 are provided on the bottom surfaces of the grooves 13 and 14 in the suction jig 6.
- the plurality of suction holes 30 are sequentially connected to a suction source 32 such as a vacuum pump or a decompression tank through a suction pipe (not shown) provided in the suction jig 6 and the base 7 and a suction pipe 31. linked.
- the inside of the grooves 13 and 14 is sucked by the plurality of suction holes 30 provided on the bottom surfaces of the plurality of grooves 13 and 14 and connected to the suction source 32.
- the liquid remaining inside the plurality of grooves 13 and 14 and containing cutting waste is sucked and removed outside the adsorption jig 6 and thus outside the cutting device. Therefore, the inside of the plurality of grooves 13 and 14 is cleaned.
- the location and number of the plurality of suction holes 30 provided inside the grooves 13 and 14 are not particularly limited and can be arbitrarily determined. However, these locations are preferably the intersections of the grooves 13, 14 as shown in the figure. This enhances the effect of removing the accumulated liquid to the outside of the cutting device at the intersection where the liquid containing cutting waste tends to accumulate inside the plurality of grooves 13 and 14.
- FIG. 6 is a schematic perspective view illustrating a main part of the cutting device according to the present embodiment.
- a plurality of suction holes 30 and a plurality of supply holes 34 are provided adjacent to each other on the bottom surfaces of the grooves 13 and 14 in the suction jig 6.
- the suction holes 30 are indicated by “X” inside the ellipse
- the supply holes 34 are indicated by “ ⁇ ” inside the ellipse.
- the plurality of supply holes 34 are connected to a cleaning water supply source 36 via a supply pipe (not shown) provided in the suction jig 6 and the base 7 and a supply pipe 35 in order. .
- the plurality of supply holes 34 supply cleaning water 37 into the grooves 13 and 14. Then, the cleaning water 37 supplied from the plurality of supply holes 34 is sucked through the plurality of suction holes 30 to be removed as the drainage 38 to the outside of the suction jig 6 and thus to the outside of the cutting device. . Therefore, the liquid accumulated in the grooves 13 and 14 is mixed with the drainage 38 and removed to the outside of the adsorption jig 6.
- the cleaning water 37 supplied from the plurality of supply holes 34 is sucked through the plurality of suction holes 30 to be removed to the outside of the adsorption jig 6 as the drainage 38.
- the liquid remaining in the plurality of grooves 13 and 14 and containing cutting waste is sucked and mixed with the drainage 38 and removed outside the suction jig 6 and thus outside the cutting device. Therefore, the inside of the plurality of grooves 13 and 14 is effectively cleaned.
- a plurality of suction holes 30 and a plurality of supply holes 34 are provided adjacent to each other.
- the location and number of the plurality of suction holes 30 and the plurality of supply holes 34 are not particularly limited and can be arbitrarily determined. However, these locations are preferably the intersections of the grooves 13, 14 as shown in the figure. This enhances the effect of removing the accumulated liquid to the outside of the cutting device at the intersection where the liquid containing cutting waste tends to accumulate inside the plurality of grooves 13 and 14.
- the resin sealing body 1 as an object to be cut is obtained when the resin sealing body 1 is cut to manufacture an optical element (optical electronic component) such as an LED package or a CCD.
- the resin sealing body containing translucent resin may be sufficient.
- the object to be cut may be a resin molded body in the case of manufacturing an optical article such as an optical lens, an optical communication component, or a light guide plate by cutting a resin molded body containing a translucent resin.
- the attachment of cutting waste causes a decrease in yield.
- item can be improved by preventing that a cutting waste adheres to an optical element or an optical system article
- the object to be cut may be a wafer such as a silicon wafer or a compound semiconductor wafer, or a substrate such as a glass substrate or a ceramic substrate, in addition to the resin sealing body.
- the present invention can be applied to the case where it is desired to avoid the attachment of cutting waste when the workpiece is cut into pieces.
- the nozzle for the cleaning water may be made vertically long so that the nozzle for the cutting water and the nozzle for the cleaning water are used in common.
- the cutting water / cleaning water combined nozzle jets water toward both the cutting place and the cut groove.
- the nozzle for cutting water which has the same shape as the nozzle for washing water can also be provided along with the Z direction with respect to the nozzle for washing water.
- cutting water in the description so far is a generic term for liquids supplied for the purpose of reducing machining resistance (lubrication) and cooling and removing chips generated by cutting, that is, cutting fluids.
- Washing water is a generic term for liquids supplied mainly for the purpose of removing chips generated by cutting, that is, cleaning liquids.
- city water or pure water is usually used.
- cutting water and washing water a liquid obtained by adding an additive (detergent, lubricant, etc.) to city water or pure water may be used.
- the resin sealing body 1 that is the object to be cut was fixed by suction using the suction jig 6.
- the present invention is not limited to this, and the object to be cut may be fixed using a clamp or the like depending on the size and shape of the object to be cut or an article after being singulated.
- full cut for completely cutting an object to be cut has been described.
- the present invention is not limited to this, and the present invention can also be applied to so-called “half cut” in which a part to be cut is cut (partially cut) while leaving a part in the thickness direction of the part to be cut. Even in the case of half-cutting, the cutting water 19 including cutting waste may enter the grooves 13 and 14 of the suction jig 6 (see FIG. 1), so the present invention is effective.
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- Details Of Cutting Devices (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008049048A JP5363746B2 (ja) | 2008-02-29 | 2008-02-29 | 切断装置及び切断方法 |
| JP2008-049048 | 2008-02-29 |
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| WO2009107324A1 true WO2009107324A1 (ja) | 2009-09-03 |
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| PCT/JP2009/000377 Ceased WO2009107324A1 (ja) | 2008-02-29 | 2009-02-02 | 切断装置及び切断方法 |
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| Country | Link |
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| JP (1) | JP5363746B2 (https=) |
| TW (1) | TWI451930B (https=) |
| WO (1) | WO2009107324A1 (https=) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012007381A1 (de) * | 2010-07-15 | 2012-01-19 | Gebr. Schmid Gmbh & Co. | Träger für einen siliziumblock, trägeranordnung mit einem solchen träger und verfahren zur herstellung einer solchen trägeranordnung |
| CN111266911A (zh) * | 2020-03-27 | 2020-06-12 | 南京鸿发有色金属制造股份有限公司 | 一种用于铝型材加工的铝屑回收装置 |
| CN115194840A (zh) * | 2022-07-19 | 2022-10-18 | 内蒙合成化工研究所 | 一种绝热层裁剪装置 |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5709370B2 (ja) * | 2009-11-26 | 2015-04-30 | 株式会社ディスコ | 切削装置及び切削方法 |
| JP5468886B2 (ja) * | 2009-12-02 | 2014-04-09 | アピックヤマダ株式会社 | 切断装置及び切断方法 |
| JP5627618B2 (ja) * | 2012-02-23 | 2014-11-19 | Towa株式会社 | 固定治具の製造方法及び固定治具 |
| JP5975703B2 (ja) * | 2012-04-09 | 2016-08-23 | 株式会社ディスコ | 切削装置 |
| JP6143668B2 (ja) * | 2013-12-28 | 2017-06-07 | Towa株式会社 | 電子部品製造用の切断装置及び切断方法 |
| JP6257360B2 (ja) * | 2014-02-04 | 2018-01-10 | 株式会社ディスコ | ブレードカバー装置 |
| JP6228044B2 (ja) * | 2014-03-10 | 2017-11-08 | 株式会社ディスコ | 板状物の加工方法 |
| JP6338478B2 (ja) * | 2014-07-18 | 2018-06-06 | Towa株式会社 | 切断方法及び製品の製造方法 |
| KR20170112003A (ko) * | 2016-03-30 | 2017-10-12 | 동우 화인켐 주식회사 | 시트형 필름 절단기 |
| JP7822348B2 (ja) * | 2023-07-26 | 2026-03-02 | Towa株式会社 | 保持部材、切断用テーブル、切断装置、及び、半導体装置の製造方法 |
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| JP2006150494A (ja) * | 2004-11-29 | 2006-06-15 | Disco Abrasive Syst Ltd | 切削装置 |
| JP2007111840A (ja) * | 2005-10-21 | 2007-05-10 | Disco Abrasive Syst Ltd | 切削装置 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS6480506A (en) * | 1987-09-24 | 1989-03-27 | Hitachi Ltd | Dicer |
| JPH01101112A (ja) * | 1987-10-15 | 1989-04-19 | Sony Corp | 半導体ウエハのダイシング方法 |
| JPH04240749A (ja) * | 1991-01-25 | 1992-08-28 | Toshiba Corp | ダイシング装置 |
| JPH0745562A (ja) * | 1993-07-30 | 1995-02-14 | Sony Corp | 半導体ウェーハのダイシング方法およびその装置 |
| JP2003309087A (ja) * | 2002-04-18 | 2003-10-31 | Towa Corp | 基板の切断方法及び装置 |
| JP2004055860A (ja) * | 2002-07-22 | 2004-02-19 | Renesas Technology Corp | 半導体装置の製造方法 |
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2008
- 2008-02-29 JP JP2008049048A patent/JP5363746B2/ja active Active
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2009
- 2009-02-02 WO PCT/JP2009/000377 patent/WO2009107324A1/ja not_active Ceased
- 2009-02-11 TW TW098104290A patent/TWI451930B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006150494A (ja) * | 2004-11-29 | 2006-06-15 | Disco Abrasive Syst Ltd | 切削装置 |
| JP2007111840A (ja) * | 2005-10-21 | 2007-05-10 | Disco Abrasive Syst Ltd | 切削装置 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012007381A1 (de) * | 2010-07-15 | 2012-01-19 | Gebr. Schmid Gmbh & Co. | Träger für einen siliziumblock, trägeranordnung mit einem solchen träger und verfahren zur herstellung einer solchen trägeranordnung |
| CN103140336A (zh) * | 2010-07-15 | 2013-06-05 | 吉布尔·施密德有限责任公司 | 硅块载体、具有该载体的载体装置和制造载体装置的方法 |
| CN103140336B (zh) * | 2010-07-15 | 2015-11-25 | 吉布尔·施密德有限责任公司 | 载体装置和制造载体装置的方法 |
| CN111266911A (zh) * | 2020-03-27 | 2020-06-12 | 南京鸿发有色金属制造股份有限公司 | 一种用于铝型材加工的铝屑回收装置 |
| CN115194840A (zh) * | 2022-07-19 | 2022-10-18 | 内蒙合成化工研究所 | 一种绝热层裁剪装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5363746B2 (ja) | 2013-12-11 |
| TW201000249A (en) | 2010-01-01 |
| TWI451930B (zh) | 2014-09-11 |
| JP2009202311A (ja) | 2009-09-10 |
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