WO2009025319A1 - Composition de polyimide, panneau de câblage flexible et procédé de fabrication d'un panneau de câblage flexible - Google Patents

Composition de polyimide, panneau de câblage flexible et procédé de fabrication d'un panneau de câblage flexible Download PDF

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Publication number
WO2009025319A1
WO2009025319A1 PCT/JP2008/064912 JP2008064912W WO2009025319A1 WO 2009025319 A1 WO2009025319 A1 WO 2009025319A1 JP 2008064912 W JP2008064912 W JP 2008064912W WO 2009025319 A1 WO2009025319 A1 WO 2009025319A1
Authority
WO
WIPO (PCT)
Prior art keywords
flexible wiring
wiring board
alkali
composition
polyimide
Prior art date
Application number
PCT/JP2008/064912
Other languages
English (en)
Japanese (ja)
Inventor
Junichi Ishii
Tomoyasu Sunaga
Mamiko Nomura
Hiroki Kanaya
Original Assignee
Sony Chemical & Information Device Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemical & Information Device Corporation filed Critical Sony Chemical & Information Device Corporation
Publication of WO2009025319A1 publication Critical patent/WO2009025319A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials

Abstract

L'invention porte sur une composition de polyimide laquelle, après développement par un alcali, ne provoque pas de dépôt de poudre blanche sur la surface même lorsqu'un nettoyage à l'acide n'est pas conduit. L'invention porte également sur un panneau de câblage flexible fait avec la composition et sur un procédé de fabrication du panneau. L'invention porte également sur : une composition de polyimide qui a une aptitude améliorée au développement par un alcali, en particulier une aptitude au développement par un alcali tel que le carbonate de sodium, et est appropriée pour être utilisée comme matière de couche de recouvrement pour des panneaux de câblage flexibles ; sur un panneau de câblage flexible fait avec la composition ; et sur un procédé de fabrication du panneau. Un hydrolysat qui se génère lors du développement par un alcali après exposition à la lumière peut être fixé au polyimide par réaction de l'hydrolysat avec un agent réticulant. Ainsi, le dépôt de surface d'une poudre blanche peut être empêché sans conduire de nettoyage à l'acide après développement par un alcali. Une sélection d'une matière spécifique comme composant du composé de polyimide peut augmenter la solubilité dans les alcalis et conférer une élasticité faible et un retard de flamme, qui sont requis pour une matière de recouvrement pour des panneaux de câblage flexibles.
PCT/JP2008/064912 2007-08-22 2008-08-21 Composition de polyimide, panneau de câblage flexible et procédé de fabrication d'un panneau de câblage flexible WO2009025319A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007215389 2007-08-22
JP2007-215389 2007-08-22

Publications (1)

Publication Number Publication Date
WO2009025319A1 true WO2009025319A1 (fr) 2009-02-26

Family

ID=40378218

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/064912 WO2009025319A1 (fr) 2007-08-22 2008-08-21 Composition de polyimide, panneau de câblage flexible et procédé de fabrication d'un panneau de câblage flexible

Country Status (3)

Country Link
JP (1) JP5426851B2 (fr)
TW (1) TW200927833A (fr)
WO (1) WO2009025319A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017090625A1 (fr) * 2015-11-26 2017-06-01 住友電気工業株式会社 Film de base pour carte de circuit imprimé, plaque originale pour carte de circuit imprimé, et procédé de fabrication de plaque originale pour carte de circuit imprimé

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JP4767931B2 (ja) * 2007-09-19 2011-09-07 信越化学工業株式会社 難燃性ポリイミドシリコーン樹脂組成物
JP4771100B2 (ja) * 2008-08-27 2011-09-14 信越化学工業株式会社 無溶剤型ポリイミドシリコーン系樹脂組成物及びその硬化物
JP5343494B2 (ja) * 2008-09-30 2013-11-13 デクセリアルズ株式会社 感光性シロキサンポリイミド樹脂組成物
JP5338523B2 (ja) * 2009-06-29 2013-11-13 デクセリアルズ株式会社 新規なチオエーテル基含有シロキサンポリイミド及び配線基板
JP5538779B2 (ja) * 2009-08-31 2014-07-02 国立大学法人横浜国立大学 感光性樹脂組成物および該組成物を使用した反応現像画像形成方法
JP5549841B2 (ja) * 2009-09-07 2014-07-16 日立化成株式会社 感光性樹脂組成物、永久レジスト用感光性フィルム、レジストパターンの形成方法、プリント配線板及びその製造方法、表面保護膜並びに層間絶縁膜
KR101927723B1 (ko) * 2011-01-18 2019-03-12 히타치가세이가부시끼가이샤 변성 실리콘 화합물, 이것을 이용한 열 경화성 수지 조성물, 프리프레그, 적층판 및 인쇄 배선판
US8886106B2 (en) * 2011-03-02 2014-11-11 Konica Minolta Business Technologies, Inc. Intermediate transfer belt and method for producing the same
JP5848638B2 (ja) * 2012-03-07 2016-01-27 株式会社日本触媒 硬化性樹脂組成物、その製造方法及びエレクトロニクス実装材料
US11512199B2 (en) 2016-11-02 2022-11-29 Toray Industries, Inc. Resin composition, resin sheet, cured film, organic el display device, semiconductor electronic component, semiconductor equipment, and method for producing organic el display device

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JPH06200216A (ja) * 1992-12-28 1994-07-19 Nippon Steel Chem Co Ltd プリント基板用耐熱性接着剤フィルム及びその使用方法並びにこれを用いたプリント基板の製造方法
JP2002012666A (ja) * 2000-06-29 2002-01-15 Shin Etsu Chem Co Ltd ポリイミドシリコーン樹脂、その製造方法およびその組成物
JP2006083307A (ja) * 2004-09-16 2006-03-30 Kyocera Chemical Corp 感光性ポリイミドシロキサンおよびその組成物
JP2006206756A (ja) * 2005-01-28 2006-08-10 Sony Chem Corp ポリイミド化合物及びフレキシブル配線板
JP2007217490A (ja) * 2006-02-15 2007-08-30 Shin Etsu Chem Co Ltd ポリイミドシリコーン樹脂及びそれを含む熱硬化性組成物
WO2008096601A1 (fr) * 2007-02-09 2008-08-14 Sony Chemical & Information Device Corporation Composition photosensible de résine polyimide

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JP2007094011A (ja) * 2005-09-29 2007-04-12 Sumitomo Bakelite Co Ltd ポジ型感光性樹脂組成物、並びにそれを用いた半導体装置及び表示素子

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06200216A (ja) * 1992-12-28 1994-07-19 Nippon Steel Chem Co Ltd プリント基板用耐熱性接着剤フィルム及びその使用方法並びにこれを用いたプリント基板の製造方法
JP2002012666A (ja) * 2000-06-29 2002-01-15 Shin Etsu Chem Co Ltd ポリイミドシリコーン樹脂、その製造方法およびその組成物
JP2006083307A (ja) * 2004-09-16 2006-03-30 Kyocera Chemical Corp 感光性ポリイミドシロキサンおよびその組成物
JP2006206756A (ja) * 2005-01-28 2006-08-10 Sony Chem Corp ポリイミド化合物及びフレキシブル配線板
JP2007217490A (ja) * 2006-02-15 2007-08-30 Shin Etsu Chem Co Ltd ポリイミドシリコーン樹脂及びそれを含む熱硬化性組成物
WO2008096601A1 (fr) * 2007-02-09 2008-08-14 Sony Chemical & Information Device Corporation Composition photosensible de résine polyimide

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017090625A1 (fr) * 2015-11-26 2017-06-01 住友電気工業株式会社 Film de base pour carte de circuit imprimé, plaque originale pour carte de circuit imprimé, et procédé de fabrication de plaque originale pour carte de circuit imprimé
CN108293296A (zh) * 2015-11-26 2018-07-17 住友电气工业株式会社 印刷线路板用基膜、印刷线路板用基材以及制造印刷线路板用基材的方法
CN108293296B (zh) * 2015-11-26 2020-10-20 住友电气工业株式会社 印刷线路板用基膜、印刷线路板用基材以及制造印刷线路板用基材的方法

Also Published As

Publication number Publication date
JP5426851B2 (ja) 2014-02-26
JP2009068008A (ja) 2009-04-02
TW200927833A (en) 2009-07-01

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