WO2009095347A3 - Verfahren zur verklebung von flexiblen leiterplatten mit polymermaterialien zur partiellen oder vollständigen versteifung - Google Patents

Verfahren zur verklebung von flexiblen leiterplatten mit polymermaterialien zur partiellen oder vollständigen versteifung Download PDF

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Publication number
WO2009095347A3
WO2009095347A3 PCT/EP2009/050666 EP2009050666W WO2009095347A3 WO 2009095347 A3 WO2009095347 A3 WO 2009095347A3 EP 2009050666 W EP2009050666 W EP 2009050666W WO 2009095347 A3 WO2009095347 A3 WO 2009095347A3
Authority
WO
WIPO (PCT)
Prior art keywords
flexible circuit
circuit board
adhesive film
circuit boards
reinforcement plate
Prior art date
Application number
PCT/EP2009/050666
Other languages
English (en)
French (fr)
Other versions
WO2009095347A2 (de
Inventor
Marc Husemann
Frank Hannemann
Markus Brodbeck
Original Assignee
Tesa Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesa Se filed Critical Tesa Se
Priority to US12/864,637 priority Critical patent/US20110094676A1/en
Priority to CN200980109258.2A priority patent/CN101990790A/zh
Priority to JP2010543488A priority patent/JP2011527095A/ja
Priority to EP09705439A priority patent/EP2238815A2/de
Publication of WO2009095347A2 publication Critical patent/WO2009095347A2/de
Publication of WO2009095347A3 publication Critical patent/WO2009095347A3/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/68—Vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/085—Using vacuum or low pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

Verfahren zur Herstellung von Leiterplatten, umfassend einen Prozess zur Modifizierung einer flexiblen Leiterplatte insbesondere zu deren Stabilisierung, gekennzeichnet durch zumindest folgende Verfahrensschritte: a) Bereitstellung eines Flächengebildes ('Verstärkungsplatte') mit geringerer Flexibilität als die der flexiblen Leiterplatte, b) Heißlaminierung einer hitzeaktivierbaren Klebefolie auf der Verstärkungsplatte, c) Platzierung des Laminats aus Klebefolie und Verstärkungsplatte mit der Klebfolienseite auf der flexiblen Leiterplatte, d) Einbringung des Bauteils aus Verstärkungsplatte, Klebefolie und flexibler Leiterplatte in eine Unterdruckatmosphäre, e) Heißlaminierung des Bauteils unter Applikation von Druck und Wärme.
PCT/EP2009/050666 2008-01-28 2009-01-21 Verfahren zur verklebung von flexiblen leiterplatten mit polymermaterialien zur partiellen oder vollständigen versteifung WO2009095347A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US12/864,637 US20110094676A1 (en) 2008-01-28 2009-01-21 Method for cluing flexible circuit boards to polymer materials for partial or complete stiffening
CN200980109258.2A CN101990790A (zh) 2008-01-28 2009-01-21 为了部分或全部增硬将挠性电路板与聚合物材料胶粘的方法
JP2010543488A JP2011527095A (ja) 2008-01-28 2009-01-21 フレキシブル回路基板を部分的にまたは完全に補剛するためのポリマー材料による接着方法
EP09705439A EP2238815A2 (de) 2008-01-28 2009-01-21 Verfahren zur verklebung von flexiblen leiterplatten mit polymermaterialien zur partiellen oder vollständigen versteifung

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008006390A DE102008006390A1 (de) 2008-01-28 2008-01-28 Verfahren zur Verklebung von flexiblen Leiterplatten mit Polymermaterialien zur partiellen oder vollständigen Versteifung
DE102008006390.8 2008-01-28

Publications (2)

Publication Number Publication Date
WO2009095347A2 WO2009095347A2 (de) 2009-08-06
WO2009095347A3 true WO2009095347A3 (de) 2009-10-29

Family

ID=40651285

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/050666 WO2009095347A2 (de) 2008-01-28 2009-01-21 Verfahren zur verklebung von flexiblen leiterplatten mit polymermaterialien zur partiellen oder vollständigen versteifung

Country Status (8)

Country Link
US (1) US20110094676A1 (de)
EP (1) EP2238815A2 (de)
JP (1) JP2011527095A (de)
KR (1) KR20100111734A (de)
CN (1) CN101990790A (de)
DE (1) DE102008006390A1 (de)
TW (1) TW200942109A (de)
WO (1) WO2009095347A2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201121864A (en) * 2009-12-23 2011-07-01 Metal Ind Res & Dev Ct Continuous feeding device of vacuum process equipment.
CN102300409B (zh) * 2011-07-08 2014-02-26 深圳市精诚达电路科技股份有限公司 挠性电路板基材与补强材料间粘合的方法
CN103619123B (zh) * 2013-09-30 2017-11-28 韩华社 一种fpc贴合补强片的全自动设备
CN104470219A (zh) * 2014-11-28 2015-03-25 苏州米达思精密电子有限公司 一种胶内缩补强片的生产设备
KR101707844B1 (ko) * 2015-03-02 2017-02-17 김태헌 연성인쇄회로기판의 보강방법과 연성인쇄회로기판의 보강장치
DE102018120711A1 (de) * 2018-08-24 2020-02-27 Airbus India Operations Private Limited Verfahren und Vorrichtung zum Herstellen eines Verbundmaterialbauteils mit integriertem elektrischen Leiterkreis sowie damit erhältliches Verbundmaterialbauteil
US11940337B2 (en) * 2018-12-20 2024-03-26 Shenzhen New Degree Technology Co., Ltd. Pressure sensing device, pressure sensing method and electronic terminal with compact structure and high sensitivity
CA3166032A1 (en) * 2020-02-06 2021-08-12 Nicholas BOROUGHS Tape lamination head
CH717619A1 (de) 2020-07-07 2022-01-14 Daetwyler Schweiz Ag Verfahren zum Herstellen einer elastomeren Komponente, die eine gedruckte Struktur umfasst, und elastomere Komponente.

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0574286A1 (de) * 1992-06-02 1993-12-15 Alcatel Espace Methode zum Zusammenbau von Hybridschaltungen durch Vakuum-Verklebung und nach der Methode hergestellte Anordnungen
JPH07170032A (ja) * 1993-12-13 1995-07-04 Fujikura Ltd フレキシブルプリント配線板の補強板貼り合わせ方法
WO1998019863A1 (en) * 1996-11-08 1998-05-14 W.L. Gore & Associates, Inc. Method and apparatus for aligning and laminating substrates to stiffeners in electrical circuits
EP0902609A1 (de) * 1997-09-05 1999-03-17 Ascom Hasler AG Verfahren zum Herstellen einer Leiterplatte, Leiterplatte und Anordnung zum Durchführen des Verfahrens
US20030121604A1 (en) * 1999-08-25 2003-07-03 Shipley Company, L.L.C. Conveyorized vacuum applicator and method of applying a dry film resist to a printed circuit board
US20050000645A1 (en) * 2003-07-01 2005-01-06 Sharp Kabushiki Kaisha Method for bonding reinforcing plate
WO2007021687A1 (en) * 2005-08-12 2007-02-22 3M Innovative Properties Company Method of laminating adherend

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4127436A (en) * 1975-04-17 1978-11-28 E. I. Du Pont De Nemours And Company Vacuum laminating process
JPS593740B2 (ja) * 1975-07-30 1984-01-25 日立化成工業株式会社 凹凸表面に感光層の形成された固体板の製造法
JPS61211016A (ja) * 1985-03-18 1986-09-19 Fujikura Ltd フレキシブルプリント基板と補強板との接合方法
JP3329572B2 (ja) * 1994-04-15 2002-09-30 福田金属箔粉工業株式会社 印刷回路用銅箔およびその表面処理方法
US5478885A (en) 1994-04-15 1995-12-26 Shell Oil Company Composition of epoxy resin, epoxidized block polydiene and curing agent
JPH08291278A (ja) 1995-04-21 1996-11-05 Minnesota Mining & Mfg Co <3M> ホットメルト接着剤組成物及び接着性フィルム
JP3724954B2 (ja) * 1997-08-29 2005-12-07 株式会社東芝 電子装置および半導体パッケージ
JP3040979B1 (ja) * 1998-12-02 2000-05-15 日本特殊陶業株式会社 配線基板及び補強板

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0574286A1 (de) * 1992-06-02 1993-12-15 Alcatel Espace Methode zum Zusammenbau von Hybridschaltungen durch Vakuum-Verklebung und nach der Methode hergestellte Anordnungen
JPH07170032A (ja) * 1993-12-13 1995-07-04 Fujikura Ltd フレキシブルプリント配線板の補強板貼り合わせ方法
WO1998019863A1 (en) * 1996-11-08 1998-05-14 W.L. Gore & Associates, Inc. Method and apparatus for aligning and laminating substrates to stiffeners in electrical circuits
EP0902609A1 (de) * 1997-09-05 1999-03-17 Ascom Hasler AG Verfahren zum Herstellen einer Leiterplatte, Leiterplatte und Anordnung zum Durchführen des Verfahrens
US20030121604A1 (en) * 1999-08-25 2003-07-03 Shipley Company, L.L.C. Conveyorized vacuum applicator and method of applying a dry film resist to a printed circuit board
US20050000645A1 (en) * 2003-07-01 2005-01-06 Sharp Kabushiki Kaisha Method for bonding reinforcing plate
WO2007021687A1 (en) * 2005-08-12 2007-02-22 3M Innovative Properties Company Method of laminating adherend

Also Published As

Publication number Publication date
TW200942109A (en) 2009-10-01
KR20100111734A (ko) 2010-10-15
JP2011527095A (ja) 2011-10-20
DE102008006390A1 (de) 2009-07-30
US20110094676A1 (en) 2011-04-28
EP2238815A2 (de) 2010-10-13
WO2009095347A2 (de) 2009-08-06
CN101990790A (zh) 2011-03-23

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