WO2009086989A2 - Dispositif de détection - Google Patents

Dispositif de détection Download PDF

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Publication number
WO2009086989A2
WO2009086989A2 PCT/EP2008/066187 EP2008066187W WO2009086989A2 WO 2009086989 A2 WO2009086989 A2 WO 2009086989A2 EP 2008066187 W EP2008066187 W EP 2008066187W WO 2009086989 A2 WO2009086989 A2 WO 2009086989A2
Authority
WO
WIPO (PCT)
Prior art keywords
sensor
circuit board
housing
signal line
interface
Prior art date
Application number
PCT/EP2008/066187
Other languages
German (de)
English (en)
Other versions
WO2009086989A3 (fr
Inventor
Anwar Hegazi
Thomas Loebe
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Priority to JP2010541730A priority Critical patent/JP5453307B2/ja
Priority to EP08869364A priority patent/EP2229117A2/fr
Priority to CN2008801241385A priority patent/CN101909540B/zh
Publication of WO2009086989A2 publication Critical patent/WO2009086989A2/fr
Publication of WO2009086989A3 publication Critical patent/WO2009086989A3/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D21/00—Measuring or testing not otherwise provided for
    • G01D21/02—Measuring two or more variables by means not covered by a single other subclass

Definitions

  • the invention is based on a sensor device according to the preamble of the independent claim.
  • a device for combined detection of the axle acceleration and the wheel speed is already known.
  • wheel speed sensor and accelerometer are combined together in a common device and connected mechanically stiff with the wheel axle.
  • a sharing of the interface and the required power supply is provided.
  • the sensors are integrated in a common housing. Furthermore is also a
  • Preparation circuit provided for the two sensors. However, this would require a dedicated integrated circuit.
  • the sensor device according to the invention according to the features of the independent claim has the advantage that on the one hand synergy potentials can be used by the integration of multiple sensors in a housing. Furthermore, the proposed solution also avoids additional sensor lines in the dynamic range of the motor vehicle. On the other hand, the previously used sensors or their developed integrated circuits can be maintained without changes, so that can be dispensed with a costly new development of an integrated circuit, which integrates both sensors. The galvanically separated forwarding of the signals by means of separate lines minimizes the susceptibility of the overall system to failure.
  • FIG. 1 shows a perspective view of an embodiment
  • FIG. 2 shows a block diagram of a first embodiment
  • FIG. 3 shows a block diagram of a second embodiment
  • FIG. 4 shows a perspective view of the individual components which are arranged in a housing
  • Figure 6 is a sectional view of the embodiment of Figure 5
  • Figure 7 is a plan view of different possible arrangements of a second sensor.
  • a sensor housing 10 At least two sensors 20, 22 are arranged.
  • the sensor housing 10 is provided with a sleeve-shaped fastening element 14.
  • the cup-shaped sensor housing 10 runs out rectangular.
  • a side surface 15 At the end of the sensor housing 10 is parallel to the longitudinal axis of the sensor housing 10, a side surface 15 along which, for example, a donor wheel, not shown, can be moved past, so that the arranged in the housing 10 first sensor 20, the speed of Encoder wheel detected.
  • the two sensors 20, 22 are connected via a common cable 12 to an interface 13, consisting of a plug.
  • the first sensor 20 comprises a first integrated circuit 17, which is connected via a supply line 28 and a
  • the second sensor 22 comprises a sensor element 24, which is connected via bonded connections to a second integrated circuit 18.
  • the second integrated circuit 18 in turn is connected via the supply line 28 and the second signal line 30 to a control unit 36.
  • Sensors 20, 22 are used on a three-core cable.
  • the exemplary embodiment according to FIG. 3 differs from that according to FIG. 2 in that the integrated circuits 17, 18 are supplied with energy via separate supply lines 32 and 34, respectively. In this
  • Embodiment serves a four-core cable power supply and data exchange of the sensors 20, 22nd
  • FIG. 4 shows the essential components of the sensor device.
  • the housing 10 is cup-shaped and formed open on the side with a larger opening cross-section.
  • the fastening element 14 comprises a preferably metallic bushing 50, which serves for example to receive a screw connection.
  • An end face 42 is oriented perpendicular to the longitudinal axis of the sensor housing 10, along with a suitable arrangement of the first integrated circuit 17 of the first sensor 20, the
  • a printed circuit board 16 is formed, which terminates in a recess 47 in such a way towards the tapering end, that it is delimited on the left and on the right by finger-shaped extensions.
  • a positioning means 48 is arranged, which has a substantially U-shaped cross section and is designed for example as a positioning spring.
  • the positioning means 48 in turn runs on two U-shaped projections each, which are connected to one another in the transverse direction.
  • the recess 47 is designed such that a carrier 40 can be inserted into it.
  • the hollow carrier 40 in turn serves for - A -
  • the first integrated circuit 17 or the first sensor 20 has two connection pins, which in each case via the circuit board 16 or other suitable means are electrically conductively contacted with the signal line 26 and the supply line 32.
  • 16 corresponding conductor tracks may be formed on the back of the circuit board, which lead to electrical connection points 55.
  • These connecting points 55 designed as plated-through holes serve to accommodate the four line ends, namely the
  • These lines 26, 30, 32, 34 are in a common cable 12 through a lid 41st passed through.
  • the circuit board 16 At the widened end of the circuit board 16 is behind the
  • the circuit board 16 four unspecified recesses for receiving positioning elements 54 and fasteners 52 are further provided.
  • the fastening means 52 are preferably L-shaped and made of a metal or bronze. They can be connected to both the lid 41 and the circuit board 16.
  • positioning elements 54 are formed in the form of two perpendicular to the longitudinal axis of the housing 10 projecting pins.
  • FIG. 5 shows the individual components shown in FIG. 4 in the mounted state. It can be seen that the positioning elements 54, which are part of the cover 41, engage in the recesses of the printed circuit board 16, as does the fastening means 52.
  • the open side of the cup-shaped sensor housing 10 is closed by the cover 41.
  • a protruding into the housing interior counter surface 49 is provided, which serves to receive the end face of the positioning means 48.
  • fastening pin of the carrier 40 by corresponding recesses of the connection pins of the first sensor 20 protrude for suitable positioning.
  • an electronic component 56 can additionally be identified as an external circuit for the first sensor 20, which is arranged on the underside of the printed circuit board 16. Also, the second sensor 22 requires more to be arranged on the circuit board 16 external circuits, which are not shown separately.
  • connection points 65, 65 ' are provided on the printed circuit board 16; 67, 67 'provided at different angles.
  • the sensor 22 can be mounted in a specific angular position. This is of particular interest when using a single-axis acceleration sensor with regard to the sensitivity of the respective axial direction.
  • the first conductor 61 is applied to the top of the circuit board 16, while the second conductor 63 may be disposed on the underside of the circuit board 16 and via vias again on the top of the circuit board 16 is guided to contact the sensor 22.
  • the arrangement of FIG 7 is particularly suitable for applications in which the angular position has to be changed, the printed circuit board 16 can be advantageously maintained in this case.
  • the first sensor 20 could be a wheel speed sensor.
  • a signal pre-evaluation is implemented.
  • Magnetoresistive sensors based on AMR or GMR are also conceivable.
  • transmitter wheels mounted in the region of the wheel axle such as magnetically conducting gears or punched grids (combined with back-bias magnets in the sensor 20 in the case of active sensors) or rubberized transmitter wheels magnetized with north-south pole divisions, are used.
  • the transmitter wheel influences the magnetic field, so that the sensor 20 is a measure of this Can determine the speed of the encoder wheel.
  • the sensor 20 is supplied via the supply line 28 and the signal line 26, which also serves as a ground cable, with energy.
  • the ground line is used as a signal line 26 by a signal is modulated on this signal line 26, for example by means of current modulation. This can be on a separate
  • Signal line can be omitted.
  • the thus-modulated speed information is transmitted to the controller 36 for further processing.
  • an acceleration sensor is arranged in the housing 10 as an example of a second sensor 22. It consists of the sensor element 24, for example a micromechanical system for detecting the acceleration, which is bonded to the integrated circuit 18 in connection.
  • the integrated circuit 18 evaluates the measurement signals of the sensor element 24 and performs a corresponding signal preprocessing.
  • a signal line 30 in turn, also the ground line, supplied with energy.
  • the information to be transmitted is modulated on the ground line serving as signal line 30.
  • a common cable 12 are signal line 26 of the first sensor 20, signal line 30 of the second sensor 22, and the common supply line 28 (when the supply line 28 is shared by the two integrated circuits 17, 18) or alternatively the two supply lines 32, 34 to the interface 13, which is designed as a plug out.
  • the signal preprocessing for the two sensors 20, 22 is carried out separately in the respective integrated circuits 17, 18. The forwarding of the respective
  • Output signals are galvanically separated from each other on separate lines, namely the signal line 26 and the signal line 30.
  • the second sensor 22 is used in particular for detecting the axle vibrations. It can be designed for this purpose as a single or multi-axis acceleration sensor.
  • fasteners sinomers, bicarbonate, and bicarbonate.
  • the sensor housing 10 can be mechanically fastened to the vehicle via the fastening element 14 or an adhesive or latching contour. Alternatively, the housing 10 could also be designed as a cap or ring on a wheel bearing is pressed on.
  • the sensor device is fastened to an axis-resonating element of the vehicle. Furthermore, the sensor device may include a constructive element for the defined alignment of the sensors 20, 22 to the vehicle.
  • a correspondingly populated printed circuit board 16 is accommodated in the cup-shaped sensor housing 10.
  • the circuit board 16 is equipped with the second integrated circuit 18, in which, for example, the acceleration sensor 22 is realized, as well as other electronic components 56 as components of an external circuit.
  • the narrow area of the printed circuit board 16 application-specific sensor dimensions for the function of the first sensor 20 as a wheel speed sensor can be achieved.
  • the carrier 40 is preferably executed in plastic injection molding. Over these further variants of the first sensor 20 can be realized inexpensively.
  • the carrier 40 serves to receive the magnet 46, which generates a back magnetic field magnet as a magnetic field, which is varied via a donor wheel, not shown, depending on the rotational speed. Between the first sensor 20 and the magnet 46, an H-plate 44 is placed to homogenize the magnetic field.
  • the so equipped carrier module 40 is inserted into the recess 47 and contacted with the circuit board 16 electrically conductive.
  • the carrier module 40 can be equipped relatively flexibly for specific applications. So it would also be possible to dispense with the magnet 46, for example in multipole encoder wheels. The one shown in the embodiment
  • Embodiment represents a so-called side-read sensor, d. H.
  • the sender wheel is arranged laterally from the sensor housing 10 in the vicinity of the side surface 15 for influencing the magnetic field emitted by the magnet 46.
  • the first sensor 20 could be angled at 90 °, so that a so-called bottom-read sensor is formed.
  • the sender wheel would be arranged near the end face 42.
  • These variants can be realized by a corresponding adaptation of the carrier module 40, without having an effect on the remaining circuit board 16.
  • sensors 20 with an angular position between 0 and 90 ° by a corresponding embodiment of the carrier module 40th being represented.
  • the carrier module 40 is inserted into the recess 47 of the printed circuit board 16.
  • a plastic part is sprayed, which can close the open side of the sensor housing 10 as a cover 41.
  • the circuit board 16 is attached. This is done via the positioning elements 54, which are integrated in the lid 41 as pins and can be riveted to the circuit board 16.
  • the positioning means 48 is already arranged, which engages behind the ramp-like counter surface 49 of the housing 10 during insertion and so contributes to the correct position of the front part of the circuit board 16 in the housing 10.
  • the printed circuit board 16 can be connected to the cover 41 via a plastic riveting process (cold or hot deformation). Alternatively, this task can take over metallic mounting pins, which are part of the
  • the circuit board 16 can be pressed or plugged onto the metal pins and soldered.
  • the lid 41 closes the cup-shaped housing 10 and can, for. B. by plastic laser transmission welding to the housing 10 are tightly connected.
  • the sensor housing can also be implemented in M I D technology and receive the sensor components 20, 22 and the sensor cable 12 directly. In this embodiment could be dispensed with a circuit board 16.
  • the cup 10 and the sensors 20, 22 could alternatively be cast with a suitable material, which could be dispensed with a suitable choice of material on the lid 41.
  • the acceleration sensor 22 can be arranged rotatable on the circuit board 16 as desired. Such an arrangement is shown in FIG. There, the acceleration sensor 22 can be arranged in angular increments in the circuit board plane for application-specific alignment of the sensitive axes to the Z-axis of the vehicle. This makes it possible to use a space-saving and cost-saving single-axis acceleration sensor.
  • the cable 12 could be connected to the housing 10 also by means of plugs and mating connectors. This increases the interchangeability of the
  • the sensors 20, 22 can optionally be connected directly to the lines 26, 28, 30, 32, 34 via busbars.
  • any type of sensor can be integrated in a sensor housing 10.
  • the combination of a speed sensor with an acceleration sensor is advantageous due to a variety of applications such as indirect tire pressure detection, active or semi-active damping, wheel bearing wear detection or FahrbelagsLiteserkennung.
  • the use of the sensor device is not limited to this.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)
  • Arrangements For Transmission Of Measured Signals (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

L'invention concerne un dispositif de détection comprenant: un premier détecteur (20) entouré au moins partiellement par un boîtier (10), le signal de sortie du premier détecteur (20) étant transféré à une interface (13) par l'intermédiaire d'une première ligne de signaux (26); au moins un deuxième détecteur (22) entouré également au moins partiellement par le boîtier (10), le signal de sortie du deuxième détecteur (22) étant transféré à l'interface (13) par l'intermédiaire d'une deuxième ligne de signaux (30). La première et la deuxième ligne de signaux (26, 30) sont guidées jusqu'à l'interface (13) dans un câble commun (12), mais de manière séparée galvaniquement. Au moins une ligne d'alimentation en énergie (28, 32, 34) servant à alimenter en énergie le premier et/ou le deuxième détecteur (20, 22) est placée dans le câble commun (12).
PCT/EP2008/066187 2008-01-07 2008-11-26 Dispositif de détection WO2009086989A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010541730A JP5453307B2 (ja) 2008-01-07 2008-11-26 センサ装置
EP08869364A EP2229117A2 (fr) 2008-01-07 2008-11-26 Dispositif de détection
CN2008801241385A CN101909540B (zh) 2008-01-07 2008-11-26 传感器装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008003341.3A DE102008003341B4 (de) 2008-01-07 2008-01-07 Sensorvorrichtung
DE102008003341.3 2008-01-07

Publications (2)

Publication Number Publication Date
WO2009086989A2 true WO2009086989A2 (fr) 2009-07-16
WO2009086989A3 WO2009086989A3 (fr) 2009-10-15

Family

ID=40719440

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/066187 WO2009086989A2 (fr) 2008-01-07 2008-11-26 Dispositif de détection

Country Status (5)

Country Link
EP (1) EP2229117A2 (fr)
JP (1) JP5453307B2 (fr)
CN (1) CN101909540B (fr)
DE (1) DE102008003341B4 (fr)
WO (1) WO2009086989A2 (fr)

Families Citing this family (12)

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Publication number Priority date Publication date Assignee Title
DE102011002741A1 (de) * 2011-01-17 2012-07-19 Zf Friedrichshafen Ag Sensormodul und Verfahren zum Herstellen eines Sensormoduls
CN112964891A (zh) * 2013-12-24 2021-06-15 博世汽车部件(苏州)有限公司 模块化速度传感器
US9664705B2 (en) * 2014-02-19 2017-05-30 Sensata Technologies, Inc. Speed sensor
GB2533090A (en) 2014-12-08 2016-06-15 Skf Ab Sensor device with mounting means
DE102015202333A1 (de) * 2015-02-10 2016-08-11 Robert Bosch Gmbh Sensorgehäuse für eine Radsensorvorrichtung, Radsensorvorrichtung und deren Anbindungskomponente
WO2016196519A1 (fr) * 2015-05-29 2016-12-08 Microvention, Inc. Circuit de cathéter
CN105807079B (zh) * 2016-04-20 2019-02-26 宁波中车时代传感技术有限公司 高速车用电机的速度传感器组件及其制造方法
JP6759751B2 (ja) * 2016-06-23 2020-09-23 日立金属株式会社 回転検出装置及びセンサ付きケーブル
CN107782340A (zh) * 2016-08-26 2018-03-09 大陆汽车电子（连云港）有限公司 一种曲轴传感器
DE102017220905A1 (de) * 2017-11-23 2019-05-23 Robert Bosch Gmbh Sensoreinheit für ein Fahrzeug
DE102018221819A1 (de) * 2018-12-14 2020-06-18 Robert Bosch Gmbh Steckverbinder und Steuergerät für ein Kraftfahrzeug mit einem Steckverbinder
DE102019219620A1 (de) * 2019-12-13 2021-06-17 Continental Automotive Gmbh Magnetfeldsensor

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Also Published As

Publication number Publication date
DE102008003341A1 (de) 2009-07-09
JP2011508894A (ja) 2011-03-17
WO2009086989A3 (fr) 2009-10-15
JP5453307B2 (ja) 2014-03-26
CN101909540B (zh) 2013-01-02
EP2229117A2 (fr) 2010-09-22
CN101909540A (zh) 2010-12-08
DE102008003341B4 (de) 2021-07-01

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