WO2009037753A1 - 基板搬送システム - Google Patents

基板搬送システム Download PDF

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Publication number
WO2009037753A1
WO2009037753A1 PCT/JP2007/068186 JP2007068186W WO2009037753A1 WO 2009037753 A1 WO2009037753 A1 WO 2009037753A1 JP 2007068186 W JP2007068186 W JP 2007068186W WO 2009037753 A1 WO2009037753 A1 WO 2009037753A1
Authority
WO
WIPO (PCT)
Prior art keywords
conveyer
substrate
transfer system
substrates
substrate transfer
Prior art date
Application number
PCT/JP2007/068186
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Toru Gamo
Takehiko Hori
Original Assignee
Hirata Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hirata Corporation filed Critical Hirata Corporation
Priority to CN2007801007133A priority Critical patent/CN101801815B/zh
Priority to JP2009532986A priority patent/JP4950297B2/ja
Priority to KR1020107008262A priority patent/KR101132424B1/ko
Priority to PCT/JP2007/068186 priority patent/WO2009037753A1/ja
Priority to TW097135654A priority patent/TWI403446B/zh
Publication of WO2009037753A1 publication Critical patent/WO2009037753A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/52—Devices for transferring articles or materials between conveyors i.e. discharging or feeding devices
    • B65G47/53—Devices for transferring articles or materials between conveyors i.e. discharging or feeding devices between conveyors which cross one another
    • B65G47/54—Devices for transferring articles or materials between conveyors i.e. discharging or feeding devices between conveyors which cross one another at least one of which is a roller-way
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/068—Stacking or destacking devices; Means for preventing damage to stacked sheets, e.g. spaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Stacking Of Articles And Auxiliary Devices (AREA)
PCT/JP2007/068186 2007-09-19 2007-09-19 基板搬送システム WO2009037753A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN2007801007133A CN101801815B (zh) 2007-09-19 2007-09-19 基板输送系统
JP2009532986A JP4950297B2 (ja) 2007-09-19 2007-09-19 基板搬送システム
KR1020107008262A KR101132424B1 (ko) 2007-09-19 2007-09-19 기판 반송 시스템
PCT/JP2007/068186 WO2009037753A1 (ja) 2007-09-19 2007-09-19 基板搬送システム
TW097135654A TWI403446B (zh) 2007-09-19 2008-09-17 Substrate handling system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/068186 WO2009037753A1 (ja) 2007-09-19 2007-09-19 基板搬送システム

Publications (1)

Publication Number Publication Date
WO2009037753A1 true WO2009037753A1 (ja) 2009-03-26

Family

ID=40467584

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/068186 WO2009037753A1 (ja) 2007-09-19 2007-09-19 基板搬送システム

Country Status (5)

Country Link
JP (1) JP4950297B2 (zh)
KR (1) KR101132424B1 (zh)
CN (1) CN101801815B (zh)
TW (1) TWI403446B (zh)
WO (1) WO2009037753A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102280397A (zh) * 2010-06-10 2011-12-14 致茂电子(苏州)有限公司 一种晶圆输送分配装置及其方法
JP2014056944A (ja) * 2012-09-12 2014-03-27 Ulvac Japan Ltd 真空処理装置
WO2021234203A1 (es) * 2020-05-20 2021-11-25 Tecglass Sl Maquina de impresión de vidrio con transporte continuo del vidrio

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101545260B1 (ko) * 2012-06-12 2015-08-20 한화테크윈 주식회사 기판 이송 장치
JP6045376B2 (ja) * 2013-02-06 2016-12-14 Juki株式会社 基板搬送装置、基板の搬送方法
KR101797994B1 (ko) * 2013-07-01 2017-11-15 한화테크윈 주식회사 컨베이어
CN105692029B (zh) * 2016-03-21 2018-08-10 李毅 一种适用于瓦楞纸板生产的智能物流系统
CN106369955B (zh) * 2016-08-31 2019-08-16 武汉华星光电技术有限公司 薄膜烘干机支架及薄膜烘干机

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01290299A (ja) * 1988-05-18 1989-11-22 Sanyo Electric Co Ltd 基板供給収納装置
JP2004284722A (ja) * 2003-03-20 2004-10-14 Nec Mobiling Ltd 車輌積載管理システム及び方法
JP2005060110A (ja) * 2003-08-11 2005-03-10 Chi Mei Optoelectronics Corp 順次式基板カセット用基板搬送装置
JP2005170675A (ja) * 2003-11-21 2005-06-30 Ishikawajima Harima Heavy Ind Co Ltd 基板搬送装置、基板保管搬送装置、基板搬入システム、基板搬出システム及び基板搬入／搬出システム
JP2007036227A (ja) * 2005-07-22 2007-02-08 Au Optronics Corp 基板の保存用カセット、搬送コンベア及びそれらを用いた搬送システム
WO2007029401A1 (ja) * 2005-09-02 2007-03-15 Hirata Corporation ワーク搬入出システム及び搬送装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004155569A (ja) 2002-11-08 2004-06-03 Daifuku Co Ltd 板状体の取り扱い設備
JP2004284772A (ja) * 2003-03-24 2004-10-14 Toshiba Mitsubishi-Electric Industrial System Corp 基板搬送システム
JP4436689B2 (ja) * 2004-01-28 2010-03-24 マルヤス機械株式会社 ガラス基板の搬送システム

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01290299A (ja) * 1988-05-18 1989-11-22 Sanyo Electric Co Ltd 基板供給収納装置
JP2004284722A (ja) * 2003-03-20 2004-10-14 Nec Mobiling Ltd 車輌積載管理システム及び方法
JP2005060110A (ja) * 2003-08-11 2005-03-10 Chi Mei Optoelectronics Corp 順次式基板カセット用基板搬送装置
JP2005170675A (ja) * 2003-11-21 2005-06-30 Ishikawajima Harima Heavy Ind Co Ltd 基板搬送装置、基板保管搬送装置、基板搬入システム、基板搬出システム及び基板搬入／搬出システム
JP2007036227A (ja) * 2005-07-22 2007-02-08 Au Optronics Corp 基板の保存用カセット、搬送コンベア及びそれらを用いた搬送システム
WO2007029401A1 (ja) * 2005-09-02 2007-03-15 Hirata Corporation ワーク搬入出システム及び搬送装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102280397A (zh) * 2010-06-10 2011-12-14 致茂电子(苏州)有限公司 一种晶圆输送分配装置及其方法
JP2014056944A (ja) * 2012-09-12 2014-03-27 Ulvac Japan Ltd 真空処理装置
WO2021234203A1 (es) * 2020-05-20 2021-11-25 Tecglass Sl Maquina de impresión de vidrio con transporte continuo del vidrio

Also Published As

Publication number Publication date
CN101801815A (zh) 2010-08-11
KR20100068442A (ko) 2010-06-23
JPWO2009037753A1 (ja) 2011-01-06
TWI403446B (zh) 2013-08-01
KR101132424B1 (ko) 2012-04-03
JP4950297B2 (ja) 2012-06-13
TW200922851A (en) 2009-06-01
CN101801815B (zh) 2012-05-30

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