WO2009075212A1 - 積層体、積層体の製造方法、ならびにフレキシブルプリント配線板、フレキシブルプリント配線板の製造方法 - Google Patents

積層体、積層体の製造方法、ならびにフレキシブルプリント配線板、フレキシブルプリント配線板の製造方法 Download PDF

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Publication number
WO2009075212A1
WO2009075212A1 PCT/JP2008/071972 JP2008071972W WO2009075212A1 WO 2009075212 A1 WO2009075212 A1 WO 2009075212A1 JP 2008071972 W JP2008071972 W JP 2008071972W WO 2009075212 A1 WO2009075212 A1 WO 2009075212A1
Authority
WO
WIPO (PCT)
Prior art keywords
laminate
circuit board
printed circuit
flexible printed
producing
Prior art date
Application number
PCT/JP2008/071972
Other languages
English (en)
French (fr)
Inventor
Kanji Shimoohsako
Takashi Kikuchi
Takashi Ito
Shigeru Tanaka
Original Assignee
Kaneka Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneka Corporation filed Critical Kaneka Corporation
Priority to US12/746,959 priority Critical patent/US20100266850A1/en
Priority to CN200880120103.4A priority patent/CN101896341B/zh
Priority to KR1020167001895A priority patent/KR20160014113A/ko
Priority to JP2009545390A priority patent/JP5654239B2/ja
Publication of WO2009075212A1 publication Critical patent/WO2009075212A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

　本発明の課題は、積層体およびそれを用いて得られたフレキシブルプリント配線板において、樹脂材料とめっき層との密着性と吸湿半田耐熱性を改善することにある。Ａ）少なくとも、高分子フィルム／少なくとも結晶性の熱可塑性樹脂を含有するめっき形成層からなる樹脂材料にめっきを施し、少なくとも、高分子フィルム／少なくとも結晶性の熱可塑性樹脂を含有するめっき形成層／めっき層からなる積層体を製造するめっき工程と、Ｂ）前記積層体に加熱を施す加熱工程、を含むことを特徴とする、少なくとも、高分子フィルム／少なくとも結晶性の熱可塑性樹脂を含有するめっき形成層／めっき層からなる積層体の製造方法により、上記課題を解決し得る。
PCT/JP2008/071972 2007-12-11 2008-12-03 積層体、積層体の製造方法、ならびにフレキシブルプリント配線板、フレキシブルプリント配線板の製造方法 WO2009075212A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US12/746,959 US20100266850A1 (en) 2007-12-11 2008-12-03 Laminate, method for producing laminate, flexible printed circuit board, and method for manufacturing flexible printed circuit board
CN200880120103.4A CN101896341B (zh) 2007-12-11 2008-12-03 层压板、层压板的制造方法及挠性印刷线路板、挠性印刷线路板的制造方法
KR1020167001895A KR20160014113A (ko) 2007-12-11 2008-12-03 적층체, 적층체의 제조 방법, 및 연성 인쇄 배선판, 연성 인쇄 배선판의 제조 방법
JP2009545390A JP5654239B2 (ja) 2007-12-11 2008-12-03 積層体、積層体の製造方法、ならびにフレキシブルプリント配線板、フレキシブルプリント配線板の製造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007319307 2007-12-11
JP2007319310 2007-12-11
JP2007-319310 2007-12-11
JP2007-319307 2007-12-11

Publications (1)

Publication Number Publication Date
WO2009075212A1 true WO2009075212A1 (ja) 2009-06-18

Family

ID=40755456

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/071972 WO2009075212A1 (ja) 2007-12-11 2008-12-03 積層体、積層体の製造方法、ならびにフレキシブルプリント配線板、フレキシブルプリント配線板の製造方法

Country Status (5)

Country Link
US (1) US20100266850A1 (ja)
JP (1) JP5654239B2 (ja)
KR (2) KR101599081B1 (ja)
CN (1) CN101896341B (ja)
WO (1) WO2009075212A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
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CN101951724A (zh) * 2009-07-08 2011-01-19 住友金属矿山株式会社 金属化聚酰亚胺薄膜以及使用该薄膜得到的柔性电路板
JP2015052138A (ja) * 2013-09-06 2015-03-19 住友金属鉱山株式会社 電気抵抗薄膜層の成膜方法および銅張積層板の製造方法
KR20160111960A (ko) 2014-01-22 2016-09-27 우베 고산 가부시키가이샤 도체층의 형성 방법, 및 그것을 사용한 다층 배선 기판의 제조 방법
JP2016187913A (ja) * 2015-03-30 2016-11-04 新日鉄住金化学株式会社 銅張積層板及び回路基板
KR20210053937A (ko) 2018-09-05 2021-05-12 가부시키가이샤 아리사와 세이사쿠쇼 적층체
JP2022507287A (ja) * 2019-04-30 2022-01-18 トーレ・アドバンスド・マテリアルズ・コリア・インコーポレーテッド 軟性金属箔積層フィルム、それを含む物品、及び該軟性金属箔積層フィルムの製造方法

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JP6079166B2 (ja) * 2012-11-26 2017-02-15 ソニー株式会社 積層構造体の製造方法
JP6264530B2 (ja) * 2013-09-06 2018-01-24 住友金属鉱山株式会社 電気抵抗薄膜層の成膜方法および銅張積層板の製造方法
KR101702395B1 (ko) * 2014-12-30 2017-02-06 주식회사 이녹스 흡습내열성이 우수한 열가소성 폴리이미드 접착 필름을 이용한 금속박 적층판
KR101893503B1 (ko) * 2016-05-27 2018-08-30 (주) 화인켐 미세배선용 연성 회로 기판 및 이의 제조방법

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JP2002240195A (ja) * 2001-02-19 2002-08-28 Ube Ind Ltd ポリイミド銅張板
JP2005272520A (ja) * 2004-03-23 2005-10-06 Ube Ind Ltd 接着性の改良されたポリイミドフィルム、その製造方法および積層体

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101951724A (zh) * 2009-07-08 2011-01-19 住友金属矿山株式会社 金属化聚酰亚胺薄膜以及使用该薄膜得到的柔性电路板
JP2011031603A (ja) * 2009-07-08 2011-02-17 Sumitomo Metal Mining Co Ltd 金属化ポリイミドフィルム、フレキシブル配線板及びそれらの製造方法
TWI486253B (zh) * 2009-07-08 2015-06-01 Sumitomo Metal Mining Co 金屬化聚醯亞胺薄膜及使用它而獲得之撓性配線板
JP2015052138A (ja) * 2013-09-06 2015-03-19 住友金属鉱山株式会社 電気抵抗薄膜層の成膜方法および銅張積層板の製造方法
KR20160111960A (ko) 2014-01-22 2016-09-27 우베 고산 가부시키가이샤 도체층의 형성 방법, 및 그것을 사용한 다층 배선 기판의 제조 방법
US10149394B2 (en) 2014-01-22 2018-12-04 Ube Industries, Ltd. Method for forming conductor layer, and method for producing multilayer wiring substrate using same
JP2016187913A (ja) * 2015-03-30 2016-11-04 新日鉄住金化学株式会社 銅張積層板及び回路基板
KR20210053937A (ko) 2018-09-05 2021-05-12 가부시키가이샤 아리사와 세이사쿠쇼 적층체
US11946143B2 (en) 2018-09-05 2024-04-02 Arisawa Mfg. Co., Ltd. Laminate
JP2022507287A (ja) * 2019-04-30 2022-01-18 トーレ・アドバンスド・マテリアルズ・コリア・インコーポレーテッド 軟性金属箔積層フィルム、それを含む物品、及び該軟性金属箔積層フィルムの製造方法
JP7203969B2 (ja) 2019-04-30 2023-01-13 トーレ・アドバンスド・マテリアルズ・コリア・インコーポレーテッド 軟性金属箔積層フィルム、それを含む物品、及び該軟性金属箔積層フィルムの製造方法

Also Published As

Publication number Publication date
CN101896341A (zh) 2010-11-24
KR20160014113A (ko) 2016-02-05
JP5654239B2 (ja) 2015-01-14
JPWO2009075212A1 (ja) 2011-04-28
KR20100097159A (ko) 2010-09-02
KR101599081B1 (ko) 2016-03-02
US20100266850A1 (en) 2010-10-21
CN101896341B (zh) 2014-09-10

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