WO2009025319A1 - Polyimide composition, flexible wiring board, and process for producing flexible wiring board - Google Patents

Polyimide composition, flexible wiring board, and process for producing flexible wiring board Download PDF

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Publication number
WO2009025319A1
WO2009025319A1 PCT/JP2008/064912 JP2008064912W WO2009025319A1 WO 2009025319 A1 WO2009025319 A1 WO 2009025319A1 JP 2008064912 W JP2008064912 W JP 2008064912W WO 2009025319 A1 WO2009025319 A1 WO 2009025319A1
Authority
WO
WIPO (PCT)
Prior art keywords
flexible wiring
wiring board
alkali
composition
polyimide
Prior art date
Application number
PCT/JP2008/064912
Other languages
French (fr)
Japanese (ja)
Inventor
Junichi Ishii
Tomoyasu Sunaga
Mamiko Nomura
Hiroki Kanaya
Original Assignee
Sony Chemical & Information Device Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemical & Information Device Corporation filed Critical Sony Chemical & Information Device Corporation
Publication of WO2009025319A1 publication Critical patent/WO2009025319A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials

Abstract

A polyimide composition which, after alkali development, does not cause white-powder deposition on the surface even when acid cleaning is not conducted. Also provided are a flexible wiring board made with the composition and a process for producing the board. Furthermore provided are: a polyimide composition which has improved alkali developability, in particular, developability with an alkali such as sodium carbonate, and is suitable for use as a cover lay material for flexible wiring boards; a flexible wiring board made with the composition; and a process for producing the board. A hydrolyzate which generates upon alkali development after light exposure can be fixed to the polyimide by reacting the hydrolyzate with a crosslinking agent. Thus, the surface deposition of a white powder can be prevented without conducting acid cleaning after alkali development. Selection of a specific material as a component of the polyimide compound can enhance alkali solubility and imparts low elasticity and flame retardancy, which are required of a cover lay material for flexible wiring boards.
PCT/JP2008/064912 2007-08-22 2008-08-21 Polyimide composition, flexible wiring board, and process for producing flexible wiring board WO2009025319A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007215389 2007-08-22
JP2007-215389 2007-08-22

Publications (1)

Publication Number Publication Date
WO2009025319A1 true WO2009025319A1 (en) 2009-02-26

Family

ID=40378218

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/064912 WO2009025319A1 (en) 2007-08-22 2008-08-21 Polyimide composition, flexible wiring board, and process for producing flexible wiring board

Country Status (3)

Country Link
JP (1) JP5426851B2 (en)
TW (1) TW200927833A (en)
WO (1) WO2009025319A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017090625A1 (en) * 2015-11-26 2017-06-01 住友電気工業株式会社 Base film for printed wiring board, original plate for printed wiring board, and method for manufacturing original plate for printed wiring board

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4767931B2 (en) * 2007-09-19 2011-09-07 信越化学工業株式会社 Flame retardant polyimide silicone resin composition
JP4771100B2 (en) * 2008-08-27 2011-09-14 信越化学工業株式会社 Solvent-free polyimide silicone resin composition and cured product thereof
JP5343494B2 (en) * 2008-09-30 2013-11-13 デクセリアルズ株式会社 Photosensitive siloxane polyimide resin composition
JP5338523B2 (en) * 2009-06-29 2013-11-13 デクセリアルズ株式会社 Novel thioether group-containing siloxane polyimide and wiring board
JP5538779B2 (en) * 2009-08-31 2014-07-02 国立大学法人横浜国立大学 Photosensitive resin composition and reaction development image forming method using the composition
JP5549841B2 (en) * 2009-09-07 2014-07-16 日立化成株式会社 Photosensitive resin composition, photosensitive film for permanent resist, method for forming resist pattern, printed wiring board and method for producing the same, surface protective film and interlayer insulating film
KR101927723B1 (en) * 2011-01-18 2019-03-12 히타치가세이가부시끼가이샤 Modified silicone compound, and thermosetting resin composition, prepreg, laminate plate and printed wiring board using same
US8886106B2 (en) * 2011-03-02 2014-11-11 Konica Minolta Business Technologies, Inc. Intermediate transfer belt and method for producing the same
JP5848638B2 (en) * 2012-03-07 2016-01-27 株式会社日本触媒 Curable resin composition, method for producing the same, and electronic packaging material
JP6988485B2 (en) * 2016-11-02 2022-01-05 東レ株式会社 A method for manufacturing a resin composition, a resin sheet, a cured film, an organic EL display device, a semiconductor electronic component, a semiconductor device, and an organic EL display device.

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06200216A (en) * 1992-12-28 1994-07-19 Nippon Steel Chem Co Ltd Heat-resistant adhesive film for printed wiring board, method using the same, and production of printed wiring board by using the same
JP2002012666A (en) * 2000-06-29 2002-01-15 Shin Etsu Chem Co Ltd Polyimidesilicone resin, method for producing the same and composition thereof
JP2006083307A (en) * 2004-09-16 2006-03-30 Kyocera Chemical Corp Photosensitive polyimide-siloxane and its composition
JP2006206756A (en) * 2005-01-28 2006-08-10 Sony Chem Corp Polyimide compound and flexible wiring board
JP2007217490A (en) * 2006-02-15 2007-08-30 Shin Etsu Chem Co Ltd Polyimide silicone resin and thermosetting composition containing the same
WO2008096601A1 (en) * 2007-02-09 2008-08-14 Sony Chemical & Information Device Corporation Photosensitive polyimide resin composition

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007094011A (en) * 2005-09-29 2007-04-12 Sumitomo Bakelite Co Ltd Positive type photosensitive resin composition, semiconductor device using same and display element

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06200216A (en) * 1992-12-28 1994-07-19 Nippon Steel Chem Co Ltd Heat-resistant adhesive film for printed wiring board, method using the same, and production of printed wiring board by using the same
JP2002012666A (en) * 2000-06-29 2002-01-15 Shin Etsu Chem Co Ltd Polyimidesilicone resin, method for producing the same and composition thereof
JP2006083307A (en) * 2004-09-16 2006-03-30 Kyocera Chemical Corp Photosensitive polyimide-siloxane and its composition
JP2006206756A (en) * 2005-01-28 2006-08-10 Sony Chem Corp Polyimide compound and flexible wiring board
JP2007217490A (en) * 2006-02-15 2007-08-30 Shin Etsu Chem Co Ltd Polyimide silicone resin and thermosetting composition containing the same
WO2008096601A1 (en) * 2007-02-09 2008-08-14 Sony Chemical & Information Device Corporation Photosensitive polyimide resin composition

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017090625A1 (en) * 2015-11-26 2017-06-01 住友電気工業株式会社 Base film for printed wiring board, original plate for printed wiring board, and method for manufacturing original plate for printed wiring board
CN108293296A (en) * 2015-11-26 2018-07-17 住友电气工业株式会社 Printed wiring board basement membrane, printed wiring board base material and the method for manufacturing printed wiring board base material
CN108293296B (en) * 2015-11-26 2020-10-20 住友电气工业株式会社 Base film for printed wiring board, base material for printed wiring board, and method for manufacturing base material for printed wiring board

Also Published As

Publication number Publication date
JP2009068008A (en) 2009-04-02
JP5426851B2 (en) 2014-02-26
TW200927833A (en) 2009-07-01

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